Splitting system for optical component

Abstract

A splitting system for an optical component is described. The optical component includes a mount and an optical device coupled to the mount at a coupling location. The system includes a thermally conductive pin configured to contact the optical component at the coupling location and provide directional thermal conduction to cause the optical device to structurally separate from the mount. The system also includes a heater configured to simultaneously heat the pin and a housing; the housing is configured to house the heater and the pin such that the pin extends from the heater through the housing to contact the optical component. The heater includes a heating plate coupled to one or more heat transfer members and a heat source, such as an inductive burner.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to U.S. application 63 / 447,319, filed on February 21, 2023, and incorporates by reference herein in its entirety. Technical Field

[0003] This description relates to a disassembly system for optical components. Background Art

[0004] Lithographic equipment can be used, for example, in the manufacture of integrated circuits (ICs). A patterning device (e.g., a mask) can include or provide patterns corresponding to various layers of the IC (the "design layout"), and this pattern can be transferred to a target portion (e.g., comprising one or more dies) on a substrate (e.g., a silicon wafer) coated with a layer of radiation-sensitive material ("resist"), such as by irradiating the pattern on the patterning device through the target portion. Typically, a single substrate includes multiple adjacent target portions, to which the pattern is transferred sequentially, one at a time, by the lithographic projection apparatus. In this type of lithographic projection apparatus, the pattern on the entire patterning device is transferred to a single target portion in a single operation. Such an apparatus is often referred to as a stepper. In an alternative apparatus, often referred to as a stepper-scan apparatus, the projection beam is scanned across the patterning device in a given reference direction (the "scanning" direction) while the substrate is synchronously moved parallel or antiparallel to this reference direction. Different portions of the pattern on the patterning device are gradually transferred to a single target portion.

[0005] The manufacture of semiconductor devices typically involves processing a substrate (e.g., a semiconductor wafer) using a number of manufacturing processes to form the various features and multiple layers of the device. These layers and features are typically manufactured and processed using, for example, deposition, photolithography, etching, deposition, chemical mechanical polishing, and ion implantation. Multiple devices can be manufactured on multiple dies on a substrate and then separated into individual devices. This device manufacturing process can be considered a patterning process. The patterning process involves performing a patterning step using a patterning device in a lithography apparatus, such as optical and / or nanoimprint lithography, to transfer the pattern on the patterning device to the substrate, and the patterning process typically but optionally involves one or more related pattern processing steps, such as resist development using a developer, baking the substrate using a baking tool, etching using the pattern using an etching apparatus, deposition, etc.

[0006] Photolithography is a central step in the fabrication of devices such as integrated circuits, where patterns formed on a substrate define the device's functional elements, such as microprocessors, memory chips, etc. Similar photolithography techniques are also used to form flat-panel displays, microelectromechanical systems (MEMS), and other devices.

[0007] As semiconductor manufacturing processes continue to advance, the size of functional elements has been continuously reduced for decades, while the number of functional elements, such as transistors, per device has been steadily increasing, following a trend commonly referred to as "Moore's Law." In the current state of the art, the layers of a device are manufactured using a lithographic projection apparatus that projects a design layout onto a substrate using illumination from a deep ultraviolet illumination source, thereby producing individual functional elements with dimensions well below 100 nm (i.e., less than half the wavelength of the radiation from the illumination source (e.g., a 193 nm illumination source)).

[0008] This process for printing features smaller than the classical resolution limit of a lithographic projection apparatus is often referred to as low-k1 lithography, based on the resolution formula CD = k1 × λ / NA, where λ is the wavelength of the radiation employed (currently 248 nm or 193 nm in most cases), NA is the numerical aperture of the projection optics in the lithographic projection apparatus, CD is the "critical dimension" (typically the minimum feature size printed), and k1 is an empirical resolution factor. Generally, the smaller k1, the more difficult it becomes to reproduce a pattern on the substrate that resembles the shape and dimensions planned by the designer to achieve specific electrical functionality and performance. To overcome these difficulties, complex fine-tuning steps are applied to the lithographic projection apparatus, design layout, or patterning device. These steps include, for example, but are not limited to, optimization of the NA and optical coherence settings, customized illumination schemes, the use of phase-shifting patterning devices, optical proximity correction (OPC, sometimes also referred to as "optical and process correction") in the design layout, or other methods generally referred to as "resolution enhancement techniques" (RET). Fine-tuning steps can include, for example, obtaining various measurements using metrology equipment and / or other procedures. Summary of the Invention

[0009] Lithographic equipment, metrology equipment, and / or other equipment include optical components that include a (typically metal) mount bonded to an optical device (typically glass) via adhesive. For maintenance and / or other reasons, the mount and optical device periodically require debonding. Operators typically manually position a heat gun, set to a specific temperature depending on the type of optical device and adhesive, to blow hot air onto the optical device and debond it from the mount. This method is relatively time-consuming and highly operator-dependent. For example, operators may determine a preferred temperature set point, the optimal distance between the heat gun and the optical device, and so on. Operator-to-operator variability can lead to inconsistent heating, damage to the optical device, and / or other negative effects. This method also poses safety risks to the operator, as the operator's hands are often close to or touching the hot surface. Chemical solvents are also used for debonding, but they suffer from environmental and safety issues for the product and / or the operator. Chemical solvents often require a relatively long and uncertain amount of time to debond. The present system and method reduces and / or eliminates these and other disadvantages by providing a consistent and repeatable thermomechanical tool that an operator can use to debond or otherwise separate an optical device from a mount. Advantages of the present system and method over heat guns and other debonding methods include, but are not limited to, improved operator safety, improved product safety (e.g., due to targeted heating), the ability to reuse, cost savings, improved (faster) separation speeds, improved consistency of results, and reduced debonding time.

[0010] According to an embodiment, a splitting system for an optical component is provided. The optical component includes a mount and an optical device connected to the mount at one or more connection locations. The splitting system includes one or more heat transfer members, which are configured to contact the optical component near the one or more connection locations. The one or more heat transfer members are configured to transfer heat to the one or more connection locations to cause splitting, wherein the splitting includes structural separation or disconnection of the optical device from the mount. The system includes a heater, which is configured to heat the one or more heat transfer members simultaneously. The system includes a housing, which is configured to accommodate the heater and the one or more heat transfer members. The one or more heat transfer members extend from the heater through the housing to contact the optical component.

[0011] In some embodiments, the one or more heat transfer members are thermally conductive members and are configured to transfer heat to the one or more coupling locations by conduction. In some embodiments, the one or more heat conductive members include one or more thermally conductive pins.

[0012] In some embodiments, the heater includes a heating plate and a heat source. The heating plate is coupled to the one or more heat transfer members. The heating plate is configured to simultaneously increase the temperature of the one or more heat transfer members and heat the one or more heat transfer members. The heat source is in thermal communication with the heating plate and is configured to provide heat to the heating plate.

[0013] In some embodiments, the heat source comprises an induction burner. In some embodiments, the heat source comprises a temperature controller configured to cause the heat source to controllably heat the heating plate.

[0014] In some embodiments, the heater includes a heating plate and heat source coupling configured to resiliently couple the heating plate to the heat source to ensure that the heating plate remains coupled to the one or more heat transfer members even if there are structural changes in the heating plate, the heat source, and / or the optical component. In some embodiments, the heating plate and heat source coupling includes one or more flexible supports. In some embodiments, the one or more flexible supports include one or more springs.

[0015] In some embodiments, the unbundling comprises structurally separating the mount and the optical device into two separate parts. In some embodiments, the optical device is bonded to the mount using an adhesive, the bonding location comprises a bond pad, and the unbundling comprises debonding the optical device from the mount at the bond pad by providing directed heat transfer to the adhesive.

[0016] In some embodiments, the one or more heat transfer members extend from the heater through the surface of the housing to contact the optical component. The surface of the housing may include a variable adapter. In some embodiments, the variable adapter is configured to be changed to facilitate contact between different optical components having different numbers, shapes, sizes, and / or arrangements of coupling locations and different corresponding numbers of the one or more heat transfer members. In some embodiments, the adapter includes a tool plate.

[0017] In some embodiments, the number of the one or more heat transfer members is the same as the number of coupling locations.

[0018] In some embodiments, the system further includes one or more temperature sensors configured to generate output signals indicative of the temperature of the housing, the heater, the one or more heat transfer members, and / or the one or more attachment locations of the optical component. In some embodiments, the one or more temperature sensors include three thermocouples, wherein a first thermocouple of the three thermocouples is coupled to the heater, a second thermocouple of the three thermocouples is coupled to the housing near the location where the one or more heat transfer members extend through the housing to contact the optical component, and a third thermocouple of the three thermocouples is coupled to the mount near the attachment location. In some embodiments, the one or more temperature sensors include non-contact temperature sensors, such as infrared (IR) temperature sensors and / or other non-contact temperature sensors. For example, the IR sensor and / or thermocouple can be configured to directly measure the temperature of the mount or optical component (which can provide more accurate bond temperature measurements at the attachment location). In some embodiments, the output signals from the one or more temperature sensors are configured to monitor the temperature of the heater, the housing, and / or the attachment locations, control the heater, and / or control the separation.

[0019] In some embodiments, the system further comprises an operator interface configured to display a temperature of the housing, the heater, the one or more heat transfer members, and / or the one or more coupling locations of the optical component.

[0020] In some embodiments, the housing is configured to thermally isolate the heater and / or the one or more heat transfer members from an operator using the disassembly system and / or the surrounding environment.

[0021] In some embodiments, the mount comprises metal and the optical device comprises glass. In some embodiments, the optical component comprises a face-bonded opto-mechanical component having a plane defined by optical and mechanical surfaces, the optical and mechanical surfaces being secured parallel to one another using an adhesive. In some embodiments, the optical component is a point cube. In some embodiments, the optical component comprises a portion of an interferometer. In some embodiments, the optical component forms part of a lithographic apparatus or metrology apparatus used in semiconductor manufacturing and has been removed from the lithographic apparatus or metrology apparatus.

[0022] According to another embodiment, a method for disassembling an optical component is provided. The optical component includes a mount and an optical device connected to the mount at one or more connection positions. The disassembly method includes providing one or more heat transfer members, and the one or more heat transfer members are configured to contact the optical component near the one or more connection positions. The one or more heat transfer members are configured to transfer heat to the one or more connection positions to cause disassembly, wherein the disassembly includes structural separation or disconnection of the optical device from the mount. The disassembly method includes using a heater to simultaneously heat the one or more heat transfer members. The disassembly method includes using a housing to accommodate the heater and the one or more heat transfer members. The one or more heat transfer members extend from the heater through the housing to contact the optical component. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The above aspects and other aspects and features will become apparent to those of ordinary skill in the art after reviewing the following description of specific embodiments in conjunction with the accompanying drawings.

