Multi-layer flexible wearable electronic circuit structure and preparation method and application thereof

Abstract

The invention relates to a multi-layer flexible wearable electronic circuit structure and a preparation method and application thereof. The preparation method comprises the following steps: preparing a substrate layer from a thermoplastic polyurethane solution by adopting electrostatic spinning; a metal mask plate with a circuit pattern etched through laser is pasted on the substrate layer; liquid metal is dropwise added to the substrate layer with the surface covered with the metal mask plate, and the circuit pattern is filled with the liquid metal so that a circuit pattern layer can be printed on the substrate layer; removing the metal mask plate covering the substrate layer, pasting the component on the substrate layer printed with the circuit pattern layer, and respectively connecting the positive electrode and the negative electrode of the circuit pattern layer with conductive copper adhesive tapes as a positive electrode and a negative electrode; and manufacturing a packaging layer on the circuit pattern layer and the surface of the component by using the thermoplastic polyurethane solution through electrostatic spinning to obtain the flexible circuit structure. The multi-layer flexible wearable electronic circuit structure solves the problems of poor air permeability, low skin fitting degree and insufficient mechanical durability of the multi-layer flexible wearable electronic circuit structure.

Description

Technical Field

[0001] The present invention belongs to the field of flexible electronic technology, and in particular relates to a multi-layer flexible wearable electronic circuit structure, a preparation method and an application thereof. Background Art

[0002] Soft and stretchable electronics play an important role as sensors, logic, and communication devices in the growing field of "soft robotics," electronic skin, prosthetics, and implantable devices.

[0003] Although traditional flexible circuit boards (such as FPCs) have a certain degree of flexibility, the flexibility and stretchability of their substrates (such as polyimide) and metal conductors (such as copper) are limited, making it difficult to adapt to extreme deformations or complex curves. In addition, FPCs have a dense structure, lack pores, and have poor air permeability and moisture permeability, which may cause discomfort when worn for a long time. In addition, the manufacturing process of FPCs is complex, involving steps such as material lamination, etching, and drilling, which is costly. FPCs are prone to fatigue failure after repeated bending or stretching, and metal conductors may break, affecting circuit performance. Therefore, it is very necessary to prepare a method for preparing a multilayer flexible circuit structure with good air permeability, high skin adhesion, and good mechanical durability. Summary of the Invention

[0004] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a multi-layer flexible wearable electronic circuit structure, a preparation method and application thereof, which solves the problems of poor air permeability, low skin fit and insufficient mechanical durability of the multi-layer flexible wearable electronic circuit structure.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions: The first implementation scheme provided by the present invention is to provide a method for preparing a multi-layer flexible wearable electronic circuit structure, comprising the following steps: The flexible substrate layer is prepared by electrospinning; Pasting the metal mask plate with the circuit pattern etched on it onto the base layer; Liquid metal is dripped onto the base layer with the metal mask plate attached to the surface, and the liquid metal is filled into the circuit pattern with the help of external force to print the circuit pattern layer on the base layer; Remove the metal mask covering the base layer, then stick the components on the base layer while the components are still closely attached to the circuit pattern layer, and then fix the conductive copper tapes serving as the positive and negative electrodes on both sides of the circuit pattern layer respectively; The flexible circuit structure is obtained by preparing the encapsulation layer on the circuit pattern layer and the component surface using electrostatic spinning.

[0006] Preferably, the liquid metal is a eutectic gallium-indium alloy or a eutectic gallium-indium-tin alloy.

[0007] Preferably, the thickness of the metal mask plate 5 is 0.08 mm to 0.12 mm.

[0008] Preferably, liquid metal is dripped between the conductive copper tape and the circuit pattern layer, and between the components and the circuit pattern layer to increase the connection strength.

[0009] Preferably, the flexible base layer is prepared by electrospinning any one of a thermoplastic polyurethane solution, a polyurethane solution or a styrene-ethylene-butylene-styrene block copolymer solution with a mass concentration of 18% to 22%, wherein the solvent of the thermoplastic polyurethane solution, the polyurethane solution or the styrene-ethylene-butylene-styrene block copolymer solution is tetrahydrofuran and N,N-dimethylformamide in a volume ratio of 1:1 to 1:2.

