Chip mounter and method for processing power module

Abstract

The invention relates to the technical field of chip mounters, and provides a chip mounter and method for processing a power module, the chip mounter for processing the power module comprises a processing machine table, a chip mounting device for mounting a circuit board is arranged in the processing machine table, and circuit board conveying devices are arranged on the two sides of the processing machine table in a penetrating manner; the device further comprises a mounting base and a bent rod type sliding strip, the mounting base is arranged in the middle of the machining machine table and located at the bottom of the circuit board conveying device, a mounting groove frame is transversely and movably arranged on the upper side of the mounting base, and a plurality of heating welding devices used for heating scaling powder are transversely and slidably arranged in the mounting groove frame. The number of the bent rod type sliding strips is in one-to-one correspondence with the number of the heating welding devices. According to the technical scheme, the technical problem that in the prior art, after a chip mounter completes chip mounting on a circuit board, the circuit board needs to be additionally conveyed into reflow soldering, and consequently the processing efficiency of the circuit board is poor is solved.

Description

Technical Field

[0001] The embodiments of the present invention relate to the technical field of chip placement machines, and in particular, to a chip placement machine and method for processing a power module. Background Art

[0002] A power module is a highly integrated electronic device that is directly mounted on a printed circuit board. It can provide power for application-specific integrated circuits (ASICs), digital signal processors (DSPs), microprocessors, memories, field-programmable gate arrays (FPGAs), and other digital or analog loads. The power module is mainly composed of a main structure such as a circuit board, a heat sink, and a chassis. Multiple electronic components are soldered to the circuit board, allowing the circuit board to complete the power supply operation of various electronic devices. During the power module processing, a dedicated placement machine is used to place and solder the electronic components on the circuit board.

[0003] In the prior art, when using a placement machine to mount electronic components on a circuit board, a paste such as flux or solder paste is first injected into the sockets on the circuit board. The placement machine then inserts the pins of the electronic components into the corresponding sockets, causing the pins to come into contact with the solder paste. The circuit board is then moved into a subsequent reflow soldering machine, which directly heats the circuit board to melt the solder paste, completing the soldering operation between the electronic components and the circuit board.

[0004] The power module is an electronic device directly mounted on the printed circuit board, so the circuit board inside the power module is relatively small. When the circuit board is placed on the SMT machine and then moved into the reflow soldering machine, the circuit board on the power module is relatively small and the soldering area is not large. Therefore, after the SMT machine has placed the circuit board on the circuit board, the circuit board is transferred to the reflow soldering machine for soldering, which requires additional transportation of the circuit board, affecting the processing efficiency of the circuit board. Summary of the Invention

[0005] To overcome the above-mentioned defects, an embodiment of the present invention provides a chip placement machine and method for power module processing, which solves the technical problem in the prior art that after the chip placement machine completes the placement of the circuit board, the circuit board needs to be additionally transported to the reflow soldering, resulting in poor circuit board processing efficiency.

[0006] The present invention provides a chip mounter for processing a power module, comprising a processing platform, wherein a chip mount device for mounting chips on a circuit board is provided inside the processing platform, and circuit board conveying devices are provided on both sides of the processing platform. The processing platform also includes: A mounting base is provided in the middle of the processing machine, the mounting base is located at the bottom of the circuit board conveying device, a mounting slot frame is provided on the upper side of the mounting base for horizontal movement, and a plurality of heating and welding devices for heating the flux are provided in the mounting slot frame for horizontal sliding movement; A curved rod-type slide bar, the number of which corresponds to the number of the heating and welding devices. A sliding structure is provided at the bottom of the heating and welding device. The sliding structure is slidably arranged in the mounting slot frame. The curved rod-type slide bar passes through the sliding structure. The sliding structure and the heating and welding device slide along the outer wall of the curved rod-type slide bar. The heating and welding device can be moved to the welding area at the bottom of the circuit board.

[0007] In order to drive the mounting groove frame to move laterally on the mounting base, a sliding frame is further slidably connected inside the mounting base, and a screw transmission structure is provided between the sliding frame and the bottom of the mounting base. The mounting groove frame is fixedly connected to the top of the sliding frame, and the mounting groove frame and the sliding frame move laterally inside the mounting base.

