Equipment and method for cleaning etching solution of integrated circuit board

Abstract

The invention relates to the field of circuit board cleaning, in particular to integrated circuit board etching liquid cleaning equipment and method.The integrated circuit board etching liquid cleaning equipment comprises a water tank for closing a water flow route, a sliding rail is connected to the inner wall of the water tank, a base is slidably connected to the inner side of the sliding rail, an electric telescopic rod and a driving assembly are connected to the upper end of the base, and the telescopic end of the electric telescopic rod is connected with an elastic rod; a cleaning tank is connected to the bottom of the water tank, a protruding net is connected to the position, higher than the cleaning tank, of the bottom of the water tank, paddles are arranged on the inner side of the protruding net, a floating object plate is connected to the outermost ring of the inner wall of the water tank, and a tooth groove is formed in the position, higher than the base, of the inner wall of the water tank. The circuit board can be subjected to fluid flushing through circulation of water flow, the clamping pieces and the circuit board can be driven to rotate by pushing the blades after flushing is completed, residual water stains on the surface of the circuit board can be thrown out under the action of centrifugal force during rotation, and a good drying effect is achieved.

Description

Technical Field

[0001] The present invention relates to the field of circuit board cleaning, and in particular to equipment and a method for cleaning etching liquid of an integrated circuit board. Background Art

[0002] The circuit board needs to be etched before the chip is soldered. First, the non-etched area is covered with a tin plate, and then the exposed part is etched with an etching solution to form the circuit path on the circuit board. After removing the tin plate and cleaning the etching solution, solder joints are added and the chip is soldered. In the prior art, etching solution cleaning often uses clean water without impurities, and the cleaning water after rinsing cannot be recycled again, which leads to a large amount of cleaning water waste. In addition, the etching solution residue is mainly divided into two types: the first is a suspension, such as grease, and the second is a sediment, such as tin block fragments and other etching residues. Therefore, it is necessary to solve the problem of etching solution residue in the rinsing water.

[0003] For this reason, those skilled in the art have designed a kind of integrated circuit board etching solution cleaning equipment and method to solve the above-mentioned problem. Summary of the Invention

[0004] In view of the above-mentioned technical deficiencies, the purpose of the present invention is to provide an integrated circuit board etching solution cleaning device and method, which can be adapted for use in welding meshes with different spacings.

[0005] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a water tank with a closed water flow path, the inner wall of the water tank is connected to a slide rail, the inner side of the slide rail is slidably connected to a base, the upper end of the base is connected to an electric telescopic rod and a drive assembly, the telescopic end of the electric telescopic rod is connected to an elastic rod, the end of the elastic rod away from the electric telescopic rod is connected to a clamping assembly, the bottom of the water tank is connected to a cleaning tank, the bottom of the water tank is connected to a convex net at a position higher than the cleaning tank, paddles are provided on the inside of the convex net, a floating plate is connected to the outermost circle of the inner wall of the water tank, a tooth groove is provided on the inner wall of the water tank above the base, and a drainage pump is installed on the top edge of the water tank.

[0006] Preferably, the water tank includes at least one arc segment, water circulates in the water tank, and the height of the bottom of the water tank close to the drain pump is lower than the height of the bottom of the water tank away from the drain pump.

[0007] Preferably, one end of the floating board is fixedly connected to the inner wall of the water tank, and the end of the floating board away from the water tank is a hollow structure, which can move up and down with the height of the water surface, and the water surface height does not exceed the connection between the floating board and the inner wall of the water tank.

[0008] Preferably, a transverse groove for installing the paddle blade is opened at the bottom of the water tank, and the transverse groove and the convex net wrap the paddle blade together. The paddle blade is always located below the water surface, and the convex net can contact the clamping assembly.

[0009] Preferably, the depth of the inner wall of the cleaning tank is greater than the maximum diameter of the clamping assembly. When the electric telescopic rod drives the elastic rod and the clamping assembly to descend, the clamping assembly is located in the cleaning tank.

[0010] Preferably, the clamping assembly includes a clip connected to the elastic rod, at least two clips are provided, a spring is provided between the two clips, and blades are evenly distributed on the outer circle of the clip.

[0011] Preferably, when the convex net contacts the blades, the elastic rod is forced to bend, and when the blades separate from the outer wall of the convex net, the elastic rod resets and drives the clamping assembly to vibrate, so that one side of the blades on the clip is always in contact with the water surface, one side of the convex net is an inclined surface, and the other side is a vertical surface.

