Wafer separation mobile online detection device

Abstract

The present application discloses an online detection device for wafer slicing movement, comprising: a placement mechanism; a wafer retrieval mechanism, comprising a suction assembly, a first driving member, a first air blow port, a second air blow port, and a moving assembly, wherein the suction plane of the suction assembly has a suction position perpendicular to a first direction and a placement position perpendicular to a vertical direction; the first driving member is connected to the suction assembly; the first air blow port is circular in shape, and the second air blow port is oblong in shape; the moving assembly is connected to the suction assembly; a first conveying part and a second conveying part extending along a first direction and having the same moving direction and equal moving speed, wherein a gap of a predetermined length is provided between the first conveying part and the second conveying part; the suction assembly is located above the first conveying part; two cameras are fixedly arranged above and below the gap, respectively; a first light source and a second light source are arranged above and below the gap, respectively. The online detection device for wafer slicing movement can realize unobstructed detection and can realize rapid wafer retrieval.

Description

Technical Field

[0001] This specification relates to the field of wafer detection technology, and in particular to an online detection device for wafer separation and movement. Background Art

[0002] A wafer is a circular silicon wafer or substrate used in semiconductor manufacturing, also known as a silicon wafer or liner. It is the fundamental material for manufacturing integrated circuits. Wafers are generally made of single-crystal silicon and have a very flat surface. The process of manufacturing wafers is called wafer fabrication or semiconductor manufacturing and involves multiple process steps such as wafer growth, cutting, polishing, and cleaning. On wafers, the various components and layers of integrated circuits are manufactured through processes such as photolithography, thin film deposition, ion implantation, diffusion, and metal deposition. Multiple chips can be manufactured on a single wafer, and through cutting and packaging, each chip is used as an independent IC product. Wafer manufacturing is a crucial step in the semiconductor industry, affecting the quality, efficiency, and cost of integrated circuits. After wafer fabrication is completed, the wafers need to be inspected. Wafer inspection is a core step in semiconductor manufacturing to ensure chip quality and yield, involving multi-dimensional technologies such as physical defect identification, dimensional measurement, and electrical performance testing.

[0003] In existing technologies, wafer inspection often requires clamping or supporting the wafer, which results in at least partial obstruction of the wafer. This obstructs accurate inspection of the obscured portion, reducing inspection efficiency and impacting the results, potentially leading to the outflow of defective products. Furthermore, during initial wafer inspection, removing a single wafer for inspection presents certain obstacles due to the stacking of multiple wafers, the strong adhesion between the wafers, and water stains between some wafers. Summary of the Invention

[0004] In view of the deficiencies in the prior art, one purpose of this specification is to provide a wafer slicing mobile online detection device that can achieve unobstructed detection and rapid wafer retrieval.

[0005] To achieve the above objectives, the present invention provides an online detection device for wafer separation movement, comprising:

[0006] A placement mechanism for placing a wafer, wherein a surface of the wafer in the placement mechanism is perpendicular to a first direction;

[0007] The wafer-taking mechanism for sucking wafers comprises a suction component, a first driving member, a first air blowing port, a second air blowing port and a moving component, wherein the suction component has a suction plane parallel to the surface of the wafer, and the suction plane has a suction position perpendicular to the first direction and a placement position perpendicular to the vertical direction; the first driving member is connected to the suction component, and is used to drive the suction component to rotate around a rotation axis extending in the second direction, so that the suction plane switches between the suction position and the placement position; the first direction, the second direction and the vertical direction are perpendicular to each other; the first air blowing port and the second air blowing port are respectively connected to two sides of the suction component in the second direction; the first air blowing port is circular in shape, and the second air blowing port is oblate in shape; the moving component is connected to the suction component, and is used to drive the suction component to move in the first direction and the vertical direction;

[0008] A first conveying portion and a second conveying portion extending in a first direction and moving in the same direction and at the same speed, wherein a gap of a predetermined length is defined between the first conveying portion and the second conveying portion; the predetermined length is less than a radius of the wafer; the first conveying portion is located between the placement mechanism and the second conveying portion; and the suction assembly is located above the first conveying portion.

[0009] two cameras fixedly arranged above and below the gap respectively;

[0010] A first light source and a second light source are respectively disposed above and below the gap.

[0011] As a preferred embodiment, there are two second light sources, and the angle configuration of the two second light sources is: the light of the second light source has no contact with the first transmission part and the second transmission part, and the light of the two second light sources intersects at the lower surface of the wafer on the gap.