[0008] In order to install the sliding structure into the sliding trough body, further, the sliding trough body is fixedly connected to the inner bottom wall of the installation trough frame, and the inner bottom wall of the sliding trough body is fixedly connected to the installation slide, and the top of the installation slide is provided with a trapezoidal protrusion.

[0009] In order to adjust the position of the heating and welding equipment, the sliding structure further includes a sliding base, the heating and welding equipment is fixedly connected to the sliding base, the bottom of the sliding base is located in the sliding trough body, the bottom ball hinge of the sliding base is connected to a plurality of rotating balls, the rotating balls are in contact with the inner bottom wall of the sliding trough body, and a receiving groove is provided at the bottom of the sliding base, the trapezoidal protrusion extends into the receiving groove, and tension grooves are provided on both sides of the receiving groove.

[0010] In order to enable the sliding base to move along the outer wall of the curved rod-type slide, a through groove is further provided in the middle of the sliding base, and a groove is provided at the bottom of the through groove for allowing the curved rod-type slide to enter the through groove. Both sides of the through groove are set to be trumpet-shaped, and an elastic sleeve is provided in the middle of the through groove.

[0011] In order to make the sliding base adapt to the bending curvature of the curved rod-type slide, the elastic sleeve is further set to be hollow, and a plurality of deformation grooves are opened on the inner wall of the elastic sleeve. The plurality of deformation grooves are used to form a plurality of arc-shaped clamping pieces inside the elastic sleeve, and the arc-shaped clamping pieces fit with the curved rod-type slide.

[0012] In order to install the curved rod type slide onto the mounting base, further, multiple fixed sockets are fixedly connected to both sides of the top of the mounting base, and the multiple fixed sockets located on both sides correspond one to one. Engaging blocks are provided on both sides of the curved rod type slide, and the engaging blocks engage with the fixed sockets.

[0013] In order to determine the moving speed and moving position of the circuit board, the circuit board conveying device is further provided with a material tray for placing the circuit board, and both sides of the bottom of the material tray are fixedly connected with strip slides, and the length of the strip slides is equal to the length of the circuit board.

[0014] In order to measure the moving speed and moving position of the circuit board, further, rotating parts are fixedly connected to both sides of the top of the mounting base, a rotating wheel is rotatably connected inside the rotating part, the rotating wheel contacts the inner wall of the strip slide rail, and an encoder for detecting the rotation circumference of the rotating wheel is provided between the rotating wheel and the rotating part.

[0015] In order to correct the error between the rotating wheel and the strip slide rail, further, a plurality of sensors are embedded in the inner top wall of the strip slide rail, and calibration points are embedded on the rotating wheel, and the sensors correspond to the calibration points.

[0016] A chip placement method for processing a power module, comprising the following steps: Step 1: Place the circuit board to be patched on the unloading tray, and then the unloading tray drives the circuit board to move into the processing machine, so that the patch equipment first installs electronic components on the circuit board; Step 2: Distance measurement: The unloading tray moves toward the top of the mounting base. During the movement of the unloading tray, the strip slide comes into contact with the rotating wheel, and the moving distance between the unloading tray and the circuit board is detected under the action of the encoder; Step 3, welding: after moving the welding area of the circuit board to the upper side of the heating welding device, the heating welding device heats and welds the welding area on the circuit board to weld the electronic components to the circuit board; Step 4, mobile welding: the mounting slot frame is driven to move on the top of the mounting base by the screw transmission structure. The moving speed of the heating welding equipment matches the moving speed of the circuit board. The sliding base moves along the outer wall of the curved rod-type slide bar. The heating welding equipment corresponds to different welding areas on the circuit board and performs welding operations on the welding areas of the circuit board.

[0017] The beneficial effects of the embodiments of the present invention are: 1. In the present invention, during the movement of the discharge tray, the pins of multiple electronic components are first inserted into the circuit board using a patch device, and then the discharge tray is continued to be driven to move so that the discharge tray gradually coincides with the position of the top of the mounting base. At this time, the discharge tray drives the circuit board to move horizontally on the top of the mounting base, and the sliding frame also drives the mounting slot frame and multiple heating and welding devices to move. During the movement of the heating and welding device and the sliding structure, the heating and welding device is slid along the outer wall of the curved rod-shaped slider, and the heating and welding device is moved to the corresponding welding area at the bottom of the circuit board, and the corresponding welding area on the circuit board is heated and welded. This is different from the working method of the reflow soldering machine in the prior art that performs overall heating and welding on the entire circuit board. During use, the present invention will move the heating and welding device along the welding area on the surface of the circuit board, and perform targeted welding on the welding area on the circuit board, which can maximize the guarantee of sufficient welding of the circuit board and avoid the problem of solder leak on the surface of the circuit board. It also enables the placement machine to directly perform welding operations after placing the circuit board, and effectively improves the placement operation of the circuit board part in the power module.

