Reflow soldering device in tire pressure sensor chip processing SMT (Surface Mount Technology) patch

Abstract

The invention belongs to the technical field of electronic device packaging, and particularly relates to a reflow soldering device in tire pressure sensor chip processing SMT (Surface Mount Technology) patch, which comprises four mutually symmetrical main support frames, a fixed support plate with an upward opening and integrally in a groove-shaped structure is fixed among the four main support frames, and a conveying mechanism is arranged in the middle of the upper surface of the fixed support plate; the conveying mechanism comprises conveying chains which synchronously advance on the two sides of the device and are equal in height. During use, when a long pin at a certain position needs to be subjected to repair welding during welding, only position coordinates need to be set in advance, and when the PCB body runs to the position above the tin repair mechanism, the gushing inner pipe can be driven to quickly reach the position of each pin, and then liquid solder paste is gushed to the pin point position; and more solder paste is adhered to the pins to form an effective welding machine, so that one-time welding forming can be ensured, and the welding efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic device packaging, and in particular to a reflow soldering device used in SMT (Surface Mounted Mounting) patch processing of a tire pressure sensor chip. Background Art

[0002] SMT reflow soldering is a soldering technique commonly used in electronic packaging, particularly in surface mount technology (SMT). It connects electronic components to printed circuit boards (PCBs) by melting solder and is widely used in the production of various electronic devices. First, solder paste (composed of solder powder and flux) is applied to the pads of the PCB. The paste is evenly applied to the pads using screen printing or other methods. An automated placement machine then precisely places electronic components (typically surface mount devices (SMDs)) onto the paste. Each component pin contacts the solder paste, creating a temporary contact. The PCB is then placed in a reflow oven, where the solder paste is heated and melted, then cooled to form solder joints, securing the component pins to the pads.

[0003] After searching, it is found that the welding method in the existing technology is to first apply solder paste on the PCB board, and then directly stick the electronic components on the corresponding points. However, during the fusion welding process, some tentacles will pass through the solder holes, and it is inevitable that the over-melted solder paste will be guided directly from the holes until it leaks, which will then lead to the phenomenon of cold solder joints. This requires further soldering in the later stage. Therefore, to address this phenomenon, we propose a new reflow soldering device that can prevent the occurrence of cold solder joints. Summary of the Invention

[0004] In view of the technical problem in the prior art that cold solder joints are easily generated when reflow soldering is performed on points with long antennae, the present invention adopts the following technical solution:

[0005] The reflow soldering device in the processing of tire pressure sensor chip SMT patches includes four mutually symmetrical main support frames, a fixed support plate with the same opening upward and an overall groove-shaped structure is fixed between the four main support frames, and a conveying mechanism is set in the middle of the upper surface of the fixed support plate, and the conveying mechanism includes conveying chains that move forward synchronously and at the same height on both sides of the device, and clamping mechanisms that are symmetrical and at the same height are reserved on the opposite sides of the two conveying chains. The two clamping mechanisms of the same height form a group and clamp the same PCB board body; a rectangular hole is opened in the middle of the bottom of the fixed support plate, and a flat plate is fixed on the lower surface of the fixed support plate below the rectangular hole. The surface positioning mechanism is provided with a support column on the upper surface of the plane positioning mechanism, which can be quickly positioned to any position on the horizontal plane; and a support block is fixed on the top of the support column, and a tin filling mechanism is fixed on the top of the support block; and the tin filling mechanism includes a molten tin barrel with an overall cylindrical cavity structure, and a vertical tube connected to the molten tin barrel is reserved at the top of the molten tin barrel, and a piston barrel is plugged into the circumferential outer wall of the molten tin barrel, and the barrel bottom of the piston barrel faces the inside of the molten tin barrel, and the barrel bottom of the piston barrel is respectively plugged with two one-way valves in opposite directions, and the outlet of one of the one-way valves is plugged with a gushing inner tube extending out of the vertical tube near the pin below the PCB board body.

[0006] A further configuration of the present invention is that an upper cover with the same opening in a downward groove-shaped structure is fixed between the top ends of the four main support frames, and a heating mechanism and an air cooler are provided in the middle of the upper cover, a combined air duct in the same direction as the PCB board body is fixed in the middle of the lower surface of the upper cover, and the air outlets of the heating mechanism and the air cooler are respectively connected to the air inlet of the combined air duct through a connecting pipe; through the provided combined air duct, heating mechanism and air cooler, the device is divided into a preheating section, a high-heat section and a cooling section, which is conducive to the efficient fusion of solder paste and electronic components.

