Circuit board printing device and method, electronic equipment and storage medium

Abstract

The invention discloses a circuit board printing device and method, electronic equipment and a storage medium, and relates to the technical field of printed circuits, the circuit board printing device comprises a track structure capable of achieving parallel work of multiple printing machines, board cards of different sizes are subjected to specification unification through a carrier, and initial printing board cards with small size deviation are obtained; the printed circuit boards of various sizes are obtained by performing chip mounting on the combined initial printed circuit boards through a chip mounter and welding the combined initial printed circuit boards through a welding furnace, so that the problems of low equipment utilization rate, long product switching time, high production efficiency and the like due to the fact that only one product can be produced in the same time period in one line body in the prior art are solved. According to the invention, the problems that the production efficiency is low due to the fact that the wire body stops and extra equipment and manpower are needed during wire switching and a large amount of preparation and debugging work needs to be carried out during frequent product switching are solved, and the technical effects that the equipment utilization rate and the production efficiency are improved by carrying out manual parameter adjustment without shutdown are achieved.

Description

Technical Field

[0001] The present application relates to the field of printed circuit technology, and in particular to a circuit board printing device, method, electronic device, and storage medium. Background Art

[0002] In the electronics assembly field of PCBA (Printed Circuit Board Assembly), the PCBA process requires "small, fast, and flexible" processes, meaning short work orders, fast board returns, and flexible production. This demand places higher demands on the production efficiency of SMT factories, and small production orders and frequent product changes are common problems.

[0003] In related technologies, SMT (Surface Mount Technology) production lines usually adopt the "off-line material preparation and quick line change" method, and one line can only produce one product in the same time period.

[0004] However, in the related technologies, equipment utilization is low, and the line is stagnant when switching lines; product switching time is long; producing one product occupies an additional line; production efficiency is low; additional equipment and manpower are required, and hardware costs are high. When frequently switching products, a lot of preparation and debugging work is required, resulting in low production efficiency and insufficient equipment utilization rate, which urgently needs to be improved. Summary of the Invention

[0005] The present application provides a circuit board printing device, method, electronic device and storage medium to at least solve the problem in the related art that a line can only produce one product in the same time period, the equipment utilization rate is low, the product switching time is long, and the line is stagnant when switching lines, requiring additional equipment and manpower, and when frequently switching products, a lot of preparation and debugging work is required, resulting in low production efficiency.

[0006] The present application provides a circuit board printing device, comprising: a carrier, the carrier being suitable for loading boards of different sizes based on at least two printing tasks to form initial boards that meet preset size conditions; at least two printers, each printer being suitable for printing initial boards to obtain initial printed boards based on at least two printing tasks; at least two diversion tracks, the diversion tracks being cooperatively arranged in a one-to-one correspondence with the printers, the diversion tracks being suitable for transporting initial printed boards; and multiple diversion tracks being arranged in parallel; a merging track and a merging docking station, the merging docking station being arranged at the merging end of the merging track to transport the initial printed boards of each merging track to the merging track and continue to transport the initial printed boards; a chip mounter, the merging track passing through the chip mounter to mount the initial printed boards when the initial printed boards are transported through the chip mounter via the merging track to form chip mount boards; the chip mount boards continue to be transported in the merging track; a welding furnace, the welding furnace being cooperatively arranged with the merging track to be suitable for welding the chip mount boards to obtain printed circuit boards.

[0007] The present application also provides a circuit board printing method, including: receiving at least two printing tasks, and using a carrier to load boards of different sizes based on the at least two printing tasks to form an initial board that meets preset size conditions; printing the initial board according to the at least two printing tasks to obtain an initial printed board, patching all the initial printed boards printed by the at least two printers to obtain a patch board; and welding the patch board into a corresponding printed circuit board.

[0008] The present application also provides an electronic device, comprising: a memory for storing a computer program; and a processor for implementing the steps of any of the above-mentioned circuit board printing methods when executing the computer program.

[0009] The present application also provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the steps of any of the above-mentioned circuit board printing methods are implemented.

[0010] The present application also provides a computer program product, including a computer program, which implements the steps of any of the above-mentioned circuit board printing methods when executed by a processor.

