Method and device for counting particles on surface of silicon component

Abstract

The invention provides a method and device for counting particles on the surface of a silicon component, and the method at least comprises the following steps: S1, preparing a silicon component sample: extracting a plurality of silicon component samples from a batch of silicon component products, and ensuring that the batch of silicon component products and the silicon component samples are subjected to the same process and ultrasonic cleaning treatment, the surface area of the silicon component sample is SAP; s2, preparing a testing environment, performing ultrasonic cleaning on the measuring container by using pure water, then replacing pure water with the volume of VD, and detecting the granularity BLD of the pure water before cleaning by using a liquid particle counter; s3, testing the silicon component sample, adding the silicon component sample into the measuring container, performing ultrasonic cleaning for a certain time, and detecting the granularity PLD of the cleaned pure water by using a liquid particle counter; s4, data calculation: calculating the total number L of particles on the surface of the silicon component sample according to the formula L = (PLD-BLD) * VD; and calculating the surface granularity LPC of the silicon component sample according to the formula: LPC = (PLD-BLD) * VD / SAP. Compared with other calculation methods, the precision is higher.

Description

Technical Field

[0001] The present application relates to the field of semiconductor material processing technology, and in particular to a method and device for counting particles on the surface of silicon components. Background Art

[0002] Silicon components primarily include those made of silicon materials, such as silicon rings, shower heads, silicon boats, insulation tubes, silicon electrodes, and spray tubes. Semiconductor material processing places high cleanliness requirements on the environment and contacting components. Even particles smaller than 0.1 mm can be fatal to certain products, such as chips, much like a grain of sand in a precision watch, disrupting the precise operation of the entire system. These particles are uncontrollable and can range from conductive metal particles to non-conductive material particles, potentially causing short circuits or even open circuits. To improve the yield rate of semiconductor device production, components that come into contact with chips and wafers also have higher requirements. Silicon components in contact with the production process must be evaluated for cleanliness, and those that do not meet these requirements must be handled accordingly. However, visual inspection of these tiny particulate contaminants is virtually impossible, making rapid and accurate assessment of silicon component surface cleanliness a major technical challenge.

[0003] Patent application number CN106898559A discloses a method for detecting particles in a semiconductor wafer cassette, including the following steps: (1) preparing clean silicon wafers, testing the number of particles on the wafer surface using a particle counter, and recording the number; (2) placing the clean silicon wafers in the cassette to be tested, and blowing air from a source through an air path with a particle filter into the cassette to be tested at a pressure of approximately 15 to 30 psi, maintaining the air source purge for 1 minute; (3) using a particle counter to test the particle data on the wafer surface, recording the data, and comparing the increase before and after to determine the cleanliness of the semiconductor wafer cassette. This method can quickly, efficiently, and batch detect the particle cleanliness of wafer cassettes, and timely test and analyze whether the wafer cassette particles are clean. However, some particles are difficult to purge through the air source, so it is impossible to accurately measure the particle size.

[0004] The Chinese patent application with publication number "CN115753530A" discloses a method for detecting the particle size of a high-purity copper alloy. The method comprises the following steps: the high-purity copper alloy is pretreated, dissolved, diluted, and tested with a liquid particle counter to obtain a particle size; the dissolving solution is any one of nitric acid, hydrochloric acid, or sulfuric acid, or a combination of at least two. During the particle size detection process of the high-purity copper alloy, this method detects the content of insoluble or poorly soluble matter in the high-purity copper alloy, dissolves the high-purity copper alloy in an acidic solution, accelerates the dissolution rate, and improves detection efficiency and accuracy. However, this method directly dissolves the device, not just the surface particle size. Furthermore, some particulate matter will also dissolve in the acidic solution, resulting in inaccurate detection results. Summary of the Invention

[0005] The present application provides a method and apparatus for counting particles on the surface of a silicon component, so as to at least solve the technical problem of how to count particles with high precision existing in the prior art.

