Feeding channel control device for chip feeding and discharging

Abstract

The invention relates to the technical field of chip feeding channel control, in particular to a feeding channel control device for chip feeding and discharging, which comprises a side clamping mechanism, a positioning lateral movement mechanism and an elastic buffer seat, and is characterized in that the side clamping mechanism is positioned between a conveying track and a side guide plate; when the chip is clamped, the chip is pushed upwards through the jacking mechanism, so that the side face clamping mechanism clamps the chip, after clamping is completed, the chip clamped in the middle can be pulled back into the conveying rail through continuous pushing of the jacking mechanism, and meanwhile the chip can be horizontally limited and blocked and is prevented from being pushed out of the conveying rail again. And the side clamping mechanism can move upwards and rightwards through upward pushing of the jacking mechanism, the reaction time for waiting for a controller does not need to be reserved, the whole process is completed at a time, the friction time of the time chip is shortened, and the chip is better protected.

Description

Technical Field

[0001] The present invention relates to the technical field of chip loading channel control, and in particular to a loading channel control device for chip loading and unloading. Background Art

[0002] In the lighting field, the application of LED (Light Emitting Diode) products is attracting worldwide attention. As a new green light source, LED is an inevitable trend in lighting technology development. The 21st century will be an era of new lighting sources represented by LED. Known as the fourth generation of lighting sources or green light sources, LEDs offer energy-saving, environmentally friendly, long lifespans, and compact size. They are widely used in various applications, including indicators, displays, decoration, backlighting, general lighting, and urban nightscapes.

[0003] The existing lamp bead panel needs to be glued and fixed with glue after the chip is installed. The LED lamp beads are also the chips of LED lamps. Hereinafter, the chips are collectively referred to as LED lamp beads. When the chips are loaded, they are generally transported by a vibration plate, a conveying track and a vibration plate direct vibrator for driving the conveying track to vibrate up and down. However, the chip conveying device needs to detect the direction of the chip terminal during transportation, and the entire detection time takes several seconds. During the several seconds, a chip will be stuck at the junction of the conveying track and the base plate, and the high-frequency up and down vibration of the track plus the vibration plate will apply a linear thrust to it, which will cause the stuck chip to rub against the chips on both sides for several seconds. There is a probability that the chip will be damaged during this friction process, which will cause a malfunction when it is subsequently installed on the lamp.

[0004] Therefore, it is necessary to design a loading channel control device for chip loading and unloading, which can pull the chip stuck in the middle position back to the conveying track when the chip is tested, and at the same time can horizontally limit the chip to prevent the chip from being pushed out of the conveying track again. Summary of the Invention

[0005] In response to the above-mentioned technical deficiencies, the purpose of the present invention is to provide a loading channel control device for chip loading and unloading, which can pull the chip stuck in the middle position back into the conveying track when the chip is tested, and at the same time can horizontally limit the chip to avoid pushing the chip out of the conveying track again.

[0006] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: the present invention provides a loading channel control device for loading and unloading chips, including a side clamping mechanism, a positioning side shifting mechanism and an elastic buffer seat. The side clamping mechanism is located between the conveying track and the side guide plate. The side clamping mechanism is used to clamp the side of the chip when it is lifted upward. The side clamping mechanism is fixedly installed on the displacement seat of the elastic buffer seat. The elastic buffer seat is used to provide a movable margin for downward vibration when the top of the side clamping mechanism is in contact with the top of the guide hole. The elastic buffer seat is fixedly installed on the horizontal moving seat of the positioning side shifting mechanism. The positioning side shifting mechanism is used to push the chip horizontally to the right when the top of the side clamping mechanism is in contact with the top of the guide hole. The lifting mechanism is fixedly installed on the support plate through the mounting frame. The positioning side shifting mechanism is fixedly installed on the lifting end of the lifting mechanism. The lifting mechanism is used to push the positioning side shifting mechanism vertically upward.

