Chain equipment processing method and device, electronic equipment and storage medium

Abstract

The invention discloses a chain equipment processing method and device, electronic equipment and a storage medium. The method comprises the following steps: after target chain type equipment is started to run, conveying a target silicon wafer to pass through a first area corresponding to a conveying device through the conveying device of the target chain type equipment, so that borosilicate glass on the surface of the target silicon wafer is removed when the target silicon wafer passes through the first area; determining a first numerical value corresponding to the target chain type equipment, wherein the first numerical value is obtained by counting the target silicon wafers detected by a first sensor and a second sensor and is used for indicating the number of the target silicon wafers in the first area; and determining an equipment detection result of the target chain equipment based on the first numerical value, wherein the equipment detection result is used for indicating whether the first sensor and / or the second sensor is abnormal or not. According to the scheme, whether the inductor configured in the target chain type equipment is abnormal is judged through the first numerical value, the efficiency of detecting whether the inductor is abnormal is improved, and abnormal silicon wafers caused by the fact that abnormality of the inductor is not found in time are avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of chain device processing, and in particular to a chain device processing method, device, electronic device and storage medium. Background Art

[0002] The borosilicate glass generated on the surface of the silicon wafer after boron diffusion is usually removed by wet etching. Furthermore, when using a chain-type borosilicate glass removal device to remove the borosilicate glass on the surface of the silicon wafer, it is usually necessary to configure a sensor to detect whether there is a silicon wafer whose surface borosilicate glass needs to be removed, and when it is detected that there is a silicon wafer whose surface borosilicate glass needs to be removed, the surface of the silicon wafer is first sprayed with water to avoid excessive corrosion or damage to the surface of the silicon wafer by the solvent used to remove the borosilicate glass. Therefore, it is crucial to whether the sensors configured in the chain-type borosilicate glass removal equipment are working properly. The sensors configured in the existing chain-type borosilicate glass removal equipment usually require manual intervention for abnormality detection to achieve irregular abnormality detection. However, due to the low efficiency of manual detection, it is difficult to effectively and promptly detect abnormalities in the sensors, resulting in a large number of abnormal silicon wafers. Summary of the Invention

[0003] The present invention provides a processing method, device, electronic device and storage medium for chain equipment to solve the problem of low efficiency in abnormal detection of sensors configured for chain borosilicate glass removal equipment. The sensor is used to detect whether there are silicon wafers whose surface borosilicate glass needs to be removed.

[0004] According to one aspect of the present invention, a method for processing a chain device is provided, the method comprising:

[0005] After the target chain device starts running, the target silicon wafer is transported through the first area corresponding to the transmission device by the transmission device of the target chain device, so that the borosilicate glass on the surface of the target silicon wafer is removed during the process of passing through the first area. The first area is the area between the first position and the second position along the transportation direction of the transmission device. The first position is the detection position of the first sensor, and the second position is the detection position of the second sensor. When the first sensor detects that the target silicon wafer enters the first area from the first position, the target silicon wafer is sprayed with water. The second sensor is used to detect whether the target silicon wafer leaves the first area from the second position. The transmission device is composed of rollers;

[0006] Determining a first value corresponding to the target chain device, where the first value is obtained by counting the target silicon wafers detected by the first sensor and the second sensor and is used to indicate the number of target silicon wafers in the first area;

[0007] A device detection result of the target chain device is determined based on the first value, where the device detection result is used to indicate whether an abnormality occurs in the first sensor and / or the second sensor.

[0008] According to another aspect of the present invention, there is provided a processing device for chain equipment, the device comprising:

[0009] A transport module is configured to transport a target silicon wafer through a first area corresponding to the transport device via a transport device of the target chain device after the target chain device is started, so that borosilicate glass on the surface of the target silicon wafer is removed during the process of the target silicon wafer passing through the first area. The first area is an area between a first position and a second position along a transport direction on the transport device. The first position is a detection position of a first sensor, and the second position is a detection position of a second sensor. When the first sensor detects that the target silicon wafer enters the first area from the first position, the target silicon wafer is sprayed with water. The second sensor is configured to detect whether the target silicon wafer leaves the first area from the second position. The transport device is composed of rollers.

[0010] A first determining module is configured to determine a first value corresponding to a target chain device, where the first value is obtained by counting target silicon wafers detected by the first sensor and the second sensor and is used to indicate the number of target silicon wafers in the first area;

[0011] The second determining module is configured to determine a device detection result of the target chain device based on the first value, where the device detection result is used to indicate whether an abnormality occurs in the first sensor and / or the second sensor.

