Circuit board manufacturing apparatus and circuit board manufacturing method

Abstract

In the device for manufacturing the circuit board, the circuit board comprises: a substrate; the insulating layer is fixed on the substrate; and a circuit part formed using a conductive material and fixed to the insulating layer. An apparatus for manufacturing a circuit board is provided with a pressurizing unit (a first pressurizing unit, a second pressurizing unit) having a lower die having a receiving jig on which a substrate is disposed, an upper die disposed above the lower die, and a heater for heating the upper die and the lower die, respectively. Furthermore, the device for manufacturing the circuit board is provided with preheating parts (a first preheating part and a second preheating part), the preheating parts are arranged on a path for conveying the substrate and the insulating layer to the pressing part side and a path for conveying the substrate, the insulating layer and the circuit part to the pressing part side, and the preheating parts heat the substrate and the insulating layer or heat the substrate, the insulating layer and the circuit part.

Description

Technical Field

[0001] The present disclosure relates to a circuit substrate manufacturing device and a circuit substrate manufacturing method. Background Art

[0002] Japanese Patent Publication No. 2003-48249 discloses a device that continuously presses and bonds two or more sheets with concave and convex shapes formed on at least one sheet under high vacuum, such as bonding a printed circuit board sheet with a concave and convex surface to its cover sheet. When using the device described in this document to bond two sheets together, first, the two sheets are placed between upper and lower pressing members and clamped between the upper and lower pressing members. At this time, the parts of the upper and lower pressing members that clamp the two sheets are completely sealed. When the two sheets are clamped and fixed by the upper and lower pressing members, and the lower surface of the sliding frame is tightly bonded to the upper surface of the support platform with high airtightness throughout the entire surface, an airtight partition chamber surrounded by the inner peripheral surface of the frame and the lower surface of the push block is formed on the support platform. Then, by evacuating the partition chamber, the bubbles between the two sheets can be removed. Then, the two sheets are further sandwiched between the support table and the push block and heated and pressed, thereby being thermocompression-bonded under high vacuum. Summary of the Invention

[0003] Problems to be solved by the invention

[0004] Furthermore, it would be ideal to shorten the heating and pressing time for a circuit board in which the insulating layer is fixed to the metal substrate through a heating and pressing process, and the circuit portion is fixed to the insulating layer through a heating and pressing process. However, the device described in Japanese Patent Application Laid-Open No. 2003-48249 does not take this requirement into account.

[0005] The present disclosure has been made in consideration of the above-mentioned circumstances, and an object thereof is to provide a circuit board manufacturing apparatus and a circuit board manufacturing method capable of shortening the time of the heating and pressing step.

[0006] Solutions for solving problems

[0007] For the manufacturing device of the circuit substrate of the first scheme, the circuit substrate has: a substrate, which is formed using a metal material; an insulating layer, which is formed into a sheet using an insulating material and fixed on the substrate; and a circuit part, which is formed using a conductive material and fixed on the insulating layer, the manufacturing device has: a pressurizing part, which has a lower mold, an upper mold and a heater, wherein the lower mold has a substrate setting part for setting the substrate, the upper mold is arranged on the upper side relative to the lower mold, and the upper mold presses the insulating layer or the circuit part toward the substrate side by engaging with the lower mold, and the heater heats the upper mold and the lower mold respectively; and a preheating part, which is provided on the path for conveying the substrate and the insulating layer toward the pressurizing part side and on the path for conveying the substrate, the insulating layer and the circuit part toward the pressurizing part side, and heats the substrate and the insulating layer, or heats the substrate, the insulating layer and the circuit part.

[0008] The manufacturing method of the circuit substrate of the second scheme uses the manufacturing device of the circuit substrate of the first scheme, and has the following steps: a first heating step, while conveying the substrate and the insulating layer to the side of the pressurizing part, heating the substrate and the insulating layer by the preheating part; a first setting step, setting the substrate in the state where the insulating layer is set on the substrate on the substrate setting part; a first heating and pressing step, making the upper mold and the lower mold engage, pressing the insulating layer toward the substrate side, thereby fixing the insulating layer to the substrate; a first unloading step, making the upper mold separate from the lower mold, and removing the substrate with the insulating layer fixed from the substrate setting part the second step of heating the substrate, the insulating layer and the circuit portion to the pressurizing portion while conveying the substrate, the insulating layer and the circuit portion to the pressurizing portion; the second step of setting the substrate with the circuit portion set on the insulating layer to the substrate setting portion; the second step of heating and pressing the upper mold and the lower mold to engage the circuit portion to press the circuit portion toward the substrate, thereby fixing the circuit portion to the insulating layer; and the second step of removing the upper mold from the lower mold to remove the substrate with the circuit portion fixed on the insulating layer from the substrate setting portion.

[0009] The method for manufacturing a circuit substrate of the third embodiment is the method for manufacturing a circuit substrate of the second embodiment, wherein in the first heating step, the temperature of the substrate and the insulating layer is raised to a first temperature; in the first heating and pressurizing step, the temperature of the substrate and the insulating layer is raised to a second temperature higher than the first temperature; in the second heating step, the temperature of the substrate, the insulating layer and the circuit portion is raised to a third temperature; and in the second heating and pressurizing step, the temperature of the substrate and the insulating layer is raised to a fourth temperature higher than the third temperature.

[0010] According to the manufacturing device of the circuit substrate of the first embodiment, for example, the manufacturing method of the second embodiment can be applied. In the manufacturing method of the second embodiment, first, while conveying the substrate and the insulating layer to the pressurizing part side, the substrate and the insulating layer are heated by the preheating part (first heating process). Then, the substrate in a state where the insulating layer is provided on the substrate is set in the substrate setting part (first setting process). Then, the upper mold and the lower mold are engaged, and the insulating layer is pressed toward the substrate side, thereby fixing the insulating layer to the substrate (first heating and pressurizing process). Then, the upper mold is separated from the lower mold, and the substrate with the insulating layer fixed is removed from the substrate setting part (first removal process). Then, while conveying the substrate, the insulating layer and the circuit part to the pressurizing part side, the substrate, the insulating layer and the circuit part are heated by the preheating part (second heating process). Then, the substrate in a state where the circuit part is provided on the insulating layer is set in the substrate setting part (second setting process). Next, the upper mold is engaged with the lower mold, and the circuit part is pressed toward the substrate side, thereby fixing the circuit part to the insulating layer (second heating and pressing process). Next, the upper mold is separated from the lower mold, and the substrate with the circuit part fixed on the insulating layer is removed from the substrate setting part (second removing process). After these processes, the circuit substrate is manufactured. Here, in the manufacturing method of the second scheme, before the first heating and pressing process is performed, the substrate and the insulating layer can be heated in the first heating process. Thus, the time for heating the substrate and the insulating layer in the first heating and pressing process is shortened, and as a result, the time of the first heating and pressing process can be shortened. In addition, in the manufacturing method of the second scheme, before the second heating and pressing process is performed, the substrate, the insulating layer and the circuit part can be heated in the second heating process. Thus, the time for heating the substrate, the insulating layer and the circuit part in the second heating and pressing process is shortened, and as a result, the time of the second heating and pressing process can be shortened.

