Device and method for diffusing liquid source before passivation of silicon wafer

Abstract

The invention discloses a liquid source diffusion device and method before silicon wafer passivation, and belongs to the technical field of silicon wafer processing. The device comprises a coating mechanism, the coating mechanism comprises a box body, one side of the upper end of the box body is fixedly provided with a coating cylinder, the inner bottom end of the coating cylinder is fixedly provided with an air slip ring, the rotating end of the air slip ring is sleeved with a first negative pressure suction cup, one side of the coating cylinder is fixedly provided with a raw material barrel, and the other side of the coating cylinder is fixedly provided with a second negative pressure suction cup. A first servo motor is fixedly installed on the upper end face of the box body and located on one side of the raw material barrel, the output end of the first servo motor is sleeved with a first pneumatic telescopic rod, a connecting rod is fixedly installed at the upper end of the first pneumatic telescopic rod, a supporting rod is installed on the bottom side of the connecting rod through a bolt, and a clamping hoop is rotationally connected to one side of the supporting rod. According to the liquid source diffusion device, the practicability of the liquid source diffusion device can be effectively improved, and the liquid source diffusion device has high practical value.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon wafer processing, and in particular to a liquid source diffusion device and method before silicon wafer passivation. Background Art

[0002] In the current booming semiconductor industry, silicon wafers, the fundamental material for manufacturing core devices such as integrated circuits and solar cells, have a performance that directly determines the quality and efficiency of end products. The liquid source diffusion process before silicon wafer passivation transforms liquid impurity sources into a gaseous state, allowing them to diffuse onto the wafer surface and penetrate deep into the interior, thereby altering the wafer's electrical properties. This is a key step in optimizing silicon wafer performance.

[0003] Based on the above, the inventors have discovered the following problems: when liquid source diffusion is carried out on single crystal silicon wafers, phosphorus source and boron source need to be coated on the front and back sides of the silicon wafer respectively to form a specific semiconductor doping layer. At present, most companies still use manual coating methods. Operators need to hold coating tools and evenly apply liquid phosphorus source and boron source on the surface of the silicon wafer piece by piece. Liquid phosphorus source and boron source are mostly chemical reagents with certain corrosiveness and toxicity. During the manual coating process, operators need to frequently come into contact with these chemicals. Even if protective measures are taken, there is still a risk of skin contact infection.

[0004] Therefore, in view of this, the existing structure and defects are studied and improved, and a liquid source diffusion device and method before silicon wafer passivation is provided, in order to achieve a purpose with greater practical value. Summary of the Invention

[0005] The purpose of the present invention is to provide a liquid source diffusion device and method before passivation of silicon wafers, so as to solve the problem raised in the above background technology. At present, most companies still use manual coating methods. Operators need to hold coating tools and evenly apply liquid phosphorus source and boron source on the surface of silicon wafers piece by piece. Liquid phosphorus source and boron source are mostly chemical reagents with certain corrosiveness and toxicity. During the manual coating process, operators need to frequently contact these chemicals. Even if protective measures are taken, there is still the risk of inhaling harmful gases and skin contact infection.

[0006] In view of the above problems, the technical solution proposed by the present invention is: A liquid source diffusion device before passivation of a silicon wafer comprises a coating mechanism, the coating mechanism comprising a box body, a coating cylinder is fixedly mounted on one side of the upper end of the box body, an air slip ring is fixedly mounted on the inner bottom end of the coating cylinder, a rotating end of the air slip ring is sleeved with a first negative pressure suction cup, a raw material barrel is fixedly mounted on one side of the coating cylinder, the upper end surface of the box body is located on a side of the raw material barrel and a first servo motor is fixedly mounted, an output end of the first servo motor is sleeved with a first pneumatic telescopic rod, a connecting rod is fixedly mounted on the upper end of the first pneumatic telescopic rod, a support rod is mounted on the bottom side of the connecting rod by bolts, a clamp is rotatably connected to one side of the support rod, a coating rod is inserted into the inside of the clamp, and a conveyor is fixedly mounted on the upper end surface of the box body on one side of the coating cylinder.

[0007] Furthermore, a second servo motor is fixedly installed at the inner bottom end of the coating cylinder, and the output end of the second servo motor is transmission-connected to the rotating end of the air slip ring. The output end of the air slip ring is connected to the input end of the first negative pressure suction cup through a pipeline. A third servo motor is fixedly installed on one side of the support rod, and the output end of the third servo motor is transmission-connected to the clamp.