[0024] Figure 1 A lithographic apparatus according to an embodiment is schematically depicted.

[0025] Figure 2 Embodiments of a lithocell or litho cluster according to embodiments are schematically depicted.

[0026] Figure 3 Depicted is a schematic representation of overall lithography showing the collaboration between three techniques for optimizing semiconductor manufacturing, in accordance with an embodiment.

[0027] Figure 4 A disassembly system for optical components according to an embodiment is presented.

[0028] Figure 5 Another exemplary view of a splitting system according to an embodiment is shown.

[0029] Figure 6 The analysis results according to the embodiment are shown, which show that the split system ( Figure 4 、 Figure 5 ) to transfer sufficient heat to the optical component and the locations where the optical component is connected (e.g., bond pads) while keeping the optics of the optical component relatively cool.

[0030] Figure 7 A splitting method according to an embodiment is presented.

[0031] Figure 8 is a block diagram of an exemplary computer system according to an embodiment. DETAILED DESCRIPTION

[0032] In semiconductor device manufacturing, lithography equipment, metrology equipment, and / or other equipment often include optical components, including mounts bonded to the optical device via adhesive. For maintenance and / or other reasons, the mounts and optical devices periodically need to be debonded. In existing methods, operators use heat guns to debond the optical device from the mounts. The heat gun is set to a specific temperature depending on the type of optical device and adhesive. The operator focuses the heat gun on the bond pads between the optical device and the mount, focusing on one pad at a time and refocusing the heat gun on the remaining pads (this requires significant processing time) until the optical device can be removed from the mount. It is also challenging for the operator to focus heat only on the bond pads, as this results in a large area of ​​hot air flowing across the optical component. During this process, the operator typically holds the mount with one hand and the heat gun with the other, which poses a safety risk to the operator. Alternatively, operators may use ovens set to a specific temperature to debond the optical components. However, this method also presents risks for operators, as the entire optical component assembly is heated in an oven. This can result in damage to the optics and / or optical coatings, as well as pose safety risks to operators touching the assembly. The oven method can also introduce stresses into the optics and / or have other disadvantages. The introduced stresses can have many potential causes, including a mismatch between the coefficients of thermal expansion (CTE) (e.g., between the material used for the optics and the material used for the mount), for example, where the mount may expand more than the optic, or vice versa, resulting in tension / tension between the components, and / or other causes.

[0033] The heat gun method is subjective to the operator. For example, the amount of heat applied is determined by the operator. The operator also sets the amount of heat and time based on their own prior experience. This leads to variability between operators. For example, new and inexperienced operators often damage optics by applying excessive heat. Excessive heat and poor heat control also often damage coatings on optics and create temperature gradients within large optics. Conversely, there is often insufficient heat to bring the adhesive to the proper debonding temperature. This requires the operator to apply higher force than usual to debond the optic, which often damages the optic.

[0034] Advantageously, using the systems and methods described herein, heat is conducted directly into the mount near (e.g., at or near) the connection location, such as the bond pad. An induction burner with digital temperature control (as one example) is used to generate the heat. Pins and / or other heat transfer members simultaneously transfer the heat to the bond pad. Thermocouples monitor the real-time temperature at each location. Using conduction facilitates maintaining a large thermal gradient, thereby focusing the highest temperatures at the bond pad and adhesive, while keeping the rest of the optical component assembly at a lower temperature.

[0035] The systems and methods described herein are able to repeatedly control heating time and temperature to achieve consistent debonding. The use of conduction ensures that the debonding process is the same for each use, without the inconsistencies associated with convective heat transfer. It ensures that the optical device is safe for reuse. This also improves operator safety. Due to the fact that the bonding pads are heated to the same temperature at the same time (for example, above a certain predetermined temperature, such as the glass transition temperature of the adhesive as one possible example, where the adhesive becomes "gooey"), the systems and methods described herein require relatively little force on the part of the operator to pull the optical device away from the mount. In addition, the success rate of debonding is increased and the time required for debonding is reduced compared to existing methods. The system is also modular and can be scaled to work with a variety of optical component mounts and / or optical designs.

[0036] By way of brief introduction, the description below relates to semiconductor device manufacturing and patterning processes. The following paragraphs also describe several elements of systems and / or methods for semiconductor device measurement. Although specific reference may be made herein to the manufacture of integrated circuits (ICs) for semiconductor devices, it should be understood that the description herein has many other possible applications. For example, the present invention may be used to manufacture integrated optical systems, guidance and detection patterns for magnetic domain memories, liquid crystal display panels, thin film magnetic heads, etc. Those skilled in the art will understand that in the context of such alternative applications, any use of the terms "reticle", "wafer" or "die" herein should be considered interchangeable with the more general terms "mask", "substrate" and "target portion", respectively.

[0037] As used herein, the term "projection optics" should be broadly interpreted to encompass various types of optical systems, including, for example, refractive optics, reflective optics, apertures, and catadioptric optics. The term "projection optics" may also include components that operate according to any of these design types for collectively or individually directing, shaping, or controlling a projection beam of radiation. The term "projection optics" may include any optical component in a lithographic projection apparatus, regardless of where the optical component is located in the optical path of the lithographic projection apparatus. Projection optics may include optical components for shaping, adjusting, and / or projecting radiation from a source before it passes through a patterning device, and / or optical components for shaping, adjusting, and / or projecting radiation after it passes through a patterning device. Projection optics typically do not include a source and a patterning device.

[0038] Figure 1 An embodiment of a lithographic apparatus LA is schematically depicted. The apparatus comprises an illumination system (illuminator) IL configured to condition a radiation beam B (e.g., UV, DUV, or EUV radiation); a support structure (e.g., a mask table) MT configured to support a patterning device (e.g., a mask) MA and coupled to a first positioner PM configured to accurately position the patterning device according to predetermined parameters; a substrate table (e.g., a wafer stage) WT (e.g., WTa, WTb, or both) configured to hold a substrate (e.g., a resist-coated wafer) W and coupled to a second positioner PW configured to accurately position the substrate according to predetermined parameters; and a projection system (e.g., a refractive projection lens system) PS configured to project a pattern imparted by the patterning device MA to the radiation beam B onto a target portion C (e.g., comprising one or more dies and often referred to as a field) of the substrate W. The projection system is supported on a reference frame RF. As depicted, the apparatus is of the transmissive type (e.g., using a transmissive mask). Alternatively, the device may be of the reflective type (eg using a programmable mirror array or using a reflective mask).

[0039] The illuminator IL receives a radiation beam from a radiation source SO. For example, when the source is an excimer laser, the source and the lithographic apparatus may be separate entities. In these cases, the source is not considered to form part of the lithographic apparatus, and the radiation beam is transferred from the source SO to the illuminator IL by means of a beam delivery system BD comprising, for example, suitable guide mirrors and / or a beam expander. In other cases, for example, when the source is a mercury lamp, the source may be an integral part of the apparatus. The source SO and illuminator IL together with the beam delivery system BD may be referred to as a radiation system when appropriate.

[0040] The illuminator IL may modify the intensity distribution of the beam. The illuminator may be arranged to limit the radial extent of the radiation beam so that the intensity distribution is non-zero within an annular region in a pupil plane of the illuminator IL. Additionally or alternatively, the illuminator IL may be operable to limit the distribution of the beam in the pupil plane so that the intensity distribution is non-zero in a plurality of equally spaced sectors in the pupil plane. The intensity distribution of the radiation beam in the pupil plane of the illuminator IL may be referred to as an illumination pattern.

[0041] The illuminator IL may include an adjuster AD configured to adjust the (angular / spatial) intensity distribution of the beam. Typically, at least the outer radial extent and / or the inner radial extent (commonly referred to as σ-outer and σ-inner, respectively) of the intensity distribution in the pupil plane of the illuminator can be adjusted. The illuminator IL may be operable to vary the angular distribution of the beam. For example, the illuminator may be operable to change the number and angular extent of sectors in the pupil plane in which the intensity distribution is non-zero. By adjusting the intensity distribution of the beam in the pupil plane of the illuminator, different illumination patterns can be achieved. For example, by limiting the radial and angular extent of the intensity distribution in the pupil plane of the illuminator IL, the intensity distribution can have a multipolar distribution, such as a dipole, quadrupole, or sextupole distribution. The desired illumination pattern can be achieved, for example, by inserting optics providing the desired illumination pattern into the illuminator IL or by using a spatial light modulator.

[0042] The illuminator IL can be operable to change the polarization of the beam and can be operable to adjust the polarization using an adjuster AD. The polarization state of the radiation beam in the pupil plane of the illuminator IL can be referred to as a polarization mode. Using different polarization modes can allow for greater contrast in the image formed on the substrate W. The radiation beam can be unpolarized. Alternatively, the illuminator can be arranged to linearly polarize the radiation beam. The polarization direction of the radiation beam can vary in the pupil plane of the illuminator IL. The polarization direction of the radiation can be different in different zones in the pupil plane of the illuminator IL. The polarization state of the radiation can be selected depending on the illumination mode. For a multipolar illumination mode, the polarization of each pole of the radiation beam can be substantially perpendicular to the position vector of the pole in the pupil plane of the illuminator IL. For example, for a dipole illumination mode, the radiation can be linearly polarized in a direction substantially perpendicular to a line bisecting two opposing sectors of the dipole. The radiation beam can be polarized in one of two different orthogonal directions, which can be referred to as the X polarization state and the Y polarization state. For a quadrupole illumination mode, the radiation in each sector of the pole can be linearly polarized in a direction substantially perpendicular to a line bisecting the sector. This polarization mode can be referred to as XY polarization. Similarly, for a hexapole illumination mode, the radiation in the sector of each pole can be linearly polarized in a direction substantially perpendicular to a line bisecting the sector. This polarization mode can be referred to as TE polarization.

[0043] In addition, the illuminator IL typically includes various other components, such as an integrator IN and a condenser CO. The illumination system may include various types of optical components for directing, shaping, or controlling the radiation, such as refractive, reflective, magnetic, electromagnetic, electrostatic, or other types of optical components, or any combination thereof. The illuminator thus provides a conditioned radiation beam B having a desired uniformity and intensity distribution in its cross-section.

