Release method with low deformation and low adhesive force and photocuring 3D printing method

Abstract

The invention provides a release method with low deformation and low adhesive force, which comprises the following steps: purchasing a rigid film as a release film to isolate a modified viscous material; wherein the modified viscous material is prepared by adding a proper amount of an additive for reducing the adhesive force of the material into a viscous material. According to the low-deformation and low-adhesive-force release method provided by the invention, the release film adopts the rigid film and is used for isolating the modified viscous material, the rigid film can remarkably reduce the deformation in the release process, the modified viscous material can remarkably reduce the adhesive force of the material due to the addition of the additive for reducing the adhesive force of the material, and the rigid film and the modified viscous material have a synergistic effect, so that the release effect is good. And the release effects of low deformation and low adhesive force can be realized. The invention further provides a photocuring 3D printing method.

Description

Technical Field

[0001] The present invention relates to the field of release technology, specifically to a release method with low deformation and low adhesion, and more particularly to a light-curing 3D printing method using the release method. Background Art

[0002] Release films are functional films widely used in electronics, packaging, medical applications, and light-curing 3D printing. They are used to isolate sticky materials and facilitate easy peeling during production and processing, thereby improving production efficiency and product quality. Currently, common release films can be categorized by their primary chemical composition into silicon (Si)-based, fluorine (F)-based, carbon (C)-based, oxygen (O)-based, nitrogen (N)-based, and composite release films.

[0003] However, the existing technology mainly relies on reducing the adhesion between the release film and the sticky material by chemically or physically modifying the release film. However, this method has significant problems: first, the effect of reducing adhesion is limited. It is difficult to achieve ultra-low adhesion only by modifying the surface of the release film (such as coating with silicone oil or fluorine compounds), and the deformation during the release process is large. Especially in the field of high-precision manufacturing (such as light-curing 3D printing), excessive adhesion and deformation will make it difficult to peel off the printed parts or even damage them, seriously affecting the printing efficiency and quality. Secondly, the high-performance release films (such as oxygen-permeable films) used in the existing technology have high preparation costs and limited service life. The performance gradually decays during long-term use, further increasing the maintenance cost of the manufacturing process.

[0004] In recent years, with the rapid development of photocuring 3D printing technology, this technology has been widely used in high-precision manufacturing, medical device development, microstructure design and other fields. Therefore, photocuring 3D printing places unique demands on the performance of release films. For example, the release film needs to withstand the reciprocating mechanical peeling and demolding process. However, the shortcomings of traditional release films in terms of adhesion control and durability can lead to reduced printing accuracy and increased printing failure rates.

[0005] In view of this, it is necessary to provide a release method with low deformation and low adhesion to solve the above technical problems. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide a release method with low deformation and low adhesion, which can achieve a release effect with low deformation and low adhesion.

[0007] The first aspect of the present invention is to provide a release method with low deformation and low adhesion, and the technical solution is as follows:

[0008] A low-deformation, low-adhesion release method uses a rigid film as a release film to isolate a modified viscous material; wherein the modified viscous material is prepared by adding an appropriate amount of an additive for reducing the adhesion of the material to the viscous material.

[0009] Furthermore, the rigid film is a transparent rigid film, and its elastic modulus in the elastic stage is ≥44 MPa.

[0010] Furthermore, the additive for modifying the viscous material can reduce the adhesion of the viscous material.

[0011] Furthermore, the release film is a fluorine-based rigid film, a carbon-based rigid film, an oxygen-based rigid film, a nitrogen-based rigid film or a composite rigid film.

[0012] Furthermore, the amount of the additive is 0.3-1 wt% of the mass of the viscous material.

[0013] The second aspect of the present invention is to provide a light-curing 3D printing method, which applies the release method described in the first aspect, and its technical solution is as follows:

[0014] A light-curing 3D printing method comprises the following steps:

[0015] Step S1, providing a release film and a modified photosensitive resin;

[0016] The release film is a rigid film; the modified photosensitive resin is prepared by adding an appropriate amount of additives for reducing the adhesion of the material to the photosensitive resin;

[0017] Step S2, constructing a three-dimensional model using three-dimensional drawing software and exporting it to an STL format file;

[0018] Step S3, slicing the STL file using slicing software, setting printing parameters, and generating a slicing file suitable for stereolithography 3D printing;

[0019] Step S4: importing the slice file into a light-curing 3D printer, and performing 3D printing using the release film and modified photosensitive resin of step S1 to obtain a molded model.