[0007] A further arrangement of the present invention is that the tin replenishing mechanism also includes a supporting slide, and the lower surface of the molten tin barrel is fixed on the upper surface of the supporting slide; a motor frame is fixed on the upper surface of the supporting slide near the barrel mouth of the piston barrel, and a reduction motor is fixed on the top of the motor frame, a rotating wheel is fixed on the top of the output shaft of the reduction motor, and the disk surface of the rotating wheel is rotatably connected to a connecting rod near the circumferential edge; a piston disc is slidably connected to the inside of the piston barrel, and a hinge column is fixed on the middle side of the piston disc away from the barrel bottom, and the end of the hinge column is hinged to the other end of the connecting rod.

[0008] A further arrangement of the present invention is that a hot melt mechanism is provided at the bottom of the molten tin barrel, and the hot melt mechanism includes a heating ring that extends into the bottom of the molten tin barrel close to the inner wall and has an annular structure; a T-shaped slide is provided at the top of the support block, and a boss slide is slidably connected in the T-shaped slide, and an electric control positioning pin is embedded on the upper surface of the boss slide, and the top end of the extended shaft of the electric control positioning pin is fixed to the bottom end of the supporting slide; by providing the electric control positioning pin in combination with the plane positioning mechanism that can perform plane positioning, the top nozzle of the spouting inner tube can be quickly brought to the desired point, and the overflowed liquid solder paste can be stained on the pin. Form a repair weld; and a threaded hole is opened in the middle of the front side of the boss slide, and a T-shaped anti-slip rod with a mushroom head structure is fixed on the side of the boss slide away from the threaded hole, and the circumferential outer wall of the T-shaped anti-slip rod is slidably connected with a conical slip ring symmetrical with the mushroom head structure, and a reset spring is fixed between the conical slip ring and the boss slide; a vertical anti-twist sliding hole is fixed at one end of the bottom of the T-shaped slide groove away from the threaded hole, and a back-off plug is slidably connected in the anti-twist sliding hole, and a tightening spring is fixed to the bottom end of the back-off plug, and a spring stop is fixed to the bottom end of the tightening spring, and the spring stop is fixed on the vertical inner wall of the anti-twist sliding hole.

[0009] The present invention is further configured in that the conveying mechanism further comprises a fixed support plate fixed to the bottom of the fixed support plate groove near the middle and symmetrical to each other, and a horizontal beam support plate is fixed to the top of the fixed support plate, and the front and rear ends of the beam support plate are respectively fixed with side strips of mutually symmetrical strip-shaped structures, and two ends of the two side strips, i.e., the feeding end and the discharging end of the device, are provided with two mutually parallel transmission shafts, and the two ends of the two transmission shafts are respectively fixed with transmission sprockets, and the two conveyor chains are respectively sleeved on the four transmission sprockets; the middle of the side strip near the front is embedded There is a sliding bearing, and a discharging rod is slidably inserted in the sliding bearing, and a screw rod that matches the threaded hole is fixed to one end of the discharging rod close to the boss slide; an inspection port is opened at the upper oblique upper part of the upper cover close to the support block, and a cover plate is provided at the inspection port; a feeding port is provided on the upper surface of the molten tin barrel near the circumferential edge, and a plug is screwed in the feeding port; when in use, when the solder paste solution in the molten tin barrel is insufficient, it is only necessary to insert the discharging rod and engage the screw rod with the threaded hole, and then the tin replenishing mechanism can be dragged to the bottom of the feeding port to add solder paste.

[0010] A further configuration of the present invention is that a rectangular hole 2 corresponding to the rectangular hole 1 is opened in the middle of the beam support plate, directly above the rectangular hole 1, and balls are embedded in the lower surface of the support block near the four corners; this allows the support block to be positioned more smoothly and reduces friction loss.

