Power amplifier circuit board of sintered heat dissipation plate and manufacturing method of power amplifier circuit board

Abstract

The invention provides a power amplifier circuit board of a sintered heat dissipation plate and a manufacturing method thereof, and relates to the technical field of circuit board manufacturing, and the manufacturing method of the power amplifier circuit board of the sintered heat dissipation plate comprises the following steps: drawing a PCB layout containing a power amplifier; carrying out heat management partitioning on the PCB layout, and at least dividing an installation region corresponding to the power amplifier into a first heat dissipation region; manufacturing a corresponding substrate based on the PCB layout; and the heat dissipation plate is attached and sintered to the face, deviating from the first heat dissipation area, of the substrate. The power amplifier is directly divided into one area on the substrate, the area is determined as the first heat dissipation area, then the position, corresponding to the first heat dissipation area, of the heat dissipation plate is sintered, generated heat can be directly conducted to the heat dissipation plate through the substrate when the power amplifier operates, the heat can accurately act on the heating area, and the heat dissipation efficiency is improved. The heat dissipation performance is effectively improved, the heat dissipation path is short, the heat dissipation efficiency is high, the structure is stable, and the service life of components can be effectively prolonged.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board manufacturing, and in particular to a power amplifier circuit board with a sintered heat sink and a manufacturing method thereof. Background Art

[0002] In high-power applications, power amplifiers generate a significant amount of heat during operation. Failure to dissipate this heat promptly and effectively can lead to a sharp rise in device temperature. Existing heat dissipation structures suffer from high thermal resistance and uneven heat dissipation, making them unable to meet the heat dissipation requirements of modern, highly integrated electronic devices. Summary of the Invention

[0003] The main purpose of the present invention is to provide a method for manufacturing a power amplifier circuit board with a sintered heat dissipation plate, aiming to achieve heat conduction of the power amplifier and improve the heat dissipation performance.

[0004] To achieve the above object, the present invention provides a method for manufacturing a power amplifier circuit board with a sintered heat sink, the manufacturing method comprising:

[0005] Draw the PCB layout including the power amplifier;

[0006] Performing thermal management zoning on the PCB layout, dividing at least the installation area corresponding to the power amplifier into a first heat dissipation area;

[0007] Based on the PCB layout, a corresponding substrate is manufactured;

[0008] The heat dissipation plate is attached and sintered to a side of the substrate facing away from the first heat dissipation area.

[0009] Optionally, performing thermal management zoning on the PCB layout to divide at least the installation area corresponding to the power amplifier into a first heat dissipation area includes:

[0010] Obtain heat distribution data of each component in the PCB layout;

[0011] According to the range value of the heat distribution data, the PCB layout is divided into at least two heat dissipation areas, and at least the installation area corresponding to the power amplifier is divided into a first heat dissipation area.

[0012] Optionally, the heat dissipation plate includes a first heat dissipation plate and a second heat dissipation plate; the PCB layout further includes a power input circuit and an output circuit;

[0013] The manufacturing method further comprises:

[0014] Sintering and disposing the first heat sink corresponding to the mounting area of the power amplifier;

[0015] Adhere the second heat sink to the power input circuit and the output circuit via thermal conductive adhesive;

[0016] When the second heat dissipation plate is bonded to the substrate, the second heat dissipation plate is bonded to the first heat dissipation plate at a preset distance.

[0017] Optionally, the step of attaching and sintering the heat dissipation plate to a side of the substrate facing away from the first heat dissipation area includes:

[0018] Filling thermal conductive paste onto a side of the substrate facing away from the first heat dissipation area;

[0019] Bonding the heat dissipation plate and the substrate by using the thermal conductive paste;

[0020] The substrate is heated to melt the thermal conductive paste and fix the heat dissipation plate.

[0021] Optionally, the manufacturing method further includes:

[0022] Determining the positions of various components of the power amplifier on the PCB layout;

[0023] A device groove is provided corresponding to at least one of the device positions, and the electronic device corresponding to the position is installed in the device groove.

[0024] Optionally, the manufacturing method further includes:

[0025] When the PCB layout is all power amplifier areas, the heat sink and the substrate are arranged to have the same length and width;

[0026] A plurality of grounding positions are provided on the substrate, and the heat dissipation plate is electrically connected to the plurality of grounding positions of the substrate.

[0027] Optionally, a plurality of grounding positions are provided on the substrate, and electrically connecting the heat sink to the plurality of grounding positions on the substrate comprises:

[0028] Ground pads are provided along the four corners of the substrate, and through-holes are provided at positions corresponding to the heat dissipation plate and the substrate;

[0029] The ground pad and the through-hole are connected by a stud or a wire to electrically connect the heat dissipation plate to the ground of the substrate.

[0030] Optionally, manufacturing a corresponding substrate based on the PCB layout includes:

[0031] The first heat dissipation area on the PCB layout is divided and manufactured into a substrate corresponding to the power amplifier.

[0032] In addition, to achieve the above-mentioned object, the present invention further provides a power amplifier circuit board with a sintered heat sink, which is manufactured using the above-mentioned method for manufacturing a power amplifier circuit board with a sintered heat sink, and the power amplifier circuit board includes:

[0033] a substrate, wherein a first heat dissipation area is provided on the substrate, and a power amplifier is installed in the first heat dissipation area;

[0034] A heat dissipation plate is sintered and attached to a side of the substrate facing away from the first heat dissipation area, and the heat dissipation plate is arranged corresponding to the first heat dissipation area.

