LED die bonding device and die bonding method

Abstract

The present invention relates to the technical field of crystal bonding devices, and discloses a crystal bonding device and a crystal bonding method for an LED crystal bonding machine. The crystal bonding device for the LED crystal bonding machine includes a material storage frame and a clamping mechanism. The substrates are stacked in sequence inside the material storage frame. The clamping mechanism is used to clamp the substrates from the material storage frame. The edges of the substrates are provided with arc corners, and a gap is formed between the arc corners of two adjacent substrates. In the present invention, the tip of the second block slides into the gap between the two arc corners. When the second block is completely rotated out of the through groove, the substrate is received by the second block on its upper surface and is driven onto the crystal bonding table as the servo mechanism moves. When the substrate is clamped by the device, no spacing is required between the substrates, which can greatly increase the stacking amount of the substrates inside the material storage frame, reduce the number of times the material storage frame is replaced during the production of the crystal bonding machine, and at the same time, reduce the downtime of the crystal bonding machine and improve production efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of crystal bonding devices, and in particular to a crystal bonding device and a crystal bonding method for an LED crystal bonding machine. Background Art

[0002] The die-bonding device of an LED die-bonding machine is used to secure LED chips to substrates during the LED chip packaging process. Its primary function is to precisely attach the LED chip to a metal substrate or other packaging material through high-precision operations, ensuring good contact and thermal conductivity between the chip and substrate. The die-bonding device of an LED die-bonding machine includes a clamping mechanism for loading and unloading substrates. This mechanism removes the substrate from the loading position and secures it to the die-bonding work platform. After the die-bonding process is complete, the bonded substrate is moved to the unloading position.

[0003] When the substrate clamping mechanism on the existing LED die-bonding machine's die-bonding device clamps the substrate, in order to facilitate grabbing one substrate each time, the substrates are equidistantly inserted into the inner grooves of the storage box, and a distance is set between the inner grooves. Due to the distance between the inner grooves, only a small number of substrates can be stored in a storage box. When the operator uses the clamping mechanism on the die-bonding device to clamp the substrate, the storage box needs to be frequently replaced. Each time the storage box is replaced, the die-bonding machine needs to be shut down, which will cause the production line to stop, thereby affecting the overall production efficiency. Summary of the Invention

[0004] The purpose of the present invention is to solve the shortcomings of the prior art and to propose an LED die bonding device and a die bonding method.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] The LED die bonder device includes a material storage frame and a clamping mechanism. The substrates are sequentially stacked inside the material storage frame. The clamping mechanism is used to clamp the substrates from the material storage frame. The edges of the substrates are provided with arc corners, and a gap is formed between the arc corners of two adjacent substrates. The clamping mechanism includes:

[0007] A connecting plate, which can connect the clamping mechanism and the die-bonding device;

[0008] A plurality of rods are arranged on the lower surface of the connecting plate, wherein the plurality of rods are arranged in groups of two, the base plate is arranged between two rods in a group, and a through groove is formed at one end of the rod away from the connecting plate;

[0009] A mounting block is disposed inside the through slot, wherein a V-shaped opening is formed on the outer surface of the mounting block, and a first block and a second block are formed through the V-shaped opening. The second block is configured so that when the mounting block rotates inside the through slot, one end of the second block can be driven to be inserted into the gap between two adjacent arc corners. A first groove is formed on the outer surface of the second block near the V-shaped opening;

[0010] The inserting plate is arranged inside the first groove and is slidably installed with the inner wall of the first groove. The inserting plate is arranged so that when it slides along the inner wall of the first groove, it can be inserted between two adjacent substrates through the gap between two adjacent arc corners, so as to separate the contact surfaces of the two adjacent substrates.

[0011] As a further solution of the present invention, two connecting columns are symmetrically fixedly installed on the outer surfaces of the opposite sides of the mounting block, and the two connecting columns are rotatably connected to the inner wall of the through groove. One end of the connecting column away from the mounting block passes through the outer surface of the rod body and is fixedly connected to a clockwork spring, and the other end of the clockwork spring is fixedly connected to the outer surface of the rod body.

[0012] As a further solution of the present invention, a block is fixedly installed between the inner walls of the through groove, one end of the first block abuts against the outer surface of one end of the block, and a through hole is opened inside the block.

[0013] As a further solution of the present invention, a limiting unit for limiting the position of the substrate is provided inside the through groove, and the limiting unit includes:

[0014] A column is disposed inside the through hole and slidably mounted on the inner wall thereof, with one end of the column passing through the through slot and disposed above the substrate;

[0015] a second spring, which is sleeved on the outer surface of the cylinder;

[0016] The blocking piece is arranged on the outer surface of the column close to one end of the base plate. One end of the second spring abuts against the outer surface of the block, and the other end of the second spring abuts against the outer surface of the blocking piece.