[0011] The present invention is further arranged in that, described clamping mechanism comprises a connecting strip plate that is fixed on two adjacent chain shafts of conveyor chain horizontally, and the side of connecting strip plate is attached to and slides on side plate strip, described connecting strip plate is fixed with vertical trough type slide rail away from one end of conveyor chain, and the groove bottom of trough type slide rail is all fixed with spring baffle plate near two ends, the relative end of two described spring baffle plates is all fixed with compression spring, and the relative end of two compression springs is respectively fixed with slider one and slider two, slider one and slider two are respectively fixed with cantilever rod symmetrical to each other away from a side of groove bottom, and the relative side of two described cantilever rods is respectively provided with the anti-derail groove that opening is relative and symmetrical to each other; The inner extension rod that is symmetrical to each other in L-shaped structure is respectively slidably connected in the two anti-derail grooves, and the relative end of two described inner extension rods is respectively fixed with the anti-slip pressing strip that bites mutually; By so arranging, arbitrarily adjusting can be done according to the width range of PCB board body, to clamp target object.

[0012] A further configuration of the present invention is that a positioning nut is embedded in one end of the groove bottom of the two cantilever rods away from the groove bottom, and a positioning bolt is screwed into the positioning nut to lock the position of the inner extension rod after positioning.

[0013] A further configuration of the present invention is that slider 1 and slider 2 are provided with roller grooves near the cantilever rod and near the four corners on the side opposite thereto, and rollers are provided in the roller grooves; friction loss on the grooved slide rail can be reduced.

[0014] A further configuration of the present invention is that a heat shield is fixed to the middle part of the lower surface of the upper cover near both ends, and a gap is left between the bottom end of the heat shield and the PCB board body and the upper surface of the cantilever rod, and soft curtains are provided on both sides of the heat shield; and the width and position of the soft curtains are adapted to the position of the groove-type slide rail; to reduce heat loss; upturned shaft rod seats are provided on the front and rear sides of the fixed support plate near the four corners of the bottom end, and the shaft rod seats are adapted to the shaft head of the transmission sprocket.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. By setting up a plane positioning mechanism and a tin filling mechanism that can be quickly positioned as a whole, when a long pin at a certain place needs to be re-soldered during welding, it is only necessary to set the position coordinates in advance. When the PCB board body moves above the tin filling mechanism, it will drive the spray inner tube to quickly reach each pin position, and then spray liquid solder paste to the pin point to stick more solder paste to form an effective welding machine, thereby ensuring one-time welding and improving welding efficiency.

[0017] 2. By setting up a reduction motor and cooperating with two one-way valves in opposite directions, the top nozzle of the spray inner tube can spray out a steady stream of liquid solder paste, which not only prevents the solder paste from solidifying in the spray inner tube, but also allows the extended pins to be adhered to the liquid solder paste without touching the nozzle of the spray inner tube.

[0018] 3. By means of the anti-retraction plug plate and T-shaped anti-slip rod, when the boss slide needs to be pushed into the T-shaped slide groove as a whole and fixed, it is only necessary to continue to push the boss slide until the mushroom head passes the anti-retraction plug plate and falls between the mushroom head and the conical slip ring and is stuck; if the boss slide needs to be removed for feeding or maintenance, it is only necessary to continue to push it forward until the conical slip ring also passes the anti-retraction plug plate, and then pull the boss slide in the opposite direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0020] Figure 2 It is a side view of the present invention;

[0021] Figure 3 For the present invention Figure 2 Schematic diagram of the cross-sectional structure along line AA;

[0022] Figure 4 This is an assembly diagram of the upper cover and the heating mechanism of the present invention;

[0023] Figure 5 It is an assembly diagram of the conveying bracket and the conveying chain in the present invention;

[0024] Figure 6 An exploded view of the clamping mechanism of the present invention;

[0025] Figure 7 Schematic diagram of the overall structure of the tin replenishing mechanism in the present invention;

[0026] Figure 8 It is a side view of the tin filling mechanism in the present invention;

[0027] Figure 9 For the present invention Figure 8 Cross-sectional view along line BB;

[0028] Figure 10 This is a schematic diagram of a half-cut three-dimensional structure of a molten tin barrel in the present invention;

[0029] Figure 11 It is a schematic diagram of the overall structure of the assembly position of the tapered slip ring in the present invention.