[0035] Optionally, the thickness of the heat dissipation plate is 1.5-3 times the thickness of the substrate.

[0036] The embodiment of the present invention first draws a PCB layout including a power amplifier, then performs thermal management zoning on the PCB layout, and divides at least the installation area corresponding to the power amplifier into a first heat dissipation area. Then, based on the PCB layout, a corresponding substrate is manufactured, and finally a heat dissipation plate is bonded and sintered to the side of the substrate away from the first heat dissipation area, so as to directly divide the power amplifier into an area on the substrate and determine it as the first heat dissipation area. The heat dissipation plate is then sintered at a position corresponding to the first heat dissipation area. When the power amplifier is running, the heat generated can be directly conducted to the heat dissipation plate through the substrate, which can accurately act on the heat-generating area, effectively improve the heat dissipation performance, and has the characteristics of a short heat dissipation path, high heat dissipation efficiency, and a stable structure, and can effectively extend the service life of components. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0038] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0039] Figure 1 A schematic flow chart of a method for manufacturing a power amplifier circuit board with a sintered heat sink according to an embodiment of the present invention;

[0040] Figure 2 A schematic flow chart of a method for manufacturing a power amplifier circuit board with a sintered heat sink according to another embodiment of the present invention;

[0041] Figure 3A schematic flow chart of a method for manufacturing a power amplifier circuit board with a sintered heat sink according to another embodiment of the present invention;

[0042] Figure 4 A schematic flow chart of a method for manufacturing a power amplifier circuit board with a sintered heat sink according to another embodiment of the present invention;

[0043] Figure 5 A schematic flow chart of a method for manufacturing a power amplifier circuit board with a sintered heat sink according to another embodiment of the present invention;

[0044] Figure 6 A schematic flow chart of a method for manufacturing a power amplifier circuit board with a sintered heat sink according to another embodiment of the present invention;

[0045] Figure 7 A schematic flow chart of a method for manufacturing a power amplifier circuit board with a sintered heat sink according to another embodiment of the present invention;

[0046] Figure 8 A schematic flow chart of a method for manufacturing a power amplifier circuit board with a sintered heat sink according to another embodiment of the present invention;

[0047] Figure 9 A schematic structural diagram of a power amplifier circuit board with a sintered heat sink according to an embodiment of the present invention;

[0048] Figure 10 This is a schematic structural diagram of a power amplifier circuit board with a sintered heat sink according to another embodiment of the present invention.

[0049] Description of Figure Numbers:

[0050] 10-substrate, 11-first heat dissipation area, 111-power amplifier;

[0051] 20-Heat sink.

[0052] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0053] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments, and the well-known modules, units and their connections, links, communications or operations are not shown or described in detail. In addition, the described features, architectures or functions can be combined in any way in one or more embodiments. It should be understood by those skilled in the art that the various embodiments described below are only for illustration and are not intended to limit the scope of protection of the present invention. It can also be easily understood that the modules or units or processing methods in the various embodiments described herein and shown in the drawings can be combined and designed according to various different configurations. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0054] The definitions of various nouns or methods in the following embodiments, except for those that are logically untenable, are generally based on the broad concepts that can be implemented under the premise of the disclosure in the embodiments. Under such an understanding, the various specific subordinate specific definitions of the nouns or methods should be regarded as the inventive content of the present invention, and should not be narrowly understood or interpreted in a biased manner on the grounds that the specification does not disclose such specific definitions. Similarly, under the premise that it can be logically implemented, the order of the steps in the method is flexible and changeable, and the specific subordinate specific definitions of the broad concepts of various nouns or methods are all within the scope of protection of the present invention.

[0055] In high-power applications, power amplifiers generate a significant amount of heat during operation. Failure to dissipate this heat promptly and effectively can lead to a sharp rise in device temperature. However, existing heat dissipation structures suffer from high thermal resistance and uneven heat dissipation, making them difficult to meet the heat dissipation requirements of modern, highly integrated electronic devices.

[0056] The main solution of the embodiment of the present application is: by first drawing a PCB layout containing a power amplifier, then zoning the PCB layout for thermal management, and dividing at least the installation area corresponding to the power amplifier into a first heat dissipation area, and then making a corresponding substrate based on the PCB layout, and finally bonding and sintering the heat dissipation plate to the side of the substrate facing away from the first heat dissipation area.

[0057] The present application provides a solution to directly divide the power amplifier into an area on the substrate and determine it as the first heat dissipation area. The heat dissipation plate is then sintered at a position corresponding to the first heat dissipation area. When the power amplifier is running, the heat generated can be directly conducted to the heat dissipation plate through the substrate, which can accurately act on the heat-generating area, effectively improve the heat dissipation performance, and has the characteristics of a short heat dissipation path, high heat dissipation efficiency, and a stable structure, and can effectively extend the service life of components.

[0058] In existing technologies, the large amount of heat generated by power amplifiers in high-power applications is difficult to effectively dissipate. Traditional heat dissipation structures suffer from unclear heat conduction paths and uneven heat flow distribution. For example, in the RF modules of microwave communication base stations, densely packed power transistors are exposed to high temperatures for extended periods, which can easily cause thermal stress and deformation, affecting circuit stability.

