Electrode plate and electroplating device with same

Abstract

The invention discloses an electrode plate and an electroplating device with the same. The electrode plate is suitable for serving as an anode electrode of an electroplating device. The electrode plate comprises a substrate, N electrode patterns and N wires. The substrate has a first surface and a second surface opposite to each other and has a plurality of perforations. The N electrode patterns are disposed on the first surface of the substrate, and the N electrode patterns are spaced apart from each other. The N wires are arranged on the second surface of the substrate. Each of the N wires has a first end portion and a second end portion. The first end portion of each of the N wires is connected to a corresponding electrode pattern of the N electrode patterns via the at least one through hole. The second end parts of the N wires are used for being connected with N power supply modules respectively, so that each of the N electrode patterns receives current provided by one corresponding power supply module in the N power supply modules.

Description

Technical Field

[0001] The present invention relates to an electrode plate, and in particular to an anode electrode plate for an electroplating device. Background Art

[0002] Electroplating is a crucial process in the manufacture of printed circuit boards (PCBs), and jet plating is one of the most common methods. Jet plating involves spraying a plating solution containing metal ions directly onto the PCB to be plated. A rectifier then flows through the anode electrode plate located on one side of the PCB, creating an electric field between the anode electrode and the PCB, which acts as a cathode. This electrolyzes the plating solution, separating the metal ions and depositing them on the PCB surface. Over time, a metal film forms, completing the plating process.

[0003] However, the anode electrodes of conventional anode electrode plates all receive the same current through the same rectifier. However, since the plating liquid sprayed on the circuit board may be uneven, the electric field formed on the entire circuit board is not uniform. The uneven electric field distribution will cause the film thickness formed by electroplating to be uneven, ultimately affecting the reliability and quality of the circuit board.

[0004] Therefore, how to improve the above-mentioned shortcomings has become an urgent problem to be solved by those skilled in the art. Summary of the Invention

[0005] An object of the present invention is to provide an electrode plate and an electroplating device having the electrode plate to improve the uniformity of the formed electric field.

[0006] To achieve the above-mentioned purpose, one embodiment of the present invention is to provide an electrode plate suitable for use as an anode electrode of an electroplating device. The electrode plate includes a substrate, N electrode patterns and N traces, where N is a positive integer greater than 1. The substrate has a first surface and a second surface relative to each other and has a plurality of through-holes. The N electrode patterns are arranged on the first surface of the substrate, and the N electrode patterns are separated from each other. The N traces are arranged on the second surface of the substrate. Each of the N traces has a first end and a second end. The first end of each of the N traces is connected to a corresponding electrode pattern among the N electrode patterns via at least one corresponding through-hole among the plurality of through-holes. The second ends of the N traces are used to be connected to N power modules respectively, whereby each of the N electrode patterns receives current provided by a corresponding power module among the N power modules.

[0007] According to some embodiments of the present disclosure, the second ends of the N traces all extend from the same side of the substrate.

[0008] According to some embodiments of the present disclosure, N is two and the N electrode patterns include a first electrode pattern and a second electrode pattern. The first electrode pattern is located in the middle of the substrate, and the second electrode pattern surrounds the first electrode pattern.

[0009] According to some embodiments of the present disclosure, N is three and the N electrode patterns include a first electrode pattern, a second electrode pattern, and a third electrode pattern. The first electrode pattern, the second electrode pattern, and the third electrode pattern are sequentially arranged along a direction.

[0010] According to some embodiments of the present disclosure, the N traces include a first trace, a second trace, and a third trace connected to the first electrode pattern, the second electrode pattern, and the third electrode pattern, respectively. The second ends of the first trace, the second trace, and the third trace all extend from the same side of the substrate and are arranged sequentially along that side.

[0011] According to some embodiments of the present disclosure, N is twelve and the N electrode patterns include a first electrode pattern, a second electrode pattern, a third electrode pattern, a fourth electrode pattern, a fifth electrode pattern, a sixth electrode pattern, a seventh electrode pattern, an eighth electrode pattern, a ninth electrode pattern, a tenth electrode pattern, an eleventh electrode pattern, and a twelfth electrode pattern. The first electrode pattern, the second electrode pattern, the third electrode pattern, and the fourth electrode pattern are respectively located at the four corners of the substrate; the fifth electrode pattern, the sixth electrode pattern, the seventh electrode pattern, and the eighth electrode pattern are respectively located at the four sides of the substrate, the fifth electrode pattern is located between the first and second electrode patterns, the sixth electrode pattern is located between the second and third electrode patterns, the seventh electrode pattern is located between the third and fourth electrode patterns, and the eighth electrode pattern is located between the fourth and first electrode patterns. The fifth electrode pattern, the sixth electrode pattern, the seventh electrode pattern, and the eighth electrode pattern surround the ninth electrode pattern, the tenth electrode pattern, the eleventh electrode pattern, and the twelfth electrode pattern, which are sequentially arranged along a direction.

