Split-flow exhaust device and substrate processing device

Abstract

The application provides a shunt exhaust device and a substrate processing device. The shunt exhaust device comprises a main pipeline and a shunt pipeline. The main pipeline is used for being connected with a processing chamber. The shunt pipeline is connected with the main pipeline. The shunt pipeline comprises at least a first shunt pipeline and a second shunt pipeline. The first shunt pipeline and the second shunt pipeline are detachably and sealingly connected with the main pipeline. The first shunt pipeline and / or the second shunt pipeline comprises a plurality of branch pipelines. An exhaust switching structure is arranged on each branch pipeline of the first shunt pipeline and / or the second shunt pipeline. The exhaust switching structure is used for opening or blocking the branch pipeline of the first shunt pipeline and / or the second shunt pipeline. The first shunt pipeline and / or the second shunt pipeline of the shunt exhaust device comprises a plurality of branch pipelines. The abutting points of the shunt pipeline and the main pipeline are reduced. The small integration of the shunt exhaust structure of the substrate processing device is realized. The installation space is saved.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor manufacturing, and more particularly, relates to a split-flow exhaust device and a substrate processing device. Background Art

[0002] During the operation of semiconductor substrate processing equipment, gases of different properties generated within the processing chamber react with each other and form crystals on the internal surface of the exhaust system, affecting the chamber's negative pressure requirement and, in turn, the wafer processing results. Therefore, a split exhaust system is required to allow gases of different properties in each chamber to be exhausted independently without interfering with each other.

[0003] Existing diversion exhaust devices include separate modules such as exhaust switching units and switching valves for discharging acidic gases, alkaline gases, and organic solvents. For example, the exhaust pipes used to discharge acidic gases, alkaline gases, and organic solvents are respectively connected to the exhaust interface of the processing chamber. The large number of exhaust pipe connection points increases the risk of gas leakage. The independent modules of the exhaust switching device result in a large overall size, and it can only be installed as a separate auxiliary equipment, occupying a large space. Summary of the Invention

[0004] The present invention provides a diversion and exhaust device and a substrate processing device, which can reduce the risk of air leakage, reduce size and installation space.

[0005] The technical solution adopted by the present invention to solve its technical problems is: the first aspect of the present invention provides a diversion exhaust device, including a main pipe and a diversion pipe, the main pipe is used to be connected to the processing chamber, the diversion pipe is connected to the main pipe, the diversion pipe includes at least a first diversion pipe and a second diversion pipe, the first diversion pipe and the second diversion pipe are both detachably and sealedly connected to the main pipe, the first diversion pipe and / or the second diversion pipe include a plurality of branch pipes, the branch pipes of the first diversion pipe and / or the second diversion pipe are each provided with an exhaust switching structure, the exhaust switching structure is used to conduct or block the branch pipes of the first diversion pipe and / or the second diversion pipe.

[0006] In one embodiment, the exhaust switching structure includes a driving structure and a baffle, and the driving structure is used to drive the baffle to open or close the branch pipes of the first diversion pipe and / or the second diversion pipe.

[0007] In one embodiment, the driving structure includes a driving portion and a rotating shaft, an output end of the driving portion is connected to the rotating shaft, and the baffle is fixed on the rotating shaft.

[0008] In one embodiment, the driving part is a motor, the output end of the motor is connected to the rotating shaft, or the driving part includes a cylinder, a rotating shaft connecting member and a connecting rod, the output end of the cylinder is fixedly connected to the rotating shaft connecting member, the rotating shaft connecting member is rotatably connected to the connecting rod, and the connecting rod is fixedly connected to the rotating shaft.

[0009] In one embodiment, the first shunt pipe is connected to the main pipe via a flange and a sealing gasket, and the second shunt pipe is connected to the main pipe via a flange and a sealing gasket.

