A fully automatic taiko wafer inspection apparatus and method

Abstract

The application provides a full-automatic Taiko wafer detection device and method. The device comprises a mechanical hand module, an edge searching module, a wafer turning module and a detection module. The mechanical hand module controls the wafer to flow between the edge searching module, the wafer turning module and the detection module. Each module is provided with a suction cup corresponding to the edge of the wafer. The mechanical hand module comprises a fork. The edge of the fork is provided with a plurality of groups of suction nozzles. The plurality of groups of suction nozzles are suitable for wafers of different sizes. The heights of the suction nozzles of the wafers of different sizes are different. The lip height of the suction nozzle covers at least the warped part of the wafer. The application can synchronously detect the front and back surfaces of the Taiko wafer, simplifies the production process and improves the production efficiency. In the detection process, only the part within 3 mm of the edge of the Taiko wafer is contacted, so that the wafer is not polluted and the inner circle part of the wafer is not damaged.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of wafer detection, and particularly relates to a full-automatic Taiko wafer detection device and method. BACKGROUND

[0002] With the progress of science and technology, in recent years, the demand for ultra-thin silicon wafers is increasing, and thinner silicon wafers can bring many benefits, including ultra-thin packaging, smaller size, better electrical performance and better heat dissipation performance. At present, the most commonly used silicon wafer thinning method in the silicon wafer manufacturing field is grinding, and the Taiko silicon wafer is formed by the silicon wafer thinning method. This common grinding method generally requires the thickness of the silicon wafer to be 750um-120um, but when the thickness of the silicon wafer is less than 100um, the silicon wafer becomes very soft and elastic, and cannot be directly processed. With the rise of power semiconductors, the upper and lower surfaces of the silicon wafer need to be processed at the same time, and when the thickness of the silicon wafer is less than or equal to 100um, the rigidity of the silicon wafer is further reduced, causing the silicon wafer to deform too much during transportation and carrying, resulting in breakage during transportation. Problems, and subsequent process procedures cannot be performed due to deformation of the silicon wafer.

[0003] The Taiko silicon wafer technology is to retain the edge part of about 3mm of the silicon wafer during grinding, and only grind the inner circle to thin the type, meet the process requirements of the inner circle, and also ensure the rigidity of the silicon wafer. Thus reducing the warping of the wafer, reducing the transmission requirements of the subsequent process machine and the risk of silicon wafer breakage. Therefore, it is necessary to detect the Taiko wafer in time to find the defects on the wafer in advance.

[0004] Due to the thickness of the Taiko silicon wafer itself being much smaller than the conventional standard silicon wafer, in order to improve the transportability of the Taiko silicon wafer and the stability of the Taiko silicon wafer itself, only the edge part of about 3mm of the silicon wafer can be contacted during transportation and detection. SUMMARY

[0005] In order to solve the above-mentioned problems existing in the prior art, the present application provides a full-automatic Taiko wafer detection device and method to solve the above-mentioned technical defect problems.

[0006] According to a first aspect of the present application, a full-automatic Taiko wafer detection device is provided, comprising a mechanical hand module, an edge searching module, a wafer flipping module and a detection module, the mechanical hand module controls the wafer to flow between the edge searching module, the wafer flipping module and the detection module, and each module is provided with a suction cup corresponding to the edge of the wafer, the mechanical hand module comprises a fork, a plurality of suction nozzles are distributed on the edge of the fork, the plurality of suction nozzles are suitable for wafers of different sizes, and the heights of the suction nozzles of wafers of different sizes are different, and the lip height of the suction nozzle covers at least the warped part of the wafer.

[0007] Through the structural arrangement, the mechanical hand module can be compatible with wafers of different sizes, the design of the suction nozzles can overcome the warping of the product, improve the smoothness of the wafer carrying of the mechanical hand module, and the design of the suction nozzles on the fork and the suction cups on each module can realize the transmission and fixation between each module when the device is fully automated.

