Tesla valve micro-channel phase change heat dissipation device based on bifurcate structure
By adopting a two-pronged Tesla valve design in a microchannel heat dissipation device, the problems of steam reverse interference and insufficient mixing of liquid working fluids are solved, and uniform fluid diversion and efficient heat dissipation are achieved, which is suitable for a variety of electronic components.
Patent Information
- Application Number
- CN202510758012.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-09
- Publication Date
- 2025-09-12
AI Technical Summary
In existing microchannel heat dissipation devices, steam reversely interferes with phase change mass transfer during the phase change process, and insufficient mixing of the liquid working fluid leads to local overheating, reducing heat dissipation efficiency.
The Tesla valve microchannel design based on a bifurcated structure is adopted, including a substrate and a liner. A one-way microchannel module is etched on the liner. The Tesla valve structure is used for unidirectional flow guidance to prevent steam backflow and crosstalk, ensuring uniform fluid diversion and mixing.
It improves the heat transfer efficiency, avoids steam backflow crosstalk, achieves uniform diversion and full mixing of the fluid, improves the heat dissipation uniformity and efficiency, and is suitable for electronic components of different sizes and heat output.
Smart Images
Figure CN120640611A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of phase change heat dissipation, and in particular to a Tesla valve microchannel phase change heat dissipation device based on a bifurcated structure. Background Art
[0002] As the integration of electronic devices continues to increase, their heat dissipation needs are also growing rapidly. Traditional heat dissipation devices are no longer able to meet the growing heat dissipation needs, and the available space for heat dissipation devices is becoming increasingly limited, which urgently requires heat dissipation devices to develop in the direction of miniaturization.
[0003] Microchannel heat sinks are becoming increasingly important in the heat dissipation field due to their significant advantages, such as high heat dissipation efficiency and low space occupancy. Currently, existing microchannel heat sinks mostly use complex structures such as serpentine channels and manifolds to replace simple straight channels, thereby improving heat transfer performance. However, as the heat flux density of electronic components continues to increase, liquid working fluids are more susceptible to phase change due to heat in microchannels. The vapor generated by the phase change will have a reverse interference with the phase change mass transfer process; at the same time, it is difficult for the liquid working fluid to achieve sufficient mixing in the microchannel, resulting in local overheating and ultimately reducing the heat dissipation efficiency of the microchannel. Summary of the Invention
[0004] The purpose of the present invention is to provide a Tesla valve microchannel phase change heat dissipation device based on a bifurcated structure to solve the problem that the steam generated by the phase change mentioned above will cause reverse interference to the phase change mass transfer process; at the same time, the liquid working fluid is difficult to achieve sufficient mixing in the microchannel, resulting in local overheating, and ultimately reducing the heat dissipation efficiency of the microchannel.
[0005] To achieve the above object, the present invention provides the following technical solutions:
[0006] A Tesla valve microchannel phase change heat dissipation device based on a bifurcated structure, comprising:
[0007] A substrate, wherein a chamber is formed in the substrate, and a plurality of liquid outlets are formed at the edge of the chamber, wherein the chamber is used to collect gaseous fluid and liquid fluid generated by the phase change fluid, and the gaseous fluid and liquid fluid are discharged through the liquid outlets;
[0008] The lining plate is integrally formed in the chamber, a liquid inlet is opened in the middle of the lining plate, a one-way microchannel module is etched in the lining plate, the liquid inlet is connected to the liquid inlet end of the one-way microchannel module, the liquid outlet end of the one-way microchannel module is connected to the chamber, the one-way microchannel module has a plurality of Tesla valve structures, the one-way microchannel module is used for unidirectional flow of phase change fluid and prevent steam backflow crosstalk, so that the phase change fluid can circulate in one direction to dissipate heat.
[0009] As a further solution of the present invention: the one-way microchannel module includes several hexagonal units composed of Tesla valve structures, wherein the central channel of the Tesla valve structure constitutes a hexagon, the arc channel of the Tesla valve structure is located on the inner side of the hexagon, the hexagonal unit is an equilateral unequal-angle hexagonal unit, and the one-way microchannel module is composed of equilateral unequal-angle hexagonal units arranged in a ring and in a binary branching manner, and the Tesla valve structure is used to guide the fluid in a one-way direction.
