Circuit board, electronic component and electronic equipment

Abstract

The invention discloses a circuit board, an electronic component and electronic equipment, which comprises a first insulating base material layer and a transient protection layer embedded with a transient voltage pulse suppressor bare core, and is characterized in that the first insulating base material layer is connected with a bare core electrode of the transient voltage pulse suppressor bare core through a cylindrical conductive element; the bare core grounding electrode of the transient voltage pulse suppressor bare core is used for grounding. According to the invention, the transient voltage pulse suppressor bare core is adopted, and because the transient voltage pulse suppressor bare core is small in size, the transient protection layer with the transient voltage pulse suppressor bare core can be integrated with the first insulating substrate layer; a complete transient protection path from the first insulating base material layer to the cylindrical conductive element to the bare core electrode of the transient voltage pulse suppressor bare core to the bare core grounding electrode of the transient voltage pulse suppressor bare core to the grounding end is formed, so that the circuit board has a transient suppression function, and transient voltage can be suppressed; and an additional transient suppression device is not needed.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board transient protection, in particular to a circuit board, an electronic component and an electronic device. Background Art

[0002] As a core component of electronic systems, circuit boards (PCBs) encompass a wide range of types, including printed circuit boards (PCBs), flexible circuit boards (FPCs), and multilayer PCBs. They are widely used in nearly every electronics-related field, including communications, consumer electronics, industrial control, aerospace, and medical equipment. Whether high-frequency PCBs for precise signal transmission or multi-layer interconnects supporting complex circuit structures, they all utilize carefully designed conductive traces and insulating dielectrics to achieve electrical connections between electronic components and distribute signals and power, playing an irreplaceable role in ensuring the stable and efficient operation of electronic systems.

[0003] However, a significant drawback of current circuit boards is their lack of effective transient protection. During actual operation, external factors such as electrical shocks and electrostatic discharge, as well as the startup and shutdown of internal electrical components, and malfunctions, inevitably generate transient high voltages within circuits. These transient high voltages are characterized by high peak voltages, short durations, and high destructive power. Once applied to a circuit board, they can easily penetrate the insulation layer or damage circuit components, leading to faults such as short circuits and open circuits. Such failures can not only degrade the performance of individual electronic devices, but can even cause complete failure, severely impacting their normal operation. In complex electronic systems with extremely high reliability requirements, such as aerospace control systems and medical life support equipment, transient damage to circuit boards can also cause system failure, resulting in immeasurable economic losses and even life-threatening situations. Furthermore, frequent circuit board failures caused by transient high voltages significantly increase equipment maintenance costs and downtime, significantly reducing the reliability and stability of the entire electronic system.

[0004] Therefore, developing effective transient protection technologies for various types of circuit boards to solve the problem of their susceptibility to damage from transient high voltages has become a key technical challenge that needs to be overcome in the electronics field.

[0005] It should be noted that the above technical information is only intended to deepen the understanding of the overall background technology of the present invention, and should not be regarded as an admission or implication in any form that the above technical information constitutes prior art already known to those skilled in the art. Summary of the Invention

[0006] In view of the deficiencies in the above-mentioned background technology, the present invention proposes a circuit board, an electronic component, and an electronic device, and the technical problem to be solved is: how to achieve transient protection for the circuit board itself.

[0007] The technical solution of the present invention is: A circuit board includes a first insulating substrate layer and a transient protection layer embedded with a transient voltage pulse suppressor (TVPS) core. The first insulating substrate layer is connected to the bare core electrode of the TVPS core via a cylindrical conductive element. The bare core ground electrode of the TVPS core is used for grounding. This technical solution utilizes the TVPS core. Due to the small size of the TVPS core, the transient protection layer with the TVPS core can be integrated with the first insulating substrate layer. The two can be fixed by adhesive bonding, anchoring, or directly fabricated as an integrated structure. The bare core electrode of the TVPS core is connected to the first insulating substrate layer, and the bare core ground electrode is directly grounded. This forms a complete transient protection path from the first insulating substrate layer to the cylindrical conductive element to the bare core electrode of the TVPS core to the bare core ground electrode of the TVPS core to the ground terminal. This provides the circuit board with a transient suppression function, enabling transient voltage suppression without the need for additional transient suppression devices.