[0008] In a specific embodiment, the full-automatic Taiko wafer detection device further comprises a loading and unloading port, and a basket loaded with wafers of different sizes is placed on the loading and unloading port. Through the structural arrangement, full automation and multi-size compatibility of wafer carrying can be realized, and efficient and safe production processes can be ensured.

[0009] In a specific embodiment, the fork is provided with a vacuum circuit corresponding to wafers of different sizes, and the suction nozzles suitable for wafers of different sizes are arranged on the corresponding vacuum circuit. Through the structural arrangement, when the fork adsorbs wafers of different sizes, the suction nozzles on the corresponding vacuum circuit are activated, ensuring accurate adsorption of the wafer edge by the fork, and realizing multi-size compatibility of wafer adsorption.

[0010] In a specific embodiment, the suction cup, the suction nozzle and the wafer edge within a range of 3mm are in contact. Through the structural arrangement, when the wafer is transported and fixed between each module, the wafer inner ring thickness is avoided to be touched, and the problem of wafer deformation and breakage is avoided.

[0011] In a specific embodiment, the wafer flipping module comprises two side clamping cylinders, two side size switching cylinders and a rotating motor, the two side clamping cylinders are driven to rotate around the shaft by the rotating motor, and the two side size switching cylinders are vertically arranged on the two side clamping cylinders. In the structural arrangement, the clamping cylinder is driven to rotate by the rotating motor, and the two side size switching cylinders are rotated, realizing the wafer flipping action.

[0012] In a specific embodiment, a clamping cylinder clamps and fixes the edge of the wafer, while a size-switching cylinder can be adjusted to accommodate wafers of different sizes. This structural design ensures that the clamping cylinder only contacts the edge of the wafer, preventing wafer deformation and damage during the flipping process. Simultaneously, the size-switching cylinder enables the flipping module to be compatible with wafers of multiple sizes. In this design, the size-switching cylinder retracts when the wafer size is small and extends when the wafer size is large.

[0013] In a specific embodiment, the flipping module further includes a clamping block, and a clamping cylinder and a size switching cylinder engage with the wafer edge within 3mm via the clamping block. In this configuration, the clamping cylinder and the size switching cylinder are connected to the clamping block, and the wafer is fixed through the mechanical engagement between the clamping block and the wafer edge.

[0014] In a specific embodiment, when the device is working, the clamping cylinders on both sides drive the size switching cylinder to move synchronously towards the center. The size switching cylinder moves back and forth according to the wafer size. Through this structural arrangement, the clamping cylinders on both sides and the size switching cylinder work together to clamp and fix the wafer. The back and forth movement of the size switching cylinder changes the distance between the clamping block connected to it and the clamping block connected to the clamping cylinder, thereby changing the size of the wafer that can be clamped.

[0015] In a specific embodiment, the inspection module includes an inspection stage and an inspection lens assembly. The inspection stage is equipped with a suction cup, and the inspection lens assembly includes a displacement sensor and a microscope lens assembly. In this configuration, the suction cup on the inspection stage adsorbs and fixes the wafer, and the inspection lens assembly inspects the wafer. The displacement sensor monitors changes in the wafer surface height in real time, ensuring the microscope lens assembly remains precisely focused. The microscope lens assembly captures defects on the wafer surface and internally, automatically identifies defects, and generates an inspection report.

[0016] According to a second aspect of the present invention, a fully automated Taiko wafer inspection method is proposed, comprising:

[0017] S1: Scan the wafers in the basket after feeding;

[0018] S2: Depending on the size of the wafer, the robotic arm module uses the corresponding nozzle of the toothed fork to pick up the edge of the wafer;

[0019] S3: The robotic arm module transfers the wafer to the edge-finding module, where suction cups on the edge-finding module fix the edge of the wafer and perform edge-finding.