[0044] The support structure MT supports the patterning device in a manner that depends on the orientation of the patterning device, the design of the lithographic apparatus, and other conditions (such as, for example, whether the patterning device is held in a vacuum environment). The support structure can use mechanical, vacuum, electrostatic, or other clamping techniques to hold the patterning device. The support structure can be, for example, a frame or a stage, which can be fixed or movable as required. The support structure can ensure that the patterning device is in a desired position, for example, relative to the projection system. Any use of the terms "reticle" or "mask" herein is considered synonymous with the more general term "patterning device."

[0045] The term "patterning device" as used herein should be broadly interpreted as referring to any apparatus that can be used to impart a pattern in a target portion of a substrate. In embodiments, the patterning device is any apparatus that can be used to impart a pattern in the cross-section of a radiation beam so as to produce a pattern in the target portion of the substrate. It should be noted that the pattern imparted to the radiation beam may not exactly correspond to the desired pattern in the target portion of the substrate, for example if the pattern imparted to the radiation beam includes phase-shifting features or so-called assist features. Typically, the pattern imparted to the radiation beam will correspond to a particular functional layer of a device (such as an integrated circuit) to be produced in the target portion of the apparatus.

[0046] The patterning device may be transmissive or reflective. Examples of patterning devices include masks, programmable mirror arrays, and programmable LCD panels. Masks are well known in photolithography and include mask types such as binary, alternating phase shift, and attenuated phase shift, as well as various hybrid mask types. An example of a programmable mirror array uses a matrix arrangement of small mirrors, each of which can be individually tilted to reflect an incoming radiation beam in different directions. The tilted mirrors impart a pattern in the radiation beam that is reflected by the mirror matrix.

[0047] The term "projection system" should be broadly interpreted to encompass any type of projection system appropriate to the exposure radiation being used or to other factors such as the use of an immersion liquid or the use of a vacuum, including refractive, reflective, catadioptric, magnetic, electromagnetic, and electrostatic optical systems, or any combination thereof. Any use of the term "projection lens" herein should be considered synonymous with the more general term "projection system."

[0048] The projection system PS may include multiple optical (e.g., lens) elements and may also include an adjustment mechanism configured to adjust one or more of the optical elements to correct for aberrations (phase variations in the pupil plane across the field). To achieve this correction, the adjustment mechanism may be operable to manipulate one or more optical (e.g., lens) elements within the projection system PS in one or more different ways. The projection system may have a coordinate system in which the optical axis of the projection system extends in the z-direction. The adjustment mechanism may be operable to perform any combination of the following: shifting one or more optical elements; tilting one or more optical elements; and / or deforming one or more optical elements. Displacement of the optical elements may be performed in any direction (x, y, z, or a combination thereof). Tilting of the optical elements is typically performed out of a plane perpendicular to the optical axis by rotation about an axis in the x- and / or y-directions, although rotation about the z-axis may be used for non-rotationally symmetric aspheric optical elements. Deformation of the optical element may include low-frequency shape (e.g., astigmatism) and / or high-frequency shape (e.g., free-form asphericity). Deformation of the optical element may be performed, for example, by applying forces to one or more sides of the optical element using one or more actuators and / or heating one or more selected regions of the optical element using one or more heating elements. Typically, it is not possible to adjust the projection system PS to correct for apodization (transmission variations in the pupil plane). When designing a patterning device (e.g., mask) MA for a lithographic apparatus LA, a transmission map of the projection system PS may be used. Using computational lithography techniques, the patterning device MA may be designed to at least partially correct for apodization.

[0049] The lithographic apparatus may be of a type having two (dual stage) or more tables (e.g., two or more substrate tables WTa, WTb, two or more patterning device tables, substrate table WTa and table WTb below the projection system without dedicated substrates, for example to facilitate measurement and / or cleaning). In such a "multi-stage" machine, the additional tables may be used in parallel, or preparatory steps may be performed on one or more tables while one or more other tables are being used for exposure. For example, alignment measurements using an alignment sensor AS and / or level (height, inclination, etc.) measurements using a level sensor LS may be performed.

[0050] The lithographic apparatus may also be of a type in which at least a portion of the substrate may be covered by a liquid having a relatively high refractive index (e.g., water) so as to fill the space between the projection system and the substrate. Immersion liquid may also be applied to other spaces in the lithographic apparatus, such as the space between the patterning device and the projection system. Immersion techniques are well known in the art for increasing the numerical aperture of projection systems. The term "immersion" as used herein does not imply that structures such as the substrate are necessarily submerged in the liquid, but only that the liquid is located between the projection system and the substrate during exposure.

[0051] In operation of the lithographic apparatus, a radiation beam is provided and conditioned by an illumination system IL. The radiation beam B is incident on a patterning device (e.g. a mask) MA which is held on a support structure (e.g. a mask table) MT and is patterned by the patterning device. After having passed through the patterning device MA, the radiation beam B passes through a projection system PS which focuses the beam onto a target portion C of a substrate W. With the aid of a second positioner PW and a position sensor IF (e.g. an interferometric device, a linear encoder, a two-dimensional encoder or a capacitive sensor), the substrate table WT can be accurately moved, for example for positioning a different target portion C in the path of the radiation beam B. Similarly, a first positioner PM and a further position sensor (in the Figure 1 , M2 and P2. The patterning device MA and the substrate W may be aligned using patterning device alignment marks M1, M2 and substrate alignment marks P1, P2. Although the substrate alignment marks are shown as occupying dedicated target portions, they may be located in the spaces between target portions (these are referred to as scribe lane alignment marks). Similarly, where more than one die is provided on the patterning device MA, the patterning device alignment marks may be located between the dies.

[0052] The depicted apparatus can be used in at least one of the following modes. In step mode, the support structure MT and substrate table WT are held substantially stationary while a pattern imparted to the radiation beam is projected onto a target portion C in one go (i.e., a single static exposure). The substrate table WT is then shifted in the X and / or Y directions so that a different target portion C can be exposed. In step mode, the maximum size of the exposure field limits the size of the target portion C imaged in a single static exposure. In scan mode, the support structure MT and substrate table WT are scanned synchronously while a pattern imparted to the radiation beam is projected onto a target portion C (i.e., a single dynamic exposure). The speed and direction of the substrate table WT relative to the support structure MT can be determined by the (or less) magnification and image reversal characteristics of the projection system PS. In scan mode, the maximum size of the exposure field limits the width of the target portion (in the non-scanning direction) in a single dynamic exposure, while the length of the scanning motion determines the height of the target portion (in the scanning direction). In another mode, the support structure MT is held substantially stationary, thereby holding the programmable patterning device, and the substrate table WT is moved or scanned, while a pattern imparted to the radiation beam is projected onto a target portion C. In this mode, a pulsed radiation source is typically used, and the programmable patterning device is updated as required after each movement of the substrate table WT or between successive radiation pulses during a scan. This mode of operation can be readily applied to maskless lithography using a programmable patterning device, such as a programmable mirror array of the type mentioned above.

[0053] Combinations and / or variations on the above-described modes of use or entirely different modes of use may also be employed.

[0054] The substrate can be processed before or after exposure in, for example, a coating and developing system (a tool that typically applies a resist layer to a substrate and develops the exposed resist) or a metrology or inspection tool. Where applicable, the disclosure herein can be applied to these and other substrate processing tools. Furthermore, a substrate can be processed more than once, for example to produce a multi-layer IC, so the term "substrate" as used herein can also refer to a substrate that already includes multiple processed layers.

[0055] The terms “radiation” and “beam” as used herein with respect to lithography encompass all types of electromagnetic radiation, including ultraviolet (UV) radiation or deep ultraviolet (DUV) radiation (e.g., having a wavelength of 365 nm, 248 nm, 193 nm, 157 nm, or 126 nm) and extreme ultraviolet (EUV) radiation (e.g., having a wavelength in the range of 5 nm to 20 nm), as well as particle beams, such as ion beams or electron beams.

[0056] Various patterns on or provided by a patterning device can have different process windows—the range of process variables within which a pattern is produced within specifications. Examples of pattern specifications for potential systematic defects include checking for necking, line back-off, line thinning, CD, edge placement, overlap, resist top loss, resist undercut, and / or bridging. The process window of a pattern on a patterning device or region thereof can be obtained by combining (e.g., overlapping) the process windows of each individual pattern. The boundaries of the process window of a pattern group include the boundaries of the process windows of some of the individual patterns. In other words, the individual patterns define the process window of the pattern group.

[0057] like Figure 2 As shown, the lithographic apparatus LA can form part of a lithocell LC (sometimes also referred to as a litho cell or cluster), which also includes equipment for performing pre-exposure and post-exposure processes on a substrate. Typically, this equipment includes one or more spin coaters SC for depositing one or more resist layers, one or more developers for developing the exposed resist, one or more chill plates CH, and / or one or more bake plates BK. A substrate handling device or robot RO picks up one or more substrates from input / output ports I / O1 and I / O2, moves them between the various process equipment, and delivers them to a loading station LB of the lithographic apparatus. These equipment, often collectively referred to as the coating and developing system, are controlled by a coating and developing system control unit TCU, which is itself controlled by a supervisory control system SCS, which in turn controls the lithographic apparatus via the lithography control unit LACU. Thus, the various equipment can be operated to maximize throughput and process efficiency.

[0058] In order to correctly and consistently expose a substrate exposed by a lithographic apparatus, and / or to monitor a portion of a patterning process (e.g., a device fabrication process) that includes at least one pattern transfer step (e.g., an optical lithography step), it is desirable to inspect the substrate or other object to measure or determine one or more properties, such as alignment, overlay (which may be, for example, between structures in superimposed layers or between structures in the same layer that have been provided to that layer separately, e.g., by a double patterning process), line thickness, critical dimension (CD), focus offset, material properties, etc. Therefore, a fabrication facility in which a lithocell LC is located typically also includes a metrology system that measures the properties of substrates W ( Figure 1 ) or other objects in the lithocell. The metrology system may be part of the lithocell LC, for example, it may be part of the lithographic apparatus LA (such as the alignment sensor AS ( Figure 1 )).

[0059] One or more measured parameters may include, for example, alignment and overlay between successive layers formed in or on a patterned substrate, critical dimensions (CDs) of features formed in or on the patterned substrate (e.g., critical line widths), focus or focus error of a photolithography step, dose or dose error of a photolithography step, optical aberrations of a photolithography step, etc. Such measurements are often performed on one or more dedicated metrology targets disposed on the substrate. Measurements may be performed after resist development but before etching, after etching, after deposition, and / or at other times.