[0008] On the basis of the above technical solution, as a preferred technical solution for the circuit board, the cylindrical conductive element is connected to the bare core electrode through a signal sheet, and the bare core grounding electrode is connected to a grounding sheet for grounding. This technical solution provides a preferred connection method for the signal terminal and the grounding terminal of the bare core of the transient voltage pulse suppressor, which not only has a small number of components but also occupies a small space. The signal terminal is connected to the first insulating substrate layer through the signal sheet and the cylindrical conductive element in turn. The signal sheet is used for connection in the radial direction, and the cylindrical conductive element is used for connection in the axial direction. The grounding terminal is grounded through the grounding sheet, and the grounding layer is used to lead the current out of the circuit board in the radial direction. In this way, a complete transient protection path is formed, which is the first insulating substrate layer → cylindrical conductive element → signal sheet → bare core electrode of the transient voltage pulse suppressor bare core → bare core grounding electrode of the transient voltage pulse suppressor bare core → grounding sheet → grounding terminal. The circuit board has a transient suppression function and can suppress the transient voltage on the middle hole of the circuit board without the need for additional transient suppression devices.

[0009] Based on the above technical solution, as a preferred technical solution for the circuit board, when the signal sheet is located on the side of the transient protection layer facing away from the first insulating substrate layer, the ground sheet is located between the first insulating substrate layer and the transient protection layer; when the ground sheet is located on the side of the transient protection layer facing away from the first insulating substrate layer, the signal sheet is located between the first insulating substrate layer and the transient protection layer. This technical solution provides two preferred layout structures for the transient voltage pulse suppressor die, the signal sheet, and the ground sheet: the signal sheet and the ground sheet are located on either side of the transient voltage pulse suppressor die, respectively aligning with the die electrode and the die ground electrode.

[0010] Based on the above technical solution, as a preferred technical solution for the circuit board, the transient protection layer includes a protective layer insulating substrate layer for accommodating the bare core of the transient voltage pulse suppressor, the tubular conductive element connects the first insulating substrate layer, the protective layer insulating substrate layer, and the signal plate, and the tubular conductive element passes through the ground plate and is isolated from the ground plate. This technical solution not only provides a preferred arrangement of the bare core and the cylindrical conductive element of the transient voltage pulse suppressor, but also provides a preferred assembly structure of the cylindrical conductive element relative to the grounding plate. That is, a through groove for accommodating the bare core of the transient voltage pulse suppressor is provided on the protective layer insulating substrate layer, so that the bare core electrode and the bare core grounding electrode on both sides of the bare core of the transient voltage pulse suppressor can be directly attached to the signal plate and the grounding plate respectively, and through holes for the cylindrical conductive element to pass through are provided on the first insulating substrate layer, the grounding plate, the protective layer insulating substrate layer, and the signal plate. The through holes on the first insulating substrate layer, the protective layer insulating substrate layer, and the signal plate are attached to the outer peripheral surface of the cylindrical conductive element, and the diameter of the through hole on the grounding plate is much larger than the outer diameter of the cylindrical conductive element. The insulation between the cylindrical conductive element and the grounding plate is achieved by mutual isolation. In addition, insulation between the two can also be achieved by providing insulating material.

[0011] In addition to the above technical solution, a preferred technical solution for the circuit board further includes a second insulating substrate layer. The first insulating substrate layer, grounding plate, transient protection layer, signal plate, and second insulating substrate layer are arranged in sequence, and the cylindrical conductive element connects the first insulating layer, transient protection layer, signal plate, and second insulating substrate layer. This technical solution provides an even more optimized circuit board, with the first and second insulating substrate layers positioned on opposite sides. This not only secures the grounding plate, transient protection layer, and signal plate within the circuit board, but also increases the effective usable area of ​​the circuit board.

