Die bonder

Abstract

The invention relates to the technical field of die bonding, in particular to a die bonder. The die bonder comprises a machine table, a supporting frame, a first material box assembly, a second material box assembly and a die bonding table assembly, the supporting frame, the first material box assembly, the second material box assembly and the die bonding table assembly are arranged on the machine table, and the machine table is further provided with a first wafer table assembly corresponding to the first material box assembly and a second wafer table assembly corresponding to the second material box assembly. A wafer transfer assembly and a turret assembly are arranged on the supporting frame, and the wafer transfer assembly is used for placing wafers in the first material box assembly on the first wafer table assembly and placing wafers in the second material box assembly on the second wafer table assembly; the turret assembly is used for fixing the wafers on the first wafer table assembly and the second wafer table assembly to a substrate on the wafer fixing table assembly. By adopting the mode, the die bonding efficiency can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of crystal bonding, in particular to a crystal bonding machine. Background Art

[0002] A die bonder is a mechanical device for fixing crystals and semiconductor packaging. It can transfer and bond the wafer on the blue film to the substrate to complete chip mounting. It is widely used in the production of LED direct display screens, semiconductor discrete devices, DIP and SOP and other products.

[0003] Currently, during the die bonding process, a single die bonding swing arm mechanism typically drives the suction nozzle back and forth between the die feeding and bonding positions. This is combined with a holder transfer mechanism to adjust the holder's position, enabling die bonding at different positions on the holder. Because a single die bonding swing arm mechanism can only bond one position on the holder at a time, the equipment's manual loading intervals are long, hindering human efficiency and resulting in low die bonding efficiency. The one-to-one model of the equipment mechanism fails to effectively improve mechanism utilization. Summary of the Invention

[0004] The technical problem to be solved by the embodiments of the present invention is to provide a die bonding machine that can improve the die bonding efficiency.

[0005] The present invention discloses a crystal bonding machine, comprising: a machine platform, a support frame arranged on the machine platform, a first material box assembly, a second material box assembly and a crystal bonding table assembly; the machine platform is also provided with a first wafer table assembly corresponding to the first material box assembly, and a second wafer table assembly corresponding to the second material box assembly; a wafer transfer assembly and a turret assembly are provided on the support frame; the wafer transfer assembly is used to place the wafers in the first material box assembly onto the first wafer table assembly, and to place the wafers in the second material box assembly onto the second wafer table assembly; the turret assembly is used to bond the wafers on the first wafer table assembly and the second wafer table assembly onto the substrate on the crystal bonding table assembly.

[0006] Optionally, the turret assembly includes a rotating drive member arranged on the support frame, and a rotating shaft rotatably connected to the support frame, a plurality of arms are arranged in a circular array on the rotating shaft, and the end of each arm is connected to a ZR-axis motor, and a suction nozzle is connected to the ZR-axis motor, and the suction nozzle is used to adsorb the chip.

[0007] Optionally, the number of the bond arms is greater than or equal to 6, and the number of the bond arms is an even number.

[0008] Optionally, each arm is provided with a corresponding number, the arm with an even number is used to absorb the wafer from the first wafer stage assembly or the second wafer stage assembly, and the arm with an odd number is used to absorb the wafer from the remaining one.

[0009] Optionally, the wafer transfer assembly includes a linear transmission module arranged on the support frame, and a clamping mechanism arranged on the linear transmission module, and the clamping mechanism can move back and forth between the first material box assembly and the second material box assembly for clamping the wafer.

[0010] Optionally, the first wafer stage assembly includes a first XY moving module arranged on the machine platform, and a first mounting plate arranged on the first XY moving module, a first rotating ring is rotatably arranged on the first mounting plate, and the first rotating ring is transmission-connected to a first driving motor arranged on the first mounting plate.

[0011] Optionally, the second wafer stage assembly includes a second XY moving module arranged on the machine platform, and a second mounting plate arranged on the second XY moving module, a second rotating ring is rotatably arranged on the second mounting plate, and the second rotating ring is transmission-connected to a second driving motor arranged on the second mounting plate.