[0012] According to some embodiments of the present invention, the N traces include a first trace, a second trace, a third trace, a fourth trace, a fifth trace, a sixth trace, a seventh trace, an eighth trace, a ninth trace, a tenth trace, an eleventh trace, and a twelfth trace, respectively connected to a first electrode pattern, a second electrode pattern, a third electrode pattern, a fourth electrode pattern, a fifth electrode pattern, a sixth electrode pattern, a seventh electrode pattern, an eighth electrode pattern, a ninth electrode pattern, a tenth trace, an eleventh trace, and a twelfth trace. Second ends of the first trace, the second trace, the fifth trace, the eighth trace, the ninth trace, the tenth trace, the eleventh trace, the twelfth trace, the sixth trace, the seventh trace, the third trace, and the fourth trace all extend from the same side of the substrate and are arranged sequentially along that direction.

[0013] Another embodiment of the present invention is to provide an electroplating device, which includes a tank body, a plurality of fan blades and the electrode plate described in any of the above embodiments. The tank body includes a base and a first side wall, a second side wall, a third side wall and a fourth side wall connected to the base. The first side wall, the second side wall, the third side wall and the fourth side wall are connected to form a accommodating space. The first side wall has an opening. The fan blade is arranged in the accommodating space, and the fan blade is used to disturb the electroplating solution. The electrode plate is arranged in the accommodating space and is located between the fan blade and the third side wall. The N electrode patterns of the electrode plate face the fan blade.

[0014] According to some embodiments of the present disclosure, the second ends of the N traces all extend from the same side of the substrate and in a direction perpendicular to the base.

[0015] According to some embodiments of the present invention, the electroplating device further includes N power modules. The N power modules are respectively connected to the second ends of the N traces to provide current to the N electrode patterns.

[0016] The present invention provides embodiments of electrode plates having different numbers of electrode patterns. Because these electrode patterns receive current from independent power modules via independent traces, the potential of each electrode pattern (i.e., the desired electric field) can be adjusted by the power module to which it is connected. This allows each independent power module to control the electric field formed by each electrode pattern, resulting in a substantially uniform electric field distribution across all electrodes. This allows the metal film formed on the circuit board to be evenly distributed across its surface, resulting in a uniform metal film thickness, thereby improving the reliability and quality of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 FIG. 4 is a schematic diagram of an electroplating device according to an embodiment of the present invention.

[0018] Figure 2A FIG. 1 is a front view schematic diagram of an electrode plate according to a first embodiment of the present invention.

[0019] Figure 2B yes Figure 2A Schematic diagram of the rear view of the electrode plate.

[0020] Figure 3A FIG. 1 is a front view schematic diagram of an electrode plate according to a second embodiment of the present invention.

[0021] Figure 3B yes Figure 3A Schematic diagram of the rear view of the electrode plate.

[0022] Figure 4AFIG. 4 is a front view schematic diagram of an electrode plate according to a third embodiment of the present invention.

[0023] Figure 4B yes Figure 4A Schematic diagram of the rear view of the electrode plate.

[0024] Explanation of symbols: 100: Electroplating equipment 110: trough 111: First side wall 112: Second side wall 113: Third side wall 114: Fourth side wall 115: Base 130: Fan blades 150, 200, 300, 400: electrode plates 151, 153, 210, 310, 410: substrate 152, 220, 221, 222, 320, 321, 322, 323, 4201, 4202, 4203, 4204, 4205, 4206, 4207, 4208, 4209, 4210, 4211, 4212: Routing 230, 231, 232, 330, 331, 332, 333, 4301, 4302, 4303, 4304, 4305, 4306, 4307, 4308, 4309, 4310, 4311, 4312: electrode pattern 221A, 222A, 321A, 322A, 323A: First end 221B, 222B, 321B, 322B, 323B: First end 211, 311, 411: perforation AS: Accommodation space OP: Opening V1, D1: direction. DETAILED DESCRIPTION