[0006] According to a first aspect of the present application, a method for counting particles on the surface of a silicon component is provided, comprising at least the following steps: S1, preparing silicon component samples, extracting a plurality of silicon component samples from a batch of silicon component products, ensuring that the silicon component products in the batch and the silicon component samples undergo the same process and ultrasonic cleaning treatment, and the surface area of ​​the silicon component samples is SAP; S2. Prepare the test environment. Use pure water to ultrasonically clean the measuring container, then replace it with pure water with a volume VD. Use a liquid particle counter to measure the particle size BLD of the pure water before cleaning. S3, silicon component sample test, add the silicon component sample to the measuring container, ultrasonically clean it for a certain period of time, and use a liquid particle counter to detect the particle size PLD of the pure water after cleaning; S4. Data calculation: calculate the total number of particles on the surface of the silicon component sample L = (PLD-BLD) × VD; calculate the particle size on the surface of the silicon component sample LPC = (PLD-BLD) × VD ÷ SAP.

[0007] Compared with the prior art, the method for counting particles on the surface of silicon components in this application has the following beneficial effects: The materials and processes of products in the same batch are basically the same, and the test data are relatively close. Ultrasonic cleaning of the measuring container with pure water can reduce the impact of the measuring container on the test results. Obtaining the particle size of pure water before testing can avoid the impact of the pure water particle size on the test. The ultrasonic cleaning machine can allow particles on the surface of the silicon component sample to fall into the pure water, and the number of particles can be counted by the liquid particle counter. Particles as small as 0.2 microns and as large as those visible to the naked eye can all be accurately measured. After calculation, the total number of particles on the surface of the silicon component and the particle size of the silicon component surface can be obtained. Compared with other calculation methods, it has higher accuracy.

[0008] In one embodiment, in step S2, the ultrasonic cleaning time is not less than one hour; in step S3, the ultrasonic cleaning time is not less than ten minutes, which can ensure that the particles on the surface enter the pure water, making the test more accurate.

[0009] In one embodiment, during the production of silicon component products, a smaller silicon component sample is cut, the silicon component sample is processed using the same processing technology, and an ultrasonic cleaning process is performed simultaneously. For larger components that are inconvenient to test, the sample can be cut off for testing.

[0010] In one embodiment, the temperature of the ultrasonic cleaning process is 50° C.-100° C., the ultrasonic cleaning time is more than ten minutes, and the higher the temperature, the better the cleaning effect.

[0011] In one embodiment, the measuring container is provided with multiple independent holding spaces, including a test holding space and a comparison holding space. Equal volumes or proportions of pure water are added to the test holding space and the comparison holding space, and ultrasonic cleaning is performed for a predetermined period of time. A liquid particle counter is used to measure the particle size (CLD) of the test holding space and the particle size (DLD) of the comparison holding space after cleaning. The purified water is then removed, and equal volumes or proportions of pure water are added to the test holding space and the comparison holding space. A silicon component sample is added to the test holding space, and ultrasonic cleaning is performed for the same period of time. A liquid particle counter is used to measure the particle size (PLD) of the purified water in the test holding space and the particle size (ELD) of the purified water in the comparison holding space after cleaning. The surface particle size (LPC) of the silicon component sample is calculated as (PLD - CLD + DLD - ELD) × VD ÷ SAP. This can minimize the impact of the measuring container on the test results. Specifically, during the test process, the measuring container may drop some particles, affecting the test results. By measuring the particle size in the comparison holding space, the number of particles generated in the test holding space during the test can be estimated, thereby making the calculated results more accurate.

[0012] According to a second aspect of the present application, a device for counting particles on the surface of a silicon component is provided, comprising a measuring container, a rotating base, and a fixed base. The rotating base is mounted on the fixed base so as to be rotatable relative to the fixed base about a first rotation axis. The bottom of the measuring container mates with the upper end face of the rotating base, allowing the measuring container to be mounted on the rotating base and rotate with the rotating base. The measuring container is provided with scale lines and a water outlet. The values ​​of the scale lines are the volume of the liquid in the measuring container when the liquid level is aligned with the scale lines and the water outlet when the measuring container is tilted. With this design, excess pure water in the measuring container automatically overflows, resulting in higher accuracy of the pure water volume.