[0012] As a preferred embodiment, there are two first light sources, and the light rays of the two first light sources intersect at the upper surface of the wafer on the gap; the intersection of the light rays of the two first light sources and the intersection of the light rays of the two second light sources are staggered in the first direction.

[0013] As a preferred embodiment, a drying section is fixedly provided on the upstream of the gap in the first conveying section, and the drying section includes a plurality of fans located on the top and side surfaces.

[0014] As a preferred embodiment, the second air blowing port includes a plurality of sub-air blowing ports arranged in a straight line, and the sub-air blowing ports are circular in shape; and the diameter of the sub-air blowing ports is smaller than the diameter of the first air blowing port.

[0015] As a preferred embodiment, the first air blowing port is fixedly connected to the suction assembly through a copper tube; the second air blowing port is connected to the suction assembly through a flexible tube, and the position and direction of the second air blowing port are adjustable; at the same time, at most only one of the first air blowing port and the second air blowing port is working.

[0016] As a preferred embodiment, the moving assembly includes a first slide rail extending along the first direction, a second slide rail extending along the vertical direction, a first slider slidably connected to the first slide rail, a second slider slidably connected to the second slide rail, and a fixed frame fixedly connected to the bottom of the first slider; one end of the first air blowing port and one end of the second air blowing port are fixedly connected to an end of the first slider close to the placement mechanism along the first direction; the fixed end of the first driving member is fixedly connected to the fixed frame, and the moving end of the first driving member is rotatably connected to the fixed frame; the first slide rail is fixedly connected to the second slider.

[0017] As a preferred embodiment, the placement mechanism includes:

[0018] Two limiting shafts for placing a wafer, the limiting shafts extending along a first direction, and a distance between the two limiting shafts being smaller than a diameter of the wafer;

[0019] Two fixing plates perpendicular to the first direction, with both ends of the limiting shaft respectively fixed to the inner sides of the two fixing plates;

[0020] A fixing base fixedly connected to the bottom of the fixing plate;

[0021] a third slide rail extending along the first direction, wherein the bottom of the fixing seat is slidably connected to the third slide rail;

[0022] a fourth slide rail extending along the first direction, the fourth slide rail being fixedly disposed on the upper surface of the fixing seat and passing through the two fixing plates;

[0023] A baffle is slidably connected to the fourth slide rail, and the baffle is located between the two fixed plates and passes through the two limiting shafts.

[0024] As a preferred embodiment, there are multiple placement mechanisms, and the multiple placement mechanisms are arranged at intervals in the second direction; the moving component also includes a fifth slide rail extending along the second direction and a third slider slidably connected to the fifth slide rail; the second slide rail is fixedly connected to the third slider.

[0025] As a preferred embodiment, the first conveying part includes two first conveyor belts spaced apart in the second direction, and the first conveyor belts are connected to a second driving member for driving the two first conveyor belts to move simultaneously along the first direction; the second conveying part includes two second conveyor belts spaced apart in the second direction, and the second conveyor belts are connected to a third driving member for driving the two second conveyor belts to move simultaneously along the first direction. Beneficial effects

[0026] The wafer separation movement online inspection device provided in this embodiment includes a placement mechanism, a wafer removal mechanism, a first conveyor unit, a second conveyor unit, a camera, a first light source, and a second light source. Because a gap of a predetermined length is provided between the first conveyor unit and the second conveyor unit, two cameras are respectively provided above and below the gap, and the first light source and the second light source are respectively provided above and below the gap. Furthermore, the first conveyor unit and the second conveyor unit move in the same direction and at the same speed. Therefore, when the wafer is transferred from the first conveyor unit through the gap to the second conveyor unit, the two cameras can simultaneously photograph and inspect the upper and lower surfaces of the wafer located in the gap, achieving unobstructed inspection and capable of detecting defects such as scratches and chipped edges on the wafer.

[0027] In addition, the film taking mechanism includes a suction component, a first driving component, a first air blowing port, a second air blowing port and a moving component. The suction component sucks the wafer, and the first air blowing port and the second air blowing port are respectively located on both sides of the suction component in the second direction, and the first air blowing port is circular in shape, and the second air blowing port is oblong in shape. When the suction component sucks the target wafer, the first air blowing port can first blow away multiple wafers adjacent to the target wafer, and then blow air to the gap between the target wafer and its adjacent wafers through the oblong second air blowing port, so that the suction component can easily take out the target wafer under the drive of the moving component, and can achieve fast film taking.

