Wafer positioning-based rotary base monitoring method, device and medium

Abstract

The application discloses a wafer positioning-based rotary base monitoring method and device and a medium, relates to the technical field of semiconductor preparation, and comprises the following steps: acquiring real-time pressure data of a multi-axis piezoelectric sensor, performing finite element analysis of the real-time pressure data through a stiffness matrix, and obtaining rotary base clamp root stress data; based on preset rotary base clamp jaw deformation parameters, real-time deformation variable inversion is performed to determine rotary base clamp jaw body stress data; the rotary base clamp stress data and the jaw body stress data are time-synchronously processed to obtain rotary base real-time stress parameters; the rotary base real-time stress parameters are subjected to abnormal threshold determination to determine a rotary base abnormal state; the rotary base abnormal state is uploaded to a preset closed-loop controller, and an abnormal rotary base alarm signal is sent through the closed-loop controller. The application solves the technical problem of preparation precision reduction of a wafer in a wet preparation process.

Description

Technical Field

[0001] This application relates to the field of semiconductor fabrication technology, and in particular to a method, device and medium for monitoring a rotating base based on wafer positioning. Background Technology

[0002] In semiconductor manufacturing processes, wafer clamping systems are core devices that ensure the uniformity of processes such as thin film deposition, etching, and polishing. As advanced processes advance to nodes of 3nm and below, wafer sizes increase (e.g., 300mm / 450mm) and thicknesses decrease (<100μm), significantly increasing the requirements for the dynamic stability and thermomechanical compatibility of clamping systems.

[0003] During the rotation of the rotating base, uneven centrifugal distribution can cause the wafer and wafer grippers to undergo periodic force shifts. When there are significant temperature changes during the manufacturing process, stress distortion can occur at the interface between the materials and the equipment, leading to wafer damage or reduced fabrication precision. Summary of the Invention

[0004] This application provides a method, device, and medium for monitoring a rotating base based on wafer positioning, which solves the technical problem of decreased wafer fabrication accuracy during wet fabrication.

[0005] In a first aspect, embodiments of this application provide a method for monitoring a rotating base based on wafer positioning. The method includes: acquiring real-time pressure data from a multi-axis piezoelectric sensor and performing finite element analysis of the stiffness matrix on the real-time pressure data to obtain force data at the root of the rotating base fixture; determining the force data of the rotating base fixture claw body through real-time deformation inversion based on preset rotating base claw deformation parameters; synchronizing the rotating base fixture force data and claw body force data in a time sequence to obtain real-time force parameters of the rotating base; determining an abnormal threshold for the real-time force parameters of the rotating base to identify an abnormal state of the rotating base; uploading the abnormal state of the rotating base to a preset closed-loop controller, and issuing an abnormal alarm signal for the rotating base through the closed-loop controller.

[0006] In one implementation of this application, finite element analysis of the stiffness matrix is ​​performed on real-time pressure data to obtain the root force data of the rotating base fixture. Specifically, this includes: performing static calibration analysis on the real-time pressure data to obtain static calibration data of the rotating base; wherein the static calibration analysis includes: pressure curve fitting and cross-validation; performing dynamic calibration analysis on the real-time pressure data to obtain dynamic calibration data of the rotating base; wherein the dynamic calibration data includes: time-domain verification and dynamic error compensation; determining the root stiffness matrix of the rotating base fixture through stiffness matrix construction; and inverting the root stiffness matrix of the rotating base fixture based on the static calibration data and the dynamic calibration data of the rotating base fixture to obtain the root force data of the rotating base fixture.

[0007] In one implementation of this application, based on preset deformation parameters of the rotating base gripper, the force data of the rotating base gripper gripper body is determined through real-time deformation inversion. Specifically, this includes: modeling the bending state of the deformation parameters of the rotating base gripper to obtain a bending model of the rotating base gripper gripper body; dividing the bending model of the rotating base gripper gripper body into a region mesh and applying boundary condition constraints to the region mesh corresponding to the bending model of the rotating base gripper gripper body to obtain bending simulation data of the rotating base gripper gripper body; and determining the force data of the rotating base gripper gripper body through parameter self-optimization FEA simulation based on the bending simulation data.

