Chip testing equipment

Abstract

The present application provides a chip testing device, comprising: a housing, at least one socket for a chip under test, a load board, a digital measurement board, and a heat sink; a first support structure is provided on the top of two opposing target side panels of the housing; the bottoms of the two first support structures are provided with support plates extending inwards, and the top and sides of the heat sink are provided with mounting plates extending outwards, the two mounting plates being overlapped one by one on the support plates of the two first support structures; the two sides of the digital measurement board are overlapped on the two mounting plates; the load board is overlapped on the top of the first support structure and electrically connected to the digital measurement board; the socket for the chip under test is mounted on the top of the load board, and the socket for the chip under test is used to place at least one chip under test. Through the design of the first support structure, the chip under test, the load board, the digital measurement board, and the heat sink form a stacked structure, which is more compact, can both ensure chip testing performance and save space occupied by the entire machine.

Description

Technical Field

[0001] The present application relates to the field of chip testing technology, and in particular to a chip testing device. Background Art

[0002] In the semiconductor testing process, semiconductor automatic test equipment (ATE), also known as test machines, are commonly used to test batches of chips under test.

[0003] In related technologies, multiple devices under test (DUTs) are typically loaded onto a load board via DUT sockets. This load board is then connected to the ATE's digital measurement board via pogo pins or cables. Because multiple DUTs are tested in parallel, and the DUTs have numerous pins and complex load board connections, the load board typically utilizes a multi-layer circuit board layout. Furthermore, the digital measurement board integrates numerous electronic components, necessitating considerations for heat dissipation.

[0004] Therefore, how to design chip testing equipment that integrates DUT, load board, digital measurement board, and heat dissipation device to save the space occupied by the entire machine and ensure chip testing performance has become an urgent problem that needs to be solved. Summary of the Invention

[0005] In view of this, an embodiment of the present application provides a chip testing device. Through the design of the first supporting structure, the chip under test, the load board, the digital measurement board and the heat sink form a stacked structure, which can not only ensure the chip testing performance but also save the space occupied by the entire machine.

[0006] In the first aspect, an embodiment of the present application provides a chip testing device, comprising: a shell, and at least one chip socket under test, a load board, a digital measurement board and a heat sink arranged in sequence along the height direction of the shell; a first supporting structure is respectively provided on the top of the two opposite target side plates of the shell; the bottoms of the two first supporting structures are respectively provided with support plates extending inward, and the top two sides of the heat sink are respectively provided with mounting plates extending outward, and the two mounting plates are overlapped on the support plates of the two first supporting structures in a one-to-one correspondence; the two sides of the digital measurement board are respectively overlapped on the two mounting plates; the load board is overlapped on the top of the first supporting structure and is electrically connected to the digital measurement board, the chip socket under test is installed on the top of the load board, and the chip socket under test is used to place at least one chip under test.

[0007] In some embodiments, the chip testing equipment also includes: a second support structure; the first support structure is a Z-shaped structure, the second support structure is a U-shaped structure, the second support structure is located on the side opposite to the support plate, and is arranged between the target side plate and the first support structure, one side of the second support structure is fixedly connected to the target side plate, and the other side is fixedly connected to the first support structure.

[0008] In some embodiments, the first support structure includes a first plate, a second plate, and the support plate connected in sequence, the first plate and the support plate extend in a horizontal direction, the second plate extends in a height direction of the housing, the load plate is overlapped on the first plate, and the heat sink and the digital measurement board are limited between the two second plates of the first support structure.

[0009] In some embodiments, the second support structure includes a third plate and a fourth plate arranged opposite to each other and a connecting plate connecting the third plate and the fourth plate, the third plate is located on a side close to the target side plate and is fixedly connected to the target side plate, and the fourth plate is located on a side close to the second plate and is fixedly connected to the second plate.

[0010] In some embodiments, the chip testing device further includes: a handle; the handle is disposed on the outer side of the target side plate, and the handle, the target side plate and the third plate body are fixedly connected by fasteners.

[0011] In some embodiments, the chip testing device further includes: at least two reinforcing ribs; the two ends of the reinforcing ribs are respectively overlapped on the top of the first support structure and fixedly connected to the two first support structures, and the load plate is overlapped on the first support structure through the reinforcing ribs.