[0060] There are various techniques for measuring the structures formed during the patterning process, including the use of scanning electron microscopes, image-based measurement tools and / or various specialized tools. A fast and non-invasive form of specialized measurement tools is one that directs a radiation beam onto a target on the surface of the substrate and measures the properties of the scattered (diffraction / reflection) beam. By evaluating one or more properties of the radiation scattered by the substrate, one or more properties of the substrate can be determined. Traditionally, this can be referred to as diffraction-based measurement. Applications of such diffraction-based measurement include measurements of overlay, alignment, etc. For example, overlay and / or alignment can be measured by comparing parts of the diffraction spectrum (for example, comparing different diffraction orders in the diffraction spectrum of a periodic grating).

[0061] Therefore, in a device manufacturing process (e.g., a patterning process or a lithography process), a substrate or other object may be subjected to various types of measurements during or after the process. The measurements may determine whether a specific substrate has defects, establish adjustments to the process and to the equipment used in the process (e.g., aligning two layers on a substrate or aligning a pattern forming device to a substrate), measure the performance of the process and equipment, or may be used for other purposes. Examples of measurements include optical imaging (e.g., an optical microscope), non-imaging optical measurements (e.g., diffraction-based measurements, such as ASML's EyedStar measurement tool, ASML's SMASH measurement system), mechanical measurements (e.g., profile detection using a stylus, atomic force microscopy (AFM)), and / or non-optical imaging (e.g., scanning electron microscopy (SEM)).

[0062] The measurement results can be provided directly or indirectly to the supervisory control system SCS. If an error is detected, the exposure of subsequent substrates (especially if the inspection can be completed quickly and quickly enough so that one or more other substrates in the batch remain to be exposed) and / or the subsequent exposure of the exposed substrate can be adjusted. In addition, the exposed substrate can be stripped and reworked to improve yield, or discarded, thereby avoiding further processing of substrates known to be defective. In the case where only some target portions of the substrate are defective, further exposure can be performed only on those target portions that meet the specifications. Other manufacturing process adjustments are contemplated.

[0063] A metrology system can be used to determine one or more properties of a substrate structure, and in particular to determine how one or more properties vary between different substrate structures, or how different layers of the same substrate structure vary from layer to layer. The metrology system can be integrated into the lithographic apparatus LA or lithocell LC, or the metrology system can be a separate device.

[0064] In order to achieve the measurement, one or more targets are often specifically provided on the substrate. Typically, the target is specially designed and can include a periodic structure. For example, the target on the substrate can include one or more one-dimensional periodic structures (e.g., geometric features such as gratings), which are printed so that after development, the periodic structural features are formed by solid resist lines. As another example, the target can include one or more two-dimensional periodic structures (e.g., gratings), which are printed so that after development, the one or more periodic structures are formed by through holes in the resist or solid resist guide posts. Alternatively, the bars, guide posts or through holes can be etched into the substrate (e.g., etched into one or more layers on the substrate).

[0065] Figure 3 A schematic representation of overall lithography is depicted, which illustrates the collaboration between three technologies used to optimize semiconductor manufacturing. Typically, the patterning process in a lithographic apparatus LA is one of the most critical steps in a process requiring high-precision sizing and placement of structures on a substrate W ( Figure 1 ). To ensure this high level of precision, the three systems can be combined into a so-called “holistic” control environment, such as Figure 3Schematically depicted. One of these systems is a lithography apparatus LA (virtually) connected to a metrology device (e.g., a metrology tool) MT (a second system) and a computer system CS (a third system). The "holistic" environment can be configured to optimize the collaboration between these three systems to enhance the overall process window and provide a tight control loop to ensure that the patterning performed by the lithography apparatus LA remains within the process window. The process window defines the range of process parameters (e.g., dose, focus, overlay) within which a particular manufacturing process produces a defined result (e.g., a functional semiconductor device). Typically, within this defined result, variations in process parameters within the lithography or patterning process are tolerated.

[0066] The computer system CS can use (part of) the design layout to be patterned to predict which resolution enhancement techniques to use, and perform computational lithography simulations and calculations to determine which mask layouts and lithographic equipment settings achieve the maximum overall process window (in Figure 3 Typically, the resolution enhancement technique is arranged to match the patterning possibilities of the lithographic apparatus LA. The computer system CS may also be used (e.g. using input from a metrology tool MT) to detect where within the process window the lithographic apparatus LA is currently operating, to predict whether defects may be present (e.g. attributable to suboptimal processing). Figure 3 is depicted by an arrow pointing to “0” in the second scale SC2).

[0067] The metrology equipment (tool) MT may provide input to the computer system CS to enable accurate simulations and predictions, and may provide feedback to the lithographic apparatus LA to identify, for example, possible drifts in the calibration state of the lithographic apparatus LA (in Figure 3 ) depicted by multiple arrows in the third scale SC3.

[0068] During photolithography, it is desirable to frequently measure the resulting structures, for example, for process control and verification. Tools used to perform such measurements include metrology tools (devices) MT. Different types of metrology tools MT for performing such measurements are known, including scanning electron microscopes (SEMs) or various forms of scatterometer metrology tools MT. In some embodiments, metrology tool MT is or includes a SEM.

[0069] In some embodiments, the measurement tool MT is or includes a spectroscopic scatterometer, an ellipsometry scatterometer, or other light-based tool. The spectroscopic scatterometer can be configured so that radiation emitted by a radiation source is directed onto a target feature on a substrate and reflected or scattered radiation from the target is directed to a spectrometer detector, which measures the spectrum of the specularly reflected radiation (i.e., a measurement of the intensity as a function of wavelength). From this data, the structure or profile of the target that produced the detected spectrum can be reconstructed, for example, by rigorous coupled wave analysis and nonlinear regression or by comparison with a library of simulated spectra. Ellipsometry scatterometers allow the parameters of a lithography process to be determined by measuring the scattered radiation for each polarization state. Such a measurement tool (MT) emits polarized light (such as linear, circular, or elliptically polarized light) by using, for example, an appropriate polarization filter in the illumination section of the measurement device. A source suitable for the measurement device can also provide polarized radiation.

[0070] As mentioned above, such as Figures 1 to 3 The lithography and / or metrology apparatus shown includes an optical component comprising a (typically metal) mount bonded to an optical device (typically glass) by an adhesive. For maintenance and / or other reasons, the mount and optical device periodically need to be debonded.

[0071] Figure 4 A disassembly (e.g., debonding) system 400 for an optical component 401 is shown. In some embodiments, optical component 401 comprises a face-bonded opto-mechanical component having a plane defined by optical and mechanical surfaces secured parallel to one another using an adhesive. As an example based on semiconductor manufacturing, optical component 401 may be a point cube. As another example, optical component 401 may comprise a portion of an interferometer. In some embodiments, optical component 401 forms part of, and has been removed from, a lithographic apparatus or metrology apparatus used in semiconductor manufacturing.

[0072] exist Figure 4In FIG. 4 , optical component 401 includes a mount 403 and an optical device 405, which is coupled to mount 403 at one or more coupling locations 407 (two locations in this example). Coupling locations 407 may be or include, for example, adhesive pads and / or other components. An adhesive pad may be or include a volume of adhesive (e.g., epoxy or other adhesive) that connects one component to another (in this case, the optical device to the mount). An adhesive pad may be or include a designated area (e.g., a small cavity or protrusion from the mount) configured to receive adhesive of a predetermined shape / size to form a connection between the optical device and the mount. Typically, a small hole is present to allow for adhesive injection, and in the case of a cavity, vent holes may be present on the side to allow the adhesive to dry. Mount 403 may be or include a component that attaches optical device 405 to a surrounding structure. Mount 403 may be or include a mechanical device configured to receive and / or position the optical device within a larger assembly. Typically, mounting 403 is metal and may incorporate features that improve the quality of the interface between the optic and the adhesive and / or features that improve the quality of the interface with the surrounding structure. Optical device 405 may be or include an element or assembly of elements that affects the propagation of electromagnetic waves in a specific and defined manner. This may include modifying the direction of travel, shape, phase, polarization, or any other condition of the wave. Optical device 405 may be or include a reflective or transmissive element, including but not limited to a mirror, lens, cube, beam splitter, polarizer, etc. Typically, mounting 403 may be made of metal and optic 405 may be made of glass, but the techniques described herein may be applied to any heat-promoted debonding process.

[0073] In some embodiments, the optical device 405 can be coupled to the mount 403 at a coupling location 407, such as an adhesive pad. Coupling can include, for example, bonding and / or other coupling techniques. The optical device 405 can be bonded and / or otherwise coupled to the mount 403 using, for example, adhesives and / or other bonding techniques that can use heat (as described herein) to debond and / or otherwise separate. Separation includes structurally separating or disconnecting the optical device 405 from the mount 403. Separation includes, for example, debonding and / or other separation. Separation includes structurally separating the mount 403 and the optical device 405 into two separate parts. The separation system 400 includes one or more heat transfer members 402, a heater 404, a housing 406, and / or other components.

[0074] The one or more heat transfer members 402 are configured to contact the optical component 401 at or near one or more coupling locations 407. In some embodiments, the number of the one or more heat transfer members 402 is the same as the number of coupling locations 407. For example, Figure 4As shown, two heat transfer members 402 are configured to contact the optical component 401 at or near two coupling locations 407. Contact can include touching, nearly touching, and / or other contact. Contact can be facilitated by gravity, with the optical component 401 placed on top of the heat transfer members 402, a coupling mechanism (e.g., screws, clips, clamps, straps, bolts, etc.) configured to hold the optical component 401 against the housing 406 (at the housing coupling location 450) and / or the heat transfer members 402, and / or by other operations or features.

[0075] One or more heat transfer members 402 are configured to transfer heat providing directional heat transfer 410 to one or more connection locations 407 to cause separation of the optical device 405 from the mount 403. Heat transfer 410 can include conduction and / or other heat transfer. One or more heat transfer members 402 are thermally conductive. One or more heat transfer members 402 are configured to provide directional heat transfer to one or more connection locations 407. For example, heat can be conducted directly into the metal mount 403. The use of conduction can enable the system 400 to maintain a large thermal gradient, thereby concentrating the highest temperature at the adhesive at the connection location 407 and keeping the rest of the system 400 at a lower temperature. In some embodiments, member 402 comprises a metal, such as aluminum, steel, and / or other thermally conductive metal. In some embodiments, member 402 comprises a thermally conductive material other than metal.

