Refrigeration equipment, manufacturing method of vacuum barrier film, vacuum insulated panel and manufacturing method of vacuum insulated panel

Abstract

The invention relates to the technical field of vacuum heat insulation materials, and provides refrigeration equipment, a manufacturing method of a vacuum barrier film, a vacuum heat insulation plate and a manufacturing method of the vacuum heat insulation plate, and the manufacturing method of the vacuum barrier film comprises the steps that the environment where a base material and a getter are located is subjected to vacuum treatment; the base material and the getter are heated respectively, and the activated getter is deposited on the surface of the base material through an atomic layer deposition method to form the getter layer. Wherein the getter and the base material are integrally arranged, so that the production process is simplified to a certain extent, and the production cost is reduced; besides, the getter is uniformly plated on the surface of the base material, so that the contact area of the core material and the getter layer is increased, the gas adsorption efficiency and the vacuum maintaining capability are improved, gas leakage and water seepage of the membrane material can be effectively inhibited, and the space utilization rate of the VIP is optimized; in addition, by optimizing the thickness and distribution of the air suction layer, the heat insulation performance and long-term stability of the VIP can be improved, and therefore the service life of the VIP can be prolonged.

Description

Technical Field

[0001] The present invention relates to the technical field of vacuum thermal insulation materials, and in particular to a refrigeration device, a method for manufacturing a vacuum barrier film, a vacuum insulation panel and a method for manufacturing the same. Background Art

[0002] Vacuum insulation panels (VIPs) are a new type of insulation material that has rapidly developed in recent years. They utilize a high internal vacuum to reduce air convection, a low-conductivity core material to reduce solid heat conduction, and a highly reflective barrier film to suppress radiative convection while simultaneously maintaining a vacuum and insulating against water and air. This minimizes internal heat transfer, making them a widely used low-thermal-conductivity material in refrigerators, ships, aviation, and construction. In related technologies, the getter used in VIPs is typically packaged separately and placed inside the core material or along the edge of the film. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the related art. To this end, the present invention provides a method for manufacturing a vacuum barrier film, which realizes the integration of a getter and a substrate.

[0004] The present invention also provides a refrigeration device.

[0005] A method for manufacturing a vacuum barrier film according to an embodiment of the first aspect of the present invention includes: subjecting the substrate and the getter's environment to vacuum treatment; The substrate and the getter are heated separately, and the activated getter is deposited on the surface of the substrate by an atomic layer deposition method to form a getter layer.

[0006] According to one embodiment of the present invention, the step of subjecting the substrate and the getter to vacuum treatment includes: The substrate and the getter are placed in a vacuum chamber and evacuated to make the vacuum degree in the vacuum chamber equal to the target vacuum degree.

[0007] According to one embodiment of the present invention, the heating the substrate and the getter separately comprises: The getter is heated twice, wherein the first heating is used to degas the getter, and the second heating is used to activate the getter.

[0008] According to one embodiment of the present invention, heating the substrate and the getter separately, and depositing the activated getter on the surface of the substrate by atomic layer deposition to form a getter layer, comprises: placing the getter in a heating furnace, and heating the getter by the heating furnace to activate the getter; The activated getter is heated by the heating furnace so that getter atoms are deposited on the surface of the substrate to form the getter layer.

[0009] According to one embodiment of the present invention, after placing the getter in the heating furnace and before heating the getter in the heating furnace to activate the getter, the method further includes: The position of the heating furnace is adjusted so that the heating furnace and the substrate are arranged opposite to each other and the distance between the heating furnace and the substrate is equal to the target distance.

[0010] According to one embodiment of the present invention, heating the substrate and the getter separately, and depositing the activated getter on the surface of the substrate by atomic layer deposition to form a getter layer, comprises: Heating a target material by a sputtering coating device to activate the target material; wherein the target material is made by the getter; The activated target material is bombarded by the sputtering coating device so that getter atoms are deposited on the surface of the substrate to form the getter layer.

[0011] According to an embodiment of the second aspect of the present invention, a vacuum insulation panel comprises a vacuum barrier membrane and a vacuum insulation panel core material, wherein the vacuum insulation panel core material is vacuum-sealed in a space enclosed by the vacuum barrier membrane; wherein the vacuum barrier membrane is a vacuum barrier membrane obtained by the above-mentioned method for manufacturing the vacuum barrier membrane.

[0012] According to one embodiment of the present invention, the vacuum insulation panel core material includes: A plurality of fiber layers, wherein the plurality of fiber layers are stacked; A gas circulation network is provided between two adjacent fiber layers. The gas circulation network includes a gas circulation main pipe and a plurality of gas circulation branch pipe networks. The plurality of gas circulation branch pipe networks are connected to the gas circulation main pipe in sequence along the gas flow direction of the gas circulation main pipe. The gas circulation main pipe and each of the gas circulation branch pipe networks are provided with air inlets.

