Monocrystalline silicon processing and cleaning equipment for photoelectric production

Abstract

The invention provides monocrystalline silicon processing and cleaning equipment for photoelectric production, and relates to the technical field of monocrystalline silicon cleaning.The monocrystalline silicon processing and cleaning equipment comprises a flushing tank, a flushing mechanism for flushing monocrystalline silicon is arranged on the flushing tank, an adjusting mechanism for adjusting the flushing mechanism is arranged on the flushing tank, and the flushing mechanism comprises a vertical rod, a water storage tank and a flow divider; the adjusting mechanism comprises an L-shaped support, a partition plate and a transverse rod, the vertical rod is fixedly installed at the upper end of the flushing tank, the water storage tank is fixedly installed at the side end of the flushing tank, and the L-shaped support is fixedly installed at the upper end of the flushing tank. According to the device, the threaded rods are matched with the threaded grooves, gaps among the multiple cleaning nozzles can be adjusted by rotating the threaded rods, all the cleaning nozzles can be synchronously controlled to adjust the gaps by rotating the threaded rods, the cleaning nozzles do not need to be adjusted one by one, the tedious process of adjusting the cleaning nozzles is simplified, and the cleaning efficiency is improved. And the adjusting efficiency of the equipment during flushing is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of single crystal silicon cleaning, and more specifically, relates to a single crystal silicon processing and cleaning device for photoelectric production. Background Art

[0002] Single crystal silicon is a semiconductor material with a complete crystal structure formed by orderly arrangement of silicon atoms along a single crystal direction. Its cleaning is to remove contaminants such as abrasive particles, metal ions and organic matter left over from processing, to prevent impurities from causing surface defects or electrical performance degradation, thereby ensuring the reliability and yield of semiconductor devices. The Chinese patent publication number is: CN118080435A. The second mounting bracket of the invention is connected to a cleaning component in a vertical sliding direction toward one side of the first mounting bracket, and a filtering structure is provided directly below the cleaning component. Through the setting of the structure, automatic cleaning of the material box is achieved, which saves time and effort and improves work efficiency.

[0003] Existing single crystal silicon processing equipment has the following disadvantages when cleaning: When washing single crystal silicon, the nozzles are usually fixed to the side walls of the cleaning tank. However, the fixed spacing between the single crystals varies. When washing, the fixed nozzles cannot ensure that the water flow penetrates the narrow gaps, resulting in blind spots on the sides of the silicon wafers and deep in the gaps, causing contaminants to remain. When washing existing single crystal silicon, the nozzle cannot be adjusted in height, that is, dynamic cleaning cannot be performed. Silicon wafers and silicon wafer slots have different specifications. The fixed-height nozzle cannot adapt to the washing of silicon wafers of multiple specifications. In the continuous spray mode, a large amount of cleaning liquid is sprayed, which not only increases the consumption of pure water and chemicals, but also increases the burden of wastewater treatment. Summary of the Invention

[0004] In order to solve the above technical problems, the present invention provides a single crystal silicon processing and cleaning equipment for photovoltaic production to solve the above problems.

[0005] A single crystal silicon processing and cleaning equipment for photovoltaic production includes a rinsing trough, wherein the rinsing trough is provided with a rinsing mechanism for rinsing single crystal silicon, and the rinsing trough is provided with an adjustment mechanism for adjusting the rinsing mechanism, the rinsing mechanism includes a vertical pole, a water storage tank and a diverter, and the adjustment mechanism includes an L-shaped bracket, a spacer and a cross bar, the vertical pole is fixedly installed at the upper end of the rinsing trough, the water storage tank is fixedly installed at the side end of the rinsing trough, the L-shaped bracket is fixedly installed at the upper end of the rinsing trough, a first connecting rod is fixedly installed between the diverter and the L-shaped bracket, the spacer and the cross bar are both located at the lower end of the L-shaped bracket, the inner side wall of the rinsing trough is provided with a silicon wafer fixing groove, and at least two silicon wafers are fixedly installed on the inner side wall of the silicon wafer fixing groove, the number of the vertical poles is four, and the vertical poles are in a group of two, and each group of the vertical poles is fixedly installed between It is equipped with the same mounting rod, and a cylinder is fixedly installed at the lower end of each mounting rod. There are two water tanks, and the upper ends of the two water tanks are penetrated by a mounting groove, and the inner side wall of each mounting groove is fixedly installed with a water hose. There are two L-shaped brackets, and the upper ends of the two L-shaped brackets are penetrated by a cylindrical groove, and the lower ends of the two L-shaped brackets are fixedly installed with two guide columns, and the inner side wall of the cylindrical groove is rotatably installed with a threaded rod, and the upper end of the diverter is penetrated by two connecting pipe grooves, and the ends of the two water hoses are fixedly installed on the inner side wall of the connecting pipe groove, and at least two connecting hoses are fixedly installed on the side end of the diverter, and each of the connecting hoses is fixedly installed with a metal conduit on the side end, and each of the metal conduits is fixedly installed with a cleaning nozzle on the side end.

