Semiconductor forming and transferring device

Abstract

The invention relates to the technical field of semiconductor processing, and particularly discloses a semiconductor forming and transferring device which comprises a transferring platform, a moving frame is connected to the transferring platform in a sliding mode, and a power part used for driving the moving frame to slide is arranged on the transferring platform; a bearing plate is vertically connected to the moving frame in a sliding manner, and a clamping part for clamping the lead frame is arranged on the bearing plate; a pressure applying part used for driving the clamping part to clamp the lead frame is mounted on the moving frame, and the pressure applying part is in sliding connection with the moving frame. The clamping part is driven by the bearing plate to move downwards, and after the bearing plate moves downwards to a set position and the pressure applying part continues to move downwards, the clamping part can be triggered to clamp the lead frame, so that the lead frame is conveniently fixed, the lead frame is conveniently transferred, and after the lead frame is fixed, the power part drives the lead frame to move downwards at the moment. And the power part drives the moving frame to slide on the transfer platform, so that the transfer operation of the lead frame can be realized.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, in particular to a semiconductor molding transfer device. Background Art

[0002] Semiconductors are materials with electrical conductivity between that of insulators and conductors. Specifically, they have electrical conductivity between conductors and insulators at room temperature. Their conductivity is easily controlled, making them suitable for use as components in information processing. Semiconductors are crucial from both a technological and economic perspective.

[0003] Semiconductors are widely used in radios, televisions, and temperature measurement. Diodes, for example, are devices made of semiconductors. Semiconductors are materials whose electrical conductivity can be controlled, ranging from insulators to conductors. Semiconductors are of immense importance from both a technological and economic perspective. The semiconductor component packaging process requires various equipment, such as laser scribing machines and slicers. As semiconductor applications become more widespread, the demand for semiconductor component packaging equipment is growing.

[0004] As the chip carrier of integrated circuits, the lead frame is a key structural component that uses bonding materials (gold wire, aluminum wire, copper wire) to achieve electrical connection between the internal circuit lead ends of the chip and the external leads to form an electrical circuit. It acts as a bridge connecting to external wires. Lead frames are required in most semiconductor integrated blocks and are an important basic material in the electronic information industry.

[0005] When performing steps such as patching, gluing, fixing jumpers, and testing, the lead frame needs to be transferred, so a transfer device is needed. Although existing transfer devices can transfer lead frames, the transfer method of existing transfer devices may mostly be a picking or grasping transfer method. Since the thickness of the lead frame is generally thin, the lead frame may cause physical pressure loss and bending during the picking or grasping transfer process, which may increase the probability of lead frame loss.

[0006] In order to solve the above technical problems, relevant patents have been proposed in the prior art, such as a Chinese patent with authorization announcement number 221327673U, entitled "A Semiconductor Lead Frame Transfer Device". The above patent discloses a semiconductor lead frame transfer device, comprising a base plate, a cross plate fixedly connected to the top of the base plate, slots being provided on the left and right sides of the top of the cross plate, a transfer mechanism being provided on the top of the base plate, the transfer mechanism comprising a tooth plate fixedly connected to the left and right sides of the top of the base plate, and a device box being provided on the top of the tooth plate.

[0007] In the above patent, the servo motor can drive the U-shaped plate forward, adsorbing the suction cup on the surface of the lead frame, so that the suction cup sucks up the lead frame, avoiding the physical pressure loss and bending of the lead frame during the transfer process of picking up or grabbing, and reducing the probability of lead frame loss. The existing technology such as the above patent can meet the needs of semiconductor lead frame transfer to a certain extent, but has the following shortcomings in actual use: first, the use of the suction cup to absorb the lead frame affects the stability of the lead frame during transfer to a certain extent; second, after the lead frame is transferred to a certain position, a specific mechanism needs to be used to drive the lead frame to rotate; finally, the existing technology such as the above patent can only perform the lead frame transfer operation within its established platform, which affects the scope of application of the transfer device and has certain shortcomings. Summary of the Invention

[0008] The object of the present invention is to provide a semiconductor molding transfer device to solve the problems raised in the above background technology.