[0012] Based on the above technical solution, as a preferred technical solution for the circuit board, a grounding ring is connected to the periphery of the first insulating substrate layer, the grounding plate, the transient protection layer, the signal plate, and the second insulating substrate layer. In this way, a complete transient protection path is formed, which is the first insulating substrate layer, the second insulating substrate layer → the tubular conductive element → the signal plate → the transient voltage pulse suppressor bare core electrode → the transient voltage pulse suppressor bare core grounding electrode → the grounding plate → the grounding ring. The circuit board has a transient suppression function and can suppress transient voltages on the middle hole of the circuit board without the need for additional transient suppression devices. At the same time, the grounding plate is connected to the grounding ring to form a grounding path, which also forms an equipotential point for the entire circuit board, which can achieve a shielding effect. In addition, the grounding ring can reinforce and fix each layer structure, thereby improving the reliability of the circuit board.

[0013] On the basis of the above technical solution, as a preferred technical solution for the circuit board, the outer contours of the first insulating substrate layer, the grounding plate, the transient protection layer, and the second insulating substrate layer are the same and are all circular.

[0014] On the basis of the above technical solution, as a preferred technical solution of the circuit board, the cylindrical conductive element, the grounding plate, the signal plate, and the grounding ring are all copper elements.

[0015] An electronic component comprises the circuit board described in any one of the above technical solutions.

[0016] An electronic device comprises the circuit board described in any one of the above technical solutions.

[0017] Compared with the prior art, the circuit board, electronic components, and electronic equipment proposed in the present invention use a transient voltage pulse suppressor bare core. Taking advantage of the thin thickness and small size of the transient voltage pulse suppressor bare core, the transient voltage pulse suppressor bare core is directly integrated on the circuit board. That is, the transient protection layer with the transient voltage pulse suppressor bare core can be integrated with the first insulating substrate layer. The electrode of the transient voltage pulse suppressor bare core is connected to the first insulating substrate layer, and the ground electrode is directly grounded. In this way, a complete transient protection path is formed: first insulating substrate layer → tubular conductive element → transient voltage pulse suppressor bare core electrode → transient voltage pulse suppressor bare core ground electrode → ground end. This enables the circuit board itself to have a transient suppression function and can suppress transient voltages without the need for additional transient suppression devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0019] Figure 1 is a three-dimensional diagram of the circuit board of the present invention; Figure 2 for Figure 1 Exploded diagram; Figure 3 for Figure 2 A magnified view of the bare die of the transient voltage pulse suppressor; Figure 4 for Figure 2 Enlarged view of the cylindrical conductive element.

[0020] Description of Figure Numbers: First insulating substrate layer 1, first through hole 1-0; Cylindrical conductive element 1-1, straight cylindrical portion 1-1-1, flange 1 1-1-2, flange 2 1-1-3; Grounding plate 2, grounding plate through hole 2-1; Transient protection layer 3: Protective layer insulating base material layer 3-0, through groove 3-0-1, protective layer through hole 3-0-2; Transient voltage pulse suppressor bare core 3-1, bare core electrode 3-1-1, bare core grounding electrode 3-1-2, bare core silicon substrate 3-1-3; Signal plate 4, signal plate through hole 4-1; Second insulating substrate layer 5, second through hole 5-0; Grounding ring 6. DETAILED DESCRIPTION

[0021] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the core concept of the present invention and the following embodiments, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] The present application provides these embodiments to make this application thorough and complete, and to fully express the scope of this application to those skilled in the art. It should be noted that: unless otherwise specifically stated, the relative arrangement of parts and steps, the composition of materials, numerical expressions and numerical values ​​set forth in these embodiments should be interpreted as merely exemplary, and not as limiting.

[0023] It should be noted that, in the description of this application, unless otherwise specified, "several" means greater than or equal to two; the terms "upper," "lower," "left," "right," "inner," "outer," "axial," "radial," and the like, indicating orientations or positional relationships, are intended solely to facilitate the description of this application and simplify the description, and do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0024] In addition, the terms "first," "second," and similar terms used in this application do not denote any order, quantity, or importance, but are simply used to distinguish different parts. "Perpendicular" does not mean perpendicular in the strict sense, but rather means within the tolerance range. "Parallel" does not mean parallel in the strict sense, but rather means within the tolerance range. "Include" or "comprising" and similar terms mean that the elements preceding the word include the elements listed after the word, and do not exclude the possibility of other elements being included.