[0012] In some embodiments, a notch is provided on the first supporting structure, and a connecting structure is provided at each end of the reinforcing rib. The connecting structure includes a first clamping platform, and the first clamping platform is clamped in the notch.

[0013] In some embodiments, the connection structure also includes a second card platform, and the first card platform and the second card platform are spaced apart to form a card slot between the first card platform and the second card platform, the second plate body of the first support structure and the fourth plate body of the second support structure are clamped in the card slot, the second card platform is exposed outside the first support structure, and the second card platform, the second plate body, the fourth plate body and the first card platform are fixedly connected by fasteners.

[0014] In some embodiments, the mounting plate protrudes from the top surface of the heat sink, the top surface of the heat sink is provided with a plurality of bosses, the bottom surface of the digital measurement board is provided with a plurality of components, the plurality of components are arranged in a one-to-one correspondence with the plurality of bosses, and a thermal pad is provided between the components and the bosses.

[0015] In some embodiments, the chip testing device further includes: at least one support column; a cavity is provided between the bottom of the heat dissipation block and the bottom plate of the housing, the support column is located in the cavity, and one end of the support column is fixedly provided on the bottom plate of the housing, and the other end of the support column abuts against the bottom of the heat dissipation block.

[0016] In some embodiments, the chip testing equipment further includes: at least one cooling fan; the heat dissipation block includes a plurality of cooling fins, a cooling gap is provided between two adjacent cooling fins, and the air outlet direction of the cooling fan is parallel to the extension direction of the cooling gap.

[0017] In some embodiments, at least one of the heat dissipation fans is installed on one of the target side panels, and at least one heat dissipation hole is provided on the other target side panel.

[0018] In some embodiments, when there are multiple cooling fans, the multiple cooling fans are respectively installed on the two target side panels, the cooling fan on one of the target side panels is used to introduce external air into the outer casing, and the cooling fan on the other target side panel is used to discharge the air in the outer casing to the outside.

[0019] The present application provides a chip testing device, comprising: a housing, and at least one chip socket under test, a load board, a digital measurement board, and a heat sink arranged in sequence along the height direction of the housing; a first support structure is provided on the top of the two opposite target side panels of the housing; the bottoms of the two first support structures are respectively provided with support plates extending inwards, and the top two sides of the heat sink are respectively provided with mounting plates extending outwards, and the two mounting plates are overlapped on the support plates of the two first support structures in a one-to-one correspondence; the two sides of the digital measurement board are overlapped on the two mounting plates; the load board is overlapped on the top of the first support structure and electrically connected to the digital measurement board, the chip socket under test is mounted on the top of the load board, and the chip socket under test is used to place at least one chip under test. Through the design of the first support structure, the chip under test, the load board, the digital measurement board, and the heat sink form a stacked structure, which is more compact, can not only ensure the chip test performance, but also save the space occupied by the whole machine, making the space of the whole machine structure relatively reasonable. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 An exploded diagram of a chip testing device provided in the first embodiment of the present application;

[0022] Figure 2 An assembly diagram of a chip testing device provided in the first embodiment of the present application;

[0023] Figure 3 This is a schematic diagram of the structure of the chip testing device provided in the first embodiment of the present application;

[0024] Figure 4 for Figure 3 The main view;

[0025] Figure 5 A schematic diagram of the connection between the first supporting structure, the second supporting structure, and the reinforcing ribs provided in the first embodiment of the present application;

[0026] Figure 6 for Figure 5 sectional view of

[0027] Figure 7 This is a second structural diagram of the chip testing device provided in the first embodiment of the present application;

[0028] Figure 8 for Figure 7 A partial enlarged view of

[0029] Figure 9 An assembly diagram of a chip testing device provided in the second embodiment of the present application;

[0030] Figure 10 This is a schematic diagram of the electrical performance connections of the chip testing equipment provided in the first embodiment of the present application.

[0031] Reference numerals:

[0032] 01-housing; 10-target side panel; 11-test chip socket; 12-load board; 13-digital measurement board; 14-heat sink; 15-first support structure; 16-support column; 17-base plate; 18-cooling fan; 19-handle; 20-reinforcement rib; 21-second support structure;

[0033] 1-first card platform; 2-second card platform; 3-card slot; 102-heat dissipation hole; 121-first connector; 131-second connector; 132-component; 141-mounting plate; 142-boss; 143-heat dissipation fin; 151-support plate; 152-first plate body; 153-second plate body; 154-slot; 201-connection structure; 203-fastener; 211-connecting plate; 212-fourth plate body; 213-third plate body. DETAILED DESCRIPTION

[0034] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort shall fall within the scope of protection of the present invention.