[0012] Optionally, the support frame is provided with a first crystal-taking lens module corresponding to the first wafer stage assembly, and a second crystal-taking lens module corresponding to the second wafer stage assembly; the support frame is also provided with a crystal-fixing lens module corresponding to the crystal-fixing stage assembly.

[0013] Optionally, a correction lens module is further provided on the machine platform, and the correction lens module is arranged on the side of the first wafer stage assembly or the second wafer stage assembly, and is used to detect the wafer adsorbed on the suction nozzle.

[0014] Optionally, the crystal bonding table assembly includes a third XY movable module provided on the machine platform, and a fixture provided on the third XY movable module, wherein the fixture is used for placing the substrate.

[0015] Compared with the prior art, the beneficial effect of the crystal bonder provided by the embodiment of the present invention is that: by setting a first material box assembly and a second material box assembly, as well as a first wafer stage assembly corresponding to the first material box assembly and a second wafer stage assembly corresponding to the second material box assembly, in conjunction with the efficient transfer function of the wafer transfer assembly, dual-path crystal supply is achieved, greatly shortening the time interval for manual loading. For example, in a traditional single-path crystal supply system, after manual loading once, the equipment needs to wait for the crystal bond swing arm to complete the entire crystal bond process before it can load again. In this design, each set of the first material box assembly and the first wafer stage assembly can cooperate to perform the loading operation, and each set of the second material box assembly and the second wafer stage assembly can also cooperate to perform the loading operation, thereby effectively improving the transfer efficiency. At the same time, the turret assembly can simultaneously process wafers from the first wafer stage assembly and the second wafer stage assembly, which greatly improves the crystal bond efficiency compared to the traditional single crystal bond swing arm mechanism that can only perform crystal bond operations on one position of the bracket at a time. The adoption of the above-mentioned multi-component collaborative working mode allows each mechanism to fully play its role, avoiding the problem of low mechanism utilization in the traditional one-to-one mode, and improving the overall operating efficiency and production capacity of the crystal bonder. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments, in which:

[0017] Figure 1 This is one of the structural diagrams of the die bonding machine provided by an embodiment of the present invention;

[0018] Figure 2 1 is a schematic structural diagram of a wafer transfer assembly provided by an embodiment of the present invention;

[0019] Figure 3 is a structural schematic diagram of a turret assembly provided by an embodiment of the present invention;

[0020] Figure 4 This is the second structural diagram of the die bonding machine provided by the embodiment of the present invention;

[0021] Figure 5 1 is a schematic structural diagram of a first wafer stage assembly (a second wafer stage assembly) provided in an embodiment of the present invention;

[0022] Figure 6 This is the third structural schematic diagram of the crystal bonding machine provided by the embodiment of the present invention.

[0023] The reference numerals in the figures are:

[0024] 100, die bonder; 110, machine platform; 112, correction lens module; 120, support frame; 122, first die-taking lens module; 124, second die-taking lens module; 126, die-bonding lens module; 130, first magazine assembly; 140, second magazine assembly; 150, first wafer stage assembly; 152, first XY motion module; 154, first mounting plate; 156, first rotating ring; 158, first drive motor; 160. Second wafer stage assembly; 162. Second XY motion module; 164. Second mounting plate; 166. Second rotating ring; 168. Second drive motor; 170. Wafer transfer assembly; 172. Linear transmission module; 174. Clamping mechanism; 180. Turret assembly; 182. Rotating shaft; 184. Boom arm; 186. ZR-axis motor; 190. Crystal bonding stage assembly; 192. Third XY motion module; 194. Fixture. DETAILED DESCRIPTION

[0025] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. Now, in conjunction with the accompanying drawings, the preferred embodiments of the present invention will be described in detail.