[0010] Preferably, the base layer is prepared by electrospinning on a metal plate connected to a negative voltage, a layer of aluminum foil is fixed to the surface of the metal plate, and any one of a thermoplastic polyurethane solution, a polyurethane solution or a styrene-ethylene-butylene-styrene block copolymer solution is used as the positive electrode of the electrospinning and is connected to the positive voltage, wherein the spinning speed of the electrospinning is 0.1 mm / min~0.12 mm / min, the positive voltage of the electrospinning is set to 5.8 kv~6.2 kv, and the negative voltage is set to -6.2 kv~-5.8 kv.

[0011] Preferably, two circuit pattern layers with fixed conductive copper tapes are arranged in sequence from top to bottom, and the two circuit pattern layers are laser punched to make the upper and lower circuit pattern layers conductive, and then electrostatic spinning is used to prepare a packaging layer on the topmost circuit pattern layer and the surface of the components to obtain a three-layer flexible circuit structure.

[0012] The present invention provides a multi-layer flexible wearable electronic circuit structure prepared by a method for preparing the multi-layer flexible wearable electronic circuit structure.

[0013] Preferably, it includes a base layer, a circuit pattern layer, components and a packaging layer stacked from bottom to top, the circuit pattern layer is printed on the top surface of the base layer, the components are pasted on the base layer with the circuit pattern layer, the circuit pattern layers are respectively connected with conductive copper tapes, the packaging layer covers the outside of the circuit pattern layer and the components, and the ends of the two conductive copper tapes are located outside the packaging layer.

[0014] The present invention provides an application of a multi-layer flexible wearable electronic circuit structure in health monitoring, human-computer interaction or smart clothing.

[0015] Compared with the prior art, the present invention has the following beneficial effects: The preparation method of the multi-layer flexible wearable electronic circuit structure provided by the present invention can prepare ultrafine fibers to form a highly flexible and stretchable circuit structure that can adapt to more complex curved surfaces and dynamic deformations. Compared with traditional FPC flexible circuit boards, electrospun circuits have porous structures with good air permeability and moisture permeability, and are suitable for long-term wear or skin-fitting applications. In addition, the electrospinning technology is relatively simple and does not involve material lamination, etching, drilling and other steps. It is low-cost, suitable for large-scale production, and has a variety of material options. Electrospun flexible circuits do not use the copper wire in FPC flexible circuit boards as conductors, so they have higher fatigue resistance and durability, can withstand repeated bending and stretching, and have good mechanical durability, such as Figure 10 At the same time, the circuit structure is bent multiple times, and the LED lights in the circuit structure are always powered, as shown in FIG. Figure 9 The shown proof is that the circuit will not break and will not affect the circuit performance.

[0016] The multi-layered flexible wearable electronic circuit structure fabricated by this invention can stretch up to 500% and is breathable and waterproof, effectively preventing allergic or inflammatory reactions in the skin where it is applied. It can also function as a strain sensor to detect human motion in real time. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is the preparation process of the embodiment of the present invention Figure 1 .

[0018] Figure 2 This is a schematic diagram of the preparation process of the embodiment of the present invention Figure 2 ; Figure 3 It is a schematic diagram of preparing a base layer by electrospinning according to the present invention.

[0019] Figure 4 It is a schematic diagram of printing a circuit pattern layer on a base layer according to the present invention.

[0020] Figure 5 This is a schematic diagram of the present invention showing components being pasted onto a base layer having a printed circuit pattern layer.

[0021] Figure 6 The present invention is an unpackaged multi-layer flexible wearable electronic circuit structure.

[0022] Figure 7 The present invention is a multi-layer flexible wearable electronic circuit structure after packaging.

[0023] Figure 8 Schematic diagram of the packaging of a red LED lamp according to an embodiment of the present invention.

[0024] Figure 9Schematic diagram of the bending liquid metal circuit of the red LED lamp according to an embodiment of the present invention.

[0025] Figure 10 Schematic diagram of 20% strain gauge resistance change in a 1KΩ resistor package according to an embodiment of the present invention.

[0026] Figure 11 This is a three-layer flexible circuit package diagram.

[0027] Figure 12 This is the SEM image of TPU electrospinning.

[0028] Reference numerals 1. Metal plate; 2. Aluminum foil; 3. Base layer; 4. Circuit pattern layer; 5. Metal mask plate; 6. Roller; 7. Resistors; 8. Resin adhesive; 9. Conductive copper tape; 10. Encapsulation layer. DETAILED DESCRIPTION

[0029] The specific embodiments of the present invention are described in detail below, but it should be understood that the scope of protection of the present invention is not limited by the specific embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. The experimental methods described in the embodiments of the present invention are all conventional methods unless otherwise specified.

