Deep cavity machining assembly and machining method thereof
By designing deep cavity processing components and using structures such as deep cavity probes and U-shaped brushes, the problem of difficult debris discharge and difficult cooling liquid in deep cavity processing is solved, effectively cleaning and cooling of deep cavity is achieved, and processing accuracy and tool life are improved.
Patent Information
- Application Number
- CN202510911198.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-02
- Publication Date
- 2025-09-02
AI Technical Summary
In deep cavity processing, debris are difficult to discharge and cooling liquid is difficult to enter the deep cavity, resulting in the impact of tool life and processing accuracy.
A deep cavity processing assembly is designed, including a multi-axis swing head, docking mechanism, tool cleaning mechanism, guide frame and deep cavity cleaning mechanism. The deep cavity probe extends into the deep cavity for debris cleaning and cooling liquid spraying, and the tool is cleaned and cooled with a U-shaped brush and a spray plate.
It realizes that debris in the deep cavity can be effectively removed, the tool can be fully cooled, and the processing accuracy and tool life are improved.
Smart Images
Figure CN120572071A_ABST
Abstract
Description
Technical Field
[0001] Embodiments of the present disclosure relate to the technical field of deep cavity processing, and in particular, to a deep cavity processing assembly and a processing method thereof. Background Art
[0002] Deep cavity machining is a mechanical processing technology for complex cavities or deep hole structures with a large depth-to-diameter ratio. It is commonly used in molds, aerospace, energy equipment and other fields. Deep cavity machining is required for the deep cavity structures of injection molds and die-casting molds, or the cavities on pump housings. When performing deep cavity machining, longer tools are used, which are driven by multi-axis machine tools to extend into the deep cavity for cutting.
[0003] During deep cavity machining, due to the long tool and deep cavity, after the tool penetrates into the cavity, the machining debris is difficult to be discharged smoothly from the deep cavity. At the same time, the tool continues to cut, and heat will accumulate in the deep cavity, which may cause the tool temperature to be too high and deformed. At the same time, the debris is difficult to be discharged normally, which has a great impact on the temperature rise and wear of the tool. In addition, due to the deep depth of the deep cavity, the cooling liquid cannot be fully sprayed into the deep cavity for effective cooling and lubrication. Therefore, whether the debris can be discharged smoothly in the deep cavity during deep cavity machining is crucial to the machining accuracy and tool maintenance. Summary of the Invention
[0004] To overcome the above-mentioned defects, the embodiments of the present disclosure provide a deep cavity machining component and a machining method thereof, which are used to solve the technical problem in the prior art that, during deep cavity machining, the debris in the deep cavity is sometimes difficult to discharge and the cooling liquid is difficult to enter the deep cavity, resulting in a reduction in tool life and machining accuracy.
[0005] According to one aspect, at least one embodiment of the present disclosure provides a deep cavity processing assembly, including a multi-axis swing head, wherein the multi-axis swing head is installed on a machine tool, and a tool is provided on the multi-axis swing head. It also includes a docking mechanism, a tool cleaning mechanism, a guide frame and a deep cavity cleaning mechanism, the docking mechanism is fixedly installed on the side of the multi-axis swing head, and a chip removal platform is rotatably connected to the docking mechanism, wherein the docking mechanism is used to drive the chip removal platform to move to the side of the tool, and the tool cleaning mechanism is slidably arranged on the chip removal platform. When the chip removal platform moves to the side of the tool, the tool cleaning mechanism can be connected to the tool, and the tool cleaning mechanism is used to clean the debris on the tool, the guide frame is fixedly connected to the chip removal platform, and the guide frame is arranged on the side of the tool cleaning mechanism, the deep cavity cleaning mechanism is slidably arranged on the guide frame, and the deep cavity cleaning mechanism is used to clean the debris in the deep cavity, and the deep cavity cleaning mechanism includes a deep cavity probe, which is slidably arranged on the guide frame, and the deep cavity probe can be extended into the deep cavity to clean the debris.
