Semiconductor process furnace

Abstract

The invention discloses a semiconductor process furnace which comprises a cylindrical furnace body, a plurality of electrode holders used for being connected with a heater are arranged at the first end of the furnace body, a spiral heat dissipation water channel is arranged at the first end of the furnace body, and the electrode holders are arranged along the spiral heat dissipation water channel. The top cover adopts the spiral heat dissipation water channel and is combined with the position of the electrode holder, so that the layout is compact and the cooling is uniform; the second end flange area is provided with an arc-shaped water channel and a roundabout coiling water channel, the flow channel path is long, flow speed control is reasonable, and heat exchange is sufficient; a plurality of arc-shaped heat dissipation water channels on the side wall of the furnace body are connected through flow guide openings which are axially connected in series and circumferentially staggered, cooling liquid is forced to flow in a distributed mode according to a set path, and local short circuit is completely eradicated; and the problems of non-uniform temperature and hot spot accumulation in long-temperature-zone process equipment can be effectively solved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor production process equipment, in particular to a semiconductor process furnace. Background Art

[0002] With the widespread adoption of third-generation semiconductor materials (such as silicon carbide (SiC) and gallium nitride (GaN)), the associated manufacturing process equipment is placing higher demands on high-temperature processing performance. In particular, the activation annealing of SiC materials after ion implantation typically requires ultra-high temperatures exceeding 2000°C, posing a significant challenge to both heating and thermal control systems.

[0003] To achieve high-temperature processing, equipment typically uses resistance heating or induction heaters, connected to the heating elements within the furnace via multiple sets of electrode holders. External insulation (such as carbon felt) is used to reduce heat loss. However, even with these insulation measures, a significant amount of heat is still transferred to the furnace through radiation and conduction, particularly in the electrode area directly connected to the heater. This area, while carrying current, also becomes a critical heat concentration point.

[0004] Therefore, how to optimize the heat dissipation structure at the end of the furnace body and achieve efficient cooling around the electrode holder without affecting the electrode wiring and heating efficiency is a key technical problem that needs to be solved urgently in this field. Summary of the Invention

[0005] The present invention aims to solve the problems of uneven cooling coverage, overheating of the electrode area and complex structural arrangement existing in existing semiconductor high-temperature process equipment, and provides a semiconductor process furnace.

[0006] The technical solution adopted by the present invention is to design a semiconductor process furnace, including a cylindrical furnace body, a first end of which is provided with multiple electrode seats for connecting to a heater, a first end of which is provided with a spiral heat dissipation water channel, and the electrode seats are arranged along the spiral heat dissipation water channel.

[0007] In some embodiments, a water inlet of the water channel is provided at the head end of the spiral line of the spiral heat dissipating water channel, and the water inlet is connected to the water inlet joint through a water inlet channel provided on the first end.

[0008] In certain embodiments, the tail end of the spiral line of the spiral heat dissipation water channel is connected to a water outlet joint.

[0009] In some embodiments, the first end includes a furnace body top cover, the spiral heat dissipation water channel is provided on the top cover, and the depth of the spiral heat dissipation water channel gradually decreases from the head end to the tail end.

[0010] In certain embodiments, the top cover includes a top cover base and a cover plate, the spiral heat dissipation channel is provided in a spiral groove on the top cover base, and the cover plate is sealingly covered on the spiral groove.

[0011] In some embodiments, a water inlet channel connecting the water inlet and the water inlet connector is provided on the top cover base.

[0012] In some embodiments, a plurality of annular heat dissipation water channels arranged along the axis of the furnace body are provided on the side wall between the two ends of the furnace body, adjacent annular heat dissipation water channels are connected by guide ports, and the positions of adjacent guide ports in the circumferential direction are staggered with each other. A water inlet connected to the annular heat dissipation water channels is provided at the bottom of the furnace body, and a water outlet connected to the annular heat dissipation water channels is provided at the upper part of the furnace body.

[0013] In some embodiments, several mounting bases and cooling water pipes for installing temperature control or temperature measuring elements in the furnace are provided on the side wall of the furnace body. The mounting base has an interlayer water channel, and the cooling water pipe is connected to the interlayer water channel on the mounting base. The two ends of the cooling water pipe are respectively connected to the water supply port and the water inlet.

