Batch assembling device and method for power wafers

Abstract

The invention provides a batch assembling method of power wafers, which is used for fixing a plurality of power wafers on a radiating fin, and comprises the following steps of: clamping a plurality of pressing plate modules on a printed circuit board; embedding the power wafers into the pressing plate modules, and enabling a plurality of groups of pins of the power wafers to pass through a plurality of groups of wafer pin through holes of the printed circuit board; a plurality of locking pieces are respectively locked into the radiating fin through the printed circuit board and one pressing plate module; the radiating fin is provided with a plurality of abutting areas so as to abut against the power wafers, each pressing plate module is provided with a plurality of buckling claws and a plurality of longitudinal sliding grooves, the buckling claws abut against the longitudinal sliding grooves in a movable mode, and the buckling claws abut against the longitudinal sliding grooves in a movable mode. Therefore, the height difference of the abutting areas is absorbed so as to ensure the abutting state of the power wafers and the abutting areas.

Description

Technical Field

[0001] The present invention relates to a power module and a batch assembly solution for power chips. Background Art

[0002] In order to reduce the operating temperature of a power chip, it is usually attached to a heat sink so that the heat generated by the chip can be quickly dissipated through the heat sink. However, the heat dissipation effect is greatly reduced due to poor contact between the power chip and the heat sink.

[0003] Based on the above-mentioned shortcomings, relevant industry insiders have developed a pressure plate for applying pressure to the power chip and the heat sink to improve the bonding effect. Figure 1 and attached Figure 2 , among which, Figure 1 A three-dimensional exploded view of a power chip, a fixing member and a pressure plate of a conventional power module is shown; and Figure 2 Shown attached Figure 1 A combination diagram of the power module. Figure 1 As shown, two power chips 10 are arranged on the top surface of a heat sink 20 ; a pressing plate 30 is an elongated sheet with a through hole 301 longitudinally formed therein, and a screw hole 201 is formed in the heat sink 20 at a position corresponding to the through hole 301 .

[0004] During assembly, the two power chips 10 are placed on the top surface of the heat sink 20 at intervals and on both sides of the screw hole 201. Next, the pressure plate 30 is placed on the top surface of the two power chips 10 and the through hole 301 is aligned with the screw hole 201. Finally, a bolt 302 is passed through the through hole 301 and screwed into the screw hole 201, so that the pressure plate 30 applies pressure to the two power chips 10 below, so that the two power chips 10 and the top surface of the heat sink 20 form a bond as shown in the figure. Figure 2 The close contact state shown in the figure overcomes the aforementioned defect of poor heat dissipation caused by poor fitting contact.

[0005] However, the pressing plate 30 has the following potential deficiencies in practice:

[0006] (1) The pressure plate 30 is formed by stamping a metal sheet. Since the material itself is conductive, it is not suitable as a pressure and fixing element;

[0007] (2) The structural strength of the pressure plate 30 is higher than that of the power chip 10. Therefore, if the pressure plate 30 is over-locked, it is easy to cause the power chip 10 to break or be damaged.

[0008] (3) The pressure plate 30 does not provide a corresponding positioning structure to accommodate the two power chips 10, so that after the locking operation, the two power chips 10 are easily skewed due to compression; and

[0009] (4) In particular, when a considerable number of power chips 10 are to be placed on the top surface of the heat sink 20, the operator must perform locking operations on multiple pressing plates 30 in batches, which not only makes it difficult to make the power chips 10 closely adhere to the top surface of the heat sink 20 but also consumes a lot of work hours.

[0010] To solve the above problems, a novel batch assembly solution for power chips is urgently needed in the art. Summary of the Invention

[0011] An object of the present invention is to provide a batch assembly solution for power chips, which can accommodate multiple power chips by clamping multiple pressure plate modules on a printed circuit board, and then make these power chips abut a heat sink through a batch locking operation, thereby optimizing the assembly efficiency of the power modules.

[0012] Another object of the present invention is to provide a batch assembly solution for power chips, which can absorb the height differences of multiple abutment areas of the heat sink through an automatic height adjustment mechanism provided by each pressure plate module, thereby ensuring the abutment state of the power chips and the abutment areas.

[0013] To achieve the above-mentioned objectives, a batch assembly device for power chips is proposed, which is used to perform a batch assembly operation to fix multiple power chips on a heat sink, and includes:

[0014] A printed circuit board having a first top surface and a first bottom surface, the first top surface having at least one row of center positioning holes spaced apart from each other, and providing a plurality of supporting areas centered on the center positioning holes, each of the supporting areas having a plurality of chip pin through holes; and

[0015] 4. The repairing kit for automotive dents, according to claim 1, wherein a bottom of the foot stand comprises a through-hole, and the two foot blocks are connected via a through-hole to the foot stand, wherein the two foot blocks are connected via a through-hole to the foot stand. The two foot blocks are connected via a through-hole to the foot stand.

