Electronic device and method for manufacturing electronic device

Abstract

The invention relates to an electronic device and a method for manufacturing the electronic device. The electronic device includes a display panel including a first area and a second area adjacent to the first area; a protective layer overlapping the first area and disposed under the display panel; and an electronic module overlapping the second area and disposed below the display panel. A lower surface of the display panel includes a first lower surface overlapping the first region and a second lower surface overlapping the second region, and a contact angle between the first lower surface and water is smaller than a contact angle between the second lower surface and water.

Description

[0001] This application claims priority to and all benefits derived from Korean Patent Application No. 10-2024-0032550, filed on March 7, 2024, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0002] The present disclosure herein relates to an electronic device and a method for manufacturing the electronic device, and more particularly, to an electronic device having improved reliability and a method for manufacturing the electronic device. Background Art

[0003] Electronic devices including display devices, such as smart phones, digital cameras, laptop computers, car navigation units, and smart televisions, provide images to users through display screens.

[0004] A display device may include a display panel that provides image information and a protective layer for protecting the display panel from external influences. The protective layer protects the display panel from external influences by preventing deformation of the display panel caused by external impacts and effectively dissipating heat generated by the display panel. To impart various functions for protecting the display panel, the protective layer adopts a stacked structure of multiple functional layers. At the same time, research is also underway on electronic devices in which single-layer protective layers that integrate various functions for protecting the display panel are applied, and methods for manufacturing the electronic devices. Summary of the Invention

[0005] The present disclosure provides an electronic device having improved reliability and a method for manufacturing the electronic device.

[0006] An embodiment of the present invention provides an electronic device, comprising: a display panel including a first area and a second area adjacent to the first area; a protective layer overlapping the first area and disposed below the display panel; and an electronic module overlapping the second area and disposed below the display panel, wherein a lower surface of the display panel includes a first lower surface overlapping the first area and a second lower surface overlapping the second area, and a contact angle between the first lower surface and water is smaller than a contact angle between the second lower surface and water.

[0007] In an embodiment, the protective layer may include a curable resin, and a contact angle between the first lower surface and the curable resin in liquid form may be smaller than a contact angle between the second lower surface and the curable resin in liquid form.

[0008] In one embodiment, the protective layer may further include a heat dissipation material dispersed in the curable resin.

[0009] In one embodiment, the electronic device may further include a heat dissipation layer disposed below the protective layer.

[0010] In one embodiment, the protection layer may be directly disposed on the first lower surface.

[0011] In an embodiment, a hole may be defined in the protective layer, and the hole may overlap with the second region.

[0012] In one embodiment, the protective layer may extend away from the hole in a direction, and the protective layer may include: a first side surface defining the hole and having a first inclination angle relative to the lower surface of the display panel; and a second side surface having a second inclination angle relative to the lower surface of the display panel and opposite to the first side surface in the direction, and the first inclination angle is greater than the second inclination angle.

[0013] In one embodiment, the display panel may include: a first non-bending area, including a first area and a second area; a second non-bending area, facing the first non-bending area; and a bending area, defined between the first non-bending area and the second non-bending area and having a predetermined curvature radius.

[0014] In one embodiment, the electronic device may further include: a circuit board disposed to overlap the second non-bending region.

[0015] In one embodiment, the lower surface of the display panel may further include a third lower surface overlapping the bending area, and the contact angle between the first lower surface and water may be smaller than the contact angle between the third lower surface and water.

[0016] In one embodiment, the electronic device may further include a window disposed above the display panel.

[0017] In one embodiment, the lower surface of the display panel may be formed of polyimide.

[0018] In one embodiment, the protection layer may have a thickness of about 50 micrometers (μm) to about 300 μm.

[0019] In an embodiment of the present invention, an electronic device includes: a display panel, including a non-bending area and a bending area adjacent to the non-bending area and having a predetermined curvature radius; a circuit board, overlapping with the non-bending area and electrically connected to the display panel; and a protective layer, overlapping with the non-bending area and arranged under the display panel, wherein the lower surface of the display panel includes a first panel lower surface overlapping with the non-bending area and a second panel lower surface overlapping with the bending area, and the contact angle between the first panel lower surface and water is smaller than the contact angle between the second panel lower surface and water.

[0020] In an embodiment of the present invention, a method for manufacturing an electronic device includes: providing a display panel, the display panel including a first area and a second area adjacent to the first area, and the lower surface of the display panel including a first lower surface overlapping with the first area and a second lower surface overlapping with the second area; forming a preliminary protective layer by applying a resin composition onto the first lower surface; forming a protective layer by curing the preliminary protective layer; and arranging an electronic module to overlap with the second area, wherein the contact angle between the first lower surface and water is smaller than the contact angle between the second lower surface and water.

[0021] In one embodiment, in forming the preliminary protective layer, the coating of the resin composition may be performed by a screen printing process or a slit coating process.

[0022] In one embodiment, forming the preliminary protective layer may include: providing a mask on the second lower surface before coating of the resin composition; and providing plasma on the mask and the first lower surface.

[0023] In one embodiment, forming the preliminary protective layer may include providing plasma on the first lower surface and not providing plasma on the second lower surface before coating the resin composition.

[0024] In one embodiment, forming the preliminary protection layer may include performing a hydrophobic treatment on the second lower surface before coating the resin composition.

[0025] In one embodiment, performing the hydrophobic treatment on the second lower surface may be performed by a water-repellent coating process. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings are included to provide a further understanding of the present invention and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the present invention and together with the description serve to explain the principles of the present invention.

[0027] In the attached figure:

[0028] Figure 1 is a perspective view of an electronic device according to an embodiment of the present invention;

[0029] Figure 2 is an exploded perspective view of an electronic device according to an embodiment of the present invention;

[0030] Figure 3 is a cross-sectional view of a display panel according to an embodiment;

[0031] Figure 4A and Figure 4B is a cross-sectional view of a partial configuration of an electronic device according to an embodiment of the present invention;

[0032] Figure 5is a plan view of a display module according to an embodiment of the present invention;

[0033] Figure 6 is a rear view of a display module according to an embodiment of the present invention;

[0034] Figure 7A and Figure 7B are cross-sectional views of partial configurations of display modules according to embodiments of the present invention;

[0035] Figure 8A is a flowchart illustrating a method for manufacturing an electronic device according to an embodiment of the present invention;

[0036] Figure 8B is a flow chart illustrating some steps of a method for manufacturing an electronic device according to an embodiment of the present invention;

[0037] 9A to 9D are cross-sectional views illustrating some steps of a method for manufacturing an electronic device according to an embodiment of the present invention; and

[0038] Figure 10A and Figure 10B are cross-sectional views illustrating some steps of a method for manufacturing an electronic device according to other embodiments of the present invention. DETAILED DESCRIPTION

[0039] In this specification, it will be understood that when an element (or region, layer, part, etc.) is referred to as being "on," "connected to" or "coupled to" another element, it can be directly disposed / connected / coupled to the other element or intervening elements may be disposed therebetween.