[0076] In some embodiments, one or more heat transfer members 402 include one or more heat conducting pins. A given pin may have, for example, an elongated cylindrical shape and / or other shapes. Figure 4 As shown, heat transfer members 402 (eg, pins) contact the heater 404 at one end and extend to contact the mount 403 at the opposite end of each pin.

[0077] The heater 404 is configured for one or more heat transfer members 402. The heater 402 is configured to heat the one or more heat transfer members 402 simultaneously. The heater 404 includes a heating plate 412, a heat source 414 and / or other components. The heating plate 412 is coupled to the one or more heat transfer members 402. The heating plate 412 can be coupled to the one or more heat transfer members 402 by screws, clips, clamps, straps, bolts, etc. that are configured to hold the heating plate 412 against the heat transfer member 402. In some embodiments, there can be a press fit between the heating plate 412 and the heat transfer member 402 (e.g., a pin) to ensure maximum contact between the two (and therefore maximum heat conduction between the two). As another example, the heating plate 412 and the heat transfer member 402 can be formed as a single part. Any construction method that has good thermal conductivity is contemplated. The heating plate 412 is configured to simultaneously increase the temperature of and heat the one or more heat transfer members 402. In Figure 4 In the example shown, the heating plate 412 distributes heat received from the heat source 414 (more or less evenly) throughout the heating plate 412 and conducts the heat (in this example, upward) to the thermally conductive member 402, which in turn provides directed heat transfer 410 to the coupling location 407. In some embodiments, the heating plate 412 and / or the heating plate 412 in combination with the coupled heat transfer member 402 can be removable from the system 400. In some embodiments, the heating plate 412 can have handling bosses and / or other features configured to facilitate easier manipulation by an operator to place and / or remove the heating plate 412 from its position in the system 400.

[0078] The heat source 414 is in thermal communication with the heating plate 412. The thermal communication may include direct contact, contact via a heat conducting medium, and / or other thermal communication. For example, in some embodiments, the heating plate 412 may be suspended above the heat source 414 (at Figure 4 414) and / or otherwise secured in contact with, proximate to, or near heat source 414 such that heat generated by heat source 414 is communicated to heating plate 412. Heating plate 412 is configured to absorb heat from heat source 414 and transfer that heat uniformly and simultaneously (or nearly simultaneously) to heat transfer member 402. For example, one or both of heating plate 412 and heat source 414 can be secured to housing 406 (via screws, nuts, clips, clamps, adhesives, straps, and / or other mechanisms) in an orientation that facilitates heat transfer from heat source 414 to heating plate 412 and from heating plate 412 to heat transfer member 402.

[0079] Heat source 414 is configured to provide heat to heating plate 412. In some embodiments, heat source 414 includes an induction burner and / or other heat source. For example, heat source 414 can be configured to heat heating plate 412 via electromagnetic induction (e.g., by passing high-frequency alternating current (AC) through an electromagnet to generate current and heat internally, which heat source 414 then transfers to heating plate 412). In some embodiments, heat source 414 can include a flame, a radiant heater, and / or other heat source.

[0080] In some embodiments, the heat source 414 includes a temperature controller configured to controllably heat the heating plate 412, the one or more heat transfer members 402, the optical component 401 (at its coupling location 407), and / or other components. In some embodiments, the system 400 includes one or more temperature sensors 460 configured to generate output signals indicating the temperature of the housing 406, the heater 404, the one or more heat transfer members 402, the one or more coupling locations 407 of the optical component 401, and / or the temperature of other components. For example, the one or more temperature sensors 460 may include one or more thermocouples. In some embodiments, a first thermocouple may be coupled to the heater 404. A second thermocouple may be coupled to the housing 406 at or near the location where the one or more heat transfer members 402 extend through the housing 406 to contact the optical component 401. A third thermocouple may be coupled to the mount 403 at or near the coupling location 407. Temperature sensor 460 can be wired and / or wireless. In some embodiments, one or more temperature sensors include non-contact temperature sensors, such as infrared (IR) and / or other non-contact temperature sensors. For example, an IR sensor and / or a thermocouple can be configured to directly measure the temperature of the mount or optical device (which can provide a more accurate bond temperature measurement at the joint location). Temperature sensor 460 can be configured to transmit an output signal to heat source 414, computer system CS (in Figure 3 As shown and described above, and / or Figure 8 and described below) and / or other systems configured to control the temperature in the system 400.

[0081] In some embodiments, the output signals from one or more temperature sensors 460 can be used to monitor the temperature of the heater 404, housing 406, coupling location 407, and / or other components of the system 400. In some embodiments, the output signals from one or more temperature sensors 460 can be used to control the heater 404, control debonding, and / or perform other operations. For example, the heater 404 can be configured to cease operation in response to an output signal from one or more temperature sensors 460 indicating that the temperature of the coupling location 407 (or any other described component) has reached a predetermined temperature. The predetermined temperature can be a temperature at which debonding occurs. In some embodiments, the system 400 includes an operator interface (see Figure 5 ), the operator interface is configured to display the temperature of the housing 406, the heater 404, the one or more heat transfer members 402, the one or more coupling locations 407 of the optical component 401, and / or other information.

[0082] The housing 406 is configured to house or contain the heater 404, one or more heat transfer members 402, and / or other components. For example, the housing 406 is configured to thermally isolate the heater 404 and / or one or more heat transfer members 402 from an operator using the disassembly system 400 and / or the surrounding environment. In some embodiments, the housing 406 can be formed from a thermally insulating material such as ceramic, a polymer, a metal with low thermal conductivity, and / or other materials. In some embodiments, the housing 406 can have dimensions (e.g., length, width, height, volume, wall thickness, etc.) configured to house or contain the components of the system 400 as described above, to thermally insulate the components of the system 400, and / or to be configured for other purposes. In some embodiments, the housing 406 can be formed from modular components (e.g., different walls coupled together), can be a single, unitary part, and / or can have other forms.

[0083] Housing 406 is configured to support optical component 401. In some embodiments, optical component 401 can be coupled to housing 406 at one or more housing coupling locations 450. Optical component 401 can be coupled to housing 406 (via screws, nuts, clips, clamps, adhesives, tape, and / or other mechanisms) in an orientation that facilitates heat transfer from heat transfer member 402 to mount 403.

[0084] One or more heat transfer members 402 are configured to extend from the heater 404 through the housing 406 to contact the mount 403 of the optical component 401. For example, in some embodiments, the optical device 405 is coupled to the mount 403 by bonding using an adhesive. The coupling location 407 includes an adhesive pad, and the detachment includes debonding the optical device 405 from the mount 403 at the adhesive pad by providing directional heat transfer through the heat transfer member 402 and the mount 403 to the adhesive.

[0085] In some embodiments, the heat transfer member 402 extends from the heater 404 through the surface 452 of the housing 406 to contact the optical component 401. In some embodiments, the surface 452 of the housing 406 includes a variable adapter. The variable adapter is configured to be changed to facilitate contact between different optical components having different numbers, shapes, sizes, and / or arrangements of coupling locations and different corresponding numbers of one or more heat transfer members 402. For example, the adapter may include a tool plate. The tool plate may have different numbers and / or positions of apertures and / or contact locations for the heat transfer members 402, different numbers and / or positions of threads for coupling the tool plate to the housing 406, and / or other features. For example, the tool plate may be coupled to the rest of the housing 406 such that the heat transfer member 402 protrudes through a corresponding hole in the tool plate. The optical component 401 may be positioned to rest on the heat transfer member 402 such that the coupling location 407 rests directly above the heat transfer member 402 (at Figure 4 ). In some embodiments, corresponding mating portions of the tool plate and / or housing 406 can include pins, slots, attachment points, and / or other features configured to facilitate easy alignment of the tool plate and coupling with the rest of the housing 406. For example, a pin can pass through a hole in the tool plate. There can be a gap / air gap between the pin and the pin hole. The tool plate can rest on the housing 406. For example, there can be an edge in the housing 406 with alignment pins and / or other features that hold the tool plate in place. In some embodiments, the tool plate can include one or more features for aligning the position of the mount 403 on the tool plate to ensure that the bonding pad is centered on the pin.

[0086] In some embodiments, system 400 includes a coupling 420 between the heating plate and the heat source. Coupling 420 is configured to resiliently couple heating plate 412 to heat source 414. Coupling 420 is configured to ensure that heating plate 412 is coupled to one or more heat transfer members 402 regardless of structural variations in heating plate 412, heat source 414, optical component 401, and / or other components. In some embodiments, coupling 420 includes one or more flexible supports. In some embodiments, one or more flexible supports include one or more springs, such as Figure 4As shown. Heat can be transferred from the heat source 414 to the heating plate 412 through a spring, through an air space (or other medium) between the heat source 414 and the heating plate 412 created by a flexible support, and / or heat can be transferred in other ways. For example, the heating plate 412 can be coupled to a coupler 420 that rests on the heat source 414. The heat source 414 (e.g., an induction burner) is configured to transfer electrical energy from a coil to a metal part / container by induction. The coil is mounted near a metal part (e.g., the heating plate 412 here) that is configured to be heated and is not in contact with the heat source 414. The coil generates a magnetic field that alternates at a high frequency, thereby inducing eddy currents in the metal part that generate heat due to electrical resistance. The heat source 414 (e.g., an induction burner) itself does not heat up. (As mentioned above, there are other options for the heat source 414.) As Figure 4 As shown, there is a small gap between the heating plate 412 and the heat source 414. Heat can be conducted to the heat transfer member (e.g., a pin) 1) by direct contact between the heat source 414 and the coupler 420, 2) by conduction through air because the gap between the heating plate 412 and the heat source 414 is small enough to assume that the bottom of the heating plate 412 will closely simulate the temperature of the heat source 414, and / or by other methods.

[0087] Figure 5 Another exemplary view of system 400 is shown. Figure 4 Compared to the narrower cross-sectional view provided in Figure 5 A wider external perspective view of the system 400 is provided. As described above, the split system 400 includes an operator interface 500, a housing 406, one or more heat transfer members 402 (covered by the housing 406 and Figure 5 Not visible in FIG), heater 404 (covered by housing 406 and Figure 5 not visible in the image) and / or other components. Figure 5 Also shown are optical component 401 including mount 403 and optics 405, surface 452 of housing 406, and other components.