[0026] like Figure 1 、 Figure 2 and Figure 3 As shown, an embodiment of the present invention provides a crystal bonding machine 100, including: a machine 110, a support frame 120 arranged on the machine 110, a first material box assembly 130, a second material box assembly 140 and a crystal bonding table assembly 190, the machine 110 is also provided with a first wafer table assembly 150 corresponding to the first material box assembly 130, and a second wafer table assembly 160 corresponding to the second material box assembly 140, a wafer transfer assembly 170 and a turret assembly 180 are provided on the support frame 120, the wafer transfer assembly 170 is used to place the wafer in the first material box assembly 130 to the first wafer table assembly 150, and place the wafer in the second material box assembly 140 to the second wafer table assembly 160; the turret assembly 180 is used to bond the wafers on the first wafer table assembly 150 and the second wafer table assembly 160 to the substrate on the crystal bonding table assembly 190.

[0027] Specifically, the platform 110 serves as the basic support structure for the entire die bonder 100, providing a platform for the installation and operation of other components. The support frame 120 is mounted on the platform 110 and serves to connect and secure other key components, including the wafer transfer assembly 170 and the turret assembly 180. The first and second magazine assemblies 130, 140 are used to store wafers and serve as the initial supply source for wafers. The first wafer stage assembly 150 corresponds to the first magazine assembly 130, and the second wafer stage assembly 160 corresponds to the second magazine assembly 140. They are respectively used to receive and temporarily store wafers transferred from their respective magazine assemblies. Wafer transfer assembly 170, mounted on support frame 120, is responsible for placing wafers from first magazine assembly 130 onto first wafer stage assembly 150 and wafers from second magazine assembly 140 onto second wafer stage assembly 160. This facilitates the transfer of wafers from first magazine assembly 130 to first wafer stage assembly 150, and from second magazine assembly 140 to second wafer stage assembly 160. Turret assembly 180, also mounted on support frame 120, is responsible for transferring and bonding wafers from first wafer stage assembly 150 and second wafer stage assembly 160 to substrates on die bonding stage assembly 190, completing the final die bonding process.

[0028] The die bonder 100 provided in an embodiment of the present invention achieves dual-path wafer supply by providing a first magazine assembly 130 and a second magazine assembly 140, as well as a first wafer stage assembly 150 corresponding to the first magazine assembly 130 and a second wafer stage assembly 160 corresponding to the second magazine assembly 140. This, combined with the efficient transfer function of the wafer transfer assembly 170, significantly shortens the time interval between manual loading. For example, in a conventional single-path wafer supply system, after manual loading, the equipment must wait for the die bonder arm to complete the entire die bond process before reloading. However, in this design, each set of the first magazine assembly 130 and the first wafer stage assembly 150 can cooperate in the loading operation, and each set of the second magazine assembly 140 and the second wafer stage assembly 160 can also cooperate in the loading operation, thereby effectively improving transfer efficiency. Furthermore, the turret assembly 180 can simultaneously process wafers from the first wafer stage assembly 150 and the second wafer stage assembly 160. This significantly improves die bond efficiency compared to conventional single-die bonder arm mechanisms that can only perform die bonding operations on one position of the support at a time. The above-mentioned multi-component collaborative working mode enables each mechanism to fully play its role, avoids the problem of low mechanism utilization rate in the traditional one-to-one mode, and improves the overall operating efficiency and production capacity of the die bonder 100.

[0029] like Figure 3As shown, the turret assembly 180 includes a rotating drive member arranged on the support frame 120, and a rotating shaft 182 rotatably connected to the support frame 120. A plurality of arms 184 are arranged in a circular array on the rotating shaft 182, and the end of each arm 184 is connected to a ZR-axis motor 186. The ZR-axis motor 186 is connected to a suction nozzle, which is used to adsorb the chip.

