Dimming film, preparation method of dimming film, dimming glass and vehicle

Abstract

The invention provides a dimming film, a preparation method of the dimming film, dimming glass and a vehicle, the dimming film comprises a first dimming film base material layer, a first dimming film conducting layer, an active material layer, a second dimming film conducting layer and a second dimming film base material layer which are stacked in sequence, and at least one semi-cut area, a first flexible circuit board comprising a first conductive electrode and a first flexible circuit board base material is arranged on the first dimming film conductive layer of the first half-cut area; and a second flexible circuit board comprising a second conductive electrode and a second flexible circuit board base material is arranged on the second dimming film conductive layer of the second half-cut area. Cavities are formed between the first conductive electrode and the corresponding related layer and between the second conductive electrode and the corresponding related layer, the first flexible circuit board base material is adsorbed to the surface of the first light adjusting film conductive layer to form a first electrode edge sealing structure, and the second flexible circuit board base material is adsorbed to the surface of the second light adjusting film conductive layer to form a second electrode edge sealing structure. The edge sealing cost of the dimming film is reduced, and the production efficiency of the dimming film is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of glass manufacturing, and in particular to a dimming film, a preparation method of the dimming film, dimming glass and a vehicle. Background Art

[0002] Smart glass can have a five-layer structure: a middle layer of smart film, two layers adjacent to the film, and a glass substrate outside the two film layers. The film layers contain a large amount of plasticizers, which can easily corrode the liquid crystals in the smart film. If an electrochromic (EC) smart film is used, external moisture and oxygen can also cause noticeable cosmetic defects. Therefore, an effective edge-sealing structure is required for the smart film to block the corrosion of external substances such as plasticizers, moisture, and oxygen.

[0003] Since the thickness of the dimming film at the electrode is often significantly thicker than that at the non-electrode part, when sealing the edge at the electrode, the method of stacking edge sealing materials can be used. However, this will make the electrode too thick, and local excessive thickness can easily cause the dimming glass to crack when it is assembled. In addition, when the edge sealing materials are stacked at the electrode, additional fixing materials are required to make the edge sealing structure stable. The operation is delicate, complicated and time-consuming. When sealing the edge at the electrode, a point-gluing edge sealing method can also be used. Although the edge sealing glue can avoid stacking materials at the electrode, the edge sealing glue often needs to be baked and cured, so its processing time is too long and the glue cost is relatively high. The edge sealing glue is prone to problems such as bubbles and glue overflow during the edge sealing process, which can easily cause other defects. Therefore, how to propose a dimming film that can avoid the above-mentioned edge sealing defects has become an important issue that needs to be urgently solved in this field. Summary of the Invention

[0004] In response to the problems in the prior art, embodiments of the present invention provide a dimming film, a method for preparing the dimming film, dimming glass, and a vehicle, which can at least partially solve the problems in the prior art.

[0005] In a first aspect, the present invention provides a dimming film, comprising a first dimming film substrate layer, a first dimming film conductive layer, an active material layer, a second dimming film conductive layer, and a second dimming film substrate layer stacked in sequence, wherein:

[0006] The dimming film further comprises at least one half-cut area, and the at least one half-cut area comprises a first half-cut area and / or a second half-cut area;

[0007] A first flexible circuit board is provided on the first dimming film conductive layer exposed in the first half-cut area, wherein the first flexible circuit board includes a first conductive electrode and a first flexible circuit board substrate; and a second flexible circuit board is provided on the second dimming film conductive layer exposed in the second half-cut area, wherein the second flexible circuit board includes a second conductive electrode and a second flexible circuit board substrate;

[0008] A first cavity is defined between the first conductive electrode, the second dimming film substrate, the second dimming film conductive layer, and the active material layer; the first flexible circuit board substrate covers the first cavity, and the first flexible circuit board substrate is configured to be adsorbed onto the surface of the first dimming film conductive layer in the first cavity to form a first electrode edge-sealing structure;

[0009] There is a second cavity between the second conductive electrode and the first dimming film substrate layer, the first dimming film conductive layer and the active material layer; the second flexible circuit board substrate covers the second cavity, and the second flexible circuit board substrate is used to be adsorbed to the surface of the second dimming film conductive layer at the second cavity to form a second electrode edge sealing structure.

[0010] Furthermore, the first dimming film conductive layer includes multiple first conductive partitions, and accordingly, there are multiple first conductive electrodes, each first conductive electrode corresponds to a first conductive partition; and / or, the second dimming film conductive layer includes multiple second conductive partitions, and accordingly, there are multiple second conductive electrodes, each second conductive electrode corresponds to a second conductive partition.

[0011] Furthermore, the first flexible circuit board substrate is bonded to the first dimming film conductive layer exposed in the first half-cut area and / or the second flexible circuit board substrate is bonded to the second dimming film conductive layer exposed in the second half-cut area.

[0012] Furthermore, the width of the first flexible circuit board substrate is at least 1.5 mm greater than the width of the first half-cut area, and the width of the second flexible circuit board substrate is at least 1.5 mm greater than the width of the second half-cut area; the width direction of the first flexible circuit board substrate is consistent with the width direction of the first half-cut area, and the width direction of the first half-cut area is perpendicular to the cutting plane of the first half-cut area; the width direction of the second flexible circuit board substrate is consistent with the width direction of the second half-cut area, and the width direction of the second half-cut area is perpendicular to the cutting plane of the second half-cut area.

[0013] Furthermore, the widths of the first cavity and the second cavity are greater than or equal to 1.5 mm; the width direction of the first cavity is perpendicular to the cutting plane of the first half-cut area, and the width direction of the second cavity is perpendicular to the cutting plane of the second half-cut area.

[0014] Furthermore, the width of the first flexible circuit board substrate and the second flexible circuit board substrate is 20-100 mm.

[0015] Furthermore, the thickness of the first flexible circuit board substrate and the second flexible circuit board substrate is 20-200 μm.

[0016] Furthermore, the first conductive electrode is a silver paste electrode or a conductive glue electrode; the second conductive electrode is a silver paste electrode or a conductive glue electrode.

[0017] Furthermore, the first flexible circuit board and the second flexible circuit board are made of transparent material.