[0088] The operator interface 500 is configured to display the housing 406, the heater 404, the one or more heat transfer members 402, the one or more coupling locations 407 of the optical component 401 (covered by the housing 406 and Figure 5Operator interface 500 is configured to provide an interface between system 400 and an operator, through which the operator and / or other user can provide information to and receive information from system 400. This enables the communication of data, prompts, results, and / or instructions, as well as any other communicable items (collectively referred to as "information"), between the operator and one or more components of system 400. For example, the current temperature and / or other information of one or more components of system 400 can be displayed via operator interface 500. Examples of interface devices suitable for inclusion in operator interface 500 include a keypad, buttons, switches, keyboard, knobs, joysticks, display screens, touch screens, speakers, microphones, indicator lights, audible alarms, printers, tactile feedback devices, and / or other interface devices.

[0089] In some embodiments, the operator interface 500 includes multiple separate interfaces. In some embodiments, the operator interface 500 includes at least one interface integrally provided with the housing 406, the computer system CS, and / or other components of the system 400. In some embodiments, the operator interface 500 is configured to communicate wirelessly with other components of the system 400. In some embodiments, the operator interface 500 can be and / or be included in the computer system CS, which is, for example, a desktop computer, a laptop computer, a smart phone, a tablet computer, and / or other computing devices. Such computing devices can run one or more electronic applications having a graphical user interface configured to provide information to a user and / or receive information from a user.

[0090] like Figure 5 As shown, the housing 406 is configured to accommodate the heater 404 ( Figure 4 ), one or more heat transfer members 402 ( Figure 4 ) and / or other components. The housing 406 is configured to support the optical component 401. In some embodiments, the optical component 401 can be coupled to the housing 406 at one or more housing coupling locations 450. As described above, the surface 452 of the housing 406 includes a variable adapter. In this example, the adapter may include a tool plate with a handle 502 that is configured to facilitate switching from one tool plate to another. The tool plate may have a tool plate for the heat transfer member 402 ( Figure 4 ), different numbers and / or locations of apertures and / or contact locations for coupling the tool plate to the housing 406, and / or other features. Figure 5 In the example shown, the housing 406 also includes a heat source 414 ( Figure 4 ) and / or capture heat from the heat source 414 or direct heat from the heat source 414 to the heating plate 412 ( Figure 4 ) additional frame component 510.

[0091] As described above, system 400 is configured to control the disassembly (debonding) time and temperature to achieve repeatable disassembly. The use of conductive heat (as opposed to convection) ensures that the disassembly process is identical for each repetition, without the inconsistencies associated with convection heat transfer. It also ensures that optical component 401 is safe for reuse and improves operator safety when using system 400.

[0092] Figure 6 Analysis results 600 (eg, a thermal temperature gradient map in this example) are shown, which illustrate that the system 400 ( Figure 4 、 Figure 5 ) transfers sufficient heat 602 to the attachment location 407 (eg, bond pad) of the optical component 401 while keeping the optical device 405 cool (compared to the attachment location 407). Figure 6 The side of the optical device 405 facing the mount 403 and the housing 406 is shown (e.g., as Figure 4 shown). Figure 6 In Figure 600, a grayscale color gradient illustrates the varying temperatures from approximately 130°C at or near coupling location 407 to approximately 27°C (approximately room temperature) at the end of optical device 405. In this example, optical device 405 is an interferometer optical device (or a portion of an interferometer optical device). Analysis results 600 show that system 400 was configured to simultaneously and repeatedly heat the three adhesive bonds at coupling location 407 to temperatures exceeding 120°C, while the remainder of optical device 405 (as well as exposed surfaces of mount 403 and other components of system 400) remained below 50°C. This demonstrates the repeatability of heat application and ensures operator safety and the safety of the optical device for reuse, among other advantages.

[0093] Heating in this manner also shows that the temperature gradient of the optical device 405 (see the grayscale color of the analysis results 600), the force with which an operator pulls the optical device 405 away from the mount 403 (e.g., detaching the optical device 405 from the mount 403), and / or the mismatch in the coefficients of thermal expansion between the optical device 405 and the mount 403, do not induce sufficient stress to put the optical device 405 at risk of failure. In this example, the adhesive at the joint location 407 reaches the desired temperature in under 5 minutes, which is less than existing heat gun methods, which can take up to 15 minutes.

[0094] Figure 7A method 700 for disassembling an optical component is presented. The optical component includes a mount and an optical device coupled to the mount at one or more coupling locations. Disassembling includes structurally separating the mount and the optical device into two separate parts. In some embodiments, the optical device is bonded to the mount using an adhesive, the coupling locations include bond pads, and the disassembly includes debonding the optical device from the mount at the bond pads by providing directional heat transfer to the adhesive. In some embodiments, the mount includes metal and the optical device includes glass. In some embodiments, the optical component includes any face-bonded opto-mechanical component having a plane defined by optical and mechanical surfaces, wherein the optical and mechanical surfaces are secured parallel to one another using an adhesive. For example, the optical component can be a point cube, part of an interferometer, and / or other optical component. For example, prior to disassembly (e.g., prior to performing method 700), the optical component can be removed from a lithography apparatus or metrology apparatus used in semiconductor manufacturing.

[0095] Some or all of method 700 may utilize methods such as Figure 4 (and Figure 5 ) and described above, a split system, a computer system CS (e.g., Figure 3 and Figure 8 ) and / or other systems. In some embodiments, for example, method 700 is performed as part of a lithography and / or metrology operation during semiconductor device fabrication. In some embodiments, method 700 includes providing (operation 702) a heat transfer member, heating (operation 704) the heat transfer member with a heater, housing (operation 706) the heat transfer member and heater, and / or other operations that facilitate debonding and / or otherwise separating the optical device from the mount.

[0096] The operations of method 700 are intended to be illustrative. In some embodiments, method 700 may be implemented with one or more additional operations not described and / or without one or more of the operations discussed. For example, in some embodiments, method 700 may include additional operations including determining adjustments to the heating process. Note that the operations of method 700 are not described in detail. Figure 7 The order in which the steps are presented and described herein is not intended to be limiting.

[0097] In some embodiments, one or more portions of the method 700 (e.g., heating control) may be implemented in and / or controlled by one or more processing devices (e.g., digital processors, analog processors, digital circuits designed to process information, analog circuits designed to process information, state machines, and / or other mechanisms for electronically processing information). The one or more processing devices may include one or more devices that perform some or all of the operations of the method 700 in response to instructions stored electronically on an electronic storage medium. The one or more processing devices may include one or more devices configured via hardware, firmware, and / or software that are specifically designed for performance of one or more of the operations of the method 700 (e.g., see the accompanying description below). Figure 8 Related discussions).

[0098] At operation 702, one or more heat transfer members are provided that are configured to contact an optical component at or near one or more coupling locations. In some embodiments, the number of the one or more heat transfer members is the same as the number of coupling locations. The one or more heat transfer members are configured to provide directional heat transfer to the one or more coupling locations (e.g., bond pads) to cause decoupling of the optical device from the mount. Decoupling includes structurally separating or disconnecting the optical device from the mount.

[0099] In some embodiments, the one or more heat transfer members are heat conductive members and are configured to provide directional heat transfer to one or more coupling locations. The one or more heat conductive members may include, for example, one or more heat conductive pins and / or other heat conductive members. In some embodiments, the one or more heat transfer members are connected to the one or more coupling locations. Figure 4 The heat transfer member 402 shown and described above is similar and / or the same.

[0100] At operation 704, one or more heat transfer members are heated simultaneously using a heater. The heater may be Figure 4 The heater 404 shown and described above is similar and / or identical. The heater includes a heating plate, a heat source, and / or other components. The heating plate is coupled to one or more heat transfer members. The heating plate is configured to simultaneously increase the temperature of the one or more heat transfer members and heat the one or more heat transfer members. The heat source is thermally connected to the heating plate. The heat source is configured to provide heat to the heating plate. In some embodiments, the heat source includes an induction burner and / or other heat source. In some embodiments, the heat source includes a temperature controller configured to cause the heat source to controllably heat the heating plate.

[0101] In some embodiments, operation 704 includes providing a coupler of the heating plate and the heat source for elastically coupling the heating plate to the heat source to ensure that the heating plate, the heat source, the optical component, and / or the system 400 ( Figure 4 ) there are structural changes in other parts of the heating plate, the heating plate is also connected to the one or more heat transfer members. The connector between the heating plate and the heat source may include one or more flexible supports, such as, for example, springs and / or other flexible supports.

[0102] In some embodiments, operation 704 includes providing one or more temperature sensors configured to generate output signals indicating the temperature of the housing, the heater, one or more heat transfer members, one or more coupling locations of the optical component, and / or other components. In some embodiments, the one or more temperature sensors include three or more thermocouples. A first thermocouple of the thermocouples can be coupled to the heater. A second thermocouple of the thermocouples can be coupled to the housing at or near a location where the one or more heat transfer members extend through the housing to contact the optical component (e.g., as used herein). A third thermocouple of the three thermocouples can be coupled to a mount at or near the coupling location. In some embodiments, operation 704 includes using the output signals from the one or more temperature sensors to monitor the temperature of the heater, the housing, and / or the coupling locations, control the heater, control separation, and / or perform other operations. In some embodiments, operation 704 includes providing an operator interface configured to display the temperature of the housing, the heater, the one or more heat transfer members, the one or more coupling locations of the optical component, and / or other information.

[0103] At operation 706, a housing is used to house the heater and one or more heat transfer members. The housing may be Figure 4 The housing 406 shown and described above is similar and / or identical. One or more heat transfer members extend from the heater through the housing to contact the optical component. For example, one or more heat transfer members can extend from the heater through the surface of the housing to contact the optical component. The surface of the housing may include a variable adapter. The variable adapter can be configured to be changed to facilitate contact between different optical components having different numbers, shapes, sizes and / or arrangements of connection positions and different corresponding numbers of one or more heat transfer members. The variable adapter can be, for example, a tool plate and / or other variable adapter. For example, the housing can be configured to isolate or insulate the heater and / or the one or more heat transfer members from an operator using the splitting system and / or the surrounding environment.

[0104] In some embodiments, method 700 includes automatically determining a heating temperature process adjustment based on output signals from temperature sensors and / or other operations. For example, if a determined temperature measurement is not within process tolerance, the out-of-tolerance measurement may be caused by a heater whose process parameters have drifted and / or otherwise changed such that the heater no longer generates heat within an acceptable range (e.g., the measurement may have breached an acceptable threshold). One or more new or adjusted temperature parameters may be determined based on the determination of the measurement. The new or adjusted temperature parameters may be configured to cause the debonding process to once again produce an acceptable result.