[0007] Preferably, the positioning side-shift mechanism includes an equilateral triangle block, an inverted triangle block, a limiting guide plate and a guide block. The limiting guide plate is fixedly mounted on a mounting frame connected to the lifting mechanism. A shaped guide groove is provided on the limiting guide plate. The equilateral triangle block is fixedly mounted on the lifting end of the lifting mechanism. The inverted triangle block is fixedly connected to the side of the elastic buffer seat. The inclined surface of the inverted triangle block contacts the inclined surface of the equilateral triangle block. The guide block is fixedly mounted on the side of the inverted triangle block. When the top of the chip is completely in contact with the top of the guide hole of the conveying track and the side clamping mechanism conflicts with the conveying track, the top of the guide block contacts the top of the shaped guide groove. When the side clamping mechanism pushes the chip to slide into the conveying track, the right side of the guide block contacts the right side of the shaped guide groove.

[0008] Preferably, the side clamping mechanism includes a card plate and two elastic clamping arms. The card plate is fixedly mounted on the elastic buffer seat. A groove for clamping into both sides of the chip is provided in the middle of the card plate. Each elastic clamping arm includes a clamping plate, a guide column, a side thrust spring and a limiting circular plate. The clamping plate can be horizontally slidably inserted into the card plate. A square socket for inserting the clamping plate is provided on the card plate. The guide column can be horizontally slidably mounted on the elastic buffer seat through the guide plate. One end of the guide column is fixedly connected to the clamping plate, and the other end of the guide column is fixedly connected to the limiting circular plate. The side thrust spring is used to provide an elastic force to the clamping plate near the middle of the card plate. The inner side of the top of the two clamping plates is provided with an inclined surface.

[0009] Preferably, when the lifting mechanism is not lifted upward, both sides of the chip are in contact with the inclined surfaces of the clamping plates on both sides.

[0010] Preferably, the side clamping mechanism also includes a guide block 2 and a limiting guide plate 2, the guide block 2 is fixedly mounted on the conveying track, the limiting guide plate 2 is fixedly mounted on the elastic buffer seat, the limiting guide plate 2 is provided with a shaped guide groove 2, the guide block 2 is clamped in the shaped guide groove 2, when the lifting mechanism is not pushed upward, the top of the guide block 2 contacts the top of the shaped guide groove 2, when the top of the chip is completely in contact with the top of the guide hole of the conveying track and the side clamping mechanism conflicts with the conveying track, the bottom of the guide block 2 contacts the bottom of the shaped guide groove 2.

[0011] Preferably, a top plate is provided between the two limiting guide plates, and the top plate is fixedly mounted on the elastic buffer seat. An avoidance gap is provided at the bottom of the conveying track for the top plate to pass through. When the top of the chip is completely in contact with the top of the guide hole of the conveying track and the side clamping mechanism conflicts with the conveying track, the top plate pushes the chip on its top to contact the top of the guide hole of the conveying track.

[0012] Preferably, the elastic buffer seat includes a guide seat, a square guide column, a lifting spring, a mounting plate and a limit plate. The clamping plate and the limit guide plate are both fixedly mounted on the mounting plate. The top of the square guide column is fixedly connected to the mounting plate. The limit plate is fixedly mounted on the bottom of the square guide column. The square guide column is slidably connected to the guide seat. A square guide hole is provided on the guide seat for vertical sliding of the square guide column. The lifting spring is used to apply a vertical upward elastic force to the mounting plate.

[0013] Preferably, the jacking mechanism adopts an electric push rod, and the top of the jacking mechanism is fixedly connected to the equilateral triangle block through a mounting seat.

[0014] The beneficial effects of the present invention are as follows: the chip loading and unloading loading channel control device is pushed upward by the lifting mechanism, so that the side clamping mechanism clamps the chip. After the clamping is completed, the lifting mechanism continues to push to pull the chip stuck in the middle position back into the conveyor track. At the same time, the chip can be horizontally limited to prevent it from being pushed out of the conveyor track again. The side clamping mechanism can be moved upward and to the right by pushing upward by the lifting mechanism, without leaving time to wait for the controller to respond. The entire process is completed in one go, shortening the friction time of the chip and better protecting the chip.