[0017] As a further solution of the present invention, a second groove is provided inside the second block, the second groove is connected to the first groove, and an ejection unit is provided inside the second groove for driving the insert plate to be inserted between two adjacent base plates, the ejection unit comprising:

[0018] A first plate body, which is fixedly mounted on an end of the plug-in board away from the base plate;

[0019] A second plate body is fixedly mounted on an end of the first plate body away from the plug plate, and the second plate body is arranged in an L shape;

[0020] The first spring is arranged inside the second slot, one end of the first spring is fixedly connected to the outer surface of the second plate body, and the other end of the first spring is fixedly connected to the inner wall of the second slot away from the end of the plug board.

[0021] As a further solution of the present invention, a driving unit is provided on the outer surface of the second block, the driving unit is coupled to the ejection unit, and the driving unit can drive the ejection unit to drive the insert plate to be inserted between two adjacent base plates, and the driving unit includes:

[0022] Two support plates are symmetrically fixedly mounted on the outer surface of the second block on a side close to the first block;

[0023] A rotating shaft is rotatably mounted between the two support plates;

[0024] A cam is fixedly mounted on the outer surface of the rotating shaft and is disposed between the two support plates, wherein the arc outer surface of the cam abuts against an end of the second plate away from the first plate;

[0025] A one-way bearing, which is fixedly mounted on one end of the rotating shaft;

[0026] a gear fixedly mounted on the outer surface of the one-way bearing;

[0027] The arc rack is fixedly mounted on the outer surface of the rod body close to the gear, the gear is meshed with the arc rack, and the center of the arc rack is coincident with the rotation center of the connecting column.

[0028] As a further solution of the present invention, an arc groove is provided through the outer surface of the rod body near the arc rack, one end of the rotating shaft passes through the arc groove and is slidably installed with the inner wall of the arc groove, and the arc groove and the arc rack are located at the same center.

[0029] As a further solution of the present invention, a positioning unit for limiting the position of the plug-in board is provided inside the through slot, and the positioning unit includes:

[0030] A first rod, which is fixedly installed between inner walls on opposite sides of the through slot;

[0031] The second rod is fixedly mounted on the upper surface of the first plate body. The second rod has elastic deformation capability. The outer surface of the second rod near the top end abuts against the outer surface of the first rod.

[0032] As a further solution of the present invention, the top ends of the multiple rods are rotatably mounted on the lower surface of the connecting plate, an angle is set between the two rods in a group, and a plurality of third springs are fixedly connected to the lower surface of the connecting plate. The other ends of the third springs are fixedly connected to the outer surface of the rods, and the third springs are arranged on the outer surface of the rods on the side opposite to the substrate.

[0033] The die bonding method of the die bonding device of the LED die bonding machine comprises the following steps:

[0034] S1: Move the connecting plate downward, so that the connecting plate drives the second block to move closer to the base plate through the rod body;

[0035] S2: The lower surface of the second block will first contact the uppermost substrate. As the second block continues to move downward, it will slowly retract into the inner part of the through slot.

[0036] S3: When the rod body moves downward a certain distance, since only the lower surface of the rod body contacts the arc corner of the uppermost base plate, the second block rotates out of the through slot with the connecting column as the rotation center under the elastic force of the clockwork spring. During the rotation, the tip of the second block slides into the gap between the two arc corners.

[0037] S4: When the second block moves upward with the rod, the elastic force of the clockwork spring will continue to drive the second block to rotate out of the through slot. The tip of the second block will first lift the substrate, and then as it moves, its tip will slowly insert into the lower surface of the substrate, and the substrate will be supported by the second block on its upper surface.

[0038] In this application, the tip of the second block will slide into the gap between the two arc corners. When the second block is completely rotated out of the through groove, the substrate will be supported by the second block on its upper surface and driven to the crystal bonding table as the servo mechanism moves. When clamping the substrate through this device, no spacing is required between the substrates, which can greatly increase the stacking amount of substrates inside the material storage frame and reduce the number of times the material storage frame is replaced during the production of the crystal bonding device of the crystal bonding machine. At the same time, the downtime of the crystal bonding device of the crystal bonding machine is reduced, and the production efficiency is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 This is a schematic diagram of the connection plate of the LED die bonder device proposed in the present invention;

[0040] Figure 2 This is a schematic diagram of the material storage board of the LED die bonding device proposed in the present invention;

[0041] Figure 3 This is a schematic diagram of the rod body of the LED die bonding device proposed by the present invention;

[0042] Figure 4 This is a schematic diagram of the arc rack of the LED die bonding device proposed by the present invention;

[0043] Figure 5 This is a schematic diagram of the limiting unit of the LED die bonding device proposed by the present invention;

[0044] Figure 6 This is a schematic diagram of the clockwork spring of the LED die bonding device proposed by the present invention;