[0030] In the figure: 1. Main support frame; 2. Shaft seat; 3. Drive sprocket; 4. Fixed support plate; 401. Rectangular hole 1; 5. Connecting strip plate; 6. Grooved slide rail; 7. Clamping mechanism; 701. Slider 1; 702. Slider 2; 703. Compression spring; 704. Cantilever rod; 705. Anti-derailment groove; 706. Inner extension rod; 707. Anti-slip pressure strip; 8. Soft door curtain; 9. Heat shield; 10. Air cooler; 11. Cover plate; 12. Heating mechanism; 13. Upper cover; 14. Conveyor chain; 15. Discharging rod; 16. Screw; 17. Support block; 171. Boss slide; 172. T-shaped slide groove; 173. T-shaped anti-slip rod; 174. Retraction plate; 175. Anti-twist sliding hole; 176. Spring stop; 177. Conical slip ring; 178. Return spring; 18. Fixed support plate; 19. Plane positioning mechanism; 191. Support column; 20. PCB board body; 21. Tin filling mechanism; 211. Support slide; 212. Gear motor; 213. Rotary wheel; 214. Piston barrel; 215. Melting tin barrel; 216. Spray inner tube; 217. Vertical tube; 218. Hot melt mechanism; 22. Side panel; 2201. Sliding bearing; 2202. Rectangular hole 2; 23. Beam support plate; 24. Air duct. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0032] like Figures 1 to 11As shown, the reflow soldering device in the tire pressure sensor chip processing SMT patch includes four mutually symmetrical main support frames 1, and a fixed support plate 4 with the same opening upward and an overall groove-shaped structure is fixed between the four main support frames 1, and a conveying mechanism is arranged in the middle of the upper surface of the fixed support plate 4, and the conveying mechanism includes conveying chains 14 that move forward synchronously and at the same height on both sides of the device, and clamping mechanisms 7 that are symmetrical and at the same height are reserved on opposite sides of the two conveying chains 14. The two clamping mechanisms 7 of the same height form a group and clamp the same PCB board body 20; a rectangular hole 401 is opened in the middle of the bottom of the fixed support plate 4, and a plane positioning mechanism 19 is fixed on the lower surface of the fixed support plate 4 below the rectangular hole 401, and a support column 19 is provided on the upper surface of the plane positioning mechanism 19, which can be quickly positioned to any position in the horizontal plane; and a support block 17 is fixed to the top of the support block 17, and a tin filling mechanism 21 is fixed to the top of the support block 17; and the tin filling mechanism 21 includes an entire The molten tin barrel 215 has a cylindrical cavity structure, and a vertical tube 217 is reserved at the top of the molten tin barrel 215 for communicating with the molten tin barrel 215. A piston barrel 214 is inserted into the outer circumferential wall of the molten tin barrel 215, and the bottom of the piston barrel 214 faces the interior of the molten tin barrel 215. Two one-way valves in opposite directions are respectively inserted into the bottom of the piston barrel 214, and the outlet of one of the one-way valves is inserted with a spray inner tube 216 extending from the vertical tube 217 close to the pin below the PCB board body 20; by providing a plane positioning mechanism 19 and a tin filling mechanism 21 that can be quickly positioned as a whole, when a long pin at a certain point needs to be repaired during welding, it is only necessary to set the position coordinates in advance. When the PCB board body 20 moves to the top of the tin filling mechanism 21, it will drive the spray inner tube 216 to quickly reach each pin position, and then spray liquid solder paste to the pin point, so that the pin is adhered with more solder paste to form an effective welding machine, thereby ensuring one-time welding and improving welding efficiency.

[0033] like Figure 1 、 Figure 3 and Figure 4 As shown, an upper cover 13 with the same opening downward in a groove-shaped structure is fixed between the top ends of the four main support frames 1, and a heating mechanism 12 and an air cooler 10 are provided in the middle of the upper cover 13. A combined air duct 24 that is consistent with the direction of the PCB board body 20 is fixed to the middle of the lower surface of the upper cover 13, and the air outlets of the heating mechanism 12 and the air cooler 10 are respectively connected to the air inlet of the combined air duct 24 through a connecting pipe; through the provided combined air duct 24, the heating mechanism 12 and the air cooler 10, the device is divided into a preheating section, a high-heat section and a cooling section, which is conducive to the efficient fusion of solder paste and electronic components.