[0011] Through this application, including a track structure that can realize multiple printing machines working in parallel, the specifications of boards of different sizes are unified by a carrier to obtain initial printed boards with small size deviations from each other, and then the initial printed boards are merged, and the merged initial printed boards are mounted by a placement machine, and then welded by a welding furnace to obtain printed circuit boards of various sizes. This solves the problem in the related technology that a line can only produce one product in the same time period, the equipment utilization rate is low, the product switching time is long, and the line is stagnant when switching lines, requiring additional equipment and manpower. In addition, when frequently switching products, a lot of preparation and debugging work is required, resulting in low production efficiency. The technical effect of improving equipment utilization and production efficiency is achieved without stopping the machine for manual parameter adjustment. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0013] Figure 1 A schematic structural diagram of a circuit board printing device provided in an embodiment of the present application; Figure 2 A schematic structural diagram of a circuit board printing device provided in one embodiment of the present application; Figure 3 A schematic structural diagram of a carrier provided in one embodiment of the present application; Figure 4 An assembly diagram of a universal full-process vehicle provided by one embodiment of the present application; Figure 5 A schematic diagram of an application of a carrier provided by an embodiment of the present application; Figure 6 An embodiment of the present application provides a flowchart of a circuit board printing method.

[0014] Among them, 10-circuit board printing device, A-carrier, 100-printing machine, 100A-first printing machine, 100B-second printing machine, 200-divergence track, 301-merging track, 302-marching docking station, 400-mounting machine, 400A-first mounter, 400B-second mounter, 400C-third mounter, 400D-fourth mounter, 500-soldering furnace, 600A-first pusher, 600B-second pusher, 700A-first board box, 800B-second board box, 800-first inspection module, 900-second inspection module. DETAILED DESCRIPTION

[0015] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0016] It should be noted that, in the description of this application, the terms "comprises," "includes," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. The terms "first," "second," etc., in this application are used to distinguish similar objects, and are not used to describe a particular order or sequence.

[0017] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0018] It is understandable that circuit board printing is the core process of modern electronic manufacturing. Its process covers multiple precise links from design to finished product testing. The technical principles integrate materials science and electronic engineering, and its application areas cover strategic industries such as communications, consumer electronics, and automotive electronics.

[0019] In related technologies, printing different PCB sizes requires replacing the printing stencil and support base, switching printing programs, and performing SMT line changes. During the printing process, SMT lines must be changed, for example, using off-line material preparation, where materials are prepared in advance according to the production BOM (bill of materials) and placed on a spare feeder. When switching lines, the loaded feeder must be inserted into the equipment trolley's track and the material scanned and verified to prevent material errors.

[0020] In the actual production process, in related technologies, the PCB (Printed Circuit Board) in the board box can be pushed into the printing machine through the push rod of the board pusher; the PCB is transported to the SPI (Solder Paste Printing Inspection) through the track after printing; the qualified card is transported to the placement machine through the track for placement (Placement Machine 1 / 2 / 3 / 4 places different devices); after placement, AOI (Automated Optical Inspection) inspection (Placement effect inspection) is carried out; high-temperature reflow soldering is performed to complete SMT production.

[0021] However, in the related technologies, equipment utilization is low, and the line is stagnant when switching lines; product switching time is long; producing one product occupies an additional line; production efficiency is low; additional equipment and manpower are required, and hardware costs are high. When frequently switching products, a lot of preparation and debugging work is required, resulting in low production efficiency and insufficient equipment utilization rate, which urgently needs to be improved.

[0022] In order to solve the above problems, the embodiment of the present application can design a structure that can simultaneously produce boards of different sizes, so as to print initial boards of different sizes at the same time according to the printing task, obtain initial printed boards of corresponding sizes, and then merge the initial printed boards of different sizes. The merged initial printed boards are placed by a placement machine, and then the welding is completed by a welding furnace to obtain printed circuit boards of various sizes.

[0023] like Figure 1 FIG. 1 is a schematic structural diagram of a circuit board printing device according to an embodiment of the present application.

[0024] The circuit board printing device 10 includes: a carrier A, a printer 100 , a diverter track 200 , a merging track 301 , a merging platform 302 , a placement machine 400 and a soldering furnace 500 .

[0025] Specifically, the carrier A is suitable for loading boards of different sizes based on at least two printing tasks to form initial boards that meet preset size conditions.

[0026] At least two printing presses 100, each printing press 100 is adapted to print initial boards to obtain initial printed boards based on at least two printing jobs.