[0020] S4: when the front surface is detected, enter step S5, when the back surface is detected, the manipulator module transfers the wafer to the turnover module, the clamping cylinder moves to the middle to make the clamping block clamp the front and back sides of the wafer edge, the size switching cylinder adjusts according to the front and back movement of the wafer size, and the rotary motor drives the clamping cylinder and the size switching cylinder to rotate;

[0021] S5: the manipulator module transfers the wafer to the detection module, the chuck on the detection module fixes the edge of the wafer, and the wafer is detected;

[0022] S6: after the detection is completed, the manipulator module carries the wafer back to the basket.

[0023] Through the process design, the equipment automatically scans, searches for edges, detects the front surface, scans, searches for edges, turns over and detects the back surface in sequence, and only contacts the part within 3mm of the edge of the wafer in the process, thereby avoiding the problems of wafer deformation and damage.

[0024] Compared with the prior art, the beneficial results of the present application are that:

[0025] 1. Only the part within 3mm of the edge of the wafer is contacted in the whole operation process of the equipment, so that the wafer is not contaminated and the thin part of the inner circle of the wafer is not damaged.

[0026] 2. The equipment can detect the front and back surfaces synchronously, simplifies the production process and improves the production efficiency.

[0027] 3. The equipment can be compatible with wafers of different sizes. BRIEF DESCRIPTION OF DRAWINGS

[0028] The accompanying drawings are included to provide a further understanding of embodiments and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments and, together with the description, serve to explain the principles of the present application. Other embodiments and many of the intended advantages of the present application will be readily appreciated as the same becomes better understood by reference to the following detailed description. The elements of the drawings are not necessarily to scale relative to each other. Like reference numerals designate corresponding similar parts.

[0029] Figure 1 is a structural schematic view of the whole automatic Taiko wafer detection equipment according to the first embodiment of the present application;

[0030] Figure 2 is a structural schematic view of the prongs of the whole automatic Taiko wafer detection equipment according to the first embodiment of the present application;

[0031] Figure 3 is a structural schematic view of the turnover module of the whole automatic Taiko wafer detection equipment according to the first embodiment of the present application;

[0032] Figure 4 is a structure diagram of a mechanical hand module of a full-automatic Taiko wafer detection equipment according to a first embodiment of the present application;

[0033] Figure 5 is a structure diagram of a edge searching module of a full-automatic Taiko wafer detection equipment according to the first embodiment of the present application;

[0034] Figure 6 is a structure diagram of a detection stage of a full-automatic Taiko wafer detection equipment according to the first embodiment of the present application;

[0035] Figure 7 is a structure diagram of a detection lens group of a full-automatic Taiko wafer detection equipment according to the first embodiment of the present application;

[0036] Figure 8 is a flow chart of a full-automatic Taiko wafer detection method according to a second embodiment of the present application;

[0037] Figure 9 is a flow chart of specific steps of a full-automatic Taiko wafer front surface detection according to the second embodiment of the present application;

[0038] Figure 10 is a flow chart of specific steps of a full-automatic Taiko wafer back surface detection according to the second embodiment of the present application.

[0039] Meanings of numbers in the figures: 01-mechanical hand module, 02-port A, 03-port B, 04-edge searching module, 05-flip module, 06-detection module, 07-detection lens group, 08-detection stage, 09-tine, 10-6-inch suction nozzle, 11-8-inch suction nozzle, 12-6-inch vacuum circuit, 13-8-inch vacuum circuit, 14-clamping cylinder, 15-size switching cylinder, 16-rotary motor, 17-clamping block, 18-precision pressure regulating valve, 19-harmonic reducer, 20-reflective sensor, 21-vacuum chuck, 22-camera, 23-stage fixed chuck, 24-detection X axis, 25-detection Y axis, 26-detection Z axis, 27-displacement sensor, 28-microscope lens group, 29-annular light. DETAILED DESCRIPTION

[0040] In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which are shown by way of illustration illustrative embodiments in which the application can be practiced. For purposes of explanation and illustration, directional terms are used with reference to the orientation of the described figures. However, it is to be understood that the embodiments can be practiced in other orientations than those presented in the figures. The directional terms used herein refer to the orientation of the figure under discussion. Because components of embodiments can be positioned in a number of orientations, the directional terminology is used for purposes of illustration and description and is in no way limiting. It is to be understood that other embodiments can be utilized and structural or logical changes can be made without departing from the scope of the present application. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present application is defined by the appended claims.