[0034] like Figures 7 to 11As shown, the tin filling mechanism 21 also includes a supporting slide 211, and the lower surface of the molten tin barrel 215 is fixed to the upper surface of the supporting slide 211; a motor frame is fixed to the upper surface of the supporting slide 211 near the barrel mouth of the piston barrel 214, and a reduction motor 212 is fixed to the top of the motor frame, and a rotating wheel 213 is fixed to the top of the output shaft of the reduction motor 212, and the disk surface of the rotating wheel 213 is rotatably connected to a connecting rod near the circumferential edge; the interior of the piston barrel 214 is slidably connected to a piston disc, and a hinge column is fixed on the side of the middle of the piston disc away from the barrel bottom, and the end of the hinge column is hinged to the other end of the connecting rod; through the provision of the reduction motor 212, in conjunction with two one-way valves in opposite directions, the top nozzle of the spraying inner tube 216 can spray out a steady stream of liquid solder paste, which can not only prevent the solder paste from solidifying in the spraying inner tube 216, but also allow the extended pins to be adhered to the liquid solder paste when they do not touch the nozzle of the spraying inner tube 216.

[0035] A hot melt mechanism 218 is provided at the bottom of the molten tin barrel 215, and the hot melt mechanism 218 includes a heating ring that extends into the bottom of the molten tin barrel 215 and is close to the inner wall and has an annular structure; a T-shaped slot 172 is provided at the top of the support block 17, and a boss slide 171 is slidably connected in the T-shaped slot 172, and an electric control positioning pin is embedded on the upper surface of the boss slide 171, and the top end of the extended shaft of the electric control positioning pin is fixed to the bottom end of the support slide 211; the electric control positioning pin can be used to cooperate with the support block 17. The plane positioning mechanism 19 of the plane positioning can be combined to quickly move the top nozzle of the spouting inner tube 216 to the desired point, and the overflowed liquid solder paste can be applied to the pin to form a repair soldering; and a threaded hole is opened in the middle of the front of the boss slide 171, and a T-shaped anti-slip rod 173 with a mushroom head structure is fixed on the side of the boss slide 171 away from the threaded hole. The circumferential outer wall of the T-shaped anti-slip rod 173 is slidably connected to a conical slip ring 177 symmetrical to the mushroom head structure, and the conical slip ring A return spring 178 is fixed between 177 and the boss slide 171; a vertical anti-twist sliding hole 175 is fixed to the end of the bottom of the T-shaped sliding groove 172 away from the threaded hole, and a back-stop plug 174 is slidably connected to the anti-twist sliding hole 175, and a tightening spring is fixed to the bottom end of the back-stop plug 174, and a spring stopper 176 is fixed to the bottom end of the tightening spring, and the spring stopper 176 is fixed to the vertical inner wall of the anti-twist sliding hole 175; by setting the back-stop plug 174 and the T-shaped anti-slip Rod 173, when it is necessary to push the boss slide 171 as a whole into the T-shaped slide groove 172 and fix it, it is only necessary to continue to push the boss slide 171 until the mushroom head passes the anti-retraction plug plate 174 and falls between the mushroom head and the conical slip ring 177 to get stuck; if it is necessary to remove the boss slide 171 for adding materials or maintenance, it is only necessary to continue to push it forward until the conical slip ring 177 also passes the anti-retraction plug plate 174, and then pull the boss slide 171 in the opposite direction.

[0036] like Figures 2 to 6As shown, the conveying mechanism also includes a fixed support plate 18 fixed to the bottom of the fixed support plate 4 near the middle and symmetrical to each other, and a horizontal beam support plate 23 is fixed to the top of the fixed support plate 18, and the front and rear ends of the beam support plate 23 are respectively fixed with side panels 22 of mutually symmetrical strip-shaped structures, and two ends of the two side panels 22, namely the feeding end and the discharging end of the device, are provided with two mutually parallel transmission shafts, and the two ends of the two transmission shafts are respectively fixed with transmission sprockets 3, and the two conveying chains 14 are respectively sleeved on the four transmission sprockets 3; a sliding bearing 2201 is embedded in the middle of the side panel 22 near the front, and the sliding bearing 2201 A discharge rod 15 is inserted in the middle sliding part, and a screw 16 that is compatible with the threaded hole is fixed to the end of the discharge rod 15 near the boss slide 171; an inspection port is opened at the upper side of the upper cover 13 near the support block 17, and a cover plate 11 is provided at the inspection port; a feeding port is provided on the upper surface of the molten tin barrel 215 near the circumferential edge, and a plug is screwed in the feeding port; through the set discharge rod 15, when in use, when the solder paste solution in the molten tin barrel 215 is insufficient, it is only necessary to insert the discharge rod 15 and engage the screw 16 with the threaded hole, and then the tin replenishing mechanism 21 can be dragged to the bottom of the feeding port to add solder paste.