[0006] The tool cleaning mechanism includes a driving cylinder, a track, a splash plate, a spray plate and a U-shaped brush. The driving cylinder is fixedly mounted on the chip removal platform, the track is fixedly mounted on the chip removal platform, the splash plate is slidably arranged on the track, the output end of the driving cylinder is fixedly connected to the splash plate, the spray plate is fixedly connected to the splash plate, a liquid supply pipe 1 is connected to the spray plate, the U-shaped brush is fixedly connected to the splash plate, the U-shaped brush is arranged on the side of the splash plate close to the tool, the opening direction of the U-shaped brush is upward, the spray plate and the splash plate are arranged between the guide frame and the tool, and an end of the spray plate close to the U-shaped brush is provided with an inclined nozzle facing the U-shaped brush.
[0007] The guide frame is provided with a motor 1 and a screw, the motor 1 is fixedly mounted on the guide frame, the screw is rotatably arranged on the guide frame, the output end of the motor 1 is transmission-connected to the screw, and the deep cavity probe is threadedly connected to the screw.
[0008] The deep cavity cleaning mechanism also includes a second liquid supply tube, a liquid spray port, a bracket, a brush rod and bristles. The second liquid supply tube is connected to the deep cavity probe. A plurality of liquid spray ports are provided. The plurality of liquid spray ports are circumferentially arranged on the end of the deep cavity probe away from the second liquid supply tube. The bracket is fixedly arranged inside the deep cavity probe. The brush rod slides through the bracket. A spring is provided between the brush rod and the bracket. A tray is provided on the end of the brush rod away from the liquid spray port. The bristles are fixedly arranged on the end of the brush rod close to the liquid spray port.
[0009] A diverter cone is fixedly connected to the deep cavity probe at a position in the center of the plurality of liquid spraying ports. When the brush rod drives the bristles to move toward the diverter cone, the bristles come into contact with the diverter cone and extend through the plurality of liquid spraying ports.
[0010] The docking mechanism includes a base, a connecting rod and a second motor. The base is fixedly mounted on the side of the multi-axis swing head. There are multiple connecting rods. The two ends of the multiple connecting rods are rotatably connected to the base and the chip removal platform respectively. The multiple connecting rods are parallel. The base and the chip removal platform remain parallel. The second motor is fixedly mounted on the base. The output end of the second motor is transmission-connected to the connecting rod. The base and the chip removal platform are provided with slots corresponding to the connecting rods.
[0011] When the connecting rod drives the chip removal platform to move toward the tool, the U-shaped brush is in contact with the side of the tool close to the multi-axis swing head.
[0012] The deep cavity processing method according to the above-mentioned deep cavity processing assembly includes the following steps: Step 1: Tool deep cavity separation: The multi-axis swing head drives the tool to move and separate from the deep cavity, and drives the tool away from the deep cavity; Step 2: Mobile docking: The output end of motor 2 drives the connecting rod to rotate, and the connecting rod drives the chip removal platform to rotate to the side of the tool; Step 3: Tool docking: When the chip removal platform moves, the output end of the drive cylinder shortens and pulls the splash guard to slide on the track. When the chip removal platform moves to the side of the tool, the tool enters the U-shaped brush. Step 4: Tool cleaning: The liquid supply pipe delivers cooling liquid to the spray plate. The tool rotates slowly, the output end of the drive cylinder extends, the U-shaped brush cleans the tool, and the inclined nozzle sprays the debris scraped off the U-shaped brush. Step 5: Deep cavity alignment: The multi-axis swing head drives the deep cavity probe to align with the deep cavity; Step 6: Deep cleaning: The output end of motor 1 drives the screw to rotate, and the screw drives the deep cavity probe to slide toward the deep cavity on the guide frame, and the deep cavity probe extends into the deep cavity; Step 7: Debris removal: Liquid supply pipe 2 delivers cooling liquid to the deep cavity probe. The cooling liquid pushes the tray to make the brush rod slide on the bracket. After the bristles come into contact with the diverter cone, they extend into the deep cavity through the liquid spray port. The output end of motor 1 drives the screw to reverse, and the deep cavity probe moves out of the deep cavity. The bristles drive the debris to move out of the deep cavity. Step 8. Continue processing: The output end of motor 2 is reversed, and the connecting rod drives the chip removal platform to move away from the tool.
