Semiconductor display module manufacturing process of first die bonding and then patch single-side welding

Abstract

The invention discloses a manufacturing process of a semiconductor display module with die bonding and patch single-side welding in sequence. The manufacturing process comprises the following steps: providing a substrate; printing solder paste in a bonding pad area of the substrate, and carrying out die bonding on the semiconductor chip to the bonding pad area; carrying out single-side welding on the chip by adopting a welding mode of regional point heating, regional scanning heating or regional whole-region heating; carrying out pre-underfill treatment on the area, where the semiconductor chip is welded, of the substrate; printing solder paste in the mounting area of the substrate, and mounting an IC component in the mounting area; carrying out single-side welding on the surface-mounted components by adopting a welding mode of regional point heating, regional scanning heating or regional whole-region heating; and attaching an optical function layer to the substrate, and cutting the frame of the substrate attached with the optical function layer to form the semiconductor display module. A local heating welding mode is adopted for two times of welding, so that the substrate is prevented from being subjected to high-temperature thermal stress, the cured welding flux is prevented from secondary remelting, and the product yield is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor display technology, and in particular to a semiconductor display module manufacturing process that performs single-sided soldering followed by die bonding. Background Art

[0002] With the development of display technology, semiconductor technologies such as Mini LED and Micro LED are gradually becoming the core direction of next-generation display technology due to their advantages such as high brightness, high contrast, low power consumption and ultra-thin design. They are also being applied to high-end TVs, smartphones and various display devices. Therefore, the demand for Mini LED and Micro LED semiconductor technology is also higher.

[0003] In the traditional semiconductor display module manufacturing process, the die bonding process usually uses eutectic welding, conductive adhesive curing or reflow soldering to achieve the initial mechanical connection between the chip and the substrate, while the patch process uses reflow soldering to complete the soldering of surface mount components.

[0004] However, thermal stress is generated during the soldering stages of both the die bonding and die placement processes. After two thermal stress shocks, the substrate can easily expand, contract, and warp due to thermal stress, reducing product yield. In addition, the two heat treatments may trigger secondary melting of the solidified solder, causing defects such as electrode offset, floating, or cold solder joints. This is especially true for Mini LED and Micro LED chips with small size, small soldering area, and small chip electrode spacing. The secondary melting increases the risk of solder bridging or tin whiskers, which is not conducive to the stability of the chip's electrical connections. Summary of the Invention

[0005] The purpose of the present invention is to provide a semiconductor display module manufacturing process with single-sided soldering after die bonding, so as to solve the problems of substrate deformation, solder joint cold welding and circuit short circuit caused by two heat treatments in the die bonding and die bonding processes.

[0006] To achieve this object, the present invention adopts the following technical solutions: A semiconductor display module manufacturing process with single-sided soldering followed by die bonding includes the following steps: providing a substrate; Printing solder paste on the pad area of the substrate to bond the semiconductor chip to the pad area; Use regional spot heating, regional scanning heating or regional full-area heating welding methods to perform single-sided welding on the chip after die bonding; Performing a pre-underfill process on the area where the semiconductor chip is soldered on the substrate; Printing solder paste on the mounting area of the substrate, and mounting IC components on the mounting area; Use regional point heating, regional scanning heating or regional full-area heating welding methods to perform single-sided welding on mounted components; An optical functional layer is laminated on the substrate, and the substrate laminated with the optical functional layer is frame-cut to form a semiconductor display module.

[0007] Optionally, before providing the substrate, the substrate is subjected to surface treatment, and the surface treatment includes: Removing residues from the surface of the substrate by ultrasound or electrostatics; Using a water-based cleaning agent to remove oil stains and fingerprints on the substrate; The substrate pretreatment is completed by water rinsing and thermal drying; The pre-treated substrate is subjected to surface plasma treatment.