[0010] As a further solution of the present invention: the opposite sides of the equilateral unequal angle hexagonal units are kept parallel, the inner angle of the central end of the annular distribution of the equilateral unequal angle hexagonal units is α, wherein the number of annular distribution of the equilateral unequal angle hexagonal units in the center of the one-way microchannel module is The M equilateral unequal-angled hexagonal units are connected in an overlapping circular arrangement with the central end as the center to form a first unit layer; the equilateral unequal-angled hexagonal units outside the first unit layer are arranged in a binary branching manner to expand into a second unit layer, a third unit layer...n unit layers, where n≥3.
[0011] As a further solution of the present invention: the arc channels of the multiple Tesla valve structures within the equilateral unequal-angle hexagonal unit are symmetrical about the symmetry axis of the equilateral unequal-angle hexagonal unit, and the angles between the arc channels of the Tesla valve structure and the central channel group are equal.
[0012] As a further solution of the present invention: the one-way microchannel module also includes a supplementary unit, which is composed of equilateral unequal-angle hexagonal units arranged in a binary branching manner, and the supplementary unit is arranged in a spacing space formed by the equilateral unequal-angle hexagonal units arranged in a ring shape and in a binary branching manner.
[0013] As a further solution of the present invention: the upper portion of the one-way microchannel module is an open boundary, and the upper portion of the one-way microchannel module is in direct contact with the heat source surface of the electronic component to form a closed flow channel.
[0014] As a further solution of the present invention: the lining plate is circular.
[0015] As a further solution of the present invention: the material of the substrate and the liner is any one of copper, silicon or flexible polyimide, so as to be suitable for heat dissipation of rigid or flexible electronic devices.
[0016] As a further solution of the present invention: the arc channel of the Tesla valve structure has a depth of 100-200 μm and a width of 50-150 μm, and the central channel of the Tesla valve structure has a depth of 100-200 μm and a width of 50-150 μm.
[0017] As a further solution of the present invention: the phase change fluid is a low-boiling-point fluorinated liquid, and the phase change temperature of the phase change fluid is 40-80°C.
[0018] Compared with the prior art, the present invention has the following beneficial effects:
[0019] 1. In the present invention, a one-way microchannel module is etched on the lining plate, and the one-way microchannel modules are evenly distributed on the lining plate. After the phase change fluid is injected into the liquid inlet of the lining plate, the fluid phase changes into a gas phase fluid and a liquid phase fluid. The Tesla valve structure in the one-way microchannel module can utilize the dynamic effect of the fluid to produce a certain resistance difference when the fluid passes through, thereby realizing the one-way flow of the fluid, so that the cooling phase change fluid can be more evenly diverted and fully mixed, effectively avoiding the situation where the liquid is locally heated. At the same time, the anti-backflow characteristics of the Tesla valve structure also effectively avoid the generation of steam backflow crosstalk in the phase change process, avoid the problem of uneven heat dissipation caused by fluid chaos, and improve the heat transfer efficiency.
[0020] 2. In the present invention, a chamber is opened in the substrate, and the electronic components that need to dissipate heat are clamped in the chamber, so that the heat source surface of the electronic components can be embedded in the chamber. At the same time, the heat source surface of the electronic components directly contacts the upper open boundary of the one-way microchannel module. The heat source surface and the substrate are combined to form a closed flow channel, which effectively shortens the heat transfer path. After the phase change fluid introduced at the liquid inlet exchanges heat, the phase change fluid forms a phase change fluid after being heated. The gas phase fluid and the liquid phase fluid are collected through the chamber and discharged through the liquid outlet. The liquid outlet on the back of the substrate is connected to the pipeline, and the fluid is then discharged through the pipeline to complete the rapid heat dissipation of the electronic components.
