Heat dissipation plate with copper-aluminum structure

Abstract

The invention provides a heat dissipation plate of a copper-aluminum structure, and the heat dissipation plate of the copper-aluminum structure comprises a bottom plate, the bottom plate comprises a center layer and a coating layer wrapping the center layer, the center layer is an aluminum part, the coating layer is a copper part, a groove is formed in the upper surface of the bottom plate and located on the coating layer, and the bottom plate is also provided with a liquid inlet hole and a liquid outlet hole which are communicated with the groove; the lower surface of the cover plate covers the upper surface of the bottom plate, the cover plate is a copper piece, and a mounting area used for being connected with a chip is formed on the upper surface of the cover plate. The heat dissipation plate of the copper-aluminum structure is light in weight, low in cost and high in heat dissipation efficiency.

Description

Technical Field

[0001] The present invention relates to the field of chip heat dissipation, and in particular to a heat dissipation plate with a copper-aluminum structure. Background Art

[0002] The heat sink can cool the chip to ensure its normal operation.

[0003] Heat sinks are typically made of aluminum or copper. Copper has a higher thermal conductivity than aluminum (allowing for more efficient heat dissipation), but it also has a higher density (heavier weight) and is relatively expensive. Balancing weight, cost, and thermal conductivity remains a challenge. Summary of the Invention

[0004] In view of the above problems in the prior art, an object of the present invention is to provide a heat dissipation plate with a copper-aluminum structure, which is light in weight, low in cost and high in heat dissipation efficiency.

[0005] In order to solve the above problems, the present invention provides a heat dissipation plate with a copper-aluminum structure, the heat dissipation plate comprising:

[0006] A bottom plate, the bottom plate comprising a central layer and a cladding layer wrapping the central layer, the central layer being an aluminum member, the cladding layer being a copper member, a groove being formed on the upper surface of the bottom plate and located on the cladding layer, and a liquid inlet and outlet hole communicating with the groove being further provided on the bottom plate;

[0007] The cover plate has a lower surface covering the upper surface of the base plate, the cover plate is a copper part, and a mounting area for connecting a chip is formed on the upper surface of the cover plate.

[0008] Furthermore, the heat dissipation plate includes:

[0009] A fin group is provided in the groove, the fin group includes a plurality of fins, the fin group corresponds to the installation area, and the fins are copper parts.

[0010] Furthermore, the fin includes a plurality of fin segments connected in sequence along the longitudinal direction, and the coolant passes through each of the fins transversely, and the fin segments include:

[0011] a first plate, the first plate being arranged longitudinally and having an upper surface flush with an upper surface of the bottom plate;

[0012] a second plate, the second plate being vertically arranged and having a top end connected to a longitudinal end of the first plate;

[0013] a third plate, the third plate being longitudinally arranged, with a first longitudinal end thereof connected to the bottom end of the second plate, and a bottom of the third plate connected to the bottom of the groove;

[0014] The fourth plate is vertically arranged, and its bottom end is connected to the second longitudinal end of the third plate, and its top end is connected to one longitudinal end of the first plate of the next wing segment.

[0015] Furthermore, the fin includes a first fin and a second fin, the first fin and the second fin are alternately arranged in sequence, and the second plate of the first fin is connected to the first plate of the second fin in the longitudinal middle.

[0016] Furthermore, the fin group is welded to the bottom of the groove through a solder plate.

[0017] Furthermore, the groove formed on the bottom plate is formed by stamping the bottom plate.

[0018] Furthermore, the cladding layer is formed into a shell, liquid aluminum is injected into the shell and forms a central layer after cooling.

[0019] Furthermore, the installation areas include a plurality of items, the fin groups also include a plurality of items, the plurality of fin groups correspond one-to-one to the plurality of installation areas, and the coolant flows into each of the fin groups in sequence.

[0020] Furthermore, the number of the fin segments of the fin group located upstream is smaller than the number of the fin segments of the fin group located downstream.

[0021] Furthermore, in a single fin, the length of the third plate located in the middle in the longitudinal direction is smaller than the length of the third plates located at both ends.