[0012] According to another aspect of the present invention, an electronic device is provided, the electronic device comprising:

[0013] at least one processor; and

[0014] a memory communicatively connected to at least one processor; wherein,

[0015] The memory stores a computer program that can be executed by at least one processor. The computer program is executed by the at least one processor so that the at least one processor can execute the processing method of the chain device according to any embodiment of the present invention.

[0016] According to another aspect of the present invention, a computer-readable storage medium is provided. The computer-readable storage medium stores computer instructions, which are used to enable a processor to implement the processing method of the chain device according to any embodiment of the present invention when executed.

[0017] According to the technical solution of an embodiment of the present invention, after the target chain device starts to operate, the target silicon wafer is transported through the first area corresponding to the transmission device by the transmission device of the target chain device, so that the borosilicate glass on the surface of the target silicon wafer is removed during the process of passing through the first area, thereby realizing the removal of the borosilicate glass on the surface of the target silicon wafer by the target chain device. At the same time, the target silicon wafer is sprayed with water when entering the first area to prevent the surface of the target silicon wafer from being excessively corroded or damaged; a first value corresponding to the target chain device is determined, the first value is obtained by counting the target silicon wafers detected by the first sensor and the second sensor, and is used to indicate the number of target silicon wafers in the first area, thereby realizing the counting of the target silicon wafers transported in the first area by the first sensor and the second sensor; based on the first value, an equipment detection result of the target chain device is determined, the equipment detection result is used to indicate whether the first sensor and / or the second sensor are abnormal, thereby realizing the judgment of whether the first sensor and the second sensor configured by the target chain device are abnormal by the first value, reducing manual intervention and improving the efficiency of abnormal detection of the sensor, so as to avoid a large number of abnormal silicon wafers caused by untimely detection of abnormal sensors.

[0018] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 A flowchart of a method for processing a chain device provided by an embodiment of the present invention;

[0021] Figure 2 A schematic diagram of a target silicon wafer transportation process provided by an embodiment of the present invention;

[0022] Figure 3 A flowchart of another method for processing chain devices provided by an embodiment of the present invention;

[0023] Figure 4 A schematic structural diagram of a processing device for a chain device provided by an embodiment of the present invention;

[0024] Figure 5 A schematic structural diagram of an electronic device for implementing a processing method for chain devices provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0025] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0026] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0027] Figure 1 This is a flowchart of a chain device processing method provided by an embodiment of the present invention. The embodiment of the present invention is applicable to the case of abnormal detection of sensors configured in chain borosilicate glass removal equipment. The chain device processing method can be executed by a processing device of the chain device, which can be implemented in the form of hardware and / or software and can be configured in an electronic device that implements the chain device processing method. Figure 1 As shown, the method includes:

[0028] S101. After the target chain device starts running, the target silicon wafer is transported through the first area corresponding to the transmission device by the transmission device of the target chain device, so that the borosilicate glass on the surface of the target silicon wafer is removed in the process of passing through the first area. The first area is the area between the first position and the second position along the transportation direction on the transmission device. The first position is the detection position of the first sensor, and the second position is the detection position of the second sensor. When the first sensor detects that the target silicon wafer enters the first area from the first position, the target silicon wafer is sprayed with water. The second sensor is used to detect whether the target silicon wafer leaves the first area from the second position. The transmission device is composed of rollers.

[0029] The target chain device may be a chain device used to remove borosilicate glass from the surface of a silicon wafer. The target silicon wafer may be a silicon wafer with borosilicate glass formed on its surface after boron diffusion. The first sensor determines that the target silicon wafer has passed through a first position by blocking or reflecting the detection signal emitted by the target silicon wafer. Similarly, the second sensor determines that the target silicon wafer has passed through a second position by blocking or reflecting the detection signal emitted by the target silicon wafer. Exemplarily, the first and second sensors may be photoelectric sensors.

[0030] refer to Figure 2 The transmission device is composed of a number of rollers arranged in parallel. When the target chain device is started and the target silicon wafer is placed on the surface of the rollers, the target silicon wafer is transported as the rollers rotate. Furthermore, when the target silicon wafer is transported to the first area corresponding to the transmission device, the surface of the rollers in the first area corresponding to the transmission device is covered with a solvent that chemically reacts with borosilicate glass, which can remove the borosilicate glass on the surface of the target silicon wafer. At the same time, to prevent the solvent from causing excessive corrosion or damage to the surface of the target silicon wafer, when the first sensor detects that the target silicon wafer passes through the first position, the surface of the target silicon wafer in contact with the transmission device is sprayed with water. When the second sensor detects that the target silicon wafer passes through the second position, it indicates that the target silicon wafer has left the first area.