[0010] In one embodiment, the diversion exhaust device further includes an exhaust box respectively connected to the branch pipes of the first diversion pipe and / or the second diversion pipe, and an air pressure regulating port is provided on the pipe between the baffle and the exhaust box.

[0011] In one embodiment, the opening size of the air pressure regulating port is adjustable.

[0012] In one embodiment, when the baffle conducts the first branch pipe and / or the branch pipe of the second branch pipe, the baffle blocks the air pressure regulating port.

[0013] In one embodiment, the split exhaust device further includes a chamber air pressure regulating box and a connection box connected to the chamber air pressure regulating box;

[0014] The chamber air pressure regulating box is used to control the air pressure in the processing chamber, and the connecting box is used to be connected to the main pipeline.

[0015] A second aspect of the present invention provides a substrate processing device, comprising a host computer, a processing chamber, and a diversion exhaust device connected to the processing chamber, wherein the diversion exhaust device is the diversion exhaust device as described above, and the host computer is used to determine the properties of the gas generated in the processing chamber, and control the exhaust switching structure to open or block the branch pipes of the first diversion pipe and / or the second diversion pipe according to the gas properties.

[0016] The diversion exhaust device provided by the present invention includes a main pipeline and a diversion pipeline, wherein the main pipeline is used to connect to the processing chamber, the diversion pipeline is connected to the main pipeline, and the diversion pipeline includes at least a first diversion pipeline and a second diversion pipeline, wherein the first diversion pipeline and the second diversion pipeline are both detachably and sealedly connected to the main pipeline, the first diversion pipeline and / or the second diversion pipeline include a plurality of branch pipelines, and the branch pipelines of the first diversion pipeline and / or the second diversion pipeline are both provided with an exhaust switching structure, and the exhaust switching structure is used to conduct or block the branch pipelines of the first diversion pipeline and / or the second diversion pipeline. The first diversion pipeline and / or the second diversion pipeline of the diversion exhaust device include a plurality of branch pipelines, which reduces the docking points between the branch pipelines and the main pipeline, reduces the risk of air leakage, realizes the small integration of the diversion exhaust structure of the substrate processing device, and saves installation space.

[0017] The substrate processing device provided by the present invention includes a processing chamber and a diversion exhaust device connected to the processing chamber, the diversion exhaust device includes a main pipe and a diversion pipe, the main pipe is used to connect to the processing chamber, the diversion pipe is connected to the main pipe, the diversion pipe includes at least a first diversion pipe and a second diversion pipe, the first diversion pipe and the second diversion pipe are both detachably and sealedly connected to the main pipe, the first diversion pipe and / or the second diversion pipe include a plurality of branch pipes, the branch pipes of the first diversion pipe and / or the second diversion pipe are each provided with an exhaust switching structure, the exhaust switching structure is used to conduct or block the branch pipes of the first diversion pipe and / or the second diversion pipe. The first diversion pipe and / or the second diversion pipe of the diversion exhaust device include a plurality of branch pipes, which reduces the docking points between the branch pipes and the main pipe, reduces the risk of air leakage, realizes the small integration of the diversion exhaust structure of the substrate processing device, and saves installation space. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 A schematic structural diagram of a diversion and exhaust device provided in an embodiment of the present invention;

[0020] Figure 2 A schematic cross-sectional view of a split-flow exhaust device according to an embodiment of the present invention;

[0021] Figure 3A schematic structural diagram of an exhaust switching structure of a split exhaust device provided in an embodiment of the present invention;