[0028] Furthermore, a first drive member is connected to the suction assembly, driving the suction assembly to rotate, switching the suction plane between a suction position and a placement position. When the suction plane is in the suction position, the suction assembly faces the placement mechanism, enabling rapid wafer retrieval. When the suction plane is in the placement position, the suction assembly faces downward, allowing the wafer to be stably placed on the first conveyor section for subsequent inspection. The vertical orientation of the wafer significantly reduces resistance during retrieval.

[0029] With reference to the following description and the accompanying drawings, the specific embodiments of the present invention are disclosed in detail, indicating the manner in which the principles of the present invention can be employed. It should be understood that the embodiments of the present invention are not limited in scope thereby.

[0030] Features described and / or illustrated with respect to one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments.

[0031] It should be emphasized that the term "include / comprising" when used herein refers to the presence of features, integers, steps or components, but does not exclude the presence or addition of one or more other features, integers, steps or components. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative labor.

[0033] Figure 1 Schematic diagram of the three-dimensional structure of a wafer separation movement online detection device provided in this embodiment;

[0034] Figure 2 This is a structural schematic diagram of a placement mechanism provided in this embodiment;

[0035] Figure 3 This is a schematic structural diagram of a film-taking mechanism provided in this embodiment;

[0036] Figure 4 for Figure 3 A front view of the middle suction assembly, the first air blowing port, and the second air blowing port;

[0037] Figure 5 This is a schematic diagram of the enlarged structure of a second air outlet provided in this embodiment;

[0038] Figure 6 A schematic structural diagram of a first transmission unit and a second transmission unit provided in this embodiment;

[0039] Figure 7 for Figure 1 The main view of other structures except the placement mechanism and the film-taking mechanism.

[0040] Description of reference numerals:

[0041] 1. Placement mechanism; 11. Limiting shaft; 12. Fixing plate; 13. Fixing seat; 14. Third slide rail; 15. Fourth slide rail; 16. Baffle; 2. Sheet removal mechanism; 21. Suction assembly; 211. First suction nozzle; 212. Second suction nozzle; 22. First driving member; 23. First air blowing port; 231. Copper tube; 24. Second air blowing port; 241. Sub-air blowing port; 242. Flexible tube; 25. Moving assembly; 251. First slide rail; 252. Second slide rail; 253. First slider; 254. Second Slider; 255, fixing frame; 256, fifth slide rail; 257, third slider; 258, fourth driving member; 259, fifth driving member; 2510, sixth driving member; 3, first conveying unit; 31, first conveyor belt; 32, second driving member; 4, second conveying unit; 41, second conveyor belt; 42, third driving member; 5, gap; 6, camera; 7, first light source; 8, second light source; 9, drying unit; 91, fan; 10, wafer; X, first direction; Y, second direction; Z, vertical direction. DETAILED DESCRIPTION

[0042] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0043] It should be noted that when an element is referred to as being "disposed on" another element, it may be directly on the other element or there may be another element centered thereon. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be another element centered thereon. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used in this specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0045] See also Figures 1 to 7The embodiment of the present application provides an online detection device for wafer 10 slicing movement, comprising: a placement mechanism 1 , a wafer removal mechanism 2 , a first conveying unit 3 , a second conveying unit 4 , a camera 6 , a first light source 7 , and a second light source 8 .

[0046] like Figure 2 As shown, the placement mechanism 1 is used to place a wafer 10 , and the surface of the wafer 10 in the placement mechanism 1 is perpendicular to the first direction X.

[0047] like Figure 3 As shown, the wafer removal mechanism 2 is used to absorb the wafer 10 and includes a suction assembly 21, a first drive member 22, a first air outlet 23, a second air outlet 24, and a moving assembly 25. The suction assembly 21 has a suction plane parallel to the surface of the wafer 10. The suction plane has a suction position perpendicular to a first direction X and a placement position perpendicular to a vertical direction Z. The first drive member 22 is connected to the suction assembly 21 and is used to drive the suction assembly 21 to rotate about a rotation axis extending in a second direction Y, thereby switching the suction plane between the suction position and the placement position. The first direction X, the second direction Y, and the vertical direction Z are mutually perpendicular to each other. Specifically, the first direction X and the second direction Y are two directions perpendicular to each other in a horizontal plane. The first air outlet 23 and the second air outlet 24 are both connected to the suction assembly 21. The first air outlet 23 and the second air outlet 24 are respectively connected to either side of the suction assembly 21 in the second direction Y. The first air outlet 23 is circular in shape, while the second air outlet 24 is oblate in shape. The moving assembly 25 is connected to the suction assembly 21 and is used to drive the suction assembly 21 to move in the first direction X and the vertical direction Z.