[0036] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not require further definition or explanation in subsequent drawings.

[0037] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" and the like indicate positions or locations based on the positions shown in the accompanying drawings, or the positions or locations in which the inventive product is typically placed when in use. These terms are intended solely to facilitate the description of the present invention and to simplify the description, and are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third," etc., are used solely to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0038] Furthermore, terms such as "horizontal" and "vertical" do not necessarily mean that a component must be absolutely horizontal or overhanging, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.

[0039] In the description of the present invention, it should also be noted that, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections or electrical connections; they may refer to direct connections or indirect connections through an intermediate medium; and they may refer to internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0040] See also Figures 1 to 10 The chip testing equipment includes: a shell 01, and at least one chip socket 11 under test, a load board 12, a digital measurement board 13 and a heat sink 14 arranged in sequence along the height direction of the shell 01. A first supporting structure 15 is respectively provided on the top of the two opposite target side plates 10 of the shell 01.

[0041] The housing 01 may be a cubic structure as shown, with an internal storage space. The housing 01 includes at least a bottom plate 17 and four side plates. The two opposing side plates 10 of the housing 01 are oppositely disposed side plates of the housing 01. For example, the two opposing side plates 10 may be disposed along the length of the housing 01, or along the width of the housing 01. This is not particularly limited.

[0042] Among them, a first supporting structure 15 is provided on the top of each target side plate 10, and a support plate 151 extending inward is provided at the bottom of the two first supporting structures 15. The inward extension refers to the extension toward the side away from the target side plate 10. The top two sides of the heat sink 14 are respectively provided with a mounting plate 141 extending outward. The outward extension refers to the extension toward the side close to the target side plate 10. The two mounting plates 141 are overlapped on the support plates 151 of the two first supporting structures 15 in a one-to-one correspondence. The two sides of the digital measurement board 13 are overlapped on the two mounting plates 141, so that the digital measurement board 13 and the heat sink 14 are sequentially arranged at the bottom of the first supporting structure 15. The mounting plate 141 and the support plate 151 can be reinforced by screws to improve the stability of the connection between the mounting plate 141 and the support plate 151.

[0043] It is worth noting that the digital measurement board 13 integrates numerous components 132, such as chips, resistors, capacitors, etc. During operation, these components 132 generate heat due to the passage of current. For example, the microprocessor, power management device, memory, analog-to-digital conversion chip, digital-to-analog conversion chip, etc. on the digital measurement board 13 will experience power loss during signal conversion, data processing, and control operations, which in turn is converted into heat. If this heat cannot be dissipated in a timely manner, it will cause the temperature of the digital measurement board 13 to rise, affecting the chip test performance. Based on this, the heat sink 14 provided in this embodiment can be used to conduct the temperature of the digital measurement board 13 to dissipate heat from the digital measurement board 13, ensure chip test performance, and avoid overheating of the digital measurement board 13, which may lead to abnormal chip test performance.

[0044] Load board 12 is attached to the top of first support structure 15 and electrically connected to digital measurement board 13. A chip-under-test (DUT) socket 11 is mounted on top of load board 12 and is used to hold at least one DUT. DUT socket 11 is exposed at the top of housing 01, making it easier for an operator to place a DUT on it.

[0045] At least one chip under test is electrically connected to a load board 12 via a chip under test socket 11. For example, after the chip under test is plugged into the chip under test socket 11, the chip under test socket 11 can be electrically connected to the load board 12 via spring pins or cables. The load board 12 is electrically connected to the digital measurement board 13.

[0046] See also Figure 1 In some embodiments, the heat sink 14 includes a plurality of heat sinks 14 arranged in parallel. As the number of heat sinks 14 increases, the heat dissipation effect of the digital measurement board 13 becomes better. Of course, the number of heat sinks 14 should not be too many to avoid increasing the size of the device. Figure 1 Taking two heat dissipation blocks 14 as an example, but not limited thereto, those skilled in the art should be able to make reasonable designs according to actual needs.