[0013] The beneficial effects of the embodiments of the present disclosure are: 1. In the present invention, a deep cavity probe is provided, which can slide on a guide frame and then extend into the deep cavity, and then the cooling liquid is sprayed at the bottom of the deep cavity, so that the cooling liquid can fully contact the bottom of the deep cavity, and the cooling liquid drives the debris to be sprayed out. Compared with the traditional method of spraying cooling liquid externally, spraying cooling liquid internally can fully cool down and remove chips; 2. In the present invention, a tool cleaning mechanism is provided. After the tool is separated from the deep cavity, the tool cleaning mechanism docks with the tool through the docking mechanism to clean the tool, thereby preventing debris from being entangled on the tool and re-entering the deep cavity. 3. In the present invention, by setting up a tool cleaning mechanism, the debris can be cleaned when the tool is cleaned, and the tool can be cooled at the same time. By setting up a deep cavity cleaning mechanism, a cooling liquid can be sprayed at the bottom of the deep cavity to achieve sufficient cooling and drive the debris to flow out. By setting up a docking mechanism, the chip removal platform can be linked with the multi-axis swing head to facilitate cleaning at any time. At the same time, the deep cavity probe can be aligned with the deep cavity through the multi-axis swing head. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] To more clearly illustrate the technical solutions in the embodiments of the present disclosure, the following briefly describes the drawings required for use in describing the embodiments of the present disclosure. Obviously, the drawings described below are merely some exemplary embodiments of the present disclosure. Those skilled in the art can, without inventive effort, derive other drawings based on the content of the exemplary embodiments of the present disclosure and these drawings.
[0015] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a structural schematic diagram of another perspective of the present invention as a whole; Figure 3 This is a schematic diagram of the structure of the chip removal platform of the present invention when it is folded up; Figure 4 It is a schematic diagram of the partial structure of the cooperation between the spray plate and the U-shaped brush in the present invention; Figure 5 It is a schematic structural diagram of the tool cleaning mechanism and the deep cavity cleaning mechanism in the present invention; Figure 6 Schematic diagram of the internal cross-sectional structure of the deep cavity probe of the present invention; Figure 7 It is a schematic diagram of the partial structure of the docking mechanism in the present invention.
[0016] In the figure: 1. Multi-axis swing head; 2. Chip removal platform; 3. Guide frame; 4. Deep cavity probe; 5. Drive cylinder; 6. Track; 7. Splash plate; 8. Spray plate; 9. Liquid supply pipe 1; 10. U-shaped brush; 11. Inclined nozzle; 12. Motor 1; 13. Screw; 14. Liquid supply pipe 2; 15. Liquid spray nozzle; 16. Bracket; 17. Brush rod; 18. Bristles; 19. Diverter cone; 20. Base; 21. Connecting rod; 22. Motor 2. DETAILED DESCRIPTION
[0017] The present disclosure will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present disclosure, rather than to limit the present disclosure.
[0018] To simplify the drawings, only the parts relevant to the disclosure are schematically shown in each figure; they do not represent the actual structure of the product. Furthermore, to simplify the drawings and facilitate understanding, in some figures, only one of the components with the same structure or function is schematically shown or labeled. In this document, "one" not only means "only one" but also "more than one," and "several" includes "two" and "more than two."
[0019] It should be noted that, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this disclosure based on the specific circumstances.
[0020] In the present disclosure, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0021] In the description of this embodiment, the terms "up", "down", "left", "right", etc., and the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on the present disclosure.
[0022] In addition, in the description of the present application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.