[0013] In one embodiment, a latch or slot is provided on the top surface of the rotating base, and a slot or latch is provided on the bottom of the measuring container. The slot and latch match to ensure that the measuring container can only be installed at the same angle on the top surface of the rotating base. This design ensures that the installation angle is always correct, allowing excess pure water to be removed by pouring.

[0014] In one embodiment, the fixed seat is provided with a worm, and the lower end of the rotating seat is provided with turbine teeth. The worm and the turbine teeth are matched and meshed so that the worm can drive the rotating seat to rotate. A handwheel is provided at one end of the worm so that the worm is driven by the handwheel, so that the inclination angle of the measuring container can be controlled by the handwheel.

[0015] In one embodiment, the measuring container is semi-open and cylindrical, with an annular partition and / or a square partition disposed therein. The annular partition and / or the square partition divide the space within the measuring container into multiple independent holding spaces, with at least one holding space surrounded by the others. In this manner, by measuring the particle size of the surrounding holding spaces, the number of particles generated in the surrounding holding spaces during the test can be estimated, thereby enhancing the accuracy of the test.

[0016] In one embodiment, the annular partition and / or the square partition are detachably mounted in the measuring container, so that samples of different shapes can be tested.

[0017] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present application, nor is it intended to limit the scope of the present application. Other features of the present application will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and other objects, features and advantages of the exemplary embodiments of the present application will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present application are shown in an illustrative and non-limiting manner, in which: In the drawings, the same or corresponding reference numerals denote the same or corresponding parts.

[0019] Figure 1 A schematic diagram of the structure of a device for counting particles on the surface of a silicon component according to an embodiment of the present application is shown; Figure 2 A schematic cross-sectional view at a first angle of a device for counting particles on a silicon component surface according to an embodiment of the present application is shown; Figure 3 A schematic cross-sectional view at a second angle of the device for counting particles on the surface of a silicon component according to an embodiment of the present application is shown; Figure 4 Schematic diagram of a measuring container of a device for counting particles on a silicon component surface according to an embodiment of the present application Figure 1 ; Figure 5 Schematic diagram of a measuring container of a device for counting particles on a silicon component surface according to an embodiment of the present application Figure 2 ; Figure 6 A schematic diagram of a rotating base and a fixed base of a device for counting particles on the surface of a silicon component according to an embodiment of the present application is shown; Figure 7 Schematic diagram of a measuring container of a device for counting particles on a silicon component surface according to an embodiment of the present application Figure 3 .

[0020] Description of the numbers in the figure: 1. Measuring container; 2. Rotating seat; 3. Fixed seat; 4. Water outlet; 5. Partition; 10. Scale line; 11. First accommodating space; 12. Second accommodating space; 13. Third accommodating space; 14. Left second accommodating space; 15. Right second accommodating space; 16. Lower second accommodating space; 17. Right third accommodating space; 21. First rotating shaft; 22. Upper end face; 23. Pin; 24. Slot; 25. Mounting seat; 26. Second rotating shaft; 27. Driving seat; 28. Counterweight; 31. Worm; 32. Turbine gear; 33. Handwheel; 34. Angle scale; 35. Pointer; 36. Support leg; 41. First water outlet; 42. Second water outlet; 43. Third water outlet; 51. Circular partition; 52. Square partition; 53. First circular partition; 54. First circular partition. DETAILED DESCRIPTION

[0021] In order to make the purpose, features, and advantages of this application more obvious and easy to understand, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts shall fall within the scope of protection of this application.