[0022] Figure 4 A schematic diagram of the principle of a split-flow exhaust device for a substrate processing device provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0023] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0024] In the description of the present invention, it should be understood that the terms "including" and "having" and any variations thereof used herein are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0025] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0026] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. It should be understood that the term "and / or" used in this article is merely a way to describe the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0027] During the operation of a semiconductor substrate processing device, if gases of different properties generated in the processing chamber are mixed, they will react and produce crystals on the internal surface of the exhaust device, affecting the negative pressure demand of the chamber, and further affecting the process treatment effect of the wafer. Therefore, an exhaust switching unit is used to achieve independent exhaust of gases of different properties in each processing chamber without interfering with each other, and when the air duct is closed, the outside atmosphere can enter to balance the internal exhaust pressure. The existing exhaust switching device includes individual modules such as an exhaust switching unit and a switching valve for discharging acidic gases, alkaline gases and organic solvents. For example, the exhaust pipes for discharging acidic gases, alkaline gases and organic solvents are respectively connected to the exhaust interface of the processing chamber. The large number of exhaust pipe docking points increases the risk of leakage. The module independence of the exhaust switching device results in a large overall size, and it can only be installed as a separate auxiliary equipment, occupying a large space. Based on the above reasons, the present application provides a diversion exhaust device and a substrate processing device.

[0028] The split-flow exhaust device and substrate processing device provided by the present invention are described in detail below with reference to specific embodiments.

[0029] Figure 1 This is a schematic structural diagram of a diversion and exhaust device provided in an embodiment of the present invention. Figure 2 A schematic cross-sectional view of a split-flow exhaust device according to an embodiment of the present invention is shown. Figure 3 This is a schematic diagram of the exhaust switching structure of the split exhaust device provided in an embodiment of the present invention. Figure 4 For a schematic diagram of the principle of the split exhaust device of the substrate processing device provided by the embodiment of the present invention, please refer to Figures 1-4 A first aspect of an embodiment of the present invention provides a diversion exhaust device 1, comprising a main pipe 11 and a diversion pipe 12, wherein the main pipe 11 is used to connect to the processing chamber 2, and the diversion pipe 12 is connected to the main pipe 11, and the diversion pipe 12 includes at least a first diversion pipe 121 and a second diversion pipe 122, and the first diversion pipe 121 and the second diversion pipe 122 are both detachably and sealedly connected to the main pipe 11, and the first diversion pipe 121 and / or the second diversion pipe 122 include a plurality of branch pipes, and the branch pipes of the first diversion pipe 121 and / or the second diversion pipe are each provided with an exhaust switching structure 13, and the exhaust switching structure 13 is used to conduct or block the branch pipes of the first diversion pipe 121 and / or the second diversion pipe 122.

[0030] The diversion pipeline 12 of this embodiment includes at least a first diversion pipeline 121 and a second diversion pipeline 122, that is, the diversion pipeline includes two or more diversion pipelines. The first diversion pipeline 121 and / or the second diversion pipeline 122 include multiple branch pipelines, including the following three situations: the first diversion pipeline 121 includes multiple branch pipelines, the second diversion pipeline 122 includes multiple branch pipelines, and the first diversion pipeline 121 and the second diversion pipeline 122 both include multiple branch pipelines, wherein the multiple is two or more.

[0031] The diversion exhaust device 1 of this embodiment includes a main pipe 11 and a diversion pipe 12. The main pipe 11 is used to connect to the processing chamber 2. The processing chamber 2 of this embodiment is used to process the substrate, such as etching, deposition, cleaning and other process treatments on semiconductor wafers. During the processing process, various gases are generated in the processing chamber 2, and these gases need to be discharged through the diversion exhaust device 1. For example, during the wafer etching process, acidic gas and alkaline gas need to be used to etch the wafer, and the acidic gas and alkaline gas need to be discharged during the wafer etching process. After the etching is completed, the wafer needs to be cleaned with an organic solvent, and the organic solvent waste liquid generated during the cleaning process also needs to be discharged. During the operation of the semiconductor substrate processing device, if the gases of different properties generated by the processing chamber 2 are mixed, they will react and produce crystals on the internal surface of the exhaust device, affecting the chamber negative pressure requirement, and thus affecting the process treatment effect of the wafer. Therefore, the diversion exhaust device 1 is used to achieve the independent exhaust of gases of different properties in each processing chamber 2 without interfering with each other.