[0041] The present application provides a full-automatic Taiko wafer detection device and method, Figure 1 The structural schematic diagram of the full-automatic Taiko wafer detection device of the first embodiment of the present application is shown. As shown in the figure, Figure 1 The full-automatic TAIKO wafer detection device includes a mechanical hand module 01, an edge searching module 04, a face turning module 05, a detection module 06, a Port A 02 and a Port B 03. The mechanical hand module 01, the edge searching module 04, the face turning module 05, the Port A 02 and the Port B 03 are arranged on the left side of the device, the detection module 06 is arranged on the right side of the device, and the detection module 06 includes a detection mirror group 07 and a detection stage 08. The mechanical hand module 01 is arranged in the middle of the Port A 02, the Port B 03, the edge searching module 04, the face turning module 05 and the detection stage 08, controls the wafer to flow between the Port A 02, the Port B 03, the edge searching module 04, the face turning module 05 and the detection module 06, and each module is provided with a suction cup corresponding to the edge of the wafer. The mechanical hand module 01 is used for carrying the wafer; the edge searching module 04 is used for scanning the wafer; the face turning module 05 is used for rotating the wafer by 180°; and the detection module 06 is used for detecting the defects of the wafer.

[0042] In specific embodiments, the Port A 02 and the Port B 03 are loading and unloading ports, and a basket for loading the wafers of different sizes is arranged on the loading and unloading ports. In this example, a 6-inch or 8-inch basket can be arranged in the Port A 02 and the Port B 03, and is used for loading 6-inch or 8-inch Taiko wafers, respectively. Through the structure, full automation and multi-size compatibility of wafer carrying can be realized, and an efficient and safe production process is ensured.

[0043] Figure 2 The structural schematic diagram of the prongs of the full-automatic Taiko wafer detection device of the first embodiment of the present application is shown. As shown in the figure, Figure 2As shown, the edge of the fork 09 is provided with multiple groups of nozzles, which are suitable for wafers of different sizes, and the heights of the nozzles of wafers of different sizes are different. The fork 09 is provided with vacuum circuits corresponding to wafers of different sizes, and the nozzles suitable for wafers of corresponding sizes are arranged on the corresponding vacuum circuits. Through the structural arrangement, when the fork 09 adsorbs wafers of different sizes, the nozzles on the corresponding vacuum circuits will be activated, ensuring the accurate adsorption of the edge of the wafer by the fork 09, and realizing the multi-size compatibility of wafer adsorption.

[0044] In a specific embodiment, the edge of the fork 09 is provided with 6-inch nozzles 10 and 8-inch nozzles 11, which are suitable for 6-inch and 8-inch wafers respectively, and the heights of the 6-inch nozzles 10 and the 8-inch nozzles 11 are different. The fork 09 is also provided with a 6-inch vacuum circuit 12 and an 8-inch vacuum circuit 13, and the 6-inch nozzles 10 and the 8-inch nozzles 11 are arranged on the 6-inch vacuum circuit 12 and the 8-inch vacuum circuit 13 respectively. Through the structural arrangement, when a 6-inch wafer is adsorbed, the 6-inch nozzles 10 on the 6-inch vacuum circuit 12 will be activated; when an 8-inch wafer is adsorbed, the 8-inch nozzles 11 on the 8-inch vacuum circuit 13 will be activated.

[0045] In a specific embodiment, the lip height of the nozzle covers at least the warped part of the wafer, and through the structural arrangement, the warping of the product in the basket can be overcome, and the smoothness of the handling of the manipulator module 01 can be improved.