[0027] At least two diverter tracks 200 are provided in a one-to-one correspondence with the printing machine 100 . The diverter tracks 200 are suitable for transporting initial printed boards. A plurality of diverter tracks 200 are provided in parallel.

[0028] The merging track 301 and the merging docking station 302 are provided at the merging end of the merging track 301 to transport the initial printed boards of each diverging track to the merging track 301 and continue to transport the initial printed boards.

[0029] The placement machine 400 and the merging track 301 pass through the placement machine 400 so as to perform placement on the initial printed board when the initial printed board is transported through the placement machine 400 via the merging track 301 to form a placement board; the placement board continues to be transported in the merging track 301.

[0030] The welding furnace 500 is cooperatively arranged with the merging track 301 to be suitable for welding the patch board to obtain a printed circuit board.

[0031] It is understandable that the boards to be printed for different printing tasks may have inconsistent sizes. In order to achieve parallel processing of boards of different sizes, the embodiment of the present application can unify the sizes of boards of different sizes through carrier A.

[0032] In the embodiment of the present application, the carrier A can be assembled according to boards of different sizes, so that the sizes of the initial boards formed after assembly remain consistent, or the size deviation is within a certain range, thereby facilitating subsequent processing.

[0033] The printer 100 can be a printer for printing circuit boards. Multiple printers 100 can be arranged side by side, and each printer 100 can work independently or collaboratively to achieve the simultaneous printing of initial boards of multiple sizes, or the unified printing of initial boards of the same size to improve printing efficiency.

[0034] The printer 100 can be set on the diversion track 200, and each diversion track 200 can pass through a printer 100, so that when the printer 100 performs a printing task, the initial card can be transported by the diversion track 200 and flow into the corresponding printer 100, and after printing, the initial printing card of the corresponding size can be output.

[0035] At least two diverter tracks 200 can merge at one point to form a merge track 301. Specifically, after multiple printers 100 output initial printed boards, multiple initial printed boards of different sizes can continue to be transported along the diverter tracks 200 until they are transported to the track merge point, that is, the merge end of the merge track 301, until the merge is completed. During the merge, the initial printed boards of different sizes can be staggered and merged according to the different speeds of each diverter track 200, or according to the different feeding timings of each diverter track 200.

[0036] The merging track 301 can be understood as an automated transmission track, which is used to converge the output ends of multiple printing machines 100 to the same path. The merging docking station 302 can be set at the merging end to transport the initial printed boards on each diversion track 200 to the merging track, thereby realizing the merging of the initial printed boards output by multiple printing machines 100.

[0037] A printing task can be a set of instructions that includes circuit design parameters (such as line width, line spacing, number of layers), material specifications (substrate type, copper foil thickness) and quality requirements.

[0038] During actual execution, this embodiment of the present application can receive at least two printing tasks (possibly from different orders or product requirements). Based on the printing tasks, it controls multiple printers 100 to perform tasks in parallel. For example, multiple printers 100 can simultaneously process printing tasks for boards of different sizes, improving efficiency; or multiple printers 100 can focus on completing printing tasks for boards of the same size. After printing, the initial printed boards are collected via a converging track and enter subsequent processes.

[0039] The embodiment of the present application shortens the overall production cycle by having multiple printers 100 working simultaneously, reduces manual intervention through automated merging, accelerates the flow of boards and cards, enhances flexibility, and has high dimensional compatibility.

[0040] Optionally, in one embodiment of the present application, the circuit board printing device 10 further includes: a control component.

[0041] The control component identifies at least one target printing press 100 from the at least two printing presses 100 according to the at least two printing tasks, so as to control the at least one target printing press 100 to print.

[0042] As a possible implementation method, the control component in the embodiment of the present application may be a core control unit of the circuit board printing device 10 , which is responsible for task scheduling, equipment coordination and status monitoring.

[0043] The control component receives the printing task and confirms the printing machine 100 used for processing this task based on the printing task, that is, the target printing machine 100, wherein the confirmation logic may include: an idle printing machine 100, a printing machine 100 whose historical printing plate size is similar to the printing task, etc.

[0044] Through intelligent scheduling, the embodiments of the present application can optimize equipment utilization and reduce restriction time.

[0045] Optionally, in one embodiment of the present application, the circuit board printing device 10 further includes: a first inspection module and a first control module.

[0046] The first inspection module is used to capture the first barcode on the initial printed board to confirm whether the initial printed board meets the first preset solder paste printing qualification condition.