[0021] 3. In the present invention, the first unit, the second unit layer, and the third unit are formed by the hexagonal units in the one-way microchannel module. The present invention can select a suitable substrate size according to the size of the electronic components, and can increase the heat exchange area of the microchannel by adding a number of hexagonal units with Tesla valve structures and expanding the number of branch levels according to the size of the heat source surface and the heat dissipation requirements, thereby meeting the heat dissipation requirements of electronic components of different sizes and heat generation, and has a wide range of applications. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;
[0023] Figure 2 Schematic diagram of the hexagonal unit structure of the present invention;
[0024] Figure 3 Provides a schematic projection diagram of the first unit layer of the first embodiment of the present invention;
[0025] Figure 4 Provides a schematic projection diagram of the first unit layer of the second embodiment of the present invention;
[0026] Figure 5 Provides a schematic projection diagram of the second unit layer of the first embodiment of the present invention;
[0027] Figure 6 It is a projection diagram of the connection of the supplementary unit of the present invention;
[0028] Figure 7 A schematic projection diagram of a one-way microchannel module according to a first embodiment of the present invention is provided;
[0029] Figure 8 This is a projection diagram of the one-way microchannel module after increasing the number of branching levels of the present invention.
[0030] In the figure: 1, substrate; 11, chamber; 2, liner; 3, one-way microchannel module; 301, hexagonal unit; 302, first unit layer; 303, second unit layer; 304, third unit layer; 305, supplementary unit; 4, liquid inlet; 5, liquid outlet. DETAILED DESCRIPTION
[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0032] Example:
[0033] See also Figures 1-8 In an embodiment of the present invention, a Tesla valve microchannel phase change heat dissipation device based on a bifurcated structure includes a substrate 1 and a liner 2: a chamber 11 is opened in the substrate 1, and a plurality of liquid outlets 5 are opened at the edge of the chamber 11. The chamber 11 is used to collect the gas phase fluid and liquid phase fluid generated by the phase change fluid, and the gas phase fluid and the liquid phase fluid are discharged through the liquid outlet 5; the liner 2 is integrally formed in the chamber 11, and a liquid inlet 4 is opened in the middle of the liner 2. A one-way microchannel module 3 is etched in the liner 2, and the liquid inlet 4 is connected to the liquid inlet end of the one-way microchannel module 3, and the liquid outlet end of the one-way microchannel module 3 is connected to the chamber 11. The one-way microchannel module 3 has a plurality of Tesla valve structures. The one-way microchannel module 3 is used to unidirectionally guide the phase change fluid and prevent steam backflow crosstalk, so that the phase change fluid can circulate in one direction to dissipate heat.
[0034] Specifically, in the present invention, the lining plate 2 is directly attached to the electronic components that need heat dissipation, such as the components that need heat dissipation, and a one-way microchannel module 3 is etched on the lining plate 2. The one-way microchannel module 3 is evenly distributed on the lining plate 2. After the phase change fluid is injected into the liquid inlet 4 of the lining plate 2, the fluid phase changes into a gas phase fluid and a liquid phase fluid. The Tesla valve structure in the one-way microchannel module 3 can utilize the dynamic effect of the fluid to produce a certain resistance difference when the fluid passes through, thereby realizing the unidirectional flow of the fluid, so that the cooling phase change fluid can be more evenly diverted and fully mixed, effectively avoiding local heating of the liquid. At the same time, the anti-backflow characteristics of the Tesla valve structure also effectively avoid the generation of steam backflow crosstalk in the phase change process, avoid the problem of uneven heat dissipation caused by fluid chaos, and improve the heat transfer efficiency.
[0035] Furthermore, a chamber 11 is opened in the substrate 1, and the electronic components that need to dissipate heat are clamped in the chamber 11, so that the heat source surface of the electronic components can be embedded in the chamber 11. At the same time, the heat source surface of the electronic components directly contacts the upper open boundary of the one-way microchannel module 3. The heat source surface and the substrate are combined to form a closed flow channel, which effectively shortens the heat transfer path. After the phase change fluid introduced by the liquid inlet 4 exchanges heat, the phase change fluid forms a phase change fluid after being heated. The gas phase fluid and the liquid phase fluid are collected through the chamber 11 and discharged through the liquid outlet 5. The liquid outlet 5 on the back of the substrate 1 is connected to the pipeline, and the fluid is then discharged through the pipeline to complete the rapid heat dissipation of the electronic components.