[0023] Example 1 like Figures 1 to 7As shown, it shows a deep cavity processing assembly in an embodiment of the present disclosure, including a multi-axis swing head 1, which is installed on a machine tool, and a tool is provided on the multi-axis swing head 1. It also includes a docking mechanism, a tool cleaning mechanism, a guide frame 3 and a deep cavity cleaning mechanism. The docking mechanism is fixedly installed on the side of the multi-axis swing head 1, and a chip removal platform 2 is rotatably connected to the docking mechanism. The docking mechanism is used to drive the chip removal platform 2 to move to the side of the tool. The tool cleaning mechanism is slidably set on the chip removal platform 2. When the chip removal platform 2 moves to the side of the tool, the tool cleaning mechanism can be connected to the tool. The tool cleaning mechanism is used to clean the debris on the tool. The guide frame 3 is fixedly connected to the chip removal platform 2. 3 is arranged on the side of the tool cleaning mechanism, and the deep cavity cleaning mechanism is slidably arranged on the guide frame 3. The deep cavity cleaning mechanism is used to clean the debris in the deep cavity. The deep cavity cleaning mechanism includes a deep cavity probe 4. The deep cavity probe 4 is slidably arranged on the guide frame 3. The deep cavity probe 4 can be extended into the deep cavity to clean the debris. When cleaning is required during processing, the tool is cleaned by the tool cleaning mechanism, and the inside of the deep cavity is cleaned by the deep cavity cleaning mechanism. It is arranged on the multi-axis swing head 1 through the docking mechanism. As the multi-axis swing head 1 moves, it is more convenient to align with the deep cavity. The multi-axis swing head 1 can match the deep cavity probe 4 to the deep cavity, so that cleaning can be performed at any time during use.
[0024] like Figures 1 to 5 As shown, the tool cleaning mechanism includes a drive cylinder 5, a track 6, a splash plate 7, a spray plate 8 and a U-shaped brush 10. The drive cylinder 5 is fixedly mounted on the chip removal platform 2, the track 6 is fixedly mounted on the chip removal platform 2, the splash plate 7 is slidably arranged on the track 6, the output end of the drive cylinder 5 is fixedly connected to the splash plate 7, the spray plate 8 is fixedly connected to the splash plate 7, the spray plate 8 is connected to a liquid supply pipe 9, the U-shaped brush 10 is fixedly connected to the splash plate 7, the U-shaped brush 10 is arranged on the side of the splash plate 7 close to the tool, the opening direction of the U-shaped brush 10 is upward, the spray plate 8 and the splash plate 7 are arranged between the guide frame 3 and the tool, and the end of the spray plate 8 close to the U-shaped brush 10 is provided with an inclined nozzle 11 facing the U-shaped brush 10. When cleaning is not performed, the drive cylinder 5 The output end of the driving cylinder 5 is extended to push the splash plate 7 to the side of the guide frame 3, so that the connecting rod 21 is rotated and retracted. When cleaning is performed, the output end of the driving cylinder 5 is shortened to pull the spray plate 8 to move, so that when the U-shaped brush 10 is docked with the tool, the end of the tool close to the multi-axis swing head 1 enters the U-shaped brush 10. At this time, the output end of the driving cylinder 5 is extended to push the U-shaped brush 10 to sweep the debris on the tool. At the same time, the spray plate 8 sprays the tool, and the debris can be flushed down while cooling. The inclined nozzle 11 impacts the U-shaped brush 10 to prevent the debris brushed by the U-shaped brush 10 from remaining on the U-shaped brush 10. The tool rotates slowly at the same time for comprehensive cleaning. The splash plate 7 can prevent the sprayed cooling liquid from splashing around, affecting the impact effect on the tool.