[0025] It should also be noted that in the description of this application, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be internal communication between two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances. When a specific device is described as being located between a first device and a second device, there may or may not be an intermediate device between the specific device and the first device or the second device.

[0026] All terms used in this application have the same meaning as understood by one of ordinary skill in the art to which this application belongs, unless otherwise specifically defined. It should also be understood that terms defined in, for example, common dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and should not be interpreted in an idealized or highly formal sense, unless explicitly defined as such herein.

[0027] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0028] The present invention designs a printed circuit board device with a transient protection function, which can suppress transient high voltage and avoid breakdown.

[0029] The printed circuit board assembly consists of a TVS (transient voltage pulse suppressor) bare core, a grounding copper sheet, a substrate, a signal copper sheet, etc. The printed circuit board assembly contains a TVS bare core. The TVS bare core electrode is connected to the inner hole of the printed circuit board assembly through the signal layer, and the TVS bare core ground electrode is grounded through the ground layer. In this way, the inner hole of the printed circuit board assembly is equivalent to one pole of the TVS device, and the outer electrode of the printed circuit board assembly is called the other pole of the TVS device. The printed circuit board assembly has a transient protection function.

[0030] The present invention utilizes the thin thickness and small size of the TVS bare core to directly integrate the bare core of the TVS device in the middle of the printed circuit board. The two poles of the TVS bare core are respectively connected to the signal layer and the ground layer, thus integrating the transient protection function into the printed circuit board.

[0031] The specific embodiments are as follows: A circuit board, such as Figures 1 to 4 As shown, the circuit board comprises a first insulating substrate layer 1 and a transient voltage pulse suppressor bare core 3-1 embedded therein. The first insulating substrate layer 1 is used for circuit layout and has a green oil surface. The transient voltage pulse suppressor layer 3 suppresses transient voltage pulses throughout the entire circuit board.

[0032] Specifically, the first insulating substrate layer 1 is connected to the bare core electrode 3-1-1 of the transient voltage pulse suppressor bare core 3-1 through the cylindrical conductive element 1-1, and the bare core grounding electrode 3-1-2 of the transient voltage pulse suppressor bare core 3-1 is used for grounding.

[0033] This embodiment uses a transient voltage pulse suppressor bare core 3-1. Since the transient voltage pulse suppressor bare core 3-1 is small in size, the transient protection layer 3 with the transient voltage pulse suppressor bare core 3-1 can be set as an integral whole with the first insulating substrate layer 1. The two can be fixed by bonding, fixed by anchoring, or directly made into an integrated structure. The bare core electrode 3-1-1 of the transient voltage pulse suppressor bare core 3-1 is connected to the first insulating substrate layer 1, and the bare core grounding electrode 3-1-2 is directly grounded. In this way, a complete transient protection path is formed, which is the first insulating substrate layer 1 → the tubular conductive element 1-1 → the bare core electrode 3-1-1 of the transient voltage pulse suppressor bare core 3-1 → the bare core grounding electrode 3-1-2 of the transient voltage pulse suppressor bare core 3-1 → the ground end. This enables the circuit board itself to have a transient suppression function and can suppress transient voltages without the need for additional transient suppression devices.

[0034] Preferably, this embodiment may be various circuit boards such as a printed circuit board, a flexible circuit board, and a multi-layer circuit board.

[0035] Preferably, the transient protection layer 3 includes a protective layer insulating substrate layer 3-0 for accommodating the transient voltage pulse suppressor bare core 3-1. The protective layer insulating substrate layer 3-0 is provided with a through groove 3-0-1 for accommodating the transient voltage pulse suppressor bare core 3-1. The transient voltage pulse suppressor bare core 3-1 is embedded in the through groove 3-0-1, and the bare core electrode 3-1-1 and the bare core grounding electrode 3-1-2 of the transient voltage pulse suppressor bare core 3-1 are respectively located at both ends of the through groove 3-0-1.