[0013] According to one embodiment of the present invention, each of the gas circulation branch pipelines includes a primary gas circulation pipeline and multiple secondary gas circulation pipelines, the primary gas circulation pipeline is connected to the gas circulation main pipeline, and the multiple secondary gas circulation pipelines are connected to the primary gas circulation pipeline in sequence along the gas flow direction of the primary gas circulation pipeline.

[0014] A method for manufacturing a vacuum insulation panel according to an embodiment of the third aspect of the present invention includes: The vacuum insulation panel core material is covered with the vacuum barrier film in a vacuum environment to form the vacuum insulation panel.

[0015] A refrigeration device according to a fourth embodiment of the present invention includes a box body and the above-mentioned vacuum insulation panel, wherein the vacuum insulation panel is installed in the box body.

[0016] The above one or more technical solutions in the embodiments of the present invention have at least one of the following technical effects: The getter and the substrate are integrated into one, and the getter does not need to be packaged separately, which simplifies the production process to a certain extent and reduces production costs. In addition, by evenly coating the getter on the surface of the substrate, the contact area between the core material and the getter layer is increased, which not only improves the gas adsorption efficiency and vacuum maintenance capacity, but also effectively suppresses air leakage and water seepage of the membrane material, and optimizes the space utilization of the VIP, solving the problems of space occupation and uneven distribution caused by separate packaging of getters in traditional VIPs. In addition, by optimizing the thickness and distribution of the getter layer, the thermal insulation performance and long-term stability of the VIP can be improved, thereby extending the service life of the VIP.

[0017] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the following briefly introduces the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 It is a flow chart of a method for manufacturing a vacuum barrier film provided by an embodiment of the present invention.

[0020] Figure 2 This is one of the manufacturing process diagrams of the vacuum barrier film provided in an embodiment of the present invention.

[0021] Figure 3 This is the second manufacturing process diagram of the vacuum barrier film provided in an embodiment of the present invention.

[0022] Figure 4 Schematic diagram of the structure of the vacuum insulation panel core material provided by an embodiment of the present invention.

[0023] Figure 5 This is one of the structural diagrams of the gas circulation network provided by the embodiment of the present invention.

[0024] Figure 6This is the second structural diagram of the gas circulation network provided by the embodiment of the present invention.

[0025] Figure 7 This is a flow chart of a method for manufacturing a vacuum insulation panel provided by an embodiment of the present invention.

[0026] Reference numerals: 1. Fiber layer; 2. Gas circulation network; 21. Gas circulation main pipe; 22. Gas circulation branch network; 221. Primary gas circulation pipeline; 222. Secondary gas circulation pipeline; 2221. Secondary gas circulation pipe body; 2222. Tertiary gas circulation pipe body; 23. Air inlet; 3. Heating furnace; 4. Getter; 5. Getter atoms; 6. Substrate; 7. Sputtering coating device; 8. Target material. DETAILED DESCRIPTION

[0027] The following embodiments of the present invention are described in further detail with reference to the accompanying drawings and examples. The following examples are used to illustrate the present invention but are not intended to limit the scope of the present invention.

[0028] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the embodiments of the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance.

[0029] In the description of the embodiments of the present invention, it should be noted that, unless otherwise specified or limited, the terms "connected" and "connection" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; and direct connections or indirect connections through an intermediary. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on the specific circumstances.

[0030] In the embodiments of the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, a first feature being "above," "above," or "above" a second feature may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. A first feature being "below," "below," or "below" a second feature may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0031] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiment of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0032] In the relevant technology, the vacuum barrier film is one of the core components of the vacuum insulation panel (VIP), and its main function is to maintain an internal high vacuum environment to prevent gas penetration and moisture intrusion. Common vacuum barrier films are composed of multi-layer composite materials. Although they have excellent barrier properties, they still face the problems of slow gas penetration and decreased internal vacuum during long-term use, which will cause the insulation performance of the VIP to gradually decay. The core material is the supporting structure of the VIP, and its main function is to provide mechanical strength and reduce solid heat conduction. The porous structure of the core material can significantly reduce gas heat conduction after vacuuming, but the residual gas and adsorbed moisture inside it will still affect the long-term performance of the VIP. Getter is a functional material in the VIP used to adsorb residual gas and moisture, which can maintain an internal high vacuum environment and extend the service life of the VIP. Getters are usually placed inside the core material or on the edge of the film material in the form of independent packaging. However, the independent packaging of getters has the following problems: Individually packaged getters occupy the effective volume of the core material, thus compromising the insulation performance of the VIP. Centralized getter placement can lead to localized saturation, reducing overall adsorption efficiency. Uneven getter distribution and low adsorption efficiency make it difficult to effectively handle long-term gas permeation. Once the getter reaches saturation, the insulation performance of the VIP decreases significantly. Individually packaging and installing getters increases the complexity and cost of the production process.