[0048] like Figure 1 and Figure 6 As shown, the first conveyor 3 and the second conveyor 4 both extend along a first direction X, move in the same direction, and at the same speed. A gap 5 of a predetermined length is defined between the first conveyor 3 and the second conveyor 4. This predetermined length is less than the radius of the wafer 10, allowing the wafer 10 to pass smoothly through the gap 5 from the first conveyor 3 and then onto the second conveyor 4. The first conveyor 3 is located between the placement mechanism 1 and the second conveyor 4. A suction assembly 21 is located above the first conveyor 3.

[0049] like Figure 7 As shown, two cameras 6 are fixedly arranged above and below the gap 5. A first light source 7 and a second light source 8 are arranged above and below the gap 5, respectively.

[0050] The wafer 10 slicing movement online inspection device provided in this embodiment includes a placement mechanism 1, a retrieval mechanism 2, a first conveyor 3, a second conveyor 4, a camera 6, a first light source 7, and a second light source 8. Since there is a gap 5 of a predetermined length between the first conveyor 3 and the second conveyor 4, two cameras 6 are respectively arranged above and below the gap 5, and the first light source 7 and the second light source 8 are respectively arranged above and below the gap 5. Moreover, the first conveyor 3 and the second conveyor 4 move in the same direction and at the same speed. Therefore, when the wafer 10 is transferred from the first conveyor 3 to the second conveyor 4 through the gap 5, the two cameras 6 can simultaneously take photos of the upper and lower surfaces of the wafer 10 located at the gap 5 for inspection, thereby achieving unobstructed inspection and detecting defects such as scratches and edge collapse of the wafer 10.

[0051] In addition, the film taking mechanism 2 includes a suction component 21, a first driving component 22, a first air blowing port 23, a second air blowing port 24 and a moving component 25. The wafer 10 is sucked by the suction component 21, and the first air blowing port 23 and the second air blowing port 24 are respectively located on both sides of the suction component 21 in the second direction Y, and the first air blowing port 23 is circular and the second air blowing port 24 is oblong. When the suction component 21 sucks the target wafer 10, the first air blowing port 23 can first blow away the multiple wafers 10 adjacent to the target wafer 10, and then blow air into the gap 5 between the target wafer 10 and its adjacent wafers 10 through the oblong second air blowing port 24, so that the suction component 21 can easily take out the target wafer 10 under the drive of the moving component 25, and can achieve rapid film taking.

[0052] Furthermore, a first drive member 22 is connected to the suction assembly 21 and can drive the suction assembly 21 to rotate, switching the suction plane between the suction position and the placement position. When the suction plane is in the suction position, the suction assembly 21 faces the placement mechanism 1, enabling rapid wafer retrieval. When the suction plane is in the placement position, the suction assembly 21 faces downward, allowing the wafer 10 to be stably placed on the first conveyor 3, facilitating subsequent inspection of the wafer 10. The vertical orientation of the wafer 10 significantly reduces resistance during retrieval.

[0053] In this embodiment, there are two second light sources 8, which can illuminate the lower surface of the wafer 10 to supplement the light. The predetermined length of the gap 5 and the angles of the two second light sources 8 are configured so that the light from the second light sources 8 does not contact the first conveying part 3 and the second conveying part 4, and the light from the two second light sources 8 intersects the lower surface of the wafer 10 on the gap 5 (such as Figure 7 ), thereby ensuring that the light from the two second light sources 8 will not be blocked by the first transmitting part 3 and the second transmitting part 4.

[0054] Specifically, there are two first light sources 7, which can illuminate the upper surface of the wafer 10 and supplement the light. The light from the two first light sources 7 intersects the upper surface of the wafer 10 on the gap 5 (such as Figure 7 The intersection point (A) of the light beams from the two first light sources 7 and the intersection point (B) of the light beams from the two second light sources 8 are staggered in the first direction X to prevent light interference and ensure that both the upper and lower surfaces of the wafer 10 can be clearly photographed by the camera 6 .