[0008] The beneficial effect of adopting the above-mentioned further scheme is that the second servo motor drives the rotating end of the air slip ring to rotate, so that the silicon wafer adsorbed on the first negative pressure suction cup rotates, which facilitates uniform coating; the air slip ring realizes the air path connection to ensure the stability of the negative pressure; the third servo motor drives the clamp to rotate, adjusts the angle of the coating rod, and cooperates with the first servo motor to adjust the position of the coating rod to comprehensively coat the surface of the silicon wafer.

[0009] Furthermore, it also includes a drying mechanism, which includes a drying box, which is arranged on one side of the coating cylinder, and a lifting seat is provided at both ends of the drying box, the bottom end of the lifting seat is connected to the upper end surface of the box body, and second pneumatic telescopic rods are embedded and installed on both sides of the upper end of the lifting seat, and a connecting plate is fixedly installed between the upper ends of each pair of the second pneumatic telescopic rods.

[0010] The beneficial effect of adopting the above-mentioned further scheme is that the drying box of the drying mechanism dries the coated silicon wafers, and the lifting seat and the second pneumatic telescopic rod can adjust the height of the connecting plate, so that after the silicon wafer is removed from the inside of the drying box, it can drive a pair of sliding rods to lift the silicon wafer, and as the conveying plate moves back and forth, it facilitates the continuous conveying of the silicon wafer.

[0011] Furthermore, a connecting seat is fixedly installed on the upper end of the connecting plate, a pair of sliding rods is fixedly installed between a pair of the connecting seats, a first linear motor is fixedly installed inside the drying box between a pair of the lifting seats, a conveying plate is fixedly installed on the moving end of the first linear motor, a pair of sliding grooves are opened on the upper end of the conveying plate, and the sliding grooves are slidably connected to the sliding rods.

[0012] The beneficial effect of adopting the above further solution is that the first linear motor drives the conveying plate to move on the slide rod, thereby realizing the conveying of silicon wafers in the drying box, ensuring that the silicon wafers move along the set path in the drying box, and ensuring drying uniformity and efficiency.

[0013] Furthermore, it also includes a conveying mechanism, which includes a second linear motor, a third linear motor, a fourth linear motor and a fifth linear motor. The third linear motor is arranged on one side of the coating cylinder, and the movable end of the third linear motor is installed with a sixth linear motor, and the movable end of the sixth linear motor is installed with a first lifting frame. The second linear motor is arranged on one side of the third linear motor, and the movable end of the second linear motor is installed with a fixed rod, and the bottom end of the fixed rod is installed with a second negative pressure suction cup.

[0014] The beneficial effect of adopting the above-mentioned further scheme is that the linear motors in the conveying mechanism work together, the second linear motor cooperates with the second negative pressure suction cup to realize the suction and transportation of silicon wafers, the third linear motor, the sixth linear motor and the first lifting frame realize the transfer of silicon wafers between different workstations, which facilitates the transfer of silicon wafers transported on the conveyor belt to the first negative pressure suction cup. Since the clamping mechanism is provided on both sides of the bottom end of the first lifting frame, the silicon wafers can be transferred to the inside of the coating cylinder during the reciprocating movement, and the coated silicon wafers can be transferred to the conveying plate again, thereby improving the continuity of the processing.

[0015] Furthermore, the fourth linear motor and the fifth linear motor are respectively arranged on both sides of one end of the first linear motor, the movable end of the fourth linear motor is fixedly installed with a fourth servo motor, the output end of the fourth servo motor is equipped with a mounting frame, the movable end of the fifth linear motor is fixedly installed with a seventh linear motor, and the movable end of the seventh linear motor is installed with a second lifting frame.

[0016] The beneficial effect of adopting the above-mentioned further scheme is that the fourth linear motor and the fifth linear motor cooperate with each other to transfer the silicon wafers that have been coated and dried, and the fourth servo motor is used to drive the mounting frame to flip over, so that the clamped silicon wafer can be flipped over, so that the clamping mechanism at the bottom end of the second lifting frame and the clamping mechanism at the bottom end of the mounting frame cooperate with each other to transfer the silicon wafer lifted by the slide rod, and during the transfer process, the second lifting frame and the mounting frame move alternately, so that the coated piece of the silicon wafer can overlap and be placed between several limit rods to prevent the uncoated surface of the silicon wafer from contacting the coated surface.