[0020] Furthermore, the rigid film is a transparent rigid film, and its elastic modulus in the elastic stage is ≥44 MPa.

[0021] Furthermore, the release film is a fluorine-based rigid film, a carbon-based rigid film, an oxygen-based rigid film, a nitrogen-based rigid film or a composite rigid film.

[0022] Furthermore, the additive can reduce the adhesion of the photosensitive resin, and the additive amount is 0.3-1 wt % of the mass of the photosensitive resin.

[0023] Compared with the prior art, the release method with low deformation and low adhesion provided by the present invention has the following beneficial effects:

[0024] First, the present invention provides a release method with low deformation and low adhesion. The release film utilizes a rigid film, and the viscous material utilizes a modified viscous material. The rigid film significantly reduces deformation during the release process, while the modified viscous material, due to the addition of an adhesion-reducing additive, lowers the surface energy of the material, significantly reducing the adhesion of the resin material. The synergistic use of the release film and the modified viscous material results in a low surface energy interface, significantly optimizing the release process and reducing adhesion. This addresses the difficulty in achieving both low deformation and low adhesion during the release process with a modified release film alone, a problem encountered in conventional methods.

[0025] 2. The low deformation and low adhesion release method provided by the present invention is applied to the field of 3D printing. The low deformation and low adhesion ensure that each layer can be peeled off quickly and stably after exposure and curing, avoiding damage to the printed part or printing failure, significantly improving the efficiency and printing accuracy of 3D printing, and realizing continuous liquid surface stretching.

[0026] 3. The low-deformation, low-adhesion release method provided by the present invention can also be applied to the electronics, packaging, medical and other industries to isolate sticky materials and achieve easy peeling, meeting the diverse needs in complex manufacturing environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] To more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. The drawings described below are only some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0028] Figure 1 It is a structural schematic diagram of the printing device in the light-curing 3D printing method of the present invention. DETAILED DESCRIPTION

[0029] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present invention and to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the specific implementation methods of the present invention are further described below.

[0030] The endpoints of the ranges and any values disclosed herein are not limited to the precise ranges or values, and these ranges or values should be understood to include values close to these ranges or values. For numerical ranges, the endpoints of each range, the endpoints of each range and individual point values, and the individual point values can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed herein.

[0031] Example 1

[0032] A low-deformation, low-adhesion release method uses a rigid film as a release film to isolate a modified viscous material; wherein the modified viscous material is prepared by adding an appropriate amount of an additive for reducing the adhesion of the material to the viscous material.

[0033] The specific rigid film is a transparent rigid film, HRCF transparent rigid film purchased from Chuangxiangyuan, whose elastic modulus in the elastic stage is ≥44MPa. In addition, it can also be a fluorine-based rigid film, a carbon-based rigid film, an oxygen-based rigid film, a nitrogen-based rigid film, or a composite release film with high rigidity and low surface energy;

[0034] The additives were purchased from Yikangxun, and the added amount was 0.3-1 wt% of the mass of the viscous material, such as 0.3 wt%, 0.5 wt%, 0.6 wt%, 0.8 wt% or 1 wt%, or other values within this range.

[0035] In this embodiment, the viscous material is resin. The addition of additives can significantly reduce the surface energy of the resin material, thereby reducing its adhesion to the release film.

[0036] Example 2 Application of release method in light-curing 3D printing

[0037] A light-curing 3D printing method comprises the following steps:

[0038] Step S1, providing a release film and a modified photosensitive resin;

[0039] The release film is a transparent rigid film; the HRCF transparent rigid film purchased from Chuangxiangyuan has an elastic modulus of ≥44MPa in the elastic stage. In addition, it can also be a fluorine-based rigid film, a carbon-based rigid film, an oxygen-based rigid film, a nitrogen-based rigid film, or a composite release film with high rigidity and low surface energy.