[0008] In one implementation of this application, the force data of the rotating base fixture and the force data of the claw are synchronized in time to obtain the real-time force parameters of the rotating base. Specifically, this includes: acquiring the global clock signal of the force data of the rotating base fixture and the force data of the claw, and performing differential compensation on the global clock signal to obtain the rotating base time data; synchronizing the rotating base time data with timestamps to obtain the rotating base synchronized time data; and performing adaptive noise suppression on the rotating base synchronized time data to obtain the real-time force parameters of the rotating base. The adaptive noise suppression includes Kalman filtering and dynamic parameter adjustment.

[0009] In one implementation of this application, periodic fixed-point force determination is performed on the real-time force parameters of the rotating base to determine the abnormal state of the rotating base. Specifically, this includes: calibrating abnormal points on the real-time force parameters of the rotating base to obtain abnormal force points; determining the true abnormal force points based on the abnormal force points through symmetrical equilibrium point analysis; wherein, the symmetrical equilibrium point analysis includes: symmetrical gripper force balance analysis and asymmetrical gripper resultant force balance analysis; and determining the abnormal threshold of the force data corresponding to the true abnormal force points to determine the abnormal state of the rotating base.

[0010] In one implementation of this application, the abnormal state of the rotating base is uploaded to a preset closed-loop controller, and an abnormal alarm signal for the rotating base is issued through the closed-loop controller. Specifically, this includes: determining the abnormal stage of the abnormal state of the rotating base to obtain an abnormal alarm stage; issuing a first abnormal alarm signal for the rotating base when the abnormal alarm stage is in the first alarm stage; issuing a second abnormal alarm signal for the rotating base when the abnormal alarm stage is in the second alarm stage; and determining the abnormal alarm signal for the rotating base based on the first or second abnormal alarm signal for the rotating base.

[0011] In one implementation of this application, after uploading the abnormal state of the rotating base to a preset closed-loop controller and issuing an abnormal alarm signal for the rotating base through the closed-loop controller, the method further includes: if the device state corresponding to the alarm signal is determined to be adaptive adjustment, determining the clamping steady-state adjustment parameters through wafer offset adjustment analysis; if the device state corresponding to the alarm signal is determined to be abnormal, querying the fixture abnormal point and setting the clamping jaws corresponding to the fixture abnormal point to a temporary disabled state; and redistributing the adjacent angles of the remaining clamping jaws (excluding those in the temporary disabled state) to determine the adaptive working state of the clamping jaws.

[0012] In one implementation of this application, the adjacent angles of the remaining grippers (excluding those in a temporarily disabled state) are redistributed to determine the adaptive working state of the grippers. Specifically, this includes: obtaining the current number of grippers on the rotating base and using the current number of grippers as the number of wafer fixing points; determining the coordinates of the fixing points by processing the horizontal force balance according to the abnormal force parameters corresponding to the alarm signal; and fixing the remaining grippers to the fixed point coordinates to determine the adaptive working state of the grippers.

[0013] Secondly, embodiments of this application also provide a rotating base monitoring device based on wafer positioning, characterized in that the device includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, the instructions being executed by the at least one processor to enable the at least one processor to: acquire real-time pressure data from a multi-axis piezoelectric sensor, and perform finite element analysis of the stiffness matrix on the real-time pressure data to obtain the force data at the root of the rotating base fixture; determine the force data of the rotating base fixture claw body through real-time deformation inversion based on preset rotating base claw deformation parameters; synchronize the rotating base fixture force data and claw body force data in a time sequence to obtain real-time force parameters of the rotating base; determine the abnormal state of the rotating base by performing an abnormal threshold judgment on the real-time force parameters of the rotating base; upload the abnormal state of the rotating base to a preset closed-loop controller, and issue an abnormal alarm signal for the rotating base through the closed-loop controller.

