Device comprising copper plate, welding method and welding device

Abstract

The invention provides a device comprising a copper plate, a welding method and a welding device.The device comprising the copper plate comprises a carrier and a plate body, and the carrier is matched with the plate body; a welding channel is arranged at one end, adjacent to the plate body, of the carrier; the plate body and the welding channel form a welding space; the method comprises the following steps: placing solder between a carrier and a plate body; the carrier and the plate body are fixed, pressure is applied to the carrier and the plate body, and the plate body and the carrier are in a pressed state; heating the fixed carrier and the plate body to melt the welding flux between the carrier and the plate body; and melted welding flux is respectively arranged between the carrier and the plate body and in the welding space. The welding device comprises a supporting body and a pressure applying body which are connected through a plurality of locking pieces, and a forming space is formed between the supporting body and the pressure applying body. According to the device comprising the copper plate, the welding method and the welding device, the welding firmness between the carrier and the plate body can be improved, meanwhile, welding flux filling is more uniform, and the sealing performance after welding is ensured.

Description

Technical Field

[0001] The present invention relates to the field of welding technology, and in particular to a device comprising a copper plate, a welding method and a welding device. Background Art

[0002] In the prior art, when products made of copper materials are welded on the joint surfaces, brazing is generally used to weld the joint surfaces. The joint surfaces of the product include a first surface and a second surface, and both the first surface and the second surface are flat. During welding, the solder structure can only flow upward along the metal surface and fill at a 90-degree right angle. As the solder structure flows, the solder structure will be missing at some welding positions, thereby causing insufficient solder structure filling between the joint surfaces of the product, increasing the chance of leakage during subsequent product use. Summary of the Invention

[0003] The object of the present invention is to provide a device including a copper plate, a welding method and a welding device, which can solve the above-mentioned technical problems;

[0004] The present invention provides a device comprising a copper plate, comprising:

[0005] The carrier and the plate body are adapted to each other; wherein a welding bead is provided on one end of the carrier adjacent to the plate body;

[0006] The welding bead is opened along the top surface of one end of the carrier;

[0007] When the plate body is placed on the carrier, the plate body and the welding path form a welding space.

[0008] As a further technical solution, the welding bead protrudes from one end of the carrier.

[0009] As a further technical solution, the welding path includes an inner wall and an outer wall; when the plate body is placed on the carrier, a welding groove is formed between the inner wall and the plate body.

[0010] The present invention also provides a method for welding a device including a copper plate, comprising the following steps:

[0011] placing solder between the carrier and the board;

[0012] Fix the carrier and the plate, and apply pressure to the carrier and the plate respectively, so that the plate and the carrier are in a compressed state;

[0013] The fixed carrier and the plate are heated to melt the solder between the carrier and the plate;

[0014] The melted solder is placed between the carrier and the plate body and in the welding space respectively.

[0015] As a further technical solution, the solder is a nickel-phosphorus alloy.

[0016] As a further technical solution, the weight ratio of the nickel-phosphorus alloy is: nickel content is 88%-90%, and phosphorus content is 10%-12%.

[0017] As a further technical solution, a first bonding surface and a second bonding surface are formed between the carrier and the plate body, and the first bonding surface and the second bonding surface are placed on both sides of the welding space. The melted solder is respectively placed on the first bonding surface, the second bonding surface, the bonding position between the first bonding surface and the welding space, and the bonding position between the second bonding surface and the welding space; the cooled solder forms a first welding corner and a second welding corner at the bonding position between the first bonding surface and the welding space and at the bonding position between the second bonding surface and the welding space; the cooled solder forms a third welding corner in the welding groove.

[0018] As a further technical solution, the melted solder is placed in a soldering tank.

[0019] The present invention also provides a welding device using the welding method, comprising:

[0020] The supporting body and the pressure-applying body are connected via a plurality of locking members, and a forming space is formed between the supporting body and the pressure-applying body.

[0021] As a further technical solution, a first pressing plate is provided on the supporting body, and a second pressing plate is provided on the pressure-applying body; and the first pressing plate is adapted to the carrier.