[0025] Figure 11 is a schematic diagram of an electroplating device 100 according to an embodiment of the present invention. The electroplating device 100 includes a tank body 110, a plurality of fan blades 130 and an electrode plate 150. The tank body 110 includes a base 115 and a first side wall 111, a second side wall 112, a third side wall 113 and a fourth side wall 114 connected to the base 115, wherein the first side wall 111 has an opening OP. The first side wall 111, the second side wall 112, the third side wall 113 and the fourth side wall 114 are connected to form an accommodating space AS. A plurality of fan blades 130 are arranged in the accommodating space AS. Each fan blade 130 is used to disturb the electroplating liquid on the circuit board. It should be noted that, in fact, the electrode plate 150 of the electroplating device 100 is arranged in the accommodating space AS and is located between the fan blade 130 and the third side wall 113. The first side wall 111, the second side wall 112, the third side wall 113 and the fourth side wall 114 form a sealed accommodation space AS. The electrode plate 150 can serve as the anode electrode of the electroplating device 100, and can include substrates 151 and 153, N traces 152 and N electrode patterns. The substrate 151 can have a first surface and a second surface opposite to each other and have a plurality of through holes (not shown in the figure, refer to Figure 2B 、 3B and 4B). N electrode patterns are disposed on the first surface of the substrate 151 and are spaced apart from each other and face the fan blades 130. N traces 152 are respectively disposed on the second surface of the substrate 151, and each of the N traces 152 can be connected to a corresponding electrode pattern among the N electrode patterns via at least one through-hole (not shown, refer to FIG. Figure 2B 、 3B and 4B). A substrate 153 is further disposed on the other side of the connection between the N traces 152 and the substrate 151 to protect the traces 152. In one embodiment, the N traces 152 all extend from the same side of the substrate 151 (or substrate 153) along a direction V1 perpendicular to the base 115, facilitating subsequent wiring planning.

[0026] In one embodiment, the electroplating apparatus 100 may further include N power modules (not shown) connected to the N traces 152, respectively. Each power module can thereby provide current to a corresponding independent electrode pattern via a corresponding independent trace. The power module can be, for example, a power supply including a rectifier, which can provide a corresponding current or voltage to the electrode pattern serving as the anode electrode as required.

[0027] In one operation, when the circuit board to be electroplated is located outside the accommodating space AS (the circuit board can be fixed at a specific position outside the accommodating space AS by a clamp or other means), the fan blades 130 can be used to disturb the plating liquid on the surface of the circuit board to be electroplated, and the electrode pattern of the electrode plate 150 receives current from the power module through the wiring and has a corresponding potential, which can form an electric field between the circuit board and the cathode. Therefore, the plating liquid on the surface of the circuit board can be electrolyzed, so that the metal ions in the plating liquid are separated and adhered to the surface of the circuit board to form a metal film.

[0028] In the electroplating apparatus 100 of the present invention, since the N electrode patterns on the electrode plate 150 each receive current from a corresponding power module via N traces, the potential of each electrode pattern (i.e., the desired electric field) can be adjusted by the power module connected to it. This allows each power module to independently control the electric field formed by each electrode pattern, ensuring a substantially uniform overall electric field distribution. This allows the metal film formed on the circuit board to be evenly distributed across its surface, resulting in a uniform metal film thickness, thereby improving the reliability and quality of the circuit board.

[0029] In short, the potentials of the N electrode patterns on the electrode plate 150 used as the anode electrode of the electroplating device 100 can be adjusted independently. To achieve this goal, the structure of the electrode plate 150 needs to be specially designed. The following will further describe the electrode plates of various different embodiments.

[0030] Please refer to Figure 2A and Figure 2B , Figure 2A FIG. 1 is a front view schematic diagram of an electrode plate 200 according to a first embodiment of the present invention. Figure 2B yes Figure 2A The electrode plate 200 can be used as a rear view of the electrode plate 200. Figure 1The electrode plate 150 of the electroplating device 100 serves as an anode electrode. The electrode plate 200 includes a substrate 210, a plurality of traces 220, and a plurality of electrode patterns 230. In the present embodiment, the number of the electrode patterns 230 and the number of the traces 220 are both two. The electrode pattern 230 may include electrode patterns 231 and 232. The traces 220 may include traces 221 and 222. The electrode patterns 231 and 232 are arranged on a surface of the substrate 210 and are separated from each other. The electrode pattern 231 may be located in the middle of the substrate, while the electrode pattern 232 surrounds the electrode pattern 231. In the present embodiment, the shape of the electrode pattern 231 may be a quadrilateral, while the electrode pattern 232 may be in the shape of a "mouth" to surround the electrode pattern 231, but at a certain distance from the electrode pattern 231. In one embodiment, the electrode patterns 231 and 232 may be formed of a metal material (e.g., titanium). For example, the electrode patterns 231 and 232 are titanium mesh layers. After a period of use, the electrode patterns 231 and 232 wear out as they are used more frequently. The operator can then replace the old titanium mesh with a new one. In other words, the electrode patterns 231 and 232 are replaceable consumables.