[0040] The modified photosensitive resin is prepared by adding an appropriate amount of an additive for reducing the adhesion of the material to the photosensitive resin; specifically, the additive is purchased from Yikangxun, and the added amount is 0.3-1wt% of the mass of the photosensitive resin, such as 0.3wt%, 0.5wt%, 0.6wt%, 0.8wt% or 1wt%, or other values within this range;

[0041] Step S2, constructing a three-dimensional model using three-dimensional drawing software and exporting it to an STL format file;

[0042] Among them, the 3D drawing software is SOLIDWORKS, UG or Catia;

[0043] Step S3, slicing the STL file using slicing software, setting printing parameters, and generating a slicing file suitable for stereolithography 3D printing;

[0044] The slicing software is CHITUBOX, and the printing parameters include layer thickness, exposure time, and printing speed;

[0045] Step S4: importing the slice file into a light-curing 3D printer, and performing 3D printing using the release film and modified photosensitive resin of step S1 to obtain a molded model.

[0046] See also Figure 1 , is a schematic diagram of the structure of the printing device in the light-curing 3D printing method of the present invention. The 3D printing device includes a resin tank 1, a photosensitive resin 2 filled in the resin tank, a build base 3, a tension sensor 4 connected to the build base, a release film 6 located at the bottom of the resin tank, and a light source for light curing (not shown). The model 5 is formed by printing on the build base. The working principle of the 3D printing device is as follows:

[0047] The photosensitive resin is loaded into the resin tank; the build plate is lowered to a position close to the bottom of the tank, leaving a preset layer thickness distance from the bottom; UV light is irradiated on the resin according to the shape of the first layer to solidify it; the build plate is raised to separate the first layer of resin material from the release film; the build plate is lowered, and the above steps are repeated until the model is completed.

[0048] During the 3D printing process, a tension sensor measures the adhesion between the resin material and the release film, as well as the deformation of the release film. Demolition is successful when the bonding force between the build substrate and the model is greater than that between the release film and the model. Demolition fails when the bonding force between the release film and the model is greater than that between the build substrate and the model, resulting in a failed print. In this case, the cured model adheres to the release film, causing the print to fail.

[0049] In this embodiment, the tension sensor is a 4-S type tension sensor.

[0050] The release method of the present invention is described in detail below through specific examples.

[0051] Example 3

[0052] A light-curing 3D printing method comprises the following steps:

[0053] Step S1, providing a release film and a modified photosensitive resin;

[0054] The release film is a HRCF transparent rigid film from Chuangxiangyuan; the modified photosensitive resin is prepared by adding 0.5 wt% of an additive purchased from Yikangxun to a commercial acrylic resin and stirring evenly. The prepared modified photosensitive resin is an oily photosensitive resin.

[0055] Step S2, constructing a circular model with a diameter of 25 mm and a thickness of 1 mm using the 3D drawing software SOLIDWORKS and exporting it as an STL format file;

[0056] Step S3: Use the slicing software CHITUBOX to slice the STL file and set the printing parameters: layer thickness of 0.05 mm, exposure time of 3.5 seconds, and printing speed of 75 mm / min to generate a slicing file suitable for light-curing 3D printing;

[0057] In step S4, the slice file is imported into a light-curing 3D printer, and the HRCF transparent rigid film and modified photosensitive resin of step S1 are used for 3D printing to obtain a molded model; and the adhesion force and deformation during the printing process are measured by a tensile sensor device.