[0047] See also Figure 4 and Figure 7 The bottom surface of the load board 12 may be provided with at least one first connector 121 (two first connectors 121 are shown in the figure), see Figure 1 、 Figure 4 and Figure 7 The top surface of the digital measurement board 13 may be provided with a second connector 131 (two second connectors 131 are shown in the figure) that matches the at least one first connector 121, wherein the first connector 121 and the second connector 131 may be interconnected through pins and sockets to realize electrical connection between the digital measurement board 13 and the load board 12, thereby achieving efficient signal transmission between the digital measurement board 13 and the load board 12.

[0048] like Figure 10 As shown, the chip under test socket 11 is used to place the chip under test, so that the chip under test is electrically connected to the load board 12 through the chip under test socket 11. The load board 12 is used to carry and connect the chip under test socket 11. The chip under test socket 11 provides a loading platform for the chip under test, thereby ensuring that the chip under test can be prepared and fixed in a specific position. At the same time, the load board 12 is electrically connected to the digital measurement board 13, so that the test excitation signal generated by the digital measurement board 13 can be accurately transmitted to the chip under test, and the response signal of the chip under test can also be fed back to the digital measurement board 13 to realize the test of the chip under test.

[0049] like Figure 9 As shown, the load board 12 can also be used to implement parallel testing. Since the load board 12 can load multiple chip sockets 11 under test at the same time, multiple chip sockets 11 under test can be tested at the same time, which greatly improves the test efficiency and meets the demand for rapid testing of large quantities of chips during semiconductor mass production, helping to reduce test costs and shorten test cycles.

[0050] The digital measurement board 13 is used to provide test excitation signals. The digital measurement board 13 can generate digital signals of various types, frequencies, amplitudes, and timings, which are applied to the chip under test as test excitation signals. These test excitation signals simulate the input signals of the chip under test in actual operation and are used to stimulate various functions and operations of the chip under test to verify whether its functions are normal.

[0051] In some embodiments, the number of the chip sockets 11 under test can be one or more. Figure 1 and Figure 2 , the number of the chip socket 11 under test is one, see Figure 9 In some embodiments, there are multiple chip sockets 11 under test (four are shown in the figure, but not limited to this).

[0052] It is understandable that if the area occupied by the load plate 12 does not completely enclose the top of the housing 01, Figure 1 As shown, multiple boards can be fixed around the load board 12 to fill the hollow area on the top of the shell 01, so that the chip testing equipment forms a completely closed cubic structure, thereby protecting the internal components from water and dust.

[0053] In this embodiment, a first support structure 15 is used to support the load board 12 and the heat sink 14. The chip socket 11 under test is placed on the load board 12, and the digital measurement board 13 is placed on the heat sink 14. Therefore, the first support structure 15 is equivalent to indirectly supporting the chip socket 11 under test and the digital measurement board 13. Therefore, through the design of the first support structure 15, the chip under test, the load board 12, the digital measurement board 13 and the heat sink 14 form a stacked structure. This structure is more compact, which can not only ensure the chip test performance, but also save the space occupied by the entire machine, making the space of the entire machine structure relatively reasonable.

[0054] See also Figure 1 、 Figures 3 to 8 In some embodiments, the chip testing equipment further includes: a second support structure 21, the first support structure 15 is a Z-shaped structure, the second support structure 21 is a U-shaped structure, the second support structure 21 is located on the side opposite to the support plate 151, and is arranged between the target side plate 10 and the first support structure 15, one side of the second support structure 21 is fixedly connected to the target side plate 10, and the other side is fixedly connected to the first support structure 15, so as to support the first support structure 15 through the second support structure 21, thereby improving the deformation resistance of the first support structure 15.

[0055] Among them, the first support structure 15 is a Z-shaped structure. For example, the first support structure 15 includes a first plate body 152, a second plate body 153 and a support plate 151 connected in sequence. The first plate body 152 and the support plate 151 can extend in the horizontal direction to serve as a support plane. The second plate body 153 can extend in the height direction of the shell 01. The load plate 12 is overlapped on the first plate body 152. The heat sink 14 and the digital measurement board 13 are limited between the second plates 153 of the two first support structures 15. This limiting setting prevents the heat sink 14 and the digital measurement board 13 from shaking in the cavity formed by the shell 01.