[0014] Thirdly, this application also provides a non-volatile computer storage medium for monitoring a rotating base based on wafer positioning, storing computer-executable instructions. The computer-executable instructions are configured to: acquire real-time pressure data from a multi-axis piezoelectric sensor and perform finite element analysis of the stiffness matrix on the real-time pressure data to obtain the force data at the root of the rotating base fixture; determine the force data of the rotating base fixture claw body through real-time deformation inversion based on preset rotating base claw deformation parameters; synchronize the rotating base fixture force data and claw body force data in a time sequence to obtain real-time force parameters of the rotating base; determine the abnormal state of the rotating base by judging the real-time force parameters of the rotating base using an abnormal threshold; upload the abnormal state of the rotating base to a preset closed-loop controller, and issue an abnormal alarm signal for the rotating base through the closed-loop controller.

[0015] This application provides a method, device, and medium for monitoring a rotating base based on wafer positioning. By performing dynamic force analysis and abnormal state alarm on the grippers and roots of the rotating base fixture, it solves the technical problem of decreased wafer fabrication accuracy during wet fabrication. It realizes real-time monitoring of the wafer's stress state under the working state of the rotating base, improves the yield and positional stability of wafer fabrication, and reduces the probability of wafer damage. Attached Figure Description

[0016] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0017] Figure 1 A flowchart of a rotating base monitoring method based on wafer positioning provided in this application embodiment;

[0018] Figure 2 This is a schematic diagram of the internal structure of a rotating base monitoring device based on wafer positioning, provided as an embodiment of this application. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] This application provides a method, device, and medium for monitoring a rotating base based on wafer positioning. By performing dynamic force analysis and abnormal state alarm on the grippers and roots of the rotating base fixture, it solves the technical problem of decreased wafer fabrication accuracy during wet fabrication. It realizes real-time monitoring of the wafer's stress state under the working state of the rotating base, improves the yield and positional stability of wafer fabrication, and reduces the probability of wafer damage.

[0021] The technical solutions proposed in the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0022] Figure 1 This is a flowchart illustrating a rotating base monitoring method based on wafer positioning, provided as an embodiment of this application. Figure 1 As shown in the figure, the rotating base monitoring method based on wafer positioning provided in this application embodiment specifically includes the following steps:

[0023] Step 101: Obtain real-time pressure data from the multi-axis piezoelectric sensor and perform finite element analysis of the stiffness matrix on the real-time pressure data to obtain the force data at the root of the rotating base fixture.

[0024] Existing rotary base clamps are mostly based on symmetrical claw structure designs, assuming that each claw bears a uniform centrifugal force during high-speed rotation. However, in actual working conditions, due to the mass distribution tolerance of the claw body, the residual dynamic balance of the base, and the nonlinearity of the stiffness of the clamp base connection interface, the centrifugal force is asymmetrically distributed in the circumferential direction.

[0025] For example, a multi-axis piezoelectric sensor capable of simultaneously measuring normal and tangential forces is selected and integrated into the root of each gripper jaw, ensuring direct contact between the jaw body and the base connection area. High-strength epoxy resin is used to bond the sensor to the jaw root. A polyimide film is added between the sensor and the jaw body to reduce stress concentration. Finite element analysis is performed on the parameter data acquired by the sensors, enabling real-time analysis of the root force under high-speed rotation of the rotating base gripper, providing a data foundation for the state analysis of the rotating base gripper and wafer.

[0026] Specifically, finite element analysis of the stiffness matrix is ​​performed on the real-time pressure data to obtain the root force data of the rotating base fixture. This includes: performing static calibration analysis on the real-time pressure data to obtain static calibration data of the rotating base; wherein, the static calibration analysis includes: pressure curve fitting and cross-validation; performing dynamic calibration analysis on the real-time pressure data to obtain dynamic calibration data of the rotating base; wherein, the dynamic calibration data includes: time domain verification and dynamic error compensation; determining the root stiffness matrix of the rotating base fixture through stiffness matrix construction; and inverting the root stiffness matrix of the rotating base fixture based on the static calibration data and the dynamic calibration data of the rotating base fixture to obtain the root force data of the rotating base fixture.