[0033] like Figure 1 、 Figure 2 and Figure 3 As shown, the method for manufacturing the vacuum barrier film according to the embodiment of the present invention includes: S100 , the environment where the substrate 6 and the getter 4 are located is subjected to vacuum treatment.

[0034] The environment in which the substrate 6 and the getter 4 are located is a vacuum environment, and for example, the vacuum degree may be 0.02-10 Pa. It should be noted that the entire manufacturing process of the vacuum barrier film is completed in a vacuum environment.

[0035] S200 , heating the substrate 6 and the getter 4 respectively, and depositing the activated getter 4 on the surface of the substrate 6 by an atomic layer deposition method to form a getter layer.

[0036] The substrate 6 and the getter 4 are subjected to corresponding heating processes, during which the substrate 6 can be degassed, and the getter 4 can be degassed and activated. After the heating process of the substrate 6 and the getter 4 is completed, the activated getter 4 is deposited on the surface of the substrate 6 by atomic layer deposition to form a getter layer. For example, the getter layer can be an active film layer of a single getter 4 formed using a single getter 4, or a composite getter 4 active film layer formed using multiple getters 4. It should be noted that the substrate 6 and the getter 4 can be heated separately using corresponding heating devices, that is, the substrate 6 and the getter 4 can be heated using different equipment.

[0037] In actual applications, the getter layer is directly formed on the substrate 6, that is, the getter 4 and the substrate 6 are integrated, and the getter 4 does not need to be packaged separately, which simplifies the production process to a certain extent and reduces the production cost. In addition, by uniformly coating the getter 4 on the surface of the substrate 6, the contact area between the core material and the getter layer is increased, which not only improves the gas adsorption efficiency and vacuum maintenance ability, but also effectively suppresses gas leakage and water seepage of the membrane material, and optimizes the space utilization of the VIP, solving the problems of space occupation and uneven distribution caused by the separate packaging of the getter 4 in the traditional VIP. In addition, by optimizing the thickness and distribution of the getter layer, the thermal insulation performance and long-term stability of the VIP can be improved, thereby extending the service life of the VIP.

[0038] In an optional embodiment, the substrate 6 and the getter 4 are subjected to a vacuum treatment, comprising: The substrate 6 and the getter 4 are placed in a vacuum chamber and evacuated to a target vacuum level. For example, the target vacuum level can be 0.02-10 Pa. The entire manufacturing process of the vacuum barrier film is completed in a vacuum chamber.

[0039] For example, the substrate 6 and the getter 4 are placed in a vacuum chamber. The chamber is evacuated to below 0.05 Pa to remove adsorbed gases and moisture on the surface of the material. The vacuum state is maintained for 1-2 hours to ensure that the surface of the material reaches a high vacuum environment.

[0040] It should be noted that the getter 4 can be any one of activated carbon, calcium sulfate, and aluminum oxide, or a mixture of at least two of these three substances. Specifically, it can be a mixture of activated carbon and calcium sulfate, a mixture of calcium sulfate and aluminum oxide, or a mixture of calcium sulfate and aluminum oxide. The mixing ratio is not specifically limited here. Of course, the getter 4 can also be a mixture of activated carbon, calcium sulfate, and aluminum oxide.

[0041] It is understood that before vacuum treatment, it is necessary to select a suitable substrate 6 material (such as stainless steel foil, aluminum foil, or polymer film) to ensure that its surface is clean and free of oil, dirt, and impurities. Furthermore, it is necessary to select a suitable getter 4 material and pre-grind it into powder or granules.

[0042] In an optional embodiment, heating the substrate 6 and the getter 4 separately comprises: The getter 4 is heated twice, wherein the first heating is used to degas the getter 4 , and the second heating is used to activate the getter 4 .

[0043] It should be noted that the substrate 6 only needs to be heated once, and the getter 4 needs to be heated twice. Of course, the getter 4 can also be heated only once. In this case, the degassing and activation of the getter 4 need to be completed in one heating process.

[0044] Exemplarily, the getter 4 is heated to 200-300° C. for 30-60 minutes to activate the adsorption performance of the getter 4. During the activation process, the oxide layer or impurities on the surface of the getter 4 are removed, and the adsorption capacity of the getter 4 is significantly enhanced.

[0045] In practical applications, the coating method of the getter layer can be evaporation coating or sputtering coating. The specific coating method depends on the properties of the getter 4 material. For example, for getter 4 materials with a lower melting point, evaporation coating can be used, while for getter 4 materials with a higher melting point, sputtering coating is suitable.

[0046] like Figure 2 As shown, the coating method of the getter layer is evaporation coating.