[0018] 2. In the present invention, during the movement of the material discharging tray toward the top of the mounting base, the moving speed and position of the circuit board can be measured through the coordination between the rotating wheels and the strip slide rails, so that the mounting slot frame and the heating and welding equipment can be moved at coordinated speeds, making it easier for the heating and welding equipment to correspond to the position of the welded area on the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly describes the drawings required for describing the embodiments of the present invention. Obviously, the drawings described below are merely exemplary embodiments of the present invention. Those skilled in the art can, without inventive effort, derive other drawings based on the contents of the exemplary embodiments of the present invention and these drawings.

[0020] Figure 1 It is a schematic structural diagram of the present invention as a whole; Figure 2 It is a schematic structural diagram of a partial cross-section of the present invention; Figure 3 This is a schematic diagram of the structure of the processing machine, circuit board conveying equipment, mounting base and material discharge tray in the present invention; Figure 4 This is a schematic diagram of the structure of the mounting base, mounting slot frame, heating and welding equipment and curved rod-type slide bar in the present invention; Figure 5 It is a partial cross-sectional structural diagram of the mounting base, mounting slot frame, heating and welding equipment, curved rod-shaped slide bar and slide frame in the present invention; Figure 6 For the present invention Figure 5 A schematic diagram of the partially enlarged structure at point A in the middle; Figure 7 It is a partial cross-sectional structural diagram of the sliding trough, the mounting slide, the sliding base and the heating and welding equipment in the present invention; Figure 8 This is a schematic diagram of the structure of the sliding base, elastic sleeve, rotating ball and receiving groove in the present invention; Figure 9 It is a partial cross-sectional structural diagram of the cooperation among the sliding base, the elastic sleeve, the rotating ball and the receiving groove in the present invention; Figure 10 This is a schematic diagram of the structure of the material tray, strip slide rail and sensor in the present invention.

[0021] In the figure: 1. Processing machine; 2. SMT equipment; 3. Circuit board conveying equipment; 4. Mounting base; 5. Mounting slot frame; 6. Heating and welding equipment; 7. Bending rod type slide; 8. Sliding frame; 9. Sliding slot body; 10. Mounting slide; 11. Trapezoidal protrusion; 12. Sliding base; 13. Rotating ball; 14. Receiving slot; 15. Tension slot; 16. Through slot; 17. Slot; 18. Elastic sleeve; 19. Deformation slot; 20. Arc clamping piece; 21. Fixed socket; 22. Engaging block; 23. Material discharge tray; 24. Strip slide; 25. Rotating part; 26. Rotating wheel; 27. Encoder; 28. Sensor; 29. Calibration point; 30. Transmission screw; 31. Motor drive equipment. DETAILED DESCRIPTION

[0022] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention.

[0023] To simplify the drawings, only the parts relevant to the disclosure are schematically shown in each figure; they do not represent the actual structure of the product. Furthermore, to simplify the drawings and facilitate understanding, in some figures, only one of the components with the same structure or function is schematically shown or labeled. In this document, "one" not only means "only one" but also "more than one," and "several" includes "two" and "more than two."

[0024] It should be noted that, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in the present invention based on the specific circumstances.

[0025] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0026] In the description of this embodiment, the terms "up", "down", "left", "right", etc., and the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be understood as a limitation on the present invention.

[0027] In addition, in the description of the present application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0028] Example 1, as Figures 1 to 10 As shown, the present invention discloses a chip mounter for power module processing, including a processing machine 1, a chip mount device 2 for mounting circuit boards is provided in the processing machine 1, and circuit board conveying devices 3 are provided on both sides of the processing machine 1. The chip mount device 2 is a conventional technical device on the existing chip mounter. The chip mount device 2 can install multiple electronic components on the circuit board in sequence, and is a prior art device well known to those skilled in the art. The circuit board conveying device 3 is a prior art device that applies the working principle of the conveyor belt device to move the discharge tray 23 laterally. By placing the circuit board that needs to be mounted on the discharge tray 23, the discharge tray 23 and the circuit board are driven to move into the processing machine 1, so that the circuit board passes through the chip mount device 2 and the mounting base 4 in sequence, and then is moved out of the processing machine 1.