[0047] The first control module is used to allow the initial printed boards that meet the first preset solder paste printing qualification conditions to be merged into the placement machine 400 for placement, if the initial printed boards meet the first preset solder paste printing qualification conditions. Otherwise, the current confirmation process is interrupted, and the corresponding printing fault is confirmed based on the first barcode.

[0048] It is understood that the first inspection module is a quality inspection unit in a printed circuit board (PCB) production line, such as SPI (solder paste print inspection), and typically integrates machine vision, laser scanning, or spectral analysis technology. The first inspection module can use a camera or barcode scanner to read the first barcode on the initial printed board (a unique identifier printed on the edge of the initial printed board, containing information such as production batch, model, and process parameters) to perform solder paste inspection on the board. The first preset solder paste print qualification criteria can be set accordingly based on the production line and printing task, and are not specifically limited here.

[0049] After the inspection result is obtained, if the inspection is qualified, it is confirmed that the initial printed board can enter the next process to be merged with the qualified initial printed boards output by other printers 100 to the placement machine 400; If the inspection fails, the current inspection process (confirmation process) is interrupted, and the reason for the failure is confirmed based on the first barcode.

[0050] In addition, the embodiment of the present application can remind technicians to remove unqualified initial printed boards and cards when the process is interrupted, or it can continue to transport the unqualified initial printed boards and cards to the outside of the first inspection module after the interruption, and then remove the unqualified initial printed boards and cards through robot linkage and store them in a unified unqualified material pile so that the reasons for the failure can be summarized later.

[0051] The embodiment of the present application can perform pre-quality control and conduct an inspection before patching to avoid component waste. Unqualified products can be counted to facilitate subsequent process improvements.

[0052] The chip mounter 400 is used to mount chips on all the initial printed boards printed by at least two printers 100 to obtain chip mount boards.

[0053] Among them, the placement machine 400 is the core equipment in the surface mount technology (SMT) production line. Specifically, it can be a placement machine that is responsible for accurately placing electronic components (such as chips, resistors, and capacitors) onto the pads of the PCB board.

[0054] In actual implementation, at least two printers 100 work in parallel to process initial printed boards of different sizes. As a post-process, the chip mounter 400 performs chip placement on the initial printed boards output by all printers 100.

[0055] Optionally, in one embodiment of the present application, the circuit board printing device 10 further includes: a second inspection module and a second control module.

[0056] The second inspection module is used to capture the second barcode on the patch board to confirm whether the patch board meets the second preset solder paste printing qualification condition.

[0057] The second control module is used to allow the patch board that meets the second preset solder paste printing qualification condition to run to the welding furnace 500 when the patch board meets the second preset solder paste printing qualification condition; otherwise, interrupt the current confirmation process and confirm the corresponding patch fault based on the second barcode.

[0058] As a possible implementation method, the second inspection module of the embodiment of the present application can use AOI (automatic optical inspection) technology to perform quality inspection on the board after the patch.

[0059] Among them, AOI technology is based on optical principles. By comparing the actual image with the standard template, it automatically detects information such as the shape, size, and position of the solder joints. It can detect micron-level solder joint defects and device misalignment.

[0060] The embodiment of the present application can perform quality inspection on patch boards. After the inspection is qualified, the patch boards will flow into the next process. If the inspection fails, the current inspection process (confirmation process) will be interrupted, and the reason for the failure will be confirmed based on the second barcode.

[0061] In addition, the embodiment of the present application can remind technicians to remove unqualified patch boards when the process is interrupted, and can also continue to transport unqualified patch boards to the outside of the second inspection module after the interruption, and then remove the unqualified patch boards through robot linkage and store them in a unified unqualified material pile so that the reasons for the failure can be summarized later to avoid the double loss of components and PCBs caused by the flow of defective boards into welding.

[0062] The welding furnace 500 is used to weld the SMD boards into corresponding printed circuit boards.

[0063] The soldering oven 500 may be a reflow oven, which melts solder paste and forms reliable electrical and mechanical connections through a precisely controlled temperature curve.

[0064] Optionally, in one embodiment of the present application, the welding furnace 500 includes: a determination unit, a first debugging unit, and a second debugging unit.

[0065] The determining unit is used to determine the original board size and quantity of the patch board based on the printing task.