[0006] Preferably, there are two intermediate plates, the upper ends of the two intermediate plates are penetrated by a thread groove and two guide grooves, the two side ends of the two intermediate plates are fixedly installed with adjustment plates, and the side ends of each adjustment plate are penetrated by at least two oblique grooves in an array.

[0007] Preferably, the number of the cross bars is four, and the cross bars are grouped in twos. The same connecting rod is fixedly installed between each group of cross bars, and a second connecting rod is fixedly installed between the connecting rod and the L-shaped bracket. A guide rail groove is penetrated through the side end of each cross bar, and each metal conduit is slidably installed in the guide rail groove and the inclined groove.

[0008] Compared with the prior art, the present invention has the following beneficial effects: In the present invention, by cooperating with an adjustment plate, an inclined groove, a cross bar and a guide groove, the gap of the cleaning nozzle can be adjusted when flushing the silicon wafer. By adjusting the position of the cleaning nozzle to accurately align it with the narrow gap between the silicon wafers, the problem that the water flow cannot cover the gap area during flushing with a traditional fixed nozzle is solved. The cleaning nozzle can dynamically match gaps of different widths to ensure that the water flow directly acts on the side of the silicon wafer and the depth of the gap, eliminating cleaning dead corners and improving flushing uniformity.

[0009] In the present invention, by cooperating with a threaded rod and a threaded groove, when adjusting the gap between multiple cleaning nozzles, it can be achieved by rotating the threaded rod. Rotating the threaded rod can synchronously control all cleaning nozzles to adjust the spacing, without the need to adjust the cleaning nozzles one by one, simplifying the cumbersome process of adjusting the cleaning nozzles, improving the adjustment efficiency of the equipment during flushing, reducing manual operation time, and saving manpower.

[0010] In the present invention, a connecting hose and a metal conduit are provided to cooperate with each other. When the cleaning nozzle is adjusted, the connecting hose and the metal conduit cooperate to ensure flexibility and precision. The connecting hose is connected to the diverter, and absorbs displacement deviations through deformation when the cleaning nozzle moves, thereby ensuring the sealing of liquid transportation. The metal conduit rigidly supports the cleaning nozzle to ensure that it maintains a stable trajectory and precise pointing during the adjustment process. The two work together to achieve a leak-free and deviation-free adjustment process.

[0011] In the present invention, a cylinder is provided to drive the cleaning nozzle to change its height, and the vertical movement can adapt to the cleaning requirements of silicon wafer fixing grooves of different thicknesses. At the same time, the periodic reciprocating movement can drive the cleaning nozzle to perform active flushing, thereby enhancing the flushing force of the water flow on the surface of the silicon wafer, adapting to different flushing needs, and facilitating the removal of stubborn pollutants.

[0012] In the present invention, by cooperating with the first connecting rod and the second connecting rod, when the L-shaped bracket moves, the diverter and the cross bar can be driven to move at the same time by the first connecting rod and the second connecting rod, so that they and the cleaning nozzle can move synchronously, and the moving path is continued to be constrained by the guide rail groove on the cross bar, effectively suppressing the shaking or deviation of the cleaning nozzle, ensuring the water flow positioning accuracy during the flushing process, and ensuring the stability of the equipment during adjustment. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a structural schematic diagram of the flushing tank of the present invention; Figure 2 It is a schematic structural diagram of the silicon wafer of the present invention; Figure 3 It is a structural schematic diagram of the mounting rod of the present invention; Figure 4 It is a structural schematic diagram of the water storage tank of the present invention; Figure 5 It is a structural schematic diagram of the L-shaped bracket of the present invention; Figure 6 It is a structural schematic diagram of the crossbar of the present invention; Figure 7 It is a structural schematic diagram of the adjustment plate of the present invention; Figure 8 It is a schematic structural diagram of the metal conduit of the present invention.