[0032] The main pipe 11 of this embodiment is connected to the processing chamber 2 and is used to guide the gas in the processing chamber 2. The branch pipe 12 is connected to the main pipe 11 and is used to divert the gas to different exhaust paths. The branch pipe 12 includes a first branch pipe 121 and a second branch pipe 122, and the first branch pipe 121 and the second branch pipe 122 are both detachably sealed and connected to the main pipe 11. For example, see Figure 1 and Figure 2 As shown, the second branch pipe 122 is a herringbone pipe with two branch pipes. The two branch pipes of the first branch pipe 121 and the second branch pipe 122 of this embodiment are used to discharge acid gas, alkaline gas and organic solvent waste liquid respectively.

[0033] The existing exhaust pipelines for discharging acidic gas, basic gas and organic solvent are respectively connected with the exhaust interface of the processing chamber 2, and the multiple docking points of the exhaust pipelines increase the risk of gas leakage. The shunt pipeline 12 in the embodiment includes a first shunt pipeline 121 and a second shunt pipeline 122, and the first shunt pipeline 121 and the second shunt pipeline 122 are detachably and sealingly connected with the main pipeline 11. The second shunt pipeline 122 is a herringbone-shaped pipeline having two branch pipelines, which reduces the docking points of the shunt pipeline 12 connected with the exhaust interface of the processing chamber 2, and reduces the risk of gas leakage of the shunt pipeline.

[0034] The first shunt pipeline 121 and the branch pipelines of the herringbone-shaped pipeline are provided with an exhaust switching structure 13 for opening or blocking the branch pipelines on the first shunt pipeline 121 and the second shunt pipeline 122. The first shunt pipeline 121 and the two branch pipelines of the second shunt pipeline 122 are provided with the exhaust switching structure 13, and the three pipelines are respectively used for discharging acidic gas, basic gas and organic solvent waste liquid. For example, the first shunt pipeline 121 is used for discharging acidic gas, one of the two branch pipelines of the second shunt pipeline 122 is used for discharging basic gas, and the other branch pipeline is used for discharging organic solvent waste liquid. When the exhaust switching structure 13 opens the first shunt pipeline 121, the two branch pipelines of the second shunt pipeline 122 are in a blocked state. When one of the two branch pipelines of the second shunt pipeline 122 is opened, the first shunt pipeline 121 and the other branch pipeline are in a blocked state.

[0035] The shunt exhaust device includes a main pipeline and a shunt pipeline. The main pipeline is used for connecting with a processing chamber. The shunt pipeline is connected with the main pipeline. The shunt pipeline includes at least a first shunt pipeline and a second shunt pipeline. The first shunt pipeline and the second shunt pipeline are detachably and sealingly connected with the main pipeline. The first shunt pipeline and / or the second shunt pipeline include a plurality of branch pipelines. The branch pipelines of the first shunt pipeline and / or the second shunt pipeline are provided with an exhaust switching structure for opening or blocking the branch pipelines of the first shunt pipeline and / or the second shunt pipeline. The first shunt pipeline and / or the second shunt pipeline of the shunt exhaust device include a plurality of branch pipelines, which reduces the docking points of the branch pipelines with the main pipeline, reduces the risk of gas leakage, realizes the small integration of the shunt exhaust structure of the substrate processing device, and saves the installation space.

[0036] In a specific embodiment, please refer to Figure 2 and Figure 3The exhaust switching structure 13 includes a driving structure 131 and a baffle 132. The driving structure 131 is used to drive the baffle 132 to open or close the branch pipes of the first branch pipe 121 and / or the second branch pipe 122. The switching structure of this embodiment uses the driving structure to drive the baffle to open or close the branch pipes of the first branch pipe 121 and the branch pipes of the second branch pipe 122. The exhaust switching structure 13 is simple and easy to implement.