[0046] Figure 3 The structure diagram of the turnover module of the full-automatic Taiko wafer detection equipment according to the first embodiment of the present application is shown. Figure 3 As shown, the turnover module 05 includes two side clamping cylinders 14, two side size switching cylinders 15, a rotary motor 16, a clamping block 17, a precision pressure regulating valve 18 and a harmonic reducer 19. The two side clamping cylinders 14 rotate around the rotary motor 16, and the two side size switching cylinders 15 are vertically arranged on the two side clamping cylinders 14 respectively. The clamping cylinders 14 clamp and fix the edge of the wafer, and the size switching cylinders 15 can adjust to adapt to wafers of different sizes. In the structural arrangement, the turnover module 05 moves to the middle through the two side clamping cylinders 15 to clamp and fix the wafer, rotates the clamping cylinder 15 through the rotary motor 16 to realize the turnover action of the wafer, and adjusts the size switching cylinder 16 to adapt to wafers of different sizes to meet the compatibility of the turnover module 05 to wafers of different sizes.

[0047] In a specific embodiment, when the size of the wafer is small, the size switching cylinder is retracted, and when the size of the wafer is large, the size switching cylinder is extended. In this example, when producing 6-inch wafers, the size switching cylinder 15 is retracted, and when producing 8-inch wafers, the size switching cylinder 15 is extended.

[0048] In specific embodiments, the clamping cylinder 14 and the size switching cylinder 15 are in contact with the edge of the wafer within a range of 3mm through the clamping block 17. The clamping block 17 includes an upper clamping block and a lower clamping block, and the wafer is clamped and fixed through the matching work of the upper clamping block and the lower clamping block. In this structure, the clamping cylinder 14 and the size switching cylinder 15 are connected with the clamping block 17 respectively, and the wafer is clamped and fixed through the mechanical cooperation of the clamping block 17 and the edge of the wafer.

[0049] In specific embodiments, during the operation of the device, the clamping cylinder 14 on both sides drives the size switching cylinder 15 to move synchronously to the middle, and the size switching cylinder 15 moves forward and backward according to the size of the wafer. Through this structure, the clamping cylinder 14 on both sides and the size switching cylinder 15 jointly clamp and fix the wafer, and the forward and backward movement of the size switching cylinder 15 changes the distance between the clamping block 17 connected with it and the clamping block 17 connected with the clamping cylinder 14, so as to change the size of the clamped wafer.

[0050] Figure 4 The structure diagram of the mechanical hand module of the full-automatic Taiko wafer detection device according to the first embodiment of the present application is shown. As shown in Figure 4 The mechanical hand module 01 includes a fork 09 and a reflection sensor 20. In specific embodiments, after the personnel basket is put into the material, the mechanical hand module 01 will scan the wafer in the basket. Since the thickness of the Taiko wafer is much smaller than that of the conventional wafer, the reflection sensor 20 is used to scan the Taiko wafer. Through this structure, the problem that the reflection sensor is easy to misjudge when scanning the Taiko wafer and cannot accurately scan the oblique sheet is effectively solved.

[0051] Figure 5 The structure diagram of the edge searching module of the full-automatic Taiko wafer detection device according to the first embodiment of the present application is shown. As shown in Figure 5 The edge searching module 04 is an Aligner edge searching device, which includes a vacuum chuck 21 and a camera 22. The vacuum chuck 21 is arranged on a rotating table and is used to adsorb and fix the wafer, and the camera is used to cooperate with the image algorithm to identify the edge of the wafer. Through this structure, the physical edge of the 3mm thick area of the wafer periphery is quickly identified, so that the suction nozzle or clamp of the mechanical hand module 01 only contacts this area, and the inner thin area of the wafer is avoided to be touched.