[0008] Optionally, when printing solder paste on the pad area of the substrate and bonding the semiconductor chip to the pad area, after bonding is completed, the semiconductor chip bonding quality inspection is performed, including chip position offset inspection and coplanarity inspection.

[0009] Optionally, in the single-sided welding of the chip after crystal bonding by the welding method using regional point heating, regional scanning heating or regional full-area heating, and in the single-sided welding of the mounted components by the welding method using regional point heating, regional scanning heating or regional full-area heating, the welding method using regional point heating, regional scanning heating or regional full-area heating adopts laser heating welding or photon heating welding to perform point-by-point welding, line scanning welding or whole-area welding on the welding area, the welding temperature is controlled at 180℃-250℃, and the welding time of each solder point is less than or equal to 3 seconds.

[0010] Optionally, after single-sided welding of the die-bonded chip using the welding method of regional point heating, regional scanning heating or regional full-area heating, and after single-sided welding of mounted components using the welding method of regional point heating, regional scanning heating or regional full-area heating, optical inspection is performed using an automatic optical inspection system, and the optical inspection includes solder joint integrity inspection, chip offset inspection and floating height inspection.

[0011] Optionally, the automatic optical inspection system is configured with an automatic repair system. When the detection value of the automatic optical inspection system is higher than a preset value, fixed-point repair is performed through the automatic repair system.

[0012] Optionally, a groove is provided between the IC pad area and the semiconductor pad area on the substrate.

[0013] Optionally, in the pre-underfill process performed on the area of the substrate where the semiconductor chip is soldered, the thickness of the underfill is less than half the thickness of the chip.

[0014] Optionally, in the optical functional layer bonded to the substrate, the optical functional layer includes at least one of a quantum dot film, a brightness enhancement film, and a polarizing film.

[0015] Compared with the prior art, the present invention has the following beneficial effects: The present invention provides a semiconductor display module manufacturing process that first bonds the die and then performs single-sided soldering on the die. The process uses a welding method that utilizes regional point heating, regional scanning heating, or regional full-area heating to perform single-sided soldering on the die-bonded chip, thereby achieving connection between the semiconductor chip and the substrate. After the die is bonded, the process also uses a welding method that utilizes regional point heating, regional scanning heating, or regional full-area heating to perform single-sided soldering on the IC components mounted on the substrate, thereby achieving connection between the IC components and the substrate. Both welding processes adopt single-sided welding methods of regional point heating, regional scanning heating or regional full-area heating, which effectively avoids the substrate from being subjected to high-temperature thermal stress during welding, reduces the possibility of expansion, contraction and warping of the substrate, and improves product yield; at the same time, after completing the die bonding, the area where the chip is welded on the substrate is pre-underfilled to reinforce the chip after die bonding, which can further avoid the possibility of secondary melting of the solidified solder in subsequent welding, thereby improving the situation of electrode offset, floating or cold soldering caused by secondary melting of the solder, and effectively avoids the defects of solder bridging or tin whisker generated due to secondary melting, thereby improving the electrical connection stability of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] The structures, proportions, sizes, etc. depicted in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not intended to limit the conditions under which the present invention can be implemented and therefore have no substantive technical significance. Any structural modifications, changes in proportional relationships, or adjustments in size should still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and objectives that can be achieved by the present invention.

[0018] Figure 1 The present invention is a flow chart of a semiconductor display module manufacturing process that first bonds the die and then performs single-sided soldering.

[0019] Figure 2 Flowchart for surface treatment of substrate. DETAILED DESCRIPTION

[0020] In order to make the purpose, features, and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0021] In the description of the present invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They are not intended to indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally located component.