[0009] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a semiconductor forming transfer device, comprising a transfer platform, a movable frame being slidably connected to the transfer platform, and a power part for driving the movable frame to slide is provided on the transfer platform; a carrying plate is vertically slidably connected to the movable frame, and a clamping part for clamping the lead frame is provided on the carrying plate; a pressure part for driving the clamping part to clamp the lead frame is installed on the movable frame, and the pressure part is slidably connected to the movable frame; a conveying member is also provided on one side of the transfer platform, and the movable frame is slidably connected to the conveying member.

[0010] Furthermore, the clamping part includes two groups of clamping rods slidably connected to the supporting plate, each group of clamping rods has two clamping rods, which are slidably connected to both sides of the supporting plate, and the corresponding two clamping rods are fixedly connected by a connecting rod; and a contact part is provided on the bottom of each clamping rod; a reset spring is provided between each connecting rod and the supporting plate, and the elastic force of the reset spring drives the corresponding two clamping rods away from each other.

[0011] Furthermore, the contact portion includes a first contact surface, a second contact surface and a third contact surface, and the third contact surface is in a horizontal state.

[0012] Furthermore, the pressure-applying part includes a mounting plate vertically slidably connected to the movable frame, a pressure unit is arranged between the mounting plate and the connecting rod, a pressure rod is fixedly connected to the mounting plate, and a servo motor is installed on the movable frame, and the output end of the servo cylinder is coaxially connected to the pressure rod; a positioning part is also arranged between the mounting plate and the movable frame.

[0013] Furthermore, the pressure unit includes a pressure block on the bottom of the fixed mounting plate, and each connecting rod is fixedly connected to a transmission plate, and a pressure groove adapted to the pressure block is opened on the transmission plate, and the pressure block intermittently abuts against the pressure groove.

[0014] Furthermore, the positioning portion includes multiple groups of limiting telescopic rods, which are respectively arranged between the supporting plate and the mounting plate, and a positioning spring is also arranged between the supporting plate and the mounting plate. The elastic force of the positioning spring drives the pressure block away from the pressure groove.

[0015] Furthermore, the power unit includes a screw rod rotatably connected to the transfer platform, and a threaded block is fixedly connected to the movable frame, and the threaded block is threadedly connected to the screw rod. A servo click is installed on the transfer platform, and the servo motor is coaxially connected to the screw rod.

[0016] Furthermore, a slide groove is provided on the transfer platform, and a plurality of groups of rollers are provided on the bottom of the movable frame, and the plurality of rollers move in the slide groove.

[0017] Furthermore, multiple groups of limiting members are arranged between the supporting plate and the movable frame. The limiting members include limiting blocks fixedly connected to the supporting plate, and the movable frame is provided with vertical grooves adapted to the limiting blocks, and the limiting blocks are slidably connected to the movable frame through the vertical grooves.

[0018] Furthermore, a transfer groove is provided on the transfer platform, and the conveying member is installed on one side of the transfer platform through the transfer groove.

[0019] Compared with the prior art, the beneficial effect of the present invention is as follows: the semiconductor forming transfer device, therefore, during use, when it is necessary to transfer the lead frame, at this moment, the pressure portion is first used to drive the carrier plate to move downward, and then the carrier plate can drive the clamping portion to move downward, after the carrier plate moves downward to a predetermined position, when the pressure portion continues to move downward, it can trigger the clamping portion to clamp the lead frame, thereby facilitating the fixation of the lead frame to facilitate the transfer of the lead frame, after the lead frame is fixed, at this moment, the power portion drives the movable frame to slide on the transfer platform, and the transfer operation of the lead frame can be realized. Since a conveying member is also provided on one side of the transfer platform, and the movable frame is slidably connected to the conveying member, when the movable frame slides on one side of the transfer platform, it can drive the lead frame to move to the position of the conveying member, at this moment, the lead frame is unlocked by the pressure portion and the clamping portion, and the lead frame at this moment will fall on the conveying member, and the lead frame can be transported to meet the work needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments described in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0021] Figure 1 A schematic diagram of the overall structure provided by an embodiment of the present invention; Figure 2 A schematic diagram of the overall structure from another perspective provided by an embodiment of the present invention; Figure 3 A schematic diagram of the structure of the conveying member in a hidden state provided by an embodiment of the present invention; Figure 4 A schematic diagram of the structure of the roller installation method provided in an embodiment of the present invention; Figure 5 A schematic diagram of the structure of the connection between the power unit and the mobile frame provided in an embodiment of the present invention; Figure 6 A schematic diagram of a movable frame angle structure provided by an embodiment of the present invention; Figure 7 A schematic diagram of the structure of the mobile rack in hidden state provided by an embodiment of the present invention; Figure 8 A top view of a hidden state of a movable frame provided by an embodiment of the present invention; Figure 9 for Figure 8 Schematic diagram of the cross-sectional structure along the middle line AA; Figure 10 for Figure 9 Schematic diagram of the enlarged structure of area A in the middle; Figure 11 A schematic structural diagram of a pressure-applying portion provided in an embodiment of the present invention; Figure 12 This is a schematic diagram of the clamping portion structure provided by an embodiment of the present invention.