[0014] In the figure, the correspondence between the component names and the drawing numbers is: 1. Flushing trough; 11. Silicon wafer fixing trough; 12. Silicon wafer body; 2. Vertical pole; 21. Mounting rod; 22. Cylinder; 3. Water storage tank; 31. Mounting trough; 32. Water guide hose; 4. L-shaped bracket; 41. Columnar groove; 42. First connecting rod; 43. Guide column; 45. Threaded rod; 5. Diverter; 51. Connecting pipe groove; 52. Metal conduit; 53. Cleaning nozzle; 54. Connecting hose; 6. Spacer; 61. Threaded groove; 62. Guide groove; 63. Adjustment plate; 64. Bevel groove; 7. Cross bar; 71. Guide rail groove; 72. Connecting rod; 73. Second connecting rod. DETAILED DESCRIPTION

[0015] The following embodiments of the present invention are described in further detail with reference to the accompanying drawings and examples. The following examples are used to illustrate the present invention but are not intended to limit the scope of the present invention.

[0016] See also Figures 1-8 The present invention provides a single crystal silicon processing and cleaning device for photovoltaic production, comprising a rinsing tank 1, a rinsing mechanism for rinsing the single crystal silicon being provided on the rinsing tank 1, an adjusting mechanism for adjusting the rinsing mechanism being provided on the rinsing tank 1, the rinsing mechanism comprising a vertical pole 2, a water storage tank 3 and a diverter 5, and the adjusting mechanism comprising an L-shaped bracket 4, an intermediate plate 6 and a cross bar 7. During the processing of single crystal silicon such as grinding and polishing, various surface defects and contamination will be generated, and the surface of the single crystal silicon needs to be cleaned through multiple steps, such as chemical agent immersion, ultrasonic cleaning, high-pressure water flow flushing, etc. When flushing the single crystal silicon, a silicon wafer body 12 can be placed and fixed in a silicon wafer fixing tank 11, and the silicon wafer fixing tank 11 is placed in the rinsing tank 1, and the water pump in the water storage tank 3 is started to pump the cleaning water into the water guide hose 32, and the water enters the diverter 5 from the water guide hose 32, and then passes through the connecting hose 54 and the metal conduit 52, and is sprayed out by the cleaning nozzle 53 to flush the silicon wafer body 12; The vertical pole 2 is fixedly mounted on the upper end of the flushing trough 1, the water storage tank 3 is fixedly mounted on the side end of the flushing trough 1, the L-shaped bracket 4 is fixedly mounted on the upper end of the flushing trough 1, and a first connecting rod 42 is fixedly mounted between the diverter 5 and the L-shaped bracket 4. The intermediate plate 6 and the cross bar 7 are both located at the lower end of the L-shaped bracket 4. The inner side wall of the flushing trough 1 is provided with a silicon wafer fixing groove 11, and at least two silicon wafers 12 are fixedly mounted on the inner side wall of the silicon wafer fixing groove 11. There are four vertical poles 2, and the vertical poles 2 are grouped in two. The same mounting rod 21 is fixedly mounted between each group of vertical poles 2, and a cylinder 22 is fixedly mounted on the lower end of each mounting rod 21. After completing the adjustment of the cleaning nozzle 53, The user can adjust the height of the cleaning nozzle 53 according to the washing requirements of the silicon wafer 12. The user can activate the cylinder 22 to drive the L-shaped bracket 4 to move upward or downward. The movement of the L-shaped bracket 4 drives the diverter 5 and the