Wafer clamp

Abstract

The wafer clamp comprises a loading disc, a sliding supporting frame is installed at the bottom of the loading disc, the sliding supporting frame comprises a first rod piece and a second rod piece which are orthogonally crossed, and the two rod pieces are in plane orthogonal connection at the intersection point to jointly form a cross-shaped main body frame; the cross points divide the two rod pieces into four extension arm parts; each extension arm part is provided with a penetrating type sliding groove in the length direction, and each extension arm part is divided into two sliding supporting branch rods which are arranged in parallel through the corresponding sliding groove; each extending arm part is provided with a clamping assembly, and the clamping assemblies can move in the axial direction of the sliding supporting branch rods. According to the invention, through cooperation of the loading disc, the cross-shaped sliding support frame and the clamping assembly, wafers of different sizes and special-shaped wafers can be simply and rapidly clamped without replacing a clamp of the ion implanter, and the clamping device is simple and reliable in clamping operation, convenient to use and convenient to popularize and apply.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a wafer clamp. Background Art

[0002] With the rapid development of semiconductor integrated circuit technology, ion implantation, as a key link in the integrated circuit manufacturing process, has become increasingly important. The application areas of ion implantation technology have subsequently expanded, driving the rapid development of the ion implantation machine industry. The working principle of an ion implantation machine is to adjust process parameters such as implantation energy, implantation dose, and implantation beam current. The required ions are obtained from the ion source, and through the acceleration and guidance of the ion implantation machine, an ion beam with an energy of several hundred kiloelectron volts is generated. The ions to be doped are then injected into the target material in the form of an ion beam, achieving precise control of doping and changing device performance. Ion implantation has many advantages, including relatively precise control of implantation energy and doping dose, good implantation uniformity, and low temperature.

[0003] Before implantation begins, the wafer needs to be clamped using the ion implanter's loading tray. The fixtures in existing ion implanters are all fixed sizes. To clamp wafers of different sizes, the loading tray must be replaced. The installation and removal of the loading tray is cumbersome, and configuring loading trays of different sizes increases equipment costs. More importantly, the fixtures in existing ion implanters can only clamp standard wafers and cannot directly accommodate special-shaped wafers. In actual use, the special-shaped wafer is usually attached to the standard wafer using conductive adhesive or glue, and then the standard wafer is clamped using the ion implanter's own fixture for implantation. The use of conductive adhesive and glue undoubtedly introduces contamination, resulting in a significant increase in wafer surface grain size, negatively impacting the wafer's electrical performance and surface quality. Furthermore, the cumbersome process of attaching and removing the adhesive further increases labor costs and reduces production efficiency. Furthermore, during high-energy implantation, the temperature rises during the implantation process, which can cause the tape and glue to fail, creating the risk of wafer splitting. Existing mass-production ion implanters cannot accommodate trays of different sizes simultaneously. This means that wafers of different sizes, even with the same process parameters, must be implanted in separate batches, reducing ion implantation efficiency. Furthermore, because special-shaped wafers are glued to standard wafers, they are subject to significant contamination and are typically not implanted in the same batch as other standard wafers, further reducing ion implantation efficiency. Summary of the Invention

[0004] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a wafer clamp to solve the problem that the loading plate of the existing ion implanter can only clamp wafers of a certain standard size and it is difficult to simply and quickly clamp standard wafers of different sizes and special-shaped wafers.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is as follows: A wafer clamp includes a loading tray, a sliding support frame mounted on the bottom of the loading tray, the sliding support frame comprising a first rod and a second rod that intersect orthogonally, the two rods being orthogonally connected at an intersection to form a cross-shaped main frame; the intersection divides the two rods into four extension arms, forming four working quadrants; each extension arm has a through-type slide groove along its length, the slide groove dividing the extension arm into two parallel sliding support branches; each extension arm is mounted with a clamping assembly; The clamping assembly includes a fixed plate and a sliding block, and the fixed plate and the sliding block form a clamping pair, wherein the lower surface of the fixed plate is provided with a first clamping surface, and the upper surface of the sliding block is provided with a second clamping surface corresponding to the first clamping surface, and a chip clamping area is formed between the first clamping surface and the second clamping surface; the top of the sliding block is provided with two guide grooves adapted to the cross-sectional shape of the sliding support rod, and the guide grooves pass through the top of the sliding block in the vertical direction, and the sliding support rod is embedded in the guide grooves so that the sliding block can move axially along the sliding support rod; first threaded mounting holes are provided on both sides of the fixed plate, and second threaded mounting holes are provided at corresponding positions of the sliding block, and fasteners pass through the first mounting hole and the second mounting hole in sequence to lock the clamping spacing.