[0011] In the manufacturing method of the third embodiment, in the first heating process, the temperature of the substrate and the insulating layer is raised to a first temperature. In addition, in the first heating and pressing process, the substrate and the insulating layer are raised to a second temperature higher than the first temperature. Thus, for example, when a thermosetting adhesive is used to fix the insulating layer to the substrate, it is possible to suppress excessive curing of the adhesive in the first heating process. In addition, in the manufacturing method of the third embodiment, in the second heating process, the temperature of the substrate, the insulating layer, and the circuit portion is raised to a third temperature. In addition, in the second heating and pressing process, the substrate, the insulating layer, and the circuit portion are raised to a fourth temperature higher than the third temperature. Thus, for example, when a thermosetting adhesive is used to fix the circuit portion to the insulating layer, it is possible to suppress excessive curing of the adhesive in the second heating process.

[0012] Effects of the Invention

[0013] The circuit board manufacturing apparatus and circuit board manufacturing method disclosed herein have the excellent effect of shortening the time of the heating and pressing step. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a perspective view showing a circuit board.

[0015] Figure 2 It is a cross-sectional view showing a circuit substrate.

[0016] Figure 3 This is a block diagram showing a portion of a circuit board manufacturing apparatus.

[0017] Figure 4 This is a block diagram showing another part of the circuit board manufacturing apparatus.

[0018] Figure 5 It is a perspective view showing an insulating layer formed on a PET film.

[0019] Figure 6 It is a perspective view for explaining the process in the insulation layer cutting section.

[0020] Figure 7 It is a perspective view showing the common conveying jig and the positioning jig.

[0021] Figure 8 This is a perspective view for explaining the process in the first setting unit, and shows a state where the substrate is set on the common transport jig.

[0022] Figure 9 This is a perspective view for explaining the process in the first installation section, showing the process of providing an insulating layer and the like on a substrate.

[0023] Figure 10AThis is a side view for explaining the process performed in the first preheating section.

[0024] Figure 10B This is a graph showing the relationship between the temperature of the substrate and time in the first heating step and the like.

[0025] Figure 11 is a side view showing a device used in the first pressurizing unit.

[0026] Figure 12 It is a plan view showing the heating and pressurizing section and the conveying section.

[0027] Figure 13 It is a side sectional view showing a heating and pressing section and the like.

[0028] Figure 14 It is a top view showing the receiving jig.

[0029] Figure 15 It is a side sectional view showing the process of pressing the insulating layer provided on the substrate toward the substrate side.

[0030] Figure 16 It is a side view for explaining the first insulating layer fixing step.

[0031] Figure 17 It is a side view for explaining the first insulating layer fixing step.

[0032] Figure 18 It is a side view for explaining the second insulating layer fixing step.

[0033] Figure 19 It is a side view for explaining the third insulating layer fixing step and the fourth insulating layer fixing step.

[0034] Figure 20 It is a side view for explaining the third insulating layer fixing step and the fourth insulating layer fixing step.

[0035] Figure 21 It is a side view for explaining the fifth insulating layer fixing step.

[0036] Figure 22 It is a side view for explaining the sixth insulating layer fixing step and the seventh insulating layer fixing step.

[0037] Figure 23 It is a side view for explaining the process performed by the first removal part.

[0038] Figure 24 It is a side view for explaining the process performed by the first cooling unit.

[0039] Figure 25This is a perspective view for explaining the process performed by the first peeling unit.

[0040] Figure 26 This is a perspective view for explaining the process performed by the first inspection unit.

[0041] Figure 27 This is a perspective view for explaining the process performed by the circuit portion bonding section.

[0042] Figure 28 This is a perspective view for explaining the process in the second installation section, showing the process of installing the circuit section and the like on the substrate.

[0043] Figure 29 It is a side sectional view showing the process of pressing the circuit portion provided on the substrate toward the substrate.

[0044] Figure 30 It is a side view for explaining the process performed by the second removal part.

[0045] Figure 31 It is a side view for explaining the process performed by the second cooling unit.

[0046] Figure 32 This is a perspective view for explaining the process performed by the second peeling unit.

[0047] Figure 33 This is a perspective view for explaining the process performed by the second inspection unit. DETAILED DESCRIPTION

[0048] use Figures 1 to 33 , a circuit substrate manufacturing apparatus 10 and a circuit substrate manufacturing method according to an embodiment of the present disclosure are described. It should be noted that the arrow UP shown in the figure indicates the upper side of the circuit substrate manufacturing apparatus 10. First, the schematic structure of the circuit substrate 12 is described, followed by a description of the structure of the circuit substrate manufacturing apparatus 10 and the circuit substrate manufacturing method.

[0049] (Schematic Structure of Circuit Board 12)

[0050] like Figure 1 and Figure 2 As shown, the circuit board 12 includes: a substrate 12 ; an insulating layer 16 fixed on the substrate 12 ; and a circuit portion 18 fixed on the insulating layer 16 .

[0051] The substrate 12 is formed of a metal material. It includes a rectangular plate-shaped portion 14A and a plurality of heat dissipation portions 14B protruding from the plate-shaped portion 14A. An insulating layer 16 and a circuit portion 18 are laminated and fixed to one side of the plate-shaped portion 14A in the thickness direction. The heat dissipation portions 14B protrude from the other side of the plate-shaped portion 14A in the thickness direction toward the side opposite to the plate-shaped portion 14A. For example, the heat dissipation portions 14B are cylindrical and regularly spaced apart.

[0052] The insulating layer 16 is formed in a sheet shape using an insulating material and is interposed between the plate-shaped portion 14A of the substrate 12 and the circuit portion 18 to ensure insulation between the two.

[0053] The circuit portion 18 is formed in a rectangular plate shape using a conductive material. In this embodiment, a plurality of circuit portions 18 formed in a predetermined pattern are fixed to the insulating layer 16 .

[0054] (Circuit Board Manufacturing Apparatus 10 and Circuit Board Manufacturing Method)

[0055] Figure 3 and Figure 4 , a block diagram schematically showing a circuit substrate manufacturing apparatus 10 (hereinafter referred to as “manufacturing apparatus 10”) used in manufacturing the circuit substrate 12 is shown. Figure 3 As shown, the manufacturing apparatus 10 includes an insulation layer cutting unit 20, a first setting unit 22, a first preheating unit 24, a first pressing unit 26, a first unloading unit 28, a first cooling unit 30, a first peeling unit 32, and a first inspection unit 34. Figure 4 As shown, the manufacturing apparatus 10 includes a circuit portion attaching unit 36 , a second installation unit 38 , a second preheating unit 40 , a second pressurizing unit 42 , a second removing unit 44 , a second cooling unit 46 , a second peeling unit 48 , and a second inspection unit 50 .