[0045] Figure 7 This is a cross-sectional schematic diagram of the mounting block of the LED die bonder device proposed in the present invention;

[0046] Figure 8 This is a schematic diagram of the arc groove of the LED die bonding device proposed by the present invention;

[0047] Figure 9 This is a schematic diagram of the ejection unit of the LED die bonder device proposed in the present invention;

[0048] Figure 10 This is a schematic diagram of the driving unit of the LED die bonder device proposed in the present invention;

[0049] Figure 11 This is a schematic diagram of the connection columns of the LED die bonder device proposed in the present invention;

[0050] Figure 12 This is a schematic diagram of the cam of the LED die bonding device provided by the present invention;

[0051] Figure 13 for Figure 7 A partial enlarged schematic diagram in the middle;

[0052] Figure 14 for Figure 5 A partial enlarged schematic diagram of point B in the middle.

[0053] In the picture:

[0054] 100, connecting plate;

[0055] 200, material storage frame;

[0056] 300, rod body; 310, through groove; 320, arc groove; 330, block; 340, third spring;

[0057] 400, mounting block; 410, first block; 420, second block; 421, first slot; 422, second slot; 430, connecting post; 440, spring;

[0058] 500, substrate; 510, arc angle;

[0059] 600, insert board; 610, bevel;

[0060] 700, drive unit; 710, support plate; 720, rotating shaft; 730, cam; 740, gear; 750, one-way bearing; 760, arc rack;

[0061] 800, positioning unit; 810, first rod; 820, second rod;

[0062] 900, ejection unit; 910, first plate; 920, second plate; 930, first spring;

[0063] 1000, limit unit; 1100, column; 1200, second spring; 1300, blocking piece. DETAILED DESCRIPTION

[0064] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0065] Since the existing LED die bonder device needs to leave a large gap between the substrates 500 when clamping the substrates 500 to avoid interference between two adjacent substrates 500 during clamping, the storage box can only hold fewer substrates 500 because of the large gap. In order to solve this problem, Figure 1 and Figure 4 As shown, a die bonding device for an LED die bonder is disclosed, which includes a material storage frame 200 and a clamping mechanism. Substrates 500 are stacked in sequence inside the material storage frame 200. In order to avoid sharp edges on all sides that may injure operators, the edges of the existing substrates 500 are provided with arc angles 510. The size of the arc angles 510 is between R0.15 mm and R0.2 mm, so a gap is formed between the arc angles 510 of two adjacent substrates 500. The clamping mechanism is used to clamp the substrates 500 from the material storage frame 200. In order to facilitate the clamping mechanism to clamp the substrates 500, as shown in FIG. Figure 2 As shown, open gaps are left around the material storage frame 200.

[0066] like Figure 3-Figure 5 As shown, the clamping mechanism includes: a connecting plate 100, multiple rods 300, a mounting block 400, and an insert plate 600. The clamping mechanism is connected to the servo mechanism on the crystal bonding device through the connecting plate 100. The servo mechanism then drives the clamping mechanism to move in the X, Y, and Z directions through the connecting plate 100, so that the substrate 500 can be clamped and then transferred. In order to clamp the substrate 500, two groups of rods 300 are set on the lower surface of the connecting plate 100 in groups of two. The substrate 500 is set between the two rods 300 in a group. A through groove 310 is opened at the end of the rod 300 away from the connecting plate 100, and a mounting block 400 is set inside the through groove 310. Figure 5 As shown, in order for the mounting block 400 to rotate inside the through slot 310, two connecting posts 430 are symmetrically fixedly installed on the outer surfaces of the mounting block 400 on opposite sides. Both connecting posts 430 are rotatably connected to the inner wall of the through slot 310. A V-shaped opening is opened on the outer surface of the mounting block 400, and a first block 410 and a second block 420 are formed through the V-shaped opening. Figure 8As shown, when the mounting block 400 rotates inside the through slot 310, it can drive one end of the second block 420 to be inserted into the gap between two adjacent arc corners 510, as shown in FIG. Figure 5 As shown, in order to facilitate the second block 420 to be easily inserted into the gap between the two arc corners 510, the shape of the second block 420 is set to be triangular, and the ends of the triangle are set to be sharp. Figure 1 As shown, when the clamping mechanism clamps the substrate 500, the servo mechanism on the LED die bonder drives the connecting plate 100 to move downward, and the connecting plate 100 drives the second block 420 to move closer to the substrate 500 through the rod 300, as shown in FIG. Figure 4 As shown, the lower surface of the second block 420 will first contact the uppermost substrate 500, as shown in FIG. Figure 6 and Figure 7 As shown, when the second block 420 continues to move downward, it will slowly retract into the interior of the through slot 310. Since the end of the connecting column 430 away from the mounting block 400 passes through the outer surface of the rod body 300 and is fixedly connected to the spring 440, and the other end of the spring 440 is fixedly connected to the outer surface of the rod body 300, when the rod body 300 moves downward for a distance, as shown in FIG. Figure 8 As shown, since only the lower surface of the rod body 300 abuts against the arc angle 510 on the uppermost base plate 500, the second block 420 will rotate out of the through slot 310 with the connecting column 430 as the rotation center under the elastic force of the spring 440. During the rotation, the tip of the second block 420 will slide into the gap between the two arc angles 510. Since the lower surface of the second block 420 abuts against the arc angle 510 of the lower base plate 500, the second block 420 maintains its current angle and position. At this time, the connecting plate 100 is driven upward by the servo mechanism. Since the tip of the second block 420 is already in the gap between the two arc angles 510, when the second block 420 moves upward with the rod body 300, the spring 440 can rotate the second block 420. The elastic force of 40 will continue to drive the second block 420 to rotate out of the through groove 310, and the tip of the second block 420 will first lift the substrate 500, and then as it moves, its tip will slowly insert into the lower surface of the substrate 500. When the second block 420 is completely rotated out of the through groove 310, the substrate 500 will be received by the second block 420 on its upper surface and driven to the crystal bonding table as the servo mechanism moves. When the substrate 500 is clamped by this device, no spacing is required between the substrates 500, which can greatly increase the stacking amount of the substrate 500 inside the material storage frame 200, reduce the number of times the material storage frame 200 is replaced during the production of the crystal bonding device of the crystal bonding machine, and at the same time, reduce the downtime of the crystal bonding device of the crystal bonding machine, thereby improving production efficiency.