[0012] Preferably, a hole is formed in the center of the clip, and the edge of the hole is a chamfered surface. The two clips can clamp the front and back sides of the circuit board through the spring.

[0013] Preferably, the driving assembly includes a gear and a driving motor, the gear and the tooth groove form a meshing connection, the tooth groove is distributed in an annular manner on the inner wall of the water tank, and the flow direction of the water flow is opposite to the movement direction of the base.

[0014] Preferably, the drainage pump includes a pump body located at the top edge of the water tank, a corrugated tube is connected to the bottom of the pump body, a water inlet pipe is connected to the bottom of the corrugated tube, and the water inlet pipe is in contact with the inclined surface of the floating plate.

[0015] A method for cleaning an integrated circuit board etching solution comprises the following steps: Step 1: Clamp the circuit board with a clamping assembly, and immerse the clamping assembly and the circuit board in the water of the cleaning tank at the same time; Step 2: Turn on the paddle to push the water in the water tank to flow in a directional manner, and clean the two sides of the circuit board; Step 3: Remove the clamping assembly and the circuit board from the cleaning tank, and drive the driving assembly to move them around the tank. The water flow drives the clamping piece and the circuit board to rotate, so that the residual liquid on the surface of the clamping piece is thrown out. Step 4: Remove the dried circuit board from the clamping assembly.

[0016] The beneficial effects of the present invention are as follows: the circulation of water flow can not only perform fluid flushing on the circuit board, but also, after the flushing is completed, the pushing blades can be used to drive the clamping piece and the circuit board itself to rotate. During the rotation, under the action of centrifugal force, the water stains remaining on the surface of the circuit board will be thrown outward, achieving a good drying effect; At the same time, the water tank of the present invention adopts a circulating water channel design and is provided with at least one arc section. Since the residual etching solution may contain impurities or grease floating on the water surface, which may remain in the cleaning water and affect the subsequent cleaning effect, the circulating flow of water is utilized. When the water flows through the arc section, the suspended grease can be quickly washed onto the floating plate due to the centrifugal force, and can be quickly discharged through the adsorption of the drainage pump. When the clamping assembly and the circuit board are located underwater, since the paddles drive the flow of the upper water flow, the clamp located in the water can push the blades under the push of the upper water flow to allow the circuit board to be slowly rotated and cleaned in the cleaning tank, thereby improving the cleaning efficiency. In summary, the present invention uses the flow of water circulation to quickly separate the residues of the etching solution under the action of centrifugal force, maintains the purity of the rinse water, and can be rinsed repeatedly, which is beneficial to the production and manufacturing of integrated circuit modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0018] Figure 1 It is a side view internal schematic diagram of the present invention.

[0019] Figure 2 The present invention Figure 1 A partial enlarged schematic diagram of point A in the middle.

[0020] Figure 3 The present invention Figure 1 The schematic diagram below shows a partial enlargement of point B in the middle.

[0021] Figure 4 It is a top view schematic diagram of the present invention.

[0022] Figure 5 It is a schematic diagram of a drainage pump of the present invention.

[0023] Figure 6 It is a three-dimensional schematic diagram of the water tank of the present invention.

[0024] Figure 7 It is a three-dimensional schematic diagram of the water tank of the present invention. In the picture: 1. Sink; 2. Slide rail; 3. Cleaning trough; 4. Convex net; 5. Paddle; 6. Float; 7. Tooth groove; 8. Drain pump; 801. Pump body; 802. Water inlet pipe; 803. Pleated tube; 9. Base; 10. Drive assembly; 11. Clamping assembly; 1101. Clip; 1102. Spring; 1103. Push blade; 12. Electric telescopic rod; 13. Elastic rod. DETAILED DESCRIPTION

[0025] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.

[0026] Among them, the drawings are only used for illustrative purposes and represent only schematic diagrams rather than actual pictures, and should not be understood as limiting this patent; in order to better illustrate the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of the actual product; for those skilled in the art, it is understandable that some well-known structures and their descriptions in the drawings may be omitted.

[0027] The same or similar numbers in the drawings of the embodiments of the present invention correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "inside", "outside" and the like indicate an orientation or position relationship based on the orientation or position relationship shown in the drawings, it is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the terms describing the position relationship in the drawings are only used for illustrative purposes and cannot be understood as limiting this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0028] In the description of the present invention, unless otherwise expressly specified or limited, when the term "connection" or the like appears to indicate a connection relationship between components, such term should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be internal communication between two components or an interaction between two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood in specific circumstances.