[0059] In order to address the defect that existing heat dissipation structures cannot achieve directional heat conduction, we start from the perspective of heat source zoning management, analyze the heat generation intensity of different areas in the PCB layout, divide the high heat flux density areas separately and match them with corresponding heat dissipation structures, and use a sintering process to connect the heat dissipation substrate to improve the interface contact quality, thereby reducing thermal resistance, thereby achieving the effect of solving the above technical problems.

[0060] Based on the above, refer to Figure 1 In one embodiment of the present invention, the method for manufacturing the power amplifier circuit board with the sintered heat sink includes steps S100-S400, wherein:

[0061] S100, draw the PCB layout including the power amplifier;

[0062] S200, performing thermal management zoning on the PCB layout, dividing at least the installation area corresponding to the power amplifier into a first heat dissipation area;

[0063] S300, manufacturing a corresponding substrate based on the PCB layout;

[0064] S400 , attaching and sintering the heat dissipation plate to a side of the substrate facing away from the first heat dissipation area.

[0065] Thermal management zoning refers to the division of independent heat dissipation areas based on the heating characteristics of different devices in the circuit layout. This can be achieved by combining thermal imaging data acquisition with finite element simulation to identify areas of high heat flux density. The sintering process refers to the metallurgical bonding of heterogeneous materials through high-temperature molten metal materials. This can be achieved by sintering silver paste, copper paste, or solder paste to reduce the interfacial contact thermal resistance. Substrate fabrication refers to the formation of circuit-bearing structures based on the layout design. This can be achieved by etching copper-clad laminates to construct electrical connection paths.

[0066] First, the PCB layout design is completed based on the electrical parameters of the power amplifier to clarify the device installation location. Then, the heat flux density distribution of each area is extracted through thermal simulation software, and the concentrated area of the power amplifier is marked as the first heat dissipation area. Then, a substrate with corresponding circuit traces is produced according to the layout, and a metal sintering slurry is coated on the back of the substrate. Finally, the heat sink is positioned and attached to the back of the substrate, and the slurry is melted by temperature control to form a metallurgical bonding layer. Among them, the heat sink can be attached only to the position of the substrate corresponding to the first heat dissipation area, or it can be set to be the same length and width as the substrate.

[0067] This embodiment achieves precise allocation of heat dissipation resources through zoning management. Furthermore, the metal bonding layer formed by the sintering process has lower thermal resistance. Compared with traditional thermal conductive adhesive bonding, the interface contact thermal resistance can be reduced by an order of magnitude.

[0068] Through the above-mentioned technical means, this embodiment solves the problem of localized overheating in the high-power amplifier area and improves the efficiency of heat transfer from the heat source to the heat sink. The metallurgical bonding layer between the substrate and the heat sink ensures the continuity of the heat flow path, preventing heat dissipation bottlenecks caused by poor interface contact. The zoned heat dissipation design avoids redundant configuration of heat dissipation materials in low-heat flow areas, achieving a lightweight heat dissipation structure.

[0069] This embodiment first draws a PCB layout including a power amplifier, then performs thermal management zoning on the PCB layout, and divides at least the installation area corresponding to the power amplifier into a first heat dissipation area. Then, based on the PCB layout, a corresponding substrate is manufactured, and finally, a heat sink is bonded and sintered to the side of the substrate facing away from the first heat dissipation area. This allows the power amplifier to be directly divided into an area on the substrate and determined as the first heat dissipation area. The heat sink is then sintered at a position corresponding to the first heat dissipation area. When the power amplifier is operating, the heat generated can be directly conducted to the heat sink through the substrate, which can precisely act on the heat-generating area, effectively improving the heat dissipation performance. The heat sink has the characteristics of a short heat dissipation path, high heat dissipation efficiency, and a stable structure, and can effectively extend the service life of components.

[0070] Optionally, refer to Figure 2 Another embodiment of the present invention provides a method for manufacturing a power amplifier circuit board with a sintered heat sink. Figure 1 In the embodiment shown, thermal management zoning is performed on the PCB layout, and at least the installation area corresponding to the power amplifier is divided into a first heat dissipation area, including steps S210-S220, wherein:

[0071] S210, obtaining heat distribution data of each component in the PCB layout;

[0072] S220 . Divide the PCB layout into at least two heat dissipation areas according to the range value of the heat distribution data, and divide at least the installation area corresponding to the power amplifier into a first heat dissipation area.

[0073] Among them, heat distribution data refers to a data set collected through thermal simulation software or thermal imaging equipment that reflects the temperature changes of components during operation. It can be achieved using finite element analysis or infrared temperature measurement technology to quantify the differences in heat loads in different areas. Among them, heat dissipation area division refers to dividing the circuit board into areas with different thermal management levels based on preset temperature thresholds. This can be achieved by setting a gradient threshold range. For example, areas with temperatures above 80°C are classified as the first heat dissipation area, and areas with temperatures between 50°C and 80°C are classified as the second heat dissipation area, thereby achieving differentiated heat dissipation resource allocation.

[0074] Before installing the power amplifier, thermal simulation is performed to simulate the operating temperature distribution of each component, generating a heat map with numerical temperature values. Based on this data, areas with temperatures exceeding a preset upper limit are automatically identified as the primary heat dissipation zone, and a sintered heat sink is installed below them. The remaining areas are then assigned to secondary or tertiary heat dissipation zones, each with its own heat dissipation method. This ensures that high-heat areas are prioritized for high-efficiency sintering processes, while low-heat areas are bonded with conventional thermal adhesives, minimizing resource waste.