[0022] A method for counting particles on the surface of silicon components, comprising at least the following steps: S1, preparing silicon component samples, extracting several silicon component samples from a batch of silicon component products, ensuring that the silicon component products in the batch and the silicon component samples undergo the same process and ultrasonic cleaning treatment to ensure that the surface is clean and free of foreign matter; if some samples have foreign matter, other silicon component products can be checked for foreign matter; the surface area of ​​the silicon component samples is SAP; the surface area of ​​the silicon component samples can be counted based on the outer contour dimensions; for more complex shapes, automatic calculation can be performed with the aid of CAD software or CAE software.

[0023] S2. Prepare the test environment. Use pure water to ultrasonically clean the measuring container, then replace it with pure water of volume VD. Use a liquid particle counter to detect the particle size BLD of the pure water before cleaning. To increase the accuracy of the data, it is necessary to collect water at multiple locations for particle size detection. The water collection location must be 5 cm below the water surface and 5 cm above the bottom. For some smaller volumes, water can also be collected at the center for liquid particle size detection.

[0024] S3. Silicon component sample test: Add the silicon component sample to the measuring container, ultrasonically clean it for a certain period of time, and use a liquid particle counter to detect the particle size PLD of the pure water after cleaning. When using a liquid particle counter, sampling must also be performed at multiple locations to ensure more accurate testing. Water can be collected at multiple points near and far from the silicon component sample to perform liquid particle size testing. If there is a large difference between different locations, re-sampling and testing are required, or water testing must be performed after stirring.

[0025] S4. Data calculation: calculate the total number of particles on the surface of the silicon component sample L = (PLD-BLD) × VD; calculate the particle size on the surface of the silicon component sample LPC = (PLD-BLD) × VD ÷ SAP.

[0026] In one embodiment, in step S2, the ultrasonic cleaning time is not less than one hour; in step S3, the ultrasonic cleaning time is not less than ten minutes.

[0027] In one embodiment, during the production of silicon component products, a smaller silicon component sample is cut, such as a rectangular structure with a length of 60 mm, a width of 60 mm, and a height of 10 mm, and the edges are chamfered. The silicon component sample is processed using the same processing technology, typically with a cutting equipment speed of 500-5000 rpm and a feed rate of 0.05-1 mm / s. The same etching and cleaning process as the product is then performed, and finally an ultrasonic high-temperature cleaning treatment is performed at a temperature of 50°C-100°C and an ultrasonic time of not less than 10 minutes.

[0028] In one embodiment, the measuring container is provided with a plurality of independent holding spaces, the holding spaces including a test holding space and a comparison holding space, pure water of equal volume or proportion is added to the test holding space and the comparison holding space, ultrasonic cleaning is performed for a certain period of time, and a liquid particle counter is used to detect the particle size CLD of the test holding space and the particle size DLD of the comparison holding space after cleaning, and then the pure water after cleaning is removed, and pure water of equal volume or proportion is added to the test holding space and the comparison holding space, and a silicon component sample is added to the test holding space, and ultrasonic cleaning is performed together for the same period of time, and a liquid particle counter is used to detect the particle size PLD of the pure water in the test holding space and the particle size ELD of the pure water in the comparison holding space after cleaning, and the surface particle size LPC of the silicon component sample is calculated as LPC=(PLD-CLD+DLD-ELD)×VD÷SAP.

[0029] like Figure 1 and Figure 2 As shown, a device for counting particles on the surface of a silicon component includes a measuring container 1, a rotating base 2, and a fixed base 3. The rotating base 2 is mounted on the fixed base 3 so as to be rotatable relative to the fixed base 3 about a first rotating axis 21. The bottom of the measuring container 1 matches the upper end surface 22 of the rotating base 2 so that the measuring container 1 can be mounted on the rotating base 2 and rotate with the rotating base 2. The measuring container 1 is provided with a scale line 10 and a water outlet 4. The value of the scale line 10 is the volume of the liquid in the measuring container 1 when the liquid level is aligned with the scale line 10 and the water outlet 4 when the measuring container 1 is tilted. The measuring container 1 can be divided into multiple accommodating spaces by the partition 5, including at least a first accommodating space 11, a second accommodating space 12 and a third accommodating space 13. The first accommodating space 11 is provided with a first water outlet opening 41, the second accommodating space 12 is provided with a second water outlet opening 42, and the third accommodating space 13 is provided with a third water outlet opening 43. The first water outlet opening 41, the second water outlet opening 42 and the third water outlet opening 43 are arranged on the same side, so that they can be installed on the same rotating base 2, and the volume of pure water in each container can be controlled by adjusting the angle.