[0037] The drive structure 131 of this embodiment includes a drive unit 1311 and a rotating shaft 1312. The output end of the drive unit 1311 is connected to the rotating shaft 1312, and the baffle 132 is fixed to the rotating shaft 1312. The drive unit 1311 can be a motor, and the output end of the motor is connected to the rotating shaft 1312 to drive the rotating shaft to rotate, thereby driving the baffle 132 to rotate.

[0038] Illustratively, the drive unit 1311 of this embodiment includes a cylinder 3111, a rotating shaft connector 3112, and a connecting rod 3113. The output end of the cylinder 3111 is fixedly connected to the rotating shaft connector 3112, the rotating shaft connector 3112 is rotatably connected to the connecting rod 3113, and the connecting rod 3113 is fixedly connected to the rotating shaft 1312. The drive structure 131 of this embodiment uses a cylinder 3111. The cylinder 3111 is provided on the first diversion pipe 121 and the branch pipe of the second diversion pipe 122 of this embodiment. The cylinders 3111 are provided on the same side. The structure of the entire diversion and exhaust device is compact. The diversion and exhaust device 1 of this embodiment can be directly installed at the bottom of the substrate processing equipment platform without the need for a separate auxiliary machine, which greatly improves space utilization.

[0039] Furthermore, the first shunt pipe 121 is connected to the main pipe 11 via a flange and a sealing gasket, and the second shunt pipe 122 is also connected to the main pipe 11 via a flange and a sealing gasket. The design of the flange and the sealing gasket allows for a removable sealed connection between the first shunt pipe 121 and the second shunt pipe 122 and the main pipe 11. The flange connection is fastened with bolts, making it easy to maintain and replace. In addition, sealing gaskets (such as rubber, graphite, and metal gaskets) can fill minor unevenness on the flange surface, effectively preventing fluid leakage, and are particularly suitable for use with high-pressure, high-temperature, or corrosive media. If the seal fails, only the gasket needs to be replaced, rather than the entire connection component, saving time and cost. Leaks can be quickly located visually or with instruments without dismantling the entire pipe.

[0040] Further, see Figures 1-4The diversion and exhaust device 1 further includes an exhaust box 14 connected to the branch pipes of the first diversion pipe 121 and the second diversion pipe 122, respectively. An air pressure regulating port 15 is provided on the pipeline between the baffle 132 and the exhaust box 14. When the baffle 132 on the branch pipes of the first diversion pipe 121 and the second diversion pipe 122 is in a closed state, the exhaust box 14 can draw air from the outside through the air pressure regulating port 15 to balance the internal air pressure. The exhaust box 14 of this embodiment can direct the exhaust gas to different treatment units (such as a scrubber, burner, adsorption device) according to the properties of the gas (such as acidic, alkaline, and organic waste gas) to ensure compliant emissions.

[0041] The baffle 132 of this embodiment includes a first surface and a second surface disposed opposite each other. A first sealing gasket 1321 is disposed on the first surface, and a second sealing gasket 1322 is disposed on the second surface. When the baffle 132 of this embodiment blocks the branch pipes of the first diversion pipe 121 and the second diversion pipe 122, the first sealing gasket 1321 can better seal the branch pipes of the first diversion pipe 121 and the second diversion pipe 122. When the baffle 132 of this embodiment connects the branch pipes of the first diversion pipe 121 and the second diversion pipe 122, the baffle 132 blocks the air pressure regulating port 15. The second sealing gasket 1322 of this embodiment can better seal the air pressure regulating port 15. During the operation of the semiconductor substrate processing device, the diversion exhaust device 1 of this embodiment can prevent the gases of different properties generated in the processing chamber 2 from mixing and reacting and generating crystallization on the internal surface of the exhaust device, thereby affecting the negative pressure of the chamber, thereby improving the process processing effect of the wafer in the processing chamber 2. The diversion exhaust device 1 of this embodiment realizes the independent exhaust of gases of different properties in each chamber without interfering with each other through the exhaust switching structure. When the branch pipes of the first diversion pipe 121 and the second diversion pipe 122 are blocked, the outside atmosphere can enter to balance the internal exhaust pressure.

