Semiconductor cantilever needle, cantilever needle processing device and cantilever needle processing method

Abstract

The invention discloses a semiconductor cantilever needle, a cantilever needle processing device and a cantilever needle processing method, relates to the field of cantilever needles, and provides the following scheme aiming at the problem that the electrical property of the cantilever needle in the current market is influenced in the use process: the semiconductor cantilever needle comprises a metal raw material and a fusion agent, the metal raw materials comprise, by weight, 90% of tungsten, 3.2% of rhenium, 0.01% of potassium, 0.002% of iron, 0.0015% of aluminum, 0.003% of molybdenum, 0.0005% of arsenic / calcium / chromium / magnesium / manganese, 0.0005% of sodium / nickel / titanium / silicon / cobalt, 0.0002% of bismuth / cadmium / tin / copper / lead, 0.0005% of antimony, 0.0005% of rhodium, 0.0004% of ruthenium and 0.0005% of palladium. According to the semiconductor cantilever needle and the manufacturing method thereof, after metal elements such as rhodium, ruthenium and palladium are added into the material, the surface stress of the material is reduced, and the formation of an oxidation film is inhibited.

Description

Technical Field

[0001] The present invention relates to the field of cantilever needles, and in particular to a semiconductor cantilever needle, a cantilever needle processing device and a cantilever needle processing method. Background Art

[0002] A common drawback of the rhenium tungsten material currently used on the market is that it cannot be soldered. If soldering is required, it must be electroplated with other metals such as nickel and gold to increase the solderability. However, the rhenium tungsten material itself is easily oxidized in the air, forming a dense oxide film. This oxide film is difficult to remove during electroplating, or it reacts quickly to form a new oxide film within a short period of time after removal, resulting in poor bonding with electroplated nickel, gold and other metals. In addition, the nickel plating makes the product magnetic, and the electrical performance of the cantilever needle will be affected during use. This is a difficult problem in the industry.

[0003] In response to the cantilever needles currently used on the market, since they are made of rhenium tungsten material, the rhenium tungsten material is easily oxidized in the air to form a dense oxide film, resulting in poor bonding with electroplated metals such as nickel and gold. The nickel plating also makes the product magnetic, and the electrical performance of the cantilever needle will be affected during use. In this paper, we propose a semiconductor cantilever needle, a cantilever needle processing device and a cantilever needle processing method. Summary of the Invention

[0004] The semiconductor cantilever needle, cantilever needle processing device and cantilever needle processing method proposed in the present invention solve the problem that the cantilever needles currently used on the market are made of rhenium tungsten material, which is easily oxidized in the air to form a dense oxide film, resulting in poor bonding strength with electroplated nickel, gold and other metals, and the nickel plating makes the product magnetic, which affects the electrical performance of the cantilever needle during use.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A semiconductor cantilever needle includes a metal raw material and a fusion agent. The metal raw materials include the following weights: 90% tungsten, 3.2% rhenium, 0.01% potassium, 0.002% iron, 0.0015% aluminum, 0.003% molybdenum, 0.0005% arsenic / calcium / chromium / magnesium / manganese, 0.0005% sodium / nickel / titanium / silicon / cobalt, 0.0002% bismuth / cadmium / tin / copper / lead, 0.0005% antimony, 0.0005% rhodium, 0.0004% ruthenium, and 0.0005% palladium. The fusion agent is a metal fusion agent, and the ratio of the metal raw material to the fusion agent in the fusion agent is 90:6.6681.

[0007] A semiconductor cantilever needle processing device includes a fixed base, a mixing barrel for mixing metal raw materials is provided on one side of the top of the fixed base, a forming mechanism is provided on the other side of the top of the fixed base, and the forming mechanism matches the mixing barrel, and a laser cutter is provided on the top of the forming mechanism.

[0008] Preferably, the mixing barrel includes a fixing frame, a melting box, a driving motor and a driving shaft. The fixing frame is U-shaped, and the bottom of the fixing frame is fixedly connected to the fixing seat.