[0056] Among them, the second support structure 21 is a U-shaped structure. For example, the second support structure 21 includes a third plate body 213 and a fourth plate body 212 arranged relatively to each other and a connecting plate 211 connecting the third plate body 213 and the fourth plate body 212, wherein the third plate body 213 and the fourth plate body 212 can extend along the height direction of the shell 01, and the connecting plate 211 can extend along the horizontal direction to play a connecting role. The third plate body 213 is located on the side close to the target side plate 10 and is fixedly connected to the target side plate 10. The fourth plate body 212 is located on the side close to the second plate body 153 and is fixedly connected to the second plate body 153. In this way, the first support structure 15 can be supported by the second support structure 21, thereby improving the deformation resistance of the first support structure 15.

[0057] For example, in this embodiment, the connecting plate 211 is disposed opposite the first plate 152, so that the target side plate 10 (or the third plate 213), the first plate 152, the second plate 153 (or the fourth plate 212), and the connecting plate 211 together form a closed structure similar to a square tube, thereby improving the deformation resistance of the first support structure 15. Of course, in other embodiments, the connecting plate 211 and the first plate 152 can also be disposed on the same side, and the first support structure 15 can also be supported by the second support structure 21. In comparison, the design scheme in which the connecting plate 211 and the first plate 152 are disposed opposite each other provides a better support function.

[0058] The third plate 213 is fixedly connected to the target side plate 10, and the fourth plate 212 is fixedly connected to the second plate 153. This can be achieved by bonding, welding, or by fasteners 203 (such as screws) that pass through the two adjacent plates in sequence. For example, in this embodiment, to facilitate the fixed connection between the first support structure 15 and the second support structure 21, a connection method in which fasteners 203 are assembled to the two adjacent plates is adopted. The third plate 213 is fixedly connected to the target side plate 10 by fasteners 203 that pass through the target side plate 10 and the third plate 213 in sequence from the outside to the inside. The fourth plate 212 is fixedly connected to the second plate 153 by fasteners 203 that pass through the second plate 153 and the fourth plate 212 in sequence from the inside to the outside, so as to facilitate installation and removal between the two.

[0059] In this embodiment, the second support structure 21 further reinforces the housing 01 (or the target side plate 10) and the first support structure 15, thereby preventing deformation of the first support structure 15. The first support structure 15 provides stable and reliable support for the load board 12, the digital measurement board 13, and the heat sink 14, thereby preventing problems such as deterioration of chip test performance or malfunction of the chip test equipment.

[0060] See also Figure 1 、 Figure 2 、 Figures 7 to 9 In some embodiments, the chip testing device further includes: a handle 19 , which is disposed on the outside of the target side plate 10 , and the handle 19 , the target side plate 10 , and the third plate 213 of the second support structure 21 are fixedly connected by a fastener 203 .

[0061] Optionally, a handle 19 may be provided on the outside of each of the two target side panels 10, that is, a total of two handles 19 are provided, both of which are provided on the outside of the target side panel 10, and each handle 19 is fixedly connected to the corresponding target side panel 10 and the third plate body 213 via a fastener 203. For example, the handle 19 is connected to the target side panel 10 and the third plate body 213 located on the same side via a screw. The advantage of this design is that the handle 19 can be installed on the outside of the housing 01 and the target side panel 10 and the third plate body 213 can be fixedly connected. Moreover, because the installation of the handle 19 and the fixed connection of the target side panel 10 and the third plate body 213 share the same fastener 203, the number of fasteners 203 (or screw holes) that can be observed from the outside of the housing 01 can be reduced.

[0062] In some embodiments, at least one handle 19 may be provided on any target side panel 10. Alternatively, at least one handle 19 may be provided on two side panels of the housing 01 other than the target side panel 10. Regardless of the layout, the provision of handles 19 on the housing 01 facilitates movement of the chip testing device, and an operator can adjust the actual position of the chip testing device by gripping the handles 19.

[0063] See also Figure 1 、 Figures 3 to 8 In some embodiments, the chip testing device further includes: at least two reinforcing ribs 20, the two ends of the reinforcing ribs 20 are respectively overlapped on the top of the first support structure 15 and fixedly connected to the two first support structures 15, and the load plate 12 is overlapped on the first support structure 15 through the reinforcing ribs 20.