[0040] In this specification, it will be understood that "directly disposed" means that there is no intervening layer, film, region, plate, etc. between one part of a layer, film, region, plate, etc. and another part thereof. For example, "directly disposed" may mean disposed between two layers or two members without using an additional member such as an adhesive member.

[0041] The same reference numerals or symbols always refer to the same elements. In addition, in the drawings, the thickness, ratio and size of the elements are exaggerated in order to effectively describe the technical content. The term "and / or" includes all combinations of one or more related listed elements.

[0042] Although the terms "first," "second," etc. may be used to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element, without departing from the scope of the present invention. Unless the context clearly indicates otherwise, the singular also includes the plural.

[0043] In addition, for the purpose of description, terms such as "below," "below," "above," and "upper" may be used to describe the relationship of one element to another element illustrated in the figures. It will be understood that these terms have relative concepts and are based on the orientation description depicted in the figures.

[0044] It will be understood that the terms “comprises” or “comprising” when used in this specification specify the presence of stated features, integers, steps, operations, elements, components or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components or combinations thereof.

[0045] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. In addition, terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and should not be interpreted in an idealized or overly formal sense unless expressly defined as such herein.

[0046] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0047] Figure 1 is a perspective view of an electronic device ED according to an embodiment of the present invention. Figure 2 is an exploded perspective view of an electronic device ED according to an embodiment of the present invention.

[0048] The electronic device ED according to the embodiment can be activated in response to an electrical signal. For example, the electronic device ED can be a mobile phone, a tablet computer, a car navigation system, a game console, or a wearable device, but the embodiment of the present invention is not limited thereto. Figure 1 , the electronic device ED is exemplarily illustrated as a mobile phone.

[0049] The electronic device ED may display an image IM through the active area AA-ED. The active area AA-ED may include a flat surface defined by the first direction DR1 and the second direction DR2. The active area AA-ED may further include a curved surface bent from at least one side of the flat surface defined by the first direction DR1 and the second direction DR2. Figure 1The electronic device ED according to the embodiment illustrated in FIG includes two curved surfaces bent from both sides of a flat surface defined by a first direction DR1 and a second direction DR2. However, the shape of the active area AA-ED is not limited thereto. For example, the active area AA-ED may include only a flat surface, or further include at least two curved surfaces, for example, four curved surfaces bent from four side surfaces.

[0050] At the same time, Figure 1 In the following drawings, first to third directions DR1 to DR3 are illustrated, and directions respectively indicated by the first to third directions DR1 , DR2 , and DR3 described herein may have relative concepts and thus may be changed to other directions.

[0051] In the present specification, the first direction DR1 and the second direction DR2 may be orthogonal to each other, and the third direction DR3 may be a normal direction of a plane defined by the first direction DR1 and the second direction DR2. Meanwhile, in the present specification, the term "on a plane" (i.e., in a plan view) may refer to a situation when viewed on the plane defined by the first direction DR1 and the second direction DR2, and the thickness direction may refer to the third direction DR3 as a normal direction of the plane defined by the first direction DR1 and the second direction DR2.

[0052] A sensing area SA-ED may be defined in the electronic device ED. Figure 1 The camera sensing area CSA-ED and the sensor sensing area SSA-ED are exemplarily illustrated, but the number of sensing areas SA-ED is not limited thereto. The sensing area SA-ED may be defined as a single area or as three or more areas. Furthermore, the sensing area SA-ED may be defined within the active area AA-ED to constitute a portion of the active area AA-ED.

[0053] The electronic module EM may overlap with the sensing area SA-ED. The electronic module EM may receive external input transmitted through the sensing area SA-ED or provide output through the sensing area SA-ED. For example, the camera module CAM may overlap with the camera sensing area CSA-ED, and the sensor module SM may overlap with the sensor sensing area SSA-ED.

[0054] The electronic device ED may include an active area AA-ED and a peripheral area NAA-ED adjacent to the active area AA-ED. The active area AA-ED may be a portion corresponding to the active area AA of the display panel DP described later, and the peripheral area NAA-ED may be a portion corresponding to the peripheral area NAA of the display panel DP.

[0055] The peripheral area NAA-ED, which is an area for blocking optical signals, may be provided outside the active area AA-ED and surround the active area AA-ED. In one embodiment, the peripheral area NAA-ED may be provided on a side surface of the electronic device ED instead of on the front surface. The peripheral area NAA-ED may be omitted according to embodiments.

[0056] The electronic device ED of the embodiment includes a window WM, an upper member UM, a display module DM, a housing HU, and an electronic module EM.

[0057] An electronic device ED according to an embodiment may include a window WM disposed on a display panel DP. The window WM provides an outer surface of the electronic device ED. The window WM may cover the front surface of the display panel DP and protect the display panel DP from external impacts and scratches. The window WM may be coupled to the upper member UM via an adhesive layer.

[0058] The window WM may include an optically transparent insulating material. For example, the window WM may include a glass film or a synthetic resin film as a base film. The window WM may have a single-layer or multi-layer structure. For example, the window WM may include multiple plastic films bonded together with an adhesive, or may include a glass film and a plastic film bonded together with an adhesive. The window WM may further include functional layers such as an anti-fingerprint layer, a phase control layer, and a hard coating layer disposed on the base film.

[0059] In an electronic device ED according to an embodiment, an upper member UM may be disposed below the window WM and above the display module DM. The upper member UM may include an anti-reflection layer and an input detection sensor. The anti-reflection layer reduces the reflectivity of external light. The input detection sensor detects external input from a user. The upper member UM may further include an adhesive layer that bonds the anti-reflection layer and the input detection sensor.

[0060] In the electronic device ED according to the embodiment, the display module DM may be disposed under the upper member UM. The display module DM may include a display panel DP and a protection layer PL disposed under the display panel DP.

[0061] The display panel DP may include an active area AA in which an image IM is displayed and a peripheral area NAA adjacent to the active area AA. That is, the front surface of the display panel DP may include the active area AA and the peripheral area NAA. The active area AA may be an area that is activated in response to an electrical signal and generates the image IM displayed in the active area AA-ED of the electronic device ED.