[0052] Figure 6 The structure diagram of the detection stage of the full-automatic Taiko wafer detection device according to the first embodiment of the present application is shown. As shown in Figure 6As shown, the detection platform 08 is respectively provided with a 6-inch wafer and an 8-inch wafer corresponding platform fixed chuck 23, and the detection platform can move in the X direction and the Y direction along the detection X axis 24 and the detection Y axis 25. Through the structural arrangement, it can be ensured that the wafer detection only contacts the part within 3mm of the wafer edge, and the wafer can be moved to the detection lens group 07 by moving the detection platform 08 in the X direction and the Y direction.

[0053] Figure 7 The structural diagram of the detection lens group of the full-automatic Taiko wafer detection equipment of the first embodiment of the application is shown. As shown in the figure, Figure 7 The detection lens group 07 includes a detection Z axis 26, a displacement sensor 27, a microscope lens group 28 and a ring light 29. In this structural arrangement, the displacement sensor 27 monitors the wafer surface height change in real time, ensuring that the microscope lens group 28 is always accurately focused; the microscope lens group 28 moves along the detection Z axis 26 according to the wafer surface height data of the displacement sensor 27, and completes the focusing; after focusing, the microscope lens group 28 captures the defects on the wafer surface and inside, automatically identifies the defects and generates a detection report.

[0054] Figure 8 The flow chart of the full-automatic Taiko wafer detection method of the second embodiment of the application is shown. As shown in the figure, Figure 8 The full-automatic Taiko wafer detection method includes:

[0055] S1: scanning the wafer in the basket after feeding;

[0056] S2: according to the size of the wafer, the mechanical hand module uses the corresponding suction nozzle of the fork to adsorb the edge of the wafer;

[0057] S3: the mechanical hand module transfers the wafer to the edge searching module, the vacuum chuck on the edge searching module fixes the edge of the wafer and searches for the edge;

[0058] S4: when front detection, enter step S5, when back detection, the mechanical hand module transfers the wafer to the turning module, the clamping cylinder moves to the middle to make the clamping block clamp the front and back sides of the wafer edge, the size switching cylinder adjusts according to the wafer size, and the rotating motor drives the clamping cylinder and the size switching cylinder to rotate;

[0059] S5: the mechanical hand module transfers the wafer to the detection module, the platform fixed chuck 23 on the detection module fixes the edge of the wafer, and the wafer is detected;

[0060] S6: after the detection is completed, the mechanical hand module carries it back to the basket.

[0061] Through the process design, the equipment automatically scans, searches edges, detects the front surface, scans, searches edges, flips the wafer and detects the back surface in sequence, and only contacts the wafer within 3mm of the edge in the process, avoiding the problems of wafer deformation and damage.

[0062] In specific embodiments, the suction cup and the suction nozzle only contact the wafer within 3mm of the edge, avoiding touching the weak part of the inner circle of the wafer. And the wafer detection needs to be carried out in two processes of front surface detection and back surface detection in sequence. The device process of wafer front surface detection is as shown in Figure 9 , which is carried out in sequence: personnel basket feeding, wafer scanning, mechanical hand taking material, edge finder clamping and reading code, placing detection platform, CCD fine positioning, AOI inspection, mechanical hand unloading to the basket, and taking out the basket after the whole inspection is completed. The device process of wafer back surface detection is as shown in Figure 10 , which is carried out in sequence: personnel basket feeding, wafer scanning, mechanical hand taking material, edge finder clamping and reading code, mechanical hand taking material, placing the turnover module, mechanical hand taking out after the product is turned over, mechanical hand taking material to the edge finder, edge finder searching edge, mechanical hand taking material, placing detection platform, CCD fine positioning, AOI inspection, mechanical hand unloading to the turnover module, mechanical hand unloading to the basket, and taking out the basket after the whole inspection is completed.

[0063] Obviously, those skilled in the art can make various modifications and changes to the embodiments of the present application without departing from the spirit and scope of the present application. In this way, if these modifications and changes are within the scope of the claims of the present application and their equivalents, the present application also intends to cover these modifications and changes. The word "comprising" does not exclude the presence of other elements or steps not listed in the claims. The simple fact that certain measures are described in mutually different dependent claims does not mean that the combination of these measures cannot be used to advantage. Any reference signs in the claims should not be considered as limiting the scope.

