Chamber tuning method, equipment and system

Abstract

The invention provides a chamber tuning method, device and system, and relates to the technical field of integrated circuit manufacturing, and the method comprises the steps: obtaining the state information of each chamber in a target machine related to each process in a technological process, and determining the use state of each chamber according to the state information; and according to the use state of each chamber, determining an available chamber in the target machine, and generating a processing instruction carrying identification information and an available chamber sequence according to the available chamber, so that the machine executes a process on the wafer in the chamber corresponding to the available chamber sequence according to the identification information. By adopting the scheme, for the same process, the target machine table can execute the process on the wafer only by selecting the required cavity from the available cavity sequence according to the processing instruction, a large number of process formulas do not need to be pre-stored, and a large number of resources are saved.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit manufacturing, and in particular to a chamber tuning method, equipment and system. Background Art

[0002] In semiconductor manufacturing, a machine has a large number of chambers. During the production process, to ensure product quality, chambers with abnormal machine conditions need to be eliminated.

[0003] In traditional technology, different process recipes are established to adapt to different chamber combinations. The Manufacturing Execution System (MES) edits and sets the process recipes and transmits them to the machine through the Equipment Automation Project (EAP). Since the process recipes on the MES side and the machine side need to correspond one to one, and the chamber for passing goods needs to be determined according to the change of the chamber state, a large number of process recipes need to be established. For example, the LAM EOS machine has 16 chambers, and a maximum of 2 chambers need to be established. 16 -1 = 65535 craft recipes, which will consume a lot of resources. At the same time, some machine models have a certain number of craft recipe fields. For example, the DNS machine only has 2000 fields and may not be able to support this operation mode. Summary of the Invention

[0004] The purpose of the present invention is to provide a chamber tuning method, equipment and system to overcome the problem in traditional technology of establishing different process recipes to adapt to chamber combinations under different conditions, which results in the need to establish a large number of process recipes and consume resources.

[0005] In a first aspect, the present application proposes a chamber tuning method, the method comprising: For a process in the process flow, obtain the status information of each chamber in the target tool related to the process; determining the usage status of each of the chambers according to the status information; According to the usage status of each of the chambers, an available chamber is selected, and a processing instruction is generated based on the available chamber, wherein the processing instruction carries identification information and an available chamber sequence, and the processing instruction is used to enable the target machine to perform the process on the wafer in the chamber corresponding to the available chamber sequence according to the identification information.

[0006] In one embodiment, the status information includes any one or more of chamber data, operation data, and production data; Determining the usage status of each chamber according to the status information includes: Comparing the state information of each chamber with a preset first condition in sequence according to a preset order; For any chamber, if any data in the state information of the chamber does not meet the preset first condition, the chamber is considered to be in an unavailable state; otherwise, the chamber is considered to be in an available state.

[0007] In one embodiment, the status information also includes historical data; The determining the usage status of each chamber according to the status information further includes: Processing the state information using a pre-trained prediction model to obtain fault trend data for each chamber; wherein the prediction model is pre-trained based on the historical data; Comparing the fault trend data of each chamber with a preset second condition in sequence according to a preset order; For any chamber, if any data in the status information of the chamber does not meet the preset first condition, and / or the fault trend data does not meet the preset second condition, the chamber is considered to be in an unavailable state; otherwise, the chamber is considered to be in an available state.

[0008] In a second aspect, the present application further proposes a chamber tuning device, comprising: An acquisition module is used to obtain status information of each chamber in a target tool related to a process in a process flow; A processing module is used to determine the usage status of each of the chambers based on the status information; select an available chamber based on the usage status of each of the chambers, and generate a processing instruction based on the available chambers, wherein the processing instruction carries identification information and an available chamber sequence; the processing instruction is used to enable the target machine to perform the process on the wafer in the chamber corresponding to the available chamber sequence according to the identification information. In a third aspect, the present application further proposes a chamber tuning method, the method comprising: For a process in the process flow, the status information of each chamber related to the process is sent to the manufacturing execution system; receiving and parsing a processing instruction generated by the manufacturing execution system according to the status information, wherein the processing instruction carries identification information and an available chamber sequence; The process is performed on the wafer in a chamber corresponding to the available chamber sequence according to the identification information.

[0009] In one embodiment, performing the process on the wafer in the chamber corresponding to the available chamber sequence according to the identification information includes: Searching for a process recipe matching the identification information in a pre-stored process library; the process recipe includes process parameters and an original chamber sequence; Replacing the original chamber sequence with the available chamber sequence, and selecting a chamber from the available chamber sequence as a chamber to be executed according to a preset rule; The process is performed on the wafer in the chamber to be performed using the process parameters. In one embodiment, the method further comprises: After receiving the processing instruction, each chamber corresponding to the available chamber sequence is enabled, and unavailable chambers are disabled.