[0031] S102: Determine a first value corresponding to the target chain device, where the first value is obtained by counting the target silicon wafers detected by the first sensor and the second sensor and is used to indicate the number of target silicon wafers in the first area.

[0032] Specifically, the first sensor can be used to detect whether there is a target silicon wafer entering the first area from the first position, and the second sensor can be used to detect whether there is a target silicon wafer leaving the first area from the second position, so as to count the target silicon wafers transported in the first area and obtain the first value corresponding to the target chain device.

[0033] As an optional implementation manner of an embodiment of the present invention, determining a first value corresponding to a target chain device includes: if the first sensor detects a target silicon wafer, counting one to the first value and / or if the second sensor detects the target silicon wafer, counting one to the first value, and the first value is set to 0 when the target chain device starts running.

[0034] Specifically, if the first sensor detects a target silicon wafer, it indicates that a target silicon wafer has entered the first area on the conveyor from the first position, and the first value needs to be counted up by one. If the second sensor detects a target silicon wafer, it indicates that a target silicon wafer has left the first area on the conveyor from the second position, and the first value needs to be counted down by one, thereby ensuring that the first value accurately indicates the number of target silicon wafers in the first area.

[0035] For example, the first value can be represented by the value of a register of a Programmable Logic Controller (PLC). When the PLC receives a count signal from the first sensor, the register value is incremented by one, and when the PLC receives a count signal from the second sensor, the register value is decremented by one. To reduce false detections by the first and second sensors, the first sensor emits a count signal when it detects that the target silicon wafer has exceeded a fourth preset time period, and the second sensor emits a count signal when it detects that the target silicon wafer has exceeded the fourth preset time period.

[0036] S103: Determine a device detection result of the target chain device based on the first value, where the device detection result is used to indicate whether an abnormality occurs in the first sensor and / or the second sensor.

[0037] Specifically, the first value can be compared with a preset threshold range. If the first value is within the preset threshold range, the device detection result indicates that neither the first sensor nor the second sensor has an abnormality. If the first value exceeds the preset threshold range, the first sensor and the second sensor are further tested to determine whether the first sensor or the second sensor has an abnormality, or whether both the first sensor and the second sensor have an abnormality, thereby obtaining a device detection result for the target chain device. If the device detection result of the target chain device indicates that the first sensor and / or the second sensor has an abnormality, the target chain device is controlled to stop operating, and the first sensor and the second sensor are simultaneously checked for abnormalities.

[0038] As an optional implementation of the embodiment of the present invention, the processing method of the chain device further includes: when the first value remains unchanged for more than a first preset time period, detecting whether the first sensor and the second sensor are abnormal at the same time.

[0039] Specifically, when the number of target silicon wafers detected by the first sensor passing through the first position is the same as the number of target silicon wafers detected by the second sensor passing through the second position, the first value remains unchanged during counting, or when both the first sensor and the second sensor are abnormal and fail to count the first value, the first value remains unchanged. Furthermore, if the first value remains unchanged for a duration exceeding a first preset time, a sensor abnormality prompt message may be generated to prompt the user to check whether both the first sensor and the second sensor are abnormal and unable to detect the target silicon wafers.

[0040] As an optional implementation of an embodiment of the present invention, the processing method of the chain device also includes: if the first sensor does not detect the target silicon wafer for more than a second preset time and the second sensor does not detect the target silicon wafer for more than a third preset time, setting the first value to 0.

[0041] The second preset duration may be a preset time length for a target silicon wafer to enter the first area from the first position without the target wafer present. The third preset duration may be a preset time length for a target silicon wafer to leave the first area from the second position without the target wafer present. The second and third preset durations may be set based on the actual operating conditions of the target chain device.

[0042] Specifically, when the first sensor fails to detect the target silicon wafer for a period exceeding a second preset time, and the second sensor fails to detect the target silicon wafer for a period exceeding a third preset time, it indicates that the target silicon wafer does not exist in the first area corresponding to the transmission device, and the first value is set to 0 to avoid accumulation of first value errors caused by false detection by the first sensor or the second sensor.