[0009] Preferably, a melting box is provided inside the fixing frame, a driving shaft is provided on one side of the melting box, the driving shaft passes through one side of the fixing frame and extends to the outside thereof, and the driving shaft is rotatably connected to the fixing frame.

[0010] Preferably, a driving motor is provided on one side of the fixing frame, an output end of the driving motor passes through the fixing frame and extends into the interior thereof, and the output end of the driving motor is connected to the other side of the melting tank.

[0011] Preferably, the molding mechanism includes a placement box, an upper template, a lower template, an injection hole, a profiling frame, a fastening bolt, a limiting ring, a feed hopper, a flow cavity and a molding cavity. The bottom of the placement box is fixedly connected to the top of the fixing seat, and the placement box is concave.

[0012] Preferably, a lower template is provided inside the placement box, and an upper template is provided on the top of the lower template, an injection hole is provided through the top of the upper template, and flow cavities are provided on the inner walls of the upper template and the lower template, and the injection holes pass through the upper template and are connected with a group of the flow cavities, and molding cavities are provided at intervals inside the upper template and the lower template, and the molding cavities are connected with the flow cavities.

[0013] Preferably, a limiting ring is provided on the top of the placement box, a feed hopper is provided inside the limiting ring, the top of the feed hopper matches the mixing barrel, the bottom of the feed hopper passes through the injection hole and extends to the inside thereof, and a C-shaped frame is symmetrically provided at both ends of the limiting ring, the C-shaped frame is bent, the inner wall of the C-shaped frame is in contact with the placement box, a fastening bolt is provided on one side of the C-shaped frame, and the fastening bolt passes through the C-shaped frame and extends to the side wall of the placement box, and the side wall of the placement box is threadedly connected to the fastening bolt.

[0014] Preferably, a gantry is provided on the outside of the forming mechanism, the gantry is N-shaped, and the bottom of the gantry is fixedly connected to the fixing seat, the inner wall of the gantry is symmetrically provided with electric telescopic rods, and the bottom of the electric telescopic rods is fixedly connected to the top of the laser cutter.

[0015] A method for processing a semiconductor cantilever needle comprises the following steps:

[0016] S1: First, the metal raw materials and the mixture are weighed according to the above weight ratio, and the weighed mixture is placed in a melting box set inside the mixing barrel, and the metal raw materials are melted by the melting box. Then, a fusion agent is added to the melting box to fuse the metals together;

[0017] S2: At this time, the driving motor set inside the mixing barrel is started, and the driving motor drives the melting box to swing back and forth, thereby increasing the fusion of the metal raw materials inside the melting box;

[0018] S3: After the metal fusion is completed, the melting box is driven by the driving motor to rotate and make it horizontal. At this time, the box opening of the melting box is located at the top of the feed hopper, and the molten metal liquid inside the melting box is transported to the inside of the injection hole through the feed hopper, and then transported to between the upper template and the lower template through the injection hole, and then transported to the inside of the molding cavity through the flow cavity set between the upper template and the lower template, thereby realizing injection molding preparation;

[0019] S4: After the injection molding is completed, the upper template is removed. At this time, the molded cantilever needle can be etched. At the same time, the electric telescopic rod can be started to push the laser cutter downward to cut the cantilever needle inside the lower template, thereby obtaining an independent cantilever needle.

[0020] The beneficial effects of the present invention are:

[0021] 1. By adding appropriate amounts of metal elements such as rhodium, ruthenium, and palladium when preparing cantilever needles, the device makes the new material structure more delicate, reduces surface stress, inhibits the formation of oxide film, and combines more closely with other metal coatings.

[0022] 2. The molding mechanism provided inside the device cooperates with the melting mechanism to facilitate the injection molding of the cantilever needle, and then the connecting ribs of the cantilever needle are cut off by a laser cutter to prepare the cantilever needle.

[0023] In summary, the device reduces the surface stress of the material itself and inhibits the formation of oxide film by adding metal elements such as rhodium, ruthenium, and palladium to the material, allowing the material to have better bonding with other metal coatings such as nickel and gold. It can selectively be directly plated with gold to avoid the magnetism of the nickel plating layer affecting the electrical function of the cantilever needle, while maintaining the heat-resistant and high-temperature resistance value stable performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of the present invention.