[0010] In a fourth aspect, the present application further proposes a chamber tuning device, comprising: A detection module is used to detect the status information of each chamber related to a process in the process flow and send it to the manufacturing execution system; a parsing module, configured to receive and parse a processing instruction generated by the manufacturing execution system according to the status information, wherein the processing instruction carries identification information and an available chamber sequence; An execution module is configured to execute the process on the wafer in a chamber corresponding to the available chamber sequence according to the identification information.

[0011] In a fifth aspect, the present application further proposes a chamber tuning method, the method comprising: For a process in the process flow, the target machine associated with the process detects the status information of each chamber in the machine and reports it to the manufacturing execution system through the equipment automation system; The manufacturing execution system determines the usage status of each chamber based on the status information; selects an available chamber based on the usage status of each chamber, generates a processing instruction based on the available chamber, and issues the processing instruction to the target machine through the equipment automation system; wherein the processing instruction carries identification information and a sequence of available chambers; The tool performs the process on the wafer in the chamber corresponding to the available chamber sequence according to the identification information.

[0012] In a sixth aspect, the present application further proposes a chamber tuning system, comprising: The machine is used to detect the status information of each chamber related to a process in the process flow; A manufacturing execution system is configured to determine a usage status of each of the chambers based on the status information; select an available chamber based on the usage status of each of the chambers; and generate a processing instruction based on the available chambers, wherein the processing instruction carries identification information and a sequence of available chambers; The tool is further configured to perform the process on the wafer in the chamber corresponding to the available chamber sequence according to the identification information; The equipment automation system is used to realize data transmission between the manufacturing execution system and the machine.

[0013] The above-mentioned chamber tuning method, device and system have at least the following advantages: This application obtains the status information of each chamber in the target machine related to each process in the process flow, and determines the usage status of each chamber based on the status information. Based on the usage status of each chamber, it then determines the available chambers in the target machine, and generates processing instructions containing identification information and a sequence of available chambers based on the available chambers, so that the machine can perform the process on the wafer in the chamber corresponding to the sequence of available chambers based on the identification information. Using this solution, for the same process, the target machine only needs to select the required chamber from the sequence of available chambers based on the processing instructions to perform the process on the wafer, eliminating the need to pre-store a large number of process recipes and saving a lot of resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a structural block diagram of a chamber tuning system in one embodiment; Figure 2 1 is a flow chart of a chamber tuning method according to an embodiment; Figure 3 A schematic flow chart of the steps for determining the usage status of each chamber in one embodiment; Figure 4 A schematic flow chart of the step of determining the usage status of each chamber in another embodiment; Figure 5 is a structural block diagram of a chamber tuning device in one embodiment; Figure 6 is a schematic flow chart of a chamber tuning method according to another embodiment; Figure 7 It is a structural block diagram of a chamber tuning device in another embodiment. DETAILED DESCRIPTION

[0015] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure of the present application.

[0016] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" as used herein includes any and all combinations of one or more of the relevant listed items.

[0017] In the case of using “including,” “having,” and “comprising” described herein, another component may be added unless a clear limiting term such as “only,” “consisting of,” etc. is used. Unless mentioned otherwise, a term in the singular form may include a plural form and should not be understood as having one number.

[0018] It should be understood that although the terms "first," "second," etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element, without departing from the scope of this application.

[0019] In this application, unless otherwise specified or limited, the terms "connected" and "connection" should be understood in a broad sense. For example, they can refer to direct connection or indirect connection through an intermediate medium, internal communication between two elements, or interaction between two elements. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0020] See also Figure 1 In one embodiment, the present application provides a chamber tuning system, including: a manufacturing execution system (MES), an equipment automation program (EAP), and a machine platform.

[0021] An MES system is a factory-level production management system primarily used to track, manage, and optimize production processes. Specifically, its main functions include: production scheduling, such as assigning production tasks and allocating equipment resources; process tracking, such as recording the processing status of each wafer and equipment usage; data collection, such as collecting data from the EAP system and other systems for analysis and optimization; and quality management, such as monitoring product quality and analyzing defect data.

[0022] The EAP system is a device-side software system responsible for automated control and data collection. Specifically, the MES system's main functions include: device communication, such as communicating with the MES system and machines; data collection, such as collecting operational data such as temperature, pressure, and operating status, as well as equipment fault information; and status management, such as monitoring equipment status and adjusting operating modes based on instructions from the MES system.

[0023] Machine refers to semiconductor manufacturing equipment, which includes photolithography machines, etc. The above-mentioned machines are used to perform wafer processing. There are many processes that can be performed, such as wafer exposure, etching, deposition, cleaning, etc.

[0024] Optionally, the MES system, EAP system, and machine tools all have communication modules. Using a defined communication protocol, the EAP system can receive instructions from the MES system and convert them into a format recognizable by the machine tools, enabling the machine tools to execute the corresponding processes according to the instructions. Simultaneously, the machine tools report status information to the EAP system, which then uploads this information to the MES system for analysis and recording.

