An electrical connector for electroplating and a fully automatic device for wafer-level electroplating

Abstract

The present invention discloses an electrical connector for electroplating and a fully automatic device for horizontal electroplating of wafers, comprising a rotating motor, a fixing seat, a lifting cylinder, a lifting connecting plate, a loading tray, a pressing tray, a lifting positioning tray and an electrical connector body. The fixing seat is equipped with a rotating motor, the rotating motor is connected to the pressing tray, a guide hole is provided on the lifting positioning tray, an electrical connection column is slidably installed in the guide hole, the lower end of the electrical connection column is fixedly connected to the loading tray, and the electrical connector body is embedded in the loading tray. The present invention uses an electrical connector body with an elastically deformable connector head, and the electrical connector body is ring-shaped, which can achieve better electrical connection with the product, achieve uniformity of electrical connection, and improve the electroplating effect. At the same time, the rotating motor can drive the loading tray to rotate to achieve better electroplating effect, and automatic clamping is achieved by the lifting cylinder to realize automatic operation.

Description

Technical Field

[0001] The present invention relates to the field of automated machinery, and in particular to an electrical connector for electroplating and a fully automatic device for wafer-level electroplating. Background Art

[0002] Existing electroplating devices all achieve electrical connection of products through ordinary clamping, which is fixed. In order to achieve better electroplating effects during the electroplating process, this application now provides a new electroplating process, namely: during the process of electrical connection and electroplating of the product, the product is rotated, and uniform electroplating of the product is achieved through variable speed forward and reverse rotation, replacing conventional static electroplating. Therefore, an electrical connector that can cooperate with the rotation is required to achieve electrical connection of the product, and a new type of electroplating device needs to be designed. Summary of the Invention

[0003] The main purpose of the present invention is to provide an electrical connector for electroplating and a fully automatic device for wafer-level electroplating, and the purpose is to provide a new type of rotatable electrical connector and an electroplating device with the connector.

[0004] To achieve the above object, the technical solution adopted by the present invention is:

[0005] An electrical connector comprises a rotating motor, a fixed seat, a lifting cylinder, a lifting connecting plate, a feeding disk, a pressure disk, a lifting positioning disk and an electrical connector body, wherein the rotating motor is fixedly installed at the center of the upper end surface of the fixed seat, the output end of the rotating motor is fixedly connected to the pressure disk, the outer ring surface of the output end of the rotating motor is provided with a freely rotatable rotating shaft sleeve, the outer ring surface of the rotating shaft sleeve is fixedly installed with a lifting positioning disk, a guide hole is provided on the lifting positioning disk, an electrical connection column is slidably installed in the guide hole, the lower end of the electrical connection column is fixedly connected to the feeding disk, the lifting connecting plate comprises an outer ring body and an inner ring body, the outer ring body and the inner ring body are connected by a bearing, the outer ring body is fixedly connected to the upper end of the electrical connection column, the inner ring body is fixedly connected to the output end of the lifting cylinder, the lifting cylinder is fixedly installed on the fixed seat, the feeding disk is embedded with the electrical connector body, one end of the electrical connector body extends out of the feeding disk, and the other end of the electrical connector body is electrically connected to the electrical connection column.

[0006] Furthermore, the electrical connector body is annular, including an outer ring portion, elastic connecting arms and an elastic connecting head. The inner wall of the outer ring portion is provided with a plurality of elastic connecting arms integrally formed with the outer ring portion, and the ends of the elastic connecting arms are provided with elastic connecting heads.

[0007] Furthermore, a loading cavity is provided on the loading tray, and a protrusion matching the loading cavity is provided on the lower end surface of the pressing tray. A connecting groove is provided in the loading cavity, and the connecting end of the electrical connector body and the product extends into the connecting groove.