[0036] Preferably, the cylindrical conductive element 1-1 is made of copper and includes flange 1-1-2 and flange 2 1-1-3 at either end, and a straight portion 1-1-1 connected between flange 1-1-2 and flange 2 1-1-3. The outer periphery of the straight portion 1-1-1 contacts the walls of the openings in the first insulating substrate layer 1 and the protective insulating substrate layer 3-0. Flange 1-1-2 is used for crimping the first insulating substrate layer 1, while flange 2 1-1-3 is used for crimping the protective insulating substrate layer 3-0 and connecting to the bare electrode 3-1-1.

[0037] Preferably, the transient voltage pulse suppressor bare core 3-1 is provided with a bare core silicon substrate 3-1-3 toward the periphery of the through slot 3-0-1.

[0038] Preferably, two transient voltage pulse suppressor die 3-1 are disposed within the protective insulating substrate layer 3-0, and the corresponding embedded structures and connection structures are also provided in two groups. It should be noted that, under the guidance of the present invention, the number of transient voltage pulse suppressor die 3-1 within the protective insulating substrate layer 3-0 can be selected as appropriate, for example, one, two, three, etc.

[0039] Based on the above embodiment, as a preferred embodiment of the circuit board, the cylindrical conductive element 1-1 is connected to the bare core electrode 3-1-1 through the signal plate 4, and the bare core grounding electrode 3-1-2 is connected to the grounding plate 2 for grounding.

[0040] Preferably, the number of signal plates 4 matches the number of transient voltage pulse suppressor die 3-1, while only one ground plate 2 is preferably used, with its coverage area as large as possible within the projected coverage area of ​​the first insulating substrate layer 1 or the protective insulating substrate layer 3-0. It should be noted that the number of ground plates 2 may also be multiple.

[0041] This embodiment provides an optimal connection method for the signal terminal and the ground terminal of the transient voltage pulse suppressor bare core 3-1, which not only reduces the number of components but also takes up little space.

[0042] The bare core electrode 3-1-1 is connected to the first insulating substrate layer 1 in turn through the signal sheet 4 and the tubular conductive element 1-1. The signal sheet 4 is used for connection in the radial direction, and the tubular conductive element 1-1 is used for connection in the axial direction. The bare core grounding electrode 3-1-2 is grounded through the grounding sheet 2, and the grounding layer 2 is used to lead the current out of the circuit board in the radial direction. In this way, a complete transient protection path is formed, which is the first insulating substrate layer 1 → tubular conductive element 1-1 → signal sheet 4 → bare core electrode 3-1-1 of transient voltage pulse suppressor bare core 3-1 → bare core grounding electrode 3-1-2 of transient voltage pulse suppressor bare core 3-1 → grounding sheet 2 → grounding end. The circuit board has a transient suppression function and can suppress the transient voltage on the middle hole of the circuit board without the need for additional transient suppression devices.

[0043] Preferably, the signal sheet 4 is bonded to and welded with the bare core electrode 3-1-1, and the grounding sheet 2 is bonded to and welded with the bare core grounding electrode 3-1-2, wherein the signal sheet 4 is crimped between the flange 1-1-3 and the protective layer insulating substrate layer 3-0.

[0044] Preferably, the signal sheet 4 is provided with a signal sheet through hole 4 - 1 , and the straight tube portion 1 - 1 - 1 passes through the signal sheet through hole 4 - 1 and contacts the signal sheet through hole 4 - 1 .

[0045] Preferably, a grounding plate through hole 2-1 is provided on the grounding plate 2, and the straight tube portion 1-1-1 passes through the grounding plate through hole 2-1 and is isolated and insulated from the grounding plate through hole 2-1.

[0046] It should be noted that, in addition to the above, other connection methods that occupy less space can also be used.

[0047] Preferably, the signal sheet 4 and the ground sheet 2 are both copper sheet structures, and other sheet materials with good conductive properties can also be used.