[0043] According to the technical solution of an embodiment of the present invention, after the target chain device starts to operate, the target silicon wafer is transported through the first area corresponding to the transmission device by the transmission device of the target chain device, so that the borosilicate glass on the surface of the target silicon wafer is removed during the process of passing through the first area, thereby realizing the removal of the borosilicate glass on the surface of the target silicon wafer by the target chain device. At the same time, the target silicon wafer is sprayed with water when entering the first area to prevent the surface of the target silicon wafer from being excessively corroded or damaged; a first value corresponding to the target chain device is determined, the first value is obtained by counting the target silicon wafers detected by the first sensor and the second sensor, and is used to indicate the number of target silicon wafers in the first area, thereby realizing the counting of the target silicon wafers transported in the first area by the first sensor and the second sensor; based on the first value, an equipment detection result of the target chain device is determined, the equipment detection result is used to indicate whether the first sensor and / or the second sensor are abnormal, thereby realizing the judgment of whether the first sensor and the second sensor configured by the target chain device are abnormal by the first value, reducing manual intervention and improving the efficiency of abnormal detection of the sensor, so as to avoid a large number of abnormal silicon wafers caused by untimely detection of abnormal sensors.

[0044] Figure 3 This is a flowchart of another method for processing chain devices provided by an embodiment of the present invention. The technical solution of this embodiment further optimizes the process of determining the device detection result of the target chain device based on the first value in the above embodiment. The solutions not fully described in this embodiment can be found in the above embodiment. This embodiment can be combined with various optional solutions in one or more of the above embodiments. Figure 3 As shown, the method specifically includes:

[0045] S201. After the target chain device starts running, the target silicon wafer is transported through the first area corresponding to the transmission device by the transmission device of the target chain device, so that the borosilicate glass on the surface of the target silicon wafer is removed in the process of passing through the first area. The first area is the area between the first position and the second position along the transportation direction on the transmission device. The first position is the detection position of the first sensor, and the second position is the detection position of the second sensor. When the first sensor detects that the target silicon wafer enters the first area from the first position, the target silicon wafer is sprayed with water. The second sensor is used to detect whether the target silicon wafer leaves the first area from the second position. The transmission device is composed of rollers.

[0046] S202: Determine a first value corresponding to the target chain device, where the first value is obtained by counting the target silicon wafers detected by the first sensor and the second sensor and is used to indicate the number of target silicon wafers in the first area.

[0047] S203. Determine a second value corresponding to the target chain device, and determine a first detection result based on the first value and the second value, wherein the second value is determined based on an allowable detection error of the second sensor, and the first detection result is used to indicate whether an abnormality occurs in the first sensor.

[0048] The second value may be a value set based on the number of false detections allowed by the second sensor. A false detection by the second sensor may result in the second sensor failing to detect a target wafer leaving the first area from the second position, but decrementing the first value by one. Consequently, when the actual number of target wafers in the first area is zero or close to zero, the first value may be less than zero. For example, the second value may be set to -5.

[0049] Specifically, if the first sensor experiences an anomaly, the first value is not incremented when the target silicon wafer enters the first area from the first position. Consequently, when the second sensor detects the target silicon wafer leaves the first area from the second position, the first value is decremented, causing the first value to be less than the second value. Furthermore, if the first value is not less than the second value, the first detection result indicates that the first sensor has not experienced an anomaly. If the first value is less than the second value, the first detection result indicates that the first sensor has experienced an anomaly. The second value is set based on the number of false detections allowed by the second sensor to prevent false detections by the second sensor from affecting the accuracy of the first detection result.

[0050] S204. Determine a third value corresponding to the target chain device, and determine a second detection result based on the first value and the third value, where the third value is the number of target silicon wafers that should exist in the first area, and the second detection result is used to indicate whether the second sensor has an abnormality.

[0051] Specifically, if both the first and second sensors are normal, and a blockage occurs between target silicon wafers during transport within the first area, the first value obtained by the first and second sensors will be greater than the third value. If the second sensor is abnormal, the first value will not be decremented when the target silicon wafer leaves the first area from the second position. Consequently, when the first sensor detects the target silicon wafer entering the first area from the first position, the first value will be incremented, causing the first value to be greater than the third value. Furthermore, if the first value is not greater than the third value, the second detection result indicates that the second sensor is normal. If the first value is greater than the third value, it is further determined that a blockage occurs between target silicon wafers within the first area or that the second sensor is abnormal.