[0030] Specifically, the rotary drive element provides a power source for the rotational movement of the turret assembly 180. A common rotary drive element may be a motor, which drives the rotation of the rotating shaft 182 through the rotation of the motor. A plurality of arm arms 184 are arranged in a circular array on the rotating shaft 182. The end of each arm arm 184 is connected to a ZR-axis motor 186, and the ZR-axis motor 186 is connected to a suction nozzle. This structural design enables the arm arms 184 to perform circular motion driven by the rotating shaft 182, and the ZR-axis motor 186 on each arm arm 184 can independently control the movement of the suction nozzle in the vertical direction (Z axis) and the rotational direction (R axis). The suction nozzle is used to absorb the wafer for the crystal bonding operation. In actual use, when turret assembly 180 begins operation, the rotary drive activates, driving shaft 182 to rotate. This causes circularly arranged arms 184 to sequentially pass over the first wafer stage assembly 150 and the second wafer stage assembly 160, with one arm 184 aligned with the first wafer stage assembly 150 and the other with the second wafer stage assembly 160. The ZR-axis motor 186 at the end of the corresponding arm 184 controls the suction nozzle to descend and absorb the wafer. The nozzle then ascends. As shaft 182 continues to rotate, arm 184 brings the suction nozzle, holding the wafer, above die bonding stage assembly 190. At this point, the ZR-axis motor 186 activates again, controlling the nozzle to descend and bond the wafer to the substrate, completing one die bonding operation. The nozzle then ascends, and arm 184 continues to rotate with shaft 182, preparing for the next die retrieval and bonding operation.

[0031] In an optional embodiment of the present application, the number of the bond arms 184 is greater than or equal to 6, and the number of the bond arms 184 is an even number.

[0032] Specifically, when the number of the arms 184 is greater than or equal to 6, the turret assembly 180 can perform more crystal retrieval and crystal bonding operations during one rotation, further improving the crystal bonding efficiency. For example, when the turret assembly 180 with 6 arms 184 rotates one circle on the rotating shaft 182, it can perform one more crystal retrieval and two more crystal bonding operations compared to the turret assembly 180 with 4 arms 184. The number of arms 184 is an even number in order to better achieve the coordinated work of dual-path crystal supply. In actual work, every two arms 184 are equivalent to an operating station. When the two arms 184 are rotated to the preset position, the first wafer stage assembly 150 and the second wafer stage assembly 160 can be moved to the corresponding arms 184 respectively to facilitate the absorption of the wafer, avoiding the situation of waiting time being too long, thereby improving the overall operating efficiency of the equipment. It should be noted that during the chip suction process, the blue film removal operation needs to be performed, so the time required for this process is longer than that of other processes. By setting up the first chip stage assembly 150 and the second chip stage assembly 160, the problem of long process time can be effectively overcome.

[0033] In an optional embodiment of the present application, each arm 184 is correspondingly numbered, and the arm 184 with an even number is used to suck chips from the first chip stage assembly 150 or the second chip stage assembly 160, and the arm 184 with an odd number is used to suck chips from the remaining one.

[0034] Specifically, during operation, when the shaft 182 of the turret assembly 180 begins rotating, the even-numbered and odd-numbered arms 184, respectively, pick up wafers from the corresponding first wafer stage assembly 150 or second wafer stage assembly 160, according to their respective functional assignments. For example, arms 184 numbered 2, 4, and 6 pick up wafers from the first wafer stage assembly 150, while arms 184 numbered 1, 3, and 5 pick up wafers from the second wafer stage assembly 160. This way, during one rotation of the shaft 182, both the first wafer stage assembly 150 and the second wafer stage assembly 160 are fully utilized, achieving efficient dual-path wafer supply and retrieval operations. The arms 184 then sequentially bond the captured wafers to the substrate on the die bonding table assembly 190. In actual applications, the specifications of the chips placed in the first material box assembly 130 and the second material box assembly 140 may be the same or different. By numbering the arms 184 and clarifying their functional assignments, the crystal retrieval process of the turret assembly 180 is made more orderly and efficient. This precise functional division avoids conflicts or confusions in the crystal retrieval process of the arms 184, further improving the efficiency of crystal bonding. In actual applications, if chips of different specifications are placed in the first material box assembly 130 and the second material box assembly 140, the crystal bonding operation can be completed on the same crystal bonding machine 100 without the need for re-discharging or changing rings. This saves time in changing plates and rings, which is beneficial to improving the working efficiency of the machine 110.