[0018] In a second aspect, the present invention provides a method for preparing a dimming film, comprising:

[0019] Cutting the dimming film to prepare at least one half-cut area, the at least one half-cut area including a first half-cut area and / or a second half-cut area; wherein the first half-cut area is obtained by cutting the second dimming film substrate, the second dimming film conductive layer, and the active material layer in the first target area of ​​the dimming film, thereby exposing the first dimming film conductive layer; and the second half-cut area is obtained by cutting the first dimming film substrate layer, the first dimming film conductive layer, and the active material layer in the second target area of ​​the dimming film, thereby exposing the second dimming film conductive layer;

[0020] The first conductive electrode of the first flexible circuit board is fixed to the first dimming film conductive layer exposed in the first half-cut area, and a first cavity is left between the first conductive electrode and the second dimming film substrate, the second dimming film conductive layer and the active material layer; and / or, the second conductive electrode of the second flexible circuit board is fixed to the second dimming film conductive layer exposed in the second half-cut area, and a second cavity is left between the second conductive electrode and the first dimming film substrate layer, the first dimming film conductive layer and the active material layer; wherein, the first flexible circuit board substrate of the first flexible circuit board covers the first cavity, so as to be adsorbed to the surface of the first dimming film conductive layer at the first cavity when the dimming film is combined, forming a first electrode edge sealing structure; the second flexible circuit board substrate of the second flexible circuit board covers the second cavity, so as to be adsorbed to the surface of the second dimming film conductive layer at the second cavity when the dimming film is combined, forming a second electrode edge sealing structure.

[0021] Furthermore, the method for preparing the dimming film proposed by the present invention further includes:

[0022] The first flexible circuit board substrate of the first flexible circuit board is bonded to the first dimming film conductive layer exposed in the first half-cut area and / or the second flexible circuit board substrate is bonded to the second dimming film conductive layer exposed in the second half-cut area.

[0023] In a third aspect, the present invention proposes a dimming glass, comprising the dimming film described in any of the above embodiments, a first glass substrate and a second glass substrate, wherein the dimming film is arranged between the first glass substrate and the second glass substrate; the first flexible circuit board substrate is adsorbed onto the surface of the first dimming film conductive layer at the first cavity to form a first electrode edge sealing structure, and / or the second flexible circuit board substrate is adsorbed onto the surface of the second dimming film conductive layer at the second cavity to form a second electrode edge sealing structure.

[0024] In a fourth aspect, the present invention provides a vehicle comprising the switchable glass described in the above embodiment.

[0025] The dimming film, the preparation method of the dimming film, the dimming glass and the vehicle provided by the embodiments of the present invention include a first dimming film substrate layer, a first dimming film conductive layer, an active material layer, a second dimming film conductive layer and a second dimming film substrate layer stacked in sequence, at least one half-cut area, the at least one half-cut area including a first half-cut area and / or a second half-cut area; a first flexible circuit board is arranged on the first dimming film conductive layer exposed in the first half-cut area, the first flexible circuit board includes a first conductive electrode and a first flexible circuit board substrate; a second flexible circuit board is arranged on the second dimming film conductive layer exposed in the second half-cut area, the second flexible circuit board includes a second conductive electrode and a second flexible circuit board substrate; the first conductive electrode and the second conductive electrode are connected to each other. There is a first cavity between the second dimming film substrate, the second dimming film conductive layer and the active material layer; the first flexible circuit board substrate covers the first cavity, and the first flexible circuit board substrate is used to be adsorbed to the surface of the first dimming film conductive layer at the first cavity to form a first electrode edge sealing structure; there is a second cavity between the second conductive electrode and the first dimming film substrate layer, the first dimming film conductive layer and the active material layer; the second flexible circuit board substrate covers the second cavity, and the second flexible circuit board substrate is used to be adsorbed to the surface of the second dimming film conductive layer at the second cavity to form a second electrode edge sealing structure, which reduces the edge sealing cost of the dimming film and improves the production efficiency of the dimming film. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0027] Figure 1A 1 is a schematic top view of the dimming film provided in the first embodiment of the present invention.

[0028] Figure 1BAA is a schematic cross-sectional structure diagram of the dimming film provided by the first embodiment of the present invention.

[0029] Figure 1C BB is a schematic diagram of the cross-sectional structure of the dimming film provided by the first embodiment of the present invention.

[0030] Figure 2 2 is a schematic top view of the structure of the dimming film provided in the second embodiment of the present invention.

[0031] Figure 3 3 is a schematic top view of the dimming film provided in the third embodiment of the present invention.

[0032] Figure 4 1 is a schematic diagram of the cross-sectional structure of the dimming film after edge sealing provided by the fourth embodiment of the present invention.

[0033] Figure 5 FIG. 5 is a schematic diagram of the cross-sectional structure of the dimming film BB after edge sealing provided by the fifth embodiment of the present invention.

[0034] Figure 6A 1 is a schematic top view of the structure of the dimming film provided in the sixth embodiment of the present invention.

[0035] Figure 6B FIG. 1 is a schematic diagram of the CC cross-sectional structure of the dimming film provided by the sixth embodiment of the present invention.

[0036] Figure 7A 2 is a schematic top view of the structure of the dimming film provided by the seventh embodiment of the present invention.

[0037] Figure 7B DD is a schematic cross-sectional structure diagram of the dimming film provided by the seventh embodiment of the present invention.

[0038] Figure 8 It is a schematic structural diagram of the silver paste electrode provided by the eighth embodiment of the present invention.

[0039] Figure 9 2 is a schematic structural diagram of a conductive adhesive electrode provided by a ninth embodiment of the present invention.

[0040] Figure 10 1 is a flow chart of a method for preparing a dimming film according to the tenth embodiment of the present invention.

[0041] Figure 11A 3 is a schematic diagram of the cross-sectional structure of the switchable glass provided by the eleventh embodiment of the present invention at the first conductive electrode.

[0042] Figure 11B 3 is a schematic diagram of the cross-sectional structure of the switchable glass provided by the eleventh embodiment of the present invention at the second conductive electrode. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention are further described in detail with reference to the accompanying drawings. Here, the schematic embodiments of the present invention and their descriptions are used to explain the present invention, but are not intended to limit the present invention. It should be noted that, in the absence of conflict, the embodiments in this application and the features in the embodiments can be combined with each other in any way. The acquisition, storage, use, processing, etc. of data in the technical solutions in this application comply with the relevant provisions of laws and regulations. The user information in the embodiments of this application is obtained through legal and compliant channels, and the acquisition, storage, use, processing, etc. of user information are agreed to by the customer.

[0044] In order to facilitate understanding of the technical solution provided by this application, the relevant contents of the technical solution of this application are first explained below.

[0045] This application designs a flexible printed circuit (FPC) structure by widening a conventional FPC so that the non-gold finger portion of the FPC's substrate covers the half-cut area of ​​the dimming film and extends beyond the half-cut line of the dimming film. This allows a portion of the FPC's substrate to overlap the top surface of the dimming film. When the FPC is bonded to the dimming film's electrodes, a preliminary edge-sealing structure is formed at the dimming film's electrodes.

[0046] Since the silver paste at the electrode of the dimming film leaves a certain width from the half-cut line to avoid the silver paste contacting the conductive layer of the dimming film and causing a short circuit, the cavity area between the silver paste and the half-cut line can be used for edge sealing. The cold drawing during assembly makes the FPC substrate tightly adhere to the cavity area at the electrode of the dimming film due to negative pressure, forming the final electrode edge sealing structure, thereby achieving the effect of blocking the corrosion of water vapor, oxygen, plasticizers and other substances in the external environment of the dimming film; if there is no silver paste at the electrode of the dimming film, the exposed conductive layer of the half-cut area of ​​the dimming film electrode is directly used as the cavity area. After completing hot pressing (Bonding) and assembly and cold drawing, the FPC can also form an electrode edge sealing structure to achieve an edge sealing effect.