[0014] In some embodiments, an end flange is provided on the second end of the furnace body opposite to the first end, and an arc-shaped water channel is provided in the middle of the end flange. A circuitous heat dissipation water channel is concentrically coiled between the arc-shaped water channel and the edge of the end flange. One end of the arc-shaped water channel is connected to the water inlet joint, and the other end is connected to the water outlet joint of the circuitous heat dissipation water channel. In the radial direction, the inner end of the circuitous heat dissipation water channel is connected to the water inlet joint, and the outer end of the circuitous heat dissipation water channel is connected to the water outlet joint.

[0015] In some embodiments, the curved water channel and the circuitous heat dissipation water channel are both grooves opened on the end flange, the groove of the circuitous heat dissipation water channel is covered with a sealing plate, the curved water channel is arranged on an annular water channel wall, the water channel wall is higher than the sealing plate, and the water inlet joint and the water outlet joint are connected in parallel on the water channel wall between the two ends of the curved water channel, and the water inlet joint and the water outlet joint are connected to the water inlet port of the curved water channel and the water outlet port of the circuitous heat dissipation water channel through through holes opened on the water channel wall.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The present invention designs a rationally structured cooling water channel system at the first end, the second end and the side wall of the furnace body, respectively, to form a multi-stage cooling system with independent partitions and coherent coordination; it can cope with the strong heat flow generated when processing ultra-high temperature (>2000℃) SiC and other semiconductor materials, and effectively prevent the furnace body from overheating and local heat accumulation. The first end top cover adopts a spiral heat dissipation water channel, combined with the position of the electrode seat, with a compact layout and uniform cooling; the second end flange area is provided with an arc water channel and a circuitous winding water channel, with a long flow path, reasonable flow rate control, and sufficient heat exchange; all water channel designs follow the principles of process continuity, path extension, and reasonable direction to maximize heat exchange efficiency. All cooling water channels adopt a structure in which grooves are directly opened on the surface of the furnace body or flange, and then sealed with a sealing plate, which is suitable for CNC processing and modular production; multiple arc heat dissipation water channels on the side wall of the furnace body are connected by axial series and circumferentially staggered guide ports, forcing the coolant to flow according to the set path distribution, eliminating local short circuits; it can effectively solve the problems of uneven temperature and hot spot accumulation in long temperature zone process equipment. A sandwich water channel cooling structure is set in the temperature measuring element mounting seat, and water is supplied in series through cooling water pipes; this prevents the sensor from losing accuracy or burning out at high temperatures, extends its service life, and improves the reliability and accuracy of temperature control in the process. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention is described in detail below with reference to specific embodiments and accompanying drawings. To illustrate details and facilitate understanding of its principles, the drawings are not necessarily drawn to scale, and similar reference numerals may describe similar components in different views. The accompanying drawings generally illustrate the embodiments discussed herein by way of example and not limitation. Among them:

[0019] Figure 1 It is a three-dimensional schematic diagram of the process furnace.

[0020] Figure 2 It is an exploded schematic diagram of the process furnace.

[0021] Figure 3 It is an exploded diagram of the furnace top cover.

[0022] Figure 4 It is a schematic diagram of the spiral groove on the furnace top cover.

[0023] Figure 5 yes Figure 4 AA cross-section diagram.

[0024] Figure 6 It is a perspective diagram of the furnace top cover.

[0025] Figure 7 It is a schematic diagram of the process furnace in an upright state.

[0026] Figure 8 It is a schematic diagram showing the annular heat dissipation water channel in the side wall of the furnace body.

[0027] Figure 9 This is a schematic diagram of the mounting base.

[0028] Figure 10 Schematic cross-sectional view of the mounting base.

[0029] Figure 11 is a schematic diagram of the end flange.

[0030] Figure 12 It is an exploded diagram of the end flange.