[0031] like Figure 2B As shown, traces 221 and 222 can be disposed on the other surface of substrate 210. Wire 221 has a first end 221A and a second end 221B. Wire 222 has a first end 222A and a second end 222B. The first end 221A of trace 221 can be connected to electrode pattern 231 via at least one through-hole 211 (three shown) of substrate 210, while the first end 222A of trace 222 can be connected to electrode pattern 232 via at least one through-hole 211 (three shown) of substrate 210. On the other hand, the second end 221B of trace 221 and the second end 222B of trace 222 can be used to connect to different electrofilm modules (not shown), respectively. Thus, electrode patterns 231 and 232 can receive current provided by their respective connected electrofilm modules via traces 221 and 222, respectively, thereby achieving the effect of independently adjusting their potentials.

[0032] In one embodiment, the second end 221B of the trace 221 and the second end 222B of the trace 222 may both extend from the same side of the substrate 210 to facilitate wiring connected to the power module. Figure 1 As shown, the second end 221B of the trace 221 and the second end 222B of the trace 222 may both extend from the side of the substrate 210 closest to the base 115 of the tank body 110 along a direction V1 perpendicular to the base 115 .

[0033] Please refer to Figure 3A and Figure 3B , Figure 3AFIG. 1 is a front view schematic diagram of an electrode plate 300 according to a second embodiment of the present invention. Figure 3B yes Figure 3A The electrode plate 300 can be used as a rear view of the electrode plate 300. Figure 1 The electrode plate 150 of the electroplating device 100 serves as an anode electrode. The electrode plate 300 includes a substrate 310, a plurality of traces 320, and a plurality of electrode patterns 330. In the present embodiment, the number of the electrode patterns 330 and the number of the traces 320 are both three. The electrode pattern 330 may include electrode patterns 331, 332, and 333. The traces 320 may include traces 321, 322, and 323. The electrode patterns 331, 332, and 333 are disposed on a surface of the substrate 310 and are spaced apart from each other, and may be arranged in sequence along the direction D1, that is, the electrode patterns 331, 332, and 333 are arranged in sequence along the direction D1. Similarly, the electrode patterns 331, 332, and 333 may be formed, for example, of a metal material (e.g., titanium). For example, the electrode patterns 331 , 332 and 333 are themselves titanium metal mesh layers, and after the electrode patterns 331 , 332 and 333 are used for a period of time, the consumption of the electrode patterns 331 , 332 and 333 will increase with the number of uses, and the operator can replace the old titanium mesh with a new one.

[0034] like Figure 3B As shown, traces 321, 322, and 323 can be disposed on another surface of substrate 310. Trace 321 has a first end 321A and a second end 321B. Trace 322 has a first end 322A and a second end 322B. Trace 323 has a first end 323A and a second end 323B. The first end 321A of trace 321 can be connected to electrode pattern 331 via at least one through-hole 311 (three shown) in substrate 310. The first end 322A of trace 322 can be connected to electrode pattern 332 via at least one through-hole 311 (three shown) in substrate 310. And the first end 323A of trace 323 can be connected to electrode pattern 333 via at least one through-hole 311 (three shown) in substrate 310. On the other hand, the second end 321B of trace 321, the second end 322B of trace 322 and the second end 323B of trace 323 can be used to connect different electrofilm modules (not shown), respectively, whereby the electrode patterns 331, 332 and 333 can respectively receive the current provided by the electrofilm modules to which they are connected via traces 321, 322 and 323, thereby achieving the effect of independently adjusting the potential.