[0025] Figure 2 It is a structural side view of the present invention.

[0026] Figure 3It is a structural schematic diagram of the mixing barrel of the present invention.

[0027] Figure 4 It is a structural schematic diagram of the forming mechanism of the present invention.

[0028] Figure 5 It is a structural sectional view of the upper template of the present invention.

[0029] Numbers in the figure: 1. Fixed seat; 2. Mixing barrel; 201. Fixed frame; 202. Melting box; 203. Drive motor; 204. Drive shaft; 3. Molding mechanism; 301. Placement box; 302. Upper template; 303. Lower template; 304. Injection hole; 305. Profile frame; 306. Fastening bolt; 307. Limiting ring; 308. Feed hopper; 309. Flow chamber; 310. Molding chamber; 4. Gantry; 5. Electric telescopic rod; 6. Laser cutter. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0031] Reference Figure 1-Figure 5 As shown, a semiconductor cantilever needle is provided, wherein the metal raw materials include the following weights: 90% tungsten, 3.2% rhenium, 0.01% potassium, 0.002% iron, 0.0015% aluminum, 0.003% molybdenum, 0.0005% arsenic / calcium / chromium / magnesium / manganese, 0.0005% sodium / nickel / titanium / silicon / cobalt, 0.0002% bismuth / cadmium / tin / copper / lead, 0.0005% antimony, 0.0005% rhodium, 0.0004% ruthenium, and 0.0005% palladium. The fusion agent is a metal fusion agent, and the ratio of the metal raw material to the fusion agent in the fusion agent is 90:6.6681.

[0032] A semiconductor cantilever needle processing device includes a fixed base 1, a mixing barrel 2 for mixing metal raw materials is provided on one side of the top of the fixed base 1, a forming mechanism 3 is provided on the other side of the top of the fixed base 1, and the forming mechanism 3 is matched with the mixing barrel 2, and a laser cutter 6 is provided on the top of the forming mechanism 3.

[0033] like Figure 3As shown, the mixing barrel 2 includes a fixed frame 201, a melting box 202, a driving motor 203 and a driving shaft 204. The fixed frame 201 is U-shaped, and the bottom of the fixed frame 201 is fixedly connected to the fixed seat 1. The melting box 202 is arranged inside the fixed frame 201, and a driving shaft 204 is arranged on one side of the melting box 202. The driving shaft 204 passes through one side of the fixed frame 201 and extends to its outside, and the driving shaft 204 is rotatably connected to the fixed frame 201. A driving motor 203 is arranged on one side of the fixed frame 201, and the output end of the driving motor 203 passes through the fixed frame 201 and extends to its inside, and the output end of the driving motor 203 is connected to the other side of the melting box 202; the mixing barrel 2 facilitates melting and fusing the metal raw materials.

[0034] like Figure 4 、 Figure 5 As shown, the molding mechanism 3 includes a placement box 301, an upper template 302, a lower template 303, an injection hole 304, a profiling frame 305, a fastening bolt 306, a limiting ring 307, a feed hopper 308, a flow cavity 309 and a molding cavity 310. The bottom of the placement box 301 is fixedly connected to the top of the fixing seat 1, and the placement box 301 is concave. The lower template 303 is provided inside the placement box 301, and the top of the lower template 303 is provided with an upper template 302. The top of the upper template 302 is penetrated by an injection hole 304. The inner walls of the upper template 302 and the lower template 303 are both provided with a flow cavity 309. The injection hole 304 penetrates the upper template 302 and is connected to a group of flow cavities 309. The interiors of the upper template 302 and the lower template 303 are spaced apart. A molding cavity 310 is provided, and the molding cavity 310 is connected to the flow cavity 309. A limiting ring 307 is provided on the top of the placement box 301. A feed hopper 308 is provided inside the limiting ring 307. The top of the feed hopper 308 matches the mixing barrel 2, and the bottom of the feed hopper 308 passes through the injection hole 304 and extends to the inside thereof. A C-shaped frame 305 is symmetrically provided at both ends of the limiting ring 307. The C-shaped frame 305 is bent, and the inner wall of the C-shaped frame 305 contacts the placement box 301. A fastening bolt 306 is provided on one side of the C-shaped frame 305, and the fastening bolt 306 passes through the C-shaped frame 305 and extends to the side wall of the placement box 301, and the side wall of the placement box 301 is threadedly connected to the fastening bolt 306; the molding mechanism 3 prepares the cantilever needle by injection molding.