[0025] Specifically, in this embodiment, the tool detects the status information of each chamber associated with each process in the process flow and reports it to the MES system via the EAP system. The MES system determines the usage status of each chamber based on this status information. Based on the usage status of each chamber, it selects an available chamber and generates a processing instruction based on the available chambers. The processing instruction carries identification information and a sequence of available chambers. The EAP system transmits this processing instruction to the tool, which then performs the wafer process in the chamber corresponding to the sequence of available chambers based on the identification information. Specifically, different processes in the wafer process flow correspond to different tools. Before executing a process, the MES system first identifies the target tool involved in the process and obtains the status information of each chamber in the target tool to confirm whether each chamber is available. Each process may involve one or more target tools, and this status information may be obtained and stored in the MES system periodically or in real time. Furthermore, in this embodiment of the application, the status information of each chamber may be obtained before each production batch (LOT).

[0026] Status information includes any one or more of chamber data, operational data, and production data. Chamber data represents the status of each chamber in the target tool, such as whether the chamber is currently idle, processing, or faulty, and the chamber's operating time, idle time, and maintenance time. Operational data represents data related to chamber operation, such as chamber temperature, pressure, and plasma chamber RF power. Production data represents data related to the production process, such as processing batches, process recipes, and chamber yield rates.

[0027] By analyzing the above status information, the MES system obtains the real-time status of each chamber, selects the available chambers, and generates processing instructions.

[0028] Furthermore, the MES system processes the above processing instructions into data packets and sends them to the EAP system through the communication module.

[0029] The EAP system is used to realize data transmission between the manufacturing execution system and the machine.

[0030] Specifically, upon receiving the data packet, the EAP system parses it into a pre-defined data structure, extracting key data from the processing instructions, such as the aforementioned identification information and the sequence of available chambers. Furthermore, the EAP system converts this key data into an instruction format that the machine can recognize and execute.

[0031] Optionally, the EAP system is also configured to perform data integrity and security verification on the data packet before parsing the data packet corresponding to the processing instruction. Exemplary verification methods include verifying the version number and timestamp of the data packet to ensure it is the target version; verifying that key fields in the data packet are complete and formatted correctly to ensure data integrity; and verifying the checksum or hash value included in the data packet to ensure it has not been damaged or tampered with during transmission.

[0032] Optionally, the tool performs a process on the wafer in a chamber corresponding to the available chamber sequence according to the identification information, including: In a pre-stored process library, a process recipe matching the identification information is searched, wherein the process recipe includes process parameters and an original chamber sequence.

[0033] The original chamber sequence is replaced with the available chamber sequence, and a chamber is selected from the available chamber sequence as the chamber to be executed according to a preset rule.

[0034] The process parameters are used to perform a process on the wafer in the chamber to be performed.

[0035] Specifically, the machine pre-stores a process library, which includes multiple process recipes related to the manufacturing process. The above-mentioned identification information is used to characterize the uniqueness of each process recipe. Generally speaking, the identification information includes one or more of the program name, version number, hash value and checksum. Furthermore, in addition to the above-mentioned identification information, each process recipe also includes a variety of data such as process type, applicable machine model, chamber sequence and process parameters. After the designer writes the process recipe in the upper system, it is sent to the machine end through the MES system and EAP system in turn. Before executing the process recipe, the machine end first confirms whether the identification information on the machine end and the identification information in the MES correspond one to one. If so, the process recipe is loaded and run; otherwise, an error will be reported and the execution will be refused.

[0036] After receiving the processing instructions from the EAP system, the machine parses them to obtain identification information and available chamber sequences. Based on the identification information, a query is performed in the process library. If a process recipe's identification information matches the parsed identification information, the parsed available chamber sequence is used to replace the original chamber sequence in the process recipe, completing the update of the process recipe.

[0037] For example, in conventional technology, if a target tool has four chambers, ABCD, and a LOT requires depositing a 10nm thick silicon dioxide (SiO2) film on the wafer surface at 500°C, multiple process recipes are pre-stored in the process library, each corresponding to a different chamber combination. For example, if four wafers are processed at a time, the first process recipe is named Recipe 1, with a chamber sequence of ABCD. If three wafers are processed at a time, the second process recipe is named Recipe 2, with a chamber sequence of ABC. The third process recipe is named Recipe 3, with a chamber sequence of ABD. The fourth process recipe is named Recipe 4, with a chamber sequence of BCD. If two wafers are processed at a time, the fifth process recipe is named Recipe 5, with a chamber sequence of AB. And so on, ultimately resulting in multiple process recipes. It should be understood that since these process recipes correspond to the same process, the process parameters are identical. However, since this approach cannot predetermine chamber conditions, it requires pre-storing a large number of process recipes, which consumes significant resources.

[0038] In this embodiment, the target machine detects the status information of the four chambers and reports it to the MES system. The MES system analyzes the status information of each chamber one by one, removes chambers with abnormal conditions or manual control, and adds the chambers that pass verification to the available chamber sequence. For example, if the analysis determines that chamber B is abnormal, the available chamber sequence is ACD, and the corresponding identification information of this available chamber sequence is Recipe 1. The MES system processes this available chamber sequence ACD and its corresponding identification information Recipe 1 into a processing instruction and sends it to the target machine through the EAP system.