[0064] Among them, the reinforcing ribs 20 span the two first supporting structures 15. On the one hand, they are used to support the load board 12, and on the other hand, they are used to reinforce the overall structure of the chip testing equipment (or the shell 01), so that the overall structural stability of the chip testing equipment is better to avoid overall structural instability. For example, when the overall weight of the load board 12, the chip socket 11 under test installed on the load board 12, and the chip under test placed on the chip socket 11 under test is heavy, the shell 01 and the first supporting structure 15 are deformed, thereby causing the test performance of the chip to deteriorate or the chip testing equipment to malfunction, affecting the normal use of the equipment.

[0065] See also Figure 1 and Figure 5 In some embodiments, a slot 154 is provided on the first supporting structure 15 , and connecting structures 201 are provided at both ends of the reinforcing rib 20 . The connecting structure 201 includes a first clamping platform 1 , which is clamped in the slot 154 to fix the reinforcing rib 20 to the first supporting structure 15 .

[0066] Furthermore, the connecting structure 201 also includes a second card platform 2, and the first card platform 1 and the second card platform 2 are arranged at intervals to form a card slot 3 between the first card platform 1 and the second card platform 2. The second plate body 153 of the first support structure 15 is clamped in the card slot 3, and the second card platform 2 is exposed outside the first support structure 15 so that the reinforcement rib 20 and the first support structure 15 form a mortise and tenon structure. The second card platform 2, the second plate body 153 and the first card platform 1 are fixedly connected by fasteners 203 to further improve the stability and reliability of the connection between the reinforcement rib 20 and the first support structure 15.

[0067] Furthermore, the second plate 153 of the first support structure 15 and the fourth plate 212 of the second support structure 21 are both engaged within the slot 3, with the second clamping platform 2 exposed outside the first support structure 15, so that the reinforcing rib 20 and the first support structure 15 form a mortise-and-tenon structure. The second clamping platform 2, the second plate 153, the fourth plate 212, and the first clamping platform 1 are fixedly connected via fasteners 203, further improving the stability and reliability of the connection between the reinforcing rib 20 and the first support structure 15. The fasteners 203 can be inserted from one side of the second clamping platform 2 and fixed within the second plate 153, the fourth plate 212, and the first clamping platform 1 at once, facilitating installation and removal of the aforementioned parts.

[0068] See also Figure 1 and Figure 8 In some embodiments, the mounting plate 141 protrudes from the top surface of the heat sink 14 , and the top surface of the heat sink 14 is provided with a plurality of bosses 142 . The bottom surface of the digital measurement board 13 is provided with a plurality of components 132 . The plurality of components 132 are arranged in a one-to-one correspondence with the plurality of bosses 142 , and a thermal pad is provided between the components 132 and the bosses 142 .

[0069] The digital measurement board 13 is placed on the heat sink 14 , with components 132 corresponding to the bosses 142 in a one-to-one relationship. A thermal pad is provided between the components 132 and the bosses 142 . The bosses 142 are used to support the digital measurement board 13 . The thermal pad between the components 132 and the bosses 142 can increase the heat exchange area between the components 132 and the bosses 142 while preventing direct hard contact between the components 132 and the bosses 142 that could affect chip testing. The components 132 on the digital measurement board 13 may include a microprocessor, a power management device, a memory, an analog-to-digital conversion chip, a digital-to-analog conversion chip, capacitors, inductors, resistors, and the like.

[0070] In some embodiments, the shapes of the plurality of bosses 142 may be the same or different, such as cubes, cylinders, etc., and the distances between adjacent bosses 142 may be equal or different, as long as there is a one-to-one correspondence between the bosses 142 and the components 132. This embodiment does not impose any particular restrictions on the shape of the bosses 142 or the distances between adjacent bosses 142. The thermal pad may be made of a material with a certain degree of flexibility and good thermal conductivity, such as PE.

[0071] See also Figure 1 、 Figure 3 、 Figure 4 and Figure 7 In some embodiments, the chip testing device further includes: at least one support column 16, a cavity is provided between the bottom of the heat dissipation block 14 and the bottom plate 17 of the housing 01, the support column 16 is located in the cavity, and one end of the support column 16 is fixedly provided on the bottom plate 17 of the housing 01, and the other end of the support column 16 abuts against the bottom of the heat dissipation block 14.