[0058] Example 4

[0059] A light-curing 3D printing method comprises the following steps:

[0060] Step S1, providing a release film and a modified photosensitive resin;

[0061] The release film is a HRCF transparent rigid film from Chuangxiangyuan; the modified photosensitive resin is prepared by adding 0.5 wt% of an additive purchased from Yikangxun to a water-based photosensitive resin and stirring evenly. The prepared modified photosensitive resin is a water-based photosensitive resin;

[0062] Step S2, constructing a circular model with a diameter of 25 mm and a thickness of 1 mm using the 3D drawing software SOLIDWORKS and exporting it as an STL format file;

[0063] Step S3: Use the slicing software CHITUBOX to slice the STL file and set the printing parameters: layer thickness of 0.05 mm, exposure time of 3.5 seconds, and printing speed of 75 mm / min to generate a slicing file suitable for light-curing 3D printing;

[0064] In step S4, the slice file is imported into a light-curing 3D printer, and the HRCF transparent rigid film and modified photosensitive resin of step S1 are used for 3D printing to obtain a molded model; and the adhesion force and deformation during the printing process are measured by a tensile sensor device.

[0065] Example 5

[0066] A light-curing 3D printing method comprises the following steps:

[0067] Step S1, providing a release film and a modified photosensitive resin;

[0068] The release film is a HRCF transparent rigid film from Chuangxiangyuan; the modified photosensitive resin is prepared by adding 0.5 wt% of an additive purchased from Yikangxun to a water-based photosensitive resin and stirring evenly. The prepared modified photosensitive resin is a water-based photosensitive resin;

[0069] Step S2, constructing a solid cylinder with a diameter of 15 mm and a height of 100 mm using the 3D drawing software SOLIDWORKS and exporting it to an STL format file;

[0070] Step S3: Slice the STL file using the slicing software CHITUBOX and set the printing parameters: exposure time of 3.5 seconds, continuous printing, to generate a slice file suitable for light-curing 3D printing;

[0071] In step S4, the slice file is imported into a light-curing 3D printer, and the HRCF transparent rigid film and the modified photosensitive resin in step S1 are used for 3D printing to obtain a molded model.

[0072] This embodiment realizes continuous light-curing 3D printing with a printing speed of 200 mm / h.

[0073] Example 6

[0074] A light-curing 3D printing method comprises the following steps:

[0075] Step S1, providing a release film and a modified photosensitive resin;

[0076] The release film is a HRCF transparent rigid film from Chuangxiangyuan; the modified photosensitive resin is prepared by adding 0.5 wt% of an additive purchased from Yikangxun to a water-based photosensitive resin and stirring evenly. The prepared modified photosensitive resin is a water-based photosensitive resin;

[0077] Step S2, constructing a hollow cylinder with a large circle diameter of 15 mm, a small circle diameter of 10 mm, and a height of 100 mm using the 3D drawing software SOLIDWORKS, and exporting it to an STL format file;

[0078] Step S3: Slice the STL file using the slicing software CHITUBOX and set the printing parameters: exposure time of 3.5 seconds, continuous printing, to generate a slice file suitable for light-curing 3D printing;

[0079] In step S4, the slice file is imported into a light-curing 3D printer, and the HRCF transparent rigid film and the modified photosensitive resin in step S1 are used for 3D printing to obtain a molded model.

[0080] This embodiment realizes continuous light-curing 3D printing with a printing speed of 300 mm / h.

[0081] Comparative Example 1

[0082] A light-curing 3D printing method comprises the following steps:

[0083] Step S1, providing a release film and a photosensitive resin;

[0084] The release film is FEP release film; the photosensitive resin is commercial acrylic resin;

[0085] Step S2, constructing a circular model with a diameter of 25 mm and a thickness of 1 mm using the 3D drawing software SOLIDWORKS and exporting it as an STL format file;

[0086] Step S3: Use the slicing software CHITUBOX to slice the STL file and set the printing parameters: layer thickness of 0.05 mm, exposure time of 3.5 seconds, and printing speed of 75 mm / min to generate a slicing file suitable for light-curing 3D printing;

[0087] In step S4, the slice file is imported into a light-curing 3D printer, and the FEP release film and photosensitive resin of step S1 are used for 3D printing to obtain a molded model; and the adhesion force and deformation during the printing process are measured by a tension sensor device.