[0036] Preferably, Figures 1-8 As shown, the one-way microchannel module 3 includes several hexagonal units 301 composed of Tesla valve structures, wherein the central channel of the Tesla valve structure forms a hexagon, the arc channel of the Tesla valve structure is located inside the hexagon, the hexagonal unit 301 is an equilateral unequal-angle hexagonal unit 301, and the one-way microchannel module 3 is composed of equilateral unequal-angle hexagonal units 301 in a ring shape and in a binary branching arrangement. The Tesla valve structure is used to guide the fluid in a unidirectional manner and prevent steam backflow crosstalk.
[0037] Specifically, several hexagonal units 301 composed of Tesla valve structures can ensure the unidirectional flow of phase change fluid and prevent steam backflow crosstalk. The hexagonal unit 301 is more compact in structure and improves space utilization. The shape design of the equilateral and unequal-angle hexagonal unit 301 optimizes the flow path of the fluid and further enhances the unidirectional flow guidance effect. The binary branching arrangement enables the fluid to be more evenly distributed in the unidirectional microchannel module 3, thereby improving the uniformity and efficiency of heat dissipation.
[0038] Preferably, Figure 2-Figure 4As shown, the opposite sides of the equilateral unequal-angle hexagonal units 301 remain parallel, and the inner angle of the center end of the annular distribution of the equilateral unequal-angle hexagonal units 301 is α, wherein the number of annular distribution of the equilateral unequal-angle hexagonal units 301 in the center of the one-way microchannel module 3 is M equilateral unequal-angled hexagonal units 301 are connected in an overlapping circular arrangement with the central end as the center to form a first unit layer 302; the equilateral unequal-angled hexagonal units 301 outside the first unit layer 302 are arranged in a binary branching manner to expand into a second unit layer 303, a third unit layer 304...n unit layers, n ≥ 3.
[0039] Specifically, the value of M is determined based on the overall size of the unidirectional microchannel module 3 and the required fluid flow rate to ensure that the flow of the fluid in the unidirectional microchannel module 3 is both efficient and stable. The first unit layer 302 serves as the core part of the unidirectional microchannel module 3, the second unit layer 303, the third unit layer 304... until the n unit layer, each layer is based on the previous layer, and is arranged and expanded in sequence in a binary branching manner to form a complete unidirectional microchannel module 3. The unidirectional microchannel modules 3 expanded in sequence in a binary branching manner not only optimize the flow path of the fluid, but also improve the overall strength and stability of the unidirectional microchannel module 3.
[0040] Further, if Figure 8 As shown, the hexagonal units 301 in the one-way microchannel module 3 form the first unit, the second unit layer 303 and the third unit. The present invention can select a suitable substrate size according to the size of the electronic components, and can increase the heat exchange area of the microchannel by adding a number of hexagonal units 301 with Tesla valve structures and expanding the number of branches according to the size of the heat source surface and the heat dissipation requirements, thereby meeting the heat dissipation requirements of electronic components of different sizes and heat amounts, and has a wide range of applications.
[0041] Further, such as Figure 2 As shown, the design method of the hexagonal unit 301 is as follows:
[0042] like Figure 2 As shown, select a two-dimensional plane, called the XY plane; select a point on the XY plane as the origin O, stipulate that the side length of the hexagon is L, and the internal angle with the origin O as the vertex is called α; starting from the origin O, the five vertices in the counterclockwise direction are called A, B, C, D, and E respectively;
[0043] By changing the included angle α and keeping the side length L of the hexagon unchanged, the parallel position relationship of the opposite sides of the hexagon remains unchanged, forming an equilateral hexagonal unit;
[0044] A set of Tesla valve structures of the same size are designed on the AO section and the EO section to meet the following conditions:
[0045] Here, starting from point A, draw a line segment of length L1, called line segment L1; the other endpoint of line segment L1 is called point P1; line segment L1 is inside the equilateral hexagon, and the angle between line segment L1 and line segment AO is called β1;
[0046] Draw a line segment perpendicular to line segment L1 through point P1, called line segment M1; the intersection with line segment AO is called point Q1; draw an arc through points P1 and Q1, called arc R1; arc R1 is tangent to line segment L1;
[0047] Design a set of Tesla valve structure channel center lines of the same size on line segments BA and DE, meeting the following conditions:
[0048] Starting from point B, draw a line segment of length L2, called line segment L2; the other endpoint of line segment L2 is called point P2; line segment L2 is inside the equilateral hexagon, and the angle between line segment L2 and line segment BA is called β2;
[0049] Draw a line segment perpendicular to line segment L2 through point P2, called line segment M2; the intersection with line segment BA is called point Q2. Draw an arc through points P2 and Q2, called arc R2; arc R2 is tangent to line segment L2;
[0050] Design a set of Tesla valve structure channel center lines of the same size on line segments CB and CD, meeting the following conditions:
[0051] Starting at point C, draw a line segment of length L3, called line segment L3. The other endpoint of line segment L3 is called point P3. Line segment L3 is inside the equilateral hexagon and is the angle bisector of the interior angle of the hexagon with point C as its vertex.