[0052] Optionally, the third value is set based on a permitted number of false detections by the first sensor and the expected number of target silicon wafers within the first area, to prevent false detections by the first sensor from affecting the accuracy of the second detection result. A false detection by the first sensor may result in the first sensor failing to detect the target silicon wafer entering the first area from the first position, but incrementing the first value. Consequently, when the actual number of target silicon wafers within the first area is at or near the third value, the first value may be greater than the third value.

[0053] As an optional implementation manner of an embodiment of the present invention, determining a third value corresponding to the target chain device includes: determining a first distance corresponding to the transmission device, the first distance being the distance between the first position and the second position; determining a second distance corresponding to the transmission device and a first size of the target silicon wafer, the second distance being the distance between two adjacent target silicon wafers in the first area along the transportation direction, and the first size of the target silicon wafer being the length of the target silicon wafer along the transportation direction; and determining a third value based on the first distance, the second distance, and the first size of the target silicon wafer.

[0054] Among them, reference Figure 2 The first distance can be obtained by actually measuring the distance between the first position and the second position on the conveyor along the conveying direction of the conveyor. The second distance and the first size of the target silicon wafer can be pre-set based on user requirements. For example, the second distance can also be obtained by the following methods A1-A3:

[0055] Method A1: If the distance between two adjacent target silicon wafers along the transport direction remains unchanged during the process of the transmission device transporting the target silicon wafers, the third distance between the two adjacent target silicon wafers along the transport direction before entering the first area can be measured and used as the second distance.

[0056] Method A2: If the distance between two adjacent target silicon wafers along the transport direction changes in the same way when passing through the first position, the distance change value of the distance between the two adjacent target silicon wafers along the transport direction when passing through the first position can be estimated, and the third distance between the two adjacent target silicon wafers along the transport direction before entering the first area can be measured, thereby determining the second distance based on the distance change value and the third distance.

[0057] Method A3: If the distance between two adjacent target silicon wafers along the transport direction changes differently when passing through the first position, the average of the distances between two adjacent target silicon wafers along the transport direction among several target silicon wafers before entering the first area can be used as the second distance.

[0058] Specifically, the third value corresponding to the target chain device can be determined according to the following formula:

[0059]

[0060] Wherein, n represents the third value, L1 represents the first distance, L2 represents the second distance, and L3 represents the first size of the target silicon wafer.

[0061] As an optional implementation manner of an embodiment of the present invention, determining the second distance corresponding to the transmission device includes: determining the transportation speed of the transmission device for the target silicon wafer; determining the time interval between two adjacent target silicon wafers entering the first area from the first position; and determining the second distance based on the transportation speed and the time interval.

[0062] The transport speed of the target silicon wafers may refer to the linear speed of the roller surface of the transport device. The time interval between two adjacent target silicon wafers entering the first area from the first position can be obtained through actual measurement. Furthermore, the product of the transport speed of the target silicon wafers and the time interval between two adjacent target silicon wafers entering the first area from the first position can be used as the second distance corresponding to the transport device.

[0063] S205: Determine a device detection result of the target chain device based on the first detection result and the second detection result.

[0064] Specifically, after determining the first detection result corresponding to the first sensor and the second detection result corresponding to the second sensor, the first detection result and the second detection result may be used as the device detection results of the target chain device.

[0065] The technical solution of an embodiment of the present invention is that after the target chain device starts to operate, the target silicon wafer is transported through the first area corresponding to the transmission device by the transmission device of the target chain device, so that the borosilicate glass on the surface of the target silicon wafer is removed in the process of passing through the first area, thereby realizing the removal of the borosilicate glass on the surface of the target silicon wafer by the target chain device, while avoiding excessive corrosion or damage to the surface of the target silicon wafer; determining a first value corresponding to the target chain device, the first value is obtained by detecting the target silicon wafers by the first sensor and the second sensor and counting them, and is used to indicate the number of target silicon wafers in the first area, thereby realizing the counting of the target silicon wafers transported in the first area by the first sensor and the second sensor; determining a second value corresponding to the target chain device, and determining a first detection result based on the first value and the second value, and the second value The determination is based on the allowed detection error of the second sensor, and the first detection result is used to indicate whether the first sensor has an abnormality, thereby realizing abnormality detection of the first sensor by comparing the first value and the second value, while avoiding the second sensor from making an erroneous detection and affecting the accuracy of the first detection result; the third value corresponding to the target chain device is determined, and the second detection result is determined based on the first value and the third value. The third value is the number of target silicon wafers that should exist in the first area. The second detection result is used to indicate whether the second sensor has an abnormality, thereby realizing abnormality detection of the second sensor by comparing the first value and the third value; the equipment detection result of the target chain device is determined based on the first detection result and the second detection result, thereby improving the accuracy of abnormality detection of the first sensor and the second sensor.