[0022] In the semiconductor display module manufacturing process, the die-bonding process uses eutectic soldering, conductive adhesive curing, or reflow soldering to connect the chip to the substrate, while the SMT process also uses reflow soldering to connect surface-mount components to the substrate. Therefore, both the die-bonding and SMT processes generate thermal stress, and the substrate is prone to warping and deformation due to the thermal stress on both sides, resulting in low final product yield. Furthermore, the two heat treatments can trigger secondary remelting of the solidified solder, resulting in defects such as cold solder joints and floating solder joints. This is particularly true for small semiconductors with close chip pitch, such as Mini LEDs and Micro LEDs. Secondary remelting can easily lead to solder bridging or the formation of tin whiskers, which are detrimental to chip electrical connections.

[0023] Based on this, an embodiment of the present invention provides a semiconductor display module manufacturing process with single-sided soldering after die bonding, including the following steps: providing a substrate; Printing solder paste on the pad area of the substrate to bond the semiconductor chip to the pad area; Use regional spot heating, regional scanning heating or regional full-area heating welding methods to perform single-sided welding on the chip after die bonding; Performing a pre-underfill process on the area where the semiconductor chip is soldered on the substrate; Printing solder paste on the mounting area of the substrate, and mounting IC components on the mounting area; Use regional point heating, regional scanning heating or regional full-area heating welding methods to perform single-sided welding on mounted components; An optical functional layer is laminated on the substrate, and the substrate laminated with the optical functional layer is frame-cut to form a semiconductor display module.

[0024] The present invention provides a semiconductor display module manufacturing process that first bonds the die and then performs single-sided soldering on the die. The process uses a welding method that utilizes regional point heating, regional scanning heating, or regional full-area heating to perform single-sided soldering on the die-bonded chip, thereby achieving connection between the semiconductor chip and the substrate. After the die is bonded, the process also uses a welding method that utilizes regional point heating, regional scanning heating, or regional full-area heating to perform single-sided soldering on the IC components mounted on the substrate, thereby achieving connection between the IC components and the substrate. Both welding processes adopt single-sided welding methods of regional point heating, regional scanning heating or regional full-area heating, which effectively avoids the substrate from being subjected to high-temperature thermal stress during welding, reduces the possibility of expansion, contraction and warping of the substrate, and improves product yield; after completing the die bonding, the area where the chip is welded on the substrate is pre-underfilled to reinforce the chip after die bonding, which can further avoid the possibility of secondary melting of the solidified solder in subsequent welding, thereby improving the situation of electrode offset, floating or cold soldering caused by secondary melting of the solder. At the same time, it also effectively avoids the defects of solder bridging or tin whisker generated due to secondary melting, and improves the stability of the chip electrical connection.

[0025] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.

[0026] like Figure 1 As shown, an embodiment of the present invention provides a semiconductor display module manufacturing process that first bonds the die and then performs single-sided soldering. It is suitable for the production of Mini LED or Micro LED display modules. Mini LED or Micro LED chips are small in size, have small chip spacing, and have small soldering space. During production, they are prone to solder bridging or tin whiskering due to secondary melting. The semiconductor display module manufacturing process provided by the present invention can effectively avoid the possibility of secondary melting, thereby avoiding the defects of solder bridging or tin whiskering caused by secondary melting. The semiconductor display module manufacturing process provided by the present invention that first bonds the die and then performs single-sided soldering is achieved by the following steps: Step S1, providing a substrate; Among them, the substrate is a semiconductor circuit board base material, which is used to carry semiconductor lamp beads, driver ICs and other electronic components, and provide electrical connections and mechanical support. It is not limited in this embodiment, including but not limited to copper plates, PCB boards, alumina ceramic substrates, aluminum nitride ceramic substrates, etc.

[0027] Step S2: printing solder paste on the pad area of the substrate to bond the semiconductor chip to the pad area; Among them, the pad area of the substrate refers to the area on the substrate used to carry the semiconductor chip, which is specifically set according to the display requirements of the semiconductor display module, and the present invention does not make any special restrictions on this; solder paste is a mixed material for surface welding in the mounting process, mainly composed of tin alloy powder and flux.

[0028] Specifically, the substrate is precisely mounted in a solder paste printer, and a solder paste layer is evenly coated on the pad area of the substrate using the solder paste printer. The substrate is preheated to partially volatilize the flux and form a stable solder paste layer.