[0006] Furthermore, the loading plate is a loading ring with a hollow center.

[0007] Furthermore, the bottoms of both ends of the first rod and the second rod are provided with protrusions with mounting threads, and a secondary stabilizing frame is connected to the bottom of each protrusion by bolts. The secondary stabilizing frame includes the same cross-shaped frame structure as the sliding support frame and the two are directly opposite each other.

[0008] Furthermore, a guide block is fixedly connected to the bottom of the sliding block, and sliding grooves that are slidably matched with the guide block are formed on the four extending arms of the secondary stabilizing frame.

[0009] Furthermore, the loading tray, the sliding support frame and the protrusion are integrally formed.

[0010] Furthermore, an elastic gasket is provided between the fixed plate and the sliding block, and its outer contour matches the projection of the clamping surface of the fixed plate. A third mounting hole is opened on the gasket at a position corresponding to the first mounting hole.

[0011] Furthermore, fourth mounting holes are provided at both ends of the first rod and the second rod, and the two rods are fixedly connected to the loading tray via fasteners and the fourth mounting holes.

[0012] Furthermore, the fixed plate and the sliding block are U-shaped structures, and the opening of the U-shaped structure faces away from the intersection.

[0013] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention discloses a wafer clamp, which can clamp wafers of different sizes and special-shaped wafers simply and quickly through the cooperation of a loading plate, a cross-shaped sliding support frame and a clamping assembly without replacing the clamp provided by the ion implanter. It solves the problem that the clamp of a traditional ion implanter can only clamp wafers of fixed size, and clamping wafers of different sizes requires replacing the loading plate, which is cumbersome to operate and increases the equipment cost by configuring loading plates of different sizes. At the same time, it solves the problem that when clamping special-shaped wafers in a traditional ion implanter, it is necessary to fix the special-shaped wafers on the standard wafers through conductive glue or glue, which causes great pollution and affects the performance of the wafers. The cumbersome process of chip mounting and glue removal leads to increased labor costs and reduced production efficiency, as well as the risk of chip cracking due to glue failure.

[0014] 2. The wafer fixture of the present invention is particularly suitable for mass-production ion implanters. It can simultaneously implant standard wafers of different sizes and special-shaped wafers, shortening fixture replacement time, increasing ion implantation efficiency, and reducing wafer fixture costs. This solves the problem that existing ion implanters cannot simultaneously implant multiple-sized wafers and special-shaped wafers.

[0015] 3. The loading tray of the present invention adopts a hollow structure, which can reduce weight and effectively prevent the wafer from being thrown off and splitting during rotation. The hollow structure also helps to dissipate heat of the wafer during the injection process and reduce the risk of splitting caused by thermal stress accumulation during the injection process. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Schematic diagram of the structure of the wafer clamp of the present invention; Figure 2 It is a structural schematic diagram of the clamping assembly of the present invention; Figure 3 It is a structural schematic diagram of the sliding support frame of the present invention; Figure 4 This is a schematic diagram of the structure of the wafer clamp of the present invention for clamping a standard wafer; Figure 5 This is a schematic diagram of the structure of the wafer clamp of the present invention for clamping a special-shaped wafer; In the figure, the loading tray 1, the sliding support frame 2, the first rod 201, the second rod 202, the slide groove 203, the fourth mounting hole 204, the clamping assembly 3, the fixed plate 301, the sliding block 302, the guide groove 303, the first mounting hole 304, the guide block 305, the gasket 306, the protrusion 4, and the secondary stabilizing frame 5. DETAILED DESCRIPTION