[0035] like Figure 1 、 Figure 2 As shown, a gantry 4 is provided on the outside of the forming mechanism 3, the gantry 4 is in an N shape, and the bottom of the gantry 4 is fixedly connected to the fixed seat 1, and an electric telescopic rod 5 is symmetrically provided on the inner wall of the gantry 4, and the bottom of the electric telescopic rod 5 is fixedly connected to the top of the laser cutter 6; the laser cutter 6 cuts the connected cantilever needles into independent cantilever needles.

[0036] A method for processing a semiconductor cantilever needle comprises the following steps:

[0037] S1: First, the metal raw materials and the mixture are weighed according to the above weight ratio, and the weighed mixture is placed in the melting box 202 provided in the mixing barrel 2, and the metal raw materials are melted by the melting box 202. Then, a fusion agent is added to the melting box 202 to fuse the metals together;

[0038] S2: At this time, the driving motor 203 provided inside the mixing barrel 2 is started, and the driving motor 203 drives the melting box 202 to swing back and forth, thereby increasing the fusion of the metal raw materials inside the melting box 202;

[0039] S3: After the metal fusion is completed, the melting box 202 is driven to rotate by the driving motor 203 and is horizontal. At this time, the box opening of the melting box 202 is located at the top of the feed hopper 308, and the molten metal liquid inside the melting box 202 is transported to the inside of the injection hole 304 through the feed hopper 308, and then transported to between the upper template 302 and the lower template 303 through the injection hole 304, and then transported to the inside of the molding cavity 310 through the flow cavity 309 provided between the upper template 302 and the lower template 303, thereby realizing injection molding preparation;

[0040] S4: After the injection molding is completed, the upper template 302 is removed. At this time, the molded cantilever needle can be etched. At the same time, the electric telescopic rod 5 can be started to push the laser cutter 6 downward to cut the cantilever needle inside the lower template 303, thereby obtaining an independent cantilever needle.

[0041] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A semiconductor cantilever needle, comprising a metal raw material and a flux, characterized in that: The metal raw materials include the following weights: 90% tungsten, 3.2% rhenium, 0.01% potassium, 0.002% iron, 0.0015% aluminum, 0.003% molybdenum, 0.0005% arsenic / calcium / chromium / magnesium / manganese, 0.0005% sodium / nickel / titanium / silicon / cobalt, 0.0002% bismuth / cadmium / tin / copper / lead, 0.0005% antimony, 0.0005% rhodium, 0.0004% ruthenium, and 0.0005% palladium. The fusion agent is a metal fusion agent, and the ratio of the metal raw material to the fusion agent of the fusion agent is 90:6.6681.

2. The semiconductor cantilever needle processing device according to claim 1, characterized in that: The invention comprises a fixed seat (1), a mixing barrel (2) for mixing metal raw materials is provided on one side of the top of the fixed seat (1), a forming mechanism (3) is provided on the other side of the top of the fixed seat (1), and the forming mechanism (3) matches the mixing barrel (2), and a laser cutter (6) is provided on the top of the forming mechanism (3).

3. The semiconductor cantilever needle processing device according to claim 2, characterized in that: The mixing barrel (2) comprises a fixing frame (201), a melting box (202), a driving motor (203) and a driving shaft (204); the fixing frame (201) is U-shaped, and the bottom of the fixing frame (201) is fixedly connected to the fixing seat (1).

4. The semiconductor cantilever needle processing device according to claim 3, characterized in that: A melting box (202) is provided inside the fixing frame (201), a driving shaft (204) is provided on one side of the melting box (202), the driving shaft (204) passes through one side of the fixing frame (201) and extends to the outside thereof, and the driving shaft (204) is rotatably connected to the fixing frame (201).