[0015] The top plate further activates the chip fixation function to prevent the chip from being pushed horizontally. At the same time, when the elastic buffer seat slides horizontally, it will drive the top plate to move horizontally, and the top plate will drive the conveying track clamped by it to move together.

[0016] The bottom of the second L-shaped guide groove is the contact position between the side clamping mechanism and the conveying track. After the contact is made at this position, the positioning side shifting mechanism can promote the side shifting. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 This is a schematic diagram of the three-dimensional structure of the automatic chip feeding equipment.

[0019] Figure 2 This is a schematic diagram of the partial three-dimensional structure of the automatic chip feeding equipment.

[0020] Figure 3 It is a schematic diagram of the three-dimensional structure of the side guide plate and the bottom plate.

[0021] Figure 4 Schematic diagram of the chip's structural position.

[0022] Figure 5 A top view of the chip on the annular pressure plate and conveyor track.

[0023] Figure 6 A top view of the chip on the side guide and conveyor track.

[0024] Figure 7 It is a schematic diagram of the three-dimensional structure of the present invention.

[0025] Figure 8 It is a top view of the present invention.

[0026] Figure 9 It is a schematic diagram of the three-dimensional structure of the side clamping mechanism.

[0027] Figure 10 It is a schematic diagram of the partial three-dimensional structure of the side clamping mechanism.

[0028] Figure 11 Schematic diagram of the end of the conveyor track.

[0029] Explanation of reference numerals: 1, support plate; 2, rotating disk; 3, lifting mechanism; 5, side clamping mechanism; 5a, clamping plate; 5b, clamping plate; 5c, guide column; 5d, side thrust spring; 5e, limiting circular plate; 5f, guide block 2; 5g, limiting guide plate 2; 5g, L-shaped guide groove 2; 5h, top plate; 6, positioning and side shifting mechanism; 6a, regular triangle block; 6b, inverted triangle block; 6c, limiting guide plate 1; 6c 1. L-shaped guide groove; 6d. Guide block; 7. Elastic buffer seat; 7a. Guide seat; 7b. Square guide column; 7c. Lifting spring; 7d. Mounting plate; 7e. Limit plate; 10. Conveyor track; 10a. Material guide hole; 10b. Avoidance gap; 11. Vibrating plate; 12. Vibrating plate; 13. Annular pressure plate; 13a. Material passing gap; 14. Side guide plate; 15. Chip; 16. Bottom plate. DETAILED DESCRIPTION