[0027] In one embodiment, in order to obtain the reference parameters required for inversion and avoid inversion distortion caused by phase delay or resonance, the above data is obtained through static calibration and dynamic calibration.

[0028] First, the sensitivity coefficients obtained from static calibration are directly used in the inversion algorithm to convert the sensor signals into preliminary force values. The force-displacement data from the static calibration are compared with the finite element simulation results to correct the material parameters (such as elastic modulus) or boundary conditions of the model, ensuring the static accuracy of the FEA model.

[0029] Then, the transfer characteristics of the sensor are obtained through the frequency response function to determine the dynamic compensation in the inversion algorithm. The damping ratio of the sensor is typically selected as a reference for the transfer characteristics. The sensor response data from the dynamic calibration is input into the FEA transient analysis to verify the model's predictive ability under dynamic loads.

[0030] Finite element analysis was used to construct the stiffness matrix at the root of the rotating base fixture, convert the sensor signals into the actual force distribution, and thus determine the force data at the root of the rotating base fixture.

[0031] Step 102: Based on the preset deformation parameters of the rotating base gripper, determine the force data of the rotating base gripper gripper body through real-time deformation inversion.

[0032] For example, the deformation data of the rotating base gripper jaws is acquired by arranging foil strain gauges at the end of the gripper arm furthest from the wafer and uniformly coating their surfaces with a thin protective layer. The acquired strain gauge output data is then used for real-time deformation inversion, enabling the analysis of the forces acting on the rotating base gripper jaws.

[0033] Specifically, based on the preset deformation parameters of the rotating base gripper, the stress data of the rotating base gripper gripper body is determined through real-time deformation inversion. This includes: modeling the bending state of the rotating base gripper gripper deformation parameters to obtain the bending model of the rotating base gripper gripper body; dividing the bending model of the rotating base gripper gripper body into a region mesh and applying boundary condition constraints to the region mesh corresponding to the bending model of the rotating base gripper gripper body to obtain the bending simulation data of the rotating base gripper gripper body; and determining the stress data of the rotating base gripper gripper body through parameter self-optimization FEA simulation based on the bending simulation data, thus providing a data foundation for the state analysis of the rotating base gripper and the wafer.

[0034] In one embodiment, the resistance change of the strain gauge is converted into a voltage signal using a bridge method, and the weak voltage signal is amplified. Since the data collected by the strain gauge is nonlinear, it is necessary to model the slightly curved parts, and high-order tetrahedral elements are used to refine the mesh of the sensor area.

[0035] Similarly, by constructing a stiffness matrix using FEA software and performing force inversion, the force data of the rotating base clamp claw body can be determined.

[0036] Step 103: Synchronize the force data of the rotating base fixture and the force data of the claw body in time sequence to obtain the real-time force parameters of the rotating base.

[0037] For example, since the force data of the rotating base fixture and the force data of the claw are acquired and analyzed separately, they need to be synchronized in time to avoid anomalies in the overall force analysis of the fixture. Through time synchronization and dynamic noise suppression, the time deviation and motion noise of multi-sensor data can be eliminated, and the real-time performance and accuracy of the force parameters can be improved.

[0038] Specifically, the force data of the rotating base fixture and the force data of the claw are synchronized in time to obtain the real-time force parameters of the rotating base. This includes: acquiring the global clock signal of the force data of the rotating base fixture and the force data of the claw, and performing differential compensation on the global clock signal to obtain the rotating base time data; synchronizing the rotating base time data with timestamps to obtain the rotating base synchronized time data; and performing adaptive noise suppression on the rotating base synchronized time data to obtain the real-time force parameters of the rotating base. The adaptive noise suppression includes Kalman filtering and dynamic parameter adjustment.