[0017] Furthermore, clamping mechanisms are provided on both sides of the bottom end of the first lifting frame, the bottom end of the mounting frame and the bottom end of the second lifting frame, and the clamping mechanisms include a number of parallel pneumatic clamps, and moving blocks are slidably installed on both sides of the bottom ends of the parallel pneumatic clamps, and clamping rods are fixedly installed on both sides of the bottom ends of the moving blocks, and the two moving ends of the parallel pneumatic clamps are respectively fixedly connected to a pair of moving blocks.

[0018] The beneficial effect of adopting the above-mentioned further scheme is that the parallel pneumatic clamp of the clamping mechanism drives the moving block and the clamping rod to move toward or away from each other through the moving end, thereby achieving stable clamping and release of the silicon wafer, adapting to silicon wafers of different sizes, and ensuring the stability and safety of the silicon wafer during transportation.

[0019] Furthermore, it also includes a material storage mechanism, which includes a pair of base frames, and the pair of base frames are respectively arranged on both sides of the upper end surface of the box body, and a number of limit rods are fixedly installed on the upper ends of the base frames, and push plates are slidably inserted between the limit rods. A third pneumatic telescopic rod is inserted at the center of the base frames, and the bottom end of the third pneumatic telescopic rod extends through the box body to the interior, and the top end of the third pneumatic telescopic rod is connected to the bottom end of the push plate.

[0020] The beneficial effect of adopting the above further solution is that the base frame and limit rod of the storage mechanism provide storage space and guidance, and the third pneumatic telescopic rod pushes the push plate to achieve orderly storage and retrieval of silicon wafers. The two base frames can be used for loading and unloading silicon wafers.

[0021] Furthermore, a vacuum pump is fixedly installed at the bottom end of the interior of the box body, and the output end of the vacuum pump is connected to the input end of the second negative pressure suction cup and the input end of the air slip ring through pipes. A protective frame is provided at the upper end of the box body, and several operating doors are provided on both sides of the protective frame.

[0022] The beneficial effect of adopting the above further solution is that the vacuum pump provides negative pressure for the second negative pressure suction cup and the air slip ring to ensure that the silicon wafer is firmly adsorbed; the protective frame and operating door can protect the internal structure of the equipment and prevent external interference, while making it convenient for operators to operate, maintain and monitor the equipment.

[0023] In another aspect, the present invention provides a method for using a liquid source diffusion device before silicon wafer passivation, comprising the following steps: S1, silicon wafer loading and coating: the second linear motor drives the fixed rod and the second negative pressure suction cup to move. Using the negative pressure provided by the vacuum pump, the second negative pressure suction cup sucks the silicon wafer in the loading base frame. The third and sixth linear motors cooperate with the clamping mechanism at the bottom of the first lifting frame to transfer the silicon wafer into the coating barrel. The first negative pressure suction cup absorbs and fixes the silicon wafer under the negative pressure provided by the air slip ring. The second servo motor drives the rotating end of the air slip ring to rotate, driving the silicon wafer to rotate; the first servo motor and the first pneumatic telescopic rod adjust the position of the coating rod. The third servo motor drives the clamp to adjust the angle of the coating rod. After obtaining the liquid source from the raw material barrel, the silicon wafer is coated; S2, silicon wafer drying and transfer: the coated silicon wafer is clamped by the clamping mechanism at the bottom end of the first lifting frame and transferred to the conveying plate in the drying box. The first linear motor drives the conveying plate to move along the slide bar, so that the silicon wafer moves along the set path in the drying box to complete drying. After the drying is completed, the second pneumatic telescopic rod drives the slide bar to lift and lift the silicon wafer. The fourth linear motor drives the clamping mechanism at the bottom end of the mounting frame to clamp the silicon wafer. The fourth servo motor drives the mounting frame to flip, and the silicon wafer is flipped and placed inside the base frame for unloading. Then the conveying plate continues to transport and moves the subsequent silicon wafer to the front end. The slide bar lifts the new silicon wafer again. The fifth linear motor and the seventh linear motor cooperate with the clamping mechanism at the bottom end of the second lifting frame to clamp the silicon wafer and transfer it to the inside of the base frame for unloading. The second lifting frame and the mounting frame move alternately, so that the silicon wafers are grouped in two, with the coated surfaces against each other, and are stored inside the base frame for unloading. S3, silicon wafer storage: The transferred silicon wafers are transferred to the bottom rack for unloading. The third pneumatic telescopic rod pushes the push plate to achieve orderly storage and retrieval of the silicon wafers, completing the entire liquid source diffusion process before silicon wafer passivation.