[0037] like Figure 3 and Figure 5 As shown, a rectangular hole 2202 corresponding to the rectangular hole 1 401 is provided in the middle of the crossbeam support plate 23, directly above the rectangular hole 1 401, and balls are embedded in the lower surface of the support block 17 near the four corners; this allows the support block 17 to be positioned more smoothly and reduce friction loss.

[0038] like Figure 4 and Figure 6 As shown, the clamping mechanism 7 includes a horizontal connecting strip 5 fixed on two adjacent chain shafts of the conveying chain 14, and the side of the connecting strip 5 slides on the side strip 22, and a vertical groove slide rail 6 is fixed to the end of the connecting strip 5 away from the conveying chain 14, and a spring baffle is fixed to the bottom of the groove of the groove slide rail 6 near both ends, and the opposite ends of the two spring baffles are fixed with compression springs 703, and the opposite ends of the two compression springs 703 are respectively fixed with a slider 1 701 and a slider 2 702, and the slider 1 701 and the slider 2 Block two 702 is respectively fixed with mutually symmetrical cantilever rod 704 on a side away from bottom of the groove, and two cantilever rods 704 are relative to one side and have opening relative and mutually symmetrical anti-derail groove 705; Two anti-derail grooves 705 are respectively slidably connected with mutually symmetrical inner extension rod 706 of L-shaped structure, and two inner extension rods 706 are relative to one end and are respectively fixed with mutually engaged anti-skid pressing strip 707; By so arranging, can arbitrarily adjust in the width range according to PCB board body 20, to clamp target object.

[0039] like Figure 6As shown, the ends of the two cantilever rods 704 away from the bottom of the groove are both embedded with positioning nuts, and positioning bolts are screwed into the positioning nuts to lock the position of the inner extension rod 706 after positioning.

[0040] Slider 1 701 and slider 2 702 are provided with roller grooves near the cantilever rod 704 and the four corners on the opposite side thereof, and rollers are provided in the roller grooves; friction loss on the grooved slide rail 6 can be reduced.

[0041] like Figure 3 and Figure 4 As shown, a heat shield 9 is fixed to the middle part of the lower surface of the upper cover 13 near both ends, and a gap is left between the bottom end of the heat shield 9 and the upper surface of the PCB board body 20 and the cantilever rod 704, and soft door curtains 8 are provided on both sides of the heat shield 9; and the width and position of the soft door curtains 8 are adapted to the position of the groove-shaped slide rail 6; to reduce heat loss; upturned shaft rod seats 2 are provided on the front and rear sides of the fixed support plate 4 near the four corners of the bottom end, and the shaft rod seats 2 are adapted to the shaft head of the transmission sprocket 3.

[0042] When using the present invention, first, the extension length of the inner extension rod 706 in each set of the clamping mechanism 7 is adjusted according to the width of the PCB body 20 until the edge of the PCB body 20 is just clamped; then, the PCB bodies 20 coated with solder paste and patch can be fed one by one from the loading end; when a long pin at a certain point needs to be re-soldered during soldering, it is only necessary to set the position coordinates in advance. When the PCB body 20 moves to the top of the soldering mechanism 21, it will drive the spraying inner tube 216 to quickly reach each pin position, and then spray solder to the pin point. Liquid solder paste is used to stick more solder paste on the pins to form an effective welder, thereby ensuring one-time welding. When the boss slide 171 needs to be pushed into the T-shaped slide groove 172 as a whole and fixed, it is only necessary to continue to push the boss slide 171 until the mushroom head passes the anti-retraction plug 174 and falls between the mushroom head and the conical slip ring 177 and is stuck. If the boss slide 171 needs to be removed for feeding or maintenance, it is only necessary to continue to push it forward until the conical slip ring 177 also passes the anti-retraction plug 174, and then pull the boss slide 171 in the opposite direction.