[0066] The first debugging unit is used to debug corresponding first reflow soldering parameters based on the size of the patch board when the number of the original board size is one, so as to solder each patch board using the first reflow soldering parameters.

[0067] The second debugging unit is used to debug the corresponding second reflow soldering parameters based on the sizes of all the patch boards when the number of original board sizes is not one, so as to solder each patch board using the second reflow soldering parameters.

[0068] During the reflow process, the relevant parameters involved may include: Temperature curve: including preheating zone (such as 150-180℃), reflow zone (such as 220-245℃), and cooling zone (such as <50℃ / s).

[0069] Atmosphere control: Nitrogen protection is optional to reduce solder joint oxidation.

[0070] Hot air convection: ensure temperature uniformity (such as ±2°C) through forced hot air circulation.

[0071] Generally speaking, during the soldering process, there are three stages: preheating stage: gradually increasing the temperature to activate the flux and reduce thermal shock; reflow stage: the solder paste melts to form solder joints, and the components and PCB are electrically / mechanically connected; cooling stage: rapid cooling to solidify the solder joints and avoid the formation of brittle phases.

[0072] When the size of the patch panels to be soldered is uniform, the first reflow parameters of the embodiment of the present application can generate a unique temperature curve based on the original board size of the patch panel (i.e., the board size when not loaded onto carrier A), component density, heat capacity and other parameters.

[0073] When the original board sizes of the patch boards to be soldered are not uniform, the second reflow soldering parameters of the embodiment of the present application can be determined based on multiple original board sizes. For example, compatibility modeling is performed to balance the thermal requirements of boards of different sizes (such as large boards require longer preheating time, and small boards need to avoid overheating); dynamic zoning: setting temperature zones in the reflow soldering furnace (such as a high-temperature zone in the front section and a low-temperature zone in the back section) to achieve differentiated heating.

[0074] The embodiment of the present application can achieve universal processing of boards of multiple sizes to optimize production efficiency, reduce the frequency of line changes, and eliminate the need to configure multiple welding furnaces 500 to reduce costs.

[0075] It should be noted that, since the size of the initial board can be unified by carrier A in the embodiment of the present application, the reflow parameters can also be set according to the unified size of the initial board, which simplifies the parameter adjustment scheme.

[0076] Optionally, in one embodiment of the present application, the welding furnace 500 further includes: an evaluation unit and a control unit.

[0077] The evaluation unit is used to evaluate the performance parameters of the SMD board of each original board size under the second reflow parameters.

[0078] The control unit is used to terminate the welding action and stop the operation of the merging track when the performance parameters of at least one patch board of the original board size do not meet the preset performance conditions.

[0079] Among them, the quantitative indicators of welding quality can include solder joint reliability: void rate, wetting angle, shear force; electrical performance: resistance value, capacitance value, insulation resistance; mechanical properties: board warpage, component offset, etc.

[0080] In the embodiment of the present application, the performance parameters can refer to the above-mentioned quantitative indicators and be determined in combination with the actual function and parameters of the board. Those skilled in the art can set corresponding quality thresholds to determine whether the performance parameters meet certain performance conditions.

[0081] The control unit can take subsequent actions based on the judgment results. For example, in the case of qualified results, the performance of all size boards meets the standards and continues to be transmitted to the next process (such as testing and assembly); in the case of unqualified results, if the performance of any size board does not meet the standards, the following operations will be triggered: terminate soldering, stop reflow oven heating to avoid more defective products, stop merging tracks, block defective boards from flowing into subsequent processes, prevent the spread of batch defects, issue alarm notifications, and send real-time alerts to operators.

[0082] Optionally, in one embodiment of the present application, the welding furnace 500 further includes: an optimization unit.

[0083] Among them, the optimization unit is used to optimize the second reflow parameters based on the performance parameters when the performance parameters of the patch boards of at least one original board size do not meet the preset performance conditions, until the performance parameters of the patch boards of all sizes can meet the preset performance conditions.

[0084] During the actual execution process, the optimization unit can dynamically adjust the reflow process parameters based on the real-time feedback performance parameters.

[0085] For example, the embodiments of the present application can train prediction models (such as support vector machines and neural networks) based on historical data, establish parameter-performance mapping relationships, use heuristic algorithms such as genetic algorithms and particle swarm optimization to search for the optimal solution in the parameter space, and communicate with the reflow oven through industrial protocols such as OPC UA to achieve real-time parameter distribution and effect verification.