[0039] After receiving the processing instruction, the target machine parses the identification information Recipe1 and the available chamber sequence ACD. It then searches the process library based on Recipe1. If a process recipe named Recipe1 is found, the original chamber sequence ABCD in the recipe is replaced with the available chamber sequence ACD. For example, if the LOT requires processing two wafers at a time, the target machine selects two chambers from the ACD according to a preset rule as the chambers to be executed.

[0040] The preset rules are set according to needs. For example, in each processing, AC, AD, and CD are selected in sequence as the chambers to be executed in a preset order to perform the process on the wafer; or the ACD chambers are sorted according to the chamber yield rate, and the chambers with the first two yield rate ranking results are selected as the chambers to be executed in each processing to perform the process on the wafer.

[0041] Using the above solution, for the same process, it is only necessary to replace the chamber sequence in the process recipe, and then select the required chamber from the replaced chamber sequence according to the preset rules to process the wafer. There is no need to pre-store a large number of process recipes, which saves a lot of resources.

[0042] Optionally, after the machine analyzes the processing instruction, it also includes: The identification information and the available chamber sequence are verified. After the verification is successful, the identification information is identified and the process is performed on the wafer in the chamber corresponding to the available chamber sequence.

[0043] Specifically, after parsing the identification information and the available chamber sequence, the machine verifies the key data in the identification information and the available chamber sequence. For example, by verifying the hash value or check code, it ensures that the data is not damaged during the transmission process; by checking the program name and version number, it confirms whether the current machine matches, thereby ensuring data security.

[0044] Optionally, after receiving the processing instruction, the machine further includes: According to the available chamber sequence, available chambers are enabled, while unavailable chambers are disabled.

[0045] Specifically, the tool enables each available chamber based on the available chamber sequence, allowing designated chambers to participate in the current or subsequent process, and disables chambers deemed unavailable. This approach prevents the tool from assigning tasks to disabled chambers, ensuring operational safety. Furthermore, placing disabled chambers in sleep mode reduces energy consumption.

[0046] In the aforementioned chamber optimization system, the tool acquires status information for each chamber associated with each process in the process flow and reports it to the MES system via the EAP system. The MES system then determines available chambers based on this status information and generates processing instructions containing identification information and available chamber sequences for these available chambers. These instructions are then distributed to the tool via the EAP system. Based on this identification information, the tool searches the process library for a matching process recipe and updates the chamber sequence in the matching process recipe to the available chamber sequence. Following pre-set rules, the tool selects the required chamber from the available chamber sequence and executes the process on the wafer, eliminating the need to pre-store numerous process recipes and saving significant resources.

[0047] Furthermore, the machine also enables the chambers that can be used and disables the chambers that cannot be used based on the received processing instructions, avoiding assigning tasks to the disabled chambers and ensuring operational safety. In addition, setting the disabled chambers to sleep mode can also reduce energy consumption.

[0048] Based on the same inventive concept, an embodiment of the present application also provides a chamber tuning method, which is applicable to the above-mentioned chamber tuning system. The implementation solution for solving the problem provided by this method is similar to the implementation solution recorded in the above-mentioned system. Therefore, the specific limitations in one or more method embodiments provided below can be found in the above-mentioned limitations on the system and will not be repeated here.

[0049] In one embodiment, the chamber tuning method includes: For a process in the process flow, the target machine associated with the process detects the status information of each chamber in the machine and reports it to the manufacturing execution system through the equipment automation system; The manufacturing execution system determines the usage status of each chamber based on the status information. Based on the usage status of each chamber, it selects an available chamber and generates a processing instruction based on the available chambers. The processing instruction is then sent to the target machine through the equipment automation system. The processing instruction carries identification information and a sequence of available chambers. The tool performs a process on the wafer in the chamber corresponding to the available chamber sequence according to the identification information.

[0050] Optionally, the tool performs a process on the wafer in a chamber corresponding to the available chamber sequence according to the identification information, including: In a pre-stored process library, a process recipe matching the identification information is searched, wherein the process recipe includes process parameters and an original chamber sequence.

[0051] The original chamber sequence is replaced with the available chamber sequence, and a chamber is selected from the available chamber sequence as the chamber to be executed according to a preset rule.

[0052] The process parameters are used to perform a process on the wafer in the chamber to be performed.

[0053] Optionally, after the machine analyzes the processing instruction, it also includes: The identification information and the available chamber sequence are verified. After the verification is successful, the identification information is identified and the process is performed on the wafer in the chamber corresponding to the available chamber sequence.

[0054] Optionally, after receiving the processing instruction, the machine further includes: According to the available chamber sequence, available chambers are enabled, while unavailable chambers are disabled.