[0047] Figure 1A 1 is a schematic diagram of a top view of the dimming film provided by the first embodiment of the present invention. Figure 1B AA is a schematic cross-sectional structure diagram of the dimming film provided by the first embodiment of the present invention. Figure 1C BB is a schematic cross-sectional structure diagram of the dimming film provided by the first embodiment of the present invention, Figure 2 2 is a schematic top view of the structure of the dimming film provided by the second embodiment of the present invention. Figure 3 FIG. 1 is a schematic diagram of a top view of a dimming film according to a third embodiment of the present invention. Figure 1A 、 Figure 1B 、 Figure 1C 、 Figure 2 and Figure 3As shown, the dimming film provided by the embodiment of the present invention includes a first dimming film substrate layer 1, a first dimming film conductive layer 2, an active material layer 3, a second dimming film conductive layer 4, and a second dimming film substrate layer 5 stacked in sequence, wherein:

[0048] The dimming film includes at least one half-cut area, and the at least one half-cut area includes a first half-cut area 6 and / or a second half-cut area 8;

[0049] A first flexible circuit board 7 is provided on the first dimming film conductive layer 2 exposed in the first half-cut area 6. The first flexible circuit board 7 includes a first conductive electrode 7-1 and a first flexible circuit board substrate 7-2. A second flexible circuit board 9 is provided on the second dimming film conductive layer 4 exposed in the second half-cut area 8. The second flexible circuit board 9 includes a second conductive electrode 9-1 and a second flexible circuit board substrate 9-2.

[0050] A first cavity 10 is defined between the first conductive electrode 7-1 and the second dimming film substrate layer 5, the second dimming film conductive layer 4, and the active material layer 3. The first flexible circuit board 7 substrate covers the first cavity 10. The first flexible circuit board substrate 7-2 is adapted to be adsorbed onto the surface of the first dimming film conductive layer 2 in the first cavity 10 to form a first electrode edge-sealing structure.

[0051] There is a second cavity 11 between the second conductive electrode 9-1 and the first dimming film substrate layer 1, the first dimming film conductive layer 2 and the active material layer 3; the second flexible circuit board substrate 9-2 covers the second cavity 11, and the second flexible circuit board substrate 9-2 is used to be adsorbed onto the surface of the second dimming film conductive layer 4 at the second cavity 11 to form a second electrode edge sealing structure.

[0052] Specifically, the half-cut area of ​​the dimming film refers to a specific area formed by partially cutting the dimming film by laser or other cutting methods during the production process of the dimming film. The dimming film includes at least one half-cut area, and the at least one half-cut area includes a first half-cut area 6 and / or a second half-cut area 8. For example, when the dimming film includes one half-cut area, the half-cut area is the first half-cut area 6 or the second half-cut area 8. For example, the dimming film includes the first half-cut area 6, as Figure 2 As shown; the dimming film includes a second half-cut area 8, as Figure 3 shown.

[0053] In the embodiment of the present invention, the first half-cut area 6 is obtained by cutting the second dimming film substrate layer 5, the second dimming film conductive layer 4, and the active material layer 3 on one side of the dimming film, thereby exposing the first dimming film conductive layer 2. The size and position of the first half-cut area 6 are set according to actual needs and are not limited by the embodiment of the present invention. The second half-cut area 8 is obtained by cutting the first dimming film substrate layer 1, the first dimming film conductive layer 2, and the active material layer 3 on the other side of the dimming film, thereby exposing the second dimming film conductive layer 4. The size and position of the second half-cut area 8 are set according to actual needs and are not limited by the embodiment of the present invention.

[0054] A first flexible printed circuit board (FPC) 7 is disposed on the first dimming film conductive layer 2 exposed in the first half-cut region 6. The first FPC 7 includes a first conductive electrode 7-1 disposed on the first dimming film conductive layer 2 exposed in the first half-cut region 6. A first cavity 10 is defined between the first conductive electrode 7-1 and the second dimming film substrate layer 5, the second dimming film conductive layer 4, and the active material layer 3. A first flexible printed circuit board (FPC) substrate 7-2 covers the first cavity 10 and extends over a portion of the surface of the second dimming film substrate layer 5. The first flexible printed circuit board substrate 7-2 supports and secures the first conductive electrode 7-1 and provides electrical insulation. The first flexible printed circuit board substrate 7-2 can be made of a transparent plastic such as polyimide or polyester, or an opaque material. A transparent substrate is preferred to facilitate alignment and positioning of the first FPC 7. The first conductive electrode 7-1 can be connected to the first conductive copper foil 7-4 via a first conductive wire 7-3. The substrate material of the first flexible printed circuit board substrate 7-2 can withstand temperatures of 160°C for at least one hour without cracking or wrinkling.

[0055] A second flexible printed circuit board (FPC) 9 is disposed on the second dimming film conductive layer 4 exposed in the second half-cut region 8. The second FPC 9 includes a second conductive electrode 9-1 disposed on the second dimming film conductive layer 4 exposed in the second half-cut region 8. A second cavity 11 is defined between the second conductive electrode 9-1 and the first dimming film substrate layer 1, the first dimming film conductive layer 2, and the active material layer 3. A second flexible printed circuit board (FPC) substrate 9-2 covers the second cavity 11 and extends over a portion of the surface of the first dimming film substrate layer 1. The second flexible printed circuit board substrate 9-2 supports and secures the second conductive electrode 9-1 and provides electrical insulation. The second flexible printed circuit board substrate 9-2 can be made of a transparent plastic such as polyimide or polyester, or an opaque material. A transparent substrate is preferred to facilitate alignment and positioning of the second FPC 9. The second conductive electrode 9-1 can be connected to the second conductive copper foil 9-4 via a second conductive wire 9-3. The substrate material of the second flexible printed circuit board substrate 9-2 can withstand temperatures of 160°C for at least one hour without cracking or wrinkling.

[0056] The first flexible circuit board substrate can be adsorbed onto the surface of the first dimming film conductive layer in the first cavity to form a first electrode edge-sealing structure, thereby preventing moisture, oxygen, plasticizers, and other substances in the external environment from corroding the dimming film. For example, when preparing dimming glass based on the dimming film, a cold extraction step is performed after the dimming film is combined with two glass substrates. During the cold extraction step, the air in the first cavity 10 is extracted. Due to the negative pressure, the first flexible circuit board substrate 7-2 in the first cavity 10 is adsorbed onto the surface of the first dimming film conductive layer 2, thereby forming a first electrode edge-sealing structure.