[0035] like Figure 2 As shown, the wafer transfer assembly 170 includes a linear transmission module 172 disposed on the support frame 120, and a clamping mechanism 174 disposed on the linear transmission module 172. The clamping mechanism 174 can move back and forth between the first material box assembly 130 and the second material box assembly 140 to clamp the wafer.

[0036] Specifically, the linear transmission module 172 provides power and guidance for linear motion for the clamping mechanism 174. Common linear transmission modules 172 may be a lead screw nut transmission mechanism, a synchronous belt transmission mechanism, or the like. The clamping mechanism 174 is mounted on the linear transmission module 172 and can move back and forth between the first magazine assembly 130 and the second magazine assembly 140 driven by the linear transmission module 172. Its main function is to clamp the wafer and achieve wafer transfer. The clamping mechanism 174 clamps the wafer using a specific clamping method (mechanical clamps, etc.), and then the linear transmission module 172 moves in the opposite direction, bringing the clamping mechanism 174 with the wafer clamped to the top of the first wafer stage assembly 150. The clamping mechanism 174 releases the wafer and places the wafer on the first wafer stage assembly 150. After completing the chip transfer of the first material box assembly 130, the clamping mechanism 174 is again moved to the top of the second material box assembly 140 under the drive of the linear transmission module 172, and the above clamping and placement operations are repeated to transfer the chip from the second material box assembly 140 to the second chip table assembly 160.

[0037] like Figure 5 As shown, the first wafer stage assembly 150 includes a first XY moving module 152 arranged on the machine platform 110, and a first mounting plate 154 arranged on the first XY moving module 152. A first rotating ring 156 is rotatably arranged on the first mounting plate 154, and the first rotating ring 156 is transmission-connected to a first driving motor 158 arranged on the first mounting plate 154.

[0038] Specifically, the first XY motion module 152 can be composed of two mutually perpendicular linear guides and a screw-nut transmission mechanism. A first mounting plate 154 is mounted on the first XY motion module 152 and moves with the movement of the first XY motion module 152. A first rotating ring 156 is rotatably mounted on the first mounting plate 154 and is in transmission connection with a first drive motor 158 mounted on the first mounting plate 154. The first drive motor 158 provides power for the rotation of the first rotating ring 156, enabling the first rotating ring 156 to rotate on the first mounting plate 154. When wafer transfer is required in conjunction with the arm 184, the first XY motion module 152 is activated, and by controlling the motor movement in the X- and Y-axes, the first mounting plate 154 is driven to move in the X- and Y-axes, thereby precisely adjusting the in-plane position of the wafer on the first rotating ring 156. The first driving motor 158 drives the first rotating ring 156 to rotate, which can change the position of the chip relative to the first chip stage assembly 150, so that some positions of the first rotating ring 156 correspond to the arm 184 to transfer the chip, and some positions place the chip through the chip transfer assembly 170 to improve operating efficiency.

[0039] Please continue to refer to Figure 5 The second wafer stage assembly 160 includes a second XY moving module 162 arranged on the machine platform 110, and a second mounting plate 164 arranged on the second XY moving module 162. A second rotating ring 166 is rotatably arranged on the second mounting plate 164, and the second rotating ring 166 is transmission-connected to a second driving motor 168 arranged on the second mounting plate 164.