[0031] In the figure, 1, electrode holder; 2, spiral cooling water channel; 3, water inlet; 4, first water inlet joint; 5, first water outlet joint; 6, furnace body top cover; 61, top cover base; 611, water inlet channel; 62, cover plate; 7, first seal; 8, annular cooling water channel; 81, diversion port; 82, water inlet; 83, water outlet; 9, cooling water pipe; 91, water supply port; 10, end flange; 101, arc water channel; 1011, Water inlet port; 1012, water outlet end of the arc-shaped water channel; 1021, water outlet port; 102, circuitous heat dissipation water channel; 103, radial reflux groove; 104, water channel wall; 105, connecting groove; 11, second water inlet joint; 12, second water outlet joint; 13, sealing plate; 14, first through hole; 15, second through hole; 16, second sealing strip; 161, interlayer water channel; 17, mounting seat; 18, furnace body; 19, second sealing plate. DETAILED DESCRIPTION

[0032] The following are specific embodiments of the present invention, which are further described in conjunction with the accompanying drawings to further illustrate the technical solutions of the present invention. However, the present invention is not limited to these embodiments, and the following embodiments do not limit the inventions involved in the claims. In addition, not all combinations of features described in the embodiments are necessarily required for the solutions of the invention.

[0033] The principle and structure of the present invention are described in detail below with reference to the accompanying drawings and embodiments.

[0034] Example

[0035] like Figures 1 to 6 As shown, a semiconductor process furnace includes a cylindrical furnace body 18. A plurality of electrode holders 1 for connecting to a heater are disposed on a first end of the furnace body 18. Spiral heat dissipation channels 2 are also disposed on the first end of the furnace body 18, and the electrode holders 1 are arranged along the spiral heat dissipation channels 2. In this embodiment, the first end of the furnace body 18 is a top cover 6 of the furnace body 18, and a second end opposite the first end is an end flange 10.

[0036] Specifically, a spiral water-cooling channel is provided at the first end of the furnace body 18, so that the cooling water flows in this area along a spiral path. Compared with a straight or return channel, the spiral path has a larger contact area and a longer heat exchange path, which is beneficial to improving the heat exchange efficiency; the spiral path slowly advances along the axial or tangential direction of the furnace body 18, which can effectively cover the entire high-temperature end face and achieve more comprehensive cooling coverage. The electrode holder 1 is used to connect the heater and is a key position for the input of electric power. When working, it will accumulate a large amount of heat due to contact resistance, thermal conductivity and other reasons; arranging the electrode holder 1 along the path of the spiral water channel means that each electrode holder 1 is close to the cooling water circulation area, which can achieve fixed-point heat exchange; because the spiral structure itself has the distribution advantage of "continuous near-water flow", that is, the water channel is naturally close to each component distributed thereon in geometry, so it can ensure that the local temperature rise of each electrode holder 1 is evenly controlled. The cylindrical furnace body 18 combined with the spiral flow channel and the structure of the electrodes arranged along the path can physically achieve axisymmetric or spirally symmetric heat distribution; this is conducive to reducing local deformation and expansion deviation of the furnace body 18 caused by uneven thermal stress and enhancing the overall stability of the structure.

[0037] Electrode holder 1's direct proximity to the water channel effectively removes localized heat buildup during electrical conduction, reducing the risk of overheating. The stable temperature surrounding electrode holder 1 extends the life of the electrical connection and prevents loosening, oxidation, or breakdown of contact components caused by high temperatures. This effectively suppresses heat buildup at the ends, maintaining symmetry and controllability of the temperature field within the furnace chamber, making it suitable for SiC processes requiring extremely high temperature distribution.

[0038] The water inlet 3 of the water channel is set at the head end of the spiral line of the spiral heat dissipating water channel 2, and the water inlet 3 is connected to the first water inlet joint 4 through the water inlet channel 611 set on the first end. This solution sets the water inlet 3 at the starting position of the spiral heat dissipating water channel 2 (i.e. the head end of the spiral line), so that the coolant flows from this point along the entire spiral water channel path; the spiral flow channel naturally has a long flow path and a continuous heat exchange surface, and the coolant flows through all the spiral sections in sequence from the starting point, which is conducive to removing heat layer by layer, and the cooling process is stable and uniform. The water inlet 3 is connected to the first water inlet joint 4 set outside through the water inlet channel 611, forming a passage for supplying water from the external cooling system to the spiral water channel inside the furnace body 18; the water inlet channel 611 can be opened as a drilled hole, a milled groove or a built-in cooling hole according to the end structure of the furnace body 18, and is usually arranged radially or axially through to ensure that the coolant can be smoothly transported to the head end of the water channel. This structure allows the coolant to be continuously advanced along a spiral path from the center or one end to the other, covering the area where the electrode holder 1 is located to the maximum extent, forming a spiral-shaped heat exchange zone; the coolant absorbs heat as it flows along the path, and the temperature at the outlet gradually rises, forming an orderly heat exchange process controlled by a thermal gradient, avoiding cooling failure caused by local dead water areas or turbulence.