[0086] Optionally, in one embodiment of the present application, the carrier A includes: a first bracket, a second bracket and a limiting member.

[0087] Among them, the first bracket and the second bracket are arranged on the second bracket movably along the width direction of the board.

[0088] The limiter can selectively connect the first bracket and the second bracket to limit the relative movement of the first bracket and the second bracket to limit the width of the carrier A so that the size difference of the initial boards corresponding to at least two printing tasks is within a preset range.

[0089] It is understandable that when the boards and cards are circulating on the diverter track 200 and the merge track 301 , they need to be fixed by a carrier to prevent the boards and cards from seriously deviating from the track during transportation.

[0090] Since the embodiment of the present application can simultaneously process boards of different sizes, in order to accommodate boards of different sizes, a carrier with freely configurable sizes is provided so that boards of different sizes processed in parallel can form initial boards of similar sizes with the assistance of carrier A.

[0091] Among them, carrier A can be composed of a first bracket and a second bracket. The first bracket and the second bracket have various length sizes. According to different board sizes, the embodiment of the present application can configure the first bracket and the second bracket of corresponding sizes.

[0092] In order to increase the firmness and reliability of the carrier, the first bracket and the second bracket of the embodiment of the present application are provided with limiting members, such as limiting holes, so that the carrier composed of the first bracket and the second bracket can be fine-tuned according to the size of the board to achieve stable fixation while ensuring that boards of different board sizes can be loaded through carrier A to form initial boards with size deviations less than a certain range. The preset interval can be set accordingly according to the track width, board size, etc., and no specific restrictions are made here.

[0093] Combine Figures 2 to 5 As shown, the working principle of the circuit board printing device 10 of the embodiment of the present application is described in detail using an embodiment.

[0094] like Figure 2 As shown, taking two printers 100 as an example, the circuit board printing device 10 of the embodiment of the present application includes: a carrier A, a first printer 100A, a second printer 100B, a diversion track 200, a merging track 301, a merging docking station 302, a placement machine 400 (including a first placement machine 400A, a second placement machine 400B, a third placement machine 400C, and a fourth placement machine 400D), a welding furnace 500, a first pusher 600A, a second pusher 600B, a first board collection box 700A, a second board collection box 700B, a first inspection module 800, and a second inspection module 900.

[0095] One production line is equipped with two printers 100, which are paralleled during patching. This allows the other printer 100 to operate normally when changing to another product, without stopping the entire production line.

[0096] like Figure 2 The left side board placement station has two printing machines 100 arranged side by side, which can print two different boards at the same time.

[0097] The embodiment of the present application can automatically determine the product type when capturing the barcode, and retrieve the corresponding parameters from the device parameter library to ensure that the parameters used are consistent with the actual product, thereby meeting the needs of producing two products at the same time.

[0098] In the embodiment of the present application, printing, patch and reflow soldering share the same carrier A, which can save fixture costs. At the same time, the common furnace temperature can be debugged to meet the needs of different products using the same reflow soldering parameters.

[0099] In actual implementation, the embodiment of the present application can use a full-process carrier with the same outer frame for PCBA products of different sizes. This design allows PCBs of different sizes to share the equipment track, avoiding a dual-track design and reducing equipment costs.

[0100] Vehicle A design can be as follows Figures 3 to 5 As shown, Figure 3 is a schematic diagram of various components of vehicle A; Figure 4 Schematic diagram of the combined effect; Figure 5 Schematic diagram after placement of PBC.

[0101] Among them, the various components of carrier A (the first bracket and the second bracket) can be divided into a track side (length side) and a non-track side (width side). The track side is parallel to the diversion track 200 and the merging track 301, and the non-track side is perpendicular to the diversion track 200 and the merging track 301. The non-track side is provided with a sunken step for fixing boards and cards. For boards and cards of different widths, especially smaller boards and cards, the embodiment of the present application can select non-track sides of different sizes for assembly, and fine-tune the width size through the limiting parts, that is, the width adjustment grooves, so that the boards and cards can be stably fixed on the carrier, and boards and cards of different sizes can form initial boards and cards of similar sizes.

[0102] The production process of the embodiment of the present application is as follows: The push rods of the first and second PCB pushers 600A and 600B push the two PCBs in the first and second pallet boxes 700A and 700B into the first and second printing presses 100A and 100B (the PCBs have been placed on the carrier).