[0066] Figure 4 This is a schematic diagram of the structure of a processing device for a chain-type device provided by an embodiment of the present invention. This embodiment of the present invention is applicable to detecting anomalies in sensors configured in chain-type borosilicate glass removal equipment. The processing device for the chain-type device can be implemented in hardware and / or software.

[0067] like Figure 4 As shown, the device includes:

[0068] The transport module 301 is configured to transport the target silicon wafer through a first area corresponding to the transport device via the transport device of the target chain device after the target chain device starts operating, so that borosilicate glass on the surface of the target silicon wafer is removed during the process of passing through the first area. The first area is the area between a first position and a second position along the transport direction of the transport device. The first position is the detection position of the first sensor, and the second position is the detection position of the second sensor. When the first sensor detects that the target silicon wafer enters the first area from the first position, the target silicon wafer is sprayed with water. The second sensor is used to detect whether the target silicon wafer leaves the first area from the second position. The transport device is composed of rollers.

[0069] A first determining module 302 is configured to determine a first value corresponding to a target chain device, where the first value is obtained by counting target silicon wafers detected by the first sensor and the second sensor and is used to indicate the number of target silicon wafers in the first area;

[0070] The second determining module 303 is configured to determine a device detection result of the target chain device based on the first value, where the device detection result is used to indicate whether an abnormality occurs in the first sensor and / or the second sensor.

[0071] Based on any of the above optional technical solutions, optionally, the first determination module 302 is specifically used to add one to the first value if the first sensor detects the target silicon wafer and / or subtract one from the first value if the second sensor detects the target silicon wafer, and the first value is set to 0 when the target chain device starts running.

[0072] Based on any of the above optional technical solutions, optionally, the second determination module 303 includes: a third determination unit, a fourth determination unit, and a fifth determination unit. The third determination unit is configured to determine a second value corresponding to the target chain device and determine a first detection result based on the first value and the second value, wherein the second value is determined based on an allowable detection error of the second sensor, and the first detection result indicates whether the first sensor has an abnormality. The fourth determination unit is configured to determine a third value corresponding to the target chain device and determine a second detection result based on the first value and the third value, wherein the third value is the number of target silicon wafers expected to be present in the first region, and the second detection result indicates whether the second sensor has an abnormality. The fifth determination unit is configured to determine a device detection result of the target chain device based on the first detection result and the second detection result.

[0073] Based on any of the above optional technical solutions, optionally, the fourth determining unit includes: a sixth determining subunit, a seventh determining subunit, and an eighth determining subunit. The sixth determining subunit is configured to determine a first distance corresponding to the transmission device, where the first distance is the distance between the first position and the second position; the seventh determining subunit is configured to determine a second distance corresponding to the transmission device and a first size of the target silicon wafer, where the second distance is the distance between two adjacent target silicon wafers transported in the first area along the transport direction, and the first size of the target silicon wafer is the length of the target silicon wafer along the transport direction; and the eighth determining subunit is configured to determine a third value based on the first distance, the second distance, and the first size of the target silicon wafer.

[0074] Based on any of the above optional technical solutions, optionally, the seventh determination subunit is specifically used to determine the transportation speed of the transmission device for the target silicon wafer; determine the time interval between two adjacent target silicon wafers entering the first area from the first position; and determine the second distance based on the transportation speed and the time interval.

[0075] Based on any of the above optional technical solutions, the processing device of the chain device optionally further includes an anomaly detection module, wherein the anomaly detection module is configured to detect whether an anomaly occurs in both the first sensor and the second sensor when the first value remains unchanged for more than a first preset time period.

[0076] Based on any of the above optional technical solutions, the processing device of the chain device optionally further includes: a first value assignment module. The first value assignment module is configured to set the first value to 0 if the first sensor does not detect the target silicon wafer for more than a second preset time period and the second sensor does not detect the target silicon wafer for more than a third preset time period.