[0029] like Figures 1 to 5As shown, it also includes an installation base 4, which is arranged in the middle of the processing machine 1, and the installation base 4 is located at the bottom of the circuit board conveying equipment 3. The upper side of the installation base 4 is provided with an installation slot frame 5 for horizontal movement, and a sliding frame 8 is slidably connected in the installation base 4. The sliding frame 8 and the bottom of the installation base 4 are provided with a screw transmission structure, the installation slot frame 5 is fixedly connected to the top of the sliding frame 8, and the installation slot frame 5 and the sliding frame 8 move horizontally in the installation base 4. The screw transmission mechanism includes a transmission screw 30, which is rotatably connected in the installation base 4, and the bottom of the sliding frame 8 is matched with the transmission screw 30 for transmission. A motor drive device 31 is provided at the bottom of the installation base 4, and the output end of the motor drive device 31 is fixedly connected to the transmission screw 30. When it is necessary to drive the installation slot frame 5 and multiple heating welding devices 6 to move, the motor drive device 31 is started to drive the transmission screw 30 to rotate, so that the sliding frame 8 drives the installation slot frame 5 and multiple heating welding devices 6 to move.

[0030] like Figures 1 to 7 As shown, a plurality of heating and welding devices 6 for heating the flux are arranged to slide horizontally in the mounting slot frame 5. The heating and welding device 6 is a welding device that applies infrared radiation welding technology in the prior art and is a prior art device well known to those skilled in the art. The heating and welding device 6 can melt the solder paste in the welding area of the circuit board to complete the welding operation between the electronic components and the circuit board.

[0031] like Figures 3 to 7 As shown, a sliding groove body 9 is fixedly connected to the inner bottom wall of the mounting groove frame 5, and a mounting slide bar 10 is fixedly connected to the inner bottom wall of the sliding groove body 9. A trapezoidal protrusion 11 is provided on the top of the mounting slide bar 10. In order to allow the sliding base 12 to move laterally in the mounting groove frame 5, a sliding connection relationship is maintained between the bottom of the sliding base 12 and the mounting slide bar 10, and the trapezoidal protrusion 11 enters the receiving groove 14 at the bottom of the sliding base 12, preventing the sliding base 12 from easily moving out of the sliding groove body 9; like Figures 2 to 6As shown, the number of curved rod-type slides 7 corresponds to the number of heating and welding devices 6. A sliding structure is provided at the bottom of the heating and welding device 6. The sliding structure is slidably arranged in the mounting groove frame 5. The sliding structure includes a sliding base 12. The heating and welding device 6 is fixedly connected to the sliding base 12. The bottom of the sliding base 12 is located in the sliding groove body 9. The bottom ball hinge of the sliding base 12 is connected to a plurality of rotating balls 13. The rotating balls 13 are in contact with the inner bottom wall of the sliding groove body 9. The bottom of the sliding base 12 is provided with a receiving groove 14. The trapezoidal protrusion 11 extends into the receiving groove 14. The receiving groove 14 Tension grooves 15 are provided on both sides. When the sliding base 12 needs to be installed in the sliding groove body 9, the receiving groove 14 of the sliding base 12 is first made to correspond to the position of the installation slide 10, and then the sliding base 12 is squeezed in the direction of the installation slide 10. The trapezoidal protrusion 11 will squeeze the two sides of the receiving groove 14 to widen. The tension groove 15 can deform the bottom of the receiving groove 14, making it easier for the trapezoidal protrusion 11 to enter the receiving groove 14 smoothly. At this time, the rotating ball 13 contacts the inner bottom wall of the sliding groove body 9, and then the sliding base 12 can move laterally on the sliding groove body 9.