[0039] In one embodiment, force data of the rotating base fixture and the claw body are synchronously acquired using high-speed sensors, and their global clock signals are obtained. Linear interpolation is used to compensate for the difference in clock signals to eliminate timing offsets caused by differences in sensor sampling frequencies, generating rotating base timing data. A unified timestamp is added to the rotating base timing data, and the timing data is aligned using a sliding window algorithm with a window length of 10ms and a window overlap rate of 50%, ultimately generating synchronized rotating base timing data.

[0040] A Kalman filter is used to dynamically suppress noise in the synchronous timing data, and the filter parameters are adjusted in real time according to the angular velocity of the rotating base.

[0041] Step 104: Determine the abnormal threshold of the real-time force parameters of the rotating base to identify the abnormal state of the rotating base.

[0042] By combining symmetric physical constraints with dynamic thresholds, noise interference and real anomalies can be effectively distinguished, reducing the false alarm rate.

[0043] Specifically, periodic fixed-point stress determination is performed on the real-time stress parameters of the rotating base to identify abnormal states of the rotating base. This includes: calibrating abnormal points on the real-time stress parameters of the rotating base to obtain abnormal stress points; determining the true abnormal stress points based on the abnormal stress points through symmetrical equilibrium point analysis; wherein, symmetrical equilibrium point analysis includes: symmetrical gripper force balance analysis and asymmetrical gripper resultant force balance analysis; and determining the abnormal threshold of the stress data corresponding to the true abnormal stress points to identify abnormal states of the rotating base.

[0044] The real-time force parameters of the rotating base are filtered by sliding mean (window length 20 sampling points). The standard deviation of each sampling point from the mean is calculated. If the deviation exceeds 3 times the standard deviation, it is marked as a force anomaly point.

[0045] If the grippers corresponding to the anomaly point have symmetrically distributed grippers, calculate the force difference between the symmetrical grippers; if the difference exceeds a set threshold (e.g., 10N), it is determined to be a real anomaly point.

[0046] For asymmetric grippers, the theoretical equilibrium force is calculated by decomposing the resultant force vector. If the actual force deviates from the theoretical value by more than 15%, it is determined to be a real anomaly.

[0047] A dynamic threshold is set for the force data of real abnormal points. If three consecutive sampling points exceed the threshold, the rotating base is determined to be in an abnormal state.

[0048] Step 105: Upload the abnormal status of the rotating base to the preset closed-loop controller, and issue an abnormal alarm signal for the rotating base through the closed-loop controller.

[0049] Specifically, the abnormal state of the rotating base is uploaded to a preset closed-loop controller, and the closed-loop controller issues an abnormal alarm signal for the rotating base. This includes: determining the abnormal stage of the abnormal state of the rotating base to obtain an abnormal alarm stage; issuing a first abnormal alarm signal for the rotating base when the abnormal alarm stage is in the first alarm stage; issuing a second abnormal alarm signal for the rotating base when the abnormal alarm stage is in the second alarm stage; and determining the abnormal alarm signal for the rotating base based on the first or second abnormal alarm signal for the rotating base.

[0050] In one embodiment, the first alarm stage is triggered when the duration of an abnormality in a single gripper is less than 5 seconds, and the second alarm stage is triggered when the duration of an abnormality is greater than or equal to 5 seconds, or when two or more grippers are abnormal ....

[0051] After uploading the abnormal status of the rotating base to the preset closed-loop controller and issuing an abnormal alarm signal for the rotating base through the closed-loop controller, the method further includes: if the device status corresponding to the alarm signal is determined to be adaptive adjustment, determining the clamping steady-state adjustment parameters through wafer offset adjustment analysis; if the device status corresponding to the alarm signal is determined to be abnormal, querying the fixture abnormal point and setting the clamping jaws corresponding to the fixture abnormal point to a temporary disabled state; and redistributing the adjacent angles of the remaining clamping jaws (excluding those in the temporary disabled state) to determine the adaptive working state of the clamping jaws.