[0072] Among them, a cavity is formed between the bottom of the heat sink 14 and the bottom plate 17 of the shell 01, and the support column 16 is located in the cavity. The support column 16 is used to support the heat sink 14. That is to say, the chip under test, the chip under test socket 11, the load board 12, the digital measurement board 13, the heat sink 14 and the support column 16 are stacked from top to bottom along the height direction of the shell 01. The cavity is used to accelerate the air circulation in the chip testing equipment, speed up the cooling of the heat sink 14, and further help to improve the heat dissipation effect of the digital measurement board 13.

[0073] See also Figure 1 、 Figure 3 and Figure 9 In some embodiments, the chip testing device further includes: at least one cooling fan 18, the heat sink 14 includes a plurality of cooling fins 143, and a cooling gap is provided between two adjacent cooling fins 143. The air outlet direction of the cooling fan 18 is parallel to the extension direction of the cooling gap, so that the airflow blown out by the cooling fan 18 is along the extension direction of the cooling gap to take away the heat on the cooling fins 143.

[0074] For example, Figure 1 、 Figure 2 and Figure 9 As shown, at least one cooling fan 18 is installed on one of the target side panels 10 , and at least one cooling hole 102 is provided on the other target side panel 10 .

[0075] One of the two target side panels 10 is provided with a fan mounting hole, and a cooling fan 18 is installed in the fan mounting hole. The airflow from the cooling fan 18 accelerates the cooling of the heat sink 14, further improving the heat dissipation effect of the digital measurement board 13. The number of cooling fans 18 includes but is not limited to one, and for example, three cooling fans 18 can be arranged side by side.

[0076] Among them, the other target side plate 10 of the two target side plates 10 is provided with at least one heat dissipation hole 102, such as a honeycomb hole, and the heat dissipation hole 102 is used to accelerate the circulation with the outside air, speed up the cooling of the heat dissipation block 14, and further fully dissipate heat for the digital measurement board 13.

[0077] It is worth noting that by dissipating heat for the digital measurement board 13 , the test performance of the chip can be guaranteed, and the situation in which the digital measurement board 13 is overheated and causes abnormal chip test performance can be avoided.

[0078] It is understandable that any side panel of the housing 01 (including the target side panel 10 ) may also be provided with switch components, data interfaces, etc. of the chip testing equipment.

[0079] When there are multiple cooling fans 18, the multiple cooling fans 18 can be installed on the two target side panels 10 respectively, wherein the cooling fan 18 on one target side panel 10 is used to introduce outside air into the shell 01, and the cooling fan 18 on the other target side panel 10 is used to discharge the air in the shell 01 outward, so as to enhance the exchange effect of the cooling fan 18 on the air in the shell 01 and the air in the external environment, accelerate the circulation between the air and the outside air, speed up the cooling of the heat sink 14, and thus fully dissipate heat for the digital measurement board 13.

[0080] In the chip testing device provided in this embodiment, the first support structure 15 is used to support the load board 12 and the heat sink 14. The chip socket 11 under test is placed on the load board 12, and the digital measurement board 13 is placed on the heat sink 14. Therefore, the first support structure 15 is equivalent to indirectly supporting the chip socket 11 under test and the digital measurement board 13. Through the design of the first support structure 15, the chip under test, the load board 12, the digital measurement board 13 and the heat sink 14 form a stacked structure. This structure is more compact, which can not only ensure the chip test performance, but also save the space occupied by the entire machine, making the space of the entire machine structure relatively reasonable. In addition, the first support structure 15 is arranged on the shell 01, and the shell 01 and the first support structure 15 are reinforced by the second support structure 21 to prevent the first support structure 15 from being deformed. The reinforcing ribs 20 further reinforce the overall structure of the shell 01 to prevent the overall structure of the shell 01 from being deformed, which may cause the connection between the load board 12 and the digital measurement board 13 to be misaligned, thereby causing problems such as poor chip test performance or malfunction of the chip automatic test equipment. In addition, the heat dissipation structure of the entire machine includes the heat sink 14, the cavity, the heat dissipation fan 18 and the heat dissipation holes 102 provided on the shell 01, which fully dissipate the heat for the digital measurement board 13, ensure the chip test performance, and avoid the digital measurement board 13 overheating and causing abnormal chip test performance.

[0081] The foregoing description is merely an optional embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

[0082] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any appropriate manner without contradiction. In order to avoid unnecessary repetition, the present invention will not further describe various possible combinations.