[0032] like Figures 4 to 9 As shown, the curved rod type slide 7 passes through the sliding structure, the sliding structure and the heating welding device 6 slide along the outer wall of the curved rod type slide 7, and the heating welding device 6 can be moved to the welding area at the bottom of the circuit board. A through groove 16 is provided in the middle of the sliding base 12, and a groove 17 is provided at the bottom of the through groove 16 for inserting the curved rod type slide 7 into the through groove 16. Both sides of the through groove 16 are set to be trumpet-shaped, and an elastic sleeve 18 is provided in the middle of the through groove 16. The elastic sleeve 18 is set to be hollow, and a plurality of deformation grooves 19 are provided on the inner wall of the elastic sleeve 18. The plurality of deformation grooves 19 are used to form a plurality of arc-shaped clamping pieces 20 inside the elastic sleeve 18. The arc-shaped clamping pieces 20 It fits with the curved rod-type slider 7. When the sliding base 12 needs to move along the outer wall of the curved rod-type slider 7 with a corresponding bending angle, the curved rod-type slider 7 can be replaced according to the differences in different welding areas on the circuit board, and then the curved rod-type slider 7 is moved into the through groove 16 through the slot 17 at the bottom of the sliding base 12, and then the multiple arc-shaped clamping pieces 20 are made to contact the outer wall of the curved rod-type slider 7. During the movement of the sliding base 12, the arc-shaped clamping pieces 20 can be offset toward the outer arc surface of the elastic sleeve 18, so that the sliding base 12 can adapt to the bending curvature of the curved rod-type slider 7, so that the sliding base 12 can move smoothly along the outer wall of the curved rod-type slider 7.

[0033] like Figures 4 to 6As shown, multiple fixed sockets 21 are fixedly connected to both sides of the top of the mounting base 4, and the multiple fixed sockets 21 on both sides correspond to each other. Engaging blocks 22 are provided on both sides of the curved rod type slide 7, and the engaging blocks 22 engage with the fixed sockets 21. When a different curved rod type slide 7 needs to be replaced, the engaging blocks 22 on both sides of the curved rod type slide 7 can be engaged with the fixed sockets 21, and then the curved rod type slide 7 can be kept fixed on the top of the mounting base 4.

[0034] like Figures 1 to 5 and Figure 10 As shown, a discharge tray 23 for placing circuit boards is movably provided on the circuit board conveying device 3. Strip rails 24 are fixedly connected to both sides of the bottom of the discharge tray 23. The length of the strip rails 24 is equal to the length of the circuit board. During the movement of the discharge tray 23, in order to determine the actual moving position of the circuit board, the moving position of the strip rails 24 on the top of the mounting base 4 is measured to determine the moving position of the circuit board and the distance to the remaining welding area. The top of the mounting base 4 is fixedly connected to a rotating member 25 on both sides, and a rotating wheel 26 is rotatably connected to the rotating member 25. The rotating wheel 26 contacts the inner wall of the strip slide 24. An encoder 27 for detecting the rotation circumference of the rotating wheel 26 is provided between the rotating wheel 26 and the rotating member 25. When the strip slide 24 moves to the upper side of the top of the mounting base 4 along with the material discharge tray 23, the rotating wheel 26 contacts the inner wall of the strip slide 24. The strip slide 24 drives the rotating wheel 26 to rotate during the movement, and the encoder 27 can be used to measure the rotation circumference of the rotating wheel 26 and prompt the operator through an electrical signal, so that the operator can judge the moving speed of the material discharge tray 23 and the circuit board, so that the operator can adjust the moving speed of the mounting slot frame 5 in a targeted manner; A plurality of sensors 28 are embedded in the inner top wall of the strip slide 24, and a calibration point 29 is embedded on the rotating wheel 26. The sensors 28 correspond to the calibration point 29. In order to avoid errors in the fit between the rotating wheel 26 and the strip slide 24, the spacing between the plurality of sensors 28 provided on the strip slide 24 is equal to the circumference of the rotating wheel 26. Therefore, in actual use, the rotating wheel 26 can be reset to determine the position of the calibration point 29 on the rotating wheel 26. Then, after the rotating wheel 26 contacts the strip slide 24, each sensor 28 is made to contact the calibration point 29 on the rotating wheel 26 in turn, thereby avoiding the problem of positioning error between the rotating wheel 26 and the strip slide 24. A control system that cooperates with the sensor 28 is provided on the processing machine 1 for receiving and transmitting the signal sent by the sensor 28 to instruct the operator.