[0030] In view of this, the purpose of the present invention is to provide a multi-layer flexible wearable electronic circuit structure and its preparation method and application, which solves the problems of poor air permeability, low skin fit and insufficient mechanical durability of the multi-layer flexible wearable electronic circuit structure.

[0031] like Figures 1 to 7 As shown, the present invention provides a multi-layer flexible wearable electronic circuit structure as described in claim 1, comprising a base layer 3, a circuit pattern layer 4, components and a packaging layer stacked from bottom to top, the circuit pattern layer 4 is printed on the top surface of the base layer 3, the components are pasted on the base layer 3 having the circuit pattern layer 4, and conductive copper tapes 9 are respectively connected to the symmetrical ends of the circuit pattern layer 4. The packaging layer is electrostatically spun on the circuit pattern layer 4 and the components so that the packaging layer wraps the circuit pattern layer 4 and the components and can completely cover the circuit pattern layer 4 and the components. The ends of the two conductive copper tapes 9 are located outside the packaging layer.

[0032] The technical solution of the present invention is further illustrated below using a specific example based on a multi-layer flexible wearable electronic circuit structure. Experiments have found that any of a eutectic gallium-indium alloy or a eutectic gallium-indium-tin alloy, a thermoplastic polyurethane solution, a polyurethane solution, or a styrene-ethylene-butylene-styrene block copolymer solution can be used to manufacture a multi-layer flexible wearable electronic circuit structure using the method for preparing a multi-layer flexible wearable electronic circuit structure. The following will use a thermoplastic polyurethane solution and a eutectic gallium-indium alloy as an example.

[0033] Example 1 (1) First, prepare a TPU solution with a mass concentration of 18%. The solvent is tetrahydrofuran and N, N-dimethylformamide, and the volume ratio of tetrahydrofuran to N, N-dimethylformamide is 1:1. After the preparation is completed, heat it at 60 ° C on a hot plate and stir for 5 hours until the TPU is completely dissolved. Finally, wait for the bubbles to disappear after standing for 30 minutes to obtain the TPU solution required for electrospinning. The liquid metal uses eutectic gallium-indium alloy.

[0034] (2) Then, electrospinning was started to prepare the base layer 3. A metal plate 1 that can be used for electrospinning was selected and placed at the bottom of the electrospinning equipment, and a layer of aluminum foil 2 was fixed on its surface. The metal plate 1 was connected to the negative electrode. A 5ml glass syringe was used to absorb 3ml of TPU solution as the positive electrode of electrospinning. The TPU solution was connected to the positive electrode. The positive electrode voltage was set to 5.8kv, the negative electrode voltage was set to -5.8kv, and the spinning speed was set to 0.1mm / min. After the spinning was completed, a smooth base layer 3 was obtained on the metal plate.

[0035] (3) Furthermore, a metal mask plate 5 with a thickness of 0.08 mm is used, and a conductive circuit is etched on its surface using a laser. The width of the pattern etched on the metal mask plate 5 is 0.3 mm. The metal mask plate 5 is attached to its base layer 3. A small amount of liquid metal is sucked up with a needle and dropped on the metal mask plate 5. Then, a roller 6 is rolled back and forth over the metal mask plate 5. After the liquid metal is completely filled into the gaps of the metal mask plate 5, the metal mask plate 5 can be removed. At this time, the liquid metal circuit 4 is completely printed on its base layer 3.

[0036] (4) Further, apply a small amount of resin adhesive 8 on the contact surface of the chip component such as resistor 7 or LED lamp (LED lamp is selected here) and the base layer 3, and spread the resin adhesive 8 evenly. Then, carefully place the LED lamp with tweezers and press it lightly. After waiting for a few minutes until it is completely fixed, use a small brush to dip the liquid metal on the electrode pins of the liquid metal circuit and the LED lamp, and gently apply the liquid metal until it completely covers the pins. This can prevent the liquid metal at the pins from being disconnected from the conductive path due to excessive stretching.

[0037] (5) Furthermore, the conductive copper tape 9 is attached to both ends of the liquid metal path as the power supply electrodes of the circuit. At the same time, a small brush is dipped in liquid metal and a layer of liquid metal is lightly brushed between the conductive copper tape 9 and the liquid metal circuit 4 to prevent excessive stretching from causing the power supply of the path to be disconnected.