[0052] The adjacent angles of the remaining grippers (excluding those in a temporarily disabled state) are redistributed to determine the adaptive working state of the grippers. Specifically, this includes: obtaining the current number of grippers on the rotating base and using the current number of grippers as the number of wafer fixing points; determining the coordinates of the fixing points through horizontal force balance processing based on the abnormal force parameters corresponding to the alarm signal; and fixing the remaining grippers to the fixed point coordinates to determine the adaptive working state of the grippers.

[0053] In one embodiment, the number of remaining grippers N is obtained, and the wafer circumference is divided into N fixed points in a 360° radius. The target coordinates of each gripper are solved based on the horizontal force balance equation to ensure that the resultant torque deviation is less than 0.1 N·m. Finally, the remaining grippers are controlled to move to the new coordinates to form an adaptive working state.

[0054] The above are embodiments of the method proposed in this application. Based on the same inventive concept, embodiments of this application also provide a rotating base monitoring device based on wafer positioning, the structure of which is as follows: Figure 2 As shown.

[0055] Figure 2 This is a schematic diagram of the internal structure of a rotating base monitoring device based on wafer positioning, provided as an embodiment of this application. Figure 2 As shown, the device includes:

[0056] At least one processor 201;

[0057] And a memory 202 that is communicatively connected to at least one processor;

[0058] The memory 202 stores instructions executable by at least one processor, which are executed by at least one processor 201 to enable at least one processor 201 to:

[0059] Real-time pressure data from a multi-axis piezoelectric sensor is acquired, and finite element analysis of the stiffness matrix is ​​performed on the real-time pressure data to obtain the force data at the root of the rotating base clamp. Based on the preset deformation parameters of the rotating base clamp jaws, the force data of the rotating base clamp jaws is determined through real-time deformation inversion. The force data of the rotating base clamp and the force data of the jaws are synchronized in time to obtain the real-time force parameters of the rotating base. An abnormal threshold is determined for the real-time force parameters of the rotating base to identify the abnormal state of the rotating base. The abnormal state of the rotating base is uploaded to a preset closed-loop controller, and an abnormal alarm signal of the rotating base is issued through the closed-loop controller.

[0060] Some embodiments of this application provide corresponding to Figure 1 A non-volatile computer storage medium based on wafer positioning and rotating base monitoring, storing computer-executable instructions, wherein the computer-executable instructions are configured as follows:

[0061] Real-time pressure data from a multi-axis piezoelectric sensor is acquired, and finite element analysis of the stiffness matrix is ​​performed on the real-time pressure data to obtain the force data at the root of the rotating base clamp. Based on the preset deformation parameters of the rotating base clamp jaws, the force data of the rotating base clamp jaws is determined through real-time deformation inversion. The force data of the rotating base clamp and the force data of the jaws are synchronized in time to obtain the real-time force parameters of the rotating base. An abnormal threshold is determined for the real-time force parameters of the rotating base to identify the abnormal state of the rotating base. The abnormal state of the rotating base is uploaded to a preset closed-loop controller, and an abnormal alarm signal of the rotating base is issued through the closed-loop controller.

[0062] The various embodiments in this application are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the embodiments for IoT devices and media are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions of the method embodiments.

[0063] The systems, media, and methods provided in this application are one-to-one correspondences. Therefore, the systems and media also have similar beneficial technical effects as their corresponding methods. Since the beneficial technical effects of the methods have been described in detail above, the beneficial technical effects of the systems and media will not be repeated here.

[0064] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0065] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0066] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0067] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0068] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.

[0069] Memory may include non-persistent storage in computer-readable media, such as random access memory (RAM) and / or non-volatile memory, such as read-only memory (ROM) or flash RAM. Memory is an example of computer-readable media.