[0067] In order to make the lower surface of the rod body 300 counteract the arc angle 510 on the uppermost base plate 500 when the rod body 300 moves downward, the top ends of the multiple rod bodies 300 are rotatably mounted on the lower surface of the connecting plate 100, and the lower surface of the connecting plate 100 is fixedly connected to multiple third springs 340. The other end of the third spring 340 is fixedly connected to the outer surface of the rod body 300. The third spring 340 is arranged on the outer surface of the side of the rod body 300 opposite to the base plate 500. Through the elastic force of the third spring 340 This allows the rod body 300 to abut against the arc corner 510 on the top substrate 500, making it easier for the lower surface of the second block 420 to abut against the arc corner 510 on the substrate 500 when the second block 420 is recovered. At the same time, when the rod body 300 drives the substrate 500 upward, the elastic force of the third spring 340 and the angle set between the two rod bodies 300 in a group allow the two rod bodies 300 in a group to clamp the substrate 500, thereby ensuring the stability of the substrate 500 during the clamping movement.

[0068] In order to limit the rotation angle of the second block 420 under the elastic force of the clockwork spring 440, as shown in FIG. Figure 5 As shown, a block 330 is fixedly installed between the inner walls of the through groove 310. When the second block 420 rotates, it will drive one end of the first block 410 to abut against the outer surface of one end of the block 330. At this time, the upper surface of the second block 420 will be parallel to the upper surface of the substrate 500, and the contact area between the two is the largest, so that the second block 420 can support the substrate 500 more stably.

[0069] Because the servo mechanism of the LED die bonder's die bonder moves at a high speed, the clamping mechanism also moves at a high speed. Although the tip of the second block 420 is inserted into the gap between the two arc corners 510, when the clamping mechanism moves at a high speed, the tip of the second block 420 may slip out of the gap between the two arc corners 510, causing the substrate 500 to be unable to be correctly clamped. Therefore, in a further solution, such as Figure 11As shown, the outer surface of the second block 420 near the V-shaped opening is provided with a first groove 421, and the inserting plate 600 is slidably installed between the inner walls of the first groove 421. In order to limit the inserting plate 600 to slide only along the center line direction of the first groove 421, the cross-section of the first groove 421 is dovetail-shaped, and the inserting plate 600 is matched with the first groove 421. The inserting plate 600 is arranged so that when it slides along the inner wall of the first groove 421, it can be inserted between the two adjacent substrates 500 through the gap between the two adjacent arc corners 510, so that the contact surfaces of the two adjacent substrates 500 are separated. Through this arrangement, the tip of the second block 420 is inserted into When the inserting plate 600 is in the gap between the two arc corners 510, the inserting plate 600 can extend from the first groove 421 of the second block 420, thereby being inserted between the two substrates 500, and supporting the upper substrate 500, so that the second block 420 can more easily support the substrate 500. At the same time, when the inserting plate 600 is inserted between the two substrates 500, the contact surfaces of the two substrates 500 can be separated, so that there is a gap between the contact surfaces of the two substrates 500, thereby preventing the upper substrate 500 from being deviated and slipping when the upper substrate 500 is subsequently removed due to the vacuum adsorption effect on the contact surfaces between the two substrates 500. Figure 12 As shown, in order to facilitate the insertion of the plug board 600 between the two substrates 500, an angled corner 610 is provided at the end of the plug board 600. The angled corner 610 can make the end of the plug board 600 sharper, thereby facilitating the insertion between the two substrates 500.