[0038] (6) Further, the metal plate 1 is placed in an electrospinning device, and a layer of TPU is electrospun on its surface as the final encapsulation layer 10 using the same operation as step (2).

[0039] (7) In the final step, the finished product is peeled off from the aluminum foil on the metal plate 1 to obtain a flexible circuit.

[0040] The present invention can be used as a two-layer flexible circuit packaging structure or a three-layer flexible circuit packaging structure. Figure 11 As shown, the three-layer flexible circuit packaging structure is a two-layer flexible circuit packaging structure prepared in the above embodiment 1. The packaging circuit is manufactured on the second layer according to the method of embodiment 1. The upper and lower packaging circuits are laser punched to make the upper and lower layers conductive and have a common ground terminal.

[0041] Example 2 (1) First, a 20% mass concentration TPU solution was prepared. The solvent was tetrahydrofuran and N,N-dimethylformamide, and the volume ratio of tetrahydrofuran to N,N-dimethylformamide was 1:1. After the preparation was completed, it was heated at 60 °C on a hot plate and stirred for 6 hours until the TPU was completely dissolved. Finally, it was left to stand for 30 minutes and wait for the bubbles to disappear. The TPU solution required for electrospinning was obtained. The liquid metal used was eutectic gallium-indium alloy.

[0042] (2) Then, electrospinning was started to prepare the base layer 3. A metal plate 1 suitable for electrospinning was selected and placed at the bottom of the electrospinning device. A layer of aluminum foil 2 was fixed on its surface. The metal plate 1 was connected to the negative electrode. After that, 3 ml of TPU solution was sucked into a 5 ml glass syringe as the positive electrode for electrospinning. The TPU solution was connected to the positive electrode. The positive electrode voltage was set to 6 kV, the negative electrode voltage was set to -6 kV, and the spinning speed was set to 0.1 mm / min. After the spinning was completed, a smooth base layer 3 was obtained on the metal plate.

[0043] (3) Further, a metal mask plate 5 with a thickness of 0.1 mm is used, and a conductive circuit is etched on its surface using a laser. The pattern width of the etched area on the metal mask plate 5 is 0.3 mm. The metal mask plate 5 is attached to its base layer 3. A small amount of liquid metal is sucked up with a needle and dropped on the metal mask plate 5. Then, a roller 6 is rolled back and forth over the metal mask plate 5. After the liquid metal is completely filled into the gaps of the metal mask plate 5, the metal mask plate 5 can be removed. At this time, the liquid metal circuit 4 is completely printed on its base layer 3.

[0044] (4) Further, apply a small amount of resin adhesive 8 on the contact surface of the chip components, such as the resistor 7 or the LED lamp (LED lamp is selected here), and the LED lamp and the base layer 3, and spread the resin adhesive 8 evenly. Then, carefully place the LED lamp with tweezers and press it lightly. After waiting for a few minutes until it is completely fixed, use a small brush to dip the liquid metal on the electrode pins of the liquid metal circuit and the LED lamp, and gently apply the liquid metal until it completely covers the pins. This can prevent the liquid metal at the pins from being disconnected from the conductive path due to excessive stretching.

[0045] (5) Furthermore, the conductive copper tape 9 is attached to both ends of the liquid metal path as the power supply electrodes of the circuit. At the same time, a small brush is dipped in liquid metal and a layer of liquid metal is lightly brushed between the conductive copper tape 9 and the liquid metal circuit 4 to prevent excessive stretching from causing the power supply of the path to be disconnected.

[0046] (6) Further, the metal plate 1 is placed in an electrospinning device, and a layer of TPU is electrospun on its surface as the final encapsulation layer 10 using the same operation as step (2).

[0047] (7) In the final step, the finished product is peeled off from the aluminum foil on the metal plate 1 to obtain a flexible circuit.

[0048] The present invention can be used as a two-layer flexible circuit packaging structure or a three-layer flexible circuit packaging structure. Figure 11 As shown, the three-layer flexible circuit packaging structure is based on the two-layer flexible circuit packaging structure prepared in the above embodiment 2, and the packaging circuit is manufactured on the second layer according to the method of embodiment 2. The upper and lower packaging circuits are laser punched to make the upper and lower layers conductive and have a common ground terminal.