[0105] In some embodiments, the method 700 may include electrically adjusting a heater (e.g., based on the determined process parameters). Electrically adjusting a heater may include sending an electronic signal and / or other communication to the heater, e.g., causing a change in the heater. Electrical adjustment may include, for example, changing a setting on the heater and / or other adjustments.

[0106] Figure 8 is an exemplary computer system CS (also described in Figure 3 ). A computer system CS includes a bus BS or other communication mechanism for communicating information, and a processor PRO coupled to the bus BS for processing information. The computer system CS also includes a main memory MM, such as a random access memory (RAM) or other dynamic memory, coupled to the bus BS for storing information and instructions to be executed by the processor PRO. The main memory MM can also be used to store temporary variables or other intermediate information during the execution of instructions by the processor PRO. The computer system CS also includes a read-only memory (ROM) or other static storage device coupled to the bus BS for storing static information and instructions for the processor PRO. A storage device SD, such as a magnetic disk or optical disk, is provided and coupled to the bus BS for storing information and instructions.

[0107] The computer system CS may be coupled by a bus BS to a display DS (eg, Figure 5An operator interface 500 is shown in FIG. , such as a flat-panel or touch-panel display or a cathode ray tube (CRT). An input device ID, including alphanumeric and other keys, is connected to the bus BS for communicating information and command selections to the processor PRO. Another type of user input device is a cursor control CC, such as a mouse, trackball, or cursor direction keys, for communicating directional information and command selections to the processor PRO and for controlling the movement of a cursor on the display DS. This type of input device typically has two degrees of freedom in two axes: a first axis (e.g., the x-axis) and a second axis (e.g., the y-axis), allowing the device to specify a position in a plane. A touch-panel (screen) display can also be used as an input device.

[0108] In some embodiments, all or some of one or more operations described herein (e.g., controlling an actuator to move a stage, controlling a measurement device, analyzing sensor data, etc.) can be performed by a computer system CS in response to a processor PRO executing one or more sequences of one or more instructions contained in a main memory MM. These instructions can be read into the main memory MM from another computer-readable medium (such as a storage device SD). Execution of the sequence of instructions contained in the main memory MM causes the processor PRO to perform the process steps (operations) described herein. One or more processors in a multi-processing arrangement can also be used to execute the sequence of instructions contained in the main memory MM. In some embodiments, hard-wired circuitry can be used in place of or in combination with software instructions. Therefore, the description herein is not limited to any specific combination of hardware circuitry and software.

[0109] As used herein, the term "computer-readable medium" or "machine-readable medium" refers to any medium that participates in providing instructions to the processor PRO for execution. Such media can take many forms, including but not limited to non-volatile media, volatile media, and transmission media. Non-volatile media include, for example, optical or magnetic disks, such as a storage device SD. Volatile media include volatile memory, such as main memory MM. Transmission media include coaxial cables, copper wire, and optical fiber, including the wires comprising the bus BS. Transmission media can also take the form of sound or light waves, such as those generated during radio frequency (RF) and infrared (IR) data communications. Computer-readable media can be non-transitory, such as a floppy disk, a flexible magnetic disk, a hard disk, magnetic tape, any other magnetic medium, a CD-ROM, a DVD, any other optical medium, punch cards, paper tape, any other physical medium with a pattern of holes, RAM, PROM and EPROM, FLASH-EPROM, or any other memory chip or cartridge. Non-transitory computer-readable media can have instructions recorded thereon. When executed by a computer, the instructions can implement any of the operations described herein. For example, transitory computer readable media may include carrier waves or other propagated electromagnetic signals.

[0110] Various forms of computer-readable media can be involved when one or more sequences of one or more instructions are loaded into the processor PRO for execution. For example, instructions can be initially loaded onto a disk of a remote computer. The remote computer can load instructions into its volatile memory and send instructions via a telephone line using a modem. The modem local to the computer system CS can receive data on the telephone line and use an infrared transmitter to convert the data into infrared signals. The infrared detector connected to the bus BS can receive the data carried in the infrared signal and place the data on the bus BS. The bus BS carries the data to the main memory MM, from which the processor PRO obtains and executes the instruction. The instruction received by the main memory MM can optionally be stored on the storage device SD before or after being executed by the processor PRO.

[0111] The computer system CS may also include a communication interface CI coupled to the bus BS. The communication interface CI provides a bidirectional data communication connection to a network link NDL, which is connected to a local area network LAN. For example, the communication interface CI may be an integrated services digital network (ISDN) card or a modem to provide a data communication connection to a corresponding type of telephone line. As another example, the communication interface CI may be a local area network (LAN) card that provides a data communication connection to a compatible LAN. A wireless link may also be implemented. In any such embodiment, the communication interface CI sends and receives electrical, electromagnetic, or optical signals that carry digital data streams representing various types of information.

[0112] The network link NDL typically provides data communications to other data devices via one or more networks. For example, the network link NDL may be provided by a local area network LAN connected to the host computer HC. This may include data communications services provided via the global packet data communications network (now commonly referred to as the "Internet" INT). The local area network LAN (Internet) may use electrical, electromagnetic, or optical signals to carry digital data streams. The signals passing through the various networks and the signals on the network data link NDL and via the communication interface CI are exemplary carrier waves that transport information, carrying digital data to and from the computer system CS.

[0113] The computer system CS can send messages and receive data (including program code) via a network, a network data link NDL, and a communication interface CI. In the example of the Internet, the host computer HC can transmit requested program code for an application via the Internet INT, the network data link NDL, the local area network LAN, and the communication interface CI. For example, such a downloaded application can provide all or part of the methods described herein. The received code can be executed by the processor PRO upon receipt and / or stored in a storage device SD or other non-volatile memory for later execution. In this way, the computer system CS can obtain application code in the form of a carrier wave.

[0114] Multiple embodiments of the present system and method are disclosed in the subsequent list of numbered clauses. Below, other features, characteristics and exemplary technical solutions of the present disclosure will be described according to the clauses that can be optionally claimed in any combination:

[0115] 1. A system for separating an optical component, the optical component comprising a mount and an optical device coupled to the mount at one or more coupling locations, the system comprising: one or more heat transfer members configured to contact the optical component near the one or more coupling locations, the one or more heat transfer members configured to transfer heat to the one or more coupling locations to cause separation, wherein the separation comprises structural separation or disconnection of the optical device from the mount; a heater configured to simultaneously heat the one or more heat transfer members; and a housing configured to house the heater and the one or more heat transfer members, wherein the one or more heat transfer members extend from the heater through the housing to contact the optical component.

[0116] 2. The system of clause 1, wherein the one or more heat transfer members are thermally conductive members and are configured to transfer heat to the one or more coupling locations.

[0117] 3. The system of any preceding clause, wherein the one or more thermally conductive members comprise one or more thermally conductive pins.

[0118] 3. A system according to any of the preceding clauses, wherein the heater comprises: a heating plate coupled to the one or more heat transfer members, the heating plate being configured to simultaneously increase the temperature of the one or more heat transfer members and heat the one or more heat transfer members; and a heat source thermally connected to the heating plate, the heat source being configured to provide heat to the heating plate.

[0119] 5. The system of any preceding clause, wherein the heat source comprises an induction burner.

[0120] 6. The system of any preceding clause, wherein the heat source comprises a temperature controller configured to cause the heat source to controllably heat the heating plate.

[0121] 7. The system of any of the preceding clauses, further comprising a heating plate to heat source coupler configured to elastically couple the heating plate to the heat source to ensure that the heating plate is coupled to the one or more heat transfer members even if the heating plate, the heat source, and / or the optical component are present or undergo structural changes.

[0122] 8. The system of any preceding clause, wherein the coupling of the heating plate to the heat source comprises one or more flexible supports.

[0123] 9. The system of any preceding clause, wherein the one or more flexible supports comprise one or more springs.

[0124] 10. The system of any preceding clause, wherein disassembling comprises structurally separating the mount and the optical device into two separate parts.

[0125] 11. A system according to any of the preceding clauses, wherein the optical device is coupled to the mount by bonding using an adhesive, the coupling location includes a bonding pad, and the separation includes debonding the optical device from the mount at the bonding pad by transferring heat to the adhesive.

[0126] 12. The system of any preceding clause, wherein the one or more heat transfer members extend from the heater through a surface of the housing to contact the optical component, and wherein the surface of the housing includes a variable adapter.

[0127] 13. A system according to any of the preceding clauses, wherein the variable adapter is configured to be changed to facilitate contact between different optical components having different numbers, shapes, sizes and / or arrangements of coupling locations and different corresponding numbers of the one or more heat transfer members.

[0128] 14. The system of any preceding clause, wherein the adapter comprises a tool plate.

[0129] 15. The system of any preceding clause, wherein the number of the one or more heat transfer members is the same as the number of coupling locations.

[0130] 16. The system according to any of the preceding clauses further comprises one or more temperature sensors configured to generate an output signal indicative of the temperature of the housing, the heater, the one or more heat transfer members and / or the one or more connection locations of the optical component.

[0131] 17. A system according to any of the preceding clauses, wherein the one or more temperature sensors include three thermocouples, wherein a first thermocouple of the three thermocouples is coupled to the heater, a second thermocouple of the three thermocouples is coupled to the housing at or near a location where the one or more heat transfer members extend through the housing to contact the optical component, and a third thermocouple of the three thermocouples is coupled to the mount at or near a coupling location.

[0132] 18. A system according to any of the preceding clauses, wherein the output signal from the one or more temperature sensors is configured to monitor the temperature of the heater, the housing and / or the connection location, control the heater, and / or control the separation.

[0133] 19. The system of any of the preceding clauses, further comprising an operator interface configured to display the temperature of the housing, the heater, the one or more heat transfer members, and / or the one or more coupling locations of the optical component.

[0134] 20. The system of any preceding clause, wherein the housing is configured to thermally isolate the heater and / or the one or more heat transfer members from an operator using the splitting system and / or the surrounding environment.

[0135] 21. The system of any preceding clause, wherein the mount comprises metal and the optics comprises glass.

[0136] 22. The system of any preceding clause, wherein the optical component comprises a surface-bonded opto-mechanical component having a plane defined by optical and mechanical surfaces, the optical and mechanical surfaces being secured parallel to one another using an adhesive.

[0137] 23. The system of any preceding clause, wherein the optical component is a point cube.

[0138] 24. The system of any preceding clause, wherein the optical component comprises a portion of an interferometer.