[0024] Compared with the prior art, the beneficial effects of the present invention are as follows: the liquid source diffusion device and method before passivation of silicon wafers, in the coating mechanism, the box provides an installation foundation, the coating cylinder is used for silicon wafer coating operations, the air slip ring cooperates with the first negative pressure suction cup to adsorb and fix the silicon wafer, the raw material barrel stores the liquid source, the first servo motor and the first pneumatic telescopic rod drive the coating rod to perform the coating operation, the conveyor assists in material transmission, and the various components cooperate to realize the liquid source coating process of the silicon wafer, the second servo motor drives the rotating end of the air slip ring to rotate, so that the silicon wafer adsorbed on the first negative pressure suction cup rotates, which is convenient for uniform coating; the air slip ring realizes the air path connection to ensure the stability of the negative pressure; the third servo motor drives the clamp to rotate, adjusts the angle of the coating rod, and cooperates with the first servo motor to adjust the position of the coating rod to comprehensively coat the surface of the silicon wafer, the linear motors in the conveying mechanism cooperate to operate, the second linear motor cooperates with the second negative pressure suction cup to realize silicon wafer suction and transportation, the third linear motor and the sixth linear motor The linear motor and the first lifting frame realize the transfer of silicon wafers between different workstations, which is convenient for transferring the silicon wafers transported on the conveyor belt to the first negative pressure suction cup. Since the clamping mechanism is provided on both sides of the bottom end of the first lifting frame, the silicon wafer can be transferred to the inside of the coating cylinder during the reciprocating movement, and the coated silicon wafer can be transferred to the conveying plate again, thereby improving the continuity of processing. The fourth linear motor and the fifth linear motor cooperate with each other to transfer the silicon wafers that have been coated and dried. The fourth servo motor is used to drive the mounting frame to flip, which can flip the clamped silicon wafer, so that the clamping mechanism at the bottom end of the second lifting frame and the clamping mechanism at the bottom end of the mounting frame cooperate to transfer the silicon wafer lifted by the slide rod, and the second lifting frame and the mounting frame move alternately during the transfer process, so that the coated piece of the silicon wafer can overlap and be placed between several limit rods to avoid the uncoated surface of the silicon wafer from contacting the coated surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is one of the three-dimensional structural schematic diagrams disclosed in an embodiment of the present invention; Figure 2 A schematic diagram of the three-dimensional structure of the second embodiment of the present invention; Figure 3 A schematic diagram of the three-dimensional structure of a coating mechanism disclosed in an embodiment of the present invention; Figure 4 This is a schematic diagram of the three-dimensional structure of the drying mechanism disclosed in an embodiment of the present invention; Figure 5 A schematic diagram of a partial three-dimensional structure of a conveying mechanism disclosed in an embodiment of the present invention; Figure 6 A partial front cross-sectional schematic diagram of a material storage mechanism disclosed in an embodiment of the present invention; Figure 7 This is a schematic front cross-sectional view of a coating cylinder disclosed in an embodiment of the present invention; Figure 8A schematic diagram of the three-dimensional structure of the clamping mechanism disclosed in an embodiment of the present invention; Figure 9 This is a block diagram of the method disclosed in an embodiment of the present invention.

[0026] In the figure: 1. Protective frame; 2. Coating mechanism; 201. Box; 202. Coating cylinder; 203. Conveyor; 204. First servo motor; 205. First negative pressure suction cup; 206. Raw material barrel; 207. Connecting rod; 208. Support rod; 209. Clamp; 210. Coating rod; 211. Third servo motor; 212. Air slip ring; 213. Second servo motor; 214. First pneumatic telescopic rod; 3. Drying mechanism; 301. Drying box; 302. First linear motor; 303. Lifting seat; 304. Connecting plate; 305. Second pneumatic telescopic rod; 306. Connecting seat; 307. Sliding rod; 308. Conveying plate; 3 09. Slide; 4. Conveying mechanism; 401. Second linear motor; 402. Third linear motor; 403. Fourth linear motor; 404. Fifth linear motor; 405. Clamping mechanism; 40501. Parallel pneumatic clamp; 40502. Moving block; 40503. Clamping rod; 406. Sixth linear motor; 407. First lifting frame; 408. Second lifting frame; 409. Fixed rod; 410. Second negative pressure suction cup; 411. Fourth servo motor; 412. Mounting frame; 413. Seventh linear motor; 7. Material storage mechanism; 701. Base frame; 702. Limit rod; 703. Push plate; 704. Third pneumatic telescopic rod. DETAILED DESCRIPTION