[0056] like Figure 3 、 Figure 5 as well as Figure 6 As shown, in the insulation layer cutting portion 20, the insulation layer 16 is cut into a predetermined shape and size. Figure 5 As shown in FIG. 1 , the insulating layer 16 is formed in a sheet shape along a film 52 formed using polyethylene terephthalate (hereinafter referred to as PET film 52). Figure 6As shown, the insulating layer cutting section 20 includes: a cutting table 54 for placing the insulating layer 16 together with the PET film 52; and a cutter 56 for cutting the insulating layer 16 placed on the cutting table 54 together with the PET film 52. Furthermore, in the process in the insulating layer cutting section 20, first, the insulating layer 16 is placed (set) on the cutting table 54 together with the PET film 52 in a state where the insulating layer 16 faces downward relative to the PET film 52. Then, the cutter 56 moves on the cutting table 54 along a prescribed trajectory, thereby cutting the insulating layer 16 together with the PET film 52 into a prescribed shape and size. It should be noted that Figure 6 The cut portion is depicted by a two-dot chain line. In this embodiment, by cutting the insulating layer 16 together with the PET film 52, deformation of the insulating layer 16 near the cut portion is suppressed compared to when the insulating layer 16 is cut alone. It should be noted that each process in the insulating layer cutting unit 20 can be performed entirely automatically, or partially or entirely manually.

[0057] like Figure 3 、 Figure 7 、 Figure 8 as well as Figure 9 As shown, in the first installation portion 22, the insulating layer 16 cut into a predetermined shape and size by the insulating layer cutting portion 20 is installed on the substrate 12. Figure 7 As shown, in the first setting portion 22, a conveying portion 66 (see Figure 10A ) for transporting and a positioning fixture 60 engaged with the common transport fixture 58. The common transport fixture 58 includes a substrate setting portion 58A for setting the substrate 12 in an embedded state. The positioning fixture 60 is formed of the same metal material as the common transport fixture 58. A rectangular positioning hole 60A is formed in the positioning fixture 60 in a manner that penetrates in the up and down directions. In addition, the positioning fixture 60 engages with the common transport fixture 58 from the upper side, thereby limiting the movement of the positioning fixture 60 relative to the common transport fixture 58 in the horizontal direction (the direction perpendicular to the up and down direction). In addition, in the process in the first setting portion 22, first, as Figure 8 As shown in FIG. 1 , the substrate 12 is placed on the substrate placement portion 58A of the common conveying jig 58 with the plurality of heat dissipation portions 14B facing downward. Figure 9As shown, the positioning jig 60 is engaged with the co-conveying jig 58 from above. When the positioning jig 60 is engaged with the co-conveying jig 58, the portion of the plate-shaped portion 14A of the substrate 12 to which the insulating layer 16 is fixed is exposed upward through the positioning hole 60A. Next, an adhesive is applied to the surface of the insulating layer 16 opposite the PET film 52. Next, with the side of the insulating layer 16 coated with the adhesive facing downward, the insulating layer 16 is placed in the positioning hole 60A of the positioning jig 60, and the insulating layer 16 is placed on the plate-shaped portion 14A of the substrate 12 together with the PET film 52. Next, a metal plate 62 and thick paper 64, whose shape and size as viewed from above are set to correspond to the shape and size of the insulating layer 16, are placed in the positioning hole 60A of the positioning jig 60, and the metal plate 62 and thick paper 64 are placed on the insulating layer 16 (on the PET film 52). It should be noted that all the processes in the first setting part 22 can be performed automatically, or all or part of the processes in the first setting part 22 can be performed manually.

[0058] like Figure 3 and Figure 10A As shown, in the first preheating section 24 as a preheating section, the substrate 12 and the insulating layer 16 are heated. Figure 10A As shown, the first preheating section 24 includes a heating furnace 68, which is arranged to surround a conveying section 66 that conveys the common conveying jig 58. The temperature within the heating furnace 68 is maintained at a predetermined temperature. Furthermore, during the process in the first preheating section 24, the common conveying jig 58 is conveyed by the conveying section 66, thereby moving the common conveying jig 58 within the heating furnace 68. This heats the substrate 12 placed on the common conveying jig 58 and the insulating layer 16 provided on the substrate 12 (a first heating process).

[0059] In the first heating step, the temperatures of substrate 14 and insulating layer 16 are raised to a first temperature T1, which is the target temperature. It should be noted that first temperature T1 is a temperature at which the adhesive applied to insulating layer 16 is not yet completely cured. Specifically, by adjusting the temperature within heating furnace 68 and the time that substrate 12 and insulating layer 16 pass through heating furnace 68, the temperatures of substrate 14 and insulating layer 16 are raised to the first temperature T1, which is the target temperature. Figure 10B, a graph showing the relationship between the temperature of substrate 14 and time from the start of the first heating step to the completion of the first heating and pressing step (described later) is shown. It should be noted that the temperature of insulating layer 16 is approximately the same as that of substrate 14. Furthermore, the range indicated by reference symbol H1 represents the range from the start to the completion of the first heating step. As shown in the figure, as substrate 12 and insulating layer 16 pass through heating furnace 68 at a predetermined time, the temperatures of substrate 14 and insulating layer 16 rise to the first target temperature T1.

[0060] like Figure 3 and Figures 11 to 22 As shown in FIG. 1 , in the first pressurizing portion 26 as the pressurizing portion, the insulating layer 16 provided on the substrate 12 is pressed toward the substrate 12 side. Figure 11 and Figure 12 As shown, the first pressurizing unit 26 comprises: a pressurizing unit main body 70 having a mechanism for pressing an upper mold 86 to be described later toward a lower mold 84; a preparation unit 72 provided adjacent to the pressurizing unit main body 70; and a heating and pressurizing unit conveying unit 73 for moving a heating and pressurizing unit 74 to be described later and the like between the pressurizing unit main body 70 and the preparation unit 72. Figure 13 As shown, the first pressurizing unit 26 includes two heating and pressurizing units 74 on which the substrate 12 and the like are placed, and an air suction unit 76 .

[0061] like Figure 11 As shown, the pressurizing unit main body 70 includes a hydraulic cylinder 78 and an upper die engaging portion 80 supported by the hydraulic cylinder 78. An upper die 86, described later, is detachably engaged with the upper die engaging portion 80. Furthermore, as the hydraulic cylinder 78 operates, the upper die engaging portion 80 presses the upper die 86 downward. It should be noted that the hydraulic cylinder 78 in this embodiment is composed of a high-pressure cylinder 78A and a low-pressure cylinder 78B stacked in the vertical direction.

[0062] The preparation section 72 includes an upper die lifter 82 for lifting an upper die 86 described later. The upper die 86 can be lifted or lowered relative to the lower die 84 by the operation of the upper die lifter 82.

[0063] like Figure 11 and Figure 12As shown, the heating and pressurizing section conveying section 73 includes: a rotating section 73A that can rotate in an axial direction with the up-down direction as the axial direction; and two lower mold engaging sections 73B fixed to the upper part of the rotating section 73A. The two heating and pressurizing sections 74 described later are respectively engaged with the two lower mold engaging sections 73B. Moreover, as the rotating section 73A rotates, the lower mold engaging section 73B on one side moves from the pressurizing section main body 70 to the preparation section 72, and the lower mold engaging section 73B on the other side moves from the preparation section 72 to the pressurizing section main body 70. As a result, the heating and pressurizing section 74 on the lower mold engaging section 73B on one side moves from the pressurizing section main body 70 to the preparation section 72, and the heating and pressurizing section 74 on the lower mold engaging section 73B on the other side moves from the preparation section 72 to the pressurizing section main body 70. The position on the lower die engaging portion 73B of the preparation portion 72 is referred to as “preparation position P1 ”, and the position on the lower die engaging portion 73B of the pressurizing portion main body 70 is referred to as “pressurizing position P2 ”.