[0055] like Figure 1 As shown, the first conveying part 3 is fixedly provided with a drying part 9 upstream of the gap 5. The drying part 9 includes multiple fans 91 located on the top and side surfaces, which can remove water stains, dust and other impurities on the wafer 10 to avoid interference with subsequent camera 6 detection.

[0056] In one embodiment, the second blowing port 24 may include only one opening, which is longer in one direction and very short in another direction (perpendicular to the longer direction), thereby forming a prolate second blowing port 24.

[0057] In a preferred embodiment, Figure 5 As shown, the second air outlet 24 includes a plurality of sub-air outlets 241 arranged in a straight line, resulting in a flat and long shape. Specifically, the sub-air outlets 241 are circular in shape, and their diameter is smaller than that of the first air outlet 23. The multiple sub-air outlets 241 arranged at intervals can make the airflow from the second air outlet 24 more powerful, facilitating the separation of adjacent wafers 10.

[0058] Preferably, if Figure 4 As shown, the first air outlet 23 is fixedly connected to the suction assembly 21 via a copper tube 231. The second air outlet 24 is connected to the suction assembly 21 via a flexible tube 242. The position and orientation of the second air outlet 24 are adjustable. During actual operation, the position and orientation of the second air outlet 24 can be adjusted as needed. The arrangement direction of the multiple sub-air outlets 241 intersects the first direction X, the second direction Y, and the vertical direction Z.

[0059] like Figure 3As shown, the moving assembly 25 includes a first slide rail 251 extending along a first direction X, a second slide rail 252 extending along a vertical direction Z, a first slider 253 slidably connected to the first slide rail 251, a second slider 254 slidably connected to the second slide rail 252, and a fixed frame 255 fixedly connected below the first slider 253. One end of the first air blowing port 23 and one end of the second air blowing port 24 are fixedly connected to an end of the first slider 253 along the first direction X that is close to the placement mechanism 1. The fixed end of the first driving member 22 is fixedly connected to the fixed frame 255, and the movable end of the first driving member 22 is rotatably connected to the fixed frame 255. The first slide rail 251 is fixedly connected to the second slider 254.

[0060] Specifically, the first slider 253 is connected to a fourth driving member 258, which can drive the first slider 253 to drive the fixing frame 255 to move along the first direction X, thereby achieving movement of the suction assembly 21 along the first direction X. The second slider 254 is connected to a fifth driving member 259, which can drive the second slider 254 to drive the suction assembly 21 to move along the vertical direction Z.

[0061] In this embodiment, if Figure 2 As shown, the placement mechanism 1 includes: a fixed seat 13, a third slide rail 14, two limiting shafts 11 and two fixed plates 12. The two limiting shafts 11 are used to place the wafer 10. The limiting shafts 11 extend along the first direction X, and the distance between the two limiting shafts 11 is less than the diameter of the wafer 10. The two limiting shafts 11 are spaced apart in the second direction Y. The two fixed plates 12 are perpendicular to the first direction X. The two ends of the limiting shaft 11 are respectively fixed to the inner sides of the two fixed plates 12. The fixed seat 13 is fixedly connected to the bottom of the fixed plate 12, and the two fixed plates 12 can be connected. The third slide rail 14 extends along the first direction X. The bottom of the fixed seat 13 is slidably connected to the third slide rail 14, so that the structure on the fixed seat 13 can move along the first direction X, which is convenient for loading and unloading the wafer 10. During manual loading, the fixed seat 13 is located at the end of the third slide rail 14 away from the suction component 21; after manual loading is completed, the fixed seat 13 can be moved to the end of the third slide rail 14 close to the suction component 21 to facilitate the suction component 21 to take the material.

[0062] Specifically, the placement mechanism 1 also includes a fourth slide rail 15 and a baffle 16. The fourth slide rail 15 extends along the first direction X. The fourth slide rail 15 is fixedly arranged on the upper surface of the fixed seat 13 and passes through the two fixed plates 12. The baffle 16 is slidably connected to the fourth slide rail 15. The baffle 16 is located between the two fixed plates 12 and is passed through the two limit shafts 11. The vertically stacked wafers 10 can be fixed so that they will not fall over by the baffle 16, a fixed plate 12 away from the suction component 21, and the two limit shafts 11. When the suction component 21 moves to the vicinity of the wafer 10 to pick up the material, the baffle 16 moves a predetermined distance in the direction close to the suction component 21; when the suction component 21 takes out a wafer 10, the baffle 16 moves in the direction away from the suction component 21.