[0022] The technical solution of the present invention is to open a welding path at one end of a carrier on a device including a copper plate, and form a welding space after cooperating with the plate body. After placing solder between the plate body and the carrier, the solder is melted by applying pressure and heating, and the melted solder is placed between the carrier and the plate body and in the welding space, and multiple welding positions are formed after cooling. Through the cooperation of multiple welding positions, the firmness of the welding between the carrier and the plate body can be improved, and the solder filling is more uniform, ensuring the sealing after welding. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 This is a schematic structural diagram of a device comprising a copper plate according to the present invention;

[0025] Figure 2 for Figure 1 Cross-sectional view of the AA section;

[0026] Figure 3 for Figure 2 A schematic diagram of the structure of the X part in the middle;

[0027] Figure 4 A perspective view of a device comprising a copper plate according to the present invention;

[0028] Figure 5 A flow chart of a welding method according to the present invention;

[0029] Figure 6 This is a diagram showing the state between the carrier and the plate after the solder has cooled in the present invention;

[0030] Figure 7 This is the welding effect diagram inside the carrier after the ultrasonic wave penetrates the board body in the cooling state;

[0031] Figure 8 Schematic diagram of the structure of the welding device in the present invention;

[0032] Figure 9 is a three-dimensional diagram of the welding device of the present invention;

[0033] Figure 10 Schematic diagram of the structure of the combination of the welding device and the device containing the copper plate in the present invention;

[0034] Figure 11 A perspective view of a combination of a welding device and a device including a copper plate according to the present invention;

[0035] Description of reference numerals:

[0036] 100-carrier; 200-plate body; 300-welding bead; 301-inner wall; 302-outer wall; 400-welding groove; 501-first welding corner; 502-second welding corner; 503-third welding corner; 601-support body; 602-first pressure plate; 701-pressure body; 702-second pressure plate; 800-locking piece. DETAILED DESCRIPTION

[0037] The technical solutions of the present invention are described clearly and completely below with reference to the embodiments. It is obvious that the embodiments described are only a portion of the embodiments of the present invention, not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.

[0038] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operate in a specific direction, and therefore should not be understood as limiting the present invention.

[0039] In addition, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of the present invention, "multiple" means two or more, unless otherwise clearly and specifically defined. In addition, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a communication between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0040] like Figure 1-4 As shown, the present invention proposes a device comprising a copper plate, comprising:

[0041] The carrier 100 and the plate 200 are adapted to each other; wherein, a welding bead 300 is provided on one end of the carrier 100 adjacent to the plate 200; during welding, solder is placed between the carrier 100 and the plate 200, and the carrier 100 and the plate 200 are welded by the solder in the subsequent forming stage; specifically, the welding bead 300 is opened along the top surface of one end of the carrier 100; in the present invention, the welding bead 300 is a connected annular welding bead 300; when the plate 200 is placed on the carrier 100, the plate 200 is welded to the carrier 100. 0 and the welding bead 300 form a welding space; in this way, during the welding process, it is ensured that the welding space can be fully distributed between the carrier 100 and the plate body 200, thereby ensuring the welding effect; specifically, the welding bead 300 protrudes from one end of the carrier 100; after contacting the plate body 200, it can only contact the plate body 200 through the welding bead 300. At the same time, when setting the solder, the solder is placed between the welding bead 300 and the plate body 200. When welding, the welding bead 300 and the plate body 200 are welded, and multiple welding positions can be formed after welding to improve the sealing effect.

[0042] In the present invention, the welding bead 300 includes an inner wall 301 and an outer wall 302; when the plate body 200 is placed on the carrier 100, a welding groove 400 is formed between the inner wall 301 and the plate body 200; after the solder is set, the whole is heated, and the solder will enter the welding space and the welding groove 400 after melting, and complete the welding between the carrier 100 and the plate body 200 after cooling, wherein the inner wall 301 and the outer wall 302 both form a 90° right angle with the plate body 200, which can increase the solder's immersion position.

[0043] like Figure 5-6 As shown, the present invention also provides a method for welding a device including a copper plate, comprising the following steps:

[0044] Solder is placed between the carrier 100 and the plate body 200; the carrier 100 and the plate body 200 are fixed, and pressure is applied to the carrier 100 and the plate body 200 respectively, so that the plate body 200 and the carrier 100 are in a compressed state; the fixed carrier 100 and the plate body 200 are heated to melt the solder between the carrier 100 and the plate body 200; the melted solder is placed between the carrier 100 and the plate body 200 and in the welding space respectively; after cooling, a weld is formed, and the weld between the carrier 100 and the plate body 200 is sealed; in the present invention, the solder is a nickel-phosphorus alloy; wherein the weight ratio of the nickel-phosphorus alloy is: nickel content is 88%-90%, and phosphorus content is 10%-12%.