[0049] Example 3 (1) First, a 22% mass concentration TPU solution was prepared. The solvent was tetrahydrofuran and N,N-dimethylformamide, and the volume ratio of tetrahydrofuran to N,N-dimethylformamide was 1:2. After the preparation was completed, it was heated at 60 °C on a hot plate and stirred for 6 hours until the TPU was completely dissolved. Finally, it was left to stand for 30 minutes and wait for the bubbles to disappear. The TPU solution required for electrospinning was obtained. The liquid metal used was eutectic gallium-indium alloy.

[0050] (2) Then, electrospinning was started to prepare the base layer 3. A metal plate 1 that could be used for electrospinning was placed at the bottom of the electrospinning equipment, and a layer of aluminum foil 2 was fixed on its surface. The metal plate 1 was connected to the negative electrode. A 5ml glass syringe was used to absorb 3ml of TPU solution as the positive electrode for electrospinning. The TPU solution was connected to the positive electrode. The positive electrode voltage was set to 6.2kv, the negative electrode voltage was set to -6.2kv, and the spinning speed was set to 0.12mm / min. After the spinning was completed, a smooth base layer 3 was obtained on the metal plate.

[0051] (3) Further, a metal mask plate 5 with a thickness of 0.12 mm is used, and a conductive circuit is etched on its surface using a laser. The pattern width of the etched area on the metal mask plate 5 is 0.3 mm. The metal mask plate 5 is attached to its base layer 3. A small amount of liquid metal is sucked up with a needle and dropped on the metal mask plate 5. Then, a roller 6 is rolled back and forth over the metal mask plate 5. After the liquid metal is completely filled into the gaps of the metal mask plate 5, the metal mask plate 5 can be removed. At this time, the liquid metal circuit 4 is completely printed on its base layer 3.

[0052] (4) Furthermore, a small amount of resin adhesive 8 is applied to the contact surface of the chip components, such as the resistor 7 or the LED lamp (LED lamp is selected here), and the LED lamp and the base layer 3, and the resin adhesive 8 is spread evenly. Then, the LED lamp is carefully placed with tweezers and lightly pressed. After waiting for a few minutes until it is completely fixed, a small brush is used to dip the liquid metal on the electrode pins of the liquid metal circuit and the LED lamp, and the liquid metal is gently applied until it completely covers the pins. This can prevent the liquid metal at the pins from being disconnected from the conductive path due to excessive stretching.

[0053] (5) Furthermore, the conductive copper tape 9 is attached to both ends of the liquid metal path as the power supply electrodes of the circuit. At the same time, a small brush is dipped in liquid metal and a layer of liquid metal is lightly brushed between the conductive copper tape 9 and the liquid metal circuit 4 to prevent excessive stretching from causing the power supply of the path to be disconnected.

[0054] (6) Further, the metal plate 1 is placed in an electrospinning device, and a layer of TPU is electrospun on its surface as the final encapsulation layer 10 using the same operation as step (2).

[0055] (7) In the final step, the finished product is peeled off from the aluminum foil on the metal plate 1 to obtain a flexible circuit.

[0056] The present invention can be used as a two-layer flexible circuit packaging structure or a three-layer flexible circuit packaging structure. Figure 11 As shown, the three-layer flexible circuit packaging structure is based on the two-layer flexible circuit packaging structure prepared in the above embodiment 3, and the packaging circuit is manufactured on the second layer according to the method of embodiment 3. The upper and lower packaging circuits are laser punched to make the upper and lower layers conductive and have a common ground terminal.

[0057] Experimental verification In the above-mentioned embodiments 1 to 3, the base layer 3 can be prepared by electrospinning. The following SEM test is performed on the base layer 3 prepared by any embodiment 1 to 3. Figure 12 It can be seen that there are gaps between the spun fibers, which makes them breathable and suitable for long-term wear or applications close to the skin.

[0058] The above-mentioned embodiments 1 to 3 can all prepare a multi-layer flexible wearable electronic circuit structure, and its physical structure is as follows: Figure 8 As shown, the multilayer flexible wearable electronic circuit structure prepared by any one of Examples 1 to 3 is subjected to circuit bending and 20% strain stretching cycle tests, and the results are as follows: Figures 9 and 10 As shown by Figure 9 It can be seen that after multiple bends, the LED lights in the circuit structure are always powered on, proving that the circuit will not break and will not affect the circuit performance. Figure 10 It can be seen that after multiple bending and stretching cycles, the performance of the circuit structure remains almost unchanged, proving that the circuit structure can withstand repeated bending and stretching and has good mechanical durability.