[0030] like Figure 2 As shown, when the rotating seat 2 is rotated to the first angle, no matter how much pure water is added to the first accommodating space 11, its volume will not change, so the volume of pure water in the first accommodating space 11 can be accurately controlled, as shown in FIG. Figure 3 As shown, for some tests, it may be necessary to add pure water to the second accommodating space 12, so the rotating seat 2 needs to be rotated to the second angle. At this time, the volume of pure water that can be accommodated in the second accommodating space 12 is also a fixed value, and pure water can be added to the second accommodating space 12 as appropriate.

[0031] like Figure 5 and Figure 6As shown, in one embodiment, the upper end surface 22 of the rotating base 2 is provided with a latch 23 or a slot 24, and the bottom of the measuring container 1 is provided with a slot 24 or a latch 23. The slot 24 matches the latch 23 so that the measuring container 1 can only be installed on the upper end surface 22 of the rotating base 2 at the same angle.

[0032] like Figure 1 and Figure 6 As shown, in one embodiment, the fixed base 3 is provided with a worm 31, and the lower end of the rotating base 2 is provided with turbine teeth 32. The worm 31 and the turbine teeth 32 match, allowing the worm 31 to drive the rotating base 2 to rotate. A handwheel 33 is provided at one end of the worm 31, allowing the worm 31 to be driven by the handwheel 33. The first rotating shaft 21 is provided with a pointer 35, and an angle scale 34 is provided at a corresponding position on the fixed base 3, so that the rotation angle of the rotating base 2 can be displayed by the pointer 35. The handwheel 33 can also be provided with a corresponding scale or pointer 35 to indicate the angle of rotation of the handwheel 33, or directly mark the rotation angle of the rotating base 2 after the handwheel 33 is turned. This can more accurately limit the angle of the rotating base 2. To ensure that the fixed base 3 is in a horizontal position, a height-adjustable support leg 36 is provided at the bottom of the fixed base 3. The fixed base 3 is also provided with a level to confirm whether it is in a horizontal position. If the fixed base 3 is not in a horizontal position, it will affect the capacity of the measuring container 1 corresponding to different angles.

[0033] As shown in Figure 2, the rotating seat 2 includes a mounting seat 25 and a driving seat 27. The mounting seat 25 is installed on the driving seat 27 through a bearing so that the mounting seat 25 can rotate relative to the driving seat 27. The mounting seat 25 or the driving seat 27 is provided with a second rotating shaft 26 so that the mounting seat 25 rotates around the second rotating shaft 26. The measuring container 1 is installed on the upper end surface 22 of the mounting seat 25 so that the measuring container 1 can rotate freely relative to the driving seat 27. In order to ensure that the water outlet opening 4 is located at the lowest position, a counterweight block 28 is provided on the mounting seat 25 so that under the action of gravity, the counterweight block 28 is always located at the lowest position of the center of gravity, and the water outlet opening 4 corresponding to the measuring container 1 is also located at the lowest position. In this way, even if the fixed seat 3 is located on a non-horizontal surface, the accurate pure water volume can be determined by observing the scale line 10 of the measuring container 1. For large-scale testing, the capacity of a certain volume can be quickly determined by placing the fixing base 3 on a horizontal surface. For higher accuracy requirements, the volume of pure water in the measuring container 1 needs to be rechecked through the scale line 10. The volume of the scale line 10 is the most standard, but the reading needs to be checked manually, which is time-consuming.