[0039] The tail end of the spiral cooling water channel 2 is connected to the first water outlet connector 5. A water outlet 83 is provided at the terminus of the spiral cooling water channel 2 (i.e., the tail end of the spiral), and is connected to the first water outlet connector 5 located on the first end of the furnace body 18 through a channel, forming a complete closed circulation path for the coolant. The coolant enters through the water inlet 3 at the beginning of the spiral, rises or rotates along the spiral channel, and is finally discharged from the tail end, completing a complete heat exchange cycle. Having a clear outlet helps stabilize the flow resistance within the system and can form a stable pressure differential with the inlet flow rate, ensuring continuous propulsion of the coolant within the spiral channel and avoiding stagnation. By designing the appropriate outlet channel diameter and discharge direction, problems such as liquid retention, bubble accumulation, and localized temperature anomalies can also be reduced. The first water outlet connector 5 can be connected to the return pipe of an external cooling system, forming a water inlet-spiral channel-outlet circulation path. This can be used in conjunction with industrial water cooling devices, such as constant temperature circulating water tanks or chillers. Depending on the relative position of the connectors, different installation methods such as axial, radial, or lateral water outlet can be achieved to adapt to the spatial layout of the equipment.

[0040] The first end includes a top cover 6 of the furnace body 18, on which the spiral cooling water channel 2 is disposed. The depth of the spiral cooling water channel 2 gradually decreases from the head end to the tail end. The spiral cooling water channel 2 is disposed on the top cover at the first end of the furnace body 18, becoming a component of the top cover structure, serving the dual functions of covering and enclosing the furnace body 18 and dissipating heat. This design, by directly machining or casting the spiral channel body into the top cover, improves structural compactness and facilitates a unified overall thermal control design. The water channel gradually decreases in depth from the head end to the tail end, meaning that the cross-section of the channel gradually decreases from the inlet to the outlet. This design, based on the fluid continuity equation (conservation of mass) and the principle of heat exchange control, can control the flow rate of cooling water in different sections: the front section of the channel is deep and the flow rate is relatively slow, facilitating sufficient heat exchange in the high-heat area; the rear section of the channel is shallow and narrow, creating a certain back pressure, which increases the flow rate and facilitates the rapid removal of heat at the tail end, preventing the accumulation of heat tail. Overall, a "slow at the beginning and fast at the end" cooling flow rate gradient can be achieved, optimizing cooling efficiency along the entire process. If the top cover water channel is set in a slightly inclined direction (especially the tail end is lower than the head end), gravity can be used to assist the water flow out, reducing the risk of water retention at the tail; at the same time, it is conducive to the smooth outflow of condensed water or impurity deposits, thereby extending the operating life of the system.

[0041] The top cover comprises a top cover base 61 and a cover plate 62. The spiral cooling channel 2 defines a spiral groove on the top cover base 61, and the cover plate 62 seals over the groove. The spiral cooling channel 2 is designed as a slotted structure, with a specifically shaped spiral groove machined into the surface of the top cover base 61. Its cross-section can be rectangular, semicircular, or trapezoidal. This structure is easily fabricated using CNC milling, combined turning and milling, or casting, offering ease of manufacture and high precision. A flat cover plate 62 is placed over the open surface of the spiral groove in the top cover base 61 and secured by bolts, welding, flaring, press-fitting, or adhesive sealing to form a closed channel. Once the cover plate 62 seals the spiral groove, the cooling channel is complete, offering excellent sealing and mechanical stability. The split structure of the top cover, consisting of the base and cover plate 62, facilitates inspection, cleaning, and maintenance of the cooling channel interior. If the interior becomes clogged or corroded, maintenance can be performed by simply removing the cover plate 62, significantly improving upon the inherent inability to disassemble the integrally cast channel structure.

[0042] The top cover base 61 is provided with a water inlet channel 611 communicating with the water inlet 3 and the first water inlet connector 4 .