[0063] In this embodiment, there are multiple placement mechanisms 1 (e.g., 3-5), spaced apart in the second direction Y. This allows for the placement of multiple wafers 10 during manual loading, reducing the frequency of manual loading. Accordingly, the moving assembly 25 includes a fifth slide rail 256 extending along the second direction Y and a third slider 257 slidably connected to the fifth slide rail 256. The second slide rail 252 is fixedly connected to the third slider 257. The third slider 257 is connected to a sixth drive member 2510, which drives the third slider 257 to move the suction assembly 21 along the second direction Y, enabling material removal from different placement mechanisms 1.

[0064] like Figure 2 As shown, the suction assembly 21 includes multiple suction nozzles. The suction planes of the multiple suction nozzles are flush. Specifically, the suction assembly 21 includes three first suction nozzles 211 spaced apart in the circumferential direction, and a second suction nozzle 212 located at the center of the three first suction nozzles 211. The suction area of ​​the second suction nozzle 212 is larger than the suction area of ​​the first suction nozzle 211, thereby enabling stable suction of the wafer 10.

[0065] In this embodiment, if Figure 6As shown, the first conveyor section 3 includes two first conveyor belts 31 spaced apart in the second direction Y. The first conveyor belts 31 are connected to a second drive member 32 for driving the two first conveyor belts 31 to move simultaneously in the first direction X. The second conveyor section 4 includes two second conveyor belts 41 spaced apart in the second direction Y. The second conveyor belts 41 are connected to a third drive member 42 for driving the two second conveyor belts 41 to move simultaneously in the first direction X. After the suction assembly 21 suctions and separates a wafer 10, the first drive member 22 switches the suction assembly 21 to a placement position, allowing the suction assembly 21 to place the wafer 10 on the first conveyor section 3. The second drive member 32 drives the first conveyor belts 31 to move in the first direction X, and the third drive member 42 drives the second conveyor belts 41 to move in the first direction X, thereby transferring the wafer 10 through the gap 5 to the second conveyor section 4. As the wafer 10 passes through the gap 5, two cameras 6 simultaneously inspect the upper and lower surfaces of the wafer 10, enabling in-line inspection of the wafer 10's movement.

[0066] In this embodiment, at the same time, only one of the first air blowing port 23 and the second air blowing port 24 is working. In a specific application scenario, when using the wafer 10 slice movement online detection device provided by the embodiment of the application, the following steps are included:

[0067] 1. Load the wafers 10. Specifically, position the fixed seat 13 of the placement mechanism 1 at the end of the third slide rail 14 away from the suction assembly 21, and position the baffle 16 close to the fixed plate 12 near the suction assembly 21. Stack multiple wafers 10 vertically between the fixed plate 12 away from the suction assembly 21 and the two limiting shafts 11. Then, move the baffle 16 along the fourth slide rail 15 to the surface of the wafers 10. The stacked wafers 10 are then secured by the baffle 16, the two limiting shafts 11, and the fixed plate 12 away from the suction assembly 21. Then, move the fixed seat 13 of the placement mechanism 1 to the end of the third slide rail 14 near the suction assembly 21.

[0068] 2. The suction assembly 21 removes the material. Specifically, the suction assembly 21 is driven to move in the first direction X, the second direction Y, and the vertical direction Z, so that the suction assembly 21 is facing the wafer 10. The fourth driving member 258 then drives the suction assembly 21 to move along the first direction X, approaching and approaching the wafer 10. At this time, the baffle 16 moves a predetermined distance toward the suction assembly 21, and the first air blow port 23 opens (the second air blow port 24 closes), blowing away the multiple wafers 10 adjacent to the target wafer 10. After the suction assembly 21 is in close contact with the wafer 10, the fifth driving member 259 drives the suction assembly 21 to move along the vertical direction Z. At this time, the first air blow port 23 closes and the second air blow port 24 opens, blowing air into the gap 5 between the target wafer 10 and its adjacent wafer 10. The baffle 16 moves away from the suction assembly 21 to the wafer 10. When the wafer 10 sucked by the suction assembly 21 is completely separated from the adjacent wafer 10, the second air blow port 24 closes.