[0022] Due to the above technical solution, the present invention has the following beneficial effects:

[0023] According to the copper-aluminum structure heat sink of the present invention, the copper coating of the base plate wraps around the central layer of the aluminum part. Compared with a base plate made entirely of copper, this can reduce weight and cost. Compared with a base plate made entirely of aluminum, it can increase thermal conductivity and improve heat dissipation efficiency. The base plate is formed with grooves, liquid inlet holes, and liquid outlet holes. The cover plate covers the base plate, thereby forming a flow channel. The coolant flows from the liquid inlet hole into the groove and out of the liquid outlet hole, which can effectively dissipate heat from the chip through liquid cooling. Moreover, the copper cover plate has a high thermal conductivity, which improves heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] To more clearly illustrate the technical solution of the present invention, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present invention, and those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0025] Figure 1 is a structural diagram of a heat dissipation plate with a copper-aluminum structure according to an embodiment of the present invention;

[0026] Figure 2 yes Figure 1 Structural diagram of the copper-aluminum heat sink of the embodiment without the cover plate;

[0027] Figure 3 is a structural diagram of a base plate according to one embodiment of the present invention;

[0028] Figure 4 is a structural diagram of a fin assembly according to one embodiment of the present invention;

[0029] Figure 5 is a structural diagram of a fin according to a first embodiment of the present invention;

[0030] Figure 6 1 is a structural diagram of a fin according to a second embodiment of the present invention.

[0031] Reference numerals:

[0032] 100, cover plate; 200, bottom plate; 201, covering layer; 202, center layer; 210, liquid inlet hole; 220, liquid outlet hole; 230, groove; 300, fin group; 301, first plate; 302, second plate; 303, third plate; 304, fourth plate; 310, first fin; 320, second fin. DETAILED DESCRIPTION

[0033] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0034] It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and the accompanying drawings are used to distinguish similar items and are not necessarily used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, such that the embodiments of the present invention described herein can be implemented in sequences other than those illustrated or described herein. Furthermore, the terms "including," "having," and any variations thereof are intended to cover non-exclusive inclusions.

[0035] Next, a heat dissipation plate with a copper-aluminum structure according to an embodiment of the present invention is described.

[0036] like Figures 1 to 6 As shown, the heat dissipation plate with a copper-aluminum structure according to the embodiment of the present invention includes a base plate 200 and a cover plate 100 .

[0037] First, let's describe the base plate 200. The base plate 200 includes a core layer 202 and a cladding layer 201 surrounding the core layer 202. The core layer 202 is made of aluminum, and the cladding layer 201 is made of copper. A groove 230 is formed on the upper surface of the base plate 200 and located on the cladding layer 201. The base plate 200 also includes a liquid inlet 210 and a liquid outlet 220 that communicate with the groove 230.

[0038] like Figure 3 As shown, the base plate 200 includes a central layer 202 of aluminum and a cladding layer 201 of copper. The cladding layer 201 completely encapsulates the central layer 202 (all surfaces of the central layer 202 are encapsulated by the cladding layer 201). Compared to a base plate 200 made entirely of copper, this can reduce weight and cost. Compared to a base plate 200 made entirely of aluminum, this can increase thermal conductivity and improve heat dissipation efficiency.

[0039] like Figure 2 As shown, a groove 230 , a liquid inlet hole 210 and a liquid outlet hole 220 are formed on the bottom plate 200 . The coolant can flow into the groove 230 from the liquid inlet hole 210 and flow out from the liquid outlet hole 220 .

[0040] Next, the cover plate 100 is described. The lower surface of the cover plate 100 covers the upper surface of the base plate 200. The cover plate 100 is made of copper and has a mounting area for connecting a chip formed on its upper surface.

[0041] like Figure 1 As shown, the cover plate 100 covers the bottom plate 200, which can close the groove 230, form a flow channel, and prevent the coolant from leaking. In addition, the copper cover plate 100 has a high thermal conductivity, which improves the heat dissipation efficiency.