[0064] like Figure 13 As shown in FIG, the two heating and pressing parts 74 have the same structure. Figure 13 1 and 2 show only the heating and pressing section 74 disposed on the side of the pressing section main body 70. The heating and pressing section 74 includes a lower mold 84, an upper mold 86 engaged with the lower mold 84, and a receiving jig 88 fixed to the lower mold 84 as a substrate placement portion.

[0065] The lower mold 84 includes: a lower plate portion 84A fixed to the lower mold engaging portion 73B; and a central protrusion 84B protruding upward from the horizontal center portion of the lower plate portion 84A. A receiving fixture 88, which will be described later, is fixed to the upper surface of the central protrusion 84B. In addition, a heater 90 for heating the lower mold 84 is provided on the lower plate portion 84A. Moreover, an O-ring 92 is mounted on the central protrusion 84B. A vacuum path 84C is formed between the lower plate portion 84A and the central protrusion 84B. One end of the vacuum path 84C is open to the upper surface of the central protrusion 84B, and the other end is connected to the air suction portion 76 such as a vacuum pump.

[0066] The upper mold 86 is arranged on the upper side of the lower mold 84. The upper mold 86 comprises: an upper plate portion 86A, which is detachably connected to the upper mold engaging portion 80 and the upper mold lifting portion 82 (see Figure 11) engages; and a peripheral wall portion 86B protrudes downward from the horizontal end of the upper plate portion 86A. Furthermore, the upper mold 86 engages with the lower mold 84 by moving the upper mold 86 toward the lower mold 84. When the upper mold 86 and the lower mold 84 are engaged, the central protrusion 84B of the lower mold 84 is positioned inside the peripheral wall portion 86B of the upper mold 86. This creates a sealed space 94 between the upper mold 86 and the lower mold 84, surrounding the receiving fixture 88. It should be noted that when the upper mold 86 and the lower mold 84 are engaged, the gap between the central protrusion 84B of the lower mold 84 and the peripheral wall portion 86B of the upper mold 86 is sealed by an O-ring 92. Furthermore, a heater 90 for heating the upper mold 86 is provided on the upper plate portion 86A. Furthermore, the upper mold 86 includes a concentrated pressing portion 86 that protrudes downward from the horizontal center portion of the upper plate portion 86A.

[0067] Figure 14 1 shows a top view of the receiving fixture 88 viewed from above. The receiving fixture 88 is formed in a rectangular block shape. In addition, a plurality of insertion holes 88A are formed in the receiving fixture 88 and are open on the upper side. These plurality of insertion holes 88A are connected to the plurality of heat dissipation portions 14B of the substrate 12 (see FIG. Figure 1 ) correspond to each other and are regularly arranged at prescribed intervals. Figure 15 As shown, with the plurality of heat dissipating portions 14B of the substrate 12 respectively inserted into the plurality of insertion holes 88A, the substrate 12 is placed on the receiving jig 88. When the substrate 12 is placed on the receiving jig 88, the lower surface of the plate-like portion 14A (the surface of the substrate 12 that constitutes the bottom surface of the plurality of heat dissipating portions 14B) contacts the upper surface of the receiving jig 88.

[0068] Then, if Figure 16 As shown, in the process in the first pressurizing section 26, first, the substrate 12 that has completed the process in the first preheating section 24 (passed through the heating furnace 68) is set to the heating and pressurizing section 74 arranged at the preparation position P1. Here, the substrate 12 is moved together with the positioning fixture 60 and the like by a robot (not shown) and is set to the receiving fixture 88 arranged at the preparation position P1 (first setting process). Then, as shown in FIG. Figure 17 As shown, by operating the upper mold lifting unit 82, the upper mold 86 and the lower mold 84 are engaged at the preparation position P1 (first insulation layer fixing step). Here, the upper mold 86 and the lower mold 84 are heated to a predetermined temperature by the aforementioned heater 90. Furthermore, when the upper mold 86 and the lower mold 84 are engaged at the preparation position P1, the air suction unit 76 is activated to suck the air from the sealed space 94 between the upper mold 86 and the lower mold 84. In other words, the sealed space 94 between the upper mold 86 and the lower mold 84 is evacuated.

[0069] Then, if Figure 18As shown, by rotating the rotating portion 73A, the heating and pressing portion 74 disposed at the preparation position P1 moves toward the pressing position P2. At this time, the heating and pressing portion 74 disposed at the pressing position P2 moves toward the preparation position P1 (second insulating layer fixing step).

[0070] Then, if Figure 19 As shown, upper mold engaging portion 80 is engaged with upper mold 86, and upper mold 86 is pressed toward lower mold 84 at pressurizing position P2, thereby pressing insulating layer 16 toward substrate 12. This secures insulating layer 16 to substrate 12 (first heating and pressing step, third insulating layer securing step). It should be noted that during the third insulating layer securing step, the state of insulating layer 16 being pressed toward substrate 12 is maintained for a predetermined period of time. Furthermore, during the third insulating layer securing step, while upper mold 86 and lower mold 84 are heated by heater 90, a vacuum is evacuated within sealed space 94 between upper mold 86 and lower mold 84.

[0071] Here, in the first heating and pressing process, the temperature of the substrate 14 and the insulating layer 16 rises to the second temperature T2, which is the target temperature. It should be noted that the second temperature T2 is a temperature that promotes the curing of the adhesive applied to the insulating layer 16 compared to the first temperature T1. Specifically, by adjusting the temperature of the lower mold 84 and the upper mold 86 and the time the substrate 12 and the insulating layer 16 are arranged between the lower mold 84 and the upper mold 86, the temperature of the substrate 14 and the insulating layer 16 rises to the second temperature T2, which is the target temperature. Figure 10B In the figure, the range indicated by reference symbol H2 represents the range from the start to the end of the first heating and pressing step. As shown in the figure, by positioning substrate 12 and insulating layer 16 between lower mold 84 and upper mold 86 for a predetermined period of time, the temperature of substrate 14 and insulating layer 16 rises to the second target temperature T2.

[0072] like Figure 19 As shown, simultaneously (in parallel) with the third insulating layer fixing step, the substrate 12 that has completed the step in the first preheating section 24 (passed through the heating furnace 68) is set to the heating and pressing section 74 arranged at the preparation position P1 (first setting step). Figure 20 As shown, by operating the upper mold lifting unit 82, the upper mold 86 and the lower mold 84 are engaged at the preparation position P1 (the fourth insulation layer fixing step). In addition, when the upper mold 86 and the lower mold 84 are engaged at the preparation position P1, the air suction unit 76 is operated to evacuate the sealed space 94 between the upper mold 86 and the lower mold 84.

[0073] Then, if Figure 21As shown, after the upper mold engaging portion 80 and the upper mold 86 are disengaged, the rotating portion 73A is rotated, thereby moving the heating and pressing portion 74, which has completed the third insulating layer fixing step, from the pressing position P2 to the preparation position. At this time, the heating and pressing portion 74, which has completed the fourth insulating layer fixing step, moves from the preparation position P1 to the pressing position P2 (fifth insulating layer fixing step).