[0069] 3. The suction component 21 discharges the material. Specifically, the suction component 21 is driven to move in the first direction X, the second direction Y and the vertical direction Z, so that the suction component 21 is facing the first conveying part 3. At the same time, the first driving member 22 can drive the suction component 21 to rotate to the placement position. Then the fifth driving member 259 drives the suction component 21 to move along the vertical direction Z, close to the first conveyor belt 31, and then places the wafer 10 on the suction component 21 on the first conveyor belt 31. The film picking mechanism 2 repeats steps 2 and 3. The film picking mechanism 2 of the present application can complete the picking and discharging of a wafer 10 in about 6 seconds, which is extremely efficient.

[0070] 4. Camera 6 captures and inspects. Specifically, the second drive member 32 drives the first conveyor belt 31 to move along the first direction X, and the third drive member 42 drives the second conveyor belt 41 to move along the first direction X. As a result, the wafer 10 is transferred from the first conveyor section 3 to the second conveyor section 4 through the gap 5. While the wafer 10 passes through the gap 5, the two cameras 6 simultaneously inspect the upper and lower surfaces of the wafer 10, enabling online detection of the movement of the wafer 10.

[0071] It should be noted that, in the description of this specification, the terms "first," "second," etc., are used solely for descriptive purposes and to distinguish similar objects. There is no order of precedence between the two, nor should they be understood to indicate or imply relative importance. Furthermore, in the description of this specification, unless otherwise specified, "plurality" means two or more.

[0072] Any numerical value cited herein includes all values ​​of the lower and upper values ​​in increments of one unit from the lower value to the upper value, provided that there is at least a two-unit interval between any lower value and any higher value. For example, if the value of a component quantity or process variable (e.g., temperature, pressure, time, etc.) is stated to be from 1 to 90, preferably from 20 to 80, and more preferably from 30 to 70, it is intended to illustrate that values ​​such as 15 to 85, 22 to 68, 43 to 51, 30 to 32, etc. are also explicitly listed in this specification. For values ​​less than 1, one unit is appropriately considered to be 0.0001, 0.001, 0.01, 0.1. These are merely examples intended to be clearly stated, and it is to be understood that all possible combinations of the values ​​listed between the minimum and maximum values ​​are explicitly stated in this specification in a similar manner.

[0073] Unless otherwise indicated, all ranges include the endpoints and all numbers between the endpoints. When used with a range, "about" or "approximately" applies to both endpoints of the range. Thus, "about 20 to 30" is intended to cover "about 20 to about 30," including at least the specified endpoints.

[0074] All articles and references disclosed herein, including patent applications and publications, are incorporated herein by reference for all purposes. The term "consisting essentially of..." when describing a combination should include the identified elements, ingredients, components, or steps and other elements, ingredients, components, or steps that do not materially affect the basic novel characteristics of the combination. The use of the terms "comprising" or "including" to describe a combination of elements, ingredients, components, or steps herein also contemplates embodiments consisting essentially of these elements, ingredients, components, or steps. By using the term "may," it is intended to indicate that any attribute described as "may" be optional.

[0075] Multiple elements, ingredients, parts or steps can be provided by a single integrated element, ingredient, part or step. Alternatively, a single integrated element, ingredient, part or step can be divided into separate multiple elements, ingredients, parts or steps. The disclosure of "a" or "an" to describe an element, ingredient, part or step is not intended to exclude other elements, ingredients, parts or steps.

[0076] It should be understood that the above description is for illustration and not for limitation. Many embodiments and many applications beyond the examples provided will be apparent to those skilled in the art upon reading the above description. Therefore, the scope of the present teachings should not be determined with reference to the above description, but rather with reference to the appended claims and the full scope of equivalents to which such claims are entitled. For the purpose of comprehensiveness, all articles and references, including disclosures of patent applications and publications, are incorporated herein by reference. The omission of any aspect of the subject matter disclosed herein from the foregoing claims is not intended to be a disclaimer of such subject matter, nor should it be assumed that the inventors did not consider such subject matter to be part of the disclosed inventive subject matter.