[0055] In the above chamber optimization method, the tool obtains status information for each chamber associated with each process in the process flow and reports it to the MES system via the EAP system. The MES system then determines available chambers based on this status information and generates processing instructions containing identification information and available chamber sequences for these available chambers. These instructions are then distributed to the tool via the EAP system. Based on this identification information, the tool searches the process library for a matching process recipe and updates the chamber sequence in the matching process recipe to the available chamber sequence. Following pre-set rules, the tool selects the required chamber from the available chamber sequence and executes the process on the wafer, eliminating the need to pre-store numerous process recipes and saving significant resources.

[0056] Furthermore, the machine also enables the chambers that can be used and disables the chambers that cannot be used based on the received processing instructions, avoiding assigning tasks to the disabled chambers and ensuring operational safety. In addition, setting the disabled chambers to sleep mode can also reduce energy consumption.

[0057] Based on the same inventive concept, an embodiment of the present application also provides a chamber tuning method, which is applicable to the MES system in the above-mentioned chamber tuning system. The implementation solution for solving the problem provided by this method is similar to the implementation solution recorded in the above-mentioned system. Therefore, the specific limitations in one or more method embodiments provided below can be referred to the above limitations on the system and will not be repeated here.

[0058] See also Figure 2 In one embodiment, the chamber tuning method includes: In step S202 , for a process in the process flow, status information of each chamber in a target tool related to the process is obtained.

[0059] Step S204: determining the usage status of each chamber according to the status information.

[0060] In step S206, an available chamber is selected based on the usage status of each chamber, and a processing instruction is generated based on the available chamber. The processing instruction carries identification information and an available chamber sequence, and the processing instruction is used to enable the target machine to perform a process on the wafer in the chamber corresponding to the available chamber sequence according to the identification information.

[0061] See also Figure 3 Optionally, determining the usage status of each chamber according to the status information includes: Step S302 : comparing the state information of each chamber with a preset first condition in sequence according to a preset order.

[0062] Step S304 : For any chamber, if any data in the state information of the chamber does not meet a preset first condition, the chamber is considered to be in an unavailable state; otherwise, the chamber is considered to be in an available state.

[0063] Specifically, a machine includes multiple chambers, each with a unique number. The status information of each chamber is compared against a preset first condition in a predetermined order until all chambers are completed. The purpose of setting the predetermined order is to avoid missing chambers, and it can be set based on actual conditions. For example, the predetermined order can be executed in the order of chamber numbers.

[0064] The preset first condition is used to judge the fault condition of the chamber, which includes a variety of judgment methods. For example, when the status information includes chamber data, the preset first condition can be set to the use status of the chamber as idle or in processing. If the chamber data of a chamber is faulty, it is considered that the chamber does not meet the preset first condition and is unavailable. When the status information includes operating data, the preset first condition can be set to temperature, pressure and other data within a threshold range. If the temperature of a chamber exceeds the above threshold range, it is considered that the chamber does not meet the preset first condition and is unavailable. It should be understood that the preset first condition is determined based on the data included in the status information, and if any status information of a chamber does not meet the preset first condition, the chamber is considered unavailable. Using the above solution, the MES system can obtain the real-time status of each chamber through the above status information, and then select the available chambers.

[0065] Optionally, the status information also includes historical data. A chamber's historical data includes its historical status information and fault information. By analyzing this historical data, the chamber's fault trends can be inferred. Fault information includes maintenance records, fault type, number of faults, and the service life of key components.

[0066] See also Figure 4 , according to the status information, determine the use status of each chamber, and also include: Step S402 : Using a pre-trained prediction model to process the status information, and obtain the fault trend data of each chamber; wherein the prediction model is pre-trained based on historical data.

[0067] Step S404 : comparing the fault trend data of each chamber with the preset second condition in sequence according to a preset order.

[0068] Step S406: For any chamber, if any data in the state information of the chamber does not meet the preset first condition and / or the fault trend data does not meet the preset second condition, the chamber is considered to be in an unavailable state; otherwise, the chamber is considered to be in an available state.

[0069] Specifically, the prediction model can be trained based on a machine learning model or a deep learning model. Fault trend data can be a label or a probability value. For example, the label can be set to "normal" or "abnormal"; it can also be set to "short-term no fault", "short-term possible fault", or "short-term inevitable fault". If the fault trend data is a label, the preset second condition can be set to determine that it is available only when the label is "normal". If the fault trend data of a chamber is "abnormal", it is considered that the chamber does not meet the preset second condition and is unavailable. Furthermore, if the fault trend data is a probability value, the preset second condition can be set to a fault threshold range. If the predicted probability value of a chamber does not fall within the above-mentioned fault threshold range, it is considered that the chamber does not meet the preset second condition and is unavailable. Using the above scheme, the state information is processed by the prediction model to predict the fault trend of each chamber, and the available chamber is selected according to the fault trend to optimize production efficiency and improve machine utilization.