[0052] Draw a line segment perpendicular to line segment CB through point P3, called line segment M3; the intersection with line segment CB is called point Q3. Draw an arc through points P3 and Q3, called arc R3; arc R3 is tangent to line segment L3.
[0053] Further, β1=β2=90°-α, β3=0.5α;
[0054] The first embodiment of the present invention, The range of α is 15°-90°, preferably 72°, 60°, 45°, 30° and 15°, such as Figure 3 As shown, when α is 60°, The first unit layer is formed by overlapping and connecting six equilateral hexagonal units in a circular arrangement with the center end as the center. The first unit layer enables the fluid to turn more smoothly when passing through the equilateral hexagonal units, thereby reducing the flow resistance.
[0055] The second embodiment of the present invention is as follows Figure 4 As shown, when α is 45°, Eight equilateral and unequal-angled hexagonal units are connected in an overlapping circular arrangement with the central end as the center to form a first unit layer 302 .
[0056] Preferably, Figure 2 As shown, the arc channels of several Tesla valve structures within the equilateral unequal-angle hexagonal unit 301 are symmetrical about the symmetry axis of the equilateral unequal-angle hexagonal unit 301, and the angles between the arc channels of the Tesla valve structure and the central channel group are equal (β1=β2=90°-α, β3=0.5α).
[0057] Specifically, the arc channels of several Tesla valve structures within the equilateral unequal-angle hexagonal unit 301 are symmetrical about the symmetry axis of the equilateral unequal-angle hexagonal unit 301, so that the gas phase fluid generated by the phase change flows through the arc channels of the Tesla valve structure within the equilateral unequal-angle hexagonal unit 301, which can create relaxation space for the steam, effectively improving the flow efficiency and channel stability of the fluid. At the same time, due to the angle between the arc channel and the central channel group, it can also suppress the backflow of steam and the flow of the liquid working medium to a certain extent. In addition, the Tesla valve structure within the equilateral unequal-angle hexagonal unit 301 and the angle design between the arc channel and the central channel group can also enhance the mixing effect and turbulence intensity of the fluid, which helps to improve the heat transfer and mass transfer performance of the fluid.
[0058] Preferably, Figure 6 As shown, the one-way microchannel module 3 also includes a supplementary unit 305, which is composed of equilateral unequal-angle hexagonal units 301 arranged in a binary branching manner. The supplementary unit 305 is arranged in the interval space formed by the equilateral unequal-angle hexagonal units 301 arranged in a ring shape and in a binary branching manner.
[0059] Specifically, the supplementary unit 305 is matched and connected with the first unit, the second unit layer 303, and the third unit, and the liquid outlet of the supplementary unit 305 is connected to the chamber 11. The supplementary unit 305 can provide more fluid channels within a limited space, further improving the fluid processing capacity and heat transfer efficiency. The supplementary unit 305 not only optimizes the flow direction of the fluid, but also enhances the mixing and turbulence effects of the fluid, which helps to improve the heat and mass transfer performance of the fluid. In addition, the supplementary unit 305 makes the unidirectional microchannel module 3 as a whole have better anti-backflow crosstalk resistance, which can meet the needs of more complex and diverse application scenarios.