[0070] Computer-readable media includes both permanent and non-permanent, removable and non-removable media that can store information using any method or technology. Information can be computer-readable instructions, data structures, modules of programs, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic magnetic disk storage or other magnetic storage devices, or any other non-transferable medium that can be used to store information accessible by a computing device. As defined herein, computer-readable media does not include transient computer-readable media, such as modulated data signals and carrier waves.

[0071] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0072] The above are merely embodiments of this application and are not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

Claims

1. A method for monitoring a rotating base based on wafer positioning, characterized in that, The method includes: Real-time pressure data from a multi-axis piezoelectric sensor is acquired, and finite element analysis of the stiffness matrix is ​​performed on the real-time pressure data to obtain the force data at the root of the rotating base fixture. Based on the preset deformation parameters of the rotating base gripper, the force data of the rotating base gripper gripper body is determined through real-time deformation inversion; The force data of the rotating base fixture and the force data of the claw body are synchronized in time to obtain the real-time force parameters of the rotating base. Anomaly threshold determination is performed on the real-time force parameters of the rotating base to identify abnormal states of the rotating base; The abnormal status of the rotating base is uploaded to a preset closed-loop controller, and an alarm signal for the abnormality of the rotating base is issued through the closed-loop controller.

2. The method for monitoring a rotating base based on wafer positioning according to claim 1, characterized in that, Finite element analysis of the stiffness matrix was performed on the real-time pressure data to obtain the force data at the root of the rotating base fixture, specifically including: Static calibration analysis is performed on the real-time pressure data to obtain static calibration data for the rotating base; wherein, the static calibration analysis includes: pressure curve fitting and cross-validation; The real-time pressure data is subjected to dynamic calibration analysis to obtain dynamic calibration data for the rotating base; wherein, the dynamic calibration data includes: time-domain verification and dynamic error compensation; The stiffness matrix at the root of the rotating base fixture is determined by constructing the stiffness matrix. Based on the static calibration data and dynamic calibration data of the rotating base, the stiffness matrix at the root of the rotating base fixture is inverted to obtain the force data at the root of the rotating base fixture.

3. The method for monitoring a rotating base based on wafer positioning according to claim 1, characterized in that, Based on preset deformation parameters of the rotating base gripper jaws, the force data of the rotating base gripper jaws is determined through real-time deformation inversion, specifically including: The bending state model of the deformation parameters of the rotating base gripper is performed to obtain the bending model of the gripper body of the rotating base fixture; The bending model of the rotating base clamp claw body is divided into a region mesh, and boundary conditions are constrained on the region mesh corresponding to the bending model of the rotating base clamp claw body to obtain the bending simulation data of the rotating base clamp claw body. Based on the bending simulation data, the force data of the rotating base clamp claw body is determined through FEA simulation with parameter self-optimization.

4. The method for monitoring a rotating base based on wafer positioning according to claim 1, characterized in that, The force data of the rotating base fixture and the force data of the claw body are synchronized in time to obtain the real-time force parameters of the rotating base, specifically including: The global clock signals of the force data of the rotating base fixture and the force data of the claw body are acquired, and the difference compensation is performed on the global clock signals to obtain the timing data of the rotating base. The timing data of the rotating base is timestamped to obtain the timing data of the rotating base synchronization. Adaptive noise suppression is performed on the synchronous timing data of the rotating base to obtain the real-time force parameters of the rotating base; wherein, the adaptive noise suppression includes: Kalman filtering and dynamic parameter adjustment.

5. The method for monitoring a rotating base based on wafer positioning according to claim 1, characterized in that, Periodic fixed-point stress determination is performed on the real-time stress parameters of the rotating base to identify abnormal states of the rotating base, specifically including: The abnormal points of the real-time force parameters of the rotating base are calibrated to obtain the abnormal force points; Based on the aforementioned stress anomaly points, the actual stress anomaly points are determined through symmetrical equilibrium point analysis; wherein, the symmetrical equilibrium point analysis includes: symmetrical gripper force equilibrium analysis and asymmetrical gripper resultant force equilibrium analysis. An abnormal threshold is determined by analyzing the force data corresponding to the actual abnormal force points to identify the abnormal state of the rotating base.