[0017] The specific embodiments of the present invention are described in further detail below with reference to the accompanying drawings. Example

[0018] like Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 As shown, the present invention provides a wafer clamp, comprising a loading tray 1, a sliding support frame 2 mounted on the bottom of the loading tray 1, the sliding support frame 2 comprising a first rod 201 and a second rod 202 intersecting each other orthogonally, the two rods being connected orthogonally at the intersection to form a cross-shaped main frame; the intersection divides each rod into four extension arms, forming four working quadrants; each extension arm is provided with a through-type slide groove 203 along its length, the slide groove 203 dividing the extension arm into two parallel sliding support branches; each extension arm is mounted with a clamping assembly 3; The clamping assembly 3 includes a fixed plate 301 and a sliding block 302, and the fixed plate 301 and the sliding block 302 form a clamping pair, wherein the lower surface of the fixed plate 301 is provided with a first clamping surface, and the upper surface of the sliding block 302 is provided with a second clamping surface corresponding to the first clamping surface, and a chip clamping area is formed between the first clamping surface and the second clamping surface; the top of the sliding block 302 is provided with two guide grooves 303 adapted to the cross-sectional shape of the sliding support rod, and the guide grooves 303 pass through the top of the sliding block 302 in the vertical direction, and the sliding support rod is embedded in the guide grooves 303, so that the sliding block 302 can move axially along the sliding support rod; the fixed plate 301 is provided with first threaded mounting holes 304 on both sides, and the sliding block 302 is provided with second threaded mounting holes (not shown) at the corresponding position, and the fasteners pass through the first mounting holes 304 and the second mounting holes in sequence to achieve clamping spacing locking.

[0019] In a specific implementation, the loading tray 1 is a loading ring with a hollow center. The hollow structure of the loading tray 1 helps to dissipate heat from the wafer during the implantation process and reduces the risk of wafer cracking caused by thermal stress accumulation during the implantation process.

[0020] In practice, the first and second rods 201, 202 are provided with screw-threaded protrusions 4 at their bases. A secondary stabilizing frame 5 is bolted to the underside of each protrusion 4. The secondary stabilizing frame 5 comprises the same cross-shaped frame structure as the sliding support frame 2, with the two facing each other vertically. This makes the clamping assembly 3 more stable and reduces the risk of splintering.

[0021] In a specific implementation, the bottom of the sliding block 302 is fixedly connected to a guide block 305, and the four extending arms of the secondary stabilizing frame 5 are provided with sliding grooves that slidably cooperate with the guide block 305. In this way, the secondary stabilizing frame 5 can be used to better limit and guide, and improve the stability of the clamping assembly 3.

[0022] In a specific implementation, an elastic gasket 306 is disposed between the fixed plate 301 and the sliding block 302. Its thickness is 0.5-1.2 mm, and its contour matches the projection of the clamping surface of the fixed plate 301. A third mounting hole (not shown) is defined in the gasket 306 at the location corresponding to the first mounting hole 304. Gasket 306 increases friction and prevents scratches on the wafer when securing it.

[0023] In a specific implementation, the fixed plate 301 and the sliding block 302 are U-shaped structures, with the opening of the U-shaped structure facing away from the intersection. The U-shaped structure is relatively smooth, which can avoid sharp corners and reduce the risk of edge cracking.

[0024] In a specific implementation, the loading tray 1, sliding support frame 2, and protrusion 4 can be separately processed and then assembled and fixed, or they can be directly formed as a single piece. When using separate processing and then assembly and fixation, the first rod 201 and the second rod 202 are provided with fourth mounting holes 204 at both ends, and the protrusion 4 is provided with a through-threaded hole, which is aligned with the fourth mounting hole 204. The secondary stabilizing frame 5 is fixedly connected to the protrusion 4, sliding support frame 2, and loading tray 1 in sequence via fasteners.