[0060] Preferably, Figure 1 As shown, the upper portion of the one-way micro-channel module 3 is an open boundary, and the upper portion of the one-way micro-channel module 3 is in direct contact with the heat source surface of the electronic components to form a closed flow channel.
[0061] Specifically, the upper part of the one-way microchannel module 3 has an open boundary, which can ensure efficient heat exchange between the heat source surface of the electronic components and the cooling fluid. The one-way microchannel module 3 can more effectively reduce the operating temperature of the electronic components, improve their operating efficiency and stability, and extend their service life.
[0062] Preferably, Figure 1 As shown, the lining plate 2 is circular.
[0063] Specifically, the liner 2 adopts a circular design, and its diameter is slightly larger than the inner diameter of the one-way microchannel module 3, ensuring that the liner 2 can match the one-way microchannel module 3 etched in a circular shape as a whole, thereby improving the utilization rate of the liner 2.
[0064] Preferably (not shown), the material of the substrate 1 and the backing plate 2 is any one of copper, silicon or flexible polyimide, so as to be suitable for heat dissipation of rigid or flexible electronic devices.
[0065] In actual use, to meet the heat dissipation requirements of high-power chips, copper substrate materials are used to increase the heat dissipation area by increasing the number of branches. The specific implementation steps are as follows:
[0066] like Figure 8 As shown, according to the method of forming a binary branch sequence of several equilateral and unequal-angled hexagonal units 301 with Tesla valve structures in the embodiment, the unit layer of the basic structure is expanded to 4 layers, and the supplementary unit 305 is correspondingly expanded to 3 layers, forming a larger heat dissipation area.
[0067] Laser ablation is used to process channels on a copper substrate, with a processing depth of 100 to 200 μm and a width of 50 to 150 μm.
[0068] The raised edge height formed by the substrate 1 and the cavity 11 is 2 mm, and the raised edge height of the liner 2 is 1.5 mm. The electronic components are directly embedded in the raised grooves, and the contact surface is coated with thermal grease to further reduce thermal resistance.
[0069] In specific use, a bendable heat dissipation device is designed for flexible electronic devices. The specific solution is as follows:
[0070] Polyimide is selected as the material of the substrate 1 and the liner 2. The edge protrusion formed by the substrate 1 and the cavity 11 is formed by a 3D printing process, and the liner 2 is a compressible elastic structure.
[0071] Preferably, the phase change fluid is a low-boiling-point fluorinated liquid, the phase change temperature of the phase change fluid is 40-80°C, the liquid working fluid is a low-boiling-point fluorinated liquid, and the phase change temperature drops to 40°C, which is suitable for low-temperature heat dissipation scenarios of flexible devices.
[0072] Preferably, the arcuate channel of the Tesla valve structure has a depth of 100 to 200 μm and a width of 50 to 150 μm, and the central channel of the Tesla valve structure has a depth of 100 to 200 μm and a width of 50 to 150 μm. These dimensional designs enable the Tesla valve structure to effectively guide fluid flow at a microscale while reducing the energy loss of the fluid in the channel. The special geometric shape of the Tesla valve structure, including the depth and width of its arcuate channel and central channel, act together on the fluid to generate vortices and rotations during the flow process, thereby enhancing the mixing and heat transfer efficiency of the fluid. In addition, this dimensional design also ensures that the Tesla valve structure in the microchannel heat dissipation device conforms to the trend of miniaturization of electronic equipment, enabling it to maintain efficient heat dissipation performance under various working conditions.
[0073] Specifically, these dimensional designs of the Tesla valve structure are intended to optimize the fluid flow path and improve heat dissipation efficiency. The depth and width parameter ranges of the arc channel and the central channel ensure the smooth flow of the fluid in the channel. The Tesla valve structure can effectively prevent the backflow and crosstalk of the gas phase fluid generated by the phase change inside the heat dissipation device, reduce the pressure on the wall, enhance the heat exchange effect, and thus achieve efficient heat dissipation of flexible electronic devices.
[0074] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.