[0043] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A reflow soldering device for processing tire pressure sensor chip SMT patches, comprising four mutually symmetrical main support frames (1), a fixed support plate (4) with the same upward opening and an overall groove-shaped structure fixed between the four main support frames (1), and a conveying mechanism is provided in the middle of the upper surface of the fixed support plate (4), the conveying mechanism comprising conveying chains (14) that advance synchronously and at the same height on both sides of the device, characterized in that: The two conveyor chains (14) are respectively provided with symmetrical and equal-height clamping mechanisms (7) on opposite sides, and the two equal-height clamping mechanisms (7) form a group and clamp the same PCB board body (20); a rectangular hole (401) is opened in the middle of the bottom of the fixed support plate (4), and a plane positioning mechanism (19) is fixed on the lower surface of the fixed support plate (4) below the rectangular hole (401), and a support column (191) that can be quickly positioned to any position on the horizontal plane is provided on the upper surface of the plane positioning mechanism (19); and a support block (17) is fixed on the top of the support column (191), and the top of the support block (17) is fixed to the bottom of the fixed support plate (4). A tin replenishing mechanism (21) is fixed at the end; and the tin replenishing mechanism (21) includes a tin melting barrel (215) with an overall cylindrical cavity structure, a vertical pipe (217) in communication with the tin melting barrel (215) is reserved at the top of the tin melting barrel (215), a piston barrel (214) is plugged into the circumferential outer wall of the tin melting barrel (215), and the barrel bottom of the piston barrel (214) faces the inside of the tin melting barrel (215), and two one-way valves with opposite directions are respectively plugged into the barrel bottom of the piston barrel (214), and the outlet of one of the one-way valves is plugged into a gushing inner pipe (216) extending from the vertical pipe (217) close to the pin below the PCB board body (20).

2. The reflow soldering device for processing tire pressure sensor chip SMT patch according to claim 1, characterized in that: A top cover (13) with a downward opening and a groove-shaped structure is fixed between the top ends of the four main support frames (1), and a heating mechanism (12) and an air cooler (10) are arranged in the middle of the top cover (13). A combined air duct (24) having the same direction as the PCB board body (20) is fixed in the middle of the lower surface of the top cover (13), and the air outlets of the heating mechanism (12) and the air cooler (10) are respectively connected to the air inlet of the combined air duct (24) through a connecting pipe.

3. The reflow soldering device for processing tire pressure sensor chip SMT patch according to claim 1, characterized in that: The tin replenishing mechanism (21) further comprises a supporting slide (211), wherein the lower surface of the molten tin barrel (215) is fixed to the upper surface of the supporting slide (211); a motor frame is fixed to the upper surface of the supporting slide (211) near the barrel mouth of the piston barrel (214), and a reduction motor (212) is fixed to the top of the motor frame, a rotating wheel (213) is fixed to the top of the output shaft of the reduction motor (212), and the disk surface of the rotating wheel (213) is rotatably connected to a connecting rod near the circumferential edge; a piston disc is slidably connected to the inside of the piston barrel (214), and a hinge column is fixed to the middle side of the piston disc away from the barrel bottom, and the end of the hinge column is hinged to the other end of the connecting rod.

4. The reflow soldering device for processing tire pressure sensor chip SMT patch according to claim 1, characterized in that: A hot melt mechanism (218) is provided at the bottom of the molten tin barrel (215), and the hot melt mechanism (218) includes a heating ring extending into the bottom of the molten tin barrel (215) close to the inner wall and forming an annular structure; a T-shaped slide groove (172) is provided at the top of the support block (17), and a boss slide (171) is slidably connected in the T-shaped slide groove (172), and an electric control positioning pin is embedded in the upper surface of the boss slide (171), and the top end of the extended shaft of the electric control positioning pin is fixed to the bottom end of the supporting slide (211); and a threaded hole is provided in the middle of the front of the boss slide (171), and a T with a mushroom head structure is fixed on the side of the boss slide (171) away from the threaded hole. The T-shaped anti-slip rod (173) is provided, and the circumferential outer wall of the T-shaped anti-slip rod (173) is slidably connected to a conical slip ring (177) symmetrical to the mushroom head structure, and a reset spring (178) is fixed between the conical slip ring (177) and the boss slide (171); a vertical anti-twist sliding hole (175) is fixed to the end of the groove bottom of the T-shaped sliding groove (172) away from the threaded hole, and a stop plate (174) is slidably connected in the anti-twist sliding hole (175), a pressing spring is fixed to the bottom end of the stop plate (174), and a spring stopper (176) is fixed to the bottom end of the pressing spring, and the spring stopper (176) is fixed to the vertical inner wall of the anti-twist sliding hole (175).