[0035] In one embodiment, the second end 321B of the trace 321, the second end 322B of the trace 322, and the second end 323B of the trace 323 may all extend from the same side of the substrate 310 and be arranged in sequence along the direction D1 (i.e., the traces 321, 322, and 323 extending in sequence along the direction D1) to facilitate wiring connected to the power module. In one embodiment, for example Figure 1 As shown, the second end 321B of the trace 321, the second end 322B of the trace 322, and the second end 323B of the trace 323 may all extend from the side of the base 115 closest to the tank body 110 in the substrate 310 along the direction V1 perpendicular to the base 115 and be arranged in sequence along the direction D1.

[0036] Please refer to Figure 4A and Figure 4B , Figure 4A FIG. 4 is a front view schematic diagram of an electrode plate 400 according to a third embodiment of the present invention. Figure 4B yes Figure 4A The electrode plate 400 can be used as a rear view of the electrode plate 400. Figure 1 The electrode plate 150 of the electroplating device 100 functions as an anode electrode. The electrode plate 400 includes a substrate 410, a plurality of traces 4201-4212, and a plurality of electrode patterns 4301-4312. In this embodiment, the number of electrode patterns and traces is twelve. The electrode patterns 4301-4312 are arranged on a surface of the substrate 410 and are separated from each other. In one embodiment, the electrode patterns 4301, 4302, 4303, and 4304 can be respectively located at the four corners of the substrate 410, and their shapes can all be triangular. Electrode patterns 4305, 4306, 4307, and 4308 may be located on four sides of substrate 410, with electrode pattern 4305 located between electrode patterns 4301 and 4302, electrode pattern 4306 located between electrode patterns 4302 and 4303, electrode pattern 4307 located between electrode patterns 4303 and 4304, and electrode pattern 4308 located between electrode patterns 4304 and 4301. Electrode patterns 4309, 4310, 4311, and 4312 may be arranged sequentially along direction D1 and surrounded by electrode patterns 4305, 4306, 4307, and 4308. Similarly, electrode patterns 4301-4312 may be formed of a metal material (e.g., titanium). For example, the electrode patterns 4301 - 4312 are themselves titanium metal mesh layers, and after the electrode patterns 4301 - 4312 are used for a period of time, the consumption of the electrode patterns 4301 - 4312 increases with the number of uses, and the operator can replace the old titanium mesh with a new one.

[0037] like Figure 4BAs shown, traces 4201-4212 can be disposed on another surface of substrate 410. Similarly, each of traces 4201-4212 has a first end and a second end relative to each other (for ease of reading, the component numbers of the first and second ends of each of traces 4201-4212 are omitted here). The first end of each of traces 4201-4212 can be connected to a corresponding electrode pattern of electrode patterns 4301-4312 via at least one corresponding through-hole 411 of substrate 410. In addition, the second end of each of traces 4201-4212 can be used to connect to different electrofilm modules (not shown in the figure). Thus, electrode patterns 4301-4312 can receive current provided by their respective connected electrofilm modules through traces 4201-4212, thereby achieving the effect of independently adjusting their potentials.

[0038] In one embodiment, the second ends of the traces 4201, 4202, 4205, 4208, 4209, 4210, 4211, 4212, 4206, 4207, 4203, and 4204 may all extend from the same side of the substrate 410 and be arranged in sequence along the direction D1 (i.e., the traces 4201, 4202, 4205, 4208, 4209, 4210, 4211, 4212, 4206, 4207, 4203, and 4204 extending in sequence along the direction D1) to facilitate wiring connected to the power module. In one embodiment, for example, Figure 1 As shown, the second ends of traces 4201, 4202, 4205, 4208, 4209, 4210, 4211, 4212, 4206, 4207, 4203 and 4204 may all extend from the side of the base 115 closest to the tank body 110 in the substrate 410 along a direction V1 perpendicular to the base 115 and be arranged in sequence along the direction D1.

[0039] Regarding the anode electrodes of electroplating devices, the present invention provides embodiments of electrode plates having different numbers of electrode patterns. Because these electrode patterns receive current from independent power modules via independent traces, the potential of each electrode pattern (i.e., the desired electric field) can be adjusted by the power module connected to it. In this way, the electric field formed by each electrode pattern can be controlled by each independent power module, so that all electric field distributions are roughly the same. This allows the metal film formed on the circuit board to be evenly distributed on its surface, that is, the circuit board has a uniform metal film thickness, thereby improving the reliability and quality of the circuit board.