[0029] Example 1: The present invention provides an integrated circuit board etching solution cleaning device and method, such as Figure 1-7As shown, a water tank 1 with a closed water flow path is provided. The inner wall of the water tank 1 is connected to a slide rail 2. The inner side of the slide rail 2 is slidably connected to a base 9. The upper end of the base 9 is connected to an electric telescopic rod 12 and a drive assembly 10. The telescopic end of the electric telescopic rod 12 is connected to an elastic rod 13. The end of the elastic rod 13 away from the electric telescopic rod 12 is connected to a clamping assembly 11. The bottom of the water tank 1 is connected to a cleaning tank 3. A convex net 4 is connected to the bottom of the water tank 1 at a position higher than the cleaning tank 3. A paddle 5 is provided inside the convex net 4. The outermost circle of the inner wall of the water tank 1 is connected to There is a floating plate 6, and a tooth groove 7 is provided on the inner wall of the water tank 1 above the base 9. A drainage pump 8 is installed on the top edge of the water tank 1. The water tank 1 includes at least one arc segment. Water circulates in the water tank 1. When the water flows through the arc segment, the suspended particles are thrown outward due to the action of centrifugal force. The height of the side of the bottom of the water tank 1 close to the drainage pump 8 is lower than the height of the side away from the drainage pump 8. The bottom of the water tank 1 is an inclined structure with an inclination angle of less than 5°. A small amount of inclination can prompt the suspended matter to actively move closer to the edge of the low-position water tank 1.

[0030] One end of the floating plate 6 is fixedly connected to the inner wall of the water tank 1. The end of the floating plate 6 away from the water tank 1 is a hollow structure and can move up and down with the height of the water surface. The water surface height does not exceed the connection between the floating plate 6 and the inner wall of the water tank 1. The hollow structure at one end of the floating plate 6 can cause one end of the floating plate 6 to move synchronously with the ups and downs of the water surface and be on the same horizontal line with the water surface. Under the action of centrifugal force, the suspended matter will be thrown onto the floating plate 6, making it easy for the drainage pump 8 to extract it.

[0031] The bottom of the water tank 1 is provided with a transverse groove for installing the paddle blade 5. The transverse groove and the convex net 4 together wrap the paddle blade 5. The paddle blade 5 is always located below the water surface. The paddle blade 5 can drive the liquid to circulate. The paddle blade 5 and the convex net 4 are equidistantly distributed inside the water tank 1, and the paddle blade 5 is oriented in the clockwise direction. The convex net 4 can contact the clamping component 11.

[0032] The depth of the inner wall of the cleaning tank 3 is greater than the maximum diameter of the clamping assembly 11. The cleaning tank 3 can perform immersion cleaning on the clamping assembly 11 and the circuit board, and the flow of water can flush the residual liquid on the circuit board. When the electric telescopic rod 12 drives the elastic rod 13 and the clamping assembly 11 to descend, the clamping assembly 11 is located in the cleaning tank 3. While using immersion cleaning can improve cleaning efficiency, since the height of the paddle 5 is higher than the cleaning tank 3, the clamping assembly 11 will also rotate inside the cleaning tank 3. It is mainly the upper layer of liquid water that drives the blade 1103 to drive the entire clamping assembly 11 to rotate, thereby achieving the effect of rotary cleaning; The clamping assembly 11 includes a clip 1101 connected to the elastic rod 13. There are at least two clips 1101, with a spring 1102 disposed between the two clips 1101. Blades 1103 are evenly distributed around the outer ring of the clip 1101. The clip 1101 needs to be made of a thin sheet material and a corrosion-resistant coating. Reducing the thickness of the clip 1101 can reduce the weight during rotation. When the convex mesh 4 contacts the blade 1103, the elastic rod 13 is forced to bend. When the blade 1103 separates from the outer wall of the convex mesh 4, the elastic rod 13 resets and drives the clamping assembly 11 to vibrate. One side of the blade 1103 on the clip 1101 is always in contact with the water surface, and the elastic rod 13 can elastically yield. Due to the height of the convex mesh 4, the clip 1101 cannot directly cross the convex mesh 4 by rolling, but the elastic effect of the elastic rod 13 can force the clip 1101 to lift up by yielding, and allow the elastic rod 13 to accumulate elastic potential energy and release the elastic potential energy when it completely crosses the convex mesh 4. The released elastic potential energy can cause the regular circuit board to shake frequently, which is conducive to the separation of moisture. One side of the convex mesh 4 is a slope and the other side is a vertical surface. The sloped side of the convex mesh 4 can better allow the clip 1101 to cross the upper surface of the convex mesh 4 when rotating.