[0043] A water inlet channel 611 is directly machined on the top cover base 61, and the two ends of the channel are respectively connected to the head end of the spiral heat dissipation water channel 2 (i.e., the water inlet 3) and the first water inlet connector 4 provided on the outer surface of the top cover; thus, a complete water supply path is formed, which is connected from the external cooling system through the first water inlet connector 4, the water inlet channel 611, and the head end of the water channel. Compared with external pipes or welded branches, the channel is built into the top cover base 61, which is more compact and reduces the number of parts; this design can be achieved by mechanical drilling, milling and sealing, or sandwich casting; the channel cross-section can be circular, rectangular, or special-shaped according to the pressure and flow requirements. The position, length, and direction of the water inlet channel 611 can be flexibly designed according to the equipment layout, and is compatible with water inlet connections in different directions (such as radial / axial / lateral).

[0044] The water inlet channel 611 is a groove opened on the inner side of the top cover. The water inlet channel 611 is formed by welding a first sealing strip 7 covering the groove.

[0045] like Figures 7 to 10 As shown, a plurality of annular heat dissipation water channels 8 are arranged along the axial direction of the furnace body 18 on the side wall between the two ends of the furnace body 18. Adjacent annular heat dissipation water channels 8 are connected by guide ports 81. The positions of adjacent guide ports 81 in the circumferential direction are staggered. A water inlet 82 connected to the annular heat dissipation water channels 8 is provided at the bottom of the furnace body 18, and a water outlet 83 connected to the annular heat dissipation water channels 8 is provided at the upper part of the furnace body 18.

[0046] A plurality of annular heat dissipation channels 8 are arranged in sequence along the axial direction in the side wall area of ​​the furnace body 18 (i.e., the circumferential side of the cylinder). Each annular heat dissipation channel 8 covers a certain angle on the circumference, forming partial coverage. The plurality of annular heat dissipation channels 8 together constitute a cooling chain along the height direction of the furnace body 18, which can cover the heating areas at different elevations layer by layer. The water channels are connected by guide ports 81. The guide ports 81 are preset fluid channels that allow the coolant to flow from the lower-level water channel to the upper-level water channel. This structure is equivalent to connecting multiple annular cooling sections in series into a spiral or stepped continuous water path, which is conducive to controlling the flow rate and direction. Adjacent guide ports 81 are staggered in the circumferential direction, that is, each guide port 81 is arranged in rotation along the circumference. This design can prevent the coolant from forming a "straight path" in the vertical direction, which causes the intermediate cooling section to be skipped. The staggered arrangement forces the coolant to wrap around the entire inner side of the furnace wall along a spiral path, thereby increasing the flow channel length and heat exchange area. The water inlet 82 is set at the bottom of the furnace body 18 and the water outlet 83 is set at the top, forming a bottom-up cooling path; the coolant enters from the bottom and flows upward step by step through the layers of annular heat dissipation water channels 8, taking away the heat conducted from the high-temperature heating area in the furnace to the furnace wall; the bottom-up flow path conforms to natural convection and the rising trend of heat, thereby improving cooling efficiency.

[0047] The sidewalls of the furnace body 18 are provided with several mounting blocks 17 for mounting temperature control or temperature measurement components within the furnace, as well as cooling water pipes 9. The mounting blocks 17 have interlayer water channels 161, which the cooling water pipes 9 communicate with. The cooling water pipes 9 also connect to a water supply port 91 and a water inlet 82 at either end. The water supply port 91 is connected to an external water supply line, while the water inlet 82 connects to the water inlet 82 of the annular heat dissipation channel 8.

[0048] Multiple mounting seats 17 structures are preset on the side wall of the furnace body 18 for fixedly installing temperature control elements (such as thermocouples, infrared sensors, thermistors, etc.); the mounting seats 17 are directly connected to the metal or graphite wall of the furnace body 18. In a high-temperature environment, long-term operation will cause the sensor to heat up, distort or be damaged.

[0049] Each mounting seat 17 is internally integrated with an interlayer water channel 161 to form an independent water cooling structure. The water channel can be designed to be annular and surround the temperature control element to achieve local cooling of the element positioning area.

[0050] The interlayer water channel 161 of each mounting seat 17 is connected to the external water supply system through the cooling water pipe 9; one end of the cooling water pipe 9 is connected to the water supply port 91 (connected to the main water supply pipe of the cooling system), and the other end is connected to the water inlet 82; the cooling water pipes 9 of all mounting seats 17 are connected in series to a main cooling water pipe 9, forming a unified and continuous cooling water path.