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] See also Figures 1-8The present invention provides a technical solution: a liquid source diffusion device before passivation of a silicon wafer, comprising a coating mechanism 2, the coating mechanism 2 comprising a box body 201, a coating cylinder 202 is fixedly mounted on one side of the upper end of the box body 201, an air slip ring 212 is fixedly mounted on the bottom end of the coating cylinder 202, a first negative pressure suction cup 205 is sleeved on the rotating end of the air slip ring 212, a raw material barrel 206 is fixedly mounted on one side of the coating cylinder 202, a first servo motor 204 is fixedly mounted on the upper end surface of the box body 201 on one side of the raw material barrel 206, a first pneumatic telescopic rod 214 is sleeved on the output end of the first servo motor 204, a connecting rod 207 is fixedly mounted on the upper end of the first pneumatic telescopic rod 214, a support rod 208 is mounted on the bottom side of the connecting rod 207 by bolts, a clamp 209 is rotatably connected to one side of the support rod 208, a coating rod 210 is inserted into the inside of the clamp 209, and a conveyor 203 is fixedly mounted on the upper end surface of the box body 201 on one side of the coating cylinder 202.

[0029] According to an embodiment of the present invention, a second servo motor 213 is fixedly installed at the inner bottom end of the coating cylinder 202, and the output end of the second servo motor 213 is transmission-connected to the rotating end of the air slip ring 212. The output end of the air slip ring 212 is connected to the input end of the first negative pressure suction cup 205 through a pipeline. A third servo motor 211 is fixedly installed on one side of the support rod 208, and the output end of the third servo motor 211 is transmission-connected to the clamp 209.

[0030] An embodiment of the present invention further includes a drying mechanism 3, which includes a drying box 301. The drying box 301 is arranged on one side of the coating cylinder 202, and lifting seats 303 are provided at both ends of the drying box 301. The bottom end of the lifting seat 303 is connected to the upper end surface of the box body 201, and second pneumatic telescopic rods 305 are embedded and installed on both sides of the upper end of the lifting seat 303, and a connecting plate 304 is fixedly installed between the upper ends of each pair of second pneumatic telescopic rods 305.

[0031] Function An embodiment of the present invention, further, the upper ends of the connecting plates 304 are fixedly installed with connecting seats 306, a pair of slide rods 307 are fixedly installed between a pair of connecting seats 306, the interior of the drying box 301 is located between a pair of lifting seats 303 and a first linear motor 302 is fixedly installed, the moving end of the first linear motor 302 is fixedly installed with a conveying plate 308, the upper end of the conveying plate 308 is provided with a pair of slide grooves 309, and the slide grooves 309 are slidably connected to the slide rods 307.

[0032] An embodiment of the present invention further includes a conveying mechanism 4, which includes a second linear motor 401, a third linear motor 402, a fourth linear motor 403 and a fifth linear motor 404. The third linear motor 402 is arranged on one side of the coating cylinder 202, and the moving end of the third linear motor 402 is installed with a sixth linear motor 406, and the moving end of the sixth linear motor 406 is installed with a first lifting frame 407. The second linear motor 401 is arranged on one side of the third linear motor 402, and the moving end of the second linear motor 401 is installed with a fixed rod 409, and the bottom end of the fixed rod 409 is installed with a second negative pressure suction cup 410.

[0033] According to an embodiment of the present invention, further, the fourth linear motor 403 and the fifth linear motor 404 are respectively arranged on both sides of one end of the first linear motor 302, the moving end of the fourth linear motor 403 is fixedly installed with the fourth servo motor 411, the output end of the fourth servo motor 411 is equipped with a mounting frame 412, the moving end of the fifth linear motor 404 is fixedly installed with the seventh linear motor 413, and the moving end of the seventh linear motor 413 is installed with the second lifting frame 408.