[0022] Explanation of the accompanying drawings: 1. Transfer platform; 2. Moving frame; 3. Power unit; 31. Servo motor; 32. Screw rod; 33. Threaded block; 4. Loading plate; 5. Clamping unit; 51. Clamping rod; 52. Connecting rod; 53. Reset spring; 54. Contact unit; 541. First contact surface; 542. Second contact surface; 543. Third contact surface; 6. Pressure unit; 61. Pressure rod; 62. Pressure block; 63. Transmission plate; 64. Pressure groove; 65. Servo cylinder; 7. Positioning spring; 8. Limiting telescopic rod; 9. Roller; 10. Slide groove; 11. Transfer groove; 12. Conveying member. DETAILED DESCRIPTION

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0024] See also Figures 1-12 The present invention provides a technical solution: a semiconductor molding transfer device, comprising a transfer platform 1, a mobile frame 2 is slidably connected to the transfer platform 1, and the transfer platform 1 is provided with a power part 3 for driving the mobile frame 2 to slide; a carrying plate 4 is vertically slidably connected to the mobile frame 2, and the carrying plate 4 is provided with a clamping part 5 for clamping a lead frame; a pressure part 6 is installed on the mobile frame 2 for driving the clamping part 5 to clamp the lead frame, and the pressure part 6 is slidably connected to the mobile frame 2; a conveying member 12 is also provided on one side of the transfer platform 1, and the mobile frame 2 is slidably connected to the conveying member 12.

[0025] Specifically, a semiconductor forming transfer device includes a transfer platform 1, wherein a plurality of support members are provided on the bottom of the transfer platform 1, which can improve the stability of the transfer device during operation. A movable frame 2 is slidably connected to the transfer platform 1, and a power unit 3 for driving the movable frame 2 to slide is provided on the transfer platform 1, which can provide a power source for the sliding of the movable frame 2, thereby facilitating the movement of the lead frame and achieving better use effect. A supporting plate 4 is vertically slidably connected to the movable frame 2, and a clamping portion 5 for clamping the lead frame is provided on the supporting plate 4. When in use, the lead frame is clamped by the clamping portion 5, thereby enabling the lead frame to be moved to meet work needs. A pressure portion 6 for driving the clamping portion 5 to clamp the lead frame is installed on the movable frame 2, and the pressure portion 6 is slidably connected to the movable frame 2. A conveying member 12 is also provided on one side of the transfer platform 1, and the movable frame 2 is slidably connected to the conveying member 12. Therefore, during use, when the lead frame needs to be transferred, the pressure portion 6 is first used to drive the carrier plate 4 downward, and then the carrier plate 4 can drive the clamping portion 5 to move downward. After the carrier plate 4 moves downward to a predetermined position, when the pressure portion 6 continues to move downward, the clamping portion 5 can be triggered to clamp the lead frame, thereby facilitating the fixation of the lead frame to facilitate the transfer of the lead frame. After the lead frame is fixed, the power portion 3 is activated to drive the movable frame 2 to slide on the transfer platform 1, thereby realizing the transfer operation of the lead frame. Since a conveying member 12 is also provided on one side of the transfer platform 1, and the movable frame 2 is slidably connected to the conveying member 12, when the movable frame 2 slides on the side of the transfer platform 1, it can drive the lead frame to move to the position of the conveying member 12. At this moment, the lead frame is unlocked by the pressure portion 6 and the clamping portion 5, and the lead frame at this moment will fall on the conveying member 12, thereby realizing the transportation of the lead frame, meeting the work needs.