[0139] 25. A system according to any preceding clause, wherein the optical component forms part of a lithographic apparatus or a metrology apparatus used for semiconductor manufacturing and has been removed from the lithographic apparatus or the metrology apparatus.

[0140] 26. A method for disassembling an optical component, the optical component comprising a mount and an optical device connected to the mount at one or more connection positions, the disassembly method comprising: providing one or more heat transfer members, the one or more heat transfer members being configured to contact the optical component at or near the one or more connection positions, the one or more heat transfer members being configured to transfer heat to the one or more connection positions to cause disassembly, the disassembly comprising structural separation or disconnection of the optical device from the mount; simultaneously heating the one or more heat transfer members using a heater; and accommodating the heater and the one or more heat transfer members using a housing, wherein the one or more heat transfer members extend from the heater through the housing to contact the optical component.

[0141] 27. The method of clause 26, wherein the one or more heat transfer members are thermally conductive members and are configured to provide the transferred heat to the one or more coupling locations via conduction.

[0142] 28. A method according to any preceding clause, wherein the one or more thermally conductive members comprise one or more thermally conductive pins.

[0143] 29. A method according to any of the preceding clauses, wherein the heater comprises: a heating plate connected to the one or more heat transfer members, the heating plate being configured to simultaneously increase the temperature of the one or more heat transfer members and heat the one or more heat transfer members; and a heat source in thermal communication with the heating plate, the heat source being configured to provide heat to the heating plate.

[0144] 30. The method of any preceding clause, wherein the heat source comprises an induction burner.

[0145] 31. The method of any preceding clause, wherein the heat source comprises a temperature controller configured to cause the heat source to controllably heat the heating plate.

[0146] 32. The method according to any of the preceding clauses further comprises: providing a connector between the heating plate and the heat source for elastically coupling the heating plate to the heat source to ensure that the heating plate is coupled to the one or more heat transfer members even if the heating plate, the heat source and / or the optical component are present or undergo structural changes.

[0147] 33. A method according to any preceding clause, wherein the coupling of the heating plate to the heat source comprises one or more flexible supports.

[0148] 34. The method of any preceding clause, wherein the one or more flexible supports comprise one or more springs.

[0149] 35. The method of any preceding clause, wherein disassembling comprises structurally separating the mount and the optical device into two separate parts.

[0150] 36. A method according to any of the preceding clauses, wherein the optical device is connected to the mounting member by bonding using an adhesive, the connection location includes a bonding pad, and the separation includes debonding the optical device from the mounting member at the bonding pad by providing the transmitted heat to the adhesive.

[0151] 37. The method of any preceding clause, wherein the one or more heat transfer members extend from the heater through a surface of the housing to contact the optical component, and wherein the surface of the housing includes a variable adapter.

[0152] 38. A method according to any of the preceding clauses, wherein the variable adapter is configured to be changed to facilitate contact between different optical components having different numbers, shapes, sizes and / or arrangements of coupling locations and different corresponding numbers of the one or more heat transfer members.

[0153] 39. A method according to any preceding clause, wherein the adapter comprises a tool plate.

[0154] 40. The method of any preceding clause, wherein the number of the one or more heat transfer members is the same as the number of coupling locations.

[0155] 41. The method according to any of the preceding clauses further comprises: providing one or more temperature sensors, wherein the one or more temperature sensors are configured to generate an output signal indicating the temperature of the housing, the heater, the one or more heat transfer members and / or the one or more connection locations of the optical component.

[0156] 42. A method according to any of the preceding clauses, wherein the one or more temperature sensors include three thermocouples, wherein a first thermocouple of the three thermocouples is coupled to the heater, a second thermocouple of the three thermocouples is coupled to the housing at or near a location where the one or more heat transfer members extend through the housing to contact the optical component, and a third thermocouple of the three thermocouples is coupled to the mount at or near a coupling location.

[0157] 43. The method of any of the preceding clauses, further comprising: using output signals from the one or more temperature sensors to monitor the temperature of the heater, housing, and / or coupling location, control the heater, and / or control the separation.

[0158] 44. The method of any of the preceding clauses, further comprising providing an operator interface configured to display the temperature of the housing, the heater, the one or more heat transfer members, and / or the one or more connection locations of the optical component.

[0159] 45. The method of any preceding clause, further comprising: thermally isolating the heater and / or the one or more heat transfer members from an operator using the disassembly system and / or the surrounding environment using the housing.

[0160] 46. ​​The method of any preceding clause, wherein the mount comprises metal and the optic comprises glass.

[0161] 47. The method of any preceding clause, wherein the optical component comprises a surface-bonded opto-mechanical component having a plane defined by optical and mechanical surfaces, the optical and mechanical surfaces being secured parallel to one another using an adhesive.

[0162] 48. A method according to any preceding clause, wherein the optical component is a point cube.

[0163] 49. A method according to any preceding clause, wherein the optical component comprises a part of an interferometer.

[0164] 50. The method of any preceding clause, further comprising removing the optical component from a lithographic apparatus or metrology equipment used in semiconductor manufacturing prior to separation.

[0165] The concepts disclosed herein can be associated with imaging and / or fabricating sub-wavelength features and can be particularly useful for emerging imaging technologies capable of producing increasingly shorter wavelengths. Emerging technologies already in use include EUV (extreme ultraviolet) and DUV lithography, which can produce wavelengths of 193 nm using ArF lasers and even 157 nm using fluorine lasers. Furthermore, EUV lithography can produce wavelengths in the 20 nm to 5 nm range using synchrotrons or by bombarding materials (solid or plasma) with high-energy electrons to generate photons in this range.

[0166] While the concepts disclosed herein can be used for imaging on substrates such as silicon wafers, it should be understood that the disclosed concepts can be used with any type of lithography imaging system and / or metrology system, for example, a lithography imaging system for imaging and / or measuring features on substrates other than silicon wafers. Furthermore, combinations and subcombinations of the disclosed elements may include separate embodiments. For example, one or more of the elements and / or operations described above may be included in separate embodiments, or they may be included together in the same embodiment.

[0167] The foregoing description is intended to be illustrative rather than restrictive. Accordingly, those skilled in the art will appreciate that modifications may be made as described without departing from the scope of the claims set forth hereinafter.

Claims

1. A disassembly system for an optical component, the optical component comprising a mount and an optical device coupled to the mount at one or more coupling locations, the disassembly system comprising: one or more heat transfer members configured to contact the optical component proximate the one or more coupling locations, the one or more heat transfer members configured to transfer heat to the one or more coupling locations to cause detachment, wherein the detachment comprises structural separation of the optical device from the mount; a heater configured to simultaneously heat the one or more heat transfer members; and A housing is configured to house the heater and the one or more heat transfer members, wherein the one or more heat transfer members extend from the heater through the housing to contact the optical component.

2. The system of claim 1, wherein: The one or more heat transfer members are thermally conductive members and are configured to transfer heat to the one or more coupling locations by conduction; and The one or more thermally conductive members include one or more thermally conductive pins.

3. The system according to claim 1, wherein: The heater comprises: a heating plate coupled to the one or more heat transfer members, the heating plate configured to simultaneously increase the temperature of the one or more heat transfer members and heat the one or more heat transfer members; and a heat source in thermal communication with the heating plate, the heat source configured to provide heat to the heating plate, wherein the heat source comprises: Induction burners; and A temperature controller is configured to cause the heat source to controllably heat the heating plate.

4. The system of claim 3, further comprising a heating plate to heat source coupler configured to resiliently couple the heating plate to the heat source to ensure that the heating plate remains coupled to the one or more heat transfer members even if there are structural changes in the heating plate, the heat source, and / or the optical component, wherein: The coupling of the heating plate to the heat source comprises one or more flexible supports; and The one or more flexible supports include one or more springs.

5. The system of claim 1 , wherein: The disassembly includes structurally separating the mount and the optical device into two separate parts; The optical device is coupled to the mount by bonding using an adhesive, the coupling location includes a bonding pad, and the detaching includes debonding the optical device from the mount at the bonding pad by transferring heat to the adhesive; the one or more heat transfer members extending from the heater through a surface of the housing to contact the optical component, and wherein the surface of the housing includes a variable adapter, wherein the variable adapter is a tool plate, and wherein the variable adapter is configured to be changed to facilitate contact between different optical components having different numbers, shapes, sizes, and / or arrangements of coupling locations and different corresponding numbers of the one or more heat transfer members; and The number of the one or more heat transfer members is the same as the number of the coupling locations.

6. The system of claim 1 , further comprising one or more temperature sensors configured to generate an output signal indicative of a temperature of the housing, the heater, the one or more heat transfer members, and / or the one or more coupling locations of the optical component; in, The one or more temperature sensors include three thermocouples, wherein a first thermocouple of the three thermocouples is coupled to the heater, a second thermocouple of the three thermocouples is coupled to the housing near a location where the one or more heat transfer members extend through the housing to contact the optical component, and a third thermocouple of the three thermocouples is coupled to the mount near a coupling location.

7. The system according to claim 6, wherein: The output signals from the one or more temperature sensors are configured to monitor the temperature of the heater, the housing, and / or the coupling location, control the heater, and / or control the separation; The disassembly system further includes an operator interface configured to display temperatures of the housing, the heater, the one or more heat transfer members, and / or the one or more coupling locations of the optical component.

8. The system according to claim 1, wherein: The housing is configured to thermally isolate the heater and / or the one or more heat transfer members from an operator using the demultiplexing system and / or the surrounding environment, and wherein the mount comprises metal and the optics comprises glass.

9. The system according to claim 1, wherein: The optical component includes a surface-bonded opto-mechanical component having a plane defined by optical and mechanical surfaces secured parallel to one another using an adhesive.

10. The system according to claim 1, wherein: The optical component is a point cube.

11. The system according to claim 1, wherein: The optical component comprises a portion of an interferometer.

12. The system according to claim 1, wherein: The optical component forms part of a lithographic apparatus or a metrology apparatus used for semiconductor manufacturing and has been removed from the lithographic apparatus or the metrology apparatus.

13. A method for disassembling an optical component, the optical component comprising a mount and an optical device coupled to the mount at one or more coupling locations, the method comprising: providing one or more heat transfer members configured to contact the optical component proximate the one or more coupling locations, the one or more heat transfer members configured to transfer heat to the one or more coupling locations to cause the detachment, wherein the detachment comprises structural separation of the optical device from the mount; simultaneously heating the one or more heat transfer members using a heater; as well as The heater and the one or more heat transfer members are housed by a housing, wherein the one or more heat transfer members extend from the heater through the housing to contact the optical component.

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