[0088] Comparative Example 2

[0089] A light-curing 3D printing method comprises the following steps:

[0090] Step S1, providing a release film and a photosensitive resin;

[0091] The release film is NFEP release film; the photosensitive resin is commercial acrylic resin;

[0092] Step S2, constructing a circular model with a diameter of 25 mm and a thickness of 1 mm using the 3D drawing software SOLIDWORKS and exporting it as an STL format file;

[0093] Step S3: Use the slicing software CHITUBOX to slice the STL file and set the printing parameters: layer thickness of 0.05 mm, exposure time of 3.5 seconds, and printing speed of 75 mm / min to generate a slicing file suitable for light-curing 3D printing;

[0094] In step S4, the slice file is imported into a light-curing 3D printer, and the NFEP release film and photosensitive resin of step S1 are used for 3D printing to obtain a molded model; and the adhesion force and deformation during the printing process are measured by a tension sensor device.

[0095] Comparative Example 3

[0096] A light-curing 3D printing method comprises the following steps:

[0097] Step S1, providing a release film and a photosensitive resin;

[0098] Wherein, the release film is an ACF release film; the photosensitive resin is a commercial acrylic resin;

[0099] Step S2, constructing a circular model with a diameter of 25 mm and a thickness of 1 mm using the 3D drawing software SOLIDWORKS and exporting it as an STL format file;

[0100] Step S3: Use the slicing software CHITUBOX to slice the STL file and set the printing parameters: layer thickness of 0.05 mm, exposure time of 3.5 seconds, and printing speed of 75 mm / min to generate a slicing file suitable for light-curing 3D printing;

[0101] In step S4, the slice file is imported into a light-curing 3D printer, and the ACF release film and photosensitive resin of step S1 are used for 3D printing to obtain a molded model; and the adhesion force and deformation during the printing process are measured by a tension sensor device.

[0102] Comparative Example 4

[0103] A light-curing 3D printing method comprises the following steps:

[0104] Step S1, providing a release film and a photosensitive resin;

[0105] The release film is the HRCF transparent rigid film produced by Chuangxiangyuan; the photosensitive resin is a commercial acrylic resin;

[0106] Step S2, constructing a circular model with a diameter of 25 mm and a thickness of 1 mm using the 3D drawing software SOLIDWORKS and exporting it as an STL format file;

[0107] Step S3: Use the slicing software CHITUBOX to slice the STL file and set the printing parameters: layer thickness of 0.05 mm, exposure time of 3.5 seconds, and printing speed of 75 mm / min to generate a slicing file suitable for light-curing 3D printing;

[0108] In step S4, the slice file is imported into a light-curing 3D printer, and the HRCF release film and photosensitive resin of step S1 are used for 3D printing to obtain a molded model; and the adhesion force and deformation during the printing process are measured by a tension sensor device.

[0109] Comparative Example 5

[0110] A light-curing 3D printing method comprises the following steps:

[0111] Step S1, providing a release film and a photosensitive resin;

[0112] The release film is an NFEP release film; the photosensitive resin is prepared by adding 0.5 wt% of an additive purchased from Yikangxun to a commercial acrylic resin and stirring uniformly. The prepared modified photosensitive resin is an oily photosensitive resin;

[0113] Step S2, constructing a circular model with a diameter of 25 mm and a thickness of 1 mm using the 3D drawing software SOLIDWORKS and exporting it as an STL format file;

[0114] Step S3: Use the slicing software CHITUBOX to slice the STL file and set the printing parameters: layer thickness of 0.05 mm, exposure time of 3.5 seconds, and printing speed of 75 mm / min to generate a slicing file suitable for light-curing 3D printing;

[0115] In step S4, the slice file is imported into a light-curing 3D printer, and the NEFP release film and photosensitive resin of step S1 are used for 3D printing to obtain a molded model; and the adhesion force and deformation during the printing process are measured by a tension sensor device.

[0116] The adhesion and deformation test results of Examples 3-4 and Comparative Examples 1-5 are shown in Tables 1 and 2.

[0117] Table 1: Adhesion test results of Examples 3-4 and Comparative Examples 1-3

[0118] Example Adhesion force / N Example 3 4 Example 4 2.6 Comparative Example 1 19.64 Comparative Example 2 10.48 Comparative Example 3 9.13 Comparative Example 4 9.6 Comparative Example 5 7.5

[0119] Table 2: Test results of deformation of release films of Example 3 and Comparative Examples 1-3

[0120]

[0121]

[0122] The relative deformation refers to the ratio of the deformation of the transparent rigid film to the deformation of the transparent rigid film under the condition of a fixed adhesion value.