[0070] Optionally, based on the usage status of each chamber, an available chamber is selected, including: Traverse the usage status of each chamber. During the traversal process, if a chamber is in an available state, add the chamber to the available queue. After the traversal is completed, each chamber in the available queue is the available chamber sequence.

[0071] Optionally, after adding the available chamber to the available queue, the following steps are further included: Based on the status information of each chamber in the available queue, the chambers are further screened to select the appropriate chambers for the process. For example, chambers with the smallest parameter differences can be selected to ensure consistency. Chambers with less usage time can also be selected to avoid overuse of certain chambers. This approach allows for the selection of chambers in good condition for processing tasks, improving yield and production efficiency.

[0072] Optionally, the chamber tuning method further includes: The acquired status information is processed and then saved in a database; the processing of the status information includes cleaning and format conversion.

[0073] Specifically, the acquired status information includes multi-dimensional data, each in a different format. Furthermore, the acquired status information may contain invalid data. Therefore, the embodiments of the present application cleanse and unify the aforementioned status information, and store the processed data in a database for subsequent rapid query and analysis.

[0074] The above chamber optimization method obtains status information for each chamber in the target tool associated with each process in the process flow. Based on this status information, it determines the usage status of each chamber. Based on the usage status of each chamber, it then determines the available chambers in the target tool. Based on the available chambers, it generates processing instructions containing identification information and a sequence of available chambers and sends them to the tool. This allows the tool to execute the process on the wafer in the chamber corresponding to the sequence of available chambers based on the identification information. Using this solution, for the same process, the target tool simply selects the required chamber from the available sequence according to the processing instructions from the MES system and pre-set rules to execute the process on the wafer. This eliminates the need to pre-store numerous process recipes and saves significant resources.

[0075] It should be understood that, although the various steps in the flowcharts involved in the various embodiments described above are displayed in sequence according to the instructions of the arrows, these steps are not necessarily executed in sequence in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and these steps can be executed in other orders. Moreover, at least a portion of the steps in the flowcharts involved in the various embodiments described above can include multiple steps or multiple stages, and these steps or stages are not necessarily executed and completed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a portion of steps or stages in other steps.

[0076] Based on the same inventive concept, an embodiment of the present application also provides a chamber tuning device, which is suitable for the above-mentioned chamber tuning method. The implementation solution for solving the problem provided by the device is similar to the implementation solution recorded in the above-mentioned method. Therefore, the specific limitations in one or more device embodiments provided below can be referred to the limitations on the method above, and will not be repeated here.

[0077] See also Figure 5 In one embodiment, the chamber tuning device includes: an acquisition module and a processing module.

[0078] The acquisition module is used to obtain status information of each chamber in a target tool related to a process in the process flow.

[0079] The processing module is used to determine the usage status of each chamber based on the status information; select an available chamber based on the usage status of each chamber, and generate a processing instruction based on the available chamber, wherein the processing instruction carries identification information and an available chamber sequence; the processing instruction is used to enable the target machine to perform a process on the wafer in the chamber corresponding to the available chamber sequence according to the identification information.

[0080] Optionally, the processing module determines the usage status of each chamber based on the status information, including: comparing the status information of each chamber with a preset first condition in sequence according to a preset order; for any chamber, if any data in the status information of the chamber does not meet the preset first condition, the chamber is considered to be in an unavailable state; otherwise, the chamber is considered to be in an available state.

[0081] Optionally, the status information also includes historical data; the processing module determines the usage status of each chamber based on the status information, and also includes: using a pre-trained prediction model to process the status information to obtain fault trend data of each chamber; wherein the prediction model is pre-trained based on historical data; in accordance with a preset order, the fault trend data of each chamber is compared with a preset second condition in turn; for any chamber, if any data in the status information of the chamber does not meet the preset first condition, and / or the fault trend data does not meet the preset second condition, the chamber is considered to be in an unavailable state; otherwise, the chamber is considered to be in an available state.

[0082] Optionally, the processing module selects an available chamber based on the usage status of each chamber, including: traversing the usage status of each chamber. During the traversal process, if a chamber is in an available state, the chamber is added to the available queue. After the traversal is completed, each chamber in the available queue is an available chamber sequence.

[0083] Optionally, the processing module is further configured to further screen the chambers according to status information of the chambers in the available queue, so as to select appropriate chambers to perform the process.

[0084] The chamber optimization device acquires status information for each chamber in the target tool associated with each process in the process flow. Based on this status information, it determines the usage status of each chamber. It then determines the available chambers in the target tool based on the usage status of each chamber. It then generates processing instructions containing identification information and a sequence of available chambers based on the available chambers and sends them to the tool. This allows the tool to execute the process on the wafer in the chamber corresponding to the sequence of available chambers based on the identification information. Using this solution, for the same process, the target tool simply selects the required chamber from the available sequence according to the processing instructions from the MES system and pre-set rules. This eliminates the need to pre-store numerous process recipes and saves significant resources.