[0045] Example 1:

[0046] A nickel-phosphorus alloy is placed between a carrier 100 and a plate 200 made of red copper; the carrier 100 and the plate 200 are fixed, and pressure is applied to the carrier 100 and the plate 200 respectively, so that the plate 200 and the carrier 100 are in a compressed state; the fixed carrier 100 and the plate 200 are placed in a heating device at 870°C for heating to melt the nickel-phosphorus alloy between the carrier 100 and the plate 200; the melted nickel-phosphorus alloy is placed between the carrier 100 and the plate 200 and in the welding space; after cooling, a weld is formed, and sealing is performed through the weld between the carrier 100 and the plate 200; wherein the weight ratio of the nickel-phosphorus alloy is: nickel content is 90% and phosphorus content is 10%.

[0047] Example 2:

[0048] A nickel-phosphorus alloy is placed between a carrier 100 and a plate 200 made of red copper; the carrier 100 and the plate 200 are fixed, and pressure is applied to the carrier 100 and the plate 200 respectively, so that the plate 200 and the carrier 100 are in a compressed state; the fixed carrier 100 and the plate 200 are placed in a heating device at 850°C for heating to melt the nickel-phosphorus alloy between the carrier 100 and the plate 200; the melted nickel-phosphorus alloy is placed between the carrier 100 and the plate 200 and in the welding space; after cooling, a weld is formed, and sealing is performed through the weld between the carrier 100 and the plate 200; wherein the weight ratio of the nickel-phosphorus alloy is: nickel content is 88% and phosphorus content is 12%.

[0049] Example 3:

[0050] A nickel-phosphorus alloy is placed between a carrier 100 and a plate 200 made of red copper; the carrier 100 and the plate 200 are fixed, and pressure is applied to the carrier 100 and the plate 200 respectively, so that the plate 200 and the carrier 100 are in a compressed state; the fixed carrier 100 and the plate 200 are placed in a heating device at 860°C for heating to melt the nickel-phosphorus alloy between the carrier 100 and the plate 200; the melted nickel-phosphorus alloy is placed between the carrier 100 and the plate 200 and in the welding space; after cooling, a weld is formed, and sealing is performed through the weld between the carrier 100 and the plate 200; wherein the weight ratio of the nickel-phosphorus alloy is: nickel content is 89% and phosphorus content is 11%.

[0051] like Figure 6 As shown, a first bonding surface and a second bonding surface are formed between the carrier 100 and the board body 200, and the first bonding surface and the second bonding surface are placed on both sides of the welding space. The melted solder is respectively placed on the first bonding surface, the second bonding surface, the bonding position between the first bonding surface and the welding space, and the bonding position between the second bonding surface and the welding space; the cooled solder forms a first welding corner 501 and a second welding corner 502 at the bonding position between the first bonding surface and the welding space and at the bonding position between the second bonding surface and the welding space, respectively; the cooled solder forms a third welding corner 503 in the welding groove 400.

[0052] Before applying pressure to the carrier 100 and the pressure plate, a nickel-phosphorus alloy is placed on the first bonding surface and the second bonding surface. After the nickel-phosphorus alloy is placed, the carrier 100 and the pressure plate are pressed, and the pressed carrier 100 and the plate body 200 are heated to melt the nickel-phosphorus alloy. The melted nickel-phosphorus alloy is in liquid state and flows in the liquid state and is placed at the bonding position between the first bonding surface and the welding space, the bonding position between the second welding surface and the welding space, and at the same time between the first bonding surface and the second bonding surface. After cooling, a first weld corner 501 and a second weld corner 502 are formed at the bonding position between the first bonding surface and the welding space and the bonding position between the second welding surface and the welding space, respectively, thereby achieving double sealing.

[0053] In addition, due to the setting of the welding groove 400, when the solder is melted and in liquid state, it will flow into the welding groove 400; and after cooling, a third welding corner 503 will be formed; at the same time, multiple sealing is achieved by cooperating with the first welding corner 501, the second welding corner 502, the first bonding surface and the second bonding surface to improve the sealing effect; Figure 7 As shown, after the carrier 100 and the plate body 200 are welded by a welding method, ultrasound is used to penetrate the plate body 200 to display the interior of the carrier 100, and the welding space can be clearly seen, further verifying that the solder is placed on the first bonding surface and the second bonding surface respectively during heating, and after cooling, the first welding corner 501, the second welding corner 502 and the third welding corner 503 are formed; that is, multiple seals are formed.