[0047] Specifically, the substrate 6 and the getter 4 are heated respectively, and the activated getter 4 is deposited on the surface of the substrate 6 by an atomic layer deposition method to form a getter layer, including: The getter 4 is placed in the heating furnace 3 and heated by the heating furnace 3 to activate the getter 4 .

[0048] The activated getter 4 is heated by the heating furnace 3 so that getter atoms 5 are deposited on the surface of the substrate 6 to form a getter layer.

[0049] Among them, the evaporation coating using the heating furnace 3 includes but is not limited to coil heating evaporation coating, laser heating evaporation coating and electron beam heating evaporation coating, and if the evaporation coating is performed using the heating furnace 3, only the upward deposition coating method can be used.

[0050] Specifically, after the vacuum degree of the vacuum chamber reaches the required level, the heating of the substrate 6 and the getter 4 is started at the same time, and degassing of the substrate 6 and the getter 4 is started. After the degassing is completed, the getter 4 needs to be further activated; after the getter 4 is activated, it is continued to be heated, and after the saturated vapor pressure of the getter 4 is reached, the active getter atoms 5 begin to evaporate outward; after reaching the surface of the substrate 6, the beam of evaporated active getter atoms 5 is evenly deposited on the surface of the substrate 6 until it covers the entire substrate 6 to form the required getter layer.

[0051] In an optional embodiment, after placing the getter 4 in the heating furnace 3 and before heating the getter 4 in the heating furnace 3 to activate the getter 4, the process further includes: The position of the heating furnace 3 is adjusted so that the heating furnace 3 and the substrate 6 are arranged opposite to each other, and the distance between the heating furnace 3 and the substrate 6 is equal to the target distance.

[0052] It should be noted that the distance between the heating furnace 3 and the substrate 6 is adjusted according to the area of the substrate 6 so that the active getter atoms 5 can be evenly coated on the surface of the substrate 6. In addition, the distance between the heating furnace 3 and the substrate 6, the temperature of the heating furnace 3, and the heating time can be adjusted accordingly according to the size, thickness, and uniformity of the getter layer to ensure that the various parameters of the prepared getter layer meet the requirements.

[0053] It should be noted here that before placing the getter 4 in the heating furnace 3 , the position of the heating furnace 3 may be adjusted so that the distance between the heating furnace 3 and the substrate 6 is equal to the target distance.

[0054] like Figure 3 As shown, the getter layer is deposited by sputtering.

[0055] Specifically, the substrate 6 and the getter 4 are heated respectively, and the activated getter 4 is deposited on the surface of the substrate 6 by an atomic layer deposition method to form a getter layer, including: The target material 8 is heated by the sputtering coating device 7 to activate the target material 8; wherein the target material 8 is made by the getter 4; The activated target material 8 is bombarded by the sputtering coating device 7 so that the getter atoms 5 are deposited on the surface of the substrate 6 and form a getter layer.

[0056] Among them, the sputtering source includes but is not limited to a sputtering target gun, a sputtering target material, an electromagnet, an electron source filament and a sputtering gas, etc., and the sputtering coating includes but is not limited to magnetron sputtering coating and the like. Moreover, if the target material 8 is used for sputtering coating, both upward coating and downward coating are possible.

[0057] Specifically, after the vacuum degree of the vacuum chamber reaches the requirement, the heating of the substrate 6 and the target material 8 is started at the same time, and the degassing of the substrate 6 and the target material 8 is started. After the degassing is completed, the target material 8 needs to be further activated; the activated target material 8 is bombarded by the sputtering coating device 7, and the active getter atoms 5 begin to sputter outward; after reaching the surface of the substrate 6, the beam of sputtered active getter atoms 5 is evenly deposited on the surface of the substrate 6 until it covers the entire substrate 6 to form the required getter layer.

[0058] In an optional embodiment, after the target material 8 is placed in the sputtering coating device 7 and before the target material 8 is heated by the sputtering coating device 7, the method further includes: The position of the sputtering coating device 7 is adjusted so that the sputtering coating device 7 and the substrate 6 are arranged opposite to each other, and the distance between the sputtering coating device 7 and the substrate 6 is equal to the target distance.

[0059] It should be noted that the distance between the sputtering coating device 7 and the substrate 6 is adjusted according to the area of the substrate 6 so that the active getter atoms 5 can be evenly coated on the surface of the substrate 6. In addition, the distance between the sputtering coating device 7 and the substrate 6, the power of the sputtering coating device 7, and the sputtering time can be adjusted accordingly according to the size, thickness, and uniformity of the getter layer so that the various parameters of the prepared getter layer (such as position, shape, size, and thickness) meet the requirements.

[0060] In addition, an embodiment of the present invention further provides a vacuum insulation panel, comprising a vacuum barrier film and a vacuum insulation panel core material, wherein the vacuum insulation panel core material is vacuum-sealed in a space enclosed by the vacuum barrier film; wherein the vacuum barrier film is a vacuum barrier film obtained by a vacuum barrier film manufacturing method.