[0016] Among them, the batch assembly operation includes:

[0017] Placing the pressing plate modules on the first top surface of the printed circuit board and allowing the hollow snap-fitting columns to pass through the central positioning holes and snap-fit onto the first bottom surface of the printed circuit board;

[0018] The power chips are placed in pairs in the chip accommodating areas and fixed by the pair of locking portions, and the plurality of pins of the power chips are passed through the chip pin through-holes;

[0019] The second top surfaces of the pressure plate modules are brought into contact with the heat sink, the central through holes are aligned with the locking holes of the heat sink, and the locking members are each locked into the heat sink via one of the hollow snap columns, one of the central through holes, and one of the locking holes; and

[0020] The groups of pins are welded in the groups of chip pin through holes.

[0021] In one embodiment, the second top surface of the pressing plates is an electrically insulating surface.

[0022] In one embodiment, the locking claw is a plastic locking claw.

[0023] In one embodiment, a latch is provided on each of two opposite sides of the hollow snap post.

[0024] In one embodiment, the locking hole is a screw hole, and the locking element is a screw.

[0025] To achieve the above-mentioned objectives, the present invention further proposes a batch assembly method for power chips, which utilizes a batch assembly device to fix multiple power chips on a heat sink. The batch assembly device comprises: a printed circuit board having a first top surface and a first bottom surface, the first top surface having at least one row of multiple center positioning holes spaced apart, and providing multiple supporting areas centered on the center positioning holes, each of which is provided with multiple sets of chip pin through-holes; and multiple pressure plate modules, each comprising: a pressure plate having a second top surface and a second bottom surface, the second top surface having a separating protrusion, a pair of snap-fit portions, and a pair of wafer accommodating areas, the partition protrusion having a central through-hole, the pair of snap portions being located on both sides of the partition protrusion, the pair of wafer accommodating areas being formed between the partition protrusion and the pair of snap portions, and the two opposite side edges of the middle area of the second bottom surface each having at least one longitudinal slide groove; and a positioning member having a snap carrier and a hollow snap column disposed in the middle of the snap carrier, the two opposite sides of the snap carrier each being provided with at least one snap claw, each of the snap claws being elastically snapped to one of the longitudinal slide grooves on the second bottom surface of the pressure plate, and the hollow snap column being aligned with one of the central through-holes; the method comprising:

[0026] Placing the pressing plate modules on the first top surface of the printed circuit board and allowing the hollow snap-fitting columns to pass through the central positioning holes and snap-fit onto the first bottom surface of the printed circuit board;

[0027] The power chips are placed in pairs in the chip accommodating areas and fixed by the pairs of locking portions, and the plurality of pins of the power chips are passed through the chip pin through-holes;

[0028] The second top surfaces of the pressure plate modules are brought into contact with the heat sink, the central through holes are aligned with the locking holes of the heat sink, and the locking members are each locked into the heat sink via one of the hollow snap columns, one of the central through holes, and one of the locking holes; and

[0029] The groups of pins are welded in the groups of chip pin through holes.

[0030] In one embodiment, the second top surface of the pressing plates is an electrically insulating surface.

[0031] In one embodiment, the locking claw is a plastic locking claw.

[0032] In one embodiment, a latch is provided on each of two opposite sides of the hollow snap post.

[0033] In one embodiment, the locking hole is a screw hole, and the locking element is a screw.

[0034] To achieve the above-mentioned object, the present invention further provides a method for batch assembling power chips, for fixing a plurality of power chips on a heat sink, the method comprising:

[0035] Clamping a plurality of pressing plate modules on a printed circuit board;

[0036] Embedding the power chips into the pressure plate modules, and passing the plurality of pins of the power chips through the plurality of chip pin through-holes of the printed circuit board;

[0037] Locking a plurality of locking members into the heat sink through the printed circuit board and a pressure plate module; and

[0038] Soldering the groups of pins into the groups of chip pin through-holes;

[0039] Among them, the heat sink has multiple abutment areas to abut against the power chips, each of the pressure plate modules has multiple snap claws and multiple longitudinal slide grooves, and the snap claws abut against the longitudinal slide grooves in a movably manner, thereby absorbing the height difference of the abutment areas to ensure the abutment state of the power chips and the abutment areas.