[0070] It should be noted that if Figure 8 As shown, when the inserting plate 600 is to be inserted between the two substrates 500, the second block 420 uses the force of the clockwork spring 440 to keep its lower surface always against the arc corner 510 of the lower substrate 500, so that when the inserting plate 600 is to be inserted between the two substrates 500, the lower substrate 500 can be firmly pressed down to prevent the upper substrate 500 from being lifted up for a distance by the adsorption force between the two substrates 500 when it is pushed up again by the inserting plate 600, and then falling down again to damage the substrate 500 below it.

[0071] In order to drive the inserting plate 600 to slide along the inner wall of the first groove 421 and to be inserted between the two substrates 500, as shown in FIG. Figure 7 and Figure 11As shown, a second groove 422 is provided inside the second block 420, and the second groove 422 is connected to the first groove 421. A ejection unit 900 is provided inside the second groove 422 for driving the plug-in board 600 to be inserted between two adjacent base boards 500. The ejection unit 900 includes: a first plate body 910, a second plate body 920 and a first spring 930. The first plate body 910 is fixedly mounted on the end of the plug-in board 600 away from the base board 500, and the second plate body 920 is fixedly mounted on the end of the first plate body 910 away from the plug-in board 600. One end of the first spring 930 is fixedly connected to the outer surface of the second plate body 920, and the other end of the first spring 930 is fixedly connected to the inner wall of the end of the second groove 422 away from the plug-in board 600, as shown. Figure 7 As shown, when the second plate body 920 is subjected to a force away from the substrate 500 (the specific force is described in detail below), the second plate body 920 will drive the first plate body 910 to move away from the substrate 500, and the first plate body 910 will squeeze the first spring 930, so that it has compressed elastic potential energy. When the first spring 930 releases the compressed elastic potential energy, the first plate body 910 can drive the inserting plate 600 to move closer to the substrate 500, thereby inserting it between the two substrates 500.

[0072] In order to drive the second plate 920 to move away from the base plate 500, as shown in FIG. Figure 10 As shown, a driving unit 700 is provided on the outer surface of the second block 420, and the driving unit 700 is coupled to the ejection unit 900. The driving unit 700 can drive the ejection unit 900 to drive the inserting plate 600 to be inserted between two adjacent base plates 500. The driving unit 700 includes: two support plates 710, a rotating shaft 720, a cam 730, a one-way bearing 750, a gear 740 and an arc rack 760. The two support plates 710 are symmetrically fixedly mounted on the outer surface of the second block 420 close to the first block 410. The rotating shaft 720 is rotatably mounted between the two support plates 710. The cam 730 is fixedly mounted on the outer surface of the rotating shaft 720 and is arranged between the two support plates 710. The arc outer surface of the cam 730 is against the end of the second plate body 920 away from the first plate body 910. The one-way bearing 750 is fixedly mounted on one end of the rotating shaft 720. The gear 740 is fixedly mounted on the outer surface of the one-way bearing 750, as shown in FIG. Figure 4 As shown, when the lower surface of the second block 420 begins to abut against the arc angle 510 of the edge of the substrate 500, the second block 420 will move away from the substrate 500 and rotate back toward the inside of the through groove 310. The second block 420 drives the gear 740 through the support plate 710 and the rotating shaft 720 to rotate counterclockwise with the connecting column 430 as the rotation center (as shown in FIG. Figure 4As shown by the arrow, the arc rack 760 is fixedly mounted on the outer surface of the rod body 300 near the gear 740, the gear 740 is meshed with the arc rack 760, and the center of the arc rack 760 coincides with the rotation center of the connecting column 430. Therefore, the gear 740 drives the shaft 720 to rotate counterclockwise through the one-way bearing 750, and the shaft 720 drives the cam 730 to rotate counterclockwise (as shown in FIG. Figure 5 As shown by the arrow, the protruding surface of the cam 730 will abut against the top of the second plate 920. As the cam 730 continues to rotate counterclockwise, it will drive the second plate 920 to move away from the substrate 500, thereby causing the second plate 920 to drive the first plate 910 to move away from the substrate 500. The first plate 910 will squeeze the first spring 930, causing it to have compressed elastic potential energy.

[0073] In order to facilitate the engagement of the gear 740 with the arc rack 760, an arc groove 320 is opened through the outer surface of the rod body 300 near the arc rack 760. One end of the rotating shaft 720 passes through the arc groove 320 and is slidably installed with the inner wall of the arc groove 320. The arc groove 320 and the arc rack 760 are located at the same center of the circle. At the same time, the arc groove 320 can limit the movement range of the rotating shaft 720 and, at the same time, limit the movement range of the second block 420.