[0103] The first printer 100A prints a PCB; the second printer 100B prints a PCB (printing with a carrier).

[0104] After printing, the track transports the PCB to the first inspection module 800 through the track. The SPI uses the visual system to capture the corresponding barcode on the PCB (different barcodes correspond to different boards) and automatically calls the relevant program to perform solder paste inspection on the board.

[0105] The initial printed boards that have passed the inspection are combined into a merging track 301 by the two diverting tracks 200 through the track combining platform 302 .

[0106] The merging track 301 is transported to the placement machine 400 for placement (the placement machines 400A / 400B / 400C / 400D place different components). The placement machine 400 uses the visual system to capture the corresponding barcode on the PCB (different barcodes correspond to different boards) and automatically calls the relevant program to load the board.

[0107] After patching, the second inspection module 900 is used to perform AOI inspection (patch effect inspection). The AOI captures the corresponding barcode on the PCB through the visual system (different barcodes correspond to different boards) and automatically calls the relevant program to perform solder paste inspection on the patch board.

[0108] High-temperature reflow soldering (the two PCBs are adjusted to the same width through carrier A and can share the same reflow oven).

[0109] Complete SMT production (output two types of PCBA at the same time).

[0110] In summary, the dual-printing machine design of the embodiment of the present application can print two products at the same time, avoid production interruptions caused by frequent line changes, and realize the simultaneous production of two products on one line, reducing equipment idle time and avoiding the impact of line switching on production time; SPI automatically calls the relevant program to inspect the board by grabbing the corresponding barcode on the PCB through the visual system (different barcodes correspond to different boards). It can automatically identify the board and automatically call the corresponding program, and can detect two boards at the same time; the track docking station merges the two tracks into one track, and can adapt to all sizes of boards through a universal full-process carrier, so that PCBs of different sizes share the same track width and the same reflow oven temperature. The common reflow oven temperature is set to meet the simultaneous production requirements and reduce hardware and fixture costs; the placement machine automatically calls the corresponding production program by grabbing the barcode device of different products to ensure that the equipment parameters for the simultaneous production of two products are correct, and the AOI automatically calls the relevant program to inspect the board by grabbing the corresponding barcode on the PCB through the visual system (different barcodes correspond to different boards). It can automatically identify boards and cards, automatically call up corresponding programs, and can test two boards and cards at the same time.

[0111] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus the necessary general hardware platform, and of course it can also be implemented by hardware, but in many cases the former is a better implementation method.

[0112] The embodiment of the present application also provides a circuit board printing method, such as Figure 6 As shown, the circuit board printing method includes the following steps: In step S601 , at least two printing tasks are received, and boards of different sizes are loaded on a carrier based on the at least two printing tasks to form an initial board that meets a preset size condition.

[0113] In step S602, initial boards are printed according to at least two printing tasks to obtain initial printed boards, and patches are applied to all the initial printed boards printed by at least two printers to obtain patch boards.

[0114] In step S603, the SMD board is welded into a corresponding printed circuit board.

[0115] For the description of the features in the embodiment corresponding to the circuit board printing method, reference can be made to the relevant description of the embodiment corresponding to the circuit board printing device, and no further details will be given here.

[0116] An embodiment of the present application further provides an electronic device, including a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program to execute the steps of any of the above-mentioned circuit board printing method embodiments.

[0117] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored. The computer program is configured to execute the steps of any of the above-mentioned circuit board printing method embodiments when running.

[0118] In an exemplary embodiment, the computer-readable storage medium may include, but is not limited to, various media that can store computer programs, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk, or an optical disk.

[0119] An embodiment of the present application further provides a computer program product, which includes a computer program. When the computer program is executed by a processor, the steps of any of the above-mentioned circuit board printing method embodiments are implemented.

[0120] An embodiment of the present application further provides another computer program product, including a non-volatile computer-readable storage medium, wherein the non-volatile computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of any of the above-mentioned circuit board printing method embodiments are implemented.

[0121] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the above description has generally described the components and steps of each example according to their functions. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0122] The above describes in detail the circuit board printing device, method, electronic device, and storage medium provided by this application. Specific examples are used herein to illustrate the principles and implementation methods of this application. The description of the above embodiments is intended only to facilitate understanding of the method and core concepts of this application. It should be noted that those skilled in the art may make various improvements and modifications to this application without departing from the principles of this application, and such improvements and modifications fall within the scope of protection of the claims of this application.