[0040] In order to enable you, the review committee, to further understand the structure, features, objectives, and advantages of the present invention, the following are attached with drawings and detailed descriptions of preferred embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1A three-dimensional exploded view of a power chip, a fixing member, and a pressure plate of a conventional power module is shown;

[0042] Figure 2 Shown Figure 1 A combination diagram of the power module;

[0043] Figure 3 An exploded perspective view of an embodiment of a power wafer batch assembly apparatus according to the present invention is shown;

[0044] Figures 4 to 13 Shows the use of Figure 3 A schematic diagram of the disassembled operation of a batch assembly device to form a power module; and

[0045] Figure 14 A flow chart showing an embodiment of a method for batch assembling power wafers of the present invention is shown.

[0046] Reference numerals:

[0047] 10: Power chip;

[0048] 20: heat sink;

[0049] 201: screw hole;

[0050] 30: pressing plate;

[0051] 301: perforation;

[0052] 302: bolt;

[0053] 101: printed circuit board;

[0054] 101a: center positioning hole;

[0055] 101b: chip pin through-hole;

[0056] 102: positioning piece;

[0057] 1021: snap-on carrier;

[0058] 1021a: snap claw;

[0059] 1022: Hollow snap-on column;

[0060] 1022a: Card Falcon;

[0061] 103: pressing plate;

[0062] 103a: separating convex portion;

[0063] 103a1: central perforation;

[0064] 103a2: longitudinal chute;

[0065] 103b: buckle portion;

[0066] 103c: chip accommodating area;

[0067] 105: locking member;

[0068] 110: power chip;

[0069] 111: pin;

[0070] 120: heat sink;

[0071] 121: abutment area;

[0072] 121a: locking hole;

[0073] Step a: clamping a plurality of pressing plate modules on a printed circuit board;

[0074] Step b: embed the power chips into the pressure plate modules and make the power chips

[0075] A plurality of groups of pins pass through a plurality of groups of chip pin through holes of the printed circuit board;

[0076] Step c: Locking the plurality of locking members into the printed circuit board and the pressure plate module.

[0077] In the heat sink;

[0078] Step d: Soldering the groups of pins into the groups of chip pin through-holes. DETAILED DESCRIPTION

[0079] Please refer to the attached Figure 3 , which shows an exploded perspective view of an embodiment of a batch assembly device for power chips of the present invention. Figure 3 As shown, the batch assembly device for power chips includes a printed circuit board 101, multiple positioning members 102, multiple pressure plates 103 and multiple locking members 105, which are used to perform a batch assembly operation to fix multiple power chips 110 on a heat sink 120, wherein the positioning members 102 and the pressure plates 103 are used to form a pressure plate module.

[0080] The printed circuit board 101 has a first top surface and a first bottom surface. The first top surface has at least one row of center positioning holes 101a spaced apart from each other. A plurality of supporting areas are provided with the center positioning holes 101a as the center, and each supporting area has a plurality of chip pin through holes 101b.

[0081] Each pressure plate 103 has a second top surface and a second bottom surface. The second top surface has a partitioning protrusion 103a, a pair of latching portions 103b, and a pair of wafer receiving areas 103c. The partitioning protrusion 103a has a central through-hole 103a1. The pair of latching portions 103b are located on either side of the partitioning protrusion 103a, and the pair of wafer receiving areas 103c are formed between the partitioning protrusion 103a and the pair of latching portions 103b. Furthermore, the middle region of the second bottom surface has at least one longitudinal groove 103a2 on each of its two opposing sides.

[0082] Each of these positioning parts 102 has a snap carrier 1021 and a hollow snap column 1022 arranged in the middle of the snap carrier 1021, wherein at least one snap claw 1021a is provided on each of the two opposite sides of the snap carrier 1021, and the snap claw 1021a can be a plastic snap claw, and a latch 1022a is provided on each of the two opposite sides of the hollow snap column 1022.

[0083] In addition, the heat sink 120 has a plurality of abutting areas 121 . Each abutting area 121 is provided with at least one locking hole 121 a , wherein the locking hole 121 a may be a screw hole.

[0084] Please refer to the attached Figure 4 To the attached Figure 13 , which is a schematic diagram of the decomposition of the batch assembly operation. Figure 4 To the attached Figure 11 As shown, the batch assembly operation includes:

[0085] (1) As attached Figure 4 As shown, the plastic snap claws 1021a of the snap carriers 1021 of the positioning members 102 are elastically snapped into the longitudinal grooves 103a2 of the second bottom surfaces of the pressing plates 103 to form a plurality of pressing plate modules, so that the snap carriers 1021 can have a longitudinal displacement space relative to the pressing plates 103. After the snap carriers 1021 are combined with the pressing plates 103, the hollow snap columns 1022 are aligned with the central through-holes 103a1 of the partitioning protrusions 103a.