[0033] A hole is provided through the center of the clip 1101, and the edge of the hole is a chamfered slope. The hole can expose the front and back sides of the circuit board and use centrifugal force to throw moisture on the surface of the circuit board outward under the action of rotation. The slope of the edge of the hole can facilitate the flow of liquid. The two clips 1101 can clamp the front and back sides of the circuit board through the spring 1102.

[0034] The drive assembly 10 includes a gear and a drive motor. The gear is meshed with the tooth groove 7. The tooth groove 7 is annularly distributed on the inner wall of the water tank 1. The flow direction of the water flow is opposite to the movement direction of the base 9. The opposite movement direction of the circuit board and the water flow can promote the water flow to better interact with the push blade 1103 on the clip 1101, thereby pushing the clip 1101 to rotate, generate centrifugal force and remove water. The drainage pump 8 includes a pump body 801 located at the top edge of the water tank 1. A corrugated tube 803 is connected to the bottom of the pump body 801. The bottom of the corrugated tube 803 is connected to the water inlet pipe 802. The water inlet pipe 802 is in contact with the inclined surface of the floating plate 6. The corrugated tube 803 can be extended and retracted up and down. Its structure is similar to the curved part of a straw. When the floating plate 6 is lifted upward by the action of the water flow, it will also lift up the water inlet pipe 802 at the bottom of the corrugated tube 803, continuously maintaining the adsorption state of suspended grease. The drainage pump 8 can also use a vacuum pump. Since it may often absorb air, the use of a vacuum pump can extend the life of the device.

[0035] A method for cleaning an integrated circuit board etching solution comprises the following steps: Step 1, clamping the circuit board with a clamping assembly 11, and simultaneously immersing the clamping assembly 11 and the circuit board in water in a cleaning tank 3; Step 2: Turn on the paddle 5 to push the water in the water tank 1 to flow in a directional manner, and clean the two sides of the circuit board; Step 3: Remove the clamping assembly 11 and the circuit board from the cleaning tank 3 and, driven by the driving assembly 10, perform a circular motion along the water tank 1. The water flow drives the clip 1101 and the circuit board to rotate, causing the residual liquid on the surface of the clip 1101 to be thrown outward. Step 4: Remove the dried circuit board from the clamping assembly 11. Working principle: When in use, insert the circuit board between the two clips 1101, and use the spring 1102 and the two clips 1101 to clamp the two square sides of the circuit board. Turn on the driving component 10 to drive the multiple clamping components 11 to move directly above the cleaning tank 3. Turn on the electric telescopic rod 12, and the electric telescopic rod 12 drives the multiple clamping components 11 to descend and submerge into the water in the cleaning tank 3. Because the water flow is pushed by the blade 5, the water in the water tank 1 always circulates in one direction, and the residual etching liquid on the circuit board will be washed away by the water flow. At the same time, when the sediment passes through the cleaning tank 3, it will fall to the bottom of the cleaning tank 3 to form a sediment. There is some grease in the etching liquid, and the grease will float on the top layer. Under the action of the centrifugal force of the water bend, the grease is thrown to the edge floating plate 6 and is completely sucked away by the drainage pump 8. When the electric telescopic rod 12 drives the clamping assembly 11 to leave the cleaning tank 3, the pushing blade 1103 at the bottom edge of the clip 1101 is still in contact with the water surface. When the driving assembly 10 drives the base 9 and the clamping assembly 11 to perform a circular motion, the water flow interacts with the pushing blade 1103 at the bottom of the clip 1101, driving the pushing blade 1103 to rotate, and driving the circuit board to rotate. The rotation of the circuit board throws out the water stains on the surface outward by centrifugal force, and dries the circuit board itself during the throwing process. After one circle, when it reaches the top of the cleaning tank 3 again, it dives into the cleaning tank 3 for cleaning. Two reciprocating movements complete the cleaning process of the entire circuit board. It should be noted that the above-described specific embodiments are merely preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will appreciate that various modifications, equivalent substitutions, and variations may be made to the present invention. However, as long as these modifications do not depart from the spirit of the present invention, they are intended to be within the scope of protection of the present invention. Furthermore, certain terms used in the specification and claims of this application are not intended to be limiting and are provided solely for ease of description.