Claims

1. A chip testing device, characterized in that: include: A housing, and at least one chip socket under test, a load board, a digital measurement board, and a heat sink are sequentially arranged along the height direction of the housing; a first supporting structure is respectively provided on the top of two target side plates of the housing; The bottoms of the two first support structures are respectively provided with inwardly extending support plates, and the top sides of the heat sink are respectively provided with outwardly extending mounting plates, and the two mounting plates are overlapped on the support plates of the two first support structures in a one-to-one correspondence; the two sides of the digital measurement board are respectively overlapped on the two mounting plates; The load board is overlapped on the top of the first supporting structure and is electrically connected to the digital measurement board. The chip under test socket is installed on the top of the load board. The chip under test socket is used to place at least one chip under test. The chip testing equipment further includes: a second supporting structure; The first supporting structure is a Z-shaped structure, and the second supporting structure is a U-shaped structure. The second supporting structure is located on the side opposite to the supporting plate and is arranged between the target side plate and the first supporting structure. One side of the second supporting structure is fixedly connected to the target side plate, and the other side is fixedly connected to the first supporting structure.

2. The chip testing device according to claim 1, characterized in that: The first supporting structure includes a first plate, a second plate, and the supporting plate connected in sequence. The first plate and the supporting plate extend in a horizontal direction, the second plate extends in a height direction of the housing, the load plate is overlapped on the first plate, and the heat sink and the digital measurement board are limited between the two second plates of the first supporting structure.

3. The chip testing device according to claim 2, characterized in that: The second supporting structure includes a third plate and a fourth plate arranged opposite to each other and a connecting plate connecting the third plate and the fourth plate. The third plate is located on a side close to the target side plate and is fixedly connected to the target side plate. The fourth plate is located on a side close to the second plate and is fixedly connected to the second plate.

4. The chip testing device according to claim 3, characterized in that: The chip testing device further includes a handle; the handle is arranged on the outer side of the target side plate, and the handle, the target side plate and the third plate body are fixedly connected by fasteners.

5. The chip testing device according to claim 1, characterized in that: The chip testing device further includes: at least two reinforcing ribs; Two ends of the reinforcing rib are respectively overlapped on the top of the first supporting structure and fixedly connected to the two first supporting structures. The load plate is overlapped on the first supporting structure through the reinforcing rib.

6. The chip testing device according to claim 5, characterized in that: The first supporting structure is provided with a notch, and both ends of the reinforcing rib are respectively provided with a connecting structure, and the connecting structure includes a first clamping platform, and the first clamping platform is clamped in the notch.

7. The chip testing device according to claim 6, characterized in that: The connecting structure also includes a second card platform, and the first card platform and the second card platform are spaced apart to form a card slot between the first card platform and the second card platform. The second plate body of the first supporting structure and the fourth plate body of the second supporting structure are clamped in the card slot, and the second card platform is exposed outside the first supporting structure. The second card platform, the second plate body, the fourth plate body and the first card platform are fixedly connected by fasteners.

8. The chip testing device according to claim 1, characterized in that: The mounting plate protrudes from the top surface of the heat sink block, and the top surface of the heat sink block is provided with a plurality of bosses. The bottom surface of the digital measurement board is provided with a plurality of components, and the plurality of components are arranged in a one-to-one correspondence with the plurality of bosses, and a thermal pad is provided between the components and the bosses.

9. The chip testing device according to claim 1, characterized in that: The chip testing device further includes: at least one supporting column; There is a cavity between the bottom of the heat dissipation block and the bottom plate of the shell. The support column is located in the cavity, and one end of the support column is fixedly arranged on the bottom plate of the shell, and the other end of the support column abuts against the bottom of the heat dissipation block.

10. The chip testing device according to claim 1, characterized in that: The chip testing equipment further includes: at least one cooling fan; the cooling block includes a plurality of cooling fins, a cooling gap is provided between two adjacent cooling fins, and the air outlet direction of the cooling fan is parallel to the extension direction of the cooling gap.

11. The chip testing device according to claim 10, characterized in that: At least one of the heat dissipation fans is installed on one of the target side panels, and at least one heat dissipation hole is provided on the other target side panel.

12. The chip testing device according to claim 10, characterized in that: When there are multiple cooling fans, the multiple cooling fans are respectively installed on the two target side panels, the cooling fan on one of the target side panels is used to introduce external air into the outer shell, and the cooling fan on the other target side panel is used to discharge the air in the outer shell to the outside.

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