[0086] (2) As attached Figure 5 and attached Figure 6 As shown, the pressing plate modules are placed on the first top surface of the printed circuit board 101 and the hollow snap-fit columns 1022 pass through the central positioning holes 101a and snap-fit on the first bottom surface of the printed circuit board 101;

[0087] (3) As attached Figure 7 and attached Figure 8As shown, the power chips 110 are placed in pairs in each of the chip accommodating areas 103c and fixed by each of the pair of locking portions 103b, and the plurality of pins 111 of the power chips 110 pass through the plurality of chip pin through-holes 101b; and

[0088] (4) As attached Figure 9 To the attached Figure 13 As shown, the second top surfaces of the pressure plates 103 are abutted against the heat sink 120, and the central through holes 103a1 are aligned with the multiple locking holes 121a of the heat sink 120, and the multiple locking members 105 are each locked into the heat sink 120 through a hollow snap column 1022, a central through hole 103a1 and a locking hole 121a, wherein the locking member 105 can be a screw.

[0089] After the locking members 105 are locked into the heat sink 120 , the groups of pins 111 can be soldered into the groups of chip pin through holes 101 b to complete the assembly of a power module and solder the power module onto the printed circuit board 101 at the same time.

[0090] It is worth mentioning that, as Figure 13 As shown, when the abutment areas 121 are not on the same plane, since the plastic snap claws 1021a of the snap carriers 1021 have a longitudinal displacement space on the longitudinal slide groove 103a2, the plastic snap claws 1021a can have different snap positions on the longitudinal slide groove 103a2 to absorb the height difference of the abutment areas 121, thereby allowing the power chips to maintain an abutment state with the abutment areas.

[0091] That is, through this batch assembly operation, the present invention can integrate the power module assembly process with the process of plugging the power module into the printed circuit board 101, thereby improving the overall assembly efficiency of the printed circuit board 101. Furthermore, it is worth noting that the second top surfaces of the pressure plates 103 are electrically insulating surfaces, thereby preventing short circuits between the power chips 110.

[0092] From the above description, it can be seen that the present invention discloses a batch assembly method for power chips. Figure 14 , which shows a flow chart of an embodiment of a batch assembly method of power chips of the present invention, for fixing multiple power chips on a heat sink. Figure 14 As shown, the method includes: clamping a plurality of pressure plate modules on a printed circuit board (step a); embedding the power chips into the pressure plate modules, and passing the plurality of pins of the power chips through the plurality of chip pin through-holes of the printed circuit board (step b); locking a plurality of locking members into the heat sink through the printed circuit board and one of the pressure plate modules (step c); and soldering the plurality of pins into the plurality of chip pin through-holes (step d).

[0093] In addition, in the above steps, the contact surface between the pressure plate modules and the power chips is an electrically insulating surface; and each of the locking components is a screw component.

[0094] In addition, in the above steps, the heat sink has a plurality of contact areas for contacting the power chips, and the contact areas may have different heights.

[0095] In addition, in the above steps, each of the pressure plate modules has multiple latching claws and multiple longitudinal slide grooves, and the latching claws are movably abutted against the longitudinal slide grooves, thereby absorbing the height difference of the abutting areas to ensure the abutting state of the power chips and the abutting areas.

[0096] According to the above design, the present invention has the following advantages:

[0097] 1. The batch assembly solution for power chips of the present invention can accommodate multiple power chips by clamping multiple pressure plate modules onto a printed circuit board, and then a batch locking operation is performed to make the power chips abut against a heat sink, thereby optimizing the assembly efficiency of the power modules; and

[0098] Second, the batch assembly solution for power chips of the present invention can absorb the height differences of the multiple contact areas of the heat sink through an automatic height adjustment mechanism provided by each of the pressure plate modules, thereby ensuring the contact state between the power chips and the contact areas.

[0099] The embodiments involved in the present invention are preferred embodiments. However, any local changes or modifications that are derived from the technical ideas of the present invention and are easily inferred by those skilled in the art do not depart from the scope of the patent rights of the present invention.