[0074] Then, if Figure 22 As shown, upper mold engaging portion 80 is engaged with upper mold 86, and upper mold 86 is pressed toward lower mold 84 at pressurizing position P2, thereby pressing insulating layer 16 toward substrate 12. Insulating layer 16 is thereby fixed to substrate 12 (first heating and pressing step, sixth insulating layer fixing step).

[0075] Simultaneously (and in parallel) with the sixth insulating layer fixing step, the substrate 12, to which the insulating layer 16 is fixed, is removed from the heating and pressing section 74 located at the preparation position P1. Here, a robot (not shown) operates to move the substrate 12 together with the positioning jig 60 and the like, and removes the substrate 12 from the receiving jig 88 located at the preparation position P1 (a first removing step). The substrate 12 removed from the receiving jig 88 is returned to the common transport jig 58 on the transport section 66 together with the positioning jig 60 and the like. Next, the substrate 12 that has completed the process in the first preheating section 24 (passed through the heating furnace 68) is set in the heating and pressing section 74 located at the preparation position P1 (a first setting step, a seventh insulating layer fixing step). In this manner, by repeating the first to seventh insulating layer fixing steps, the substrates 12 and the like that have completed the processes in the first preheating section 24 are sequentially placed in the first press section 26. Furthermore, the substrates 12 and the like placed in the first press section 26 are sequentially conveyed to the next step.

[0076] In the first pressurizing section 26 of the manufacturing apparatus 10 of this embodiment, the third and fourth insulating layer fixing steps can be performed simultaneously. Furthermore, the sixth and seventh insulating layer fixing steps can be performed simultaneously. This prevents the waiting time before the steps of fixing the substrate 12 and the insulating layer 16 from being prolonged. Specifically, while the insulating layer 16 is pressed toward the substrate 12 at pressurizing position P2, the substrate 12 with the insulating layer 16 fixed thereto can be removed from the heating and pressurizing section 74 at the preparation position P1. Furthermore, while the insulating layer 16 is pressed toward the substrate 12 at pressurizing position P2, the substrate 12 before the insulating layer 16 is fixed can be placed in the heating and pressurizing section 74 at the preparation position P1. Furthermore, while the insulating layer 16 is pressed toward the substrate 12 at pressurizing position P2, the substrate 12 before the insulating layer 16 is fixed can be heated at the preparation position P1 using heaters 90 provided in the upper mold 86 and lower mold 84, respectively. Furthermore, while insulating layer 16 is being pressed toward substrate 12 at pressurizing position P2, enclosed space 94 formed between upper mold 86 and lower mold 84 can be evacuated at preparation position P1. Thus, in this embodiment, the time required to wait idly before placing substrate 12 or the like, which has completed the process in first preheating section 24, into first pressurizing section 26 can be reduced.

[0077] In addition, in this embodiment, if Figure 15 As shown, the substrate 12 is placed on the receiving jig 88, with the plurality of heat dissipating portions 14B of the substrate 12 respectively inserted into the plurality of insertion holes 88A of the receiving jig 88. When the substrate 12 is placed on the receiving jig 88, the lower surface of the plate-shaped portion 14A (the surface of the substrate 12 that constitutes the bottom surface of the plurality of heat dissipating portions 14B) contacts the upper surface of the receiving jig 88. Thus, the bottom surface of the plurality of heat dissipating portions 14B in the substrate 12 can be supported by the upper surface of the receiving jig 88. As a result, even when using a metal substrate 12 having a plurality of heat dissipating portions 14B formed in a convex shape, it is possible to pressurize the fixed portion of the insulating layer 16.

[0078] Furthermore, in this embodiment, the concentrated pressing portion 86 of the upper mold 86 is inserted into the positioning hole 60A of the positioning jig 60, thereby pressing the portion of the plate-shaped portion 14A of the substrate 12 on which the insulating layer 16 is placed. This allows the portion of the plate-shaped portion 14A of the substrate 12 on which the insulating layer 16 is placed to be pressed at a precise pinpoint.

[0079] Furthermore, in this embodiment, the concentrated pressing portion 86 of the upper mold 86 presses the portion of the plate-shaped portion 14A of the substrate 12 where the insulating layer 16 is placed, through the thick paper 64 and the metal plate 62. This allows the portion of the plate-shaped portion 14A of the substrate 12 where the insulating layer 16 is placed to be pressed evenly. Furthermore, by placing the metal plate 62 between the thick paper 64 and the insulating layer 16 (PET film 52), the unevenness of the thick paper 64 can be prevented from being transferred to the insulating layer 16.

[0080] Furthermore, in this embodiment, air suction unit 76 can suction air from sealed space 94 formed between lower mold 84 and upper mold 86. This allows for faster vacuuming around the area where insulating layer 16 is fixed, compared to a configuration in which air outside lower mold 84 and upper mold 86 is also suctioned in order to suction air from sealed space 94 formed between lower mold 84 and upper mold 86.

[0081] Furthermore, in this embodiment, the substrate 14 and insulating layer 16 can be heated in the first heating step before the first heating and pressing step. This shortens the time required to heat the substrate 14 and insulating layer 16 in the first heating and pressing step, resulting in a shorter duration of the first heating and pressing step. Furthermore, in this embodiment, the temperature of the substrate 14 and insulating layer 16 is raised to a first temperature T1 in the first heating step. Furthermore, in the first heating and pressing step, the temperature of the substrate 14 and insulating layer 16 is raised to a second temperature T2, which is higher than the first temperature T1. This prevents excessive curing of the adhesive in the first heating step.

[0082] It should be noted that the various steps in the first pressurizing unit 26 described above may all be performed automatically, or may be partially performed manually.

[0083] like Figure 3 and Figure 23 As shown, in the first unloading section 28, the positioning jig 60 is unloaded from the common transport jig 58 transported from the first pressurizing section 26. Furthermore, in the first unloading section 28, the metal plate 62 and thick paper 64 placed on the insulating layer 16 are unloaded. It should be noted that the processes in the first unloading section 28 can be performed entirely automatically, or partially or entirely manually.

[0084] like Figure 3 and Figure 24 As shown, in the first cooling unit 30, the substrate 12 and the insulating layer 16 are cooled. Figure 24As shown, the first cooling unit 30 includes fans 96 located above and below the conveyor unit 66 that conveys the shared transport jig 58. During the process in the first cooling unit 30, the shared transport jig 58 is conveyed by the conveyor unit 66, passing between the upper and lower fans 96. This cools the substrate 12 placed on the shared transport jig 58 and the insulating layer 16 secured thereto.