[0077] According to the technical solution of the embodiment of the present invention, after the target chain device starts operating, the transport module 301 transports the target silicon wafer through the first area corresponding to the transport device via the transport device of the target chain device, so that the borosilicate glass on the surface of the target silicon wafer is removed during the process of passing through the first area, thereby achieving the removal of the borosilicate glass on the surface of the target silicon wafer by the target chain device. At the same time, the target silicon wafer is sprayed with water when entering the first area to prevent excessive corrosion or damage to the surface of the target silicon wafer. The first determination module 302 determines a first value corresponding to the target chain device, where the first value is obtained by counting the target silicon wafers detected by the first sensor and the second sensor and is used to indicate the number of target silicon wafers in the first area, thereby achieving the counting of the target silicon wafers transported in the first area by the first sensor and the second sensor. The second determination module 303 determines the device detection result of the target chain device based on the first value, where the device detection result is used to indicate whether the first sensor and / or the second sensor are abnormal, thereby achieving the determination of whether the first sensor and the second sensor configured in the target chain device are abnormal based on the first value, thereby reducing manual intervention and improving the efficiency of sensor abnormality detection, thereby avoiding the failure to detect sensor abnormalities in a timely manner, resulting in a large number of abnormal silicon wafers.

[0078] The processing device of the chain device provided in the embodiment of the present invention can execute the processing method of the chain device provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the execution method.

[0079] Figure 5A schematic structural diagram of an electronic device for implementing a processing method for a chain device provided in an embodiment of the present invention. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or required herein.

[0080] like Figure 5 As shown, the electronic device 10 includes at least one processor 11 and a memory, such as a read-only memory (ROM) 12, a random access memory (RAM) 13, etc., which is communicatively connected to the at least one processor 11. The memory stores a computer program that can be executed by the at least one processor. The processor 11 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 12 or the computer program loaded from the storage unit 18 into the random access memory (RAM) 13. Various programs and data required for the operation of the electronic device 10 can also be stored in the RAM 13. The processor 11, ROM 12, and RAM 13 are connected to each other via a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.

[0081] Multiple components in the electronic device 10 are connected to the I / O interface 15, including an input unit 16, such as a keyboard, a mouse, etc.; an output unit 17, such as various types of displays, speakers, etc.; a storage unit 18, such as a magnetic disk, an optical disk, etc.; and a communication unit 19, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information / data with other devices via a computer network such as the Internet and / or various telecommunication networks.

[0082] The processor 11 can be various general-purpose and / or specialized processing components with processing and computing capabilities. Some examples of the processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various specialized artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The processor 11 executes the various methods and processes described above, such as the processing methods of the chain device.

[0083] In some embodiments, the processing method of the chain device can be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as the storage unit 18. In some embodiments, part or all of the computer program can be loaded and / or installed on the electronic device 10 via the ROM 12 and / or the communication unit 19. When the computer program is loaded into the RAM 13 and executed by the processor 11, one or more steps of the processing method of the chain device described above can be performed. Alternatively, in other embodiments, the processor 11 can be configured to execute the processing method of the chain device by any other appropriate means (for example, by means of firmware).

[0084] Various embodiments of the systems and techniques described herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), system-on-chip systems (SOCs), programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include being implemented in one or more computer programs that are executable and / or interpreted on a programmable system that includes at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0085] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when the computer program is executed by the processor, the functions / operations specified in the flowcharts and / or block diagrams are implemented. The computer program may be executed entirely on the machine, partially on the machine, as a stand-alone software package, partially on the machine and partially on a remote machine, or entirely on a remote machine or server.

[0086] In the context of the present invention, computer-readable storage media can be tangible media that can contain or store a computer program for use with an instruction execution system, device or equipment or used in combination with an instruction execution system, device or equipment. Computer-readable storage media can include but are not limited to electronic, magnetic, optical, electromagnetic, infrared or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, computer-readable storage media can be machine-readable signal media. More specific examples of machine-readable storage media can include electrical connections based on one or more lines, portable computer disks, hard disks, random access memories (RAM), read-only memories (ROM), erasable programmable read-only memories (EPROM or flash memory), optical fibers, portable compact disk read-only memories (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0087] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0088] The systems and techniques described herein can be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer with a graphical user interface or web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0089] A computing system may include clients and servers. The clients and servers are typically remote from each other and typically interact via a communication network. This client-server relationship arises through computer programs running on the respective computers, creating a client-server relationship. The server may be a cloud server, also known as a cloud computing server or cloud host. This server is a hosting product within the cloud computing service ecosystem that addresses the management difficulties and limited scalability of traditional physical hosting and VPS services.

[0090] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in the present invention can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of the present invention can be achieved. This is not limited herein.

[0091] The above specific embodiments do not limit the scope of protection of the present invention. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention.