[0123] The test results in Tables 1 and 2 show that the adhesion force measured in Example 3 was 4N, and the adhesion force measured in Example 4 was 2.6N, which are significantly lower than those in Comparative Example 1 (19.64N), Comparative Example 2 (10.48N), Comparative Example 3 (9.13N), Comparative Example 4 (9.6N), and Comparative Example 5 (7.5N). Furthermore, the rigid film exhibits low deformation during the demolding process. This demonstrates that the use of the rigid film significantly reduces deformation during the demolding process, while the use of the additive significantly reduces the adhesion of the resin material. The synergistic use of these two methods significantly optimizes the release process and reduces adhesion, resolving the key issue of traditional methods, which struggle to simultaneously achieve both low deformation and low adhesion during the release process by modifying the release film alone.

[0124] Furthermore, due to the low deformation and low adhesion characteristics of the release method of the present invention, it exhibits significant advantages in light-curing 3D printing, effectively avoiding damage to printed parts or printing failures, significantly improving printing efficiency and printing accuracy, and enabling continuous light-curing 3D printing at speeds of up to 300 mm / h. However, Comparative Examples 1-5 exhibited high adhesion and deformation during the demolding process, and therefore could not achieve continuous light-curing 3D printing.

[0125] The release method of the present invention has wide applicability and can be extended to other industries such as electronics, packaging, and medical treatment to isolate sticky materials and achieve easy peeling, thereby meeting diverse needs in complex manufacturing environments.

[0126] The embodiments of the present invention are described in detail above, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions and variations made to these embodiments without departing from the principles of the present invention are still within the scope of protection of the present invention.

Claims

1. A release method with low deformation and low adhesion, characterized in that: Use rigid film as release film to isolate modified adhesive materials; The modified viscous material is prepared by adding an appropriate amount of an additive for reducing the adhesion of the material into the viscous material.

2. The release method with low deformation and low adhesion according to claim 1, characterized in that: The rigid film is a transparent rigid film, and the elastic modulus of the rigid film in the elastic stage is ≥44 MPa.

3. The release method with low deformation and low adhesion according to claim 1, characterized in that: The additive for modifying the viscous material can reduce the adhesion of the viscous material.

4. The release method with low deformation and low adhesion according to claim 2, characterized in that: The release film is a fluorine-based rigid film, a carbon-based rigid film, an oxygen-based rigid film, a nitrogen-based rigid film or a composite rigid film.

5. The release method with low deformation and low adhesion according to claim 1, characterized in that: The amount of the additive added is 0.3-1 wt% of the mass of the viscous material.

6. A light-curing 3D printing method, characterized in that: The steps include: Step S1, providing a release film and a modified photosensitive resin; The release film is a rigid film; the modified photosensitive resin is prepared by adding an appropriate amount of additives for reducing the adhesion of the material to the photosensitive resin; Step S2, constructing a three-dimensional model using three-dimensional drawing software and exporting it to an STL format file; Step S3, slicing the STL file using slicing software, setting printing parameters, and generating a slicing file suitable for stereolithography 3D printing; Step S4: importing the slice file into a light-curing 3D printer, and performing 3D printing using the release film and modified photosensitive resin of step S1 to obtain a molded model.

7. The light-curing 3D printing method according to claim 6, characterized in that: The release film is a transparent rigid film, and its elastic modulus in the elastic stage is ≥44 MPa.

8. The light-curing 3D printing method according to claim 7, characterized in that: The release film is a fluorine-based rigid film, a carbon-based rigid film, an oxygen-based rigid film, a nitrogen-based rigid film or a composite rigid film.

9. The light-curing 3D printing method according to claim 6, characterized in that: The additive can reduce the adhesion of the viscous material, and the added amount is 0.3-1 wt % of the mass of the photosensitive resin.

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