[0059] Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is intended to include such modifications and variations.

Claims

1. A method for preparing a multi-layer flexible wearable electronic circuit structure, characterized in that: The steps include: A flexible substrate layer is prepared by electrospinning (3); Pasting the metal mask plate (5) with the circuit pattern etched thereon onto the base layer (3); Dropping liquid metal onto a base layer (3) having a metal mask plate (5) attached to its surface, so that the liquid metal fills the circuit pattern, and is used to print a circuit pattern layer (4) on the base layer (3); The metal mask plate (5) covering the base layer (3) is removed, and components are then pasted onto the base layer (3) while the components are also closely adhered to the circuit pattern layer (4), and conductive copper tapes (9) serving as positive and negative electrodes are respectively fixed on both sides of the circuit pattern layer (4); Electrospinning is used to prepare an encapsulation layer (10) on the circuit pattern layer (4) and the surface of the component, thereby obtaining a two-layer flexible circuit structure.

2. The method for preparing a multi-layer flexible wearable electronic circuit structure according to claim 1, characterized in that: The liquid metal is a eutectic gallium-indium alloy or a eutectic gallium-indium-tin alloy.

3. The method for preparing a multi-layer flexible wearable electronic circuit structure according to claim 1, characterized in that: The thickness of the metal mask plate (5) is 0.08 mm to 0.12 mm.

4. The method for preparing a multi-layer flexible wearable electronic circuit structure according to claim 1, wherein: Liquid metal is dripped between the conductive copper tape (9) and the circuit pattern layer (4), as well as between the components and the circuit pattern layer (4) to increase the connection strength.

5. The method for preparing a multi-layer flexible wearable electronic circuit structure according to claim 1, characterized in that: The flexible base layer (3) is prepared by electrospinning any one of a thermoplastic polyurethane solution, a polyurethane solution or a styrene-ethylene-butylene-styrene block copolymer solution with a mass concentration of 18% to 22%, wherein the solvent of the thermoplastic polyurethane solution, the polyurethane solution or the styrene-ethylene-butylene-styrene block copolymer solution is tetrahydrofuran and N,N-dimethylformamide with a volume ratio of 1:1 to 1:

2.

6. The method for preparing a multi-layer flexible wearable electronic circuit structure according to claim 5, wherein: The base layer (3) is prepared by electrospinning on a metal plate (1) connected to a negative voltage, a layer of aluminum foil (2) is fixed on the surface of the metal plate (1), and any one of a thermoplastic polyurethane solution, a polyurethane solution or a styrene-ethylene-butylene-styrene block copolymer solution is used as a positive electrode for electrospinning and is connected to a positive voltage, wherein the spinning speed of the electrospinning is 0.1 mm / min to 0.12 mm / min, the positive voltage of the electrospinning is set to 5.8 kV to 6.2 kV, and the negative voltage is set to -6.2 kV to -5.8 kV.

7. The method for preparing a multi-layer flexible wearable electronic circuit structure according to claim 1, wherein: Two circuit pattern layers (4) with fixed conductive copper tapes (9) are arranged in sequence from top to bottom, and the two circuit pattern layers (4) are punched by laser to make the upper and lower circuit pattern layers (4) conductive. Then, electrostatic spinning is used to prepare a packaging layer (10) on the uppermost circuit pattern layer (4) and the surface of the components to obtain a three-layer flexible circuit structure.

8. A multi-layer flexible wearable electronic circuit structure prepared by the method for preparing a multi-layer flexible wearable electronic circuit structure according to any one of claims 1 to 7.

9. The multi-layer flexible wearable electronic circuit structure according to claim 8, characterized in that: The invention comprises a base layer (3), a circuit pattern layer (4), components and a packaging layer stacked from bottom to top, wherein the circuit pattern layer (4) is printed on the top surface of the base layer (3), the components are attached to the base layer (3) having the circuit pattern layer (4), the circuit pattern layer (4) is respectively connected with conductive copper tapes (9), the packaging layer covers the outside of the circuit pattern layer (4) and the components, and the ends of the two conductive copper tapes (9) are located outside the packaging layer.

10. Application of the multi-layer flexible wearable electronic circuit structure according to claim 8 in health monitoring, human-computer interaction or smart clothing.

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