[0062] The peripheral area NAA may be adjacent to the active area AA. The peripheral area NAA may surround the active area AA. A driving circuit or driving line for driving the active area AA or various types of signal lines or pads for providing electrical signals to the active area AA may be provided in the peripheral area NAA.

[0063] The display panel DP may include a first non-bending area NBA1, a second non-bending area NBA2, and a bending area BA defined between the first non-bending area NBA1 and the second non-bending area NBA2. The bending area BA may be defined as a portion bent about a predetermined axis extending in the second direction DR2. In one embodiment, the bending area BA may have a predetermined radius of curvature. Because the display panel DP bends in the bending area BA, the second non-bending area NBA2 of the display panel DP may be disposed below the first non-bending area NBA1 of the display panel DP.

[0064] The first non-bending area NBA1 of the display panel DP may include an active area AA including pixels therein, and an area of ​​the first non-bending area NBA1 excluding the active area AA, the bending area BA, and the second non-bending area NBA2 may correspond to the peripheral area NAA.

[0065] A driving element DIC for driving the display panel DP may be mounted on the second non-bending area NBA2 of the display panel DP. A display pad (not shown) disposed adjacent to an end of the second non-bending area NBA2 may be included in the second non-bending area NBA2 of the display panel DP. A circuit board PCB may be disposed on an end portion of the second non-bending area NBA2 of the display panel DP. However, embodiments of the present invention are not limited thereto, and the driving element DIC may be mounted on the circuit board PCB.

[0066] The circuit board PCB can overlap with the second non-bending area NBA2. The circuit board PCB can be used to control the image IM (see Figure 1 ) signals or power signals are transmitted from a mainboard within the electronic device ED to the display panel DP. The circuit board PCB may be a flexible circuit board. The circuit board PCB may include circuit pads (not shown) disposed adjacent to its ends. The circuit pads (not shown) may be connected to display pads (not shown). Accordingly, the display panel DP and the circuit board PCB may be electrically connected to each other.

[0067] The display panel DP may include a first area NSA and a second area SA adjacent to the first area NSA. The second area SA may be an area overlapping with the electronic module EM, and the first area NSA may be an area surrounding at least a portion of the second area SA. Figure 2As shown in , the first area NSA may be an area surrounding the entire periphery of the second area SA. The second area SA may correspond to the sensing area SA-ED of the electronic device ED. The first area NSA may correspond to the entire area of ​​the first non-bending area NBA1 except the second area SA.

[0068] The second area SA may include a first signal transmission area CSA corresponding to the camera sensing area CSA-ED of the electronic device ED, and a second signal transmission area SSA corresponding to the sensor sensing area SSA-ED of the electronic device ED. Below the display panel DP, the camera module CAM may be positioned to overlap the first signal transmission area CSA, and the sensor module SM may be positioned to overlap the second signal transmission area SSA. Although not illustrated, a predetermined opening may be defined in a portion of the second area SA of the display panel DP. In other words, a portion of the display panel DP corresponding to a region of the second area SA may be penetrated.

[0069] Figure 2 The second area SA is exemplarily illustrated as including a first signal transmission area CSA and a second signal transmission area SSA, that is, two transmission areas. However, the number of the second area SA is not limited thereto. For example, the second area SA of the display panel DP may be defined as a single area or three or more areas. In addition, Figure 2 The second area SA is exemplarily illustrated as having a circular shape or a quadrangular shape, but the shape of the second area SA is not limited thereto and may be variously defined.

[0070] On a plane, the area of ​​the second area SA may be smaller than that of the first area NSA. The transmittance of the first area NSA may be different from that of the second area SA. The transmittance of the second area SA may be greater than that of the first area NSA.

[0071] At the same time, in the display panel DP according to the embodiment, a portion of the driving circuit or driving lines for driving the pixels arranged in the second area SA may be arranged in a portion of the first area NSA adjacent to the second area SA or in the peripheral area NAA. Accordingly, the wiring density in the second area SA may be less than the wiring density in the first area NSA. However, the embodiments of the present invention are not limited thereto, and the wiring density in the second area SA may be substantially the same as the wiring density in the first area NSA.

[0072] The display panel DP may include a light emitting element layer DP-ED including organic light emitting elements, quantum dot light emitting elements, micro LED light emitting elements, nano LED light emitting elements, etc. (see FIG. Figure 3 ). Light emitting element layer DP-ED (see Figure 3 ) can be configured to substantially generate an image.

[0073] The protective layer PL may be provided under the display panel DP. The protective layer PL may be a member that supports the display panel DP, absorbs impact applied to the display panel DP, and performs a heat dissipation function of dissipating heat generated in components (such as the electronic module EM) provided under the display panel DP. Figure 5 The details of the protective layer PL are described.

[0074] A hole HH may be defined in the protective layer PL. The hole HH may be defined in an area corresponding to the electronic module EM. The hole HH may be defined to overlap with the second area SA of the display panel DP. In one embodiment, the hole HH of the protective layer PL may be defined as a single hole or multiple holes. The hole HH may include a sensor hole HS and a camera hole HC.

[0075] Figure 2 In the example, only the hole HH is defined in the protective layer PL. However, embodiments of the present invention are not limited thereto, and a predetermined opening may be additionally defined in the display panel DP. The hole HH may overlap with the electronic module EM. At least a portion of the electronic module EM may be disposed so as to be inserted into the hole HH.

[0076] In an electronic device ED according to an embodiment, the electronic module EM may be an electronic component that outputs or receives optical signals. For example, the electronic module EM may include a camera module CAM and a sensor module SM. The camera module CAM may receive external light through a camera sensing area CSA-ED and capture an external image. Furthermore, the sensor module SM may be a sensor that outputs or receives external light through a sensor sensing area SSA-ED, such as a proximity sensor or an infrared light emitting sensor.

[0077] In addition to the electronic module EM described above, an electronic device ED according to an embodiment may further include a power module, a control module, a wireless communication module, an image input module, an audio input module, an audio output module, a memory, an external interface module, and the like. The electronic device ED may include a main circuit board, and the modules may be mounted on the main circuit board or electrically connected to the main circuit board via a flexible circuit board. The power module may supply the power required for the overall operation of the electronic device ED. For example, the power module may include a typical battery device.

[0078] Figure 3 is a cross-sectional view of a display panel according to an embodiment of the present invention.