[0042] The above heat sink with a copper-aluminum structure has a copper coating layer 201 of the base plate 200 that wraps the central layer 202 of the aluminum part. Compared with a base plate 200 made of all copper material, it can reduce weight and cost. Compared with a base plate 200 made of all aluminum material, it can increase thermal conductivity and improve heat dissipation efficiency. A groove 230, a liquid inlet 210, and a liquid outlet 220 are formed on the base plate 200. The cover plate 100 covers the base plate 200, thereby forming a flow channel. The coolant flows from the liquid inlet 210 into the groove 230 and flows out from the liquid outlet 220, which can efficiently dissipate heat from the chip through liquid cooling. Moreover, the copper cover plate 100 has a high thermal conductivity, which improves heat dissipation efficiency.

[0043] In some embodiments of the present invention, the heat sink includes a fin assembly 300. The fin assembly 300 is disposed in the groove 230. The fin assembly 300 includes a plurality of fins. The fin assembly 300 corresponds to the mounting area, and the fins are copper parts.

[0044] like Figure 2 As shown, a fin assembly 300 comprising multiple fins is disposed within recess 230. Fin assembly 300 corresponds to the mounting area, i.e., the chip, thereby increasing the contact area (heat exchange area) between the chip and the coolant below, improving heat dissipation efficiency for the chip. Fin assembly 300, made of copper, has a high thermal conductivity, further enhancing heat dissipation efficiency for the chip. Furthermore, the copper fins have a low contact thermal resistance with the copper upper surface of base plate 200, thereby improving heat exchange efficiency.

[0045] Furthermore, the fin includes a plurality of fin segments connected in sequence along the longitudinal direction, and the coolant passes through each fin horizontally, and the fin segments include a first plate 301, a second plate 302, a third plate 303 and a fourth plate 304. The first plate 301 is arranged longitudinally, and its upper surface is flush with the upper surface of the bottom plate 200. The second plate 302 is arranged vertically, and its top end is connected to one longitudinal end of the first plate 301. The third plate 303 is arranged longitudinally, and its first longitudinal end is connected to the bottom end of the second plate 302, and the bottom of the third plate 303 is connected to the bottom of the groove 230. The fourth plate 304 is arranged vertically, and its bottom end is connected to the second longitudinal end of the third plate 303, and its top end is connected to one longitudinal end of the first plate 301 of the next fin segment. Wherein, the longitudinal and transverse directions are as follows: Figure 2 As shown, the directions of other drawings refer to Figure 2 .

[0046] like Figure 2 As shown in the figure, the coolant passes through each fin laterally. Figure 4 and Figure 5 As shown, the fin comprises a plurality of fin segments connected in sequence, including a first plate 301, a second plate 302, a third plate 303, and a fourth plate 304, which are longitudinally connected in sequence. The bottom of the third plate 303 is connected to the bottom of the groove 230, and the top of the first plate 301 is connected to the lower surface of the cover plate 100. This provides a relatively large contact area, which can reduce thermal resistance. The coolant flowing through the second plate 302 and the fourth plate 304 increases the contact area with the coolant, improving heat dissipation efficiency.

[0047] Optionally, each plate can be formed by stamping a long copper strip, and the thickness of each plate of the fin is consistent. This method is relatively simple and has high operating efficiency.

[0048] Furthermore, the fins include a first fin 310 and a second fin 320 , which are alternately arranged in sequence, and the second plate 302 of the first fin 310 and the first plate 301 of the second fin 320 are connected in the longitudinal middle.

[0049] like Figure 4 As shown, the first fins 310 and the second fins 320 are alternately and staggeredly arranged in sequence (the second plate 302 of the first fin 310 and the first plate 301 of the second fin 320 are connected in the longitudinal middle). When the coolant flows through the first channel of the first fin 310 (composed of the second plate 302, the third plate 303, and the fourth plate 304), it will be split (split into two, forming a first split and a second split) when it encounters the second fin 320. When the coolant flows through the second channel of the first fin 310 (composed of the fourth plate 304, the first plate 301, and the second plate 302), it will be split (split into two, forming a third split and a fourth split) when it encounters the second fin 320 and the fourth plate 304. Each split of the coolant (the first split, the second split, the third split, and the fourth split) is correspondingly merged and then split again through the first fin 310. That is, the coolant passes through each fin one by one, continuously splitting and merging, making the heat exchange of the coolant with the fin assembly 300 more sufficient, improving the heat dissipation efficiency of the chip. In addition, the temperature of the coolant can be made more uniform, improving the uniformity of heat dissipation to the chip.