Claims

1. A fully automated Taiko wafer inspection device, characterized in that, include: The system includes a robotic arm module, an edge-finding module, a flipping module, and a detection module. The robotic arm module controls the transfer of the wafer between the edge-finding module, the flipping module, and the detection module. Each module has a suction cup corresponding to the edge of the wafer. The robotic arm module includes a toothed fork with multiple sets of suction nozzles distributed on its edge. These suction nozzles are adapted to wafers of different sizes, and the heights of the suction nozzles for wafers of different sizes are different. The lip height of each suction nozzle at least covers the warped portion of the wafer. The edge-finding module quickly identifies the physical edge of the 3mm thick area surrounding the wafer, ensuring that the suction nozzles of the robotic arm module only contact the area within 3mm of the wafer's edge.

2. The fully automated Taiko wafer inspection equipment according to claim 1, characterized in that, It also includes loading and unloading ports, on which baskets for loading the wafers of different sizes are placed.

3. The fully automated Taiko wafer inspection equipment according to claim 1, characterized in that, The toothed fork is provided with vacuum circuits corresponding to the different sizes of wafers, and the suction nozzle adapted to the corresponding size wafer is set on the corresponding vacuum circuit.

4. The fully automated Taiko wafer inspection equipment according to claim 1, characterized in that, The suction cup and nozzle make contact with the edge of the wafer within 3 mm.

5. The fully automated Taiko wafer inspection equipment according to claim 1, characterized in that, The flipping module includes two clamping cylinders, two size switching cylinders, and a rotary motor. The two clamping cylinders are driven to rotate around an axis by the rotary motor, and the two size switching cylinders are respectively vertically arranged on the two clamping cylinders.

6. The fully automated Taiko wafer inspection equipment according to claim 5, characterized in that, The clamping cylinder clamps and fixes the edge of the wafer, and the size switching cylinder can be adjusted to adapt to wafers of different sizes.

7. The fully automated Taiko wafer inspection equipment according to claim 6, characterized in that, The flipping module also includes a clamping block, and the clamping cylinder and the size switching cylinder are in contact with the edge of the wafer within a 3mm range through the clamping block.

8. The fully automated Taiko wafer inspection equipment according to claim 7, characterized in that, When the equipment is working, the clamping cylinders on both sides drive the size switching cylinder to move synchronously towards the middle, and the size switching cylinder moves back and forth according to the wafer size.

9. The fully automated Taiko wafer inspection equipment according to claim 1, characterized in that, The detection module includes a detection stage and a detection lens assembly. The detection stage is equipped with the suction cup, and the detection lens assembly includes a displacement sensor and a microscope lens assembly.

10. A fully automated Taiko wafer inspection method, comprising the fully automated Taiko wafer inspection equipment according to any one of claims 1-9, characterized in that, include: S1: Scan the wafers in the basket after feeding; S2: Based on the size of the wafer, the robotic arm module uses the suction nozzle corresponding to the toothed fork to adsorb the edge of the wafer; S3: The robotic arm module transfers the wafer to the edge-finding module, where the suction cups on the edge-finding module fix the edge of the wafer and perform edge-finding. S4: During front-side inspection, proceed to step S5. During back-side inspection, the robotic arm module transfers the wafer to the flipping module. The clamping cylinder moves towards the center to clamp the front and back sides of the wafer edge. The size switching cylinder moves back and forth according to the wafer size. The rotary motor drives the clamping cylinder and the size switching cylinder to rotate. S5: The robotic arm module transfers the wafer to the detection module, where the suction cups on the detection module fix the edge of the wafer and perform detection on the wafer; S6: After the inspection is completed, the robotic arm module will transport the product back to the basket.

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