[0048] Based on the above embodiment, as a preferred embodiment of the circuit board, when the signal plate 4 is located on the side of the transient protection layer 3 away from the first insulating substrate layer 1 , the ground plate 2 is located between the first insulating substrate layer 1 and the transient protection layer 3 .

[0049] Alternatively, when the grounding plate 2 is located on the side of the transient protection layer 3 facing away from the first insulating base layer 1 , the signal plate 4 is located between the first insulating base layer 1 and the transient protection layer 3 .

[0050] This embodiment provides two preferred layout structures between the transient voltage pulse suppressor bare core 3-1, the signal plate 4, and the ground plate 2, that is, the signal plate 4 and the ground plate 2 are respectively located on both sides of the transient voltage pulse suppressor bare core 3-1, and are respectively attached to the bare core electrode 3-1-1 and the bare core ground electrode 3-1-2.

[0051] Based on the above embodiment, as a preferred embodiment of the circuit board, the transient protection layer 3 includes a protective layer insulating substrate layer 3-0 for accommodating the transient voltage pulse suppressor bare core 3-1, and the tubular conductive element 1-1 connects the first insulating substrate layer 1, the protective layer insulating substrate layer 3-0, and the signal plate 4, and the tubular conductive element 1-1 passes through the grounding plate 2 and is isolated from the grounding plate 2.

[0052] This embodiment provides not only a preferred arrangement of the transient voltage pulse suppressor bare core 3 - 1 and the tubular conductive element 1 - 1 , but also a preferred assembly structure of the tubular conductive element 1 - 1 relative to the grounding plate 2 .

[0053] That is, a through groove is opened on the protective layer insulating base material layer 3-0 for accommodating the transient voltage pulse suppressor bare core 3-1, so that the bare core electrode 3-1-1 and the bare core grounding electrode 3-1-2 on both sides of the transient voltage pulse suppressor bare core 3-1 can be directly attached to the signal plate 4 and the grounding plate 2 respectively.

[0054] The first insulating substrate layer 1, the grounding plate 2, the protective layer insulating substrate layer 3-0, and the signal plate 4 are all provided with through holes for the cylindrical conductive element 1-1 to pass through. The through holes on the first insulating substrate layer 1, the protective layer insulating substrate layer 3-0, and the signal plate 4 are in contact with the outer peripheral surface of the cylindrical conductive element 1-1, and the diameter of the through hole on the grounding plate 2 is much larger than the outer diameter of the cylindrical conductive element 1-1. The insulation between the cylindrical conductive element 1-1 and the grounding plate 2 is achieved by mutual isolation. In addition, the insulation between the two can also be achieved by providing insulating material.

[0055] Specifically, the through-hole on the first insulating substrate layer 1 is designated as first through-hole 1-0, the through-hole on the grounding plate 2 is designated as grounding plate through-hole 2-1, the through-hole on the protective insulating substrate layer 3-0 is designated as protective layer through-hole 3-0-2, and the through-hole on the signal plate 4 is designated as signal plate through-hole 4-1. The outer wall of the straight portion 1-1 of the cylindrical conductive element 1-1 simultaneously contacts the inner walls of the first through-hole 1-0, protective layer through-hole 3-0-2, and signal plate through-hole 4-1, and is isolated from the grounding plate through-hole 2-1, achieving insulation. Furthermore, flange 1-1-2 of the cylindrical conductive element 1-1 is crimped to the outer periphery of the outer end of the first through-hole 1-0, and flange 2 1-1-3 crimps the signal plate 4 to the outer periphery of the outer end of the protective layer through-hole 3-0-2.

[0056] Based on the above embodiment, a preferred embodiment of the circuit board further includes a second insulating substrate layer 5. The first insulating substrate layer 1, the grounding plate 2, the transient protection layer 3, the signal plate 4, and the second insulating substrate layer 5 are sequentially arranged to form a multi-layer structure. The cylindrical conductive element 1-1 connects the first insulating layer 1, the transient protection layer 3, the signal plate 4, and the second insulating substrate layer 5, and is isolated from the grounding plate 2 to achieve insulation.