[0051] like Figures 11 to 12As shown, an end flange 10 is provided on the second end of the furnace body 18 opposite to the first end, and an arc-shaped water channel 101 is provided in the middle of the end flange 10. A circuitous heat dissipation water channel 102 is concentrically coiled between the arc-shaped water channel 101 and the edge of the end flange 10. One end of the arc-shaped water channel 101 is connected to the second water inlet joint 11, and the other end is connected to the second water outlet joint 12 of the circuitous heat dissipation water channel 102. In the radial direction, the inner end of the circuitous heat dissipation water channel 102 is connected to the second water inlet joint 11, and the outer end of the circuitous heat dissipation water channel 102 is connected to the second water outlet joint 12.

[0052] The second end of the furnace body 18 (usually the bottom or discharge end) is provided with an end flange 10 with a stable structure and good sealing performance; the flange not only realizes the sealing and fixation of the furnace body 18, but also integrates the cooling function. An arc-shaped water channel 101 (which can be a partial arc, annular arc segment, etc.) is provided in the central area of ​​the flange to cover the central part of the flange closest to the high-temperature zone; the arc-shaped water channel 101 preferentially absorbs or intercepts the radiant heat conduction from the inside of the furnace cavity, and performs primary cooling treatment in the central area. In the area between the arc-shaped water channel 101 and the outer edge of the flange, a circuitous heat dissipation water channel 102 is arranged in a concentric circle manner to form an S-shaped diversion path; this structure enables the coolant to flow from the center of the flange to the edge along the S-shaped path; it increases the path length and residence time of the water flow, which helps to enhance the heat exchange capacity. One end of the arc-shaped water channel 101 is connected to the second water inlet joint 11, and coolant is connected to the external cooling system; the other end of the arc-shaped water channel 101 is connected to the inner port of the circuitous heat dissipation water channel 102, and the coolant transitions from the center to the circuitous heat dissipation water channel 102; the circuitous heat dissipation water channel 102 flows radially from the inside to the outside in circles, and finally connects to the second water outlet joint 12 from its outermost circle port to be discharged, thus realizing a complete cooling circuit.

[0053] The curved water channel 101 and the circuitous heat dissipation water channel 102 are both grooves opened on the end flange 10, the groove of the circuitous heat dissipation water channel 102 is covered with a first sealing plate 13, and the groove of the curved water channel 101 is covered with a second sealing plate 13. The curved water channel 101 is arranged on an annular water channel wall 104, and the water channel wall 104 is higher than the sealing plate 13. The second water inlet joint 11 and the second water outlet joint 12 are connected in parallel on the water channel wall 104 between the two ends of the curved water channel 101, and the second water inlet joint 11 and the second water outlet joint 12 are connected to the water inlet port 1011 of the curved water channel 101 and the water outlet port 1021 of the circuitous heat dissipation water channel 102 through the through holes opened on the water channel wall 104.

[0054] The arc-shaped water channel 101 and the circuitous heat dissipation water channel 102 are both groove structures directly machined on the end flange 10 body, and the depth and width of the groove body match the flow channel design parameters; this design is convenient for CNC milling, wire cutting or casting, and has high processing precision, good cleanliness and large thermal contact area. The circuitous heat dissipation water channel 102 is a slotted structure, and the surface is covered with a flat sealing plate 13 to achieve sealing, forming a closed water channel; the sealing plate 13 can be assembled by screw fixing, welding or sealing adhesive bonding to ensure reliable structural sealing under high temperature and water pressure. The arc-shaped water channel 101 is embedded in a circle of annular raised structures (water channel wall 104) on the end flange 10, and the water channel wall 104 is higher than the plane of the sealing plate 13 of the circuitous heat dissipation water channel 102; the water channel wall 104 not only plays a role in positioning and separation, but also facilitates the setting of a through hole thereon for installation into the second water outlet joint 12.