[0042] Furthermore, the opening size of the air pressure regulating port 15 is adjustable to regulate the air pressure within the pipe. When the baffle 132 connects the first branch pipe 121 and the branch pipes of the second branch pipe 122, the baffle 132 blocks the air pressure regulating port 15, ensuring that gas can only flow through the predetermined path. In this embodiment, the air pressure regulating port 15 is provided with an adjustment plate 151. By adjusting the opening of the adjustment plate 151, the size of the air pressure regulating port 15 can be adjusted.

[0043] See also Figure 4The diversion exhaust device of this embodiment also includes a chamber air pressure regulating box 16 and a connecting box 17 connected to the chamber air pressure regulating box 16. The chamber air pressure regulating box 16 is used to control the air pressure in the processing chamber 2, and the connecting box 17 is used to connect to the main pipeline 11. The chamber air pressure regulating box 16 is part of the pressure control system and plays a key role in the process. Its core function is to accurately control the gas pressure and environment in the processing chamber 2 to ensure the stability, repeatability and performance optimization of the process. For example, the chamber air pressure regulating box 16 cooperates with the mass flow controller to ensure that the reaction gas is evenly distributed during the etching process to avoid local pressure unevenness causing inconsistent film thickness or etching rate. The chamber air pressure regulating box 16 and the connecting box 17 of this embodiment are both the chamber air pressure regulating box 16 and the connecting box 17 used in the prior art.

[0044] The diversion exhaust device provided in an embodiment of the present invention includes a main pipe and a diversion pipe, wherein the main pipe is used to connect to the processing chamber, the diversion pipe is connected to the main pipe, and the diversion pipe includes at least a first diversion pipe and a second diversion pipe, wherein the first diversion pipe and the second diversion pipe are both detachably and sealedly connected to the main pipe, the first diversion pipe and / or the second diversion pipe include a plurality of branch pipes, and the branch pipes of the first diversion pipe and / or the second diversion pipe are both provided with an exhaust switching structure, and the exhaust switching structure is used to conduct or block the branch pipes of the first diversion pipe and / or the second diversion pipe. The first diversion pipe and / or the second diversion pipe of the diversion exhaust device include a plurality of branch pipes, which reduces the docking points between the branch pipes and the main pipe, reduces the risk of air leakage, realizes the small integration of the diversion exhaust structure of the substrate processing device, and saves installation space.

[0045] A second aspect of an embodiment of the present invention provides a substrate processing device, including a processing chamber and a diversion and exhaust device connected to the processing chamber, wherein the diversion and exhaust device is the diversion and exhaust device described in the above embodiment.

[0046] For example: it includes a main pipeline and a branch pipeline, the main pipeline is used to connect to the processing chamber, the branch pipeline is connected to the main pipeline, the branch pipeline includes at least a first branch pipeline and a second branch pipeline, the first branch pipeline and the second branch pipeline are both detachably and sealedly connected to the main pipeline, the first branch pipeline and / or the second branch pipeline include multiple branch pipelines, the branch pipelines of the first branch pipeline and / or the second branch pipeline are each provided with an exhaust switching structure, the exhaust switching structure is used to conduct or block the branch pipelines of the first branch pipeline and / or the second branch pipeline.