Claims
1. A Tesla valve microchannel phase change heat dissipation device based on a bifurcated structure, characterized in that: include: A substrate, wherein a chamber is formed in the substrate, and a plurality of liquid outlets are formed at the edge of the chamber, wherein the chamber is used to collect gaseous fluid and liquid fluid generated by the phase change fluid, and the gaseous fluid and liquid fluid are discharged through the liquid outlets; The lining plate is integrally formed in the chamber, a liquid inlet is opened in the middle of the lining plate, a one-way microchannel module is etched in the lining plate, the liquid inlet is connected to the liquid inlet end of the one-way microchannel module, the liquid outlet end of the one-way microchannel module is connected to the chamber, the one-way microchannel module has a plurality of Tesla valve structures, the one-way microchannel module is used for unidirectional flow of phase change fluid and prevent steam backflow crosstalk, so that the phase change fluid can circulate in one direction to dissipate heat.
2. The Tesla valve microchannel phase change heat dissipation device based on a bifurcated structure according to claim 1 is characterized in that: The one-way microchannel module includes several hexagonal units composed of Tesla valve structures, wherein the central channel of the Tesla valve structure forms a hexagon, the arc channel of the Tesla valve structure is located inside the hexagon, and the hexagonal unit is an equilateral unequal-angle hexagonal unit. The one-way microchannel module is composed of equilateral unequal-angle hexagonal units arranged in a ring and in a binary branching manner. The Tesla valve structure is used to guide fluid in a one-way direction.
3. The Tesla valve microchannel phase change heat dissipation device based on a bifurcated structure according to claim 2 is characterized in that: The opposite sides of the equilateral unequal-angle hexagonal units are kept parallel, and the inner angle of the central end of the annular distribution of the equilateral unequal-angle hexagonal units is α, wherein the number of annular distribution of the equilateral unequal-angle hexagonal units in the center of the one-way microchannel module is The M equilateral unequal-angled hexagonal units are connected in an overlapping circular arrangement with the central end as the center to form a first unit layer; the equilateral unequal-angled hexagonal units outside the first unit layer are arranged in a binary branching manner to expand into a second unit layer, a third unit layer...n unit layers, where n≥3.
4. The Tesla valve microchannel phase change heat dissipation device based on a bifurcated structure according to claim 3 is characterized in that: The arcuate channels of the Tesla valve structures in the equilateral unequal-angle hexagonal unit are symmetrical about the symmetry axis of the equilateral unequal-angle hexagonal unit, and the angles between the arcuate channels of the Tesla valve structure and the central channel group are equal.
5. The Tesla valve microchannel phase change heat dissipation device based on a bifurcated structure according to claim 4 is characterized in that: The one-way microchannel module also includes a supplementary unit, which is composed of equilateral unequal-angle hexagonal units arranged in a binary branching manner. The supplementary unit is arranged in a spacing space formed by the equilateral unequal-angle hexagonal units arranged in a ring shape and in a binary branching manner.
6. The Tesla valve microchannel phase change heat dissipation device based on a bifurcated structure according to claim 5, characterized in that: The upper portion of the one-way micro-channel module is an open boundary, and the upper portion of the one-way micro-channel module is in direct contact with the heat source surface of the electronic component to form a closed flow channel.
7. The Tesla valve microchannel phase change heat dissipation device based on a bifurcated structure according to claim 6, characterized in that: The lining plate is circular.
8. The Tesla valve microchannel phase change heat dissipation device based on a bifurcated structure according to claim 7, characterized in that: The substrate and the backing plate are made of any one of copper, silicon or flexible polyimide, so as to be suitable for heat dissipation of rigid or flexible electronic devices.
9. The Tesla valve microchannel phase change heat dissipation device based on a bifurcated structure according to claim 8, characterized in that: The arc channel of the Tesla valve structure has a depth of 100 to 200 μm and a width of 50 to 150 μm. The central channel of the Tesla valve structure has a depth of 100 to 200 μm and a width of 50 to 150 μm.
10. The Tesla valve microchannel phase change heat dissipation device based on a bifurcated structure according to claim 9, characterized in that: The phase change fluid is a low boiling point fluorinated liquid, and the phase change temperature of the phase change fluid is 40-80°C.