[0085] like Figure 3 and Figure 25 As shown, in the first peeling section 32, the PET film 52 is removed from the insulating layer 16. Figure 25 As shown, the first peeling section 32 includes: a suction section 98 for sucking the PET film 52; and a nozzle 100 for spraying compressed air between the PET film 52 and the insulating layer 16. Furthermore, during the process in the first peeling section 32, the suction section 98 first sucks the horizontal center portion of the PET film 52. Next, the suction section 98 is moved while spraying compressed air between the PET film 52 and the insulating layer 16 from the nozzle 100. As a result, the PET film 52 is peeled from the insulating layer 16. It should be noted that the PET film 52 peeled from the insulating layer 16 is transported by the suction section 98 and discarded in a predetermined container. It should be noted that the processes in the first peeling section 32 can be performed entirely automatically, or partially or entirely manually.

[0086] like Figure 3 and Figure 26 As shown, in the first inspection unit 34, it is inspected whether the insulating layer 16 is fixed to a predetermined position in the substrate 12. Figure 26 As shown, the first inspection unit 34 includes a camera 102. In addition, in the process in the first inspection unit 34, the images of the substrate 12 and the insulating layer 16 captured by the camera 102 are compared with the inspection data, thereby inspecting whether the insulating layer 16 is fixed to the specified position in the substrate 12. When the inspection result shows that the insulating layer 16 is fixed to the specified position in the substrate 12, the substrate 12 with the insulating layer 16 fixed thereto is conveyed to the next process. On the other hand, when the inspection result shows that the insulating layer 16 is not fixed to the specified position in the substrate 12, the substrate 12 with the insulating layer 16 fixed thereto is not conveyed to the next process and is discarded. It should be noted that the processes in the first inspection unit 34 can be performed entirely automatically, or partially or entirely manually.

[0087] like Figure 4 and Figure 27 As shown, in the circuit portion pasting portion 36, the circuit portion 18 is pasted to the polyurethane sheet 104. Figure 27As shown, the shape and size of the polyurethane sheet 104 as viewed in the thickness direction are set to correspond to the shape and size of the insulating layer 16. An adhesive layer to which the circuit portion 18 can be attached is formed on one side of the polyurethane sheet 104. Then, in the process in the circuit portion attaching section 36, the circuit portion 18 is attached to a predetermined position on the surface of the polyurethane sheet 104 on which the adhesive layer is formed. In this way, the circuit portion 18 is fixed to the polyurethane sheet 104. It should be noted that the processes in the circuit portion attaching section 36 can be performed entirely automatically, or partially or entirely manually.

[0088] like Figure 4 and Figure 28 As shown, in the second installation portion 38 , the circuit portion 18 fixed to the polyurethane sheet 104 is installed on the insulating layer 16 fixed to the substrate 12 .

[0089] In the process in the second installation section 38, adhesive is applied to the surface of the circuit section 18 opposite the polyurethane sheet 104. Alternatively, adhesive is applied to the portion of the insulating layer 16 to which the circuit section 18 is to be fixed. Next, with the surface of the circuit section 18 opposite the polyurethane sheet 104 facing downward, the circuit section 18 and the polyurethane sheet 104 are placed on the insulating layer 16. Next, thick paper 64 is placed on the polyurethane sheet 104. It should be noted that the various processes in the second installation section 38 can be performed entirely automatically, or partially or entirely manually.

[0090] like Figure 4 As shown in FIG. 1 , in the second preheating section 40 serving as the preheating section, the substrate 12, the insulating layer 16, and the circuit section 18 are heated. It should be noted that the process in the second preheating section 40 is the same as the process in the first preheating section 24. That is, in the process in the second preheating section 40, the common transport jig 58 is transported by the transport section 66, thereby moving the common transport jig 58 within the heating furnace 68 (see FIG. 1 ). Figure 10A ). Thus, the substrate 12, the insulating layer 16, the circuit portion 18, and the like placed on the common transport jig 58 are heated (second heating step).

[0091] Here, in the second heating process, the temperatures of the substrate 14, the insulating layer 16, and the circuit portion 18 are raised to a third temperature T3, which is a target temperature. It should be noted that the third temperature T3 is a temperature at which the curing of the adhesive used to fix the circuit portion 18 to the insulating layer 16 is not yet complete. In this embodiment, the adhesive used to fix the circuit portion 18 to the insulating layer 16 and the adhesive used to fix the insulating layer 16 to the substrate 14 are set to be the same adhesive, so the third temperature T3 is set to the same temperature as the first temperature T1. In the second heating process, similarly to the first heating process, the substrate 12, the insulating layer 16, and the circuit portion 18 pass through the heating furnace 68 for a predetermined time, thereby raising the temperatures of the substrate 12, the insulating layer 16, and the circuit portion 18 to the third temperature T3, which is a target temperature. It should be noted that the third temperature T3 can also be set to a temperature different from the first temperature T1.

[0092] like Figure 4 As shown, in the second pressurizing unit 42 as the pressurizing unit, the circuit unit 18 provided on the insulating layer 16 is pressed toward the substrate 12. In the process in the second pressurizing unit 42, similarly to the process in the first pressurizing unit 26, the circuit unit 18 is pressed toward the substrate 12. Figures 11 to 14 The pressurizing section main body 70, the preparation section 72, the heating and pressing section transport section 73, the two heating and pressing sections 74, and the air suction section 76 are shown. Here, each process in the second pressurizing section 42 is similar to each process in the first pressurizing section 26. Therefore, in the description of each process in the second pressurizing section 42, the same figures as those used in the description of each process in the first pressurizing section 26 are used.

[0093] like Figure 16 As shown, in the process in the second press section 42, first, the substrate 12 that has completed the process in the second preheating section 40 (passed through the heating furnace 68) is set to the heating and press section 74 arranged at the preparation position P1 (second setting process). Here, a robot (not shown) is operated to set the substrate 12 to the receiving fixture 88 arranged at the preparation position P1. Then, as shown in FIG. Figure 17 As shown, by operating the upper mold lifting unit 82, the upper mold 86 and the lower mold 84 are engaged at the preparation position P1 (first circuit unit fixing step). Here, the upper mold 86 and the lower mold 84 are heated to a predetermined temperature by the aforementioned heater 90. Furthermore, when the upper mold 86 and the lower mold 84 are engaged at the preparation position P1, the air suction unit 76 is activated to suck the air from the sealed space 94 between the upper mold 86 and the lower mold 84. In other words, the sealed space 94 between the upper mold 86 and the lower mold 84 is evacuated.

[0094] Then, if Figure 18As shown, by rotating the rotating portion 73A, the heating and pressing portion 74 disposed at the preparation position P1 moves toward the pressing position P2. At this time, the heating and pressing portion 74 disposed at the pressing position P2 moves toward the preparation position P1 (second circuit unit fixing step).

[0095] Then, if Figure 19 As shown, the upper mold engaging portion 80 is engaged with the upper mold 86, and the upper mold 86 is pressed toward the lower mold 84 at the pressurizing position P2, thereby pressing the circuit portion 18 provided on the insulating layer 16 toward the substrate 12. In this way, the circuit portion 18 is fixed to the insulating layer 16 (second heating and pressing process, third circuit portion fixing process). It should be noted that in the third circuit portion fixing process, the state of pressing the circuit portion 18 toward the substrate 12 is maintained for a predetermined time. In addition, in the third circuit portion fixing process, the circuit portion 18 is pressed toward the substrate 12 with a pressure lower than that in the aforementioned third insulating layer fixing process. Therefore, as an example, only the high-pressure cylinder 78A is operated in the third insulating layer fixing process, or only the low-pressure cylinder 78B is operated in the third circuit portion fixing process. In addition, in the third circuit portion fixing process, while the upper mold 86 and the lower mold 84 are heated by the heater 90, the enclosed space 94 between the upper mold 86 and the lower mold 84 is also vacuumed.