[0079] refer to Figure 3 , the display panel DP according to the embodiment may include a base layer BL, a circuit layer DP-CL disposed on the base layer BL, a light emitting element layer DP-ED, and an encapsulation layer ENL.

[0080] The base layer BL may include a plastic substrate, a glass substrate, a metal substrate, an organic / inorganic composite material substrate, etc. For example, the base layer BL may include at least one polyimide layer. The protective layer PL may be disposed below the base layer BL.

[0081] The circuit layer DP-CL includes at least one insulating layer, a semiconductor pattern, and a conductive pattern. The insulating layer includes at least one inorganic layer and at least one organic layer. The semiconductor pattern and the conductive pattern can form signal lines, pixel drive circuits, and scan drive circuits. Furthermore, the circuit layer DP-CL may include a rear surface metal layer.

[0082] The light-emitting element layer DP-ED includes a display element, such as a light-emitting element. For example, the light-emitting element can be an organic light-emitting element, a quantum dot light-emitting element, a micro-LED light-emitting element, or a nano-LED light-emitting element. The light-emitting element layer DP-ED can further include an organic layer, such as a pixel defining film.

[0083] The light emitting element layer DP-ED may be provided in the active area AA. The peripheral area NAA is provided at the periphery of the active area AA and surrounds the active area AA. The light emitting element may not be provided in the peripheral area NAA.

[0084] The encapsulation layer ENL may be disposed on and cover the light-emitting element layer DP-ED. The encapsulation layer ENL may be disposed on the circuit layer DP-CL to seal the light-emitting element layer DP-ED. The encapsulation layer ENL may be a thin-film encapsulation layer comprising a plurality of organic and inorganic thin films. The encapsulation layer ENL may include a thin-film encapsulation layer having a stacked structure of inorganic layer / organic layer / inorganic layer. The stacked structure of the encapsulation layer ENL is not particularly limited.

[0085] Figure 4A and Figure 4B Each of them is a cross-sectional view showing a partial configuration of an electronic device according to an embodiment of the present invention. Figure 4A The display panel DP is not bent, and Figure 4B The bending area BA of the display panel DP is bent in the electronic device ED according to the embodiment of the present invention. Figures 1 to 3 The same / similar parts as those described in and their repeated description will be omitted.

[0086] refer to Figure 4A and Figure 4B , the electronic device ED according to an embodiment of the present invention may include a window WM, an upper member UM, and a display module DM.

[0087] In an embodiment, the electronic device ED may include a front surface and a rear surface. The front surface of the electronic device ED may be defined by the window WM, and the rear surface of the electronic device ED may be defined by the protective layer PL.

[0088] The window WM may cover the front surface of the display panel DP. The window WM may include a base substrate (not shown) and a frame pattern (not shown). The base substrate (not shown) may include a transparent base layer such as a glass substrate or a transparent film. The frame pattern may have a multilayer structure. The multilayer structure may include a colored layer and a black light-shielding layer.

[0089] The upper member UM includes an anti-reflection layer UM-1 and an input sensor UM-2. The window WM and the anti-reflection layer UM-1 may be bonded together via a first adhesive layer AL1, and the anti-reflection layer UM-1 and the input sensor UM-2 may be bonded together via a second adhesive layer AL2. However, at least one of the first adhesive layer AL1 and the second adhesive layer AL2 may be omitted. For example, the second adhesive layer AL2 may be omitted, and the anti-reflection layer UM-1 may be directly disposed on the input sensor UM-2.

[0090] The anti-reflection layer UM-1 can reduce external light reflectivity. The anti-reflection layer UM-1 can include a retarder and / or a polarizer. The anti-reflection layer UM-1 can include a polarizing film or a color filter. The color filter can have a predetermined arrangement. The arrangement of the color filter can be determined based on the color of light emitted from the pixels included in the display panel DP. The anti-reflection layer UM-1 can include a spacer layer adjacent to the color filter.

[0091] The input sensor UM-2 may include a plurality of sensing electrodes (not shown) for detecting external input, traces (not shown) connected to the plurality of sensing electrodes, and an inorganic layer and / or an organic layer for insulating / protecting the plurality of sensing electrodes or traces. The input sensor UM-2 may be a capacitive sensor, but is not particularly limited thereto.

[0092] The input sensor UM-2 may be formed directly on the thin film encapsulation layer through a continuous process during the manufacture of the display panel DP. However, embodiments of the present invention are not limited thereto. The input sensor UM-2 may be manufactured as a panel separate from the display panel DP and then attached to the display panel DP via an adhesive layer.

[0093] The display module DM may include a display panel DP and a protection layer PL disposed under the display panel DP.

[0094] The protective layer PL may be disposed directly below the display panel DP. The protective layer PL may contact the lower surface of the display panel DP. No additional adhesive member may be disposed between the protective layer PL and the display panel DP. The protective layer PL may have a thickness of approximately 50 μm to approximately 300 μm. For example, the protective layer PL may have a thickness of approximately 100 μm to approximately 200 μm.

[0095] In the display module DM of the embodiment, a single-layer protective layer PL may be provided on the lower surface of the display panel DP. The protective layer PL may be a component that supports the display panel DP, absorbs impact applied to the display panel DP, and performs a heat dissipation function to dissipate heat generated in components (such as the electronic module EM) provided below the display panel DP. Since in the electronic device ED according to the embodiment, the single-layer protective layer PL performs not only an impact absorption function but also a heat dissipation function, etc., the thickness of the electronic device ED can be reduced, and the components can be simplified, thereby making it possible to improve process efficiency during the manufacture of the electronic device ED according to the embodiment. However, the embodiments of the present invention are not limited thereto. Although not illustrated, the electronic device ED of the embodiment may further include at least one of an impact absorption layer, a heat dissipation layer, a shielding layer, and a support layer provided below the protective layer PL.

[0096] The protective layer PL may include a base resin. The protective layer PL may include a curable base resin. For example, the protective layer PL may include a thermosetting resin or a photocurable resin. The protective layer PL may include at least one of curable acrylic resins, urethane resins, fluorine resins, epoxy resins, polyester resins, polyamide resins, and silicone resins. The protective layer PL may further include a plurality of fillers dispersed in the base resin. These fillers may perform shielding, heat dissipation, or impact absorption functions. In one embodiment, the protective layer PL may further include a heat dissipation material dispersed in the curable resin.

[0097] The protective layer PL may include a first protective layer PL1 overlapping the first non-bending area NBA1 and a second protective layer PL2 overlapping the second non-bending area NBA2. On a plane defined by the first direction DR1 and the second direction DR2, the first protective layer PL1 and the second protective layer PL2 may not overlap with the bending area BA therebetween. Figure 5 Details of the first protective layer PL1 and the second protective layer PL2 are described.