[0057] The second flexible circuit board substrate is designed to be adsorbed onto the surface of the second dimming film conductive layer in the second cavity to form a second electrode edge-sealing structure, effectively preventing the dimming film from being corroded by substances such as moisture, oxygen, and plasticizers in the external environment. For example, when preparing dimming glass based on the dimming film, a cold extraction step is performed after the dimming film is combined with two glass substrates. During the cold extraction step, the air in the second cavity 11 is evacuated. Due to the negative pressure, the second flexible circuit board substrate 9-2 in the second cavity 11 is adsorbed onto the surface of the second dimming film conductive layer 4, thereby forming a second electrode edge-sealing structure.

[0058] Because the edge sealing of the dimming film is achieved using the first flexible circuit board substrate 7-2 and the second flexible circuit board substrate 9-2, there is no need to stack edge sealing materials or use additional fixing materials, which reduces the edge sealing cost of the dimming film and improves the production efficiency of the dimming film. Furthermore, the edge sealing can be performed using existing process steps, eliminating the need for a dedicated edge sealing process, further reducing the edge sealing cost of the dimming film and improving the production efficiency of the dimming film.

[0059] like Figure 4 As shown, after the dimming film is laminated, the first flexible circuit board substrate 7-2 is adsorbed onto the surface of the first dimming film conductive layer 2 to form a first electrode edge sealing structure 12. Figure 5 As shown, after the dimming films are laminated, the second flexible circuit board substrate 9 - 2 is adsorbed onto the surface of the second dimming film conductive layer 4 to form a second electrode edge sealing structure 13 .

[0060] The dimming film includes but is not limited to a suspended particle device (SPD) dimming film, an EC dimming film, a polymer dispersed liquid crystal (PDLC), and a liquid crystal (LC) dimming film. The shapes of the first flexible circuit board substrate 7-2 and the second flexible circuit board substrate 9-2 are set according to actual needs, and are not limited in the embodiment of the present invention. For example, they are the imitation of the half-cut area of ​​the dimming film. The cutting pattern of the half-cut area of ​​the dimming film is designed according to the size contour of the dimming glass. The first dimming film conductive layer 2 and the second dimming film conductive layer 4 can be made of FTO or ITO. The active material layer 3 can be made of liquid crystal material, which is selected according to actual needs and is not limited in the embodiment of the present invention.

[0061] The dimming film provided by the embodiment of the present invention includes a first dimming film substrate layer, a first dimming film conductive layer, an active material layer, a second dimming film conductive layer, and a second dimming film substrate layer stacked in sequence, and at least one half-cut area, wherein the at least one half-cut area includes a first half-cut area and / or a second half-cut area; a first flexible circuit board is arranged on the first dimming film conductive layer exposed in the first half-cut area, and the first flexible circuit board includes a first conductive electrode and a first flexible circuit board substrate; a second flexible circuit board is arranged on the second dimming film conductive layer exposed in the second half-cut area, and the second flexible circuit board includes a second conductive electrode and a second flexible circuit board substrate; the first conductive electrode is connected to the second dimming film substrate, the first conductive electrode is connected to the second dimming film substrate, the second conductive electrode is connected to the second conductive electrode, the second conductive electrode is connected to the second conductive electrode, the second conductive electrode is connected to the second conductive electrode. There is a first cavity between the second dimming film conductive layer and the active material layer; the first flexible circuit board substrate covers the first cavity, and the first flexible circuit board substrate is used to be adsorbed to the surface of the first dimming film conductive layer at the first cavity to form a first electrode edge sealing structure; there is a second cavity between the second conductive electrode and the first dimming film substrate layer, the first dimming film conductive layer and the active material layer; the second flexible circuit board substrate covers the second cavity, and the second flexible circuit board substrate is used to be adsorbed to the surface of the second dimming film conductive layer at the second cavity to form a second electrode edge sealing structure, which reduces the edge sealing cost of the dimming film and improves the production efficiency of the dimming film.

[0062] Based on the above embodiments, the first dimming film conductive layer 2 further includes multiple first conductive sections. Accordingly, there are multiple first conductive electrodes 7-1, each corresponding to a first conductive section. The multiple first conductive electrodes share the first flexible circuit board substrate 7-2, that is, multiple first conductive electrodes are provided on the first flexible circuit board substrate 7-2.

[0063] For example, Figure 6AAs shown, the first dimming film conductive layer 2 includes first conductive partitions 2-1, 2-2 and 2-3, first conductive electrodes 7-1-1, 7-1-2 and 7-1-3, the first conductive electrode 7-1-1 is arranged on the first conductive partition 2-1, the first conductive electrode 7-1-2 is arranged on the first conductive partition 2-2, and the first conductive electrode 7-1-3 is arranged on the first conductive partition 2-3. The second dimming film conductive layer 4 is not partitioned, and the second conductive electrode 9-1 serves as a common electrode. The structures of the first conductive electrodes 7-1-1, 7-1-2 and 7-1-3 are similar, and the first conductive electrode 7-1-3 is taken as an example for description. Figure 6B As shown, there is a first cavity 10-1 between the first conductive electrode 7-1-3 and the second dimming film substrate layer 5, the second dimming film conductive layer 4 and the active material layer 3; the first flexible circuit board substrate 7-2 covers the first cavity 10-1. During the cold extraction step, the air in the first cavity 10-1 will be extracted. Due to the effect of negative pressure, the first flexible circuit board substrate 7-2 at the first cavity 10-1 will be adsorbed to the surface of the first conductive partition 2-3, thereby forming a corresponding electrode edge sealing structure.

[0064] Further, based on the above embodiments, the second dimming film conductive layer 4 includes multiple second conductive sections. Accordingly, there are multiple second conductive electrodes 9-1, each corresponding to a second conductive section. The multiple second conductive electrodes 9-1 share the first flexible circuit board substrate 7-2, meaning that multiple second conductive electrodes are provided on the second flexible circuit board substrate 9-2.

[0065] For example, Figure 7A As shown, the second dimming film conductive layer 4 includes second conductive partitions 4-1, 4-2 and 4-3, second conductive electrodes 9-1-1, 9-1-2 and 9-1-3, the second conductive electrode 9-1-1 is arranged on the second conductive partition 4-1, the second conductive electrode 9-1-2 is arranged on the second conductive partition 4-2, and the second conductive electrode 9-1-3 is arranged on the second conductive partition 4-3. The first dimming film conductive layer 2 is not partitioned, and the first conductive electrode 7-1 serves as a common electrode. The structures of the second conductive electrodes 9-1-1, 9-1-2 and 9-1-3 are similar, and the second conductive electrode 9-1-3 is taken as an example for description. Figure 7B As shown, there is a second cavity 11-1 between the second conductive electrode 9-1-3 and the first dimming film substrate layer 1, the first dimming film conductive layer 2 and the active material layer 3; the second flexible circuit board substrate 9-2 covers the second cavity 11-1. During the cold extraction step, the air in the second cavity 11-1 will be extracted. Due to the effect of negative pressure, the second flexible circuit board substrate 9-2 at the second cavity 11-1 will be adsorbed to the surface of the second conductive partition 4-3, thereby forming a corresponding electrode edge sealing structure.