two cross bars 7 to move respectively through the first connecting rod 42 and the second connecting rod 73. The two adjustment plates 63 are driven to move through the threaded rod 45 to achieve the upward or downward movement of the cleaning nozzle 53. The cleaning nozzle 53 is moved to a position suitable for washing the silicon wafer 12. At the same time, during the washing of the silicon wafer 12, the cylinder 22 can be activated to drive the L-shaped bracket 4 to move up and down, and then the cleaning nozzle 53 is used to reciprocate and wash the silicon wafer 12. There are two water storage tanks 3, and the upper ends of the two water storage tanks 3 are penetrated with a mounting groove 31, and the inner side wall of each mounting groove 31 is fixedly installed with a water hose 32. There are two L-shaped brackets 4, and the upper ends of the two L-shaped brackets 4 are penetrated with a cylindrical groove 41, and the lower ends of the two L-shaped brackets 4 are fixedly installed with two guide columns 43. The inner side wall of the cylindrical groove 41 is rotatably installed with a threaded rod 45. The upper end of the diverter 5 is penetrated with two connecting pipe grooves 51, and the ends of the two water hoses 32 are fixedly installed on the inner side wall of the connecting pipe groove 51. The side end of the diverter 5 is fixedly installed with at least two connecting hoses 54, and the side end of each connecting hose 54 is A metal conduit 52 is fixedly installed, and a cleaning nozzle 53 is fixedly installed on the side end of each metal conduit 52. There are two intermediate plates 6. The upper ends of the two intermediate plates 6 are penetrated by a threaded groove 61 and two guide grooves 62. Adjustment plates 63 are fixedly installed on the two side ends of the two intermediate plates 6. The side end of each adjustment plate 63 is penetrated by at least two inclined grooves 64 in an array. The user can rotate the threaded rod 45, and the threaded rod 45 rotates through the threaded groove 61 to drive the intermediate plate 6 to move upward. Because the two guide posts 43 are located on the inner side walls of the guide groove 62, the intermediate plate 6 will move upward along the two guide posts 43. The upward movement of the intermediate plate 6 will drive the two adjustment plates 63 to move upward. There are four crossbars 7, and the crossbars 7 are grouped in pairs. A connecting rod 72 is fixedly installed between each group of crossbars 7. A second connecting rod 73 is fixedly installed between the connecting rod 72 and the L-shaped bracket 4. A guide groove 71 is penetrated at the side end of each crossbar 7. Each metal conduit 52 is slidably installed in the guide groove 71 and the inclined groove 64. Since the adjusting plate 63 is provided with an inclined groove 64, the inclined grooves 64 on the two adjusting plates 63 are symmetrically distributed from the middle. When the adjusting plate 63 drives the inclined groove 64 to move upward, At this time, each cleaning nozzle 53 will slide in the guide groove 71 and move away from each other, so that the distance between each cleaning nozzle 53 is gradually widened. The user can continue to rotate the threaded rod 45. When the position of each cleaning nozzle 53 matches the gap between each silicon wafer 12, the user can stop rotating the threaded rod 45. At this time, the user can start the water pump in the water tank 3 to pump the cleaning water into the water hose 32, and then into the diverter 5 from the water hose 32, and finally sprayed out by the cleaning nozzle 53 to rinse the silicon wafer 12.