[0085] Each module in the chamber tuning device described above can be implemented in whole or in part through software, hardware, or a combination thereof. Each module can be embedded in or independent of a processor in a computer device in hardware form, or stored in a computer device memory in software form, allowing the processor to call and execute the corresponding operations of each module.

[0086] Based on the same inventive concept, an embodiment of the present application also provides a chamber tuning method, which is applicable to the machine in the above-mentioned chamber tuning system. The implementation solution for solving the problem provided by this method is similar to the implementation solution recorded in the above-mentioned system. Therefore, the specific limitations in one or more method embodiments provided below can be referred to the above limitations on the system and will not be repeated here.

[0087] See also Figure 6 In one embodiment, the chamber tuning method includes: In step S602 , for a process in the process flow, status information of each chamber related to the process is sent to a manufacturing execution system.

[0088] Step S604 : receiving and parsing a processing instruction generated by the manufacturing execution system according to the status information, wherein the processing instruction carries identification information and an available chamber sequence.

[0089] Step S606 : performing a process on the wafer in a chamber corresponding to the available chamber sequence according to the identification information.

[0090] Optionally, performing a process on the wafer in a chamber corresponding to the available chamber sequence according to the identification information includes: Searching for a process recipe that matches the identification information in a pre-stored process library; the process recipe includes process parameters and an original chamber sequence; Replace the original chamber sequence with the available chamber sequence, and select a chamber from the available chamber sequence as the chamber to be executed according to a preset rule; The process parameters are used to perform a process on the wafer in the chamber to be performed. Optionally, the chamber tuning method further includes: After receiving the processing instruction, each chamber corresponding to the available chamber sequence is enabled, and the unavailable chambers are disabled.

[0091] In this chamber optimization method, the tool acquires status information for each chamber associated with each process in the process flow and reports it to the MES system via the EAP system. The MES system then determines available chambers based on this status information and generates processing instructions containing identification information and available chamber sequences for these available chambers. Based on this identification information, the tool searches the process library for a matching process recipe and updates the chamber sequence in the matching process recipe to the available chamber sequence. Following pre-set rules, the tool selects the desired chamber from the available chamber sequence and executes the process on the wafer, eliminating the need to pre-store numerous process recipes and saving significant resources.

[0092] Furthermore, the machine also enables the chambers that can be used and disables the chambers that cannot be used based on the received processing instructions, avoiding assigning tasks to the disabled chambers and ensuring operational safety. In addition, setting the disabled chambers to sleep mode can also reduce energy consumption.

[0093] Based on the same inventive concept, an embodiment of the present application also provides a chamber tuning device, which is suitable for the above-mentioned chamber tuning method. The implementation solution for solving the problem provided by the device is similar to the implementation solution recorded in the above-mentioned method. Therefore, the specific limitations in one or more device embodiments provided below can be referred to the limitations on the method above, and will not be repeated here.

[0094] See also Figure 7 In one embodiment, the chamber tuning device includes: a detection module and an analysis module.

[0095] The detection module is used to detect the status information of each chamber related to a process in the process flow and send it to the manufacturing execution system.

[0096] The parsing module is used to receive and parse the processing instructions generated by the manufacturing execution system according to the status information, wherein the processing instructions carry identification information and an available chamber sequence.

[0097] The execution module is used to execute a process on the wafer in a chamber corresponding to the available chamber sequence according to the identification information.

[0098] Optionally, the execution module executes a process on the wafer in a chamber corresponding to the available chamber sequence according to the identification information, including: searching for a process recipe that matches the identification information in a pre-stored process library; the process recipe includes process parameters and an original chamber sequence; replacing the original chamber sequence with an available chamber sequence, and selecting a chamber from the available chamber sequence as a chamber to be executed according to preset rules; and using the process parameters to execute the process on the wafer in the chamber to be executed.

[0099] Optionally, the execution module is further configured to enable each chamber corresponding to the available chamber sequence and disable unavailable chambers after receiving the processing instruction.

[0100] The chamber optimization device acquires status information for each chamber associated with each process in the process flow and transmits it to the EAP system, reporting it to the MES system. The MES system then determines available chambers based on this status information and generates processing instructions containing identification information and available chamber sequences for these available chambers. Based on this identification information, the system searches for a matching process recipe in the process library, updates the chamber sequence in the matching process recipe to the available chamber sequence, and then, according to pre-set rules, selects the desired chamber from the available chamber sequence to execute the process on the wafer. This eliminates the need to pre-store numerous process recipes and saves significant resources.

[0101] Furthermore, based on the received processing instructions, the chambers that can be used are enabled and the chambers that cannot be used are disabled, thereby avoiding assigning tasks to the disabled chambers and ensuring operational safety. In addition, setting the disabled chambers to sleep mode can also reduce energy consumption.