[0066] On the basis of the above embodiments, further, the first dimming film conductive layer 2 includes multiple first conductive partitions, and accordingly, there are multiple first conductive electrodes 7-1, each first conductive electrode corresponds to a first conductive partition; the second dimming film conductive layer 4 includes multiple second conductive partitions, and accordingly, there are multiple second conductive electrodes 9-1, each second conductive electrode corresponds to a second conductive partition.

[0067] On the basis of the above embodiments, further, the first flexible circuit board substrate 7 - 2 is bonded to the first dimming film conductive layer 2 exposed in the first half-cut area 6 .

[0068] On the basis of the above embodiments, further, the second flexible circuit board substrate 9 - 2 is bonded to the second dimming film conductive layer 4 exposed in the second half-cut area 8 .

[0069] On the basis of the above embodiments, the first flexible circuit board substrate 7 - 2 is further bonded to the first dimming film conductive layer 2 exposed in the first half-cut area 6 ; the second flexible circuit board substrate 9 - 2 is bonded to the second dimming film conductive layer 4 exposed in the second half-cut area 8 .

[0070] Specifically, when the first flexible circuit board substrate 7-2 is long, the first conductive electrode 7-1 cannot fully secure the position of the first flexible circuit board substrate 7-2. To prevent the first flexible circuit board substrate 7-2 from shifting or swinging during the movement of the dimming film, which could affect subsequent processing, the first flexible circuit board substrate 7-2 can be bonded to the first dimming film conductive layer 2 exposed in the first half-cut region 6. When there are multiple bonding points between the first flexible circuit board substrate 7-2 and the first dimming film conductive layer 2, adjacent bonding points are separated by a first predetermined distance. This first predetermined distance is set based on actual needs and is not limited in this embodiment of the present invention.

[0071] Similarly, when the second flexible circuit board substrate 9-2 is long, the second conductive electrode 9-1 cannot fully secure the position of the second flexible circuit board substrate 9-2. To prevent the second flexible circuit board substrate 9-2 from shifting or misaligning during the movement of the dimming film, which could affect subsequent processing, the second flexible circuit board substrate 9-2 can be bonded to the second dimming film conductive layer 4 exposed in the second half-cut region 8. When multiple bonding points exist between the second flexible circuit board substrate 9-2 and the second dimming film conductive layer 4, adjacent bonding points are separated by a second predetermined distance. This second predetermined distance is set based on actual needs and is not limited in this embodiment of the present invention.

[0072] The bonding may be performed using polyimide glue or PET glue.

[0073] Based on the above embodiments, the width of the first flexible circuit board substrate 7-2 is further increased by at least 1.5 mm compared to the width of the first half-cut region 6. For example, the width of the first flexible circuit board substrate 7-2 is increased by 3 mm, or even by 5 mm. To ensure effective edge sealing, the width of the first flexible circuit board substrate 7-2 is increased by at least 1.5 mm compared to the width of the first half-cut region 6. This allows the first flexible circuit board substrate 7-2 to adhere to the first dimming film conductive layer 2, while maintaining a side edge of the first flexible circuit board substrate 7-2 overlying the second dimming film substrate layer 5. The width of the first flexible circuit board substrate 7-2 is aligned with the width of the first half-cut region 6, which is perpendicular to the cutting plane of the first half-cut region 6.

[0074] In addition to the above embodiments, the width of the second flexible circuit board substrate 9-2 is at least 1.5 mm greater than the width of the second half-cut region 8. For example, the width of the second flexible circuit board substrate 9-2 is 3 mm greater than the width of the second half-cut region 8, or 5 mm greater than the width of the second half-cut region 8. To ensure effective edge sealing, the width of the second flexible circuit board substrate 9-2 is at least 1.5 mm greater than the width of the second half-cut region 8. This allows the second flexible circuit board substrate 9-2 to adhere to the second dimming film conductive layer 4, while maintaining a side edge of the second flexible circuit board substrate 9-2 overlying the first dimming film substrate layer 1. The width of the second flexible circuit board substrate 9-2 is aligned with the width of the second half-cut region 8, and the width of the second half-cut region 8 is perpendicular to the cutting plane of the second half-cut region 8.

[0075] Based on the above embodiments, further, the width of the first cavity 10 is greater than or equal to 1.5 mm. The width of the first cavity 10 is perpendicular to the cutting plane of the first half-cut region 6. The width of the first cavity 10 can be determined by measuring the distance from the side of the first conductive electrode 7-1 closest to the second dimming film substrate layer 5 to the edge of the first half-cut region 6 on the second dimming film substrate layer 5. The width of the first cavity 10 should be greater than twice the thickness of the first flexible circuit board substrate 7-2 to ensure that the first cavity 10 has sufficient space to accommodate the first flexible circuit board substrate 7-2, allowing the first flexible circuit board substrate 7-2 to enter the first cavity 10 and adhere to the surface of the first dimming film conductive layer 2.

[0076] Based on the above embodiments, the width of the second cavity 11 is further greater than or equal to 1.5 mm. The width of the second cavity 11 can be determined by measuring the distance from the side of the second conductive electrode 9-1 closest to the first dimming film substrate layer 1 to the edge of the second half-cut region 8 on the first dimming film substrate layer 1. The width of the second cavity 11 should be greater than twice the thickness of the second flexible circuit board substrate 9-2 to ensure that the second cavity 11 has sufficient space to accommodate the second flexible circuit board substrate 9-2, allowing the second flexible circuit board substrate 9-2 to enter the second cavity 11 and adhere to the surface of the second dimming film conductive layer 4. The width of the second cavity 11 is perpendicular to the cutting plane of the second half-cut region 8.

[0077] Based on the above embodiments, the width of the first flexible circuit board substrate 7 - 2 is 20-100 mm, and the width of the first flexible circuit board substrate 7 - 2 can cover the first half-cut area 6 and extend to the surface of the second dimming film substrate layer 5 .

[0078] Based on the above embodiments, the width of the second flexible circuit board substrate 9 - 2 is 20-100 mm, and the width of the second flexible circuit board substrate 9 - 2 can cover the second half-cut area 8 and extend to the surface of the first dimming film substrate layer 1 .

[0079] On the basis of the above embodiments, further, the thickness of the first flexible circuit board substrate 7-2 is 20-200 μm. The thickness of the first flexible circuit board substrate 7-2 can be adjusted according to the thickness requirement of the dimming glass laminate.

[0080] On the basis of the above embodiments, further, the thickness of the second flexible circuit board substrate 9-2 is 20-200 μm. The thickness of the second flexible circuit board substrate 9-2 can be adjusted according to the thickness requirement of the dimming glass laminate.