[0050] Furthermore, the fin assembly 300 is welded to the bottom of the groove 230 through a solder plate.

[0051] A brazing plate is placed between the fin group 300 and the groove 230 and brazing is performed in a brazing furnace, which can stabilize the connection between the fin group 300 and the groove 230, reduce thermal resistance, and improve heat dissipation efficiency.

[0052] In some embodiments of the present invention, the groove 230 formed on the bottom plate 200 is formed by stamping the bottom plate 200 .

[0053] The bottom plate 200 can be relatively thin, and the groove 230 can be formed by stamping. This method is relatively efficient and low-cost, meeting the needs of large-scale operations.

[0054] Moreover, the stamping method (copper and aluminum extrusion) can reduce the contact thermal resistance of copper and aluminum and improve the heat dissipation efficiency.

[0055] During the process, a liquid inlet groove and a liquid outlet groove can be punched out on the edge of the bottom plate, and a first copper block with a liquid inlet hole 210 can be welded and connected in the liquid inlet groove, and a second copper block with a liquid outlet hole 220 can be welded and connected in the liquid outlet groove, so as to facilitate the connection between the liquid inlet hole 210 and the liquid outlet hole 220 and the groove and improve the strength of the liquid inlet hole 210 and the liquid outlet hole 220.

[0056] It should be noted that the above is only an optional example, and the bottom plate 200 may also be thicker, and the groove 230 may be formed by cutting, which should also be understood to be within the scope of the present invention.

[0057] In some embodiments of the present invention, the cladding layer 201 is formed as a shell, into which liquid aluminum is injected and cooled to form the core layer 202 .

[0058] The copper shell (cladding layer 201) has a high melting point. Liquid aluminum is injected into the shell and allowed to cool, forming an aluminum block, i.e., the core layer 202. This method ensures full contact between the copper and aluminum, lowering the contact thermal resistance and improving heat dissipation efficiency. A pre-formed injection port can be formed in the shell. After the liquid aluminum is injected, the port can be sealed with a copper plate.

[0059] In some embodiments of the present invention, there are multiple installation areas and multiple fin groups 300 . The multiple fin groups 300 correspond to the multiple installation areas one by one, and the coolant flows into each fin group 300 in sequence.

[0060] like Figure 2 As shown, four fin groups 300 are arranged laterally spaced apart and correspond one to one with the four mounting areas, so as to dissipate heat for the four chips simultaneously.

[0061] Furthermore, the number of fin segments of the upstream fin group 300 is smaller than the number of fin segments of the downstream fin group 300 .

[0062] The greater the number of fin segments in the fin assembly 300, the greater the contact area (heat exchange area) with the coolant, resulting in greater heat dissipation. As the coolant flows through each fin assembly 300 in sequence, the temperature gradually increases, and the heat dissipation efficiency gradually decreases. The contact area between the downstream fin assembly 300 and the coolant is greater than the contact area between the upstream fin assembly 300 and the coolant, improving the heat dissipation efficiency of the downstream fin assembly 300 to compensate for the decrease in heat dissipation efficiency after the coolant temperature rises, thereby improving the uniformity of heat dissipation for each chip.

[0063] The longitudinal length of the fin segments of the upstream fin assembly 300 can be increased, while the longitudinal length of the fin segments of the downstream fin assembly 300 can be reduced, thereby achieving a smaller number of fin segments in the upstream fin assembly 300 than in the downstream fin assembly 300. For example, the longitudinal length of the third plate 303 of the upstream fin assembly 300 is greater than the longitudinal length of the third plate 303 of the downstream fin assembly 300. This allows the number of fin segments in the upstream fin assembly 300 to be smaller than that in the downstream fin assembly 300, thereby improving the uniformity of heat dissipation for each chip.