[0029] In this embodiment, the die bonding process uses a needle-puncture mass transfer technology to transfer the semiconductor chip to the substrate. For example, a dual-camera collaborative positioning system is used to identify the position of the substrate pad and capture the chip position. The chip is picked up by the microneedle array on the transfer head and moved to the top of the pad. The position is calibrated by the visual system. The microneedle array applies pressure to make the chip electrode contact with the solder paste. Synchronous local heating melts the solder paste, the transfer head is lifted, and the microneedles are separated from the chip. The chip is thereby transferred to the substrate pad area, achieving a preliminary mechanical connection between the chip and the substrate. Among them, the needle-puncture mass transfer technology is a relatively mature technology in this field, and the present invention will not elaborate on it in detail.

[0030] Step S3, performing single-sided soldering on the die-bonded chip using a soldering method of regional point heating, regional scanning heating, or regional full-area heating; Specifically, the welding method can adopt laser heating welding or photon heating welding to perform point-by-point heating welding, line scanning heating welding or regional heating welding on the chips in the welding area. During actual welding, the welding method is adaptively selected according to the distribution, quantity, material properties and welding requirements of the chips in the pad area on the substrate. For example, if the chips in the pad area are irregularly distributed and the number of chips is small, the regional point heating welding method can be used; if the chips in the pad area are linearly distributed, the regional scanning heating welding method can be used; if the number of chips in the pad area is large and the distribution is irregular, the regional full-area heating welding method can be used.

[0031] Furthermore, during the soldering process, a high-precision automated positioning system allows the soldering equipment to precisely align with the chip's soldering location. After applying the appropriate amount of light energy, the laser or photon beam instantly heats the solder joint, partially melting the solder and forming a secure connection. This process only heats the soldering location, and the soldering is completed quickly, rather than continuously. This protects the substrate from thermal stresses caused by high temperatures, effectively preventing expansion, contraction, or warping.

[0032] After welding, the solder joint is cooled. For example, inert gas can be introduced to accelerate the cooling zone, effectively inhibiting oxidation of the solder joint and ensuring solidification and shape stability of the solder joint.

[0033] When using laser welding or photon welding, the welding temperature can be controlled between 180°C and 250°C, and the welding time for each solder joint is less than or equal to 3 seconds. Through rapid welding and rapid cooling, the reliability of the welding can be ensured while preventing high heat transfer to the substrate.

[0034] Step S4, performing a pre-underfill process on the area of the substrate where the semiconductor chip is to be soldered; Specifically, epoxy resin can be used as an underfill. For example, epoxy resin and curing agent are thoroughly mixed in a set ratio to ensure the uniformity of the filling material and the performance after curing; the mixed epoxy resin is evenly applied to the welding area through molding, dispensing, or film lamination, and it is ensured that the epoxy resin can completely cover the welding area and fill all gaps; according to the curing requirements of the material, such as room temperature curing or thermal curing, the underfill is cured to ensure that the filling material has good physical properties and can effectively protect the chip after welding. Through pre-underfill treatment, the solder that has been completed and solidified can be covered, effectively avoiding the risk of solder bridging or tin whiskers.

[0035] It should be noted that during the pre-underfill process, the thickness of the underfill is less than half the thickness of the semiconductor chip, which protects the chip without affecting the electrical transmission of the chip.

[0036] Step S5: printing solder paste on the mounting area of the substrate, and mounting IC components on the mounting area; Among them, the mounting area is a specific area of the substrate used to install electronic components, which must meet the requirements of component welding, electrical connection, heat dissipation and mechanical fixation.

[0037] Specifically, a solder paste printer is used to evenly apply solder paste to the mounting area on the substrate. Afterwards, the substrate is preheated to partially volatilize the flux to form a stable solder paste layer. The IC components are then accurately placed in the predetermined position using a placement machine.