[0081] On the basis of the above embodiments, further, the first conductive electrode 7 - 1 is selected to be a silver paste electrode or a conductive glue electrode.

[0082] Specifically, when the first conductive electrode 7-1 is a silver paste electrode, the first flexible circuit board 7 including the silver paste electrode is hot-pressed onto the first dimming film conductive layer 2 exposed in the first half-cut region 6. The silver paste electrode is fixed to the first dimming film conductive layer 2. The first flexible circuit board substrate 7-2 can then be bonded to the first dimming film conductive layer 2 using adhesive tape to further reinforce the first flexible circuit board 7. A cavity is formed between the silver paste electrode and the second dimming film substrate layer 5, the second dimming film conductive layer 4, and the active material layer 3.

[0083] When the first conductive electrode 7-1 is a conductive adhesive electrode, bonding is not required. By bonding the first flexible circuit board 7, including the conductive adhesive electrode, to the first dimming film conductive layer 2 exposed in the first half-cut area 6, the conductive adhesive electrode is fixed to the first dimming film conductive layer 2. The first flexible circuit board substrate 7-2 can also be bonded to the first dimming film conductive layer 2 using adhesive tape to further reinforce the first flexible circuit board 7. A cavity is formed between the conductive adhesive electrode and the second dimming film substrate layer 5, the second dimming film conductive layer 4, and the active material layer 3. Compared to silver paste electrodes, conductive adhesive electrodes do not require a bonding process, saving a bonding machine and eliminating the need for a hot pressing process, further improving edge sealing efficiency. The cost of conductive adhesive is also much lower than that of silver paste, further reducing material costs.

[0084] For example, Figure 8 As shown, the silver paste electrode includes a stacked conductive silver paste 601, a conductive adhesive 602, and a pad 603. The pad 603 can be connected to the conductive copper foil via a wire 604. The conductive adhesive 602 can be anisotropic conductive film.

[0085] For example, Figure 9 As shown, the conductive adhesive electrode includes a stacked conductive adhesive 701 and a pad 702 , and the pad 702 can be connected to the conductive copper foil through a wire 703 .

[0086] On the basis of the above embodiments, the second conductive electrode 9-1 is further selected to be a silver paste electrode or a conductive glue electrode. The second conductive electrode 9-1 can adopt a structure similar to that of the first conductive electrode 7-1, which will not be described in detail here.

[0087] On the basis of the above embodiments, further, the first flexible circuit board substrate 7 - 2 is made of transparent material to facilitate the alignment and positioning of the first FPC 7 .

[0088] On the basis of the above embodiments, further, the second flexible circuit board substrate 9 - 2 is made of transparent material to facilitate the alignment and positioning of the second FPC 9 .

[0089] Figure 10 FIG. 1 is a flow chart of a method for preparing a dimming film according to a tenth embodiment of the present invention. Figure 10 As shown, the method for preparing the dimming film provided by the embodiment of the present invention includes:

[0090] S1001, cutting the dimming film to prepare at least one half-cut area, the at least one half-cut area including a first half-cut area and / or a second half-cut area; wherein the first half-cut area is obtained by cutting the second dimming film substrate, the second dimming film conductive layer, and the active material layer in the first target area of ​​the dimming film, and exposing the first dimming film conductive layer; and the second half-cut area is obtained by cutting the first dimming film substrate layer, the first dimming film conductive layer, and the active material layer in the second target area of ​​the dimming film, and exposing the second dimming film conductive layer;

[0091] Specifically, by cutting the dimming film by means of laser or other cutting methods, at least one half-cut area can be prepared. The at least one half-cut area includes a first half-cut area and / or a second half-cut area. By cutting the first target area of ​​the dimming film by means of laser or other cutting methods, the first dimming film substrate layer, the first dimming film conductive layer and the active material layer of the first target area are removed, and the second dimming film conductive layer of the first target area is exposed, thereby obtaining a first half-cut area. By cutting the second target area of ​​the dimming film by means of laser or other cutting methods, the second dimming film substrate, the second dimming film conductive layer and the active material layer of the second target area are removed, and the first dimming film conductive layer of the second target area is exposed, thereby obtaining a second half-cut area. Wherein, the size and position of the first target area are set according to actual needs, and are not limited in the embodiment of the present invention.

[0092] S1002. Fix the first conductive electrode of the first flexible circuit board to the first dimming film conductive layer exposed in the first half-cut area, and leave a first cavity between the first conductive electrode and the second dimming film substrate, the second dimming film conductive layer and the active material layer; and / or, fix the second conductive electrode of the second flexible circuit board to the second dimming film conductive layer exposed in the second half-cut area, and leave a second cavity between the second conductive electrode and the first dimming film substrate layer, the first dimming film conductive layer and the active material layer; wherein, the first flexible circuit board substrate of the first flexible circuit board covers the first cavity, so as to be adsorbed to the surface of the first dimming film conductive layer at the first cavity when the dimming film is combined, thereby forming a first electrode edge sealing structure; the second flexible circuit board substrate of the second flexible circuit board covers the second cavity, so as to be adsorbed to the surface of the second dimming film conductive layer at the second cavity when the dimming film is combined, thereby forming a second electrode edge sealing structure.

[0093] Specifically, the first conductive electrode of the first flexible circuit board is fixed to the second dimming film conductive layer exposed in the first half-cut area. The first conductive electrode can be fixed to the second dimming film conductive layer by hot pressing (bonding), conductive copper foil tape bonding, welding, tape bonding, etc. A first cavity is defined between the first conductive electrode and the first dimming film substrate layer, the first dimming film conductive layer, and the active material layer. The first flexible circuit board substrate covers the first cavity. During the cold drawing step of preparing dimming glass based on the dimming film, the first flexible circuit board substrate in the first cavity can be adsorbed to the surface of the second dimming film conductive layer, forming a first electrode edge sealing structure.

[0094] The second conductive electrode of the second flexible circuit board is fixed to the first dimming film conductive layer exposed in the second half-cut area. The second conductive electrode can be fixed to the first dimming film conductive layer by hot pressing (bonding), conductive copper foil tape bonding, welding, tape bonding, etc. A second cavity is defined between the second conductive electrode, the second dimming film substrate, the second dimming film conductive layer, and the active material layer. The second flexible circuit board substrate covers the second cavity. During the cold drawing step of preparing dimming glass based on the dimming film, the second flexible circuit board substrate in the second cavity can be adsorbed to the surface of the first dimming film conductive layer, forming a second electrode edge sealing structure.