[0054] like Figure 8-11 As shown, the present invention also proposes a welding device using the welding method, comprising:

[0055] The support body 601 and the pressure body 701 are connected to each other by a plurality of locking members 800, and a molding space is formed between the support body 601 and the pressure body 701; during the use phase, solder is set between the carrier 100 and the plate body 200 and placed in the molding space, and the distance between the support body 601 and the pressure body 701 is adjusted by a plurality of locking members 800, thereby adjusting the pressure between the carrier 100 and the plate body 200; specifically, the plate body 200 and the pressure body 701 are arranged adjacent to each other; the carrier 100 is arranged on the support body 601; when the plurality of locking members 800 are adjusted, the pressure between the plate body 200 and the support body 601 can be adjusted to ensure that the solder is pressed between the plate body 200 and the carrier 100.

[0056] In addition, a first pressure plate 602 is provided on the support body 601, and a second pressure plate 702 is provided on the pressure body 701; and the first pressure plate 602 is adapted to the carrier 100; the carrier 100 and the plate body 200 are supported by the first pressure plate 602 and the second pressure plate 702, and at the same time, it is necessary to ensure that the melting points of the first pressure plate 602 and the second pressure plate 702 are higher than the melting points of the carrier 100 and the plate body 200; in the present invention, the first pressure plate 602 and the second pressure plate 702 are both graphite pressure plates.

[0057] The technical solution of the present invention is to open a welding bead 300 at one end of a carrier 100 on a device including a copper plate, and form a welding space after cooperating with the plate body 200. After placing solder between the plate body 200 and the carrier 100, the solder is melted by applying pressure and heating, and the melted solder is placed between the carrier 100 and the plate body 200 and in the welding space, and multiple welding positions are formed after cooling. Through the cooperation of multiple welding positions, the firmness of the welding between the carrier 100 and the plate body 200 can be improved, and the solder filling is more uniform, ensuring the sealing after welding.

[0058] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A device comprising a copper plate, characterized in that include: A carrier (100) and a plate body (200), wherein the carrier (100) is adapted to the plate body (200); wherein a welding bead (300) is provided on one end of the carrier (100) adjacent to the plate body (200); The welding bead (300) is opened along the top surface of one end of the carrier (100); When the plate body (200) is placed on the carrier (100), the plate body (200) and the welding path (300) form a welding space.

2. The device comprising a copper plate according to claim 1, characterized in that The welding bead (300) protrudes from one end of the carrier (100).

3. The device comprising a copper plate according to claim 1, characterized in that The welding path (300) comprises an inner wall (301) and an outer wall (302); when the plate body (200) is placed on the carrier (100), a welding groove (400) is formed between the inner wall (301) and the plate body (200).

4. A method for welding the device comprising a copper plate according to any one of claims 1 to 3, characterized in that: The steps include: placing solder between the carrier (100) and the board (200); The carrier (100) and the plate (200) are fixed, and pressure is applied to the carrier (100) and the plate (200) respectively, so that the plate (200) and the carrier (100) are in a compressed state; heating the fixed carrier (100) and the plate body (200) to melt the solder between the carrier (100) and the plate body (200); The melted solder is placed between the carrier (100) and the plate body (200) and in the welding space.

5. The method according to claim 4, wherein: The solder is nickel-phosphorus alloy.

6. The method according to claim 5, wherein: The weight ratio of the nickel-phosphorus alloy is: nickel content is 88%-90%, and phosphorus content is 10%-12%.

7. The method according to claim 4, wherein: A first bonding surface and a second bonding surface are formed between the carrier (100) and the plate body (200), and the first bonding surface and the second bonding surface are placed on both sides of the welding space. The melted solder is placed on the first bonding surface, the second bonding surface, the bonding position between the first bonding surface and the welding space, and the bonding position between the second bonding surface and the welding space, respectively. The cooled solder forms a first welding corner (501) and a second welding corner (502) at the bonding position between the first bonding surface and the welding space, and at the bonding position between the second bonding surface and the welding space, respectively.

8. The method according to claim 7, wherein: The melted solder is placed in the soldering groove (400), and the cooled solder forms a third solder fillet (503) in the soldering groove (400).

9. A welding device using the method according to any one of claims 4 to 8, characterized in that: include: A support body (601) and a pressure body (701), wherein the support body (601) and the pressure body (701) are connected via a plurality of locking members (800), and a molding space is formed between the support body (601) and the pressure body (701).

10. The welding device according to claim 9, characterized in that: A first pressing plate (602) is provided on the support body (601), and a second pressing plate (702) is provided on the pressure-applying body (701); and the first pressing plate (602) is adapted to the carrier (100).

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