[0038] Step S6: single-sided soldering of the mounted components using a soldering method of regional point heating, regional scanning heating, or regional full-area heating; Specifically, the welding method of regional point heating, regional scanning heating or regional full-area heating adopts laser heating welding or photon heating welding, and performs point welding, line scanning welding or whole-area welding on the welding area, thereby realizing single-sided welding of IC components.

[0039] During the soldering process, the laser or photon power and pulse width are adjusted based on the IC component's material properties and soldering requirements to ensure soldering reliability. Furthermore, a high-precision automated positioning system aligns the soldering equipment precisely with the IC component's soldering location. After applying the appropriate amount of light energy, the laser or photon beam instantly heats the solder joint, partially melting the solder and forming a secure connection between the IC component and the substrate. Only the soldering location is heated locally, and the soldering process is completed quickly, not over a prolonged period. This protects the substrate from high-temperature thermal stress, effectively preventing expansion, contraction, or warping. After soldering is complete, the solder joint is cooled.

[0040] Step S7: laminating an optical functional layer on the substrate, and cutting a frame of the substrate laminating the optical functional layer to form a semiconductor display module.

[0041] Specifically, a photocurable adhesive layer is applied to the bonding surface of the functional layer and pre-cured to a semi-fluid state to enhance adhesion. A cross-shaped alignment mark is placed on the non-display area of the substrate, and a transparent positioning mark is pre-placed at the corresponding position on the optical functional layer. A beam splitter prism is used to simultaneously image the substrate and the functional layer marks, and a piezoelectric micro-displacement stage is used to compensate for alignment deviations caused by thermal expansion. A segmented air cushion pressure head then applies positive pressure to the optical functional layer, with higher pressure in the center than at the edges, to suppress bubble formation. After bonding, the substrate is transferred into a vacuum chamber and maintained for 10-30 seconds to expel tiny bubbles.

[0042] Next, cross-shaped positioning marks are placed on the non-functional area of the substrate to accurately locate the cutting path. A cutting path is generated based on the product design drawing. A UV laser is scanned along the cutting line to form a guide groove on the optical layer surface. A diamond-coated blade is used to perform precision cutting along the guide groove. The cut substrate is then immersed in a weak acid solution to remove edge burrs and form a passivation layer.

[0043] In an embodiment of the present invention, before providing the substrate, the substrate is further subjected to surface treatment. The surface treatment includes: Removing residues from the surface of the substrate by ultrasound or electrostatics; Using a water-based cleaning agent to remove oil stains and fingerprints on the substrate; The substrate pretreatment is completed by water rinsing and thermal drying; The pre-treated substrate is subjected to surface plasma treatment.

[0044] Specifically, mechanical pretreatment is first performed by ultrasound or electrostatics. First, the substrate is immersed in an ultrasonic cleaning tank. The solution in the tank is deionized water or a neutral detergent. High-frequency sound waves with a frequency of 20 kHz-40 kHz are applied to the tank, and the temperature of the solution in the tank is controlled at 40°C-60°C. The ultrasonic action time is set according to the material type of the substrate. Usually, the ultrasonic action time is 5-20 minutes. Ultrasonic cleaning can effectively remove particulate contaminants on the surface of the substrate. For example, a voltage-carrying electrostatic adsorption roller can be used to perform non-contact scanning at a height of 0.5mm-2mm from the surface of the substrate, which can effectively remove charged particles on the surface of the substrate.

[0045] Afterwards, chemical cleaning is performed. A well-mixed water-based cleaning agent is heated to 40-60°C and then sprayed or immersed on the substrate for 5-10 minutes to dissolve any oil stains or fingerprints. The substrate surface is then rinsed with a high-pressure water jet to remove any residual cleaning agent. Finally, the substrate is dried using a hot air dryer. Cleaning the substrate before die bonding and die placement can reduce solder joint defects and improve product yield.