[0017] Working principle: In the first step, single crystal silicon will produce various surface defects and pollution during the processing such as grinding and polishing. The surface of the single crystal silicon needs to be cleaned through multiple steps, such as chemical immersion, ultrasonic cleaning, high-pressure water flushing, etc. When flushing the single crystal silicon, the silicon wafer body 12 can be placed and fixed in the silicon wafer fixing groove 11, and the silicon wafer fixing groove 11 can be placed in the flushing groove 1. The water pump in the water tank 3 is started to pump the cleaning water into the water hose 32, and the water enters the diverter 5 from the water hose 32, and then passes through the connecting hose 54 and the metal conduit 52, and is sprayed out by the cleaning nozzle 53 to flush the silicon wafer body 12.

[0018] In the second step, when the user rinses the silicon wafer 12, the ground and polished silicon wafer 12 needs to be placed and fixed in the silicon wafer fixing groove 11. The fixing frame provided in the silicon wafer fixing groove 11 allows a certain gap between the silicon wafers 12 and the silicon wafers 12 to facilitate rinsing. The user can place the silicon wafer fixing groove 11 on the inner wall of the rinsing tank 1 and start rinsing and cleaning. Due to the different thicknesses of the silicon wafers 12 and the different specifications of the silicon wafer fixing grooves 11, when silicon wafers 12 of different thicknesses are fixed in silicon wafer fixing grooves 11 of different specifications, the gaps between the silicon wafers 12 are different. The user can adjust the position of each cleaning nozzle 53 according to the gap between the silicon wafers 12. The user can rotate the threaded rod 45. The threaded rod 45 rotates through the threaded groove 61 to drive the intermediate plate 6 to move upward. Because the two guide posts 43 are located in the guide groove 62, the intermediate plate 6 moves upward. The inner wall of the intermediate plate 6 will move upward along the two guide columns 43, and the upward movement of the intermediate plate 6 will drive the two adjusting plates 63 to move upward. Because the adjusting plates 63 are provided with inclined grooves 64, the inclined grooves 64 on the two adjusting plates 63 are symmetrically distributed from the middle. When the adjusting plates 63 drive the inclined grooves 64 to move upward, each cleaning nozzle 53 will slide in the guide groove 71 and move away from each other, so that the distance between each cleaning nozzle 53 is gradually widened. The user can continue to rotate the threaded rod 45. When the position of each cleaning nozzle 53 matches the gap between each silicon wafer 12, the user can stop rotating the threaded rod 45. At this time, the user can start the water pump in the water storage tank 3 to pump the cleaning water into the water guide hose 32, and then the water guide hose 32 enters the diverter 5, and finally sprays it out from the cleaning nozzle 53 to rinse the silicon wafer 12. This device is equipped with an adjustment plate 63, an inclined groove 64, a cross bar 7 and a guide groove 71. When flushing the silicon wafer 12, the gap of the cleaning nozzle 53 can be adjusted. By adjusting the position of the cleaning nozzle 53 to accurately align it with the narrow gap between the silicon wafers 12, the problem that the water flow cannot cover the gap area during flushing with a traditional fixed nozzle is solved. The cleaning nozzle 53 can dynamically match gaps of different widths to ensure that the water flow directly acts on the side of the silicon wafer 12 and the deep part of the gap, eliminating cleaning dead corners and improving flushing uniformity.

[0019] The present device is provided with a threaded rod 45 and a threaded groove 61, and when adjusting the gap between multiple cleaning nozzles 53, it can be achieved by rotating the threaded rod 45. Rotating the threaded rod 45 can synchronously control the spacing adjustment of all cleaning nozzles 53, eliminating the need to adjust the cleaning nozzles 53 one by one, simplifying the cumbersome process of adjusting the cleaning nozzles 53, improving the adjustment efficiency of the equipment during flushing, reducing manual operation time, and saving manpower; This device cooperates with a connecting hose 54 and a metal conduit 52. When adjusting the cleaning nozzle 53, the connecting hose 54 cooperates with the metal conduit 52 to ensure flexibility and precision. The connecting hose 54 is connected to the diverter 5, and absorbs displacement deviations through deformation when the cleaning nozzle 53 moves, thereby ensuring the sealing of liquid transportation. The metal conduit 52 rigidly supports the cleaning nozzle 53, ensuring that it maintains a stable trajectory and precise pointing during the adjustment process. The two work together to achieve a leak-free and deviation-free adjustment process.

[0020] In the third step, after completing the adjustment of the cleaning nozzle 53, the user can adjust the height of the cleaning nozzle 53 according to the washing requirements of the silicon wafer 12. The user can activate the cylinder 22 to drive the L-shaped bracket 4 to move upward or downward. The movement of the L-shaped bracket 4 drives the diverter 5 and the two cross bars 7 to move respectively through the first connecting rod 42 and the second connecting rod 73. The two adjustment plates 63 are driven to move through the threaded rod 45 to achieve the upward or downward movement of the cleaning nozzle 53, and move the cleaning nozzle 53 to a position suitable for washing the silicon wafer 12. At the same time, during the washing of the silicon wafer 12, the cylinder 22 can be activated to drive the L-shaped bracket 4 to move up and down, and then the silicon wafer 12 is rinsed and sprayed with water reciprocatingly through the cleaning nozzle 53. The device is provided with a cylinder 22, which can drive the cleaning nozzle 53 to change its height. The vertical movement can adapt to the cleaning requirements of the silicon wafer fixing groove 11 with different thicknesses. At the same time, the periodic reciprocating movement can drive the cleaning nozzle 53 to perform active flushing, thereby enhancing the flushing force of the water flow on the surface of the silicon wafer body 12, which can adapt to different flushing requirements and facilitate the removal of stubborn contaminants. This device is equipped with a first connecting rod 42 and a second connecting rod 73. When the L-shaped bracket 4 moves, the first connecting rod 42 and the second connecting rod 73 can simultaneously drive the diverter 5 and the cross bar 7 to move, thereby making them move synchronously with the cleaning nozzle 53, and continue to constrain the moving path through the guide rail groove 71 on the cross bar 7, effectively suppressing the shaking or deviation of the cleaning nozzle 53, ensuring the water flow positioning accuracy during the flushing process, and ensuring the stability of the equipment during adjustment.