[0075] Compared with existing solutions, which typically divide heat dissipation zones based on experience or fixed templates, this approach may result in inaccurate coverage of high-heat components and over-configuration of heat dissipation structures in low-heat areas. This embodiment dynamically analyzes actual heat data to achieve zone division, which not only improves heat dissipation efficiency but also reduces material redundancy and optimizes the adaptability of the overall heat dissipation structure.

[0076] Through the above-mentioned technical means, this embodiment can dynamically adjust the heat dissipation zoning strategy based on the actual heat load data, solve the local overheating or heat dissipation redundancy problems caused by improper zoning in the existing technology, ensure that the heat of high-heat devices such as power amplifiers is discharged in a timely manner, and reduce the overall heat dissipation cost.

[0077] It should be noted that the heat sink includes a first heat sink and a second heat sink; the PCB layout also includes a power input circuit and an output circuit.

[0078] Based on the above structure, refer to Figure 3 Another embodiment of the present invention provides a method for manufacturing a power amplifier circuit board with a sintered heat sink. Figure 1 In the embodiment shown, the manufacturing method further includes steps S500-S700, wherein:

[0079] S500: Sintering and disposing the first heat sink corresponding to the mounting area of the power amplifier;

[0080] S600: Adhere the second heat sink to the power input circuit and the output circuit using thermally conductive adhesive;

[0081] S700: When the second heat dissipation plate is bonded to the substrate, the second heat dissipation plate is bonded to the first heat dissipation plate at a preset distance.

[0082] The first heat sink refers to a metal heat sink component fixed to the substrate by a sintering process. It can be made of copper or aluminum-based composite materials through a high-temperature sintering process. In this embodiment, copper is used for this purpose, and its sintering connection method can reduce the interfacial thermal resistance. The second heat sink refers to an auxiliary heat sink component fixed to the substrate by a bonding process. It can be made of thermally conductive adhesive containing ceramic fillers. Its bonding method is suitable for low heat flux density areas. The preset distance refers to the physical spacing between the two heat sinks. The spacing can be controlled by positioning marks or fixtures to avoid heat interference between different heat dissipation areas.

[0083] After the substrate is manufactured, a metal slurry sintering process is used to directly fix the first heat sink to the back of the substrate in the high-heating area of the power amplifier, forming a low-thermal resistance connection through high-temperature sintering. The metal slurry can be implemented using solder paste. For the power input circuit and output circuit areas, the second heat sink is bonded to the corresponding position of the substrate by applying thermal conductive adhesive. During the bonding process, the spacing between the second heat sink and the first heat sink is maintained by a positioning device, such as using a mechanical block or an optical positioning system to ensure that the spacing meets the requirements, thereby avoiding stress concentration between the heat sinks due to thermal expansion.

[0084] Compared to existing technologies, existing heat dissipation structures typically use a single heat sink or uniform bonding, without zoning to address the differences in heat distribution between different circuit areas, resulting in insufficient heat dissipation efficiency in high-heat areas. This embodiment differentiates between sintering and bonding processes and combines them with spacing to provide a more optimized heat conduction path for high-power devices while avoiding thermal coupling between different heat dissipation areas.

[0085] This embodiment can provide a low-thermal-resistance sintered heat dissipation path for the high heat flux density area of the power amplifier, and also reduce the heat dissipation interference between the power circuit and the output circuit area through spacing, thereby achieving differentiated heat dissipation in multiple areas within a limited space and improving the overall heat dissipation efficiency.

[0086] Optionally, refer to Figure 4 Another embodiment of the present invention provides a method for manufacturing a power amplifier circuit board with a sintered heat sink. Figure 1In the embodiment shown, attaching and sintering the heat dissipation plate to the side of the substrate facing away from the first heat dissipation area includes steps S410-S430, wherein:

[0087] S410, filling a thermal conductive paste onto a side of the substrate facing away from the first heat dissipation area;

[0088] S420, bonding the heat sink and the substrate using the thermal conductive paste;

[0089] S430: heating the substrate to melt the thermal conductive paste and fix the heat sink.

[0090] Among them, the thermal conductive paste can be a thermal conductive metal paste or a thermal conductive non-metallic paste. Thermal conductive metal paste refers to a flowable paste formed by mixing metal powder and an organic carrier. It can be filled onto the surface of the substrate by screen printing or dispensing using silver paste, copper paste or solder paste, and is used to fill the gap between the substrate and the heat sink to achieve heat conduction. Hot melt fixing refers to the volatilization of the organic carrier in the metal paste by heating, and the metal particles melt at high temperature to form a continuous metal layer. The sintering process can be completed at a set temperature using a reflow oven or a hot press, so that the heat sink and the substrate form a metallurgical bond. Among them, thermal conductive metal paste can also effectively reduce induced radio frequency. Among them, thermal conductive non-metallic paste refers to a paste formed by mixing non-metallic thermal conductive materials such as graphite, carbon nanotubes or thermal conductive polymers with organic carriers. It has good thermal conductivity while maintaining a certain flexibility, and is suitable for occasions where there are high requirements for thermal stress between the substrate and the heat sink.

[0091] After the substrate is fabricated, a thermally conductive paste is evenly applied to a designated area on the back of the substrate. The heat sink is then aligned and bonded to the paste-coated substrate. A heating device heats the entire substrate, causing the metal particles in the paste to melt and diffuse at high temperatures. Upon cooling, a highly thermally conductive metal connection layer is formed. This connection layer not only provides mechanical fixation but also establishes a low-resistance heat conduction path, rapidly transferring heat generated by the power amplifier to the heat sink.