[0074] like Figure 6 As shown, when the second block 420 is completely recovered into the interior of the through groove 310, as shown in FIG. Figure 7 As shown, the protruding surface of the cam 730 will rotate to leave the second plate 920 and will no longer abut against the second plate 920. At this time, because the tip of the second block 420 has not yet moved to the gap between the two arc corners 510, in order to prevent the inserting plate 600 from sliding out of the first slot 421, as shown in FIG. Figure 13 As shown, a positioning unit 800 for limiting the position of the inserting plate 600 is provided inside the through slot 310. The positioning unit 800 includes a first rod 810 and a second rod 820. The first rod 810 is fixedly mounted between the inner walls on opposite sides of the through slot 310. The second rod 820 is fixedly mounted on the upper surface of the first plate 910. Because the second block 420 is initially located entirely outside the through slot 310, the second rod 820 is located below the first rod 810. Figure 5 As shown, when the second block 420 begins to retract into the through slot 310, the first rod 810 also moves closer to the second rod 820 as the second block 420 rotates. Figure 7When the position shown is shown, the top of the second rod 820 passes the position of the first rod 810 and is located on the side of the second rod 820 away from the plugboard 600, and the outer surface of the second rod 820 near the top is against the outer surface of the first rod 810 away from the plugboard 600. At this time, the position of the second rod 820 is limited, and the positions of the first plate 910 and the plugboard 600 are restricted at the same time. When the rod body 300 drives the second block 420 to continue to move downward, as shown in FIG. Figure 8 As shown, when the tip of the second block 420 is inserted into the gap between the two arc corners 510, the second block 420 will rotate out of the through slot 310 under the action of the spring 440. Figure 9 As shown, the second rod 820 will be driven out from under the first rod 810, thereby releasing the restriction of the first rod 810 on the second rod 820. Figure 10 As shown, the inserting plate 600 slides out quickly under the action of the first spring 930, and is inserted between the two substrates 500. In order to avoid the first plate 910 from interfering with the protruding surface of the cam 730 when the inserting plate 600 is inserted between the two substrates 500, as shown in FIG. Figure 12 As shown, the second plate 920 is L-shaped, with a crossbar at its top. When the inserting plate 600 is inserted between the two base plates 500, the crossbar contacts the lowest surface of the cam 730. The shape of the cam 730 is as shown in FIG. Figure 12 As shown, a disconnection gap is required to ensure that the crossbar at the top of the first plate 910 has a movement distance of. The top of the second rod 820 can switch and exceed the positions on both sides of the first rod 810. The second rod 820 has elastic deformation ability, such as Figure 14 As shown, it can be pressed by the first rod 810 and passed over from its lower surface.

[0075] It should be noted that when gear 740 is Figure 8 As shown, when the reverse clockwise movement starts, the gear 740 itself will rotate in the clockwise direction through the engagement of the gear 740 and the arc rack 760. Because of the setting of the one-way bearing 750, at this time, the gear 740 will not drive the rotating shaft 720 to rotate. At the same time, in order to ensure that the rotating shaft 720 stops at the accurate position each time, the circumferential outer surface of the other end of the rotating shaft 720 is provided with a nylon sleeve, which is rotatably connected to the mounting hole opened on the outer surface of one of the support plates 710 through the nylon sleeve. There is friction between the nylon sleeve and the mounting hole of the support plate 710. The friction can limit the rotating shaft 720 from rotating at the current position when it is not rotated by force, and will not rotate or deviate from the position at will, thereby ensuring that the positioning unit 800 can work normally.

[0076] Because the substrate 500 is carried by the second block 420 and is driven by the servo mechanism to move, when the substrate 500 is driven by the servo mechanism to move downward quickly, because the substrate 500 is a flat plate, its lower surface is easily affected by air resistance. The faster the substrate 500 moves downward, the greater the resistance. Therefore, the substrate 500 will float up and down on the upper surface of the second block 420. In order to avoid this problem, Figure 9 As shown, in a further solution, a limiting unit 1000 for limiting the position of the substrate 500 is provided inside the through groove 310, and the limiting unit 1000 includes: a column 1100, a second spring 1200 and a baffle 1300. A through hole is opened inside the block 330, and the column 1100 is arranged inside the through hole and slidably installed with its inner wall. One end of the column 1100 passes through the through groove 310 and is arranged above the substrate 500. The second spring 1200 is sleeved on the outer surface of the column 1100, and the baffle 1300 is arranged on the outer surface of the column 1100 close to one end of the substrate 500. One end of the second spring 1200 is against the outer surface of the block 330, and the other end of the second spring 1200 is against the outer surface of the baffle 1300. When the substrate 500 is completely supported by the second block 420, the second block 420 drives one end of the first block 410 to be against the outer surface of one end of the block 330. At this time, Figure 9 As shown, the first block 410 will squeeze the top of the column 1100, and the column 1100 will move along its axial direction close to the substrate 500, so that the bottom end of the column 1100 is located above the substrate 500. There is a fixed distance between the bottom end of the column 1100 and the substrate 500, and it does not directly contact the upper surface of the substrate 500, so that after the substrate 500 is subsequently placed on the crystal bonding table, the second block 420 can be driven by the servo mechanism to separate from the substrate 500. Through this arrangement, the substrate 500 will no longer float up and down significantly on the upper surface of the second block 420 when it is lowered, thereby avoiding the large up and down floating that causes the substrate 500 to violently impact the surface of the crystal bonding table when it is lowered to the crystal bonding table, causing damage to the substrate 500 and the crystal bonding table.