[0096] Here, in the second heating and pressing process, the temperatures of the substrate 14, the insulating layer 16, and the circuit portion 18 are raised to a fourth temperature T4, which is the target temperature. It should be noted that, in this embodiment, the adhesive used to secure the circuit portion 18 to the insulating layer 16 and the adhesive used to secure the insulating layer 16 to the substrate 14 are the same adhesive, so the fourth temperature T4 is set to the same temperature as the second temperature T2. In the second heating and pressing process, similarly to the first heating and pressing process, the substrate 12, the insulating layer 16, and the circuit portion 18 are arranged between the lower mold 84 and the upper mold 86 for a predetermined period of time, and the temperatures of the substrate 14, the insulating layer 16, and the circuit portion 18 are raised to the fourth temperature T4, which is the target temperature. It should be noted that the fourth temperature T4 can also be set to a temperature different from the second temperature T2.

[0097] like Figure 19 As shown, simultaneously (in parallel) with the third circuit unit fixing process, the substrate 12 that has completed the process performed by the second preheating unit 40 (passed through the heating furnace 68) is set to the heating and pressing unit 74 arranged at the preparation position P1 (second setting process). Figure 20As shown, by operating the upper mold lifting unit 82, the upper mold 86 and the lower mold 84 are engaged at the preparation position P1 (the fourth circuit unit fixing step). In addition, when the upper mold 86 and the lower mold 84 are engaged at the preparation position P1, the air suction unit 76 is operated to vacuum the enclosed space 94 between the upper mold 86 and the lower mold 84.

[0098] Then, if Figure 21 As shown, after the upper mold engaging portion 80 and the upper mold 86 are released, the rotating portion 73A is rotated, thereby moving the heating and pressing portion 74 that has completed the third circuit unit fixing process from the pressing position P2 to the preparation position side. At this time, the heating and pressing portion 74 that has completed the fourth circuit unit fixing process moves from the preparation position P1 to the pressing position P2 side (fifth circuit unit fixing process).

[0099] Then, if Figure 22 As shown, upper mold engaging portion 80 is engaged with upper mold 86, and upper mold 86 is pressed toward lower mold 84 at pressurizing position P2, thereby pressing circuit portion 18 provided on insulating layer 16 toward substrate 12. Thus, circuit portion 18 is fixed to insulating layer 16 (second heating and pressing step, sixth circuit portion fixing step).

[0100] Simultaneously (in parallel) with the sixth circuit unit fixing process, the substrate 12 in a state where the circuit unit 18 is fixed on the insulating layer 16 is removed from the heating and pressing section 74 arranged at the preparation position P1. Here, the substrate 12 is removed from the receiving fixture 88 arranged at the preparation position P1 by a robot not shown in the figure (second unloading process). The substrate 12 removed from the receiving fixture 88 is returned to the common conveying fixture 58 on the conveying section 66 again. Next, the substrate 12 that has completed the process performed by the second preheating section 40 (passed through the heating furnace 68) is set to the heating and pressing section 74 arranged at the preparation position P1 (second setting process, seventh circuit unit fixing process). In this way, by repeatedly performing the first circuit unit fixing process to the seventh circuit unit fixing process, the substrates 12 and the like that have completed the process performed by the second preheating section 40 are sequentially put into the second pressing section 42. In addition, the substrates 12 and the like that have been put into the second pressing section 42 are sequentially sent to the next process.

[0101] Here, in the second pressurizing portion 42 of the manufacturing device 10 of the present embodiment, the third circuit portion fixing process and the fourth circuit portion fixing process can be performed simultaneously. In addition, the sixth circuit portion fixing process and the seventh circuit portion fixing process can be performed simultaneously. Thus, it is possible to suppress the waiting time before the process of fixing the circuit portion 18 and the insulating layer 16 from becoming longer. In detail, when the circuit portion 18 is pressed toward the substrate 12 side at the pressurizing position P2, the operation of removing the substrate 12 with the circuit portion 18 fixed on the insulating layer 16 from the heating and pressing portion 74 can be performed on the preparation position P1 side. In addition, when the circuit portion 18 is pressed toward the substrate 12 side at the pressurizing position P2, the substrate 12 with the circuit portion 18 provided on the insulating layer 16 can be set to the heating and pressing portion 74 on the preparation position P1 side. Furthermore, while the circuit portion 18 is pressed toward the substrate 12 at the pressurizing position P2, the substrate 12, etc., with the circuit portion 18 provided on the insulating layer 16, can be heated by heaters 90 provided in the upper mold 86 and the lower mold 84, respectively, at the preparation position P1. Furthermore, while the circuit portion 18 is pressed toward the substrate 12 at the pressurizing position P2, the enclosed space 94 formed between the upper mold 86 and the lower mold 84 can be evacuated at the preparation position P1. Thus, in this embodiment, the time spent waiting idly before the substrate 12, etc., which has completed the process in the second preheating section 40, is placed into the second pressurizing section 42 can be reduced.

[0102] In addition, in this embodiment, if Figure 29 As shown, the substrate 12 is placed on the receiving jig 88, with the plurality of heat dissipating portions 14B of the substrate 12 respectively inserted into the plurality of insertion holes 88A of the receiving jig 88. When the substrate 12 is placed on the receiving jig 88, the lower surface of the plate-shaped portion 14A (the surface of the substrate 12 that constitutes the bottom surface of the plurality of heat dissipating portions 14B) contacts the upper surface of the receiving jig 88. Thus, the bottom surface of the plurality of heat dissipating portions 14B in the substrate 12 can be supported by the upper surface of the receiving jig 88. As a result, even when a metal substrate 12 having a plurality of heat dissipating portions 14B formed in a convex shape is used, it is possible to pressurize the fixed portion of the circuit portion 18.

[0103] Furthermore, in this embodiment, the concentrated pressing portion 86 of the upper mold 86 intensively presses the portion where the circuit portion 18 is provided. This allows the portion where the circuit portion 18 is provided to be pressed with precise positioning.

[0104] Furthermore, in this embodiment, the concentrated pressing portion 86 of the upper mold 86 presses the portion where the circuit portion 18 is located, through the thick paper 64 and the polyurethane sheet 104. When the polyurethane sheet 104 is pressed toward the substrate 12 through the thick paper 64, a portion of the polyurethane sheet 104 comes into contact with the insulating layer 16, pressing the insulating layer 16 downward. This prevents swelling in the portion of the insulating layer 16 where the circuit portion 18 is not secured. Furthermore, the polyurethane sheet absorbs any adhesive that may have overflowed from between the insulating layer 16 and the circuit portion 18.

[0105] Furthermore, in this embodiment, the air in the sealed space 94 formed between the lower mold 84 and the upper mold 86 can be sucked by the air suction portion 76. This allows for faster vacuuming around the fixing portion of the circuit portion 18, compared to a configuration in which the air in the space outside the lower mold 84 and the upper mold 86 is also sucked in order to suck the air in the sealed space 94 formed between the lower mold 84 and the upper mold 86.