Claims

1. A batch assembly device for power chips, used to perform a batch assembly operation to fix multiple power chips on a heat sink, characterized in that: include: A printed circuit board having a first top surface and a first bottom surface, the first top surface having at least one row of center positioning holes spaced apart from each other, and providing a plurality of supporting areas centered on the center positioning holes, each of the supporting areas having a plurality of chip pin through holes; and 4. The repairing kit for automotive dents, according to claim 1, wherein a bottom of the foot stand comprises a through-hole, and the two foot blocks are connected via a through-hole to the foot stand, wherein the two foot blocks are connected via a through-hole to the foot stand. The two foot blocks are connected via a through-hole to the foot stand. Among them, the batch assembly operation includes: Placing the pressing plate modules on the first top surface of the printed circuit board and allowing the hollow snap-fitting columns to pass through the central positioning holes and snap-fit onto the first bottom surface of the printed circuit board; The power chips are placed in pairs in the chip accommodating areas and fixed by the pairs of locking portions, and the plurality of pins of the power chips are passed through the chip pin through-holes; The second top surfaces of the pressure plate modules are brought into contact with the heat sink, the central through holes are aligned with the locking holes of the heat sink, and the locking members are each locked into the heat sink via one of the hollow snap columns, one of the central through holes, and one of the locking holes; and The groups of pins are welded in the groups of chip pin through holes.

2. The power chip batch assembly device according to claim 1, characterized in that: The second top surface of the pressing plates is an electrical insulation surface.

3. The power chip batch assembly device according to claim 1, characterized in that: The buckle claw is a plastic buckle claw.

4. The power chip batch assembly device according to claim 1, characterized in that: A latch is provided on each of two opposite sides of the hollow buckle column.

5. The power chip batch assembly device according to claim 1, characterized in that: The locking hole is a screw hole, and the locking piece is a screw piece.

6. A method for batch assembling power chips, comprising: utilizing a batch assembly apparatus to secure a plurality of power chips to a heat sink; the batch assembly apparatus comprising: A printed circuit board having a first top surface and a first bottom surface, the first top surface having at least one row of multiple center positioning holes spaced apart, and providing multiple supporting areas with the center positioning holes as the center, and each of the supporting areas is provided with multiple groups of chip pin through-holes; and multiple pressure plate modules, each having: a pressure plate having a second top surface and a second bottom surface, the second top surface having a separating protrusion, a pair of snap-fit portions and a pair of chip accommodating areas, the separating protrusion having a center through-hole, the pair of snap-fit portions being located on both sides of the separating protrusion The pair of wafer accommodating areas are formed between the separating protrusions and the pair of latching portions, and two opposite side edges of the middle area of the second bottom surface each have at least one longitudinal slide groove; and a positioning member having a latching platform and a hollow latching column disposed in the middle of the latching platform, at least one latching claw being disposed on each of two opposite sides of the latching platform, each of the latching claws being elastically latched in one of the longitudinal slide grooves of the second bottom surface of the pressure plate, and the hollow latching column being aligned with one of the central through holes; the method comprising: Placing the pressing plate modules on the first top surface of the printed circuit board and allowing the hollow snap-fitting columns to pass through the central positioning holes and snap-fit onto the first bottom surface of the printed circuit board; The power chips are placed in pairs in the chip accommodating areas and fixed by the pairs of locking portions, and the plurality of pins of the power chips are passed through the chip pin through-holes; The second top surfaces of the pressure plate modules are brought into contact with the heat sink, the central through holes are aligned with the locking holes of the heat sink, and the locking members are each locked into the heat sink via one of the hollow snap columns, one of the central through holes, and one of the locking holes; and The groups of pins are welded in the groups of chip pin through holes.

7. The method for batch assembling power chips according to claim 6, wherein: The second top surface of the pressing plates is an electrical insulation surface.

8. The method for batch assembling power chips according to claim 6, wherein: The buckle claw is a plastic buckle claw.

9. The batch assembly method of power chips according to claim 6, wherein: A latch is provided on each of two opposite sides of the hollow buckle column.

10. The batch assembly method of power chips according to claim 6, wherein: The locking hole is a screw hole, and the locking member is a screw member.

11. A method for batch assembling power chips, for fixing a plurality of power chips on a heat sink, characterized in that: The method includes: Clamping a plurality of pressing plate modules on a printed circuit board; Embedding the power chips into the pressure plate modules, and passing the plurality of pins of the power chips through the plurality of chip pin through-holes of the printed circuit board; Locking a plurality of locking members into the heat sink through the printed circuit board and a pressure plate module; and Soldering the groups of pins into the groups of chip pin through-holes; Among them, the heat sink has multiple abutment areas to abut against the power chips, each of the pressure plate modules has multiple snap claws and multiple longitudinal slide grooves, and the snap claws abut against the longitudinal slide grooves in a movably manner, thereby absorbing the height difference of the abutment areas to ensure the abutment state of the power chips and the abutment areas.

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