[0035] The working principle of the chip mounter for power module processing: First, the circuit board that needs to be patched is placed on the discharge tray 23, and then the discharge tray 23 drives the circuit board to move into the processing machine 1, so that the patch equipment 2 first installs electronic components on the circuit board, and then the discharge tray 23 moves to the top of the mounting base 4. During the movement of the discharge tray 23, the strip slide 24 contacts the rotating wheel 26, and under the action of the encoder 27, the moving distance of the discharge tray 23 and the circuit board is detected. Then, the mounting slot frame 5 is driven to move on the top of the mounting base 4 through the screw transmission structure, so that the moving speed of the heating and welding equipment 6 matches the moving speed of the circuit board, and then the heating and welding equipment 6 heats and welds the welding area on the circuit board to weld the electronic components to the circuit board. In the process of moving the heating and welding equipment 6, the sliding base 12 will move along the outer wall of the curved rod-type slide 7, so that the heating and welding equipment 6 corresponds to different welding areas on the circuit board, completing the full welding operation on the circuit board.

[0036] It should be further explained that there are two ways to use multiple heating and welding devices 6 to weld the circuit board in the present invention. The first way is to make the curvature of the curved rod-shaped slider 7 completely consistent with the arrangement of the welding area on the circuit board. In this case, the position of the mounting slot frame 5 and the heating and welding device 6 can be moved while the circuit board and the top of the mounting base 4 are overlapped, so that the heating and welding device 6 moves along the outer wall of the curved rod-shaped slider 7, and the welding area on the circuit board is fully welded. Another way of using it is to adjust the position of the heating welding device 6 by bending the rod-shaped slider 7 during the movement of the heating welding device 6, and then stop moving the heating welding device 6. When the welding area on the circuit board moves from the top of the heating welding device 6, the heating welding device 6 welds the circuit board.

[0037] In the second embodiment, the present invention is based on a chip placement machine for power module processing, and further proposes a chip placement method for power module processing, which specifically includes the following steps: Step 1: PCB mounting: Place the PCB to be mounted on the unloading tray 23, and then the unloading tray 23 drives the PCB to move into the processing machine 1, so that the mounting equipment 2 first installs electronic components on the PCB; Step 2: Distance measurement: The unloading tray 23 moves toward the top of the mounting base 4. During the movement of the unloading tray 23, the strip slide 24 contacts the rotating wheel 26, and the encoder 27 detects the moving distance between the unloading tray 23 and the circuit board. Step 3: Welding: After moving the welding area of the circuit board to the upper side of the heating welding device 6, the heating welding device 6 heats and welds the welding area on the circuit board to weld the electronic components to the circuit board; Step 4: Mobile welding: The mounting slot frame 5 is driven to move on the top of the mounting base 4 through the screw transmission structure, so that the moving speed of the heating welding device 6 matches the moving speed of the circuit board. The sliding base 12 will move along the outer wall of the curved rod-shaped slide 7, so that the heating welding device 6 corresponds to different welding areas on the circuit board, and welding operations are performed on the welding areas of the circuit board.

[0038] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A chip placement machine for processing a power module, comprising a processing machine (1), wherein a chip placement device (2) for placing chips on a circuit board is provided in the processing machine (1), and circuit board conveying devices (3) are provided on both sides of the processing machine (1), characterized in that: Also includes: A mounting base (4), the mounting base (4) being arranged in the middle of the processing machine (1), the mounting base (4) being located at the bottom of the circuit board conveying device (3), a mounting slot frame (5) being arranged on the upper side of the mounting base (4) for horizontal movement, a plurality of heating welding devices (6) for heating the soldering flux being arranged in the mounting slot frame (5) for horizontal sliding movement; The number of the curved rod-shaped slide bars (7) corresponds to the number of the heating welding devices (6). The bottom of the heating welding devices (6) is provided with a sliding structure, the sliding structure is slidably arranged in the mounting slot frame (5), the curved rod-shaped slide bars (7) pass through the sliding structure, the sliding structure and the heating welding devices (6) slide along the outer wall of the curved rod-shaped slide bars (7), and the heating welding devices (6) can be moved to the welding area at the bottom of the circuit board.

2. A chip mounter for processing a power module according to claim 1, characterized in that: A sliding frame (8) is slidably connected in the mounting base (4), a screw transmission structure is provided between the sliding frame (8) and the bottom of the mounting base (4), the mounting groove frame (5) is fixedly connected to the top of the sliding frame (8), and the mounting groove frame (5) and the sliding frame (8) move laterally in the mounting base (4).