[0034] Function An embodiment of the present invention, further, both sides of the bottom end of the first lifting frame 407, the bottom end of the mounting frame 412 and the bottom end of the second lifting frame 408 are provided with a clamping mechanism 405, the clamping mechanism 405 includes a plurality of parallel pneumatic clamps 40501, both sides of the bottom ends of the plurality of parallel pneumatic clamps 40501 are slidably installed with moving blocks 40502, both sides of the bottom ends of the moving blocks 40502 are fixedly installed with clamping rods 40503, and the two moving ends of the parallel pneumatic clamps 40501 are respectively fixedly connected to a pair of moving blocks 40502.

[0035] An embodiment of the present invention further includes a material storage mechanism 7, which includes a pair of base frames 701. The pair of base frames 701 are respectively arranged on both sides of the upper end surface of the box body 201. A plurality of limit rods 702 are fixedly installed on the upper end of the base frames 701. Push plates 703 are slidably inserted between the plurality of limit rods 702. A third pneumatic telescopic rod 704 is inserted at the center of the base frames 701. The bottom end of the third pneumatic telescopic rod 704 passes through the box body 201 and extends to the interior. The top end of the third pneumatic telescopic rod 704 is connected to the bottom end of the push plate 703.

[0036] In accordance with an embodiment of the present invention, a vacuum pump is fixedly installed at the bottom inner end of the box body 201, and the output end of the vacuum pump is connected to the input end of the second negative pressure suction cup 410 and the input end of the air slip ring 212 through pipelines. A protective frame 1 is provided at the upper end of the box body 201, and a plurality of operating doors are provided on both sides of the protective frame 1.

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0038] See also Figure 9 The present invention provides a technical solution: a method for using a liquid source diffusion device before silicon wafer passivation, comprising the following steps: S1, silicon wafer loading and coating: the second linear motor 401 drives the fixed rod 409 and the second negative pressure suction cup 410 to move, and the second negative pressure suction cup 410 uses the negative pressure provided by the vacuum pump to suck the silicon wafer in the base frame 701 for loading. The third linear motor 402 and the sixth linear motor 406 cooperate with the clamping mechanism 405 at the bottom end of the first lifting frame 407 to transfer the silicon wafer to the coating barrel 202. The first negative pressure suction cup 205 adsorbs and fixes the silicon wafer under the negative pressure provided by the air slip ring 212. The second servo motor 213 drives the rotating end of the air slip ring 212 to rotate, driving the silicon wafer to rotate; the first servo motor 204 and the first pneumatic telescopic rod 214 adjust the position of the coating rod 210, and the third servo motor 211 drives the clamp 209 to adjust the angle of the coating rod 210. After obtaining the liquid source from the raw material barrel 206, the silicon wafer is coated; S2, silicon wafer drying and transfer: the coated silicon wafer is clamped by the clamping mechanism 405 at the bottom of the first lifting frame 407 and transferred to the conveying plate 308 in the drying box 301. The first linear motor 302 drives the conveying plate 308 to move along the slide bar 307, so that the silicon wafer moves along the set path in the drying box 301 to complete the drying. After the drying is completed, the second pneumatic telescopic rod 305 drives the slide bar 307 to lift the silicon wafer, and the fourth linear motor 403 drives the clamping mechanism 405 at the bottom of the mounting frame 412 to clamp the silicon wafer. The fourth servo motor 411 drives The mounting frame 412 flips over and places the silicon wafer inside the base frame 701 for unloading. The conveyor plate 308 then continues to convey the subsequent silicon wafer to the front end. The slide bar 307 lifts the new silicon wafer again. The fifth linear motor 404 and the seventh linear motor 413 cooperate with the clamping mechanism 405 at the bottom end of the second lifting frame 408 to clamp the silicon wafer and transfer it to the base frame 701 for unloading. The second lifting frame 408 and the mounting frame 412 move alternately, so that the silicon wafers are grouped in pairs, with the coated surfaces facing each other, and are stored inside the base frame 701 for unloading. S3, silicon wafer storage: The transferred silicon wafers are transferred to the bottom rack 701 for unloading. The third pneumatic telescopic rod 704 pushes the push plate 703 to achieve orderly storage and retrieval of the silicon wafers, completing the entire liquid source diffusion process before silicon wafer passivation.