[0098] Figure 5 is a plan view of a display module according to an embodiment of the present invention. Figure 6 is a rear view of a display module according to an embodiment of the present invention. Figure 7A and Figure 7Bare cross-sectional views of partial configurations of display modules according to embodiments of the present invention. Figure 7A Examples along Figure 6 The cross section is taken along the line II' shown in FIG. Figure 7B Examples along Figure 6 A cross section taken along line II-II' shown in FIG.

[0099] refer to Figure 5 and Figure 6 The display module DM may include a display panel DP and a protective layer PL disposed under the display panel DP. The display module DM may be composed of the display panel DP and the protective layer PL.

[0100] The protective layer PL may be disposed directly below the display panel DP. The area of ​​the lower surface of the display panel DP where the protective layer PL is disposed may have lower hydrophobicity than areas of the lower surface of the display panel DP where the protective layer PL is not disposed. In other words, the portion of the display panel DP in the second area SA and the bending area BA where the protective layer PL is not disposed may have relatively higher hydrophobicity than other areas.

[0101] The protective layer PL may include a first protective layer PL1 overlapping the first non-bending area NBA1 and a second protective layer PL2 overlapping the second non-bending area NBA2. Aside from the differences in their overlapping areas, the first and second protective layers PL1 and PL2 may be components formed from substantially the same material. For example, the first and second protective layers PL1 and PL2 may be formed simultaneously from the same material and using the same process. The thickness of the first protective layer PL1 may be substantially the same as the thickness of the second protective layer PL2. In this specification, the term "substantially the same" encompasses not only situations where components have physically identical thicknesses, but also situations where components, despite being identically designed, may have differences in thickness due to tolerances that occur during processing.

[0102] refer to Figure 5 、 Figure 6 and Figure 7A , the first non-bending area NBA1 may be divided into a first area NSA and a second area SA, and the first protective layer PL1 overlaps the first area NSA. The lower surface of the display panel DP may include a first lower surface LF1 overlapping the first area NSA, and the first protective layer PL1 may be in contact with the first lower surface LF1. The first protective layer PL1 may not overlap with the second area SA. The lower surface of the display panel DP may include a second lower surface LF2 overlapping the second area SA, and the first protective layer PL1 may not be in contact with the second lower surface LF2. The display panel DP may include a base layer BL (see Figure 3), and the first lower surface LF1 and the second lower surface LF2 of the display panel DP may be formed by a substrate layer BL (see Figure 3 ) is formed by polyimide (PI) in.

[0103] In the display panel DP, the hydrophobicity of the first lower surface LF1 is lower than the hydrophobicity of the second lower surface LF2. The contact angle between the first lower surface LF1 and water is smaller than the contact angle between the second lower surface LF2 and water. As used herein, the contact angle represents the angle between the surface of a solid object (e.g., water, a resin in liquid form) and the surface tangent to the liquid at their intersection when a liquid (e.g., water, a resin in liquid form) is provided on the surface of the solid object. In one embodiment, the first protective layer PL1 may include the above-mentioned curable resin, and the contact angle between the first lower surface LF1 and the curable resin in liquid form included in the first protective layer PL1 may be smaller than the contact angle between the second lower surface LF2 and the curable resin in liquid form. When manufacturing an electronic device ED according to an embodiment of the present invention (see Figure 1 ), a step of performing a hydrophilic treatment on the first lower surface LF1 is performed, or a step of performing a hydrophobic treatment on the second lower surface LF2 is performed, and thus the first lower surface LF1 can be different in characteristics from the second lower surface LF2.

[0104] A hole HH may be defined in the first protective layer PL1 so as to overlap the second area SA. The first protective layer PL1 may be disposed so as to surround the hole HH. The hole HH may be defined in the area corresponding to the electronic module EM. The hole HH may be defined so as to overlap the second area SA of the display panel DP. In one embodiment, the hole HH of the first protective layer PL1 may be defined as a single hole or multiple holes. The first protective layer PL1 may include a sensor hole HS and a camera hole HC.

[0105] The first protective layer PL1 may include a first side surface SS1 and a second side surface SS2. Among the side surfaces of the first protective layer PL1, the first side surface SS1 may define a hole HH. On a plane defined by the first direction DR1 and the second direction DR2, the first protective layer PL1 may extend away from the hole HH in one direction, and the second side surface SS2 may be defined as a surface opposite to the first side surface SS1 with respect to the one direction. Figure 7A The illustrated first protection layer PL1 extends away from the hole HH in the first direction DR1 , and the first and second side surfaces SS1 and SS2 are opposite to each other with respect to the first direction DR1 .

[0106] The first side surface SS1 may have a first inclination angle θ1 relative to the first lower surface LF1 of the display panel DP, and the second side surface SS2 may have a second inclination angle θ2 relative to the first lower surface LF1 of the display panel DP. The first inclination angle θ1 may have a value greater than that of the second inclination angle θ2. For example, the first inclination angle θ1 may be about 90 degrees, and the second inclination angle θ2 may have a value of about 80 degrees or more and less than 90 degrees, but the embodiment of the present invention is not limited thereto. In addition, for the convenience of description, Figure 7A The first side surface SS1 and the second side surface SS2 opposite to the first side surface SS1 are exemplified, but the first side surface SS1 defining the hole HH has a relatively larger inclination angle relative to the lower surface of the display panel DP than the other side surfaces of the protective layer PL not adjacent to the hole HH. For example, the first side surface SS1 may be closer relative to the lower surface of the display panel DP than the side surfaces of the protective layer PL adjacent to the electronic device ED (see FIG. Figure 1 ) of the four side surfaces adjacent to each other have relatively large inclination angles. When manufacturing the electronic device ED according to the embodiment of the present invention (see Figure 1 ), a step of performing a hydrophilic treatment on the first lower surface LF1 or a step of performing a hydrophobic treatment on the second lower surface LF2 is performed, and thus the first side surface SS1 defining the hole HH may be orthogonal to the lower surface of the display panel DP. Therefore, the planarity of the first protective layer PL1 adjacent to the hole HH is improved, thereby improving the electronic device ED (see FIG. Figure 1 ) reliability is possible.