3. A chip mounter for processing a power module according to claim 2, characterized in that: A sliding trough body (9) is fixedly connected to the inner bottom wall of the mounting trough frame (5), a mounting slide bar (10) is fixedly connected to the inner bottom wall of the sliding trough body (9), and a trapezoidal protrusion (11) is provided on the top of the mounting slide bar (10).

4. A chip mounter for processing a power module according to claim 3, characterized in that: The sliding structure comprises: A sliding base (12), the heating welding device (6) is fixedly connected to the sliding base (12), the bottom of the sliding base (12) is located in the sliding trough body (9), the bottom ball joint of the sliding base (12) is connected to a plurality of rotating balls (13), the rotating balls (13) are in contact with the inner bottom wall of the sliding trough body (9), the bottom of the sliding base (12) is provided with a receiving groove (14), the trapezoidal protrusion (11) extends into the receiving groove (14), and tension grooves (15) are provided on both sides of the receiving groove (14).

5. A chip mounter for processing a power module according to claim 4, characterized in that: A through groove (16) is provided in the middle of the sliding base (12), and a groove (17) is provided at the bottom of the through groove (16) for inserting the curved rod-type slide bar (7) into the through groove (16). Both sides of the through groove (16) are configured to be trumpet-shaped, and an elastic sleeve (18) is provided in the middle of the through groove (16).

6. A chip mounter for processing a power module according to claim 5, characterized in that: The elastic sleeve (18) is hollow, and a plurality of deformation grooves (19) are provided on the inner wall of the elastic sleeve (18). The plurality of deformation grooves (19) are used to form a plurality of arc-shaped clamping pieces (20) inside the elastic sleeve (18), and the arc-shaped clamping pieces (20) are fitted with the curved rod-type slide bar (7).

7. A chip mounter for processing a power module according to claim 6, characterized in that: A plurality of fixed sockets (21) are fixedly connected to both sides of the top of the mounting base (4), and the plurality of fixed sockets (21) located on both sides correspond to each other one by one. Engaging blocks (22) are provided on both sides of the curved rod-shaped slide (7), and the engaging blocks (22) engage with the fixed sockets (21).

8. A chip mounter for processing a power module according to claim 7, characterized in that: A material discharging tray (23) for placing the circuit board is movably provided on the circuit board conveying device (3), and strip-shaped slide rails (24) are fixedly connected to both sides of the bottom of the material discharging tray (23), and the length of the strip-shaped slide rails (24) is equal to the length of the circuit board.

9. A chip mounter for processing a power module according to claim 8, characterized in that: Both sides of the top of the mounting base (4) are fixedly connected to a rotating member (25), a rotating wheel (26) is rotatably connected inside the rotating member (25), the rotating wheel (26) contacts the inner wall of the strip-shaped slide rail (24), an encoder (27) for detecting the rotational circumference of the rotating wheel (26) is provided between the rotating wheel (26) and the rotating member (25), a plurality of sensors (28) are embedded in the inner top wall of the strip-shaped slide rail (24), a calibration point (29) is embedded on the rotating wheel (26), and the sensor (28) corresponds to the calibration point (29).

10. A chip placement method for processing a power module, using the chip placement machine for processing a power module according to claim 9, characterized in that: The following steps are involved: Step 1: Mounting of circuit boards: placing the circuit boards to be mounted on the material placement tray (23), and then the material placement tray (23) drives the circuit boards to move into the processing machine (1), so that the mounting device (2) first mounts electronic components on the circuit boards; Step 2: Distance measurement: the material discharging tray (23) moves toward the top of the mounting base (4). During the movement of the material discharging tray (23), the strip-shaped slide rail (24) contacts the rotating wheel (26), and the moving distance between the material discharging tray (23) and the circuit board is detected under the action of the encoder (27); Step 3, welding: after moving the welding area of the circuit board to the upper side of the heating welding device (6), the heating welding device (6) heats and welds the welding area on the circuit board, and welds the electronic components to the circuit board; Step 4: Mobile welding: The mounting slot frame (5) is driven to move on the top of the mounting base (4) by the screw transmission structure, the moving speed of the heating welding device (6) matches the moving speed of the circuit board, the sliding base (12) moves along the outer wall of the curved rod-shaped slide (7), and the heating welding device (6) corresponds to different welding areas on the circuit board to perform welding operations on the welding areas of the circuit board.

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