[0061] Specifically, since the vacuum insulation panel includes the vacuum barrier membrane as described above, the specific structure of the vacuum barrier membrane refers to the above embodiment, and the vacuum insulation panel shown in this embodiment includes all the technical solutions of the above embodiment, and therefore has at least all the beneficial effects achieved by all the above technical solutions, which will not be repeated here.

[0062] like Figure 4 and Figure 5 As shown, the core material of the vacuum insulation panel according to an embodiment of the present invention includes: multiple fiber layers 1 and a gas circulation network 2. The multiple fiber layers 1 are stacked; the gas circulation network 2 is sandwiched between two adjacent fiber layers 1. The gas circulation network 2 includes a gas circulation main 21 and multiple gas circulation branch pipe networks 22. The multiple gas circulation branch pipe networks 22 are sequentially connected to the gas circulation main 21 along the gas flow direction of the gas circulation main 21. The gas circulation main 21 and each gas circulation branch pipe network 22 are provided with an air inlet 23.

[0063] It should be noted that multiple fiber layers 1 are stacked to form the main body of the vacuum insulation panel core material. The material of the fiber layer 1 can be glass fiber, ceramic fiber or organic fiber (such as polyester fiber). The number of fiber layers 1 can be selected according to the insulation requirements and is not specifically limited here.

[0064] It is understood that the gas circulation network 2 is responsible for collecting components such as water vapor, small molecular gases, and large molecular gases adsorbed on the surfaces and interiors of the two adjacent fiber layers 1. The gas circulation network 2 can cover the entire cross-section of the fiber layer 1. The gas circulation network 2 includes a gas circulation main pipe 21 and multiple gas circulation branch pipe networks 22. In other words, the gas collected by each gas circulation branch pipe network 22 can enter the gas circulation main pipe 21 and be discharged through the gas circulation main pipe 21. This ensures that the gas flows in a certain direction and improves the gas discharge efficiency.

[0065] It is particularly important to point out that in order to improve the gas collection effect, the number of gas circulation pipes 2 can be multiple. For example, a gas circulation pipe 2 is arranged between two adjacent fiber layers 1, or each fiber layer 1 is sandwiched between two gas circulation pipes 2, and two adjacent fiber layers 1 can share one gas circulation pipe 2.

[0066] It should be noted that gas enters the branch gas circulation network 22 through the air inlet holes 23 on the branch gas circulation network 22. Gas can also enter the main gas circulation network 21 through the air inlet holes 23 on the main gas circulation network 21, thereby improving exhaust efficiency. Furthermore, the main gas circulation network 21 may not be provided with the air inlet holes 23, and only the branch gas circulation network 22 may be provided with the air inlet holes 23.

[0067] In practice, the gas circulation network 2 is positioned between two adjacent fiber layers 1, creating a network of tiny gas channels within the vacuum insulation panel core. This guides the efficient flow of gas deep within the core, significantly improving the fluidity of gas molecules. This effectively facilitates the rapid discharge of gas from the core without changing the existing production process or the overall core structure, thereby increasing the ultimate vacuum level of the vacuum insulation panel (VIP) and ultimately further reducing thermal conductivity.

[0068] In order to improve the gas collection efficiency, such as Figure 4 and Figure 5 As shown, each gas circulation branch network 22 includes a primary gas circulation pipeline 221 and multiple secondary gas circulation pipelines 222. The primary gas circulation pipeline 221 is connected to the gas circulation main pipe 21, and the multiple secondary gas circulation pipelines 222 are connected to the primary gas circulation pipeline 221 in sequence along the gas flow direction of the primary gas circulation pipeline 221.

[0069] It should be noted that the plurality of primary gas circulation pipelines 221 are sequentially connected to the gas circulation main pipe 21 along the length direction of the gas circulation main pipe 21. For example, there are four primary gas circulation pipelines 221, which are sequentially spaced apart along the length direction of the gas circulation main pipe 21. Two of the four primary gas circulation pipelines 221 are located on one side of the gas circulation main pipe 21, and the other two of the four primary gas circulation pipelines 221 are located on the other side of the gas circulation main pipe 21. In other words, the first and third primary gas circulation pipelines 221, 221, of the four primary gas circulation pipelines 221 are located on the same side, and the second and fourth primary gas circulation pipelines 221, 221, of the four primary gas circulation pipelines 221 are located on the same side.

[0070] It is understood that the primary gas circulation pipeline 221 serves as a secondary main channel for the branch gas circulation pipeline network 22. The secondary gas circulation pipelines 222 are sequentially connected along the gas flow direction of the primary gas circulation pipeline 221 to form a multi-branch structure. The arrangement of the secondary gas circulation pipeline 222 relative to the primary gas circulation pipeline 221 can be referred to as the arrangement of the primary gas circulation pipeline 221 relative to the main gas circulation pipeline 21, and will not be further described here.

