Semiconductor surface pretreatment device for integrated circuit manufacturing

Abstract

The invention discloses a semiconductor surface pretreatment device for integrated circuit manufacturing, and relates to the technical field of semiconductor processing. Comprising a workbench, a mounting seat is arranged on the workbench, a driving mechanism for driving the mounting seat to move is arranged on the workbench, an air spraying head is mounted on the mounting seat, and a plasma generator is mounted on the air spraying head; according to the plasma jet head, the square block is arranged and installed in the jet head, passing plasma airflow can be evenly blown to the air jet opening, after the airflow is evenly blown out, the air jet range of the airflow can be increased through the arranged air entraining cover, and a wider area can be covered; the flexibility is favorable for meeting different treatment requirements of the surface of a semiconductor material, fine treatment is carried out on a fine seam on the surface of a semiconductor workpiece in an intermittent strong and weak air flow air injection mode, meanwhile, thermal stress accumulation of the workpiece under long-time high-temperature exposure is reduced, and therefore the risk of workpiece deformation or damage is reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor processing, and in particular relates to a semiconductor surface pretreatment device for integrated circuit manufacturing. Background Art

[0002] In the field of semiconductor manufacturing, the pretreatment of semiconductor material surfaces is a crucial step. The performance and quality of semiconductor materials largely depend on the physical and chemical state of their surfaces. For example, in the manufacturing process of semiconductor devices, processes such as photolithography, etching, and doping all have strict requirements on the surface of semiconductor materials. If there are impurities, oxide layers, or uneven roughness on the surface, it may lead to defects such as inaccurate photolithographic patterns, inconsistent etching rates, and uneven doping concentrations, which in turn affect the performance and reliability of semiconductor devices.

[0003] In the prior art, when pre-treating the surface of a semiconductor material, a high-pressure airflow is generally connected to the treatment end, and a low-temperature plasma generator is used to generate a plasma airflow, which is then ejected to pre-treat the surface of the semiconductor material. However, in actual operation, the air jet port is generally smaller than the air inlet chamber, which easily causes the airflow ejected from the air jet port to have different intensities. When contacting the surface of the semiconductor material, it affects the diffusion and distribution of the plasma, causing damage to the material surface and affecting the treatment effect of the material surface. To this end, we propose a semiconductor surface pre-treatment device for integrated circuit manufacturing to solve the above-mentioned problems. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a semiconductor surface pretreatment device for integrated circuit manufacturing that can overcome the above problems or at least partially solve the above problems.

[0005] In order to solve the above technical problems, the basic concept of the technical solution adopted by the present invention is: a semiconductor surface pretreatment device for integrated circuit manufacturing, comprising a workbench, a mounting seat is provided on the workbench, a driving mechanism for driving the mounting seat to move is provided on the workbench, a nozzle is installed on the mounting seat, a plasma generator is installed on the nozzle head, and a gas injection port is connected to the top of the nozzle head, and also includes: a swingable square block, which is arranged inside the nozzle head; a guide unit for uniformly conveying the passing plasma airflow is provided on the square block; a movable plate that can be raised and lowered is arranged in the nozzle head, and an air bleed hood is provided below the movable plate; when the square block swings, it is used to intermittently change the intensity of the conveying airflow, and the airflow can blow the movable plate up and down when passing, thereby driving the air bleed hood to extend, thereby increasing the blowing range of the airflow on the surface of the semiconductor material.

[0006] Preferably, the guide unit includes first channels symmetrically opened on the surface of the square block, a second channel is opened on the square block between the two first channels, an air guide port is provided at the air inlet end at the top of the second channel, and the second channel is S-shaped.

[0007] Preferably, both ends of the square block are fixedly connected with a rotating shaft, one end of the rotating shaft is rotatably connected to the inner wall of the nozzle head through a bearing, and one end of the other rotating shaft passes through the nozzle head and extends to the outside and is fixedly connected to a rotating block, one side of the rotating block is connected to an extrusion spring, and one end of the extrusion spring is installed with a fixed block fixedly connected to the outer wall of the nozzle head.

[0008] Preferably, a return spring is attached to the other side of the rotating block, and the top of the return spring is fixedly connected to a sliding rod, and the sliding rod slides through the limit block, one end of the limit block is fixedly connected to the outer wall of the nozzle head, and one end of the sliding rod is fixedly connected to the extrusion plate.

[0009] Preferably, a return spring is fixedly connected between the extrusion plate and the limit block, and the return spring is sleeved on the surface of the slide rod. An eccentric wheel is attached to the surface of the extrusion plate, and a connecting shaft is fixedly connected to one side of the eccentric wheel. One end of the connecting shaft passes through the nozzle and extends to the interior, and an impeller is installed on the surface of the connecting shaft.

[0010] Preferably, a fixed plate is fixedly connected to the inner wall of the nozzle below the movable plate, and through holes are provided on the surfaces of the movable plate and the fixed plate. An air duct is provided at the bottom of the movable plate at the through hole, and a slide is fixedly connected to the outer wall of one end of the air duct, and the slide slides through the fixed plate.

[0011] Preferably, the air bleed hood is fixedly mounted on the bottom surface of the fixed plate, a telescopic spring is provided on the inner wall of the air bleed hood, a fixing ring is fixedly connected to the bottom of the air bleed hood, and the top surface of the fixing ring is in contact with the slide cylinder.

[0012] Preferably, tension springs are fixedly connected to the four sides of the top of the through hole, and the ends of the tension springs are fixedly connected to the mounting blocks, and the mounting blocks are fixedly connected to the inner wall of the nozzle.

[0013] Preferably, the through holes provided on the surfaces of the movable plate and the fixed plate are distributed at equal intervals.

[0014] Preferably, the inner wall of the nozzle is rotatably connected to a guide plate via a pin, and one end of the guide plate is in contact with the top surface of the square block.

[0015] After adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art: the present invention arranges a square block, which is installed in the nozzle head, and can evenly blow the passing plasma airflow toward the nozzle port. After the airflow is evenly blown out, the air bleed hood is arranged to increase the airflow jet range and cover a wider area. This flexibility helps to meet the different processing requirements of the surface of semiconductor materials. In addition, the intermittent strong and weak airflow jet method can be used to finely process the fine cracks on the surface of the semiconductor workpiece, while reducing the