[0077] The die bonding method of the die bonding device of the LED die bonding machine comprises the following steps:

[0078] S1: The connecting plate 100 moves downward, so that the connecting plate 100 drives the second block 420 to move closer to the base plate 500 through the rod body 300;

[0079] S2: The lower surface of the second block 420 first contacts the uppermost substrate 500. As the second block 420 continues to move downward, it slowly retracts into the through-slot 310.

[0080] S3: When the rod body 300 moves downward a certain distance, since only the lower surface of the rod body 300 abuts against the arc corner 510 on the uppermost base plate 500, the second block 420 rotates out of the through slot 310 with the connecting post 430 as the rotation center under the elastic force of the clockwork spring 440. During the rotation, the tip of the second block 420 slides into the gap between the two arc corners 510.

[0081] S4: When the second block 420 moves upward along with the rod body 300, the elastic force of the clockwork spring 440 will continue to drive the second block 420 to rotate out of the interior of the through slot 310. The tip of the second block 420 will first lift the substrate 500, and then with its own movement, its tip will slowly insert into the lower surface of the substrate 500. The substrate 500 will be received by the second block 420 on its upper surface, and then driven to the crystal bonding table by the servo mechanism for the subsequent crystal bonding production process.

[0082] The basic principles, main features and advantages of the present invention are shown and described above. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and modifications fall within the scope of the invention as claimed.

Claims

1. A device for bonding a LED die, comprising a material storage frame (200) and a clamping mechanism, wherein substrates (500) are sequentially stacked inside the material storage frame (200), and the clamping mechanism is used to clamp the substrates (500) from the material storage frame (200), wherein the edges of the substrates (500) are provided with arc corners (510), and a gap is formed between the arc corners (510) of two adjacent substrates (500), characterized in that: The clamping mechanism comprises: A connecting plate (100) capable of connecting the material clamping mechanism and the crystal fixing device; A plurality of rods (300) are arranged on the lower surface of the connecting plate (100), wherein the plurality of rods (300) are arranged in groups of two, and the base plate (500) is arranged between two rods (300) in a group, and a through slot (310) is formed at one end of the rod (300) away from the connecting plate (100); The mounting block (400) is arranged inside the through groove (310), and a V-shaped opening is provided on the outer surface of the mounting block (400), and a first block (410) and a second block (420) are formed through the V-shaped opening. The second block (420) is configured so that when the mounting block (400) rotates inside the through groove (310), one end of the second block (420) can be driven to be inserted into the gap between two adjacent arc corners (510). The outer surface of the second block (420) near the V-shaped opening is provided with a first groove (421).

2. The LED die bonding device according to claim 1, characterized in that: Two connecting columns (430) are symmetrically fixedly installed on the outer surfaces of opposite sides of the mounting block (400), and the two connecting columns (430) are both rotatably connected to the inner wall of the through groove (310). One end of the connecting column (430) away from the mounting block (400) passes through the outer surface of the rod body (300) and is fixedly connected to a clockwork spring (440). The other end of the clockwork spring (440) is fixedly connected to the outer surface of the rod body (300). A block (330) is fixedly installed between the inner walls of the through groove (310), one end of the first block (410) is against the outer surface of one end of the block (330), and a through hole is opened inside the block (330).

3. The LED die bonder device according to claim 1, characterized in that: An inserting plate (600) is slidably mounted on the inner wall of the first groove (421). The inserting plate (600) is configured to be inserted between two adjacent substrates (500) through a gap between two adjacent arc corners (510) when sliding along the inner wall of the first groove (421), thereby separating the contact surfaces of the two adjacent substrates (500).