6. The method for monitoring a rotating base based on wafer positioning according to claim 1, characterized in that, The abnormal status of the rotating base is uploaded to a preset closed-loop controller, and an alarm signal for the abnormality of the rotating base is issued through the closed-loop controller, specifically including: An abnormal stage is determined for the abnormal state of the rotating base to obtain an abnormal alarm stage; If the abnormal alarm stage is in the first alarm stage, a first rotating base abnormal alarm signal is issued; If the abnormal alarm stage is in the second alarm stage, a second rotating base abnormal alarm signal is issued; The abnormal alarm signal of the rotating base is determined based on the first abnormal alarm signal of the rotating base or the second abnormal alarm signal of the rotating base.

7. The method for monitoring a rotating base based on wafer positioning according to claim 1, characterized in that, After uploading the abnormal status of the rotating base to a preset closed-loop controller, and issuing an abnormal alarm signal for the rotating base through the closed-loop controller, the method further includes: When the device status corresponding to the alarm signal is determined to be adaptive adjustment, the clamping steady-state adjustment parameters are determined through wafer offset adjustment analysis. If the device status corresponding to the alarm signal is determined to be abnormal, query the abnormal point of the clamp and set the clamp corresponding to the abnormal point of the clamp to a temporary disabled state. The adjacent angles of the remaining grippers, excluding those in the temporarily disabled state, are redistributed to determine the gripper's adaptive working state.

8. The method for monitoring a rotating base based on wafer positioning according to claim 7, characterized in that, The adjacent angles of the remaining grippers, excluding those in the temporarily disabled state, are reallocated to determine the gripper's adaptive working state, specifically including: Obtain the current number of grippers on the rotating base, and use the current number of grippers as the number of wafer fixing points; Based on the abnormal force parameters corresponding to the alarm signal, the coordinates of the fixed point are determined through horizontal force balance processing. The remaining grippers are fixed to the fixed point coordinates to determine the adaptive working state of the grippers.

9. A rotating base monitoring device based on wafer positioning, characterized in that, The device includes: At least one processor; And, a memory communicatively connected to the at least one processor; The memory stores instructions executable by the at least one processor, which, when executed by the at least one processor, enable the at least one processor to: Real-time pressure data from a multi-axis piezoelectric sensor is acquired, and finite element analysis of the stiffness matrix is ​​performed on the real-time pressure data to obtain the force data at the root of the rotating base fixture. Based on the preset deformation parameters of the rotating base gripper, the force data of the rotating base gripper gripper body is determined through real-time deformation inversion; The force data of the rotating base fixture and the force data of the claw body are synchronized in time to obtain the real-time force parameters of the rotating base. Anomaly threshold determination is performed on the real-time force parameters of the rotating base to identify abnormal states of the rotating base; The abnormal status of the rotating base is uploaded to a preset closed-loop controller, and an alarm signal for the abnormality of the rotating base is issued through the closed-loop controller.

10. A non-volatile computer storage medium for monitoring a rotating base based on wafer positioning, storing computer-executable instructions, characterized in that, The computer-executable instructions are set as follows: Real-time pressure data from a multi-axis piezoelectric sensor is acquired, and finite element analysis of the stiffness matrix is ​​performed on the real-time pressure data to obtain the force data at the root of the rotating base fixture. Based on the preset deformation parameters of the rotating base gripper, the force data of the rotating base gripper gripper body is determined through real-time deformation inversion; The force data of the rotating base fixture and the force data of the claw body are synchronized in time to obtain the real-time force parameters of the rotating base. Anomaly threshold determination is performed on the real-time force parameters of the rotating base to identify abnormal states of the rotating base; The abnormal status of the rotating base is uploaded to a preset closed-loop controller, and an alarm signal for the abnormality of the rotating base is issued through the closed-loop controller.

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