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0031] Embodiment: An automatic chip feeding device includes a gas-driven chip recovery device and a bulk feeding mechanism for conveying chips to the gas-driven chip recovery device. A worker pours a large number of chips 15 into the bulk feeding mechanism, which then conveys the chips through the bulk feeding mechanism and finally enters the gas-driven chip recovery device. The bulk feeding mechanism includes a conveying track 10, a vibrating plate 11, and a vibrating plate 12. The chips 15 are placed into the vibrating plate 12, conveyed along the vibrating plate 12, and then enter the conveying track 10 along the discharge port of the vibrating plate 12. The conveying track 10 begins to have a guide hole 10a for the chips to slide horizontally. The vibrating plate 11 is used to drive the conveying track 10 to vibrate up and down, so that the conveying track 10 can be pushed by the chips 15 conveyed by the vibrating plate 12. When the chip 15 is stuck in the guide hole 10a, a gap is left between the top of the chip 15 and the top of the guide hole 10a, allowing the chip 15 to vibrate up and down. The gas-driven chip recovery device includes a rotating disk 2 that can rotate horizontally and a support plate 1 for supporting the rotating disk 2. The rotating disk 2 carries a rotating driver for driving its rotation. A plurality of clamping notches for the conveying track 10 to be clamped are provided on the outer edge of the rotating disk 2. A material guide track is provided at a position opposite to a clamping notch. The material guide track is fixedly mounted on the support plate 1. The material guide track is composed of two side guide plates 14 and a bottom plate 16 fixedly mounted on the bottom of the two side guide plates 14. An annular pressure plate 13 is provided on the top of the rotating disk 2. The annular pressure plate 13 is pressed on the top of the chip 15. The annular pressure plate 13 is fixedly connected to the support plate 1 so as to surround the chip 15 to ensure that the chip 15 can be better clamped into the clamping notch. The annular pressure plate 13 is fixedly provided with lenses on the top of the multiple chips 15. A laser sensor is provided on the top of the lens facing the conveying track 10 to detect whether the chip 15 is clamped in the clamping notch. The bottom of the annular pressure plate 13 is provided with a feeding notch 13a on one side close to the conveying track 10. The feeding notch 13a is used to better insert the end of the chip 15 into the top of the bottom plate 16 when the chip 15 shakes up and down. The top of the bottom plate 16 is aligned with the lowest movement amplitude of the guide hole 10a during the shaking process of the conveying track 10. The present invention provides a feeding channel control device for loading and unloading chips, such as Figures 1-8As shown, it includes a side clamping mechanism 5, a positioning side shifting mechanism 6 and an elastic buffer seat 7. The side clamping mechanism 5 is located between the conveying track 10 and the side guide plate 14. The side clamping mechanism 5 is used to clamp the side of the chip 15 when it is lifted upward. The side clamping mechanism 5 is fixedly mounted on the displacement seat of the elastic buffer seat 7. The elastic buffer seat 7 is used to provide a movable margin for downward vibration when the top of the side clamping mechanism 5 is in contact with the top of the guide hole 10a. The elastic buffer seat 7 is fixedly mounted on the horizontal moving seat of the positioning side shifting mechanism 6. The positioning side shifting mechanism 6 is used to push the chip 15 horizontally to the right when the top of the side clamping mechanism 5 is in contact with the top of the guide hole 10a. The lifting mechanism 3 is fixedly mounted on the support plate 1 through the mounting frame. The positioning side shifting mechanism 6 is fixedly mounted on the lifting end of the lifting mechanism 3. The lifting mechanism 3 is used to push the positioning side shifting mechanism 6 vertically upward. When the equipment is detecting the chip 15, the working end of the lifting mechanism 3 is pushed upward, so that the side clamping mechanism 5 is pushed upward and stuck on both sides of the chip 15. When the top of the chip 15 is completely in contact with the top of the guide hole 10a of the conveyor track 10 and the side clamping mechanism 5 is in contact with the conveyor track 10, the side clamping mechanism 5 will move to the topmost position. As the lifting mechanism 3 continues to push upward, the power of the lifting mechanism 3 will push the horizontal movable seat of the positioning side shifting mechanism 6 to move horizontally, causing the side clamping mechanism 5 to move horizontally toward the conveyor track 10, so that the chip 15 stuck between the two side guide plates 14 is pulled into the conveyor track 10. That is, when the chip is tested, the chip 15 stuck in the middle position can be pulled back into the conveyor track. At the same time, the clamping action of the side clamping mechanism 5 on the chip 15 can limit the chip 15 horizontally to prevent the chip 15 from being pushed out of the conveyor track 10 again.

[0032] Among them, when the lifting mechanism 3 moves to the final position, the elastic buffer seat 7 is in a compressed state. When the conveying track 10 shakes upward, the elasticity of the elastic buffer seat 7 can push the chip 15 upward to fit the top of the guide hole 10a, and when the conveying track 10 shakes downward, it can push the chip 15 to move downward.