[0106] Furthermore, in this embodiment, the substrate 14, insulating layer 16, and circuit portion 18 can be heated in the second heating step before the second heating and pressing step. This shortens the time required to heat the substrate 14, insulating layer 16, and circuit portion 18 in the second heating and pressing step, resulting in a shorter duration of the second heating and pressing step. Furthermore, in this embodiment, the temperature of the substrate 14, insulating layer 16, and circuit portion 18 is raised to a third temperature T3 in the second heating step. Furthermore, the temperature of the substrate 14, insulating layer 16, and circuit portion 18 is raised to a fourth temperature T4, which is higher than the third temperature T3, in the second heating and pressing step. This prevents excessive curing of the adhesive in the second heating step.

[0107] It should be noted that the various processes in the second pressurizing unit 42 described above may all be performed automatically, or may be partially performed manually.

[0108] like Figure 4 and Figure 30 As shown, the thick paper 64 placed on the polyurethane sheet 104 is removed in the second removal section 44. It should be noted that the processes in the second removal section 44 can be performed entirely automatically, or partially or entirely manually.

[0109] like Figure 4 and Figure 31 As shown, in the second cooling unit 46, the substrate 12, the insulating layer 16 and the circuit unit 18 are cooled. Figure 31As shown, during the process in the second cooling unit 46, the common transport jig 58 is transported by the transport unit 66, thereby passing the common transport jig 58 between the upper and lower fans 96. As a result, the substrate 12 placed on the common transport jig 58, the insulating layer 16 fixed to the substrate 12, and the circuit unit 18 fixed to the insulating layer 16 are cooled.

[0110] like Figure 4 and Figure 32 As shown, in the second peeling section 48, the polyurethane sheet 104 is removed. Figure 32 As shown, the second peeling section 48 includes a gripping section 106 for gripping the polyurethane sheet 104. Furthermore, in the process in the second peeling section 48, first, the gripping section 106 grips the end portion of the polyurethane sheet 104. Then, the gripping section 106 gripping the end portion of the polyurethane sheet 104 is moved. As a result, the polyurethane sheet 104 is peeled off from the circuit section 18 and the insulating layer 16. It should be noted that the polyurethane sheet 104 peeled off from the circuit section 18 and the insulating layer 16 is transported by the gripping section 106 and discarded into a specified container. It should be noted that the processes in the second peeling section 48 can be performed entirely automatically, or the processes in the second peeling section 48 can be performed partially or entirely manually.

[0111] like Figure 4 and Figure 33 As shown, in the second inspection unit 50, it is inspected whether the circuit unit 18 is fixed to a predetermined position on the substrate 12. Figure 33 As shown, in the process in the second inspection section 50, the images of the substrate 12, the insulating layer 16, and the circuit portion 18 captured by the camera 102 are compared with the inspection data, thereby inspecting whether the circuit portion 18 is fixed at a specified position in the substrate 12. In the case where the inspection result shows that the circuit portion 18 is fixed at a specified position in the substrate 12, the substrate 12 (circuit substrate 12) with the circuit portion 18 fixed to the insulating layer 16 is shipped as a product. In contrast, in the case where the inspection result shows that the circuit portion 18 is not fixed at a specified position in the substrate 12, the substrate 12 (circuit substrate 12) with the circuit portion 18 fixed to the insulating layer 16 is not shipped as a product and is discarded. It should be noted that the processes in the second inspection section 50 can be performed entirely automatically, or the processes in the second inspection section 50 can be performed partially or entirely manually.

[0112] Through the above-described steps, the Figure 1 and Figure 2 The circuit substrate 12 is shown.

[0113] It should be noted that the details and each process of the manufacturing apparatus 10 described above may be changed according to the configuration of the circuit board 12 .

[0114] In addition, you can Figure 3 The insulating layer cutting unit 20, the first setting unit 22, the first preheating unit 24, the first pressing unit 26, the first removing unit 28, the first cooling unit 30, the first stripping unit 32 and the first inspection unit 34 are shown. Figure 4 The circuit portion pasting section 36, second setting section 38, second preheating section 40, second pressurizing section 42, second removal section 44, second cooling section 46, second peeling section 48 and second inspection section 50 shown are provided as common equipment, or as equipment provided separately.

[0115] As mentioned above, one embodiment of the present disclosure has been described, but the present disclosure is not limited to the above contents, and various modifications other than the above can be implemented without departing from the scope of the present disclosure.

[0116] The disclosure of Japanese Patent Application No. 2023-001922 filed on January 10, 2023 is incorporated herein by reference in its entirety.

Claims

1. A device for manufacturing a circuit board, the circuit board comprising: a substrate formed of a metal material; an insulating layer formed of an insulating material in a sheet shape and fixed to the substrate; and a circuit portion formed of a conductive material and fixed to the insulating layer, the device comprising: The pressurizing part has a lower mold, an upper mold and a heater, wherein The lower mold has a substrate placement portion for placing the substrate, the upper mold is arranged above the lower mold, and the upper mold presses the insulating layer or the circuit portion toward the substrate by engaging with the lower mold, and the heater heats the upper mold and the lower mold respectively; and The preheating section is provided on a path for conveying the substrate and the insulating layer toward the pressurizing section and on a path for conveying the substrate, the insulating layer, and the circuit section toward the pressurizing section, and heats the substrate and the insulating layer, or heats the substrate, the insulating layer, and the circuit section.

2. A method for manufacturing a circuit substrate, using the circuit substrate manufacturing apparatus according to claim 1, comprising the following steps: a first heating step of heating the substrate and the insulating layer by the preheating unit while conveying the substrate and the insulating layer toward the pressurizing unit; a first setting step of setting the substrate with the insulating layer provided on the substrate in the substrate setting portion; a first heating and pressing step of engaging the upper mold with the lower mold to press the insulating layer toward the substrate, thereby fixing the insulating layer to the substrate; a first removing step of separating the upper mold from the lower mold to remove the substrate with the insulating layer fixed thereto from the substrate setting portion; a second heating step of heating the substrate, the insulating layer, and the circuit portion by the preheating portion while conveying the substrate, the insulating layer, and the circuit portion toward the pressurizing portion; a second setting step of setting the substrate with the circuit portion provided on the insulating layer on the substrate setting portion; a second heating and pressing step of engaging the upper mold with the lower mold to press the circuit portion toward the substrate, thereby fixing the circuit portion to the insulating layer; as well as In a second removing step, the upper mold is separated from the lower mold to remove the substrate from the substrate mounting portion in a state where the circuit portion is fixed to the insulating layer.

3. The method for manufacturing a circuit substrate according to claim 2, wherein: In the first heating step, the temperature of the substrate and the insulating layer is raised to a first temperature. In the first heating and pressurizing step, the substrate and the insulating layer are heated to a second temperature higher than the first temperature. In the second heating step, the temperatures of the substrate, the insulating layer, and the circuit portion are raised to a third temperature. In the second heating and pressurizing step, the substrate and the insulating layer are heated to a fourth temperature higher than the third temperature.

Images