[0025] like Figures 1 to 6 As shown, a motor 12 and a screw 13 are provided on the guide frame 3. The motor 12 is fixedly mounted on the guide frame 3. The screw 13 is rotatably arranged on the guide frame 3. The output end of the motor 12 is transmission-connected to the screw 13. The deep cavity probe 4 is threadedly connected to the screw 13. The deep cavity cleaning mechanism also includes a liquid supply pipe 2 14, a liquid spray port 15, a bracket 16, a brush rod 17 and bristles 18. The liquid supply pipe 2 14 is connected to the deep cavity probe 4. There are multiple liquid spray ports 15. The multiple liquid spray ports 15 are circumferentially arranged on the end of the deep cavity probe 4 away from the liquid supply pipe 2 14. The bracket 16 is fixedly arranged inside the deep cavity probe 4. The brush rod 17 slides through the bracket 16. A spring is arranged between the brush rod 17 and the bracket 16. A tray is provided on the end of the brush rod 17 away from the liquid spray port 15. The bristles 18 are fixedly arranged on the brush rod 17 close to the liquid spray port. At one end of the opening 15, a diverter cone 19 is fixedly connected to the deep cavity probe 4 at a position in the center of multiple liquid spraying openings 15. When the brush rod 17 drives the bristles 18 to move toward the diverter cone 19, the bristles 18 contact the diverter cone 19 and extend through multiple liquid spraying openings 15. The deep cavity probe 4 is set as a thin tube with a smaller diameter, which can be inserted into the thinner deep cavity. When the deep cavity probe 4 contacts the bottom of the deep cavity, the cooling liquid transported by the liquid supply pipe 2 14 is sprayed out through the liquid spraying opening 15, and the deep cavity can be cooled as it rushes out. At the same time, the cooling liquid in the deep cavity probe 4 impacts the tray, causing the brush rod 17 to slide on the bracket 16, the spring is compressed, and the bristles 18 are separated by the diverter cone 19 and extend through the liquid spraying. The bristles 18 contact the inner wall of the deep cavity. When the deep cavity probe 4 leaves the deep cavity, the delivery of the cooling liquid is maintained, and the bristles 18 can bring out the residual debris.
[0026] like Figure 2 and Figure 7 As shown, the docking mechanism includes a base 20, a connecting rod 21 and a second motor 22. The base 20 is fixedly mounted on the side of the multi-axis swing head 1. A plurality of connecting rods 21 are provided. The two ends of the plurality of connecting rods 21 are respectively rotatably connected to the base 20 and the chip removal platform 2. The plurality of connecting rods 21 are parallel, and the base 20 and the chip removal platform 2 remain parallel. The second motor 22 is fixedly mounted on the base 20. The output end of the second motor 22 is transmission-connected with the connecting rod 21. A slot corresponding to the connecting rod 21 is opened on the base 20 and the chip removal platform 2. When the connecting rod 21 drives the chip removal platform 2 to move toward the tool, the U-shaped brush 10 is connected to the side of the tool close to the multi-axis swing head 1. In this embodiment, four connecting rods 21 are provided. The output end of the second motor 22 is transmission-connected with two connecting rods 21 rotating coaxially. The output end of the second motor 22 drives the connecting rod 21 to rotate, which can drive the chip removal platform 2 to move between the side of the multi-axis swing head 1 and the side of the tool. Figure 3When deep cavity processing is performed again, the connecting rod 21 drives the chip removal platform 2 to move to the side of the multi-axis swing head 1. Through the grooves opened on the chip removal platform 2 and the base 20, the connecting rod 21 can be intertwined with the chip removal platform 2 and the base 20 when rotating, so that the chip removal platform 2 can rotate in a large range, making it easy for the chip removal platform 2 to be folded and retracted through the connecting rod 21.
[0027] In some examples, the U-shaped brush 10 can be used to scrape the tool, and the tool is cleaned starting from one end near the multi-axis swing head 1 to avoid debris docking at the root of the tool. At the same time, the chip removal platform 2 is set on the side of the multi-axis swing head 1 through the docking mechanism, which can conveniently dock the deep cavity probe 4 with the deep cavity. The deep cavity probe 4 is inserted into the deep cavity to spray cooling liquid, so that the cooling liquid can fully contact the inside of the deep cavity, and the brush bristles 18 can also be used to take out the debris for cleaning. Compared with the traditional direct spraying of cooling liquid on the outside, the deep cavity probe 4 allows the cooling liquid to enter the deep cavity. The liquid supply pipe 1 9 and the liquid supply pipe 2 14 are both connected to the liquid supply device to transport the cooling liquid.