[0071] It is particularly important to point out that each gas circulation branch network 22 may only include a primary gas circulation pipeline 221 , that is, the gas circulation branch network 22 may not include a secondary gas circulation pipeline 222 .

[0072] In order to further improve the gas collection efficiency, such as Figure 4 、 Figure 5 and Figure 6 As shown, each secondary gas circulation pipeline 222 includes a secondary gas circulation pipe body 2221 and multiple tertiary gas circulation pipe bodies 2222. The secondary gas circulation pipe body 2221 is connected to the primary gas circulation pipeline 221, and the multiple tertiary gas circulation pipe bodies 2222 are connected to the secondary gas circulation pipe body 2221 in sequence along the gas flow direction of the secondary gas circulation pipe body 2221.

[0073] It should be noted that the secondary gas circulation pipe body 2221 serves as the tertiary main channel of the gas circulation branch pipe network 22. The tertiary gas circulation pipe bodies 2222 are sequentially connected along the gas flow direction of the secondary gas circulation pipe body 2221 to form a multi-branch structure. The arrangement of the tertiary gas circulation pipe bodies 2222 relative to the secondary gas circulation pipe body 2221 can be referred to as the arrangement of the secondary gas circulation pipeline 222 relative to the primary gas circulation pipeline 221, and will not be further described here.

[0074] It is particularly important to note that the tertiary gas circulation pipe body 2222 can further serve as a fourth-level main channel in the gas circulation branch pipe network 22. Its structure not only includes the pipe body itself, but also allows for the addition of branches to the pipe body. Based on this design logic, the gas circulation pipe network 2 can be iteratively extended to form a multi-level branching system. By adopting a bionic fractal structure similar to the shape of a tree, the macro-architecture of the gas circulation pipe network 2 is optimized, and its branching levels are gradually refined and interconnected, thereby significantly increasing the contact area between the gas circulation pipe network 2 and the fiber layer 1 and improving gas collection efficiency.

[0075] like Figure 4 、 Figure 5 and Figure 6 As shown, the primary gas circulation pipeline 221 is arranged at an acute angle to the main gas circulation pipe 21. Exemplarily, the angle between the primary gas circulation pipeline 221 and the main gas circulation pipe 21 is 30 degrees, 40 degrees, 50 degrees, or 60 degrees. Similarly, the angle between the secondary gas circulation pipe body 2221 and the primary gas circulation pipe body 221 is 30 degrees, 40 degrees, 50 degrees, or 60 degrees. Similarly, the angle between the tertiary gas circulation pipe body 2222 and the secondary gas circulation pipe body 2221 is 30 degrees, 40 degrees, 50 degrees, or 60 degrees.

[0076] It should be noted that the connection points between the primary gas flow line 221 and the main gas flow line 21, the connection points between the secondary gas flow line 222 and the primary gas flow line 221, and the connection points between the tertiary gas flow tube body 2222 and the secondary gas flow tube body 2221 are collectively referred to as intersection nodes. These nodes adopt a "Y-shaped" bifurcated structure to reduce gas flow resistance, avoid turbulence caused by right-angle turns, and improve channel connectivity.

[0077] In addition, the cross-sections of the gas circulation main pipe 21, the first-level gas circulation pipeline 221, the second-level gas circulation pipe body 2221 and the third-level gas circulation pipe body 2222 are all set to be quasi-circular (such as circular or elliptical) to reduce the friction resistance between the gas and the pipe wall, thereby significantly improving the gas flow efficiency.

[0078] In practice, the inner wall of the main gas circulation pipe 21 is provided with a first spiral groove that spirally extends along its length. Similarly, the inner wall of the primary gas circulation pipe 221 is provided with a second spiral groove that spirally extends along its length. Similarly, the inner wall of the secondary gas circulation pipe 222 is provided with a third spiral groove that spirally extends along its length. In other words, the inner walls of the secondary gas circulation pipe 2221 and the tertiary gas circulation pipe 2222 are provided with a third spiral groove that spirally extends along their length.

[0079] Specifically, the inner wall of the gas circulation main pipe 21 is provided with a first spiral groove along its length, which guides the gas into a swirling flow through the spiral morphology. A second spiral groove is provided along the inner wall of the primary gas circulation pipe 221, which works in conjunction with the first spiral groove of the gas circulation main pipe 21 to enhance the local turbulence intensity. Third spiral grooves are also provided on the inner walls of both the secondary gas circulation pipe body 2221 and the tertiary gas circulation pipe body 2222, extending in a spiral along their length to form a multi-stage turbulence-inducing structure. In other words, by providing spiral grooves on the inner wall, the gas is forced to produce a spiral motion during flow, significantly enhancing the turbulence effect.