[0107] refer to Figure 5 、 Figure 6 and Figure 7B , the second protective layer PL2 may overlap with the second non-bending area NBA2. The first protective layer PL1 and the second protective layer PL2 may not overlap with the bending area BA. The lower surface of the display panel DP may include a third lower surface LF3 overlapping with the bending area BA and a fourth lower surface LF4 overlapping with the second non-bending area NBA2. The second protective layer PL2 may be in contact with the fourth lower surface LF4 and may not be in contact with the third lower surface LF3. Meanwhile, in this specification, the second non-bending area NBA2 may be referred to as a "non-bending area", the third lower surface LF3 may be referred to as a "second panel lower surface", and the fourth lower surface LF4 may be referred to as a "first panel lower surface".

[0108] In the display panel DP, the hydrophobicity of the first lower surface LF1 may be lower than the hydrophobicity of the third lower surface LF3. The contact angle between the first lower surface LF1 and water may be smaller than the contact angle between the third lower surface LF3 and water. In addition, the hydrophobicity of the fourth lower surface LF4 may be lower than the hydrophobicity of the third lower surface LF3, and the contact angle between the fourth lower surface LF4 and water may be smaller than the contact angle between the third lower surface LF3 and water. When manufacturing an electronic device ED according to an embodiment of the present invention (see Figure 1 ), a step of performing hydrophilic treatment on the fourth lower surface LF4 is performed, or a step of performing hydrophobic treatment on the third lower surface LF3 is performed, and thus the third lower surface LF3 can be different in characteristics from the fourth lower surface LF4.

[0109] The second protective layer PL2 may include a third side surface SS3 and a fourth side surface SS4. The third side surface SS3 may be defined as a surface adjacent to the bending area BA among the side surfaces of the second protective layer PL2. On a plane defined by the first direction DR1 and the second direction DR2, the second protective layer PL2 may extend in one direction away from the bending area BA, and the fourth side surface SS4 may be defined as a surface opposite to the third side surface SS3 with respect to the one direction. Figure 7B The illustrated second protection layer PL2 extends away from the bending area BA in a direction opposite to the first direction DR1 , and the third and fourth side surfaces SS3 and SS4 are opposite to each other with respect to the first direction DR1 .

[0110] The third side surface SS3 may have a third inclination angle θ3 relative to the third lower surface LF3 of the display panel DP, and the fourth side surface SS4 may have a fourth inclination angle θ4 relative to the fourth lower surface LF4 of the display panel DP. The third inclination angle θ3 may have a value greater than that of the fourth inclination angle θ4. When manufacturing an electronic device ED according to an embodiment of the present invention (see Figure 1 ), a step of performing hydrophobic treatment on the third lower surface LF3 is performed, or a step of performing hydrophilic treatment on the fourth lower surface LF4 is performed, and therefore the third side surface SS3 adjacent to the bending area BA can be orthogonal to the lower surface of the display panel DP.

[0111] Figure 8A is a flowchart illustrating a method for manufacturing an electronic device according to an embodiment. Figure 8B is a flowchart illustrating some steps of a method for manufacturing an electronic device according to an embodiment. 9A to 9D are cross-sectional views illustrating some steps of a method for manufacturing an electronic device according to an embodiment of the present invention. Figure 10A and Figure 10BThe method for manufacturing an electronic device of the embodiment can be exemplified as follows: Figures 1 to 7B In one embodiment, a method for manufacturing an electronic device ED including a first protective layer PL1 disposed under a display panel DP is provided. Figure 8A 、 Figure 8B 、 9A to 9D 、 Figure 10A and Figure 10B , in the description of the method for manufacturing the electronic device of the embodiment, the same reference numerals or symbols are used for components that are repeated with the above-mentioned components, and their detailed description will be omitted.

[0112] refer to Figure 8A , the method for manufacturing an electronic device according to an embodiment includes the following steps: providing a display panel (S100); forming a preliminary protective layer (S200); forming a first protective layer (S300); and arranging an electronic module (S400). Figure 8B , in the method for manufacturing an electronic device according to an embodiment, the step of forming a preliminary protective layer (S200) may include the following steps: providing a mask on the second lower surface (S210); providing plasma on the mask and the first lower surface (S220); and coating a resin composition (S230).

[0113] at the same time, 9A to 9D is a cross-sectional view schematically illustrating a step of forming a protective layer in a method for manufacturing an electronic device according to an embodiment of the present invention. Figures 9A to 9C The third direction DR3 is based on the above Figure 7A The manufacturing steps are schematically illustrated on a cross section in the reverse direction of Figure 9D In the above Figure 7A The production steps are schematically illustrated in corresponding cross sections.

[0114] Figure 9A and Figure 9B Schematically illustrating a step (S200) of forming a preliminary protective layer by coating a resin composition on the first lower surface, Figure 9C The step (S300) of forming the first protective layer by curing the preliminary protective layer is schematically illustrated, and Figure 9D The step (S400) of arranging the electronic module to overlap the second region is schematically illustrated. Meanwhile, the step (S200) of forming the preliminary protective layer may include the following steps: providing a mask on the second lower surface (S210); providing plasma on the mask and the first lower surface (S220); and applying a resin composition (S230). Figure 9AThe steps of providing a mask on the second lower surface (S210) and providing plasma on the mask and the first lower surface (S220) are schematically illustrated, and Figure 9B The step of applying the resin composition ( S230 ) is schematically illustrated.

[0115] refer to Figure 8B and Figure 9A , a mask MK may be provided on the second lower surface LF2 of the display panel DP, and after providing the mask MK, a plasma PZ may be provided on the lower surface of the display panel DP. Accordingly, the plasma PZ may be provided on the first lower surface LF1 and may not be provided on the second lower surface LF2. The plasma PZ may be oxygen (O2) plasma, nitrogen (N2) plasma or argon (Ar) plasma, but the embodiments of the present invention are not limited thereto. The step of providing the plasma PZ on the mask MK may include a process of irradiating the first lower surface LF1 with oxygen (O2) plasma, nitrogen (N2) plasma or argon (Ar) plasma. The step of providing the plasma PZ on the mask MK may be basically a step of performing a hydrophilic treatment on the first lower surface LF1. Accordingly, the contact angle between the first lower surface LF1 and water may be smaller than the contact angle between the second lower surface LF2 and water.

[0116] refer to Figure 8B and Figure 9B The resin composition RS may include a curable resin. The resin composition RS may include at least one of a curable acrylic resin, a urethane resin, a fluorine resin, an epoxy resin, a polyester resin, a polyamide resin, and a silicone resin. Figure 9C ) may be in liquid form before being cured.