[0095] The preparation method of the dimming film provided by the embodiment of the present invention is to cut the dimming film to prepare at least one half-cut area, and the at least one half-cut area includes a first half-cut area and / or a second half-cut area; wherein, the first half-cut area is obtained by cutting the second dimming film substrate, the second dimming film conductive layer and the active material layer of the first target area of ​​the dimming film, and exposing the first dimming film conductive layer; the second half-cut area is obtained by cutting the first dimming film substrate layer, the first dimming film conductive layer and the active material layer of the second target area of ​​the dimming film, and exposing the second dimming film conductive layer; the first conductive electrode of the first flexible circuit board is fixed to the first dimming film conductive layer exposed in the first half-cut area, and the first conductive electrode is connected to the second dimming film substrate, the second dimming film conductive layer and the active material layer. A first cavity is left between the active material layers; and / or, the second conductive electrode of the second flexible circuit board is fixed to the second dimming film conductive layer exposed in the second half-cut area, and a second cavity is left between the second conductive electrode and the first dimming film substrate layer, the first dimming film conductive layer and the active material layer; wherein, the first flexible circuit board substrate covers the first cavity, so as to be adsorbed to the surface of the first dimming film conductive layer at the first cavity when the dimming film is combined, thereby forming a first electrode edge sealing structure; the second flexible circuit board substrate covers the second cavity, so as to be adsorbed to the surface of the second dimming film conductive layer at the second cavity when the dimming film is combined, thereby forming a second electrode edge sealing structure, thereby reducing the edge sealing cost of the dimming film and improving the production efficiency of the dimming film.

[0096] On the basis of the above embodiments, the method for preparing the dimming film provided by the embodiment of the present invention further includes:

[0097] The first flexible circuit board substrate of the first flexible circuit board is bonded to the first dimming film conductive layer exposed in the first half-cut area.

[0098] Specifically, in order to prevent the first flexible circuit board substrate from deflecting, swinging, etc. when the dimming film moves, thereby affecting subsequent processes, the first flexible circuit board substrate can be bonded to the first dimming film conductive layer exposed in the first half-cut area. When there are multiple bonding points between the first flexible circuit board substrate and the first dimming film conductive layer, adjacent bonding points are separated by a preset distance, and the preset distance is set according to actual needs, which is not limited in the embodiment of the present invention. The bonding can be made with polyimide glue or PET glue, which can be selected according to actual needs, which is not limited in the embodiment of the present invention. The bonding area between the first flexible circuit board substrate and the first dimming film conductive layer can be rectangular, and the bonding area cannot exceed the ink printing area. The thickness of the bonding area is less than 70μm.

[0099] For example, the preset distance is greater than or equal to 100 mm and less than or equal to 300 mm, for example, the preset distance is 100 mm, 200 mm or 300 mm.

[0100] On the basis of the above embodiments, the method for preparing the dimming film provided by the embodiment of the present invention further includes:

[0101] The second flexible circuit board substrate of the second flexible circuit board is bonded to the second dimming film conductive layer exposed in the second half-cut area.

[0102] Specifically, in order to prevent the second flexible circuit board substrate from offsetting, swinging, etc. when the dimming film moves, which affects the subsequent process, the second flexible circuit board substrate can be bonded to the second dimming film conductive layer exposed in the second half-cut area. When there are multiple bonding points between the second flexible circuit board substrate and the second dimming film conductive layer, the adjacent bonding points are separated by a second preset distance. The second preset distance is set according to actual needs and is not limited in the embodiment of the present invention. The bonding can be made of polyimide glue or PET glue, which can be selected according to actual needs and is not limited in the embodiment of the present invention. The bonding area between the second flexible circuit board substrate and the second dimming film conductive layer can be rectangular, and the bonding area cannot exceed the ink printing area. The thickness of the bonding area is less than 70μm.

[0103] For example, the second preset distance is greater than or equal to 100 mm and less than or equal to 300 mm, for example, the second preset distance is 100 mm, 200 mm or 300 mm.

[0104] On the basis of the above embodiments, the method for preparing the dimming film provided by the embodiment of the present invention further includes:

[0105] The first flexible circuit board substrate of the first flexible circuit board is bonded to the first dimming film conductive layer exposed in the first half-cut area, and the second flexible circuit board substrate of the second flexible circuit board is bonded to the second dimming film conductive layer exposed in the second half-cut area.

[0106] Specifically, in order to avoid the first flexible circuit board substrate and the second flexible circuit board substrate from offsetting, swinging, etc. when the dimming film moves, which affects the subsequent process, the first flexible circuit board substrate can be bonded to the first dimming film conductive layer exposed in the first half-cut area, and the second flexible circuit board substrate of the second flexible circuit board can be bonded to the second dimming film conductive layer exposed in the second half-cut area.

[0107] For example, the first flexible circuit board substrate corresponds to multiple first conductive electrodes, and the second flexible circuit board substrate corresponds to one second conductive electrode. Since the first flexible circuit board substrate is longer, it is necessary to bond the first flexible circuit board substrate to the first dimming film conductive layer exposed in the first half-cut area; the second flexible circuit board substrate is shorter and can be fixed via the second conductive electrode. For example, the first flexible circuit board substrate corresponds to multiple first conductive electrodes, and the second flexible circuit board substrate corresponds to multiple second conductive electrodes. Since the first flexible circuit board substrate is longer, it is necessary to bond the first flexible circuit board substrate to the first dimming film conductive layer exposed in the first half-cut area; the second flexible circuit board substrate is also longer, and it is necessary to bond the second flexible circuit board substrate to the second dimming film conductive layer exposed in the second half-cut area.

[0108] Figure 11A FIG. 1 is a schematic cross-sectional view of the first conductive electrode of the switchable glass provided by the eleventh embodiment of the present invention. Figure 11B FIG. 1 is a schematic cross-sectional view of the second conductive electrode of the switchable glass provided by the eleventh embodiment of the present invention. Figure 11A and Figure 11B As shown, the dimming glass provided by the embodiment of the present invention includes the dimming film 901, the first glass substrate 902 and the second glass substrate 903 described in any of the above embodiments, the dimming film 901 is arranged between the first glass substrate 902 and the second glass substrate 903, the first flexible circuit board substrate 7-2 is adsorbed onto the surface of the first dimming film conductive layer 2 at the first cavity 10 to form a first electrode edge sealing structure 12; and / or, the second flexible circuit board substrate 9-2 is adsorbed onto the surface of the second dimming film conductive layer at the second cavity to form a second electrode edge sealing structure 13.

[0109] Specifically, the first glass substrate 902 and the second glass substrate 903 can be made of a substrate that is translucent. When preparing the switchable glass, the steps of lamination and cold drawing are performed. During lamination, a special glue can be applied to the surface of the switchable film 901 to firmly bond the switchable film 901 to the first glass substrate 902, and to the second glass substrate 903.