[0028] Example 2 The deep cavity processing method according to the above-mentioned deep cavity processing assembly includes the following steps: Step 1: Tool deep cavity separation: The multi-axis swing head 1 drives the tool to move and separate from the deep cavity, and drives the tool away from the deep cavity; Step 2: Mobile docking: The output end of the second motor 22 drives the connecting rod 21 to rotate, and the connecting rod 21 drives the chip removal platform 2 to rotate to the side of the tool; Step 3: Tool docking: While the chip removal platform 2 is moving, the output end of the drive cylinder 5 is shortened to pull the splash plate 7 to slide on the track 6. When the chip removal platform 2 moves to the side of the tool, the tool enters the U-shaped brush 10; Step 4: Tool cleaning: Liquid supply pipe 1 (9) delivers cooling liquid to spray plate (8), the tool rotates slowly, the output end of drive cylinder (5) extends, U-shaped brush (10) cleans the tool, and inclined nozzle (11) sprays the debris scraped off by U-shaped brush (10); Step 5: Deep cavity alignment: The multi-axis swing head 1 drives the deep cavity probe 4 to align with the deep cavity; Step 6: Deep cleaning: The output end of the motor 12 drives the screw 13 to rotate, and the screw 13 drives the deep cavity probe 4 to slide on the guide frame 3 toward the deep cavity, and the deep cavity probe 4 extends into the deep cavity; Step 7: Debris removal: Liquid supply pipe 2 14 delivers cooling liquid to deep cavity probe 4. The cooling liquid pushes the tray to make brush rod 17 slide on bracket 16. Bristles 18 contact diverter cone 19 and extend into the deep cavity through liquid spray port 15. The output end of motor 12 drives screw 13 to reverse, deep cavity probe 4 moves out of the deep cavity, and bristles 18 drive debris to move out of the deep cavity. Step 8: Continue processing: The output end of the second motor 22 is reversed, and the connecting rod 21 drives the chip removal platform 2 to move away from the tool.
[0029] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure and are not limiting. Although the present disclosure has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present disclosure may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present disclosure, and all of these should be included in the scope of the claims of the present disclosure.
Claims
1. A deep cavity machining assembly, comprising a multi-axis swing head (1), wherein the multi-axis swing head (1) is mounted on a machine tool and a tool is provided on the multi-axis swing head (1), characterized in that: Also includes: A docking mechanism is fixedly mounted on the side of the multi-axis swing head (1), a chip removal platform (2) is rotatably connected to the docking mechanism, and the docking mechanism is used to drive the chip removal platform (2) to move to the side of the tool; a tool cleaning mechanism, slidably arranged on the chip removal platform (2); when the chip removal platform (2) moves to the side of the tool, the tool cleaning mechanism can engage with the tool, and the tool cleaning mechanism is used to clean chips on the tool; A guide frame (3) is fixedly connected to the chip removal platform (2), and the guide frame (3) is arranged on the side of the tool cleaning mechanism; A deep cavity cleaning mechanism is slidably arranged on the guide frame (3), and is used to clean debris in the deep cavity. The deep cavity cleaning mechanism comprises a deep cavity probe (4), and the deep cavity probe (4) is slidably arranged on the guide frame (3). The deep cavity probe (4) can extend into the deep cavity to clean the debris.
2. The deep cavity processing assembly according to claim 1, characterized in that: The tool cleaning mechanism comprises: A driving cylinder (5) is fixedly mounted on the chip removal platform (2); A track (6) fixedly mounted on the chip removal platform (2); A splash plate (7) is slidably arranged on the track (6), and the output end of the driving cylinder (5) is fixedly connected to the splash plate (7); A spray plate (8) is fixedly connected to the splash plate (7), and a liquid supply pipe (9) is connected to the spray plate (8); A U-shaped brush (10) is fixedly connected to the anti-splash plate (7), and the U-shaped brush (10) is arranged on a side of the anti-splash plate (7) close to the tool, with the opening direction of the U-shaped brush (10) facing upward.
3. The deep cavity processing assembly according to claim 2, characterized in that: The spray plate (8) and the splash plate (7) are arranged between the guide frame (3) and the cutter, and an inclined nozzle (11) facing the U-shaped brush (10) is provided on one end of the spray plate (8) close to the U-shaped brush (10).
4. The deep cavity processing assembly according to claim 3, characterized in that: The guide frame (3) is provided with: Motor 1 (12), fixedly mounted on the guide frame (3); The screw (13) is rotatably arranged on the guide frame (3), the output end of the motor 1 (12) is transmission-connected to the screw (13), and the deep cavity probe (4) is threadedly connected to the screw (13).