[0117] The resin composition RS may be applied to the lower surface of the display panel DP. The resin composition RS may be applied by any one of spin coating, slit coating, jet printing, metal mask printing, and screen printing. For example, the resin composition RS may be applied by a screen printing process or a slit coating process.

[0118] The resin composition RS can be applied to the first lower surface LF1. Figure 9A) is emitted to the first lower surface LF1, so with respect to the curable resin included in the resin composition RS, the contact angle between the first lower surface LF1 and the curable resin included in the resin composition RS can be smaller than the contact angle between the second lower surface LF2 and the curable resin. Accordingly, the resin composition RS can be applied to the first lower surface LF1 so as to overlap with the first area NSA, and may not be applied to the second lower surface LF2 so as not to overlap with the second area SA. In the method for manufacturing an electronic device according to an embodiment of the present invention, the resin composition RS can be uniformly applied to correspond to the first area NSA, thereby resulting in an improvement in the reliability of the electronic device manufactured thereby. However, embodiments of the present invention are not limited thereto, and even if the resin composition RS is applied to at least a portion of the second lower surface LF2, the method for manufacturing an electronic device according to an embodiment of the present invention may also include a process for removing the resin composition RS applied to the second lower surface LF2.

[0119] The resin composition RS may be directly coated onto the first lower surface LF1. Accordingly, the display panel DP and the first protective layer PL1 (see FIG. 1 ) formed thereafter are Figure 9D ) is unnecessary, and thus the reliability of the manufactured electronic device can be improved.

[0120] refer to Figure 8A and Figure 9C The method for manufacturing an electronic device according to an embodiment includes a step of forming a first protective layer by curing the preliminary protective layer (S300). The preliminary protective layer PPR may be formed of a coated resin composition RS (see Figure 9B ) is formed, and the first protective layer can be formed by curing the preliminary protective layer PPR. The step of curing the preliminary protective layer PPR can be to form the first protective layer PL1 by providing light UV to the preliminary protective layer PPR (see Figure 9D ). For example, the light UV may be ultraviolet light having a central wavelength within a wavelength range of about 100 nm to about 400 nm. The preliminary protective layer PPR may include a curable resin and be light-cured when receiving the light UV. However, the embodiment of the present invention is not limited thereto, and the step of curing the preliminary protective layer PPR may also be a step of forming the first protective layer PL1 by providing heat on the preliminary protective layer PPR (see Figure 9D The preliminary protective layer PPR may be thermally cured when receiving heat.

[0121] at the same time, Figure 8A 、 Figure 8B and Figures 9A to 9C The formation of the first protective layer PL1 is illustrated in detail (see Figure 9D ) step, and the above-mentioned first protective layer PL1 is formed (see Figure 9D) can also be similarly applied to forming the second protective layer PL2 (see Figure 7B For example, a second protective layer PL2 is formed (see Figure 7B ) may include the following steps: on the third lower surface LF3 (see Figure 7B ) provides a mask MK; provides plasma PZ on the mask MK and the fourth lower surface LF4; on the fourth lower surface LF4 (see Figure 7B ) and curing the coated preliminary protective layer PPR. In addition, although not illustrated, the first protective layer PL1 and the second protective layer PL2 may be formed simultaneously from the same material and by the same process. For example, the first protective layer PL1 and the second protective layer PL2 are formed (see Figure 7B ) may include the following steps: on the second lower surface LF2 and the third lower surface LF3 (see Figure 7B ) provides a mask MK; provides plasma PZ on the mask MK and the first lower surface LF1 and the fourth lower surface LF4; the first lower surface LF1 and the fourth lower surface LF4 (see Figure 7B ) coating a preliminary protective layer PPR on; and curing the coated preliminary protective layer PPR.

[0122] refer to Figure 8A and Figure 9D The method for manufacturing an electronic device according to an embodiment includes a step of arranging an electronic module EM (S400). The electronic module EM may be arranged to overlap with the second area SA of the display panel DP. The hole HH of the first protective layer PL1 overlaps with the second area SA, and therefore, even if the electronic module EM is arranged to overlap with the second area SA, the electronic module EM can operate without deteriorating optical characteristics.

[0123] In the case of an electronic device according to an embodiment of the present invention, in the lower surface of the display panel DP, the characteristics of the area where the protective layer PL is set are different from the characteristics of the area where the protective layer PL is not set, and thus the reliability of the electronic device and the manufacturing process of the electronic device can be improved. The first lower surface LF1 of the display panel DP according to the embodiment of the present invention is defined in the first area NSA where the protective layer PL is set, and the second lower surface LF2 of the display panel DP is defined in the second area SA where the protective layer PL is not set and the electronic module EM is arranged. In the electronic device according to the embodiment of the present invention, the first lower surface LF1 has a contact angle with respect to water that is smaller than the contact angle of the second lower surface LF2 with respect to water, and thus it is possible to improve the thickness uniformity and forming reliability of the protective layer PL. In the method for manufacturing an electronic device according to an embodiment of the present invention, the protective layer PL can be formed by slit coating (which is direct coating) or screen printing, and thus the manufacturing efficiency of the electronic device can be improved.

[0124] Meanwhile, in another embodiment of the method for manufacturing an electronic device, the step of forming the preliminary protection layer ( S200 ) may not include the steps of: providing a mask on the second lower surface ( S210 ); and providing plasma on the mask and the first lower surface ( S220 ).

[0125] Figure 10A and Figure 10B 2 is a cross-sectional view schematically illustrating some steps of forming a preliminary protective layer in a method for manufacturing an electronic device according to another embodiment of the present invention. In another embodiment, the step of forming the preliminary protective layer (S200) may include the following steps: providing plasma on the first lower surface; and applying a resin composition. In yet another embodiment, the step of forming the preliminary protective layer (S200) may include the following steps: performing a hydrophobic treatment on the second lower surface; and applying a resin composition. Figure 10A is a view schematically illustrating a step of providing plasma on the first lower surface, and Figure 10B is a view schematically illustrating a step of performing a hydrophobic treatment on the second lower surface.

[0126] refer to Figure 10A , a plasma PZ may be provided on the first lower surface LF1. The plasma PZ may be provided on the first lower surface LF1 by a device ME that emits the plasma PZ. The device ME that emits the plasma PZ may emit the plasma PZ onto the first lower surface LF1 that overlaps with the first area NSA, and may not emit the plasma PZ onto the second lower surface LF2 that overlaps with the second area SA. Specifically, the device ME that emits the plasma PZ moves in one direction, and while moving, the device ME that emits the plasma PZ may emit the plasma PZ when overlapping with the first area NSA, and may not emit the plasma PZ when overlapping with the second area SA. The step of providing the plasma PZ on the first lower surface LF1 may basically be a step of performing a hydrophilic treatment on the first lower surface LF1. Accordingly, the contact angle between the first lower surface LF1 and water may be smaller than the contact angle between the second lower surface LF2 and water.