[0057] This embodiment provides a better circuit board. The first insulating substrate layer 1 and the second insulating substrate layer 5 are respectively located on both sides, which can not only clamp the ground plate 2, the transient protection layer 3, and the signal plate 4 inside, but also expand the effective use area of ​​the circuit board.

[0058] Preferably, the through hole on the first insulating substrate layer 1 for the cylindrical conductive element 1-1 to pass through is recorded as the second through hole 5-0, and the outer wall of the straight cylindrical portion 1-1 of the cylindrical conductive element 1-1 is in contact with the inner walls of the first through hole 1-0, the protective layer through hole 3-0-2, the signal plate through hole 4-1, and the second through hole 5-0 at the same time, and is isolated from the grounding plate through hole 2-1 to achieve insulation; at the same time, the flange 1-1-2 of the cylindrical conductive element 1-1 is crimped to the outer periphery of the outer end of the first through hole 1-0, and the flange 2 1-1-3 is crimped to the outer periphery of the outer end of the second through hole 5-0.

[0059] Based on the above embodiment, as a preferred embodiment of the circuit board, the first insulating substrate layer 1, the grounding plate 2, the transient protection layer 3, the signal plate 4, and the second insulating substrate layer 5 are connected to the periphery with a grounding ring 6, thereby forming a complete transient protection path of the first insulating substrate layer 1, the second insulating substrate layer 5 → the tubular conductive element 1-1 → the signal plate 4 → the transient voltage pulse suppressor bare core 3-1 electrode → the transient voltage pulse suppressor bare core 3-1 ground electrode → the grounding plate 2 → the grounding ring 6. The circuit board has a transient suppression function and can suppress the transient voltage on the middle hole of the circuit board without the need for additional transient suppression devices.

[0060] At the same time, the grounding plate 2 is connected to the grounding ring 6, preferably by welding, to form a grounding path, which also forms an equipotential point for the entire circuit board, thereby achieving a shielding effect. In addition, the grounding ring 6 can reinforce and fix each layer structure, thereby improving the reliability of the circuit board.

[0061] Based on the above embodiment, as a preferred embodiment of the circuit board, the outer contours of the first insulating substrate layer 1 , the grounding plate 2 , the transient protection layer 3 , and the second insulating substrate layer 5 are the same and are all circular.

[0062] On the basis of the above embodiment, as a preferred embodiment of the circuit board, the cylindrical conductive element 1 - 1 , the grounding plate 2 , the signal plate 4 , and the grounding ring 6 are all copper elements.

[0063] As a preferred embodiment of the circuit board, the relevant technical requirements are as follows: 1. The TVS bare die device is embedded in the printed circuit board substrate, and the printed circuit board insulating substrate positions and fixes the TVS bare die. The TVS bare die is much smaller than the TVS and can be placed in the printed circuit board substrate, reducing the number of protective devices on the printed circuit board, making it smaller and eliminating the need to solder devices.

[0064] 2. The printed circuit board device is mainly divided into 5 layers. The first layer is the insulating layer (insulating substrate), the second layer is the grounding layer (grounding copper sheet), the third layer is the transient protection layer (TVS bare core and insulating substrate), the fourth layer is the signal layer (signal copper sheet), and the fifth layer is the insulating layer (insulating substrate). The product is surrounded by a grounding copper ring, and the inner holes are connected to the corresponding signal copper sheets.

[0065] 3. Solder the TVS bare core ground electrode to the second ground layer (ground copper sheet), and solder the TVS bare core electrode to the signal layer (signal copper sheet). The TVS bare core ground electrode is directly connected to a larger flat ground copper sheet, and the ground copper sheet is connected to the ground copper ring.

[0066] 4. The signal copper sheet is connected to different inner hole layers on the same layer; the grounding copper ring is connected to the ground layer (grounding copper sheet), thus forming a complete transient protection path of inner hole copper layer → signal copper sheet → TVS bare core electrode → TVS bare core ground electrode → grounding copper sheet → grounding copper ring.

[0067] 5. The grounding copper ring is the common pole and is connected to the ground electrodes of all TVS bare cores.