[0080] In an optional embodiment, the diameter of the gas circulation main pipe 21 is less than or equal to 1 mm, and the wall thickness is greater than or equal to 50 μm and less than or equal to 100 μm. Exemplarily, the diameter of the gas circulation main pipe 21 is 0.2 mm, 0.5 mm, 0.7 mm or 1 mm, and the wall thickness of the gas circulation main pipe 21 is 50 μm, 60 μm, 80 μm or 100 μm. Similarly, the diameter of the primary gas circulation pipe 221 is less than or equal to 1 mm, and the wall thickness is greater than or equal to 50 μm and less than or equal to 100 μm. Similarly, the diameter of the secondary gas circulation pipe 222 is less than or equal to 1 mm, and the wall thickness is greater than or equal to 50 μm and less than or equal to 100 μm. In other words, the diameter of the secondary gas circulation pipe body 2221 and the tertiary gas circulation pipe body 2222 is less than or equal to 1 mm, and the wall thickness is greater than or equal to 50 μm and less than or equal to 100 μm.

[0081] It should be noted that the diameter of the gas circulation main pipe 21, the diameter of the first-level gas circulation pipeline 221, the diameter of the second-level gas circulation pipe body 2221 and the diameter of the third-level gas circulation pipe body 2222 can be equal, and the wall thickness of the gas circulation main pipe 21, the wall thickness of the first-level gas circulation pipeline 221, the wall thickness of the second-level gas circulation pipe body 2221 and the wall thickness of the third-level gas circulation pipe body 2222 can be equal.

[0082] In an optional embodiment, the diameter of the air inlet hole 23 is greater than or equal to 10 μm and less than or equal to 50 μm. For example, the air inlet hole 23 may be a circular hole, a square hole, or an elliptical hole, and the diameter of the air inlet hole 23 is 10 μm, 20 μm, 30 μm, 40 μm, or 50 μm. Furthermore, the air inlet holes 23 on the main gas circulation pipe 21, the air inlet holes 23 on the primary gas circulation pipe 221, the secondary gas circulation pipe body 2221, and the air inlet holes 23 on the tertiary gas circulation pipe body 2222 may have the same diameter.

[0083] In an optional embodiment, the density of the air inlet holes 23 is 200-500 holes / cm 2 For example, the density of the air inlet holes 23 is 200 holes / cm 2 , 300 holes / cm 2 , 400 holes / cm 2 or 500 pores / cm 2 .

[0084] In an optional embodiment, the gas circulation pipe network 2 is made of an organic polymer material, a metal material, or a ceramic material. The organic polymer material may be PTFE (polytetrafluoroethylene), ABS (acrylonitrile-butadiene-styrene), PI (polyimide), PS (polystyrene), etc.

[0085] In addition, if Figure 7 As shown, the method for manufacturing the vacuum insulation panel according to the embodiment of the present invention includes: S300: Covering the core material of the vacuum insulation panel with a vacuum barrier film in a vacuum environment to form a vacuum insulation panel. The vacuum insulation panel can also be manufactured in a vacuum chamber.

[0086] It should be noted that the core material of the vacuum insulation panel may be pre-vacuumed before being covered with the vacuum barrier film, and further vacuumed again after being covered with the vacuum barrier film.

[0087] For example, the process of evacuating the space enclosed by the vacuum barrier film may include two evacuation cycles. The first evacuation cycle is performed after the core material of the vacuum insulation panel is placed in the space enclosed by the vacuum barrier film. When the internal air pressure reaches 0.02-10 Pa, the vacuum barrier film is encapsulated to form a closed space. The second evacuation cycle is performed after the vacuum insulation panel, which has been encapsulated, is allowed to stand at room temperature for a period of time, which may be 24 hours or longer. After the panel has stood still, it is cut open along the seal and placed in a vacuum chamber. A second evacuation cycle is performed. When the internal air pressure reaches 0.02-10 Pa again, the panel is sealed again to produce the vacuum insulation panel of the embodiment of the present invention.

[0088] In addition, an embodiment of the present invention further provides a refrigeration device including a box and a vacuum insulation panel, wherein the vacuum insulation panel is installed in the box. The refrigeration device can be a refrigerator, a freezer, a cold storage room, a refrigerated transport vehicle, etc., which are not specifically limited here.

[0089] Specifically, since the refrigeration equipment includes the vacuum insulation panel as above, the specific structure of the vacuum insulation panel refers to the above embodiment, and the refrigeration equipment shown in this embodiment includes all the technical solutions of the above embodiment, and therefore has at least all the beneficial effects achieved by all the above technical solutions, which will not be repeated here.