[0033] In order to shorten the time after the chip 15 moves upward and is pushed to the right, the friction time between the chip 15 located between the conveying track 10 and the side guide plate 14 and the chips 15 on both sides thereof is shortened. Figure 7As shown, the positioning side shift mechanism 6 includes an equilateral triangle block 6a, an inverted triangle block 6b, a limiting guide plate 6c and a guide block 6d. The limiting guide plate 6c is fixedly mounted on a mounting frame connected to the jacking mechanism 3. An L-shaped guide groove 6c1 is provided on the limiting guide plate 6c. The equilateral triangle block 6a is fixedly mounted on the jacking end of the jacking mechanism 3. The inverted triangle block 6b is fixedly connected to the side of the elastic buffer seat 7. The inclined surface of the inverted triangle block 6b contacts the inclined surface of the equilateral triangle block 6a. The guide block 6d is fixedly mounted on the side of the inverted triangle block 6b. When the jacking mechanism 3 is pushed upward, the inverted triangle block 6b is pushed forward by the equilateral triangle block 6a. The vertical movement of the inverted triangle block 6b is guided by the guide block 6d and the L-shaped guide groove 6c1. When the top of the chip 15 is completely in contact with the top of the guide hole 10a of the conveyor track 10 and the side clamping mechanism 5 is in contact with the conveyor track 10, the top of the guide block 6d contacts the top of the L-shaped guide groove 6c1. As the lifting mechanism 3 continues to push, the inclined surface of the right triangle block 6a pushes the inclined surface of the inverted triangle block 6b to slide rightward. When the side clamping mechanism 5 pushes the chip 15 into the conveyor track 10, the right side of the guide block 6d contacts the right side of the L-shaped guide groove 6c1. In other words, the upward push of the lifting mechanism 3 can achieve the upward and rightward movement of the side clamping mechanism 5, eliminating the need to wait for the controller to respond. The entire process is completed in one go, shortening the friction time of the chip 15 and better protecting the chip 15.

[0034] In order for the side clamping mechanism 5 to automatically clamp the chip 15 during the upward pushing process of the lifting mechanism 3, Figure 8 and Figure 9As shown, the side clamping mechanism 5 includes a card plate 5b and two elastic clamping arms, and the card plate 5b is fixedly mounted on the elastic buffer seat 7. The middle part of the card plate 5b is provided with a groove for clamping into the two sides of the chip 15. Each elastic clamping arm includes a clamping plate 5a, a guide column 5c, a side push spring 5d and a limiting circular plate 5e. The clamping plate 5a can be horizontally slidably inserted into the card plate 5b, and the card plate 5b is provided with a square jack for inserting the clamping plate 5a. The guide column 5c can be horizontally slidably installed on the elastic buffer seat 7 through the guide plate. One end of the guide column 5c is fixedly connected to the clamping plate 5a, and the other end of the guide column 5c is fixedly connected to the limiting circular plate 5e. The side push spring 5d is used to provide an elastic force to the clamping plate 5a near the middle of the card plate 5b. The side push spring 5d is sleeved on the guide column 5c, and the guide plate of one end of the side push spring 5d is in conflict, and the other end of the side push spring 5d is in conflict with the clamping plate 5a. The inner side of the top of the two clamping plates 5a is provided with an inclined surface. When the elastic buffer seat 7 is pushed upward, it will drive the clamping plate 5a and the clamping plate 5b to move upward together, and the bottom of the chip 15 will contact the inclined surface of the clamping plate 5a. The chip 15 will be driven upward to completely fit and contact the top of the guide hole 10a. When the chip 15 cannot move, the chip 15 will then push the two clamping plates 5a to move to the sides, and the two sides of the two clamping plates 5a are clamped on both sides of the chip 15. When the positioning side shift mechanism 6 moves horizontally, it will pull the clamping plate 5a to move horizontally, so that the chip 15 is pushed into the conveying track 10.

[0035] Since there is a gap between the conveying track 10 and the side guide plate 14, in order to provide better support at the gap, as shown in FIG. Figure 8 As shown, when the lifting mechanism 3 is not lifted upward, the two sides of the chip 15 are in contact with the inclined surfaces of the two side clamps 5a. When the conveying track 10 shakes upward, the conveying track 10 will pull the clamps 5a to move upward together, and the chip 15 can be supported by the clamps 5a. When the conveying track 10 vibrates downward, the side clamping mechanism 5 still maintains support for the chip 15 to prevent the chip 15 from falling. In this way, it is ensured that the bottom of the chip 15 is always above the bottom plate 16, making it easier for the chip 15 to be inserted between the two side guide plates 14. When the side clamping mechanism 5 is driven upward, the inverted triangle block 6b will be pulled to slide vertically upward through the elastic buffer seat 7.