Claims

1. A liquid source diffusion device before silicon wafer passivation, characterized in that: The coating mechanism (2) comprises a housing (201), a coating cylinder (202) is fixedly mounted on one side of the upper end of the housing (201), an air slip ring (212) is fixedly mounted on the inner bottom end of the coating cylinder (202), a first negative pressure suction cup (205) is sleeved on the rotating end of the air slip ring (212), a raw material barrel (206) is fixedly mounted on one side of the coating cylinder (202), and a first servo motor (204) is fixedly mounted on the upper end surface of the housing (201) located on one side of the raw material barrel (206). The output end of the first servo motor (204) is provided with a first pneumatic telescopic rod (214), the upper end of the first pneumatic telescopic rod (214) is fixedly provided with a connecting rod (207), the bottom side of the connecting rod (207) is provided with a support rod (208) via a bolt, one side of the support rod (208) is rotatably connected with a clamp (209), a coating rod (210) is inserted into the interior of the clamp (209), and a conveyor (203) is fixedly provided on the upper end surface of the box body (201) on one side of the coating cylinder (202).

2. The liquid source diffusion device before silicon wafer passivation according to claim 1, characterized in that: A second servo motor (213) is fixedly mounted on the inner bottom end of the coating cylinder (202); the output end of the second servo motor (213) is transmission-connected to the rotating end of the air slip ring (212); the output end of the air slip ring (212) is connected to the input end of the first negative pressure suction cup (205) through a pipeline; a third servo motor (211) is fixedly mounted on one side of the support rod (208); the output end of the third servo motor (211) is transmission-connected to the clamp (209).

3. The liquid source diffusion device before silicon wafer passivation according to claim 1, characterized in that: The drying mechanism (3) further comprises a drying box (301), wherein the drying box (301) is arranged on one side of the coating cylinder (202), and a lifting seat (303) is provided at both ends of the drying box (301), and the bottom end of the lifting seat (303) is connected to the upper end surface of the box body (201), and second pneumatic telescopic rods (305) are embedded and installed on both sides of the upper end of the lifting seat (303), and a connecting plate (304) is fixedly installed between the upper ends of each pair of the second pneumatic telescopic rods (305).

4. The liquid source diffusion device before silicon wafer passivation according to claim 3, characterized in that: The upper ends of the connecting plates (304) are fixedly mounted with connecting seats (306), a pair of slide bars (307) are fixedly mounted between a pair of the connecting seats (306), a first linear motor (302) is fixedly mounted between a pair of the lifting seats (303) inside the drying box (301), a conveying plate (308) is fixedly mounted on the moving end of the first linear motor (302), a pair of slide grooves (309) are provided at the upper ends of the conveying plate (308), and the slide grooves (309) are slidably connected to the slide bars (307).

5. The liquid source diffusion device before silicon wafer passivation according to claim 4, characterized in that: It also includes a conveying mechanism (4), which includes a second linear motor (401), a third linear motor (402), a fourth linear motor (403) and a fifth linear motor (404), wherein the third linear motor (402) is arranged on one side of the coating cylinder (202), the movable end of the third linear motor (402) is installed with a sixth linear motor (406), the movable end of the sixth linear motor (406) is installed with a first lifting frame (407), the second linear motor (401) is arranged on one side of the third linear motor (402), the movable end of the second linear motor (401) is installed with a fixed rod (409), and the bottom end of the fixed rod (409) is installed with a second negative pressure suction cup (410).

6. The liquid source diffusion device before silicon wafer passivation according to claim 5, characterized in that: The fourth linear motor (403) and the fifth linear motor (404) are respectively arranged on both sides of one end of the first linear motor (302); the movable end of the fourth linear motor (403) is fixedly mounted with a fourth servo motor (411); the output end of the fourth servo motor (411) is sleeved with a mounting frame (412); the movable end of the fifth linear motor (404) is fixedly mounted with a seventh linear motor (413); and the movable end of the seventh linear motor (413) is mounted with a second lifting frame (408).