[0090] In some embodiments of the present invention, the vacuum insulation panels are used in ships as thermal insulation materials. In some embodiments of the present invention, the vacuum insulation panels are used in aircraft equipment as thermal insulation materials. In some embodiments of the present invention, the vacuum insulation panels are used in building materials as thermal insulation materials. These ships, aircraft equipment, or building materials possess all the features and advantages of the vacuum insulation panels described above.

[0091] Finally, it should be noted that the above embodiments are intended to illustrate the present invention only and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the embodiments, it should be understood by those skilled in the art that various combinations, modifications, or equivalent substitutions of the technical solutions of the present invention do not depart from the spirit and scope of the technical solutions of the present invention and are intended to be encompassed by the claims of the present invention.

Claims

1. A method for manufacturing a vacuum barrier film, characterized in that: include: subjecting the substrate (6) and the getter (4) to a vacuum treatment; The substrate (6) and the getter (4) are heated respectively, and the activated getter (4) is deposited on the surface of the substrate (6) by an atomic layer deposition method to form a getter layer.

2. The method for manufacturing a vacuum barrier film according to claim 1, wherein: The vacuum treatment of the substrate (6) and the getter (4) comprises: The substrate (6) and the getter (4) are placed in a vacuum chamber and evacuated to make the vacuum degree in the vacuum chamber equal to the target vacuum degree.

3. The method for manufacturing a vacuum barrier film according to claim 1, wherein: The step of heating the substrate (6) and the getter (4) separately comprises: The getter (4) is heated twice, wherein the first heating is used to degas the getter (4) and the second heating is used to activate the getter (4).

4. The method for manufacturing a vacuum barrier film according to claim 1, wherein: The step of heating the substrate (6) and the getter (4) separately and depositing the activated getter (4) on the surface of the substrate (6) by an atomic layer deposition method to form a getter layer comprises: placing the getter (4) in a heating furnace (3), and heating the getter (4) by the heating furnace (3) to activate the getter (4); The activated getter (4) is heated by the heating furnace (3) so that atoms of the getter (4) are deposited on the surface of the substrate (6) to form the getter layer.

5. The method for manufacturing a vacuum barrier film according to claim 4, wherein: After placing the getter (4) in the heating furnace (3), and before heating the getter (4) by the heating furnace (3) to activate the getter (4), the method further includes: The position of the heating furnace (3) is adjusted so that the heating furnace (3) and the substrate (6) are arranged relative to each other, and the distance between the heating furnace (3) and the substrate (6) is equal to the target distance.

6. The method for manufacturing a vacuum barrier film according to claim 1, wherein: The step of heating the substrate (6) and the getter (4) separately and depositing the activated getter (4) on the surface of the substrate (6) by an atomic layer deposition method to form a getter layer comprises: The target material (8) is heated by a sputtering coating device (7) to activate the target material (8); wherein the target material (8) is prepared by the getter (4); The activated target material (8) is bombarded by the sputtering coating device (7) so that atoms of the getter (4) are deposited on the surface of the substrate (6) to form the getter layer.

7. A vacuum insulation panel, characterized in that: It comprises a vacuum barrier film and a vacuum insulation panel core material, wherein the vacuum insulation panel core material is vacuum-sealed in a space enclosed by the vacuum barrier film; Wherein, the vacuum barrier film is a vacuum barrier film obtained by the method for manufacturing a vacuum barrier film according to any one of claims 1 to 6.

8. The vacuum insulation panel according to claim 7, wherein: The vacuum insulation panel core material comprises: A plurality of fiber layers (1), wherein the plurality of fiber layers (1) are stacked; A gas circulation pipe network (2), the gas circulation pipe network (2) is sandwiched between two adjacent fiber layers (1), the gas circulation pipe network (2) comprises a gas circulation main pipe (21) and a plurality of gas circulation branch pipe networks (22), the plurality of gas circulation branch pipe networks (22) are sequentially connected to the gas circulation main pipe (21) along the gas flow direction of the gas circulation main pipe (21), and the gas circulation main pipe (21) and each of the gas circulation branch pipe networks (22) are provided with an air inlet hole (23).

9. The vacuum insulation panel according to claim 8, wherein: Each of the gas circulation branch pipe networks (22) comprises a primary gas circulation pipeline (221) and a plurality of secondary gas circulation pipelines (222), wherein the primary gas circulation pipeline (221) is connected to the gas circulation main pipe (21), and the plurality of secondary gas circulation pipelines (222) are sequentially connected to the primary gas circulation pipeline (221) along the gas flow direction of the primary gas circulation pipeline (221).

10. A method for manufacturing a vacuum insulation panel according to any one of claims 7 to 9, characterized in that: include: The vacuum insulation panel core material is covered with the vacuum barrier film in a vacuum environment to form the vacuum insulation panel.

11. A refrigeration device, characterized in that: The utility model comprises a box body and the vacuum insulation panel according to any one of claims 7 to 9, wherein the vacuum insulation panel is installed in the box body.

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