Claims

1. An electrode plate suitable for use as an anode electrode in an electroplating device, characterized in that: The electrode plate includes: A substrate having a first surface and a second surface opposite to each other and having a plurality of through holes; N electrode patterns are disposed on the first surface of the substrate, wherein the N electrode patterns are spaced apart from each other, and N is a positive integer greater than 1; and N traces are arranged on the second surface of the substrate, each of the N traces having a first end and a second end, wherein the first end of each of the N traces is connected to a corresponding electrode pattern among the N electrode patterns through at least one corresponding through-hole among the plurality of through-holes, and the second end of the N traces is used to be connected to N power modules respectively, thereby each of the N electrode patterns receives current provided by a corresponding power module among the N power modules.

2. The electrode plate according to claim 1, wherein The second ends of the N traces all extend from the same side of the substrate.

3. The electrode plate according to claim 1, wherein: N is two and the N electrode patterns include a first electrode pattern and a second electrode pattern, wherein the first electrode pattern is located in the middle of the substrate, and the second electrode pattern surrounds the first electrode pattern.

4. The electrode plate according to claim 1, wherein N is three and the N electrode patterns include a first electrode pattern, a second electrode pattern and a third electrode pattern, wherein the first electrode pattern, the second electrode pattern and the third electrode pattern are arranged in sequence along a direction.

5. The electrode plate according to claim 4, wherein: The N traces include a first trace, a second trace, and a third trace connected to the first electrode pattern, the second electrode pattern, and the third electrode pattern, respectively, wherein the second ends of the first trace, the second trace, and the third trace all extend from the same side of the substrate and are arranged sequentially along the direction.

6. The electrode plate according to claim 1, wherein: N is twelve, and the N electrode patterns include a first electrode pattern, a second electrode pattern, a third electrode pattern, a fourth electrode pattern, a fifth electrode pattern, a sixth electrode pattern, a seventh electrode pattern, an eighth electrode pattern, a ninth electrode pattern, a tenth electrode pattern, an eleventh electrode pattern, and a twelfth electrode pattern, wherein the first electrode pattern, the second electrode pattern, the third electrode pattern, and the fourth electrode pattern are respectively located at four corners of the substrate; The fifth electrode pattern, the sixth electrode pattern, the seventh electrode pattern and the eighth electrode pattern are respectively located on the four sides of the substrate, the fifth electrode pattern is located between the first electrode pattern and the second electrode pattern, the sixth electrode pattern is located between the second electrode pattern and the third electrode pattern, the seventh electrode pattern is located between the third electrode pattern and the fourth electrode pattern, the eighth electrode pattern is located between the fourth electrode pattern and the first electrode pattern, and the fifth electrode pattern, the sixth electrode pattern, the seventh electrode pattern and the eighth electrode pattern surround the ninth electrode pattern, the tenth electrode pattern, the eleventh electrode pattern and the twelfth electrode pattern arranged in sequence along a direction.

7. The electrode plate according to claim 6, wherein: The N routings include a first routing, a second routing, a third routing, a fourth routing, a fifth routing, a sixth routing, a seventh routing, an eighth routing, a ninth routing, a tenth routing, an eleventh routing and a twelfth routing, which are respectively connected to the first electrode pattern, the second electrode pattern, the third electrode pattern, the fourth electrode pattern, the fifth electrode pattern, the sixth electrode pattern, the seventh electrode pattern, the eighth electrode pattern, the ninth electrode pattern, the tenth electrode pattern, the eleventh electrode pattern and the twelfth electrode pattern, wherein the second ends of the first routing, the second routing, the fifth routing, the eighth routing, the ninth routing, the tenth routing, the eleventh routing, the twelfth routing, the sixth routing, the seventh routing, the third routing and the fourth routing all extend from the same side of the substrate and are arranged sequentially along the direction.

8. An electroplating device, characterized in that: include: A tank body, comprising a base and a first side wall, a second side wall, a third side wall and a fourth side wall connected to the base, wherein the first side wall has an opening, wherein the first side wall, the second side wall, the third side wall and the fourth side wall are connected to form a receiving space; A plurality of fan blades are disposed in the accommodating space, wherein the fan blades are used to disturb the electroplating solution; as well as The electrode plate as described in any one of claims 1 to 7 is arranged in the accommodating space and located between the fan blade and the third side wall, wherein the N electrode patterns of the electrode plate face the fan blade.

9. The electroplating device according to claim 8, wherein: The second ends of the N traces all extend from the same side of the substrate and along a direction perpendicular to the base.

10. The electroplating device according to claim 9, wherein: The system further comprises N power modules, wherein the N power modules are respectively connected to the second ends of the N traces to provide current to the N electrode patterns.

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