[0021] The embodiments of the present invention are presented for purposes of illustration and description and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those skilled in the art. The embodiments are chosen and described in order to better illustrate the principles of the invention and its practical application and to enable those skilled in the art to understand the invention and design various embodiments with various modifications as suited for specific applications.

Claims

1. A single crystal silicon processing and cleaning device for photovoltaic production, comprising a flushing tank (1), characterized in that: The flushing tank (1) is provided with a flushing mechanism for flushing the single crystal silicon, and the flushing tank (1) is provided with an adjustment mechanism for adjusting the flushing mechanism; The flushing mechanism comprises a vertical rod (2), a water storage tank (3) and a diverter (5); the regulating mechanism comprises an L-shaped bracket (4), an intermediate plate (6) and a cross bar (7); the vertical rod (2) is fixedly mounted on the upper end of the flushing trough (1); the water storage tank (3) is fixedly mounted on the side end of the flushing trough (1); the L-shaped bracket (4) is fixedly mounted on the upper end of the flushing trough (1); a first connecting rod (42) is fixedly mounted between the diverter (5) and the L-shaped bracket (4); and the intermediate plate (6) and the cross bar (7) are both located at the lower end of the L-shaped bracket (4).

2. A single crystal silicon processing and cleaning device for photovoltaic production according to claim 1, characterized in that: The inner side wall of the rinsing tank (1) is provided with a silicon wafer fixing tank (11), and at least two silicon wafer bodies (12) are fixedly mounted on the inner side wall of the silicon wafer fixing tank (11).

3. A single crystal silicon processing and cleaning device for photovoltaic production as claimed in claim 2, characterized in that: The number of the vertical poles (2) is four, and the vertical poles (2) are arranged in groups of two. A common mounting rod (21) is fixedly mounted between the vertical poles (2) in each group, and a cylinder (22) is fixedly mounted at the lower end of each mounting rod (21).

4. A single crystal silicon processing and cleaning device for photovoltaic production as claimed in claim 3, characterized in that: There are two water storage tanks (3), and an installation groove (31) is provided through the upper end of each of the two water storage tanks (3). A water guide hose (32) is fixedly installed on the inner side wall of each installation groove (31).

5. The single crystal silicon processing and cleaning equipment for photovoltaic production according to claim 4, characterized in that: There are two L-shaped brackets (4), and the upper ends of the two L-shaped brackets (4) are both provided with a cylindrical groove (41).

6. The single crystal silicon processing and cleaning equipment for photovoltaic production according to claim 5, characterized in that: Two guide columns (43) are fixedly mounted on the lower ends of the two L-shaped brackets (4), and a threaded rod (45) is rotatably mounted on the inner side wall of the columnar groove (41).

7. A single crystal silicon processing and cleaning device for photovoltaic production according to claim 6, characterized in that: Two connecting pipe grooves (51) are formed through the upper end of the diverter (5), and the ends of the two water-conducting hoses (32) are fixedly mounted on the inner side walls of the connecting pipe grooves (51).

8. The single crystal silicon processing and cleaning equipment for photovoltaic production according to claim 7, characterized in that: At least two connecting hoses (54) are fixedly mounted on the side end of the diverter (5), a metal conduit (52) is fixedly mounted on the side end of each connecting hose (54), and a cleaning nozzle (53) is fixedly mounted on the side end of each metal conduit (52).

9. The single crystal silicon processing and cleaning equipment for photovoltaic production according to claim 8, characterized in that: There are two intermediate plates (6), and the upper ends of the two intermediate plates (6) are penetrated by a thread groove (61) and two guide grooves (62). The two side ends of the two intermediate plates (6) are fixedly mounted with an adjustment plate (63), and the side end of each adjustment plate (63) is penetrated by at least two inclined grooves (64) in an array.

10. The single crystal silicon processing and cleaning equipment for photovoltaic production according to claim 9, characterized in that: The number of the cross bars (7) is four, and the cross bars (7) are arranged in groups of two. A common connecting rod (72) is fixedly installed between each group of cross bars (7); A second connecting rod (73) is fixedly installed between the receiving rod (72) and the L-shaped bracket (4), a guide rail groove (71) is provided through the side end of each cross bar (7), and each metal conduit (52) is slidably installed in the guide rail groove (71) and the inclined groove (64).

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