[0092] Existing heat dissipation structures often use thermally conductive adhesive or mechanical pressing to secure the heat sink. However, thermally conductive adhesive has high thermal resistance and carries the risk of aging and falling off, while mechanical pressing reduces heat conduction efficiency due to gaps between the contact surfaces. This embodiment uses metal sintering to form a metallurgical bonding layer, eliminating gaps between the contact surfaces, improving interfacial thermal conductivity, and avoiding adhesive aging issues.

[0093] This embodiment effectively reduces the contact thermal resistance between the heat sink and the substrate, improves the efficiency of heat conduction from the power amplifier to the heat sink, and prevents device performance degradation or damage due to local overheating. It is particularly suitable for the heat dissipation needs of power amplifier circuit boards that need to operate at high load for a long time.

[0094] Optionally, refer to Figure 5 Another embodiment of the present invention provides a method for manufacturing a power amplifier circuit board with a sintered heat sink. Figure 1 In the embodiment shown, the manufacturing method further includes steps S800-S900, wherein:

[0095] S800, determining the position of each component of the power amplifier on the PCB layout;

[0096] S900: Setting a device groove corresponding to at least one of the device positions, and installing the electronic device corresponding to the position into the device groove.

[0097] The device location refers to the layout coordinates of the power amplifier within the PCB layout. This can be determined through circuit simulation or thermal imaging analysis and is used to clearly define the mounting points for the electronic components. The device recess refers to a sunken structure on the substrate that accommodates the electronic components. It can be formed using mechanical milling or laser etching to reduce the overall height of the components after installation. The electronic components refer to the transistors or integrated circuit components within the power amplifier and can be surface-mounted or embedded in a package to ensure sufficient contact between the components and the inner walls of the recess. By embedding the electronic components of the power amplifier within the substrate, the height of the component surface protrusion is reduced, lowering the contact thermal resistance between the components and the substrate. The packaging of the electronic components of the power amplifier is partially embedded within the recess, ensuring direct contact between the bottom of the electronic components and the bottom surface of the recess. A gap is formed between the sidewalls of the device recess and the side surfaces of the electronic components, which can be filled with a thermally conductive material. When the electronic components of the power amplifier are in operation, heat is directly transferred from the bottom to the substrate interior, where it is quickly dissipated through a heat sink sintered to the back of the substrate. This avoids the problem of traditional surface-mount mounting methods where heat must be conducted laterally to the edge of the substrate for dissipation.

[0098] Since the electronic device of this embodiment adopts the mounting process, and generally adopts the method of applying solder paste and then performing reflow soldering, and since the solder paste melts and flows during the soldering process, the electronic device often moves, causing the electronic device to offset the pad or have a cold solder joint problem. After the electronic device is embedded in the device groove, since the recessed device groove is equal to or slightly larger than the length and width of the electronic device, the electronic device can be kept in a fixed state during the soldering process, so that the electronic device will not have the problem of displacement during the soldering process.

[0099] After determining the positions of the power amplifier components, CNC equipment is used during substrate processing to create grooves at the corresponding coordinates. The groove depth can be slightly less than the substrate thickness, which refers to the vertical distance between the two surfaces. This value is determined based on a combination of material strength and heat dissipation requirements. The depth of the device groove is limited to less than this thickness to avoid direct contact between the power device and the heat sink, which could cause electrical short circuits. When installing the electronic component, its pins or pads are aligned with the conductive layer at the bottom of the groove and secured using reflow soldering or conductive adhesive. The gap between the groove sidewalls and the component can be filled with thermal grease or metal slurry to improve heat conduction efficiency.

[0100] Compared to existing technologies, traditional methods typically solder electronic components directly to the substrate surface, resulting in limited contact area between the bottom of the component and the substrate, which easily leads to heat accumulation. This embodiment, however, embeds the electronic component within the substrate through a groove structure, increasing the contact area between the component and the substrate. This allows heat to be transferred from the component to the heat sink more quickly, while also reducing the risk of the component falling off in a vibrating environment.

[0101] Through the above technical means, this embodiment can improve the heat dissipation path of the power amplifier on the substrate, reduce the impact of thermal resistance on device performance, and at the same time improve the installation stability of electronic devices on the substrate, avoiding connection failure problems caused by thermal expansion or mechanical stress.

[0102] Optionally, refer to Figure 6 Another embodiment of the present invention provides a method for manufacturing a power amplifier circuit board with a sintered heat sink. Figure 1 In the embodiment shown, the manufacturing method further includes steps S1000-S1100, wherein:

[0103] S1000: When the PCB layout is all power amplifier areas, the heat sink and the substrate are arranged to have the same length and width;

[0104] S1100 , multiple grounding positions are provided on the substrate, and the heat sink is electrically connected to the multiple grounding positions of the substrate.

[0105] Equal length and width means the planar dimensions of the heat sink are identical to those of the substrate. This can be achieved through laser cutting or die forming processes, ensuring that the edges of the heat sink are perfectly aligned with the substrate contours. Multiple grounding locations are conductive connection points spaced along the substrate surface. These can be implemented using metallized through-holes or surface-mount pads, establishing equal potential between the heat sink and substrate through physical connections.

[0106] In PCB layouts with densely populated power amplifiers, the substrate and heat sink are constructed with the same dimensions to eliminate heat dissipation blind spots. Metallized ground pads are located at the four corners of the substrate, and through-holes are machined in corresponding locations on the heat sink. Conductive bolts are inserted through the through-holes and secured to the ground pads, forming a circular current path. This design creates multiple electrical connections between the heat sink and the substrate ground plane, reducing contact impedance and enhancing electromagnetic shielding.