[0025] Instructions for Use: When assembling the fixture, first, place the sliding support frame 2 at the bottom of the loading tray 1. Then, insert the sliding support rod into the guide groove 303 of the sliding block 302, so that the upper surface of the sliding support rod is flush with the upper surface of the sliding block 302. Next, place bumps 4 at the bottom of each end of the two rods. Use fasteners to sequentially lock and secure the secondary stabilizing frame 5, bumps 4, and sliding support frame 2 to the loading tray 1. Ensure that the guide block 305 below the sliding block 302 extends into the sliding groove of the secondary stabilizing frame 5 to achieve a sliding fit. Place the wafer fixture with the above structure into the ion implanter, and use the ion implanter's built-in four-point clamping mechanism to clamp and secure the edge of the loading tray. When installing the chip, first place the chip on the sliding support frame 2 and adjust it to the appropriate position. Then slide the sliding block 302 to the appropriate position under the chip so that the sliding block 302 and the outer edge of the chip partially overlap and the chip does not block the mounting hole on the sliding block 302. Then place the gasket 306 above the sliding block 302. The gasket 306 covers the outer edge of the chip close to the center position. After the gasket 306 is placed, place the fixed plate 301 above the gasket 306, and through the cooperation of the fixed plate 301, the gasket 306 and the mounting holes facing each other on the sliding block 302, the chip is clamped by fasteners.

[0026] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit the technical solutions. Those skilled in the art should understand that modifications or equivalent replacements of the technical solutions of the present invention that do not depart from the purpose and scope of the technical solutions of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A wafer holder comprising a loading plate, characterized in that: A sliding support frame is installed at the bottom of the loading tray, and the sliding support frame includes a first rod and a second rod that are orthogonally intersecting. The two rods are orthogonally connected at the intersection to form a cross-shaped main frame. The intersection divides the two rods into four extension arms, forming four working quadrants. Each extension arm has a through-type slide groove along its length, and the slide groove divides the extension arm into two parallel sliding support rods. A clamping assembly is installed on each extension arm. The clamping assembly includes a fixed plate and a sliding block, and the fixed plate and the sliding block form a clamping pair, wherein the lower surface of the fixed plate is provided with a first clamping surface, and the upper surface of the sliding block is provided with a second clamping surface corresponding to the first clamping surface, and a chip clamping area is formed between the first clamping surface and the second clamping surface; the top of the sliding block is provided with two guide grooves adapted to the cross-sectional shape of the sliding support rod, and the guide grooves pass through the top of the sliding block in the vertical direction, and the sliding support rod is embedded in the guide grooves so that the sliding block can move axially along the sliding support rod; first threaded mounting holes are provided on both sides of the fixed plate, and second threaded mounting holes are provided at corresponding positions of the sliding block, and fasteners pass through the first mounting hole and the second mounting hole in sequence to lock the clamping spacing.

2. The wafer holder according to claim 1, wherein: The loading plate is a loading ring with a hollow center.

3. The wafer holder according to claim 1, wherein: The bottoms of both ends of the first and second rods are provided with protrusions with mounting threads, and a secondary stabilizing frame is connected to each protrusion by bolts. The secondary stabilizing frame includes the same cross-shaped frame structure as the sliding support frame, and the two are directly opposite each other.

4. The wafer holder according to claim 3, wherein: The bottom of the sliding block is fixedly connected with a guide block, and the four extending arms of the secondary stabilizing frame are provided with sliding grooves that are slidably matched with the guide block.

5. The wafer holder according to claim 3, wherein: The loading tray, the sliding support frame and the protrusion are integrally formed.

6. The wafer holder according to claim 1, wherein: An elastic gasket is provided between the fixed plate and the sliding block, the outer contour of which matches the projection of the clamping surface of the fixed plate, and a third mounting hole is opened at a position of the gasket corresponding to the first mounting hole.

7. The wafer holder according to claim 1, wherein: Fourth mounting holes are provided at both ends of the first rod and the second rod, and the two rods are fixedly connected to the loading tray via fasteners and the fourth mounting holes.

8. The wafer holder according to claim 1, wherein: The fixed plate and the sliding block are U-shaped structures, and the opening of the U-shaped structure faces away from the intersection.

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