5. The semiconductor cantilever needle processing device according to claim 4, characterized in that: A drive motor (203) is provided on one side of the fixing frame (201), an output end of the drive motor (203) passes through the fixing frame (201) and extends into the interior thereof, and the output end of the drive motor (203) is connected to the other side of the melting box (202).

6. The semiconductor cantilever needle processing device according to claim 2, characterized in that: The molding mechanism (3) comprises a placement box (301), an upper mold plate (302), a lower mold plate (303), an injection hole (304), a mold frame (305), a fastening bolt (306), a limiting ring (307), a feed hopper (308), a flow cavity (309) and a molding cavity (310); the bottom of the placement box (301) is fixedly connected to the top of the fixing seat (1), and the placement box (301) is concave.

7. The semiconductor cantilever needle processing device according to claim 6, characterized in that: A lower template (303) is provided inside the placement box (301), and an upper template (302) is provided on the top of the lower template (303), an injection hole (304) is provided through the top of the upper template (302), and the inner walls of the upper template (302) and the lower template (303) are both provided with flow cavities (309), and the injection holes (304) pass through the upper template (302) and are connected to a group of the flow cavities (309), and the interiors of the upper template (302) and the lower template (303) are both spaced apart with molding cavities (310), and the molding cavities (310) are connected to the flow cavities (309).

8. The semiconductor cantilever needle processing device according to claim 6, characterized in that: A limiting ring (307) is provided on the top of the placement box (301), and a feed hopper (308) is provided inside the limiting ring (307). The top of the feed hopper (308) matches the mixing barrel (2), and the bottom of the feed hopper (308) extends into the interior through the injection hole (304). A shaped frame (305) is symmetrically provided at both ends of the limiting ring (307). The shaped frame (305) is bent, and the inner wall of the shaped frame (305) contacts the placement box (301). A fastening bolt (306) is provided on one side of the shaped frame (305), and the fastening bolt (306) passes through the shaped frame (305) and extends to the side wall of the placement box (301), and the side wall of the placement box (301) is threadedly connected to the fastening bolt (306).

9. The semiconductor cantilever needle processing device according to claim 2, characterized in that: A gantry (4) is provided on the outside of the forming mechanism (3), the gantry (4) is in an N-shape, and the bottom of the gantry (4) is fixedly connected to the fixing seat (1), and electric telescopic rods (5) are symmetrically provided on the inner wall of the gantry (4), and the bottom of the electric telescopic rods (5) is fixedly connected to the top of the laser cutter (6).

10. A method for processing a semiconductor cantilever needle according to any one of claims 1 to 9, characterized in that: The steps include: S1: First, the metal raw materials and the mixture are weighed according to the above weight ratio, and the weighed mixture is placed in the melting box (202) provided inside the mixing barrel (2), and the metal raw materials are melted by the melting box (202), and then a fusion agent is added to the melting box (202) to fuse the metals together; S2: At this time, the driving motor (203) provided inside the mixing barrel (2) is started, and the driving motor (203) drives the melting box (202) to swing back and forth, thereby increasing the fusion of the metal raw materials inside the melting box (202); S3: After the metal fusion is completed, the melting box (202) is driven to rotate by the driving motor (203) and is made horizontal. At this time, the box opening of the melting box (202) is located at the top of the feed hopper (308), and the molten metal liquid inside the melting box (202) is transported to the inside of the injection hole (304) through the feed hopper (308), and then transported to between the upper template (302) and the lower template (303) through the injection hole (304), and then transported to the inside of the molding cavity (310) through the flow cavity (309) provided between the upper template (302) and the lower template (303), thereby realizing injection molding preparation; S4: After the injection molding is completed, the upper template (302) is removed. At this time, the cantilever needles can be etched. At the same time, the electric telescopic rod (5) can be started to push the laser cutter (6) downward to cut the cantilever needles inside the lower template (303), thereby obtaining independent cantilever needles.

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