[0036] In order to make the conveying track 10 move upward, the side clamping mechanism 5 can be driven upward together, for this purpose, Figure 10As shown, the side clamping mechanism 5 also includes a guide block 2 5f and a limiting guide plate 2 5g. The guide block 2 5f is fixedly mounted on the conveying rail 10, and the limiting guide plate 2 5g is fixedly mounted on the elastic buffer seat 7. The limiting guide plate 2 5g is provided with an L-shaped guide groove 2 5g1. The guide block 2 5f is clamped in the L-shaped guide groove 2 5g1. When the lifting mechanism 3 is not pushed upward, the top of the guide block 2 5f contacts the top of the L-shaped guide groove 2 5g1. When the top of the chip 15 is completely in contact with the top of the guide hole 10a of the conveying rail 10 and the side clamping mechanism 5 conflicts with the conveying rail 10, the bottom of the guide block 2 5f contacts the bottom of the L-shaped guide groove 2 5g1. Among them, the bottom of the L-shaped guide groove 2 5g1 is the conflict position between the side clamping mechanism 5 and the conveying rail 10. After contact at this position, the positioning side shifting mechanism 6 can push the side shift. When the conveying track 10 moves upward, it will drive the guide block 2 5f to move vertically upward. At the same time, the movement of the guide block 2 5f will drive the limiting guide plate 2 5g to move upward together. When the conveying track 10 moves upward, it will not drive the limiting guide plate 2 5g to move downward, that is, the splint 5a will not move downward.

[0037] In order to push the chip 15 in the conveying track 10 horizontally and clamp it at the same time, the chip 15 clamped by the side clamping mechanism 5 is reduced in thrust. Figure 9 As shown, a top plate 5h is provided between the two limiting guide plates 5g, and the top plate 5h is fixedly mounted on the elastic buffer seat 7. The bottom of the conveying track 10 is provided with an avoidance gap 10b for the top plate 5h to pass through. Figure 11 As shown, when the top of the chip 15 is completely in contact with the top of the guide hole 10a of the conveyor track 10 and the side clamping mechanism 5 is in conflict with the conveyor track 10, the top plate 5h pushes the chip 15 on its top to contact the top of the guide hole 10a of the conveyor track 10, thereby further activating the function of fixing the chip 15 and preventing the chip 15 from being pushed horizontally. At the same time, when the elastic buffer seat 7 slides horizontally, it will drive the top plate 5h to move horizontally, and at the same time, the top plate 5h will drive the conveyor track 10 clamped by it to move together. Among them, a rubber anti-slip pad can also be set on the top of the top plate 5h, so that when the top plate 5h drives the conveyor track 10 to move, it can be smoother. Through the action of the top plate 5h, the chip 15 can be completely in contact with the top of the guide hole 10a.

[0038] like Figure 8As shown, the elastic buffer seat 7 includes a guide seat 7a, a square guide post 7b, a lifting spring 7c, a mounting plate 7d, and a limiting plate 7e. The clamping plate 5b and the limiting guide plate 2 5g are both fixedly mounted on the mounting plate 7d. The top of the square guide post 7b is fixedly connected to the mounting plate 7d. The limiting plate 7e is fixedly mounted to the bottom of the square guide post 7b. The square guide post 7b is slidably connected to the guide seat 7a. The guide seat 7a is provided with a square guide hole for vertical sliding of the square guide post 7b. The lifting spring 7c is used to apply a vertical upward elastic force to the mounting plate 7d. The downward thrust of the clamping plate 5b and the limiting guide plate 2 5g on the mounting plate 7d will cause the mounting plate 7d to push the lifting spring 7c to be compressed, thereby alleviating the rigid collision experienced by the mounting plate 7d.

[0039] The lifting mechanism 3 adopts an electric push rod, and the top of the lifting mechanism 3 is fixedly connected to the equilateral triangle block 6a through a mounting seat. This short-distance movement method is pushed by the electric push rod, and the entire pushing process can be more stable to reduce the jitter when the clamping plate 5a lifts the chip 15.