[0127] refer to Figure 10B, a hydrophobic treatment may be performed on the second lower surface LF2. The step of performing a hydrophobic treatment on the second lower surface LF2 may be performed by a water-repellent coating process. When the second lower surface LF2 is subjected to a hydrophobic treatment by a water-repellent coating process, a water-repellent coating AC may be provided on the second lower surface LF2. The water-repellent coating AC may be provided on the second lower surface LF2 overlapping with the second area SA, and may not be provided on the first lower surface LF1 overlapping with the first area NSA. The water-repellent coating AC may be directly provided on the second lower surface LF2, and may not be in contact with the first lower surface LF1. The water-repellent coating AC may include a fluorine-based resin. For example, the water-repellent coating AC may include polytetrafluoroethylene (PTFE), perfluoroalkoxyalkane (PFA), or fluorinated ethylene propylene (FEP). Alternatively, the water-repellent coating AC may include a self-assembled monolayer (SAMs). However, the material of the water-repellent coating AC is not limited thereto, and any material may be used without restriction, as long as it can perform the function of having a contact angle between the second lower surface LF2 and water that is relatively greater than the contact angle between the first lower surface LF1 and water.

[0128] According to an embodiment of the present invention, in an electronic device, the lower surface of the display panel overlapping the transmissive region is formed to have characteristics different from those of the lower surface of the display panel overlapping other regions. Accordingly, when a protective layer is provided under the display panel, the protective layer can be easily formed into a certain shape, thereby improving the reliability of the electronic device.

[0129] In addition, according to an embodiment of the present invention, since the lower surface of the display panel overlapping with the transmissive area is made to be different in characteristics from the lower surface of the display panel overlapping with other areas when manufacturing the electronic device, the manufacturing efficiency is improved during the formation of the protective layer set under the display panel, thereby improving the reliability of the electronic device manufactured thereby.

[0130] Although the embodiments of the present invention have been described, it is understood that the present invention should not be limited to these embodiments, but that a person skilled in the art can make various changes and modifications within the spirit and scope of the present invention as required. Therefore, the technical scope of the present invention is not limited to the content described in the detailed description of the specification, but should be determined by the claims.

Claims

1. An electronic device comprising: The display panel includes a first area and a second area adjacent to the first area; a protective layer, overlapping the first area and disposed below the display panel; as well as an electronic module, overlapping with the second area and disposed below the display panel, wherein the lower surface of the display panel includes a first lower surface overlapping the first area and a second lower surface overlapping the second area, and The contact angle between the first lower surface and water is smaller than the contact angle between the second lower surface and water.

2. The electronic device according to claim 1, wherein the protective layer comprises a curable resin, and A contact angle between the first lower surface and the curable resin in liquid form is smaller than a contact angle between the second lower surface and the curable resin in liquid form. 3 . The electronic device according to claim 2 , wherein the protective layer further comprises a heat dissipation material dispersed in the curable resin. The electronic device according to claim 1 , further comprising a heat dissipation layer disposed below the protective layer. The electronic device according to claim 1 , wherein the protection layer is directly disposed on the first lower surface. The electronic device according to claim 1 , wherein a hole is defined in the protective layer, and the hole overlaps with the second region.

7. The electronic device according to claim 6, wherein the protective layer extends in a direction away from the hole, The protective layer comprises: a first side surface defining the hole and having a first inclination angle relative to the lower surface of the display panel; as well as a second side surface having a second inclination angle relative to the lower surface of the display panel and being opposite to the first side surface in the direction, and The first inclination angle is greater than the second inclination angle.

8. The electronic device according to claim 1, wherein the display panel comprises: A first non-bending region, comprising the first region and the second region; a second non-bending area facing the first non-bending area; as well as A bending area is defined between the first non-bending area and the second non-bending area and has a predetermined curvature radius.

9. The electronic device according to claim 8, further comprising: The circuit board is configured to overlap with the second non-bending area.

10. The electronic device according to claim 8, wherein the lower surface of the display panel further comprises a third lower surface overlapping the bending area, and The contact angle between the first lower surface and water is smaller than the contact angle between the third lower surface and water. The electronic device according to claim 1 , further comprising a window disposed above the display panel. 12 . The electronic device according to claim 1 , wherein the lower surface of the display panel is formed of polyimide. 13 . The electronic device according to claim 1 , wherein the protective layer has a thickness of 50 μm to 300 μm.

14. An electronic device comprising: The display panel includes a non-bending area and a bending area adjacent to the non-bending area and having a predetermined curvature radius; a circuit board, overlapping the non-bending area and electrically connected to the display panel; as well as a protective layer, overlapping the non-bending area and disposed below the display panel, The lower surface of the display panel includes a first panel lower surface overlapping the non-bending area and a second panel lower surface overlapping the bending area, and The contact angle between the lower surface of the first panel and water is smaller than the contact angle between the lower surface of the second panel and water.

15. A method for manufacturing an electronic device, the method comprising: Providing a display panel, the display panel including a first area and a second area adjacent to the first area, wherein a lower surface of the display panel includes a first lower surface overlapping the first area and a second lower surface overlapping the second area; forming a preliminary protective layer by applying a resin composition to the first lower surface; forming a protective layer by curing the preliminary protective layer; as well as arranging the electronic module to overlap with the second area, The contact angle between the first lower surface and water is smaller than the contact angle between the second lower surface and water. 16 . The method according to claim 15 , wherein in the forming of the preliminary protective layer, the coating of the resin composition is performed by a screen printing process or a slit coating process.

17. The method according to claim 15, wherein forming the preliminary protection layer comprises: Prior to said coating of said resin composition, providing a mask on the second lower surface; as well as Plasma is provided on the mask and the first lower surface.

18. The method according to claim 15, wherein forming the preliminary protection layer comprises: Prior to the coating of the resin composition, plasma is provided on the first lower surface, and the plasma is not provided on the second lower surface.

19. The method according to claim 15, wherein forming the preliminary protection layer comprises: Prior to the coating of the resin composition, a hydrophobic treatment is performed on the second lower surface. 20 . The method according to claim 19 , wherein the performing the hydrophobic treatment on the second lower surface is performed by a water-repellent coating process.

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