[0034] like Figure 4 and Figure 5As shown, in one embodiment, the measuring container 1 is semi-open cylindrical and is provided with an annular partition 51 and / or a square partition 52. The annular partition 51 and / or the square partition 52 divide the space within the measuring container 1 into multiple independent storage spaces, with at least one storage space surrounded by the other storage spaces. The annular partition 51 and / or the square partition 52 are removably mounted within the measuring container 1. Sealing strips are provided on the edges of the annular partition 51 and / or the square partition 52 and are secured to the measuring container 1 via the sealing strips.

[0035] like Figure 7 As shown, in one embodiment, the measuring container 1 is cylindrical and is provided with a plurality of annular partitions 51, so that it can be used in the particle size test of the focusing ring used in the wafer etching equipment. The focusing ring has sizes such as 8 inches and 12 inches. The outer ring of the measuring container 1 needs to be larger than 500 mm to ensure that it can accommodate a 12-inch focusing ring. The second annular partition 53 can be set above 260 mm to ensure that the interior can accommodate an 8-inch focusing ring. A first annular partition 54 of 120 mm can be designed at the center position. When the particle size test is performed on the 8-inch focusing ring, the first accommodation space 11 inside the first annular partition 54 and the third accommodation space 13 outside the second annular partition 53 can be used as a comparison accommodation space. The second accommodation space 12 enclosed between the first annular partition 54 and the second annular partition 53 is used to place the 8-inch focusing ring as a test accommodation space. Pure water can be injected into each space at the same time to perform the particle size test.

[0036] like Figure 4As shown, in one embodiment, the test holding space and the comparison holding space are symmetrically designed. In the figure, the left second holding space 14 and the right second holding space 15 are completely symmetrical. The left second holding space 14 is used as the test holding space, and the right second holding space 15 is used as the comparison holding space. Pure water can be added first to test the particle size difference between the left second holding space 14 and the right second holding space 15. If the difference is small, the calculation can be ignored. If the difference is large, more tests are performed and the left third holding space 13 and the right third holding space 13 are selected for comparison. If there is still a large difference in particle size, the right second holding cavity can be selected as the test holding cavity, and the left second holding space 14, the first holding space 11, the lower second holding space 16 and the right third holding space 17 are used as comparison holding cavities. The particle size of the left second holding space 14, the first holding space 11, the lower second holding space 16 and the right third holding space 17 are obtained using a liquid particle counter. The average particle size during ultrasonic cleaning is compared with the particle size of the test holding cavity. If there is a large difference, pure water is added to the left second holding space 14, the first holding space 11, the lower second holding space 16 and the right third holding space 17 at the same time for ultrasonic cleaning when testing the particle size of the silicon component sample. The particle size of the left second holding space 14, the first holding space 11, the lower second holding space 16 and the right third holding space 17 is obtained using a liquid particle counter, and the average value is taken as the particle size DLD of the comparison holding space. Then, the particle size of the left second holding space 14, the first holding space 11, the lower second holding space 16 and the right third holding space 17 is obtained, and the average particle size is calculated as the particle size ELD of pure water in the comparison holding space. After that, the surface particle size of the silicon component sample can be calculated according to the above method, that is, the surface particle size of the silicon component sample LPC=(PLD-CLD+DLD-ELD)×VD÷SAP.

[0037] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in this application can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of this application can be achieved. This is not limited herein.

[0038] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0039] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A method and device for counting particles on the surface of silicon components, characterized in that: At least the following steps are included: S1. Silicon component sample preparation: extract several silicon component samples from a batch of silicon component products, ensure that the silicon component products in this batch and the silicon component samples undergo the same process and ultrasonic cleaning treatment, and the surface area of ​​the silicon component samples is SAP; S2. Prepare the test environment. Use pure water to ultrasonically clean the measuring container (1). Then replace it with pure water of volume VD. Use a liquid particle counter to detect the particle size BLD of the pure water before cleaning. S3, silicon component sample testing, adding the silicon component sample to the measuring container (1), ultrasonic cleaning for a certain period of time, and using a liquid particle counter to detect the particle size PLD of the pure water after cleaning; S4. Data calculation: calculating the total number of particles on the surface of the silicon component sample L = (PLD-BLD) × VD; The surface particle size of the silicon component sample is calculated as LPC=(PLD-BLD)×VD÷SAP.