7. The liquid source diffusion device before silicon wafer passivation according to claim 6, characterized in that: A clamping mechanism (405) is provided on both sides of the bottom end of the first lifting frame (407), the bottom end of the mounting frame (412) and the bottom end of the second lifting frame (408). The clamping mechanism (405) includes a plurality of parallel pneumatic clamps (40501). Moving blocks (40502) are slidably installed on both sides of the bottom ends of the plurality of parallel pneumatic clamps (40501). Clamping rods (40503) are fixedly installed on both sides of the bottom ends of the moving blocks (40502). The two moving ends of the parallel pneumatic clamps (40501) are respectively fixedly connected to a pair of moving blocks (40502).

8. The liquid source diffusion device before silicon wafer passivation according to claim 1, characterized in that: The storage mechanism (7) further comprises a material storage mechanism (7), wherein the material storage mechanism (7) comprises a pair of base frames (701), wherein the pair of base frames (701) are respectively arranged on both sides of the upper end surface of the box body (201), wherein a plurality of limiting rods (702) are fixedly mounted on the upper ends of the base frames (701), wherein a push plate (703) is slidably inserted between the plurality of limiting rods (702), and a third pneumatic telescopic rod (704) is inserted at the center of each of the base frames (701), wherein the bottom end of each of the third pneumatic telescopic rods (704) passes through the box body (201) and extends to the interior, and the top end of each of the third pneumatic telescopic rods (704) is connected to the bottom end of the push plate (703).

9. The liquid source diffusion device before silicon wafer passivation according to claim 1, characterized in that: A vacuum pump is fixedly installed at the bottom end of the box (201), and the output end of the vacuum pump is connected to the input end of the second negative pressure suction cup (410) and the input end of the air slip ring (212) through pipelines. A protective frame (1) is provided at the upper end of the box (201), and a plurality of operating doors are provided on both sides of the protective frame (1).

10. A method for using a liquid source diffusion device before silicon wafer passivation, characterized in that: A silicon wafer pre-passivation liquid source diffusion device according to any one of claims 1 to 9, comprising the following steps: S1, silicon wafer loading and coating: the second linear motor (401) drives the fixed rod (409) and the second negative pressure suction cup (410) to move, and the second negative pressure suction cup (410) uses the negative pressure provided by the vacuum pump to absorb the silicon wafer in the base frame (701) for loading, and the third linear motor (402) and the sixth linear motor (406) cooperate with the clamping mechanism (405) at the bottom end of the first lifting frame (407) to transfer the silicon wafer to the coating cylinder (202). The pressure suction cup (205) absorbs and fixes the silicon wafer under the negative pressure provided by the air slip ring (212), and the second servo motor (213) drives the rotating end of the air slip ring (212) to rotate, thereby driving the silicon wafer to rotate; the first servo motor (204) and the first pneumatic telescopic rod (214) adjust the position of the coating rod (210), and the third servo motor (211) drives the clamp (209) to adjust the angle of the coating rod (210), and the silicon wafer is coated after obtaining the liquid source from the raw material barrel (206); S2, silicon wafer drying and transfer: the coated silicon wafer is clamped by the clamping mechanism (405) at the bottom end of the first lifting frame (407) and transferred to the conveying plate (308) in the drying box (301). The first linear motor (302) drives the conveying plate (308) to move along the slide bar (307), so that the silicon wafer moves along the set path in the drying box (301) to complete the drying. After the drying is completed, the second pneumatic telescopic rod (305) drives the slide bar (307) to lift and lift the silicon wafer. The fourth linear motor (403) drives the clamping mechanism (405) at the bottom end of the mounting frame (412) to clamp the silicon wafer. The fourth servo motor (411) The mounting frame (412) is driven to flip, and the silicon wafer is flipped and placed inside the base frame (701) for unloading. Then, the conveying plate (308) continues to convey and moves the subsequent silicon wafer to the front end. The slide bar (307) lifts the new silicon wafer again. The fifth linear motor (404) and the seventh linear motor (413) cooperate with the clamping mechanism (405) at the bottom end of the second lifting frame (408) to clamp the silicon wafer and transfer it to the inside of the base frame (701) for unloading. The second lifting frame (408) and the mounting frame (412) move alternately, so that the silicon wafers are grouped in twos, with the coated surfaces facing each other, and are stored inside the base frame (701) for unloading. S3, silicon wafer storage: the transferred silicon wafers are transferred to the interior of the base frame (701) for unloading, and the third pneumatic telescopic rod (704) pushes the push plate (703) to achieve orderly storage and retrieval of the silicon wafers, completing the entire liquid source diffusion process before silicon wafer passivation.

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