[0047] The substrate processing device of the embodiment can be a wafer etching device, a wafer deposition device, or a wafer cleaning device. The processing chamber of the embodiment is used to process a substrate, for example, to etch, deposit, clean, or the like of a semiconductor wafer. During processing, various gases are generated in the processing chamber, which need to be discharged through the shunt exhaust device. For example, during wafer etching, acidic gas and alkaline gas need to be used to etch the wafer, and the acidic gas and alkaline gas need to be discharged during wafer etching. After etching is completed, organic solvent needs to be used to clean the wafer, and the organic solvent waste liquid generated during cleaning also needs to be discharged. During the operation of the semiconductor substrate processing device, different properties of the gases generated in the processing chamber will react if mixed and crystallize on the inner surface of the exhaust device, affecting the negative pressure requirement of the chamber and thus affecting the process processing effect of the wafer. Therefore, the shunt exhaust device is used to realize the separate exhaust of different properties of the gases in each chamber without interference.

[0048] The existing exhaust pipeline for discharging acidic gas, alkaline gas, and organic solvent is respectively connected with the exhaust interface of the processing chamber, and the multiple docking points of the exhaust pipeline increase the risk of gas leakage. The shunt pipeline of the embodiment includes a first shunt pipeline and a second shunt pipeline, and the first shunt pipeline and the second shunt pipeline are detachably and sealingly connected with the main pipeline. For example, the second shunt pipeline is a herringbone pipeline having two branch pipelines, which reduces the docking points of the shunt pipeline connected with the exhaust interface of the processing chamber and reduces the risk of gas leakage of the shunt pipeline.

[0049] The first shunt pipeline and the main pipeline are connected through a flange and a sealing gasket, and the second shunt pipeline and the main pipeline are also connected through a flange and a sealing gasket. The exhaust switching structure includes a driving structure and a baffle, and the driving structure is used to drive the baffle to open or block the branch pipelines of the first shunt pipeline and the second shunt pipeline. The switching structure of the embodiment drives the baffle to open or block the branch pipelines of the first shunt pipeline and the second shunt pipeline through the driving structure, and the exhaust switching structure is simple and easy to implement. The driving structure of the embodiment adopts a cylinder structure, and the first shunt pipeline and the branch pipelines of the second shunt pipeline are provided with cylinder structures. The three cylinder structures are arranged on the same side, the structure of the entire shunt exhaust device is compact, the shunt exhaust device of the embodiment can be directly installed at the bottom of the substrate processing equipment machine, and it is not necessary to separately provide an auxiliary machine, which greatly improves the space utilization.

[0050] The substrate processing device of the embodiment further includes a host computer, which is used to judge the properties of the gases generated in the processing chamber and is signal connected with the exhaust switching structure. The host computer can control the exhaust switching structure to open or block the first shunt pipeline and the branch pipeline according to the properties of the gases in the processing chamber, so as to guide the gases of different properties to different exhaust paths.

[0051] In actual application, the working process of the substrate processing device is as follows: first, the substrate is placed in the processing chamber, and the corresponding processing process is performed. During the processing, various waste gas or waste liquid, such as acidic gas, alkaline gas and organic solvent, is generated in the processing chamber. The host computer controls the switching of the exhaust switching structure according to the properties of the waste gas or waste liquid generated by the processing chamber. If it is required to guide the gas to the first shunt pipeline, the host computer controls the driving structure to drive the baffle to rotate to the position of opening the first shunt pipeline, and controls the driving structure to drive the baffle to rotate to the position of blocking the branch pipeline of the second shunt pipeline. If it is required to guide the gas to one of the branch pipelines of the second shunt pipeline, the host computer controls the driving structure to drive the baffle to rotate to the position of opening the branch pipeline, and controls the driving structure to drive the baffle to rotate to the position of blocking the other branch pipeline of the first shunt pipeline and the second shunt pipeline.