5. The reflow soldering device for processing tire pressure sensor chip SMT patch according to claim 1, characterized in that: The conveying mechanism also includes a fixed support plate (18) fixed to the bottom of the fixed support plate (4) near the middle and symmetrical to each other, and the top of the fixed support plate (18) is fixed with a horizontal beam support plate (23), and the front and rear ends of the beam support plate (23) are respectively fixed with side strips (22) with symmetrical strip structures, and two ends of the two side strips (22), i.e., the feeding end and the discharging end of the device, are provided with two mutually parallel transmission shafts, and the two ends of the two transmission shafts are respectively fixed with transmission sprockets (3), and the two conveying chains (14) are respectively sleeved on the four transmission chains. On the sprocket (3); a sliding bearing (2201) is embedded in the middle of the side strip (22) near the front, and a discharge rod (15) is slidably inserted in the sliding bearing (2201), and a screw (16) adapted to the threaded hole is fixed to one end of the discharge rod (15) near the boss slide (171); an inspection port is opened on the upper cover (13) near the upper side of the support block (17), and a cover plate (11) is provided at the inspection port; a feeding port is provided on the upper surface of the molten tin barrel (215) near the circumferential edge, and a plug is screwed into the feeding port.

6. The reflow soldering device for processing tire pressure sensor chip SMT patch according to claim 5, characterized in that: A rectangular hole 2 (2202) corresponding to the rectangular hole 1 (401) is opened in the middle of the beam support plate (23) and located just above the rectangular hole 1 (401), and balls are embedded near the four corners of the lower surface of the support block (17).

7. The reflow soldering device for processing tire pressure sensor chip SMT patch according to claim 5, characterized in that: The clamping mechanism (7) includes a horizontal connecting strip (5) fixed on two adjacent chain shafts of the conveying chain (14), and the side of the connecting strip (5) slides on the side strip (22), and a vertical groove-shaped slide rail (6) is fixed to the end of the connecting strip (5) away from the conveying chain (14), and the groove bottom of the groove-shaped slide rail (6) is fixed near both ends, and the opposite ends of the two spring baffles are fixed with compression springs (703), and the opposite ends of the two compression springs (703) are respectively fixed with a slider. (701) and slider two (702), slider one (701) and slider two (702) are respectively fixed with mutually symmetrical cantilever rod (704) away from the side of groove bottom, and the relative side of two described cantilever rods (704) is respectively provided with opening relative and mutually symmetrical anti-derail groove (705); In the two anti-derail grooves (705), respectively slidably connected are mutually symmetrical inner extension rod (706) in L-shaped structure, and the relative end of two described inner extension rods (706) is respectively fixed with mutually engaged anti-skid pressing strip (707).

8. The reflow soldering device for processing tire pressure sensor chip SMT patch according to claim 7, characterized in that: The ends of the groove bottoms of the two cantilever rods (704) away from the groove bottoms are both embedded with positioning nuts, and positioning bolts are screwed into the positioning nuts.

9. The reflow soldering device for processing tire pressure sensor chip SMT patch according to claim 7, characterized in that: The slider 1 (701) and the slider 2 (702) are both provided with roller grooves near the cantilever rod (704) and the four corners on the opposite side thereof, and rollers are provided in the roller grooves.

10. The reflow soldering device for processing tire pressure sensor chip SMT patch according to any one of claims 7 to 9, characterized in that: A heat shield (9) is fixed to the middle of the lower surface of the upper cover (13) near both ends, and a gap is left between the bottom end of the heat shield (9) and the upper surface of the PCB board body (20) and the cantilever rod (704), and soft door curtains (8) are provided on both sides of the heat shield (9); and the width and position of the soft door curtains (8) are adapted to the position of the groove-shaped slide rail (6); and upturned shaft rod seats (2) are provided on the front and rear sides of the fixed support plate (4) near the four corners of the bottom end, and the shaft rod seats (2) are adapted to the shaft head of the transmission sprocket (3).

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