5. The deep cavity processing assembly according to claim 4, characterized in that: The deep cavity cleaning mechanism further comprises: A second liquid supply tube (14) is connected to the deep cavity probe (4); There are multiple liquid spraying ports (15), and the multiple liquid spraying ports (15) are circumferentially opened on one end of the deep cavity probe (4) away from the second liquid supply pipe (14); A bracket (16) is fixedly arranged inside the deep cavity probe (4); a brush rod (17) slidingly passing through the bracket (16), a spring being provided between the brush rod (17) and the bracket (16), and a tray being provided at one end of the brush rod (17) away from the liquid spraying port (15); Brush bristles (18) are fixedly arranged on one end of the brush rod (17) close to the liquid spraying port (15).
6. The deep cavity processing assembly according to claim 5, characterized in that: A diverter cone (19) is fixedly connected to the deep cavity probe (4) at a position in the center of the plurality of liquid spraying ports (15). When the brush rod (17) drives the bristles (18) to move toward the diverter cone (19), the bristles (18) come into contact with the diverter cone (19) and extend through the plurality of liquid spraying ports (15).
7. The deep cavity processing assembly according to claim 6, characterized in that: The docking mechanism comprises: A base (20) is fixedly mounted on the side of the multi-axis swing head (1); A plurality of connecting rods (21) are provided, and both ends of the plurality of connecting rods (21) are rotatably connected to the base (20) and the chip removal platform (2), respectively, and the plurality of connecting rods (21) are parallel; The base (20) and the chip removal platform (2) remain parallel; Motor 2 (22) is fixedly mounted on the base (20), and the output end of motor 2 (22) is transmission-connected to the connecting rod (21); The base (20) and the chip removal platform (2) are provided with slots corresponding to the connecting rod (21).
8. The deep cavity processing assembly according to claim 7, characterized in that: When the connecting rod (21) drives the chip removal platform (2) to move toward the tool, the U-shaped brush (10) is in contact with the side of the tool close to the multi-axis swing head (1).
9. A deep cavity processing method, according to the deep cavity processing assembly according to any one of claims 1 to 8, characterized in that: The following steps are involved: S1, tool deep cavity separation: the multi-axis swing head (1) drives the tool to move and separate from the deep cavity, and drives the tool away from the deep cavity; S2, mobile docking: the output end of the second motor (22) drives the connecting rod (21) to rotate, and the connecting rod (21) drives the chip removal platform (2) to rotate to the side of the tool; S3, tool docking: while the chip removal platform (2) moves, the output end of the drive cylinder (5) shortens and pulls the splash plate (7) to slide on the track (6). When the chip removal platform (2) moves to the side of the tool, the tool enters the U-shaped brush (10); S4, tool cleaning: the liquid supply pipe 1 (9) delivers cooling liquid to the spray plate (8), the tool rotates slowly, the output end of the drive cylinder (5) extends, the U-shaped brush (10) cleans the tool, and the inclined nozzle (11) sprays the debris scraped off the U-shaped brush (10); S5, deep cavity alignment: the multi-axis swing head (1) drives the deep cavity probe (4) to align with the deep cavity; S6, deep cleaning: the output end of the motor 1 (12) drives the screw (13) to rotate, and the screw (13) drives the deep cavity probe (4) to slide on the guide frame (3) toward the deep cavity, and the deep cavity probe (4) extends into the deep cavity; S7, debris removal: Liquid supply pipe 2 (14) delivers cooling liquid to the deep cavity probe (4), and the cooling liquid pushes the tray to make the brush rod (17) slide on the bracket (16). The bristles (18) contact the diverter cone (19) and extend into the deep cavity at the liquid injection port (15). The output end of motor 1 (12) drives the screw (13) to reverse, and the deep cavity probe (4) moves out of the deep cavity. The bristles (18) drive the debris to move out of the deep cavity. S8, continue processing: the output end of the second motor (22) is reversed, and the connecting rod (21) drives the chip removal platform (2) to move away from the tool.