[0040] Similarly, the second XY motion module 162 can be composed of two mutually perpendicular linear guides and a screw-nut transmission mechanism. A second mounting plate 164 is mounted on the second XY motion module 162 and moves with the movement of the second XY motion module 162. A second rotating ring 166 is rotatably mounted on the second mounting plate 164 and is in transmission connection with a second drive motor 168 mounted on the second mounting plate 164. The second drive motor 168 provides power for the rotation of the second rotating ring 166, enabling the second rotating ring 166 to rotate on the second mounting plate 164. When wafer transfer is required in conjunction with the arm 184, the second XY motion module 162 is activated. By controlling the motor movement in the X- and Y-axes, the second mounting plate 164 is driven to move in the X- and Y-axes, thereby precisely adjusting the in-plane position of the wafer on the second rotating ring 166. The second drive motor 168 drives the second rotating ring 166 to rotate, which can change the position of the chip relative to the second chip stage assembly 160, so that some positions of the second rotating ring 166 correspond to the arm 184 to transfer the chip, and some positions place the chip through the chip transfer assembly 170 to improve operating efficiency.

[0041] like Figure 1 As shown, the support frame 120 is provided with a first crystal-taking lens module 122 corresponding to the first wafer stage assembly 150 and a second crystal-taking lens module 124 corresponding to the second wafer stage assembly 160; the support frame 120 is also provided with a crystal-fixing lens module 126 corresponding to the crystal-fixing stage assembly 190.

[0042] Specifically, the first crystal-taking lens module 122 and the second crystal-taking lens module 124 collect image information of the wafers on their respective corresponding wafer stage assemblies in real time and transmit the image signal to the image processing circuit. The image processing circuit analyzes and processes the image to calculate parameters such as the actual position and angle of the wafer. Based on these parameters, the equipment control system precisely adjusts the position and angle of the wafer by controlling the first XY moving module 152, the first drive motor 158, the second XY moving module 162, and the second drive motor 168, etc., to ensure that the wafer is in the optimal crystal-taking position. During the crystal-fixing process, the crystal-fixing lens module 126 collects the position of the substrate on the crystal-fixing stage assembly 190 and the image information of the wafer and the substrate in real time, and also transmits it to the image processing circuit for analysis and processing. Based on the analysis results, the equipment control system precisely controls the movement of the turret assembly 180 to ensure that the wafer can be accurately fixed to the specified position of the substrate and the quality of the crystal fixing is guaranteed. This real-time monitoring and feedback mechanism greatly improves the stability and reliability of die bonding quality, effectively reduces the defective rate, and reduces product rework and scrap due to die bonding quality issues, thereby reducing production costs and improving production efficiency.

[0043] like Figure 4 As shown, a correction lens module 112 is also provided on the machine 110. The correction lens module 112 is arranged on the side of the first wafer stage assembly 150 or the second wafer stage assembly 160 for detecting the wafer adsorbed on the nozzle.

[0044] Specifically, after the suction nozzle on the arm 184 of the turret assembly 180 adsorbs the wafer, it will pass through the detection area of the correction lens module 112 before going to the crystal bonding table assembly 190. The correction lens module 112 quickly captures the image of the wafer on the suction nozzle and transmits it to the image processing software. The software uses advanced image recognition algorithms to accurately analyze key parameters such as the position, angle and posture of the wafer. For example, by identifying the characteristic points or specific marking patterns on the edge of the wafer, the deviation value of the wafer relative to the ideal state is calculated. If it is detected that the wafer has position offset, angle tilt or other abnormal conditions, the equipment control system will adjust the position and angle of the suction nozzle in real time based on these deviation data by controlling the ZR axis motor and other related actuators, so that the wafer returns to the correct adsorption state, ensuring that the wafer can be accurately placed on the target position of the substrate during the crystal bonding process. With the above form, the shape of the wafer can be corrected before crystal bonding, which is conducive to improving operational efficiency.

[0045] like Figure 6 As shown, the die bonding stage assembly 190 includes a third XY moving module 192 disposed on the machine platform 110 , and a fixture 194 disposed on the third XY moving module 192 . The fixture 194 is used to place the substrate.