[0040] During use, the conveyor track 10 is vibrated by the vibrating plate 11, so that the chip 15 in the conveyor track 10 is transported horizontally. When the device is testing the chip 15, the working end of the lifting mechanism 3 pushes upward, which will drive the clamping plate 5a and the clamping plate 5b to move upward together. The bottom of the chip 15 will contact the inclined surface of the clamping plate 5a, and the chip 15 will be driven upward to completely fit the top of the guide hole 10a. When the chip 15 cannot move, the chip 15 then pushes the two clamping plates 5a to move to the sides, and the two sides of the two clamping plates 5a are clamped on both sides of the chip 15. When the top of the chip 15 is completely in contact with the top of the guide hole 10a of the conveying track 10 and the side clamping mechanism 5 is in conflict with the conveying track 10, the side clamping mechanism 5 will move to the topmost position. Since the lifting mechanism 3 continues to push upward, the horizontal moving seat of the positioning side shift mechanism 6 will be pushed horizontally by the power of the lifting mechanism 3, so that the side clamping mechanism 5 drives the chip 15 to move horizontally toward the conveying track 10, so that the chip 15 stuck between the two side guide plates 14 is pulled into the conveying track 10.

[0041] And in the process of pushing upward, the top plate 5h pushes the chip 15 on its top to contact the top of the guide hole 10a of the conveying track 10. When the elastic buffer seat 7 slides horizontally, it will drive the top plate 5h to move horizontally. At the same time, the top plate 5h will drive the conveying track 10 clamped by it to move together.

[0042] Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such changes and modifications fall within the scope of the claims and their equivalents, the present invention is intended to include such changes and modifications.

Claims

1. A chip loading and unloading material channel control device, characterized in that: The side clamping mechanism (5) comprises a side clamping mechanism (5), a positioning side shifting mechanism (6) and an elastic buffer seat (7). The side clamping mechanism (5) is located between the conveying track (10) and the side guide plate (14). The side clamping mechanism (5) is used to clamp the side of the chip (15) when it is lifted upward. The side clamping mechanism (5) is fixedly mounted on the displacement seat of the elastic buffer seat (7). The elastic buffer seat (7) is used to provide a downward shock when the top of the side clamping mechanism (5) is in contact with the top of the guide hole (10a). The elastic buffer seat (7) is fixedly mounted on the horizontal movable seat of the positioning side shift mechanism (6); the positioning side shift mechanism (6) is used to push the chip (15) horizontally to the right when the top of the side clamping mechanism (5) is in contact with the top of the guide hole (10a); the lifting mechanism (3) is fixedly mounted on the support plate (1) through the mounting frame; the positioning side shift mechanism (6) is fixedly mounted on the lifting end of the lifting mechanism (3); and the lifting mechanism (3) is used to push the positioning side shift mechanism (6) vertically upward.

2. A chip loading and unloading material feeding channel control device according to claim 1, characterized in that: The positioning side shift mechanism (6) includes an equilateral triangle block (6a), an inverted triangle block (6b), a limiting guide plate (6c) and a guide block (6d). The limiting guide plate (6c) is fixedly mounted on a mounting frame connected to the jacking mechanism (3). An L-shaped guide groove (6c1) is provided on the limiting guide plate (6c). The equilateral triangle block (6a) is fixedly mounted on the jacking end of the jacking mechanism (3). The inverted triangle block (6b) is fixedly connected to the side of the elastic buffer seat (7). The inclined surface of the inverted triangle block (6b) is aligned with the inclined surface of the equilateral triangle block (6a). Surface contact, guide block 1 (6d) is fixedly installed on the side of the inverted triangle block (6b), when the top of the chip (15) is completely in contact with the top of the guide hole (10a) of the conveying track (10), and the side clamping mechanism (5) is in contact with the conveying track (10), the top of the guide block 1 (6d) is in contact with the top of the L-shaped guide groove 1 (6c1), and when the side clamping mechanism (5) pushes the chip (15) to slide into the conveying track (10), the right side of the guide block 1 (6d) is in contact with the right side of the L-shaped guide groove 1 (6c1).