Claims

1. A circuit board printing device, characterized in that: include: A carrier, the carrier being adapted to load boards of different sizes based on at least two printing tasks to form initial boards that meet preset size conditions; at least two printing presses, each of the printing presses being adapted to print the initial plates to obtain initial printed plates based on at least two printing jobs; At least two diversion tracks, each of which is provided in a one-to-one correspondence with the printing press, and is suitable for transporting the initial printed boards; and a plurality of the diversion tracks are provided in parallel; A merging track and a merging docking station, wherein the merging docking station is arranged at the merging end of the merging track to transport the initial printed boards of each of the diverging tracks to the merging track and continue to transport the initial printed boards; A chip mounter, wherein the merging track passes through the chip mounter, so as to mount the initial printed board card when the initial printed board card is transported through the merging track through the chip mounter to form a chip mount board card; The patch board is continuously transported in the merging track; A welding furnace is provided in cooperation with the merging track, and is suitable for welding the patch board to obtain a printed circuit board.

2. The circuit board printing device according to claim 1, characterized in that: Also includes: A control component identifies at least one target printing press from the at least two printing presses according to the at least two printing tasks, so as to control the at least one target printing press to print.

3. The circuit board printing device according to claim 1, characterized in that: Also includes: A first inspection module is configured to capture a first barcode on the initial printed board to confirm whether the initial printed board meets a first preset solder paste printing qualification condition; The first control module is used to allow the initial printed board that meets the first preset solder paste printing qualification condition to be merged into the placement machine for placement, if the initial printed board meets the first preset solder paste printing qualification condition; otherwise, interrupt the current confirmation process and confirm the corresponding printing fault based on the first barcode.

4. The circuit board printing device according to claim 1, characterized in that: Also includes: A second inspection module is used to capture the second barcode on the patch board to confirm whether the patch board meets the second preset solder paste printing qualification condition; The second control module is used to allow the patch board that meets the second preset solder paste printing qualification condition to run to the welding furnace when the patch board meets the second preset solder paste printing qualification condition; otherwise, interrupt the current confirmation process and confirm the corresponding patch fault based on the second barcode.

5. The circuit board printing device according to claim 1, characterized in that: The welding furnace comprises: A determining unit, configured to determine the original board size and quantity of the patch board based on the printing task; A first debugging unit is configured to debug corresponding first reflow parameters based on the size of the patch board when the number of the original board size is one, so as to solder each patch board using the first reflow parameters; The second debugging unit is used to debug the corresponding second reflow soldering parameters based on the sizes of all the patch boards when the number of the original board sizes is not one, so as to solder each patch board using the second reflow soldering parameters.

6. The circuit board printing device according to claim 5, characterized in that: The welding furnace also includes: An evaluation unit, configured to evaluate performance parameters of the SMD board of each original board size under the second reflow parameters; The control unit is used to terminate the welding action and stop the operation of the merging track when the performance parameters of at least one patch board of the original board size do not meet the preset performance conditions.

7. The circuit board printing device according to claim 6, characterized in that: The welding furnace also includes: The optimization unit is used to optimize the second reflow soldering parameters based on the performance parameters of the patch boards of at least one original board size if the performance parameters do not meet the preset performance conditions, until the performance parameters of the patch boards of all sizes can meet the preset performance conditions.

8. The circuit board printing device according to claim 1, characterized in that: The carrier includes: a first bracket and a second bracket, wherein the first bracket is movably disposed on the second bracket along a width direction of the board; A limiter, which can selectively connect the first bracket and the second bracket to limit the relative movement of the first bracket and the second bracket to limit the width of the carrier so that the size difference of the initial boards corresponding to the at least two printing tasks is within a preset range.

9. A circuit board printing method, characterized in that: The circuit board printing device according to any one of claims 1 to 8 comprises: receiving at least two printing tasks, and using a carrier to load boards of different sizes based on the at least two printing tasks to form an initial board that meets a preset size condition; Printing the initial boards according to at least two printing tasks to obtain initial printed boards, patching all the initial printed boards printed by at least two printers to obtain patch boards; The patch board is welded into a corresponding printed circuit board.

10. An electronic device, characterized in that: include: memory for storing computer programs; A processor is configured to implement the steps of the circuit board printing method as claimed in claim 9 when executing the computer program.

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