[0064] Alternatively, by adjusting the number of fins in different fin groups 300, the number of fins in the upstream fin group 300 is smaller than the number of fins in the downstream fin group 300, and the number of wing segments in the upstream fin group 300 is smaller than the number of wing segments in the downstream fin group 300.

[0065] Furthermore, the longitudinal length of the third plate 303 of the upstream fin group 300 is greater than the longitudinal length of the third plate 303 of the downstream fin group 300. Moreover, in a single fin, the longitudinal length of the third plate 303 located in the middle is smaller than the length of the third plates 303 located at both ends.

[0066] like Figure 6 As shown, in a single fin, the length of the third plate 303 located in the middle in the longitudinal direction is smaller than the length of the third plate 303 located at both ends, so that the contact area between the longitudinal middle part of the fin and the coolant is larger, and the contact area between the longitudinal ends of the fin and the coolant is smaller, thereby being able to concentrate the heat dissipation on the middle part of the chip, corresponding to the situation where the temperature in the middle of the chip is high and the temperature at the edge is low, thereby improving the uniformity of heat dissipation for a single chip.

[0067] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A heat dissipation plate with a copper-aluminum structure, characterized in that: The heat dissipation plate comprises: A bottom plate, the bottom plate comprising a central layer and a cladding layer wrapping the central layer, the central layer being an aluminum member, the cladding layer being a copper member, a groove being formed on the upper surface of the bottom plate and located on the cladding layer, and a liquid inlet and outlet hole communicating with the groove being further provided on the bottom plate; The cover plate has a lower surface covering the upper surface of the base plate, the cover plate is a copper part, and a mounting area for connecting a chip is formed on the upper surface of the cover plate.

2. The heat dissipation plate of copper-aluminum structure according to claim 1, characterized in that: The heat dissipation plate comprises: A fin group is provided in the groove, the fin group includes a plurality of fins, the fin group corresponds to the installation area, and the fins are copper parts.

3. The heat dissipation plate of copper-aluminum structure according to claim 2, characterized in that: The fin includes a plurality of fin segments connected in sequence along the longitudinal direction, and the coolant passes through each of the fins transversely. The fin segments include: a first plate, the first plate being arranged longitudinally and having an upper surface flush with an upper surface of the bottom plate; a second plate, the second plate being vertically arranged and having a top end connected to a longitudinal end of the first plate; a third plate, the third plate being longitudinally arranged, with a first longitudinal end thereof connected to the bottom end of the second plate, and a bottom of the third plate connected to the bottom of the groove; The fourth plate is vertically arranged, and its bottom end is connected to the second longitudinal end of the third plate, and its top end is connected to one longitudinal end of the first plate of the next wing segment.

4. The heat dissipation plate of copper-aluminum structure according to claim 3, characterized in that: The fins include a first fin and a second fin, the first fin and the second fin are alternately arranged in sequence, and the second plate of the first fin is connected to the middle of the first plate of the second fin in the longitudinal direction.

5. The heat dissipation plate of copper-aluminum structure according to claim 2, characterized in that: The fin group is welded to the bottom of the groove through a solder plate.

6. The heat dissipation plate of copper-aluminum structure according to claim 1, characterized in that: The grooves formed on the bottom plate are formed by punching the bottom plate.

7. The heat dissipation plate of copper-aluminum structure according to claim 1, characterized in that: The cladding layer is formed as a shell into which liquid aluminum is injected and forms a core layer after cooling.

8. The heat dissipation plate with a copper-aluminum structure according to claim 3, characterized in that: There are multiple installation areas and multiple fin groups. The multiple fin groups correspond to the multiple installation areas one by one, and the coolant flows into each fin group in sequence.

9. The heat dissipation plate of copper-aluminum structure according to claim 8, characterized in that: The number of the fin segments of the fin group located upstream is smaller than the number of the fin segments of the fin group located downstream.

10. The heat dissipation plate of copper-aluminum structure according to claim 9, characterized in that: In a single fin, the length of the third plate located in the middle in the longitudinal direction is smaller than the length of the third plates located at both ends.

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