4. The LED die bonding device according to claim 3, characterized in that: A limiting unit (1000) for limiting the position of the substrate (500) is provided inside the through slot (310), and the limiting unit (1000) comprises: A column (1100) is arranged inside the through hole and slidably mounted on the inner wall thereof, and one end of the column (1100) passes through the through slot (310) and is arranged above the base plate (500); A second spring (1200) is sleeved on the outer surface of the column (1100); The baffle (1300) is arranged on the outer surface of one end of the column (1100) close to the base plate (500), one end of the second spring (1200) is against the outer surface of the block (330), and the other end of the second spring (1200) is against the outer surface of the baffle (1300).

5. The LED die bonding device according to claim 3, characterized in that: A second groove (422) is provided inside the second block (420), the second groove (422) being connected to the first groove (421), and an ejection unit (900) is provided inside the second groove (422) for driving the inserting plate (600) to be inserted between two adjacent base plates (500), the ejection unit (900) comprising: A first plate body (910) is fixedly mounted on an end of the plug plate (600) away from the base plate (500); A second plate body (920) is fixedly mounted on an end of the first plate body (910) away from the plug board (600), the second plate body (920) being arranged in an L-shape; A first spring (930) is disposed inside the second groove (422), one end of the first spring (930) is fixedly connected to the outer surface of the second plate (920), and the other end of the first spring (930) is fixedly connected to the inner wall of the second groove (422) at one end away from the inserting plate (600).

6. The LED die bonding device according to claim 5, characterized in that: A driving unit (700) is provided on the outer surface of the second block (420), the driving unit (700) being coupled to the ejection unit (900), the driving unit (700) being capable of driving the ejection unit (900) to drive the inserting plate (600) to be inserted between two adjacent base plates (500), the driving unit (700) comprising: Two support plates (710) are symmetrically fixedly mounted on the outer surface of the second block (420) on a side close to the first block (410); A rotating shaft (720) is rotatably mounted between the two support plates (710); A cam (730) is fixedly mounted on the outer surface of the rotating shaft (720) and is disposed between the two support plates (710), wherein the arc outer surface of the cam (730) abuts against an end of the second plate (920) away from the first plate (910); A one-way bearing (750) is fixedly mounted on one end of the rotating shaft (720); A gear (740) fixedly mounted on the outer surface of the one-way bearing (750); The arc rack (760) is fixedly mounted on the outer surface of the rod body (300) on the side close to the gear (740), the gear (740) and the arc rack (760) are meshed, and the center of the arc rack (760) is arranged to coincide with the rotation center of the connecting column (430).

7. The LED die bonding device according to claim 6, characterized in that: An arc groove (320) is formed through the outer surface of the rod body (300) near the arc rack (760), one end of the rotating shaft (720) passes through the arc groove (320) and is slidably mounted on the inner wall of the arc groove (320), and the arc groove (320) and the arc rack (760) are located at the same center.

8. The LED die bonding device according to claim 1, characterized in that: A positioning unit (800) for limiting the position of the inserting plate (600) is provided inside the through slot (310), and the positioning unit (800) comprises: A first rod (810) is fixedly mounted between inner walls on opposite sides of the through slot (310); The second rod (820) is fixedly mounted on the upper surface of the first plate (910). The second rod (820) has elastic deformation capability, and the outer surface of the second rod (820) near the top end abuts against the outer surface of the first rod (810).

9. The LED die bonder device according to claim 1, characterized in that: The top ends of the plurality of rod bodies (300) are rotatably mounted on the lower surface of the connecting plate (100), an angle is provided between the two rod bodies (300) in a group, a plurality of third springs (340) are fixedly connected to the lower surface of the connecting plate (100), the other ends of the third springs (340) are fixedly connected to the outer surface of the rod body (300), and the third springs (340) are provided on the outer surface of the rod body (300) on the side opposite to the base plate (500).

10. A die bonding method for a die bonding device of an LED die bonding machine, characterized in that: The LED die bonding device according to any one of claims 1 to 9 comprises the following steps: S1: The connecting plate (100) is moved downward, so that the connecting plate (100) drives the second block (420) to move closer to the base plate (500) through the rod body (300); S2: The lower surface of the second block (420) will first contact the uppermost substrate (500), and as the second block (420) continues to move downward, it will slowly retract into the interior of the through groove (310); S3: When the rod body (300) moves downward for a distance, since only the lower surface of the rod body (300) is in contact with the arc angle (510) on the uppermost base plate (500), the second block (420) rotates out of the through slot (310) with the connecting column (430) as the rotation center under the elastic force of the clockwork spring (440). During the rotation, the tip of the second block (420) slides into the gap between the two arc angles (510); S4: When the second block (420) moves upward along with the rod (300), the elastic force of the clockwork spring (440) will continue to drive the second block (420) to rotate out of the through slot (310). The tip of the second block (420) will first lift the substrate (500), and then as it moves, its tip will slowly insert into the lower surface of the substrate (500). The substrate (500) will be received by the second block (420) on its upper surface, and then driven by the servo mechanism to the crystal bonding table for subsequent crystal bonding production processes.

Images