[0026] In the embodiment provided by the present invention, the clamping portion 5 includes two sets of clamping rods 51 slidably connected to the carrier plate 4. Each set of clamping rods 51 has two clamping rods 51, one slidably connected to each side of the carrier plate 4. The two corresponding clamping rods 51 are fixedly connected by a connecting rod 52. Each clamping rod 51 has a contact portion 54 at its bottom. A return spring 53 is provided between each connecting rod 52 and the carrier plate 4. The elastic force of the return spring 53 drives the two corresponding clamping rods 51 away from each other. Specifically, when the pressure portion 6 is applied, the two symmetrical clamping rods 51 are driven toward each other, clamping and securing the lead frame.

[0027] In the embodiment provided by the present invention, the contact portion 54 includes a first contact surface 541, a second contact surface 542 and a third contact surface 543. The third contact surface 543 is in a horizontal state. When the clamping rod 51 clamps the lead frame, the first contact surface 541 first contacts the lead frame, and then the lead frame is located on the third contact surface 543 through the second contact surface 542, that is, the lead frame area can be made horizontal, further improving the stability of the lead frame during clamping, and achieving better results.

[0028] In the embodiment provided by the present invention, the pressure-applying part 6 includes a mounting plate vertically slidably connected to the movable frame 2, a pressure unit is arranged between the mounting plate and the connecting rod 52, a pressure rod 61 is fixedly connected to the mounting plate, and a servo motor 31 is installed on the movable frame 2, and the output end of the servo cylinder 65 is coaxially connected to the pressure rod 61; a positioning part is also provided between the mounting plate and the movable frame 2, the pressure unit includes a pressure block 62 fixed on the bottom of the mounting plate, and each connecting rod 52 is fixedly connected to a transmission plate 63, and a pressure groove 64 adapted to the pressure block 62 is opened on the transmission plate 63, and the pressure block 62 is intermittently abutted against the pressure groove 64, and the positioning part includes multiple groups of limiting telescopic rods 8, and the multiple groups of limiting telescopic rods 8 are respectively arranged between the bearing plate 4 and the mounting plate, and a positioning spring 7 is also provided between the bearing plate 4 and the mounting plate, and the elastic force of the positioning spring 7 drives the pressure block 62 away from the pressure groove 64. Specifically, in actual use, the servo cylinder 65 is first used to drive the pressure rod 61 to drive the carrier plate 4 to move downward, so that the carrier plate 4 moves downward to a predetermined position. At this time, the servo cylinder 65 is started again. At this time, the servo cylinder 65 overcomes the elastic force of the positioning spring 7 and drives the pressure block 62 to move downward. When the pressure block 62 drives the transmission plate 63 to slide through the pressure groove 64, it can drive the connecting rod 52 to slide, and then drive the clamping rods 51 to approach each other to fix the lead frame.

[0029] In the embodiment provided by the present invention, the power unit 3 includes a screw rod 32 rotatably connected to the transfer platform 1, and a threaded block 33 is fixedly connected to the mobile frame 2, and the threaded block 33 is threadedly connected to the screw rod 32. A servo click is installed on the transfer platform 1, and the servo motor 31 is coaxially connected to the screw rod 32, so as to facilitate driving the mobile frame 2 to slide on the transfer platform 1 to meet work needs.

[0030] In the embodiment provided by the present invention, a slide groove 10 is provided on the transfer platform 1, and multiple groups of rollers 9 are provided on the bottom of the mobile frame 2. The multiple rollers 9 move in the slide groove 10, thereby effectively reducing the friction of the mobile frame 2 and achieving better results.

[0031] In the embodiment provided by the present invention, multiple groups of limiting parts are also arranged between the supporting plate 4 and the movable frame 2. The limiting parts include a limiting block fixedly connected to the supporting plate 4, and a vertical groove adapted to the limiting block is opened on the movable frame 2. The limiting block is slidably connected to the movable frame 2 through the vertical groove to meet working needs.

[0032] In the embodiment provided by the present invention, a transfer groove 11 is provided on the transfer platform 1 , and the conveying member 12 is installed on one side of the transfer platform 1 through the transfer groove 11 , thereby conveniently conveying the lead frame to a predetermined position.