3. A chip loading and unloading material feeding channel control device as claimed in claim 2, characterized in that: The side clamping mechanism (5) includes a card plate (5b) and two elastic clamping arms. The card plate (5b) is fixedly mounted on the elastic buffer seat (7). A groove for clamping into the two sides of the chip (15) is provided in the middle of the card plate (5b). Each elastic clamping arm includes a clamping plate (5a), a guide column (5c), a side push spring (5d) and a limiting circular plate (5e). The clamping plate (5a) can be inserted into the card plate (5b) in a horizontally slidable manner. A square socket for inserting the clamping plate (5a) is provided on the card plate (5b). The guide column (5c) can be mounted on the elastic buffer seat (7) in a horizontally slidable manner through the guide plate. One end of the guide column (5c) is fixedly connected to the clamping plate (5a), and the other end of the guide column (5c) is fixedly connected to the limiting circular plate (5e). The side push spring (5d) is used to provide an elastic force to the clamping plate (5a) near the middle of the card plate (5b). The inner sides of the tops of the two clamping plates (5a) are provided with inclined surfaces.

4. A chip loading and unloading material feeding channel control device as claimed in claim 3, characterized in that: When the lifting mechanism (3) is not lifted upward, both sides of the chip (15) are in contact with the inclined surfaces of the clamping plates (5a) on both sides.

5. A chip loading and unloading material feeding channel control device as claimed in claim 4, characterized in that: The side clamping mechanism (5) further comprises a guide block 2 (5f) and a limiting guide plate 2 (5g), wherein the guide block 2 (5f) is fixedly mounted on the conveying track (10), the limiting guide plate 2 (5g) is fixedly mounted on the elastic buffer seat (7), and an L-shaped guide groove 2 (5g1) is provided on the limiting guide plate 2 (5g), and the guide block 2 (5f) is clamped in the L-shaped guide groove 2 (5g1). When the lifting mechanism (3) is not pushed upward, the top of the guide block 2 (5f) contacts the top of the L-shaped guide groove 2 (5g1), and when the top of the chip (15) is completely in contact with the top of the guide hole (10a) of the conveying track (10) and the side clamping mechanism (5) contacts the conveying track (10), the bottom of the guide block 2 (5f) contacts the bottom of the L-shaped guide groove 2 (5g1).

6. A chip loading and unloading material feeding channel control device as claimed in claim 5, characterized in that: A top plate (5h) is provided between the two limiting guide plates (5g), and the top plate (5h) is fixedly mounted on the elastic buffer seat (7). A relief notch (10b) for the top plate (5h) to pass through is provided at the bottom of the conveying track (10). When the top of the chip (15) is completely in contact with the top of the guide hole (10a) of the conveying track (10) and the side clamping mechanism (5) is in contact with the conveying track (10), the top plate (5h) pushes the chip (15) on its top to contact the top of the guide hole (10a) of the conveying track (10).

7. A chip loading and unloading material feeding channel control device according to claim 6, characterized in that: The elastic buffer seat (7) includes a guide seat (7a), a square guide column (7b), a lifting spring (7c), a mounting plate (7d) and a limit plate (7e). The clamping plate (5b) and the second limit guide plate (5g) are fixedly mounted on the mounting plate (7d). The top of the square guide column (7b) is fixedly connected to the mounting plate (7d). The limit plate (7e) is fixedly mounted on the bottom of the square guide column (7b). The square guide column (7b) is slidably connected to the guide seat (7a). A square guide hole for vertically sliding the square guide column (7b) is provided on the guide seat (7a). The lifting spring (7c) is used to apply a vertically upward elastic force to the mounting plate (7d).

8. The chip loading and unloading material feeding channel control device according to claim 1, characterized in that: The jacking mechanism (3) adopts an electric push rod, and the top of the jacking mechanism (3) is fixedly connected to the equilateral triangle block (6a) through a mounting seat.

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