[0046] Specifically, the third XY movable module is similar to the first XY movable module 152 and the second XY movable module 162 mentioned above. It is composed of mutually perpendicular linear guides, a screw-nut transmission mechanism, and a drive motor, and can provide precise linear motion in the X-axis and Y-axis directions. The fixture 194 is installed on the third XY movable module 192. Its structure and shape are specially designed according to the type and size of the substrate to be bonded. It is used to place the substrate and ensure that the substrate maintains a stable position and posture during the bonding process. In actual application, before the bonding operation begins, the operator places the substrate on the fixture 194, and the fixture 194 firmly fixes the substrate through a specific positioning structure and clamping device. When the bonding arm 184 with the wafer adsorbed rotates to the position of the bonding table assembly 190, the high-precision linear motion capability of the third XY movable module 192 enables the substrate to be accurately moved to the position required for bonding, meeting the strict requirements of different bonding processes for substrate positioning accuracy.

[0047] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Those skilled in the art may modify the technical solutions described in the above embodiments, or make equivalent replacements for some of the technical features therein; and all these modifications and replacements should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A die bonding machine, characterized in that: include: A machine, a support frame arranged on the machine, a first material box assembly, a second material box assembly and a crystal bonding table assembly, the machine is also provided with a first wafer table assembly corresponding to the first material box assembly, and a second wafer table assembly corresponding to the second material box assembly, a wafer transfer assembly and a turret assembly are provided on the support frame, the wafer transfer assembly is used to place the wafers in the first material box assembly onto the first wafer table assembly, and place the wafers in the second material box assembly onto the second wafer table assembly; the turret assembly is used to bond the wafers on the first wafer table assembly and the second wafer table assembly to the substrate on the crystal bonding table assembly.

2. The die bonder according to claim 1, wherein: The turret assembly includes a rotating drive member arranged on the support frame, and a rotating shaft rotatably connected to the support frame. A plurality of arms are arranged in a circular array on the rotating shaft, and the end of each arm is connected to a ZR-axis motor. The ZR-axis motor is connected to a suction nozzle, and the suction nozzle is used to adsorb the chip.

3. The die bonder according to claim 2, wherein: The number of the bond arms is greater than or equal to 6, and the number of the bond arms is an even number.

4. The die bonder according to claim 3, characterized in that: Each arm is correspondingly provided with a number. The arm with an even number is used to absorb the wafer from the first wafer stage assembly or the second wafer stage assembly, and the arm with an odd number is used to absorb the wafer from the remaining one.

5. The die bonder according to claim 2, wherein: The wafer transfer assembly includes a linear transmission module arranged on the support frame, and a clamping mechanism arranged on the linear transmission module. The clamping mechanism can move back and forth between the first material box assembly and the second material box assembly for clamping wafers.

6. The die bonder according to claim 5, characterized in that: The first wafer stage assembly includes a first XY moving module arranged on the machine platform, and a first mounting plate arranged on the first XY moving module, a first rotating ring is rotatably arranged on the first mounting plate, and the first rotating ring is transmission-connected to a first driving motor arranged on the first mounting plate.

7. The die bonder according to claim 6, wherein: The second wafer stage assembly includes a second XY moving module arranged on the machine platform, and a second mounting plate arranged on the second XY moving module, a second rotating ring is rotatably arranged on the second mounting plate, and the second rotating ring is transmission-connected to a second driving motor arranged on the second mounting plate.

8. The die bonder according to any one of claims 1 to 7, characterized in that: The support frame is provided with a first crystal-taking lens module corresponding to the first wafer stage assembly, and a second crystal-taking lens module corresponding to the second wafer stage assembly; the support frame is also provided with a crystal-fixing lens module corresponding to the crystal-fixing stage assembly.

9. The die bonder according to any one of claims 2 to 7, characterized in that: The machine is also provided with a correction lens module, which is arranged on the side of the first wafer stage assembly or the second wafer stage assembly and is used to detect the wafer adsorbed on the suction nozzle.

10. The die bonder according to any one of claims 1 to 7, characterized in that: The crystal bonding table assembly includes a third XY moving module arranged on the machine platform, and a fixture arranged on the third XY moving module, wherein the fixture is used to place a substrate.

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