[0055] The through holes include two holes: a first through hole 14 and a second through hole 15. The first through hole connects to the second water inlet connector 11 at one end and to the water inlet port 1011 of the curved water channel 101 at the other end. The second through hole connects to the second water outlet connector 12 at one end and to the water outlet port 1021 of the detour cooling water channel 102 at the other end. Because the water outlet port 1021 of the detour cooling water channel 102 is located radially outward of the flange, while the second through hole 15 is located on the inner wall 104 of the detour cooling water channel 102, a radial return groove 103 is provided on the flange to connect the second through hole 15 with the water outlet port 1021 of the detour cooling water channel 102. The water outlet of the curved water channel 101 communicates with the water inlet of the detour cooling water channel 102 via a connecting groove 105 provided on the inner side of the flange body. The groove and connecting groove 105 can be sealed with a second seal 16 to form a water flow channel. The specific embodiments described herein are merely illustrative of the spirit of the present invention. Persons skilled in the art may make various modifications, additions, or substitutions to the described embodiments without departing from the spirit of the present invention or exceeding the scope of the appended claims.

Claims

1. A semiconductor process furnace, comprising a cylindrical furnace body, wherein a first end of the furnace body is provided with a plurality of electrode holders for connecting a heater, characterized in that: A spiral heat dissipation water channel is provided at the first end of the furnace body, and the electrode seat is arranged along the spiral heat dissipation water channel.

2. The semiconductor process furnace according to claim 1, characterized in that The head end of the spiral line of the spiral heat dissipating water channel is provided with a water inlet of the water channel, and the water inlet is connected to the water inlet joint through a water inlet channel provided on the first end.

3. The semiconductor process furnace according to claim 2, characterized in that: The tail end of the spiral line of the spiral heat dissipation water channel is connected to the water outlet joint.

4. The semiconductor process furnace according to claim 3, characterized in that The first end includes a furnace body top cover, the spiral heat dissipation water channel is arranged on the top cover, and the depth of the spiral heat dissipation water channel gradually decreases from the head end to the tail end.

5. The semiconductor process furnace according to claim 4, characterized in that: The top cover includes a top cover base and a cover plate. The spiral heat dissipation water channel is provided in a spiral groove on the top cover base. The cover plate is sealed and covers the spiral groove.

6. The semiconductor process furnace according to claim 5, characterized in that: The top cover base is provided with a water inlet channel communicating with the water inlet and the water inlet joint.

7. The semiconductor process furnace according to claim 1, wherein: Several annular heat dissipation water channels arranged along the axis of the furnace body are provided on the side wall between the two ends of the furnace body. Adjacent annular heat dissipation water channels are connected through guide ports, and the positions of adjacent guide ports in the circumferential direction are staggered with each other. A water inlet connected to the annular heat dissipation water channel is provided at the bottom of the furnace body, and a water outlet connected to the annular heat dissipation water channel is provided at the upper part of the furnace body.

8. The semiconductor process furnace according to claim 7, characterized in that: Several mounting seats and cooling water pipes for installing temperature control or temperature measuring elements in the furnace are provided on the side wall of the furnace body. The mounting seat has an interlayer water channel. The cooling water pipe is connected to the interlayer water channel on the mounting seat. The two ends of the cooling water pipe are respectively connected to the water supply port and the water inlet.

9. The semiconductor process furnace according to claim 1, characterized in that An end flange is provided on the second end of the furnace body opposite to the first end, and an arc-shaped water channel is provided in the middle of the end flange. A circuitous heat dissipation water channel is concentrically coiled between the arc-shaped water channel and the edge of the end flange. One end of the arc-shaped water channel is connected to the water inlet joint, and the other end is connected to the water outlet joint of the circuitous heat dissipation water channel. In the radial direction, the inner end of the circuitous heat dissipation water channel is connected to the water inlet joint, and the outer end of the circuitous heat dissipation water channel is connected to the water outlet joint.

10. The semiconductor process furnace according to claim 9, characterized in that: The arc-shaped water channel and the circuitous heat dissipation water channel are both grooves provided on the end flanges. The groove of the circuitous heat dissipation water channel is covered with a sealing plate. The arc-shaped water channel is provided on an annular water channel wall. The water channel wall is higher than the sealing plate. The water inlet joint and the water outlet joint are connected in parallel on the water channel wall between the two ends of the arc-shaped water channel. The water inlet joint and the water outlet joint are connected to the water inlet port of the arc-shaped water channel and the water outlet port of the circuitous heat dissipation water channel through through holes provided on the water channel wall.

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