[0052] The substrate processing device provided by the embodiment of the present application comprises a processing chamber and a shunt exhaust device connected with the processing chamber. The shunt exhaust device comprises a main pipeline and a shunt pipeline. The main pipeline is used for connecting with the processing chamber. The shunt pipeline is connected with the main pipeline. The shunt pipeline comprises at least a first shunt pipeline and a second shunt pipeline. The first shunt pipeline and the second shunt pipeline are detachably and sealingly connected with the main pipeline. The first shunt pipeline and / or the second shunt pipeline comprises a plurality of branch pipelines. The exhaust switching structure is arranged on each branch pipeline of the first shunt pipeline and / or the second shunt pipeline. The exhaust switching structure is used for opening or blocking the branch pipeline of the first shunt pipeline and / or the second shunt pipeline. The first shunt pipeline and / or the second shunt pipeline of the shunt exhaust device comprises a plurality of branch pipelines. The abutting points of the branch pipelines and the main pipeline are reduced. The risk of gas leakage is reduced. The small integration of the shunt exhaust structure of the substrate processing device is realized. The installation space is saved.

[0053] In the above description, the description of the terms "an embodiment", "some embodiments", "an example", "a specific example", and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the present specification and the features of the different embodiments or examples without contradiction.

[0054] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A split-flow exhaust device, characterized in that: The invention comprises a main pipeline and a branch pipeline, wherein the main pipeline is used to be connected to the processing chamber, and the branch pipeline is connected to the main pipeline. The branch pipeline comprises at least a first branch pipeline and a second branch pipeline, and the first branch pipeline and the second branch pipeline are both detachably and sealedly connected to the main pipeline. The first branch pipeline and / or the second branch pipeline comprise a plurality of branch pipelines, and the plurality of branch pipelines in the same branch pipeline are docked with the main pipeline through the same docking port. The branch pipelines of the first branch pipeline and / or the second branch pipeline are both provided with an exhaust switching structure, and the exhaust switching structure is used to conduct or block the branch pipelines of the first branch pipeline and / or the second branch pipeline; The exhaust switching structure includes a driving structure and a baffle, wherein the driving structure is used to drive the baffle to open or close the branch pipes of the first diversion pipe and / or the second diversion pipe; The diversion exhaust device also includes an exhaust box connected to the branch pipes of the first diversion pipe and / or the second diversion pipe respectively, and an air pressure regulating port is provided on the pipeline between the baffle and the exhaust box; when the baffle blocks the branch pipes of the first diversion pipe and / or the second diversion pipe, the baffle opens the air pressure regulating port, and when the baffle connects the branch pipes of the first diversion pipe and / or the second diversion pipe, the baffle blocks the air pressure regulating port.

2. The diversion and exhaust device according to claim 1, characterized in that: The driving structure includes a driving part and a rotating shaft. The output end of the driving part is connected to the rotating shaft, and the baffle is fixed on the rotating shaft.

3. The split-flow exhaust device according to claim 2, characterized in that: The driving part is a motor, the output end of the motor is connected to the rotating shaft, or the driving part includes a cylinder, a rotating shaft connecting part and a connecting rod, the output end of the cylinder is fixedly connected to the rotating shaft connecting part, the rotating shaft connecting part is rotatably connected to the connecting rod, and the connecting rod is fixedly connected to the rotating shaft.

4. The diversion and exhaust device according to claim 3, characterized in that: The first shunt pipe is connected to the main pipe via a flange and a sealing gasket, and the second shunt pipe is connected to the main pipe via a flange and a sealing gasket.

5. The split-flow exhaust device according to claim 1, characterized in that: The opening size of the air pressure regulating port is adjustable.

6. The split-flow exhaust device according to claim 1, characterized in that: It also includes a chamber air pressure regulating box and a connection box connected to the chamber air pressure regulating box; The chamber air pressure regulating box is used to control the air pressure in the processing chamber, and the connecting box is used to be connected to the main pipeline.

7. A substrate processing device, characterized in that: It includes a host computer, a processing chamber and a diversion exhaust device connected to the processing chamber, the diversion exhaust device is the diversion exhaust device as described in any one of claims 1 to 6 above, and the host computer is used to determine the properties of the gas generated in the processing chamber, and control the exhaust switching structure to conduct or block the branch pipes of the first diversion pipe and / or the second diversion pipe according to the gas properties.

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