[0033] It should be noted that the electrical equipment involved in this application can be powered by batteries or external power supply.

[0034] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "connected," etc., should be understood in a broad sense. For example, "connected" may refer to a fixed connection, a detachable connection, or an integral connection; it may refer to a mechanical connection or an electrical connection; it may refer to a direct connection or an indirect connection through an intermediate medium; it may refer to internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0035] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor molding transfer device, comprising a transfer platform (1), characterized in that: The transfer platform (1) is slidably connected to a moving frame (2), and the transfer platform (1) is provided with a power unit (3) for driving the moving frame (2) to slide; A carrier plate (4) is vertically slidably connected to the movable frame (2), and a clamping portion (5) for clamping the lead frame is provided on the carrier plate (4); The movable frame (2) is provided with a pressure portion (6) for driving the clamping portion (5) to clamp the lead frame, and the pressure portion (6) is slidably connected to the movable frame (2); A conveying member (12) is further provided on one side of the transfer platform (1), and the movable frame (2) is slidably connected to the conveying member (12).

2. The semiconductor molding transfer device according to claim 1, wherein: The clamping portion (5) comprises two groups of clamping rods (51) slidably connected to the supporting plate (4), each group of clamping rods (51) comprises two clamping rods, which are slidably connected to two sides of the supporting plate (4), and the corresponding two clamping rods (51) are fixedly connected via a connecting rod (52); A contact portion (54) is provided on the bottom of each clamping rod (51); a return spring (53) is provided between each connecting rod (52) and the supporting plate (4); and the elastic force of the return spring (53) drives the corresponding two clamping rods (51) away from each other.

3. The semiconductor molding transfer device according to claim 2, wherein: The contact portion (54) comprises a first contact surface (541), a second contact surface (542), and a third contact surface (543), and the third contact surface (543) is in a horizontal state.

4. The semiconductor molding transfer device according to claim 2, wherein: The pressure-applying portion (6) includes a mounting plate vertically slidably connected to the movable frame (2), a pressure-applying unit is provided between the mounting plate and the connecting rod (52), a pressure-applying rod (61) is fixedly connected to the mounting plate, a servo motor (31) is installed on the movable frame (2), and an output end of the servo cylinder (65) is coaxially connected to the pressure-applying rod (61); A positioning portion is also provided between the mounting plate and the movable frame (2).

5. The semiconductor molding transfer device according to claim 4, characterized in that: The pressure unit includes a pressure block (62) fixed on the bottom of the mounting plate, and each connecting rod (52) is fixedly connected to a transmission plate (63), and the transmission plate (63) is provided with a pressure groove (64) adapted to the pressure block (62), and the pressure block (62) and the pressure groove (64) are intermittently abutted.

6. The semiconductor molding transfer device according to claim 4, characterized in that: The positioning portion includes a plurality of groups of limiting telescopic rods (8), which are respectively arranged between the supporting plate (4) and the mounting plate, and a positioning spring (7) is also arranged between the supporting plate (4) and the mounting plate, and the elastic force of the positioning spring (7) drives the pressure block (62) away from the pressure groove (64).

7. The semiconductor molding transfer device according to claim 1, wherein: The power unit (3) includes a screw rod (32) rotatably connected to the transfer platform (1), and a threaded block (33) is fixedly connected to the movable frame (2), and the threaded block (33) is threadedly connected to the screw rod (32). A servo click is installed on the transfer platform (1), and the servo motor (31) is coaxially connected to the screw rod (32).

8. The semiconductor molding transfer device according to claim 1, wherein: A chute (10) is provided on the transfer platform (1), and a plurality of rollers (9) are provided on the bottom of the movable frame (2), and the plurality of rollers (9) move in the chute (10).

9. The semiconductor molding transfer device according to claim 1, wherein: A plurality of groups of limiting members are provided between the bearing plate (4) and the movable frame (2), wherein the limiting members include a limiting block fixedly connected to the bearing plate (4), and a vertical slot adapted to the limiting block is provided on the movable frame (2), and the limiting block is slidably connected to the movable frame (2) via the vertical slot.

10. The semiconductor molding transfer device according to claim 1, wherein: A transfer groove (11) is provided on the transfer platform (1), and the conveying member (12) is installed on one side of the transfer platform (1) through the transfer groove (11).

Images