[0107] Existing grounding methods often use single-point connections, which are prone to potential differences. Multi-point grounding, however, effectively balances current distribution through distributed contact, suppressing high-frequency signal interference. This embodiment addresses uneven heat dissipation and electromagnetic compatibility issues in high-density power amplifiers. Equal-area heat sinks eliminate the risk of localized overheating, and multi-point grounding reduces loop impedance, thereby improving circuit stability and interference resistance.

[0108] Optionally, refer to Figure 7 Another embodiment of the present invention provides a method for manufacturing a power amplifier circuit board with a sintered heat sink. Figure 1 In the embodiment shown, a plurality of grounding locations are provided on the substrate, and electrically connecting the heat sink to the plurality of grounding locations on the substrate includes steps S1110-S1120, wherein:

[0109] S1110, setting ground pads along the four corners of the substrate, and setting penetrating lock holes at positions corresponding to the heat dissipation plate and the substrate;

[0110] S1120. Connect the ground pad and the through-hole via a stud or a wire to electrically connect the heat sink to the ground of the substrate.

[0111] Among them, the ground pad refers to the metallized area used to achieve electrical grounding connection, which can be formed by copper material through etching process. Its function is to provide a stable low-impedance current path between the heat sink and the substrate. Among them, the through-hole refers to a mechanical connection structure that penetrates the heat sink and corresponds to the position of the ground pad. It can be formed by drilling or stamping process. Its function is to enhance the mechanical connection strength between the heat sink and the substrate through physical fixation. Among them, the stud refers to a metal connector with threads, which can be made of copper alloy material. Its function is to form a rigid connection with the ground pad by screwing into the through-hole, and also to achieve electrical conduction between the heat sink and the substrate. Its tightening process can be coordinated with the nut to achieve locking. Among them, the lead refers to a conductive metal wire, which can be made of silver-plated copper wire or copper braid. Its function is to flexibly connect the heat sink and the ground pad by welding or crimping, reducing the impact of mechanical stress on electrical performance.

[0112] Among them, during the manufacturing process of the substrate, grounding pads are first processed in the four corner areas of the substrate, and through-key holes are processed at the corresponding positions of the heat sink. After the sintering and bonding of the substrate and the heat sink are completed, the studs are inserted into the through-key holes and screwed into the grounding pads of the substrate, or the through-key holes of the heat sink are welded to the grounding pads of the substrate through wires. This process enables the grounding network of the heat sink and the substrate to form a multi-point connection, ensuring a low-impedance electrical path between the heat sink and the substrate, while suppressing connection failure caused by thermal expansion through mechanical fixation. In the prior art, heat sinks usually use a single grounding point or achieve local connection by welding, resulting in high grounding impedance and poor connection reliability. This embodiment reduces the grounding loop resistance while enhancing the connection's resistance to vibration and thermal shock through the combination of a multi-point grounding structure and mechanical connectors.

[0113] This embodiment effectively solves the problem of local heat accumulation caused by insufficient grounding of the heat sink and the substrate in high-power scenarios. It reduces thermal resistance and improves heat dissipation efficiency through multi-point electrical connection. At the same time, mechanical reinforcement of studs or leads avoids connection failure caused by temperature cycling, ensuring long-term working stability.

[0114] Optionally, refer to Figure 8 Another embodiment of the present invention provides a method for manufacturing a power amplifier circuit board with a sintered heat sink. Figure 1 In the embodiment shown, a corresponding substrate is manufactured based on the PCB layout, including step S310, wherein:

[0115] S310: Divide the first heat dissipation area on the PCB layout and make it into a substrate corresponding to the power amplifier.

[0116] The first heat dissipation area refers to the area in the PCB layout where high heat is generated by the power amplifier. The boundaries of this area can be determined through thermal imaging analysis or thermal simulation software, thereby isolating and processing the high-heat concentrated area separately. Separating and fabricating the substrate corresponding to the power amplifier refers to using an independent processing technology for the substrate portion of the first heat dissipation area, such as laser cutting or CNC milling to separate the first heat dissipation area from other areas of the substrate, and then using a high-thermal conductivity material to separately fabricate the substrate in this area, thereby enhancing local heat dissipation capabilities.

[0117] Among them, when making the substrate, the scope of the first heat dissipation area is first identified based on the results of the thermal management zoning. The area is then physically divided, for example, using laser cutting equipment to cut the substrate material along a preset boundary line to form an independent first heat dissipation area substrate. The substrate can be made of copper-based or aluminum-based composite materials and connected to the substrates of other areas through a pressing process. The thickness of the divided first heat dissipation area substrate can be adjusted, for example, it can be thicker than the non-heat dissipation area substrate to accommodate more heat conduction paths. After production is completed, the power amplifier is installed on the independently divided first heat dissipation area substrate, and the heat is quickly transferred to the sintered heat sink through the high thermal conductivity substrate in this area.

[0118] Compared to existing technologies, which typically manufacture the substrate as a single unit without independently optimizing high-heat areas, this hinders heat transfer within the substrate. This embodiment, by segmenting the first heat dissipation region and manufacturing a separate substrate, can specifically enhance the thermal conductivity of the high-heat area, reducing heat loss along the transfer path while avoiding material waste in other areas of the substrate.