[0046] Furthermore, the substrate undergoes surface plasma activation. The substrate is placed in a vacuum chamber and evacuated to an appropriate pressure using a vacuum pump to remove the air. A preselected gas is injected into the chamber to form a plasma. Once the gas is activated, the plasma reacts with the substrate surface, removing contaminants and impurities while forming an activation layer on the substrate surface. This improves soldering performance and adhesion, thereby increasing the success rate of die bonding and die placement.

[0047] In the embodiment of the present invention, in both the die bonding process and the die bonding process, a single-sided welding method using regional point heating, regional scanning heating, or regional full-area heating is adopted, and the welding process is completed in a short time. The substrate will not be subjected to high-temperature thermal stress as a whole during welding, effectively avoiding the expansion, contraction, and warping of the substrate, thereby improving the product yield. In addition, by using a single-sided welding method with local and precise control of the welding temperature, the solidified solder is prevented from undergoing secondary remelting, thereby improving the defects of electrode offset, floating, or cold soldering caused by the secondary remelting of the solder. At the same time, it also effectively avoids the defects of solder bridging or tin whisker generation caused by the secondary remelting, thereby improving the electrical connection stability of the chip. After the die bonding is completed, the area on the substrate where the chip is to be welded is pre-bottom-filled to reinforce the chip after die bonding, thereby further avoiding the possibility of the solidified solder undergoing secondary remelting in subsequent welding.

[0048] In one embodiment of the present invention, after completing the steps of printing solder paste on the pad area of the substrate and bonding the semiconductor chip to the pad area, the semiconductor chip bonding quality inspection is performed, including chip position offset inspection and coplanarity inspection.

[0049] For example, high-precision automated optical inspection (AOI) equipment, combined with image processing software, performs position detection. Before testing, a reference position is set on the substrate. The AOI camera captures the die-bonded chip, acquiring real-time image data. The captured chip image is compared with the reference image to calculate the chip's offset relative to the designed position. This chip offset detection verifies the deviation between the actual and designed chip positions after die bonding, ensuring accurate chip positioning and subsequent electrical connections and optical output performance.

[0050] Use a coplanarity tester, such as a laser interferometer or 3D surface profilometer, to scan the die-bonded surface to obtain surface height information. Software then processes the scan data to generate a height distribution map, analyzing the height differences at each test point. Coplanarity testing verifies the surface flatness and coplanarity of the die-bonded chip, ensuring that multiple chips are aligned on the same plane, guaranteeing consistent and reliable optoelectronic performance.

[0051] In another embodiment of the present invention, after completing the steps of single-sided welding of the die after crystal bonding by using regional point heating, regional scanning heating or regional full-area heating, and single-sided welding of the mounted components by using regional point heating, regional scanning heating or regional full-area heating, optical inspection is performed using an automatic optical inspection system, and the optical inspection includes solder joint integrity inspection, chip offset inspection and floating height inspection.

[0052] Specifically, spectrometers and illuminance meters can be used to measure parameters such as light output intensity, wavelength, and spectral distribution of semiconductors after welding to ensure that they meet design standards. In addition, the semiconductor can be tested with power on to observe whether it emits light normally, whether the changes in current and voltage are within the expected range, and to check whether there are quality problems such as light leakage or dark spots, which is conducive to improving product yield.

[0053] Furthermore, the automatic optical inspection system is equipped with an automatic repair system. When the detection value of the automatic optical inspection system is higher than a preset value, fixed-point repair is performed through the automatic repair system.

[0054] After optical inspection, the qualified status of the solder joints can be judged, and after defects are detected, the problematic solder joints can be quickly located and accurately repaired, which reduces manual intervention, improves the stability of welding quality, and is conducive to improving product yield.

[0055] For example, a groove structure may be provided in the IC pad region and the semiconductor pad region on the substrate, so that a barrier layer can be formed by filling the bottom with glue, thereby effectively reducing thermal crosstalk during welding.