Claims

1. A method for processing chain equipment, characterized in that: The method comprises: After the target chain device starts running, the target silicon wafer is transported through a first area corresponding to the transport device by a transmission device of the target chain device, so that the borosilicate glass on the surface of the target silicon wafer is removed during the process of passing through the first area. The first area is the area between a first position and a second position along the transport direction of the transport device. The first position is the detection position of a first sensor, and the second position is the detection position of a second sensor. When the first sensor detects that the target silicon wafer enters the first area from the first position, the target silicon wafer is sprayed with water. The second sensor is used to detect whether the target silicon wafer leaves the first area from the second position. The transport device is composed of rollers. Determining a first value corresponding to the target chain device, where the first value is obtained by counting the target silicon wafers detected by the first sensor and the second sensor and is used to indicate the number of target silicon wafers in the first area; A device detection result of the target chain device is determined based on the first value, where the device detection result is used to indicate whether an abnormality occurs in the first sensor and / or the second sensor.

2. The method according to claim 1, characterized in that Determining a first value corresponding to the target chain device includes: If the first sensor detects the target silicon wafer, the first value is incremented by one and / or if the second sensor detects the target silicon wafer, the first value is decremented by one. The first value is set to 0 when the target chain device starts running.

3. The method according to claim 1, characterized in that Determining a device detection result of the target chain device based on the first value includes: Determining a second value corresponding to the target chain device, and determining a first detection result based on the first value and the second value, wherein the second value is determined based on an allowable detection error of the second sensor, and the first detection result is used to indicate whether the first sensor has an abnormality; Determining a third value corresponding to the target chain device, and determining a second detection result based on the first value and the third value, wherein the third value is the number of target silicon wafers that should be present in the first area, and the second detection result is used to indicate whether the second sensor has an abnormality; A device detection result of the target chain device is determined based on the first detection result and the second detection result.

4. The method according to claim 3, characterized in that Determining a third value corresponding to the target chain device includes: Determining a first distance corresponding to the transmission device, where the first distance is a distance between the first position and the second position; Determining a second distance corresponding to the transport device and a first size of the target silicon wafer, wherein the second distance is a distance between two adjacent target silicon wafers transported in the first area along a transport direction, and the first size of the target silicon wafer is a length of the target silicon wafer along the transport direction; The third value is determined based on the first distance, the second distance, and a first size of the target silicon wafer.

5. The method according to claim 4, characterized in that Determining a second distance corresponding to the transmission device includes: determining a transport speed of the target silicon wafer by the transport device; Determine a time interval between two adjacent target silicon wafers entering the first area from a first position; The second distance is determined based on the transport speed and the time interval.

6. The method according to claim 1, characterized in that The method further comprises: When the first value remains unchanged for more than a first preset time period, it is detected whether the first sensor and the second sensor are abnormal at the same time.

7. The method according to claim 1, characterized in that The method further comprises: If the first sensor does not detect the target silicon wafer for more than a second preset time period and the second sensor does not detect the target silicon wafer for more than a third preset time period, the first value is set to 0.

8. A processing device for chain equipment, characterized in that: The device comprises: A transport module is configured to transport a target silicon wafer through a first area corresponding to the transport device via a transport device of the target chain device after the target chain device starts operating, so that borosilicate glass on the surface of the target silicon wafer is removed during the process of the target silicon wafer passing through the first area. The first area is an area between a first position and a second position along a transport direction on the transport device. The first position is a detection position of a first sensor, and the second position is a detection position of a second sensor. When the first sensor detects that the target silicon wafer enters the first area from the first position, the target silicon wafer is sprayed with water. The second sensor is used to detect whether the target silicon wafer leaves the first area from the second position. The transport device is composed of rollers. a first determining module, configured to determine a first value corresponding to the target chain device, wherein the first value is obtained by counting the target silicon wafers detected by the first sensor and the second sensor and is used to indicate the number of target silicon wafers in the first area; The second determining module is configured to determine a device detection result of the target chain device based on the first value, wherein the device detection result is used to indicate whether an abnormality occurs in the first sensor and / or the second sensor.

9. An electronic device, characterized in that: The electronic device comprises: at least one processor; and a memory communicatively connected to the at least one processor; wherein, The memory stores a computer program that can be executed by the at least one processor. The computer program is executed by the at least one processor to enable the at least one processor to perform the processing method of the chain device according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the processing method of the chain device according to any one of claims 1 to 7 when executed.

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