2. The method for counting particles on the surface of a silicon component according to claim 1, wherein: In step S2, the ultrasonic cleaning time is not less than one hour; in step S3, the ultrasonic cleaning time is not less than ten minutes.

3. The method for counting particles on the surface of a silicon component according to claim 1, wherein: During the production process of silicon component products, a smaller silicon component sample is cut, the silicon component sample is processed using the same processing technology, and an ultrasonic cleaning process is performed simultaneously.

4. The method for counting particles on the surface of a silicon component according to claim 1, wherein: The temperature of the ultrasonic cleaning process is 50℃-100℃.

5. The method for counting particles on the surface of a silicon component according to any one of claims 1 to 4, characterized in that: The measuring container (1) is provided with a plurality of independent holding spaces, wherein the holding spaces include a test holding space and a comparison holding space. Pure water of equal volume or equal proportion is added to the test holding space and the comparison holding space, and ultrasonic cleaning is performed for a certain time. A liquid particle counter is used to detect the particle size CLD of the test holding space and the particle size DLD of the comparison holding space after cleaning. The cleaned pure water is then removed, and pure water of equal volume or equal proportion is added to the test holding space and the comparison holding space. A silicon component sample is added to the test holding space, and ultrasonic cleaning is performed for the same time. A liquid particle counter is used to detect the particle size PLD of the pure water in the test holding space and the particle size ELD of the pure water in the comparison holding space after cleaning. The surface particle size LPC of the silicon component sample is calculated as (PLD-CLD+DLD-ELD)×VD÷SAP.

6. A device for counting particles on the surface of a silicon component, characterized in that: The invention comprises a measuring container (1), a rotating seat (2) and a fixed seat (3), wherein the rotating seat (2) is mounted on the fixed seat (3) in a manner that the rotating seat (2) can rotate relative to the fixed seat (3) around a first rotating axis (21), and the bottom of the measuring container (1) matches the upper end surface (22) of the rotating seat (2) so that the measuring container (1) can be mounted on the rotating seat (2) and rotate along with the rotating seat (2). The measuring container (1) is provided with a scale line (10) and a water outlet opening (4), and the value of the scale line (10) is the volume of the liquid in the measuring container (1) when the liquid level of the measuring container (1) is simultaneously flush with the scale line (10) and the water outlet opening (4) when the measuring container (1) is tilted.

7. The device for counting particles on the surface of a silicon component according to claim 6, wherein the upper end surface (22) of the rotating seat (2) is provided with a latch (23) or a slot (24), and the bottom of the measuring container (1) is provided with a slot (24) or a latch (23), and the slot (24) matches the latch (23) so that the measuring container (1) can only be installed on the upper end surface (22) of the rotating seat (2) at the same angle.

8. The device for counting particles on the surface of silicon parts according to claim 7, wherein the fixed seat (3) is provided with a worm (31), and the lower end of the rotating seat (2) is provided with turbine teeth (32), the worm (31) matches the turbine teeth (32) so that the worm (31) can drive the rotating seat (2) to rotate, and a handwheel (33) is provided at one end of the worm (31) so that the worm (31) is driven by the handwheel (33).

9. The device for counting particles on the surface of a silicon component according to any one of claims 6 to 8, wherein the measuring container (1) is in the shape of a semi-open cylinder, and a circular partition (51) and / or a square partition (52) are provided in the measuring container (1), and the circular partition (51) and / or the square partition (52) divide the space in the measuring container (1) into a plurality of independent accommodating spaces, and at least one accommodating space is surrounded by other accommodating spaces.

10. The device for counting particles on the surface of silicon parts according to claim 9, characterized in that: The annular partition (51) and / or the square partition (52) are detachably mounted in the measuring container (1).

Images