Claims

1. A wafer separation movement online detection device, characterized in that: include: A placement mechanism for placing a wafer, wherein a surface of the wafer in the placement mechanism is perpendicular to a first direction; The wafer-taking mechanism for sucking wafers comprises a suction component, a first driving member, a first air blowing port, a second air blowing port and a moving component, wherein the suction component has a suction plane parallel to the surface of the wafer, and the suction plane has a suction position perpendicular to the first direction and a placement position perpendicular to the vertical direction; the first driving member is connected to the suction component, and is used to drive the suction component to rotate around a rotation axis extending in the second direction, so that the suction plane switches between the suction position and the placement position; the first direction, the second direction and the vertical direction are perpendicular to each other; the first air blowing port and the second air blowing port are respectively connected to two sides of the suction component in the second direction; the first air blowing port is circular in shape, and the second air blowing port is oblate in shape; the moving component is connected to the suction component, and is used to drive the suction component to move in the first direction and the vertical direction; A first conveying portion and a second conveying portion extending in a first direction and moving in the same direction and at the same speed, wherein a gap of a predetermined length is defined between the first conveying portion and the second conveying portion; the predetermined length is less than a radius of the wafer; the first conveying portion is located between the placement mechanism and the second conveying portion; and the suction assembly is located above the first conveying portion. two cameras fixedly arranged above and below the gap respectively; A first light source and a second light source are respectively disposed above and below the gap.

2. The wafer separation movement online detection device according to claim 1, characterized in that: There are two second light sources, and the angles of the two second light sources are configured such that the light of the second light sources has no contact with the first transmission part and the second transmission part, and the light of the two second light sources intersects the lower surface of the wafer on the gap.

3. The wafer separation movement online detection device according to claim 2, characterized in that: There are two first light sources, and the light rays of the two first light sources intersect at the upper surface of the wafer on the gap; the intersection of the light rays of the two first light sources and the intersection of the light rays of the two second light sources are staggered in the first direction.

4. The wafer separation movement online detection device according to claim 1, characterized in that: The first conveying part is fixedly provided with a drying part upstream of the gap, and the drying part includes a plurality of fans located on the top surface and the side surfaces.

5. The wafer separation movement online detection device according to claim 1, characterized in that: The second air blowing port includes a plurality of sub-air blowing ports arranged in a straight line, and the sub-air blowing ports are circular in shape; and the diameter of the sub-air blowing ports is smaller than the diameter of the first air blowing port.

6. The wafer separation movement online detection device according to claim 5, characterized in that: The first air blowing port is fixedly connected to the suction component through a copper tube; the second air blowing port is connected to the suction component through a flexible tube, and the position and direction of the second air blowing port are adjustable; at the same time, at most only one of the first air blowing port and the second air blowing port is working.

7. The wafer separation movement online detection device according to claim 1, characterized in that: The moving assembly includes a first slide rail extending along the first direction, a second slide rail extending along the vertical direction, a first slider slidably connected to the first slide rail, a second slider slidably connected to the second slide rail, and a fixed frame fixedly connected below the first slider; one end of the first air blowing port and one end of the second air blowing port are fixedly connected to an end of the first slider close to the placement mechanism along the first direction; the fixed end of the first driving member is fixedly connected to the fixed frame, and the moving end of the first driving member is rotatably connected to the fixed frame; the first slide rail is fixedly connected to the second slider.

8. The wafer separation movement online detection device according to claim 7, characterized in that: The placement mechanism comprises: Two limiting shafts for placing a wafer, the limiting shafts extending along a first direction, and a distance between the two limiting shafts being smaller than a diameter of the wafer; Two fixing plates perpendicular to the first direction, with both ends of the limiting shaft respectively fixed to the inner sides of the two fixing plates; A fixing base fixedly connected to the bottom of the fixing plate; a third slide rail extending along the first direction, wherein the bottom of the fixing seat is slidably connected to the third slide rail; a fourth slide rail extending along the first direction, the fourth slide rail being fixedly disposed on the upper surface of the fixing seat and passing through the two fixing plates; A baffle is slidably connected to the fourth slide rail, and the baffle is located between the two fixed plates and passes through the two limiting shafts.

9. The wafer separation movement online detection device according to claim 8, characterized in that: There are multiple placement mechanisms, and the multiple placement mechanisms are spaced apart in the second direction; the moving component also includes a fifth slide rail extending along the second direction and a third slider slidably connected to the fifth slide rail; the second slide rail is fixedly connected to the third slider.

10. The wafer separation movement online detection device according to claim 1, characterized in that: The first conveying part includes two first conveyor belts spaced apart in the second direction, and the first conveyor belts are connected to a second driving member for driving the two first conveyor belts to move simultaneously along the first direction; the second conveying part includes two second conveyor belts spaced apart in the second direction, and the second conveyor belts are connected to a third driving member for driving the two second conveyor belts to move simultaneously along the first direction.

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