[0119] Through the above technical means, this embodiment can improve the heat dissipation efficiency in the area where the power amplifier is located, reduce the impact of thermal resistance on device performance, thereby extending the service life of the circuit board under high-power working conditions and reducing the risk of failure due to local overheating.

[0120] Reference Figure 9 The present invention further provides a power amplifier circuit board with a sintered heat sink 20, which is manufactured using the manufacturing method of the power amplifier circuit board with a sintered heat sink 20 as described in all the above embodiments. The power amplifier circuit board includes a substrate 10 and a heat sink 20, wherein:

[0121] The substrate 10 is provided with a first heat dissipation area 11 , and a power amplifier 111 is installed in the first heat dissipation area 11 ; the heat dissipation plate 20 is sintered and attached to a side of the substrate 10 away from the first heat dissipation area 11 , and the heat dissipation plate 20 is provided corresponding to the first heat dissipation area 11 .

[0122] It is worth noting that since the power amplifier circuit board of the sintered heat sink 20 of the present invention is based on the above-mentioned manufacturing method of the power amplifier circuit board of the sintered heat sink 20, the embodiments of the power amplifier circuit board of the sintered heat sink 20 of the present invention use all the technical solutions of all the embodiments of the manufacturing method of the power amplifier circuit board of the sintered heat sink 20, and the technical effects achieved are also exactly the same, which will not be repeated here.

[0123] Among them, the substrate 10 refers to the circuit board base for carrying the power amplifier 111 and other electronic devices, and can be implemented by metal-based composite materials or ceramic-based composite materials to provide structural support and assist in heat dissipation. The first heat dissipation area 11 refers to a high-heat concentration area specially divided on the substrate 10 for installing the power amplifier 111. The boundary can be determined by the thermal management zoning method to specifically enhance the local heat dissipation capacity. The heat sink 20 refers to a metal or high-thermal-conductivity non-metallic material plate combined with the substrate 10 through a sintering process. It can be implemented by copper, aluminum or graphene composite materials. The sintering and bonding method can reduce the interface thermal resistance.

[0124] The surface of the substrate 10 is divided into multiple functional areas, including a first heat dissipation area 11 for mounting a power amplifier 111. A heat sink 20 is directly affixed to the back of the substrate 10 via a sintering process, aligned with the first heat dissipation area 11. When the power amplifier 111 operates, heat is transferred through the substrate 10 to the sintered heat sink 20, forming a vertical heat dissipation path with low thermal resistance. The sintering process creates a metallurgical bond between the heat sink 20 and the substrate 10, eliminating the additional thermal resistance introduced by traditional adhesives while ensuring seamless contact between the heat sink 20 and the substrate 10.

[0125] The thickness of the substrate 10 can be selected to be between 1.6 mm and 3 mm, and the thickness of the heat sink 20 can be set to 1.5 to 3 times the thickness of the substrate 10 to match the required heat capacity. The contact surface between the substrate 10 and the heat sink 20 can be filled with silver or copper paste as a sintering medium, and hot pressing sintering can be completed at a temperature range of 300°C to 400°C. For example, when the substrate 10 is a copper-clad aluminum substrate 10, the heat sink 20 can be made of pure copper and a nitrogen-protected sintering process can be used to achieve interface alloying.

[0126] Compared to existing heat dissipation structures, which typically use thermally conductive adhesive to bond heat sinks, this creates air gaps and thermal resistance in the adhesive layer, leading to heat accumulation near the device. This embodiment, however, directly connects the heat sink 20 to the substrate 10 through a sintering process, forming a continuous heat conduction interface and significantly reducing contact thermal resistance. Furthermore, the targeted placement of the heat sink 20 in high-heat areas avoids the material waste associated with traditional uniform heat dissipation designs.

[0127] This embodiment enables rapid transfer of high-density heat generated by power amplifier 111 to heat sink 20, effectively reducing device operating temperature. The sintering connection method solves the problem of excessive thermal resistance of traditional adhesives. The precise alignment of heat sink 20 and substrate 10 improves heat dissipation efficiency, thereby ensuring the stability of high-power circuits during long-term operation.

[0128] Optionally, refer to Figure 10 Another embodiment of the present invention provides a power amplifier circuit board with a sintered heat sink 20, based on the above Figure 9In the illustrated embodiment, the thickness of the heat dissipation plate 20 is 1.5-3 times the thickness of the substrate 10 .

[0129] in, Figure 10 Here, H1 is the thickness of the substrate 10 , and H2 is the thickness of the heat sink 20 , that is, H2 is 1.5-3 times of H1 .

[0130] The heat sink 20 refers to a metal heat-conducting component bonded to the substrate 10 through a sintering process. It can be made of copper, aluminum, or their alloys and is used to conduct heat generated by the power amplifier 111 to the external environment. The substrate 10 refers to the circuit substrate that supports the power amplifier 111 and other electronic components. It can be made of a ceramic substrate 10 or a copper-clad laminate and is used to provide circuit connections and mechanical support. The thickness ratio refers to the vertical dimensional relationship between the heat sink 20 and the substrate 10. It can be achieved by adjusting the sintering process parameters or the material stacking method to optimize heat dissipation efficiency while ensuring structural strength.