[0008] Furthermore, a fully automatic device for horizontal electroplating of wafers includes a cathode assembly and an anode assembly, the cathode assembly includes a fixed frame, a lifting assembly, a rotating assembly and an electrical connector, the lifting assembly is fixedly installed on the fixed frame, the lifting assembly is installed on the rotating assembly, the output end of the rotating assembly is fixedly installed with an electrical connector, the electrical connector is placed directly above the anode assembly, an anode cavity is opened on the upper end face of the anode assembly, an anode conductive rod and an anode liquid inlet are fixedly provided at the bottom center of the anode cavity, an ion membrane assembly is fixedly provided on the cover above the anode conductive rod, a current equalizing plate is installed above the ion membrane assembly, an overflow trough is opened on the anode assembly outside the upper end opening of the anode cavity, a drain port is fixedly provided in the overflow trough, and a cathode liquid inlet is fixedly provided on the side wall of the anode assembly above the overflow trough.

[0009] Furthermore, an annular assembly is provided at the bottom of the anode cavity, which includes a plurality of upright annular partitions, forming a plurality of independent anode cavities between the annular partitions, and a connecting groove is opened on the annular partition to connect the plurality of independent anode cavities.

[0010] Furthermore, the independent anode cavity is equipped with a plurality of anode conductive rods, and the plurality of anode conductive rods are respectively arranged in different independent anode cavities, and the number of anode conductive rods arranged in each independent anode cavity is not less than one.

[0011] Furthermore, a plurality of overflow notches are provided at the connection between the anode cavity and the overflow tank, and the overflow notches are evenly distributed at the upper end of the anode cavity.

[0012] Furthermore, a swinging assembly is provided above the current equalizing plate, and the swinging assembly includes a swinging motor fixedly installed on the outer wall of the anode cavity, the swinging motor is connected to a swinging transmission assembly, the swinging transmission assembly is provided with a swinging arm, and the swinging arm is fixedly connected to the grid plate, and the swinging transmission assembly drives the grid plate to reciprocate in the anode cavity.

[0013] Furthermore, a plurality of flow balancing holes are provided on the flow balancing plate, and the distances between the flow balancing holes are the same.

[0014] Furthermore, an electroplating method comprises the steps of:

[0015] S1, the rotating assembly drives the loading plate to flip 180 degrees from the horizontal state, positioning the product on the pressing plate, and the lifting cylinder presses the product between the pressing plate and the loading plate;

[0016] S2, flipping the product again by the rotating assembly and immersing the product in the electroplating solution in an oblique manner by the lifting assembly before flipping it back to its original position;

[0017] In step S3, the anode liquid inlet and cathode liquid inlet continue to inject liquid to spray the product. The swing component moves to eliminate bubbles in the water. At the same time, the rotating motor drives the material tray to rotate and electroplate the product.

[0018] S4, after the electroplating is completed, the lifting component rises back up and is turned 180 degrees again by the rotating component to take out the product.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] The present invention realizes the electrical connection of the wafer plate through a special electrical connector, which facilitates the fixation of the wafer plate, and completes the sealing by the cylinder and the wafer loading tray, replacing the traditional methods such as screw fastening;

[0021] The rotatable placing tray can achieve uniformity of product electroplating, improve the overall uniformity of the electroplating effect of the product, and the rotating motor can realize the forward and reverse speed rotation of the product, further improving the uniformity;

[0022] The cathode assembly can adjust the angle of the material tray before entering the liquid by rotating the assembly, so that the wafer plate is immersed in the electroplating solution in an oblique manner, reducing the accumulation of bubbles when the wafer plate is immersed in the electroplating solution and improving the electroplating quality;

[0023] The anode assembly realizes anode partition control through multiple ring-shaped anode liquid inlets, replacing the traditional single liquid inlet and improving the electroplating effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a three-dimensional diagram of the electrical connector of the present invention;

[0025] Figure 2 Schematic diagram of the main cross-section of the electrical connector of the present invention;

[0026] Figure 3 For the present invention Figure 2 A magnified view of point A;

[0027] Figure 4 is a perspective view of the electroplating device of the present invention;

[0028] Figure 5 This is a three-dimensional schematic diagram of the electroplating device of the present invention with the outer shell removed;

[0029] Figure 6 A top view of the anode assembly of the present invention;

[0030] Figure 7 It is a schematic top view of the partial structure of the anode assembly of the present invention;

[0031] Figure 8 Schematic cross-sectional view of the anode assembly of the present invention.