[0056] In an exemplary embodiment of the present invention, the optical functional layer includes at least one of a quantum dot film, a brightness enhancement film, and a polarizing film.

[0057] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some of the technical features thereof can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor display module manufacturing process with single-sided soldering followed by die bonding, characterized in that: The following steps are involved: providing a substrate; Printing solder paste on the pad area of the substrate to bond the semiconductor chip to the pad area; Use regional spot heating, regional scanning heating or regional full-area heating welding methods to perform single-sided welding on the chip after die bonding; Performing a pre-underfill process on the area where the semiconductor chip is soldered on the substrate; Printing solder paste on the mounting area of the substrate, and mounting IC components on the mounting area; Use regional point heating, regional scanning heating or regional full-area heating welding methods to perform single-sided welding on mounted components; An optical functional layer is laminated on the substrate, and the substrate laminated with the optical functional layer is frame-cut to form a semiconductor display module.

2. The semiconductor display module manufacturing process of single-sided soldering with die bonding followed by chip placement according to claim 1, characterized in that: Before providing the substrate, the substrate is subjected to surface treatment, and the surface treatment comprises the following steps: Removing residues from the surface of the substrate by ultrasound or electrostatics; Using a water-based cleaning agent to remove oil stains and fingerprints on the substrate; The substrate pretreatment is completed by water rinsing and thermal drying; The pre-treated substrate is subjected to surface plasma treatment.

3. The semiconductor display module manufacturing process of single-sided soldering with die bonding followed by chip placement according to claim 1, characterized in that: When solder paste is printed on the pad area of the substrate and the semiconductor chip is bonded to the pad area, after the bonding is completed, the semiconductor chip bonding quality inspection is performed, including chip position offset inspection and coplanarity inspection.

4. The semiconductor display module manufacturing process of single-sided soldering with die bonding followed by chip placement according to claim 1, characterized in that: In the single-sided welding of the chip after crystal bonding using the welding method of regional point heating, regional scanning heating or regional full-area heating, and in the single-sided welding of the mounted components using the welding method of regional point heating, regional scanning heating or regional full-area heating, the welding method of regional point heating, regional scanning heating or regional full-area heating adopts laser heating welding or photon heating welding to perform point-by-point welding, line scanning welding or whole-area welding on the welding area, the welding temperature is controlled at 180°C-250°C, and the welding time of each welding point is less than or equal to 3 seconds.

5. The semiconductor display module manufacturing process of single-sided soldering with die bonding followed by chip placement according to claim 4, characterized in that: After single-sided soldering of the die-bonded chip using the welding method of regional point heating, regional scanning heating or regional full-area heating, and after single-sided soldering of mounted components using the welding method of regional point heating, regional scanning heating or regional full-area heating, optical inspection is performed using an automatic optical inspection system, and the optical inspection includes solder joint integrity inspection, chip offset inspection and floating height inspection.

6. The semiconductor display module manufacturing process of single-sided soldering with die bonding followed by chip placement according to claim 5, characterized in that: The automatic optical detection system is equipped with an automatic repair system. When the detection value of the automatic optical detection system is higher than a preset value, fixed-point repair is performed through the automatic repair system.

7. The semiconductor display module manufacturing process of single-sided soldering with die bonding followed by chip placement according to claim 1, characterized in that: A groove is provided between the IC pad area and the semiconductor pad area on the substrate.

8. The semiconductor display module manufacturing process of single-sided soldering with die bonding followed by chip placement according to claim 7, characterized in that: In the pre-underfill process performed on the area of the substrate where the semiconductor chip is soldered, the thickness of the underfill is less than half of the thickness of the chip.

9. The semiconductor display module manufacturing process of single-sided soldering with die bonding followed by chip placement according to claim 1, characterized in that: In the step of laminating the optical functional layer on the substrate, the optical functional layer includes at least one of a quantum dot film, a brightness enhancement film, and a polarizing film.

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