[0110] Cold drawing is a process for treating the assembled smart glass at low temperatures. This process removes air from the first cavity 10 and second cavity 11 of the smart film 901. This allows the first flexible circuit board substrate 7-2 in the first cavity 10 to adhere to the surface of the second smart film conductive layer 4 under negative pressure, thereby forming a first electrode edge-sealing structure 12. Furthermore, the second flexible circuit board substrate 9-2 in the second cavity 11 adheres to the surface of the first smart film conductive layer 2 under negative pressure, thereby forming a second electrode edge-sealing structure 13.

[0111] Since cold drawing is a necessary step in the preparation process of dimming glass, the present application provides a structure of a dimming film. During the preparation process of dimming glass, a first electrode edge sealing structure and a second electrode edge sealing structure can be formed without adding additional edge sealing operation steps or actions, thereby reducing the edge sealing cost and improving the edge sealing efficiency.

[0112] Smart glass can be used in vehicles, doors and windows and other scenes where light needs to be adjusted.

[0113] The transportation provided by the embodiment of the present invention includes the switchable glass described in the above embodiment. The transportation includes but is not limited to cars, trains, airplanes, etc.

[0114] Throughout this specification, reference to terms such as "one embodiment," "a specific embodiment," "some embodiments," "for example," "example," "specific example," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0115] The specific embodiments described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A dimming film, characterized in that: The invention comprises a first dimming film base material layer, a first dimming film conductive layer, an active material layer, a second dimming film conductive layer and a second dimming film base material layer stacked in sequence, wherein: The dimming film further comprises at least one half-cut area, and the at least one half-cut area comprises a first half-cut area and / or a second half-cut area; A first flexible circuit board is provided on the first dimming film conductive layer exposed in the first half-cut area, wherein the first flexible circuit board includes a first conductive electrode and a first flexible circuit board substrate; and a second flexible circuit board is provided on the second dimming film conductive layer exposed in the second half-cut area, wherein the second flexible circuit board includes a second conductive electrode and a second flexible circuit board substrate; A first cavity is defined between the first conductive electrode, the second dimming film substrate, the second dimming film conductive layer, and the active material layer; the first flexible circuit board substrate covers the first cavity, and the first flexible circuit board substrate is configured to be adsorbed onto the surface of the first dimming film conductive layer in the first cavity to form a first electrode edge-sealing structure; There is a second cavity between the second conductive electrode and the first dimming film substrate layer, the first dimming film conductive layer and the active material layer; the second flexible circuit board substrate covers the second cavity, and the second flexible circuit board substrate is used to be adsorbed to the surface of the second dimming film conductive layer at the second cavity to form a second electrode edge sealing structure.

2. The dimming film according to claim 1, wherein: The first dimming film conductive layer includes multiple first conductive partitions, and accordingly, there are multiple first conductive electrodes, each first conductive electrode corresponds to a first conductive partition; and / or, the second dimming film conductive layer includes multiple second conductive partitions, and accordingly, there are multiple second conductive electrodes, each second conductive electrode corresponds to a second conductive partition.

3. The dimming film according to claim 1, wherein: The first flexible circuit board substrate is bonded to the first dimming film conductive layer exposed in the first half-cut area and / or the second flexible circuit board substrate is bonded to the second dimming film conductive layer exposed in the second half-cut area.

4. The dimming film according to claim 1, wherein: The width of the first flexible circuit board substrate is at least 1.5 mm greater than the width of the first half-cut area, and the width of the second flexible circuit board substrate is at least 1.5 mm greater than the width of the second half-cut area; the width direction of the first flexible circuit board substrate is consistent with the width direction of the first half-cut area, and the width direction of the first half-cut area is perpendicular to the cutting plane of the first half-cut area; the width direction of the second flexible circuit board substrate is consistent with the width direction of the second half-cut area, and the width direction of the second half-cut area is perpendicular to the cutting plane of the second half-cut area.

5. The dimming film according to claim 1, wherein: The width of the first cavity and the second cavity is greater than or equal to 1.5 mm; the width direction of the first cavity is perpendicular to the cutting plane of the first half-cut area, and the width direction of the second cavity is perpendicular to the cutting plane of the second half-cut area.

6. The light-switching film according to claim 1, wherein: The width of the first flexible circuit board substrate and the second flexible circuit board substrate is 20-100 mm.

7. The dimming film according to claim 1, wherein: The thickness of the first flexible circuit board substrate and the second flexible circuit board substrate is 20 to 200 μm.

8. The dimming film according to claim 1, wherein: The first conductive electrode is a silver paste electrode or a conductive glue electrode; the second conductive electrode is a silver paste electrode or a conductive glue electrode.

9. The dimming film according to any one of claims 1 to 8, characterized in that: The first flexible circuit board and the second flexible circuit board are made of transparent material.

10. A method for preparing a dimming film, characterized in that: include: Cutting the dimming film to prepare at least one half-cut area, the at least one half-cut area including a first half-cut area and / or a second half-cut area; wherein the first half-cut area is obtained by cutting the second dimming film substrate, the second dimming film conductive layer, and the active material layer in the first target area of ​​the dimming film, thereby exposing the first dimming film conductive layer; and the second half-cut area is obtained by cutting the first dimming film substrate layer, the first dimming film conductive layer, and the active material layer in the second target area of ​​the dimming film, thereby exposing the second dimming film conductive layer; The first conductive electrode of the first flexible circuit board is fixed to the first dimming film conductive layer exposed in the first half-cut area, and a first cavity is left between the first conductive electrode and the second dimming film substrate, the second dimming film conductive layer and the active material layer; and / or, the second conductive electrode of the second flexible circuit board is fixed to the second dimming film conductive layer exposed in the second half-cut area, and a second cavity is left between the second conductive electrode and the first dimming film substrate layer, the first dimming film conductive layer and the active material layer; wherein, the first flexible circuit board substrate of the first flexible circuit board covers the first cavity, so as to be adsorbed to the surface of the first dimming film conductive layer at the first cavity when the dimming film is combined, forming a first electrode edge sealing structure; the second flexible circuit board substrate of the second flexible circuit board covers the second cavity, so as to be adsorbed to the surface of the second dimming film conductive layer at the second cavity when the dimming film is combined, forming a second electrode edge sealing structure.

11. The method according to claim 10, characterized in that Also includes: The first flexible circuit board substrate of the first flexible circuit board is bonded to the first dimming film conductive layer exposed in the first half-cut area and / or the second flexible circuit board substrate is bonded to the second dimming film conductive layer exposed in the second half-cut area.

12. A dimming glass, characterized in that: The method comprises the dimming film according to any one of claims 1 to 9, a first glass substrate and a second glass substrate, wherein the dimming film is arranged between the first glass substrate and the second glass substrate; the first flexible circuit board substrate is adsorbed onto the surface of the first dimming film conductive layer at the first cavity to form a first electrode edge sealing structure, and / or the second flexible circuit board substrate is adsorbed onto the surface of the second dimming film conductive layer at the second cavity to form a second electrode edge sealing structure.

13. A means of transport, characterized in that: Including the switchable glass according to claim 12.

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