[0102] Those skilled in the art will appreciate that all or part of the processes in the above-mentioned embodiments can be implemented by instructing the relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the above-mentioned embodiments. In particular, any reference to memory, database, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The databases involved in the various embodiments provided herein may include at least one of a relational database and a non-relational database. Non-relational databases may include, but are not limited to, distributed databases based on blockchains. The processors involved in the various embodiments provided herein may be, but are not limited to, general-purpose processors, central processing units (CPUs), graphics processing units (GPUs), digital signal processors (DSPs), programmable logic devices (PLDs), data processing logic devices based on quantum computing, and the like.

[0103] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0104] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present application shall be determined by the appended claims.

Claims

1. A chamber tuning method, characterized in that: The method comprises: For a process in the process flow, obtain the status information of each chamber in the target tool related to the process; determining the usage status of each of the chambers according to the status information; According to the usage status of each of the chambers, an available chamber is selected, and a processing instruction is generated based on the available chamber, wherein the processing instruction carries identification information and an available chamber sequence, and the processing instruction is used to enable the target machine to perform the process on the wafer in the chamber corresponding to the available chamber sequence according to the identification information.

2. The method according to claim 1, characterized in that The status information includes any one or more of chamber data, operation data, and production data; Determining the usage status of each chamber according to the status information includes: Comparing the state information of each chamber with a preset first condition in sequence according to a preset order; For any chamber, if any data in the state information of the chamber does not meet the preset first condition, the chamber is considered to be in an unavailable state; otherwise, the chamber is considered to be in an available state.

3. The method according to claim 2, characterized in that The state information also includes historical data; The determining the usage status of each chamber according to the status information further includes: Processing the state information using a pre-trained prediction model to obtain fault trend data for each chamber; wherein the prediction model is pre-trained based on the historical data; Comparing the fault trend data of each chamber with a preset second condition in sequence according to a preset order; For any chamber, if any data in the status information of the chamber does not meet the preset first condition, and / or the fault trend data does not meet the preset second condition, the chamber is considered to be in an unavailable state; otherwise, the chamber is considered to be in an available state.

4. A chamber tuning device, characterized in that: The device comprises: An acquisition module is used to obtain status information of each chamber in a target tool related to a process in a process flow; A processing module is used to determine the usage status of each of the chambers based on the status information; select an available chamber based on the usage status of each of the chambers, and generate a processing instruction based on the available chambers, wherein the processing instruction carries identification information and an available chamber sequence; the processing instruction is used to enable the target machine to perform the process on the wafer in the chamber corresponding to the available chamber sequence according to the identification information.

5. A chamber tuning method, characterized in that: The method comprises: For a process in the process flow, the status information of each chamber related to the process is sent to the manufacturing execution system; receiving and parsing a processing instruction generated by the manufacturing execution system according to the status information, wherein the processing instruction carries identification information and an available chamber sequence; The process is performed on the wafer in a chamber corresponding to the available chamber sequence according to the identification information.

6. The method according to claim 5, characterized in that The performing the process on the wafer in the chamber corresponding to the available chamber sequence according to the identification information includes: Searching for a process recipe matching the identification information in a pre-stored process library; the process recipe includes process parameters and an original chamber sequence; Replacing the original chamber sequence with the available chamber sequence, and selecting a chamber from the available chamber sequence as a chamber to be executed according to a preset rule; The process is performed on the wafer in the chamber to be performed using the process parameters.

7. The method according to claim 6, characterized in that The method further comprises: After receiving the processing instruction, each chamber corresponding to the available chamber sequence is enabled, and unavailable chambers are disabled.

8. A chamber tuning device, characterized in that: The device comprises: A detection module is used to detect the status information of each chamber related to a process in the process flow and send it to the manufacturing execution system; a parsing module, configured to receive and parse a processing instruction generated by the manufacturing execution system according to the status information, wherein the processing instruction carries identification information and an available chamber sequence; An execution module is configured to execute the process on the wafer in a chamber corresponding to the available chamber sequence according to the identification information.

9. A chamber tuning method, characterized in that: The method comprises: For a process in the process flow, the target machine associated with the process detects the status information of each chamber in the machine and reports it to the manufacturing execution system through the equipment automation system; The manufacturing execution system determines the usage status of each chamber based on the status information; selects an available chamber based on the usage status of each chamber, generates a processing instruction based on the available chamber, and issues the processing instruction to the target machine through the equipment automation system; wherein the processing instruction carries identification information and a sequence of available chambers; The tool performs the process on the wafer in the chamber corresponding to the available chamber sequence according to the identification information.

10. A chamber tuning system, characterized in that: The system comprises: The machine is used to detect the status information of each chamber related to a process in the process flow; A manufacturing execution system is configured to determine a usage status of each of the chambers based on the status information; select an available chamber based on the usage status of each of the chambers; and generate a processing instruction based on the available chambers, wherein the processing instruction carries identification information and a sequence of available chambers; The tool is further configured to perform the process on the wafer in the chamber corresponding to the available chamber sequence according to the identification information; The equipment automation system is used to realize data transmission between the manufacturing execution system and the machine.

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