[0068] 6. The printed circuit board device has a transient suppression function, which can suppress the transient voltage on the middle hole of the printed circuit board without the need for additional transient suppression devices.

[0069] 7. The grounding copper sheet is connected to the grounding copper ring to form a grounding path, which also creates an equipotential point for the entire printed circuit board, thus achieving a shielding effect.

[0070] 8. The space between the grounding layers is much larger than the outer diameter of the inner copper layer to achieve insulation between the signal and the ground.

[0071] 9. The grounding copper ring reinforces and fixes the 5 layers of the product to improve the reliability of the printed circuit board assembly.

[0072] An electronic component includes the circuit board described in any one of the above embodiments, so that the circuit board in the electronic component has a transient suppression function, thereby ensuring reliable operation of the circuit board and the entire electronic component.

[0073] An electronic device includes the circuit board described in any one of the above embodiments, so that the circuit board in the electronic device has a transient suppression function, thereby ensuring reliable operation of the circuit board and the entire electronic device.

[0074] Any details not provided in the present invention are conventional technical means known to those skilled in the art.

[0075] The above content shows and describes the basic principles, main features and beneficial effects of the present invention. The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the scope of protection of the present invention.

Claims

1. A circuit board, characterized in that: The invention comprises a first insulating substrate layer (1) and a transient protection layer (3) inlaid with a transient voltage pulse suppressor bare core (3-1); the first insulating substrate layer (1) is connected to a bare core electrode (3-1-1) of the transient voltage pulse suppressor bare core (3-1) through a cylindrical conductive element (1-1); and a bare core grounding electrode (3-1-2) of the transient voltage pulse suppressor bare core (3-1) is used for grounding.

2. The circuit board according to claim 1, wherein: The cylindrical conductive element (1-1) is connected to the bare core electrode (3-1-1) via a signal plate (4), and the bare core grounding electrode (3-1-2) is connected to a grounding plate (2) for grounding.

3. The circuit board according to claim 2, wherein: When the signal piece (4) is located on the side of the transient protection layer (3) facing away from the first insulating base material layer (1), the grounding piece (2) is located between the first insulating base material layer (1) and the transient protection layer (3); when the grounding piece (2) is located on the side of the transient protection layer (3) facing away from the first insulating base material layer (1), the signal piece (4) is located between the first insulating base material layer (1) and the transient protection layer (3).

4. The circuit board according to claim 2 or 3, characterized in that: The transient protection layer (3) comprises a protective layer insulating substrate layer (3-0) for accommodating a bare core (3-1) of a transient voltage pulse suppressor; the tubular conductive element (1-1) is connected to the first insulating substrate layer (1), the protective layer insulating substrate layer (3-0), and the signal plate (4); and the tubular conductive element (1-1) passes through the grounding plate (2) and is isolated from the grounding plate (2).

5. The circuit board according to claim 4, wherein: It also includes a second insulating substrate layer (5), wherein the first insulating substrate layer (1), the grounding plate (2), the transient protection layer (3), the signal plate (4), and the second insulating substrate layer (5) are arranged in sequence, and the cylindrical conductive element (1-1) connects the first insulating layer (1), the transient protection layer (3), the signal plate (4), and the second insulating substrate layer (5).

6. The circuit board according to claim 5, wherein: The first insulating base material layer (1), the grounding plate (2), the transient protection layer (3), the signal plate (4), and the second insulating base material layer (5) are peripherally connected with a grounding ring (6).

7. The circuit board according to claim 5 or 6, characterized in that: The outer contours of the first insulating substrate layer (1), the grounding plate (2), the transient protection layer (3), and the second insulating substrate layer (5) are identical and are all circular.

8. The circuit board according to claim 7, wherein: The cylindrical conductive element (1-1), the grounding plate (2), the signal plate (4), and the grounding ring (6) are all copper elements.

9. An electronic component, characterized in that: A circuit board comprising the circuit board according to any one of claims 1 to 8.

10. An electronic device, characterized in that: A circuit board comprising the circuit board according to any one of claims 1 to 8.

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