Claims

1. An integrated circuit board etching solution cleaning device, characterized in that: The invention comprises a water tank (1) with a closed water flow path, wherein the inner wall of the water tank (1) is connected to a slide rail (2), the inner side of the slide rail (2) is slidably connected to a base (9), the upper end of the base (9) is connected to an electric telescopic rod (12) and a driving assembly (10), the telescopic end of the electric telescopic rod (12) is connected to an elastic rod (13), the end of the elastic rod (13) away from the electric telescopic rod (12) is connected to a clamping assembly (11), the bottom of the water tank (1) is connected to a cleaning tank (3), a convex net (4) is connected to the bottom of the water tank (1) at a position higher than the cleaning tank (3), a paddle (5) is provided on the inner side of the convex net (4), a floating plate (6) is connected to the outermost circle of the inner wall of the water tank (1), a tooth groove (7) is provided at the inner wall of the water tank (1) above the base (9), and a drainage pump (8) is installed on the top edge of the water tank (1).

2. The integrated circuit board etching solution cleaning device according to claim 1, characterized in that: The water trough (1) includes at least one arc segment, and water circulates in the water trough (1). The height of the bottom of the water trough (1) on the side close to the drainage pump (8) is lower than the height of the side away from the drainage pump (8).

3. The integrated circuit board etching solution cleaning device according to claim 1, characterized in that: One end of the floating plate (6) is fixedly connected to the inner wall of the water tank (1), and the end of the floating plate (6) away from the water tank (1) is a hollow structure and can move up and down with the height of the water surface. The water surface height does not exceed the connection between the floating plate (6) and the inner wall of the water tank (1).

4. The integrated circuit board etching solution cleaning device according to claim 1, characterized in that: The bottom of the water tank (1) is provided with a transverse groove for installing the paddle blade (5), and the transverse groove and the convex net (4) together wrap the paddle blade (5). The paddle blade (5) is always located below the water surface, and the convex net (4) can contact the clamping component (11).

5. The integrated circuit board etching solution cleaning device according to claim 1, characterized in that: The depth of the inner wall of the cleaning tank (3) is greater than the maximum diameter of the clamping assembly (11). When the electric telescopic rod (12) drives the elastic rod (13) and the clamping assembly (11) to descend, the clamping assembly (11) is located in the cleaning tank (3).

6. The integrated circuit board etching solution cleaning device according to claim 1, characterized in that: The clamping assembly (11) comprises a clip (1101) connected to the elastic rod (13), at least two clips (1101) are provided, a spring (1102) is provided between the two clips (1101), and blades (1103) are equidistantly distributed on the outer ring of the clip (1101).

7. The integrated circuit board etching solution cleaning device according to claim 6, characterized in that: When the convex net (4) contacts the blade (1103), the elastic rod (13) is forced to bend. When the blade (1103) separates from the outer wall of the convex net (4), the elastic rod (13) resets and drives the clamping assembly (11) to vibrate. One side of the blade (1103) on the clamp (1101) is always in contact with the water surface. One side of the convex net (4) is an inclined surface, and the other side is a vertical surface. A hole is opened in the center of the clamp (1101), and the edge of the hole is a chamfered inclined surface. The two clamps (1101) can clamp the front and back sides of the circuit board through the spring (1102).

8. The integrated circuit board etching solution cleaning device according to claim 1, characterized in that: The driving assembly (10) includes a gear and a driving motor. The gear is meshed with the tooth groove (7). The tooth groove (7) is distributed in an annular manner on the inner wall of the water tank (1). The flow direction of the water flow is opposite to the movement direction of the base (9).

9. The integrated circuit board etching solution cleaning device according to claim 1, characterized in that: The drainage pump (8) includes a pump body (801) located at the top edge of the water tank (1), the bottom of the pump body (801) is connected to a corrugated tube (803), the bottom of the corrugated tube (803) is connected to a water inlet pipe (802), and the water inlet pipe (802) is in contact with the inclined surface of the floating plate (6).

10. A method for cleaning an integrated circuit board etching solution according to claim 1, characterized in that: The following steps are involved: Step 1: Clamp the circuit board with the clamping assembly (11), and simultaneously immerse the clamping assembly (11) and the circuit board in water in the cleaning tank (3); Step 2: Turn on the paddle (5) to push the water in the water tank (1) to flow in a directional manner, and clean the two sides of the circuit board; Step 3: The clamping assembly (11) and the circuit board are separated from the cleaning tank (3), and are driven by the driving assembly (10) to perform a circular motion along the water tank (1), and the clamping piece (1101) and the circuit board are driven to rotate under the action of the flow of water, so that the residual liquid on the surface of the clamping piece (1101) is thrown outward; Step 4: Remove the dried circuit board from the clamping assembly (11).

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