[0131] Among them, during the manufacturing process of the power amplifier circuit board, the thickness ratio of the heat sink 20 and the substrate 10 is determined by material selection and processing steps. For example, the thickness of the substrate 10 can be set to 0.8 mm, and the thickness of the heat sink 20 can be selected in the range of 1.2 mm to 2.4 mm. During the sintering process, if the thickness of the heat sink 20 is too thin, it will lead to insufficient heat capacity and will not be able to effectively buffer the instantaneous heat generated by the power amplifier 111; if it is too thick, it will increase the overall weight and reduce the installation adaptability. By limiting the thickness of the heat sink 20 to 1.5-3 times that of the substrate 10, it is ensured that heat can be quickly diffused through the heat sink 20, and the risk of stress concentration or delamination between the substrate 10 and the heat sink 20 due to excessive thickness difference is avoided.

[0132] Compared to existing technologies, traditional heat dissipation structures typically design the heat sink 20 and substrate 10 to be of the same thickness or have an unbalanced ratio, resulting in heat accumulation within the substrate 10 and ineffective dissipation. This can also easily cause structural deformation due to differences in thermal expansion coefficients. This embodiment, by limiting the thickness ratio, allows the heat sink 20 to conduct more heat per unit time while matching the mechanical strength of the substrate 10, reducing the risk of interfacial cracking caused by thermal cycling.

[0133] This embodiment solves the problem of mismatched thermal conductivity between the heat sink 20 and the substrate 10 in high-power scenarios, improves heat dissipation efficiency and enhances structural reliability, allowing the power amplifier circuit board to maintain a stable temperature during continuous high-load operation.

[0134] The above are only preferred embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention description and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A method for manufacturing a power amplifier circuit board with a sintered heat sink, characterized in that: The manufacturing method comprises: Draw the PCB layout including the power amplifier; Performing thermal management zoning on the PCB layout, dividing at least the installation area corresponding to the power amplifier into a first heat dissipation area; Based on the PCB layout, a corresponding substrate is manufactured; The heat dissipation plate is attached and sintered to a side of the substrate facing away from the first heat dissipation area.

2. The method for manufacturing a power amplifier circuit board with a sintered heat sink according to claim 1, wherein: The thermal management partitioning of the PCB layout, at least dividing the installation area corresponding to the power amplifier into a first heat dissipation area, includes: Obtain heat distribution data of each component in the PCB layout; According to the range value of the heat distribution data, the PCB layout is divided into at least two heat dissipation areas, and at least the installation area corresponding to the power amplifier is divided into a first heat dissipation area.

3. The method for manufacturing a power amplifier circuit board with a sintered heat sink according to claim 2, wherein: The heat dissipation plate includes a first heat dissipation plate and a second heat dissipation plate; the PCB layout also includes a power input circuit and an output circuit; The manufacturing method further comprises: Sintering and disposing the first heat sink corresponding to the mounting area of the power amplifier; Adhere the second heat sink to the power input circuit and the output circuit via thermal conductive adhesive; When the second heat dissipation plate is bonded to the substrate, the second heat dissipation plate is bonded to the first heat dissipation plate at a preset distance.

4. The method for manufacturing a power amplifier circuit board with a sintered heat sink according to claim 1, wherein: The step of attaching and sintering the heat dissipation plate to a side of the substrate facing away from the first heat dissipation area includes: Filling thermal conductive paste onto a side of the substrate facing away from the first heat dissipation area; Bonding the heat dissipation plate and the substrate by using the thermal conductive paste; The substrate is heated to melt the thermal conductive paste and fix the heat dissipation plate.

5. The method for manufacturing a power amplifier circuit board with a sintered heat sink according to claim 1, wherein: The manufacturing method further comprises: Determining the positions of various components of the power amplifier on the PCB layout; A device groove is provided corresponding to at least one of the device positions, and the electronic device corresponding to the position is installed in the device groove.

6. The method for manufacturing a power amplifier circuit board with a sintered heat sink according to claim 1, wherein: The manufacturing method further comprises: When the PCB layout is all power amplifier areas, the heat sink and the substrate are arranged to have the same length and width; A plurality of grounding positions are provided on the substrate, and the heat dissipation plate is electrically connected to the plurality of grounding positions of the substrate.

7. The method for manufacturing a power amplifier circuit board with a sintered heat sink according to claim 6, wherein: The substrate is provided with a plurality of grounding positions, and the heat sink is electrically connected to the plurality of grounding positions of the substrate, including: Ground pads are provided along the four corners of the substrate, and through-holes are provided at positions corresponding to the heat dissipation plate and the substrate; The ground pad and the through-hole are connected by a stud or a wire to electrically connect the heat dissipation plate to the ground of the substrate.

8. The method for manufacturing a power amplifier circuit board with a sintered heat sink according to claim 1, wherein: The step of manufacturing a corresponding substrate based on the PCB layout includes: The first heat dissipation area on the PCB layout is divided and manufactured into a substrate corresponding to the power amplifier.

9. A power amplifier circuit board with a sintered heat sink, characterized in that: The power amplifier circuit board is manufactured using the manufacturing method of the sintered heat sink according to any one of claims 1 to 8, and the power amplifier circuit board comprises: a substrate, wherein a first heat dissipation area is provided on the substrate, and a power amplifier is installed in the first heat dissipation area; A heat dissipation plate is sintered and attached to a side of the substrate facing away from the first heat dissipation area, and the heat dissipation plate is arranged corresponding to the first heat dissipation area.

10. The power amplifier circuit board of the sintered heat sink according to claim 9, characterized in that: The thickness of the heat dissipation plate is 1.5-3 times the thickness of the substrate.

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