[0032] Reference numerals:

[0033] 1. Rotating motor; 2. Fixed seat; 3. Lifting cylinder; 4. Lifting connecting plate; 5. Loading tray; 6. Pressing tray; 7. Lifting positioning plate; 9. Electrical connection column; 10. Outer ring body; 11. Inner ring body; 12. Outer ring part; 13. Elastic connecting arm; 14. Elastic connecting head; 15. Loading chamber; 20. Cathode assembly; 30. Anode assembly; 21. Fixed frame; 22. Lifting assembly; 23. Rotating assembly; 24. Electrical connector; 31. Anode chamber; 32. Anode conductive rod; 33. Anode liquid inlet; 34. Ion membrane assembly; 35. Flow equalizing plate; 36. Overflow trough; 37. Drain port; 38. Cathode liquid inlet; 391. Annular partition; 392. Independent anode chamber; 393. Connecting trough; 311. Overflow gap; 351. Swing motor; 352. Swing arm; 353. Grid plate. DETAILED DESCRIPTION

[0034] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more precise definition of the protection scope of the present invention.

[0035] See also Figure 1-8 As shown, an electrical connector includes a rotating motor 1, a fixed seat 2, a lifting cylinder 3, a lifting connecting plate 4, a material placing disc 5, a material pressing disc 6, a lifting positioning disc 7 and an electrical connector body. The rotating motor 1 is fixedly installed at the center of the upper end surface of the fixed seat 2. The output end of the rotating motor 1 is fixedly connected to the material pressing disc 6. A freely rotatable rotating sleeve is set on the outer ring surface of the output end of the rotating motor 1. A lifting positioning disc 7 is fixedly installed on the outer ring surface of the rotating sleeve. A guide hole is opened on the lifting positioning disc 7, and an electrical connector is slidably installed in the guide hole. The electrical connecting column 9 is fixedly connected to the feeding tray 5 at the lower end of the electrical connecting column 9. The lifting connecting plate 4 includes an outer ring body 10 and an inner ring body 11. The outer ring body 10 and the inner ring body 11 are connected by a bearing. The outer ring body 10 is fixedly connected to the upper end of the electrical connecting column 9. The inner ring body 11 is fixedly connected to the output end of the lifting cylinder 3. The lifting cylinder 3 is fixedly installed on the fixed seat 2. The feeding tray 5 is embedded with an electrical connector body. One end of the electrical connector body extends out of the feeding tray 5, and the other end of the electrical connector body is electrically connected to the electrical connecting column 9.

[0036] The electrical connector body is annular and includes an outer ring portion 12, elastic connecting arms 13 and an elastic connecting head 14. The inner wall of the outer ring portion 12 is provided with a plurality of elastic connecting arms 13 integrally formed with the outer ring portion 12, and the ends of the elastic connecting arms 13 are provided with elastic connecting heads 14.

[0037] The material placement tray 5 is provided with a material placement cavity 15, and the lower end surface of the pressing tray 6 is provided with a protrusion matching the material placement cavity 15. A connecting groove is provided in the material placement cavity 15, and the connecting end of the electrical connector body and the product extends into the connecting groove.

[0038] A fully automatic device for horizontal electroplating of wafers includes a cathode assembly 20 and an anode assembly 30. The cathode assembly 20 includes a fixed frame 21, a lifting assembly 22, a rotating assembly 23 and an electrical connector 24. The lifting assembly 22 is fixedly installed on the fixed frame 21, and the rotating assembly 23 is installed on the lifting assembly 22. The output end of the rotating assembly 23 is fixedly installed with the electrical connector 24, and the electrical connector 24 is placed directly above the anode assembly 30. An anode cavity 31 is provided on the upper end surface of the anode assembly 30, and an anode conductive rod 32 and an anode liquid inlet 33 are fixedly provided at the bottom center of the anode cavity 31. An ion membrane assembly 34 is fixedly provided above the anode conductive rod 32, and a current equalizing plate 35 is installed above the ion membrane assembly 34. An overflow groove 36 is provided on the anode assembly 30 outside the upper end opening of the anode cavity 31, and a drain port 37 is fixedly provided in the overflow groove 36. A cathode liquid inlet 38 is fixedly provided on the side wall of the anode assembly 30 above the overflow groove 36.

[0039] An annular assembly is provided at the bottom of the anode cavity 31 , which includes a plurality of upright annular partitions 391 , forming a plurality of independent anode cavities 392 between the annular partitions 391 , and a connecting groove 393 is opened on the annular partition 391 , which connects the plurality of independent anode cavities 392 .

[0040] The independent anode cavity 392 contains a plurality of anode conductive rods 32 . The plurality of anode conductive rods 32 are respectively arranged in different independent anode cavities 392 , and each independent anode cavity 392 contains at least one anode conductive rod 32 .

[0041] A plurality of overflow notches 311 are provided at the connection between the anode cavity 31 and the overflow trough 36 . The overflow notches 311 are evenly distributed at the upper end of the anode cavity 31 .

[0042] A swing assembly is provided above the current equalizing plate 35, and the swing assembly includes a swing motor 351 fixedly mounted on the outer wall of the anode cavity 31. The swing motor 351 is connected to a swing transmission assembly, and the swing transmission assembly is provided with a swing arm 352. The swing arm 352 is fixedly connected to a grid plate 353. The swing transmission assembly drives the grid plate 353 to reciprocate in the anode cavity 31.

[0043] The flow balancing plate 35 is provided with a plurality of flow balancing holes, and the distances between the flow balancing holes are the same.

[0044] An electroplating method comprising the steps of:

[0045] S1, the rotating assembly 23 drives the loading plate to flip 180 degrees from the horizontal state, positioning the product on the pressing plate 6, and the lifting cylinder 3 presses the product between the pressing plate 6 and the placing plate 5;

[0046] S2, flip the product again by the rotating assembly 23 and immerse the product in the electroplating solution by the lifting assembly 22 in an oblique manner before flipping it back to its original position;

[0047] S3, the anode liquid inlet 33 and the cathode liquid inlet 38 continue to flow liquid to spray the product. The swing assembly moves to eliminate bubbles in the water. At the same time, the rotating motor 1 drives the material tray 5 to rotate and electroplate the product.

[0048] S4, after the electroplating is completed, the lifting component 22 rises back up and is turned 180 degrees again by the rotating component 23 to take out the product.

[0049] The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiment. Any equivalent modifications or changes made by ordinary technicians in this field based on the contents disclosed in the present invention should be included in the protection scope recorded in the claims.

Claims

1. An electrical connector, comprising a rotating motor (1), a fixing seat (2), a lifting cylinder (3), a lifting connecting plate (4), a material placing plate (5), a material pressing plate (6), a lifting positioning plate (7), an electrical connecting column (9) and an electrical connector body, characterized in that: A rotating motor (1) is fixedly mounted at the center of the upper end face of the fixed seat (2); a pressing plate (6) is fixedly connected to the output end of the rotating motor (1); a freely rotatable rotating sleeve is mounted on the outer ring face of the output end of the rotating motor (1); a lifting positioning plate (7) is fixedly mounted on the outer ring face of the rotating sleeve; a guide hole is provided on the lifting positioning plate (7); an electrical connection column (9) is slidably mounted in the guide hole; a material placing plate (5) is fixedly connected to the lower end of the electrical connection column (9); a lifting connecting plate (4) comprises an outer ring body (10) and an inner ring body (11); the outer ring body (10) and the inner ring body (11) are connected via a bearing; the outer ring body (10) and the electrical connection The upper end of the column (9) is fixedly connected, the inner ring body (11) is fixedly connected to the output end of the lifting cylinder (3), the lifting cylinder (3) is fixedly installed on the fixed seat (2), the material placement tray (5) is embedded with an electric connector body, one end of the electric connector body extends out of the material placement tray (5), and the other end of the electric connector body is electrically connected to the electric connection column (9); the electric connector body is annular, including an outer ring part (12), an elastic connecting arm (13) and an elastic connecting head (14), the inner wall of the outer ring part (12) is provided with a plurality of elastic connecting arms (13) integrally formed with the outer ring part (12), and the end of the elastic connecting arm (13) is provided with an elastic connecting head (14).

2. An electrical connector according to claim 1, characterized in that: The material placement disc (5) is provided with a material placement cavity (15), and the lower end surface of the pressing disc (6) is provided with a protrusion matching the material placement cavity (15). A connecting groove is provided in the material placement cavity (15), and the connecting end of the electrical connector body and the product extends into the connecting groove.

3. A fully automatic wafer-level electroplating device, characterized by: The invention comprises a cathode assembly (20) and an anode assembly (30), wherein the cathode assembly (20) comprises a fixed frame (21), a lifting assembly (22), a rotating assembly (23) and an electrical connector (24) as claimed in any one of claims 1 to 2, wherein the lifting assembly (22) is fixedly mounted on the fixed frame (21), the rotating assembly (23) is mounted on the lifting assembly (22), the output end of the rotating assembly (23) is fixedly mounted with an electrical connector (24), the electrical connector (24) is placed just above the anode assembly (30), and the upper end surface of the anode assembly (30) is provided with an anode The anode cavity (31) is provided with an anode conductive rod (32) and an anode liquid inlet (33) fixedly arranged at the bottom center of the anode cavity (31); an ion membrane assembly (34) is fixedly provided above the anode conductive rod (32); a flow balancing plate (35) is installed above the ion membrane assembly (34); an overflow groove (36) is provided on the anode assembly (30) outside the upper end opening of the anode cavity (31); a drain port (37) is fixedly provided in the overflow groove (36); and a cathode liquid inlet (38) is fixedly provided on the side wall of the anode assembly (30) above the overflow groove (36).

4. The fully automatic wafer-level electroplating device according to claim 3, characterized in that: An annular assembly is provided at the bottom of the anode cavity (31), the annular assembly comprising a plurality of upright annular partitions (391), a plurality of independent anode cavities (392) being formed between the annular partitions (391), and a connecting groove (393) is provided on the annular partitions (391), the connecting groove (393) connecting the plurality of independent anode cavities (392).

5. The fully automatic wafer-level electroplating device according to claim 4, characterized in that: The independent anode cavity (392) contains a plurality of anode conductive rods (32), the plurality of anode conductive rods (32) are respectively arranged in different independent anode cavities (392), and the number of anode conductive rods (32) arranged in each independent anode cavity (392) is not less than one.

6. The fully automatic wafer-level electroplating device according to claim 3, characterized in that: A plurality of overflow notches (311) are provided at the connection between the anode cavity (31) and the overflow trough (36), and the overflow notches (311) are evenly distributed at the upper end of the anode cavity (31).

7. The fully automatic wafer-level electroplating device according to claim 3, characterized in that: A swing assembly is provided above the current balancing plate (35), the swing assembly comprising a swing motor (351) fixedly mounted on the outer wall of the anode cavity (31), the swing motor (351) being connected to a swing transmission assembly, the swing transmission assembly being provided with a swing arm (352), the swing arm (352) being fixedly connected to a grid plate (353), and the swing transmission assembly driving the grid plate (353) to reciprocate in the anode cavity (31).

8. The fully automatic wafer-level electroplating device according to claim 3, characterized in that: The flow balancing plate (35) is provided with a plurality of flow balancing holes, and the distances between the flow balancing holes are the same.

9. An electroplating method according to any one of claims 3 to 8, characterized in that: Including steps: S1, the rotating assembly (23) drives the loading plate to turn 180 degrees from the horizontal state, positioning the product on the pressing plate (6), and the lifting cylinder (3) presses the product between the pressing plate (6) and the placing plate (5); S2, flipping the product again by the rotating assembly (23) and immersing the product in the electroplating solution by the lifting assembly (22) in a beveled manner before flipping it back to its original position; S3, the anode liquid inlet (33) continues to feed liquid, and the cathode liquid inlet (38) also continues to feed liquid to spray the product, the swing component moves to eliminate bubbles in the water body, and at the same time the rotating motor (1) drives the material tray (5) to rotate to electroplate the product; S4, after the electroplating is completed, the lifting assembly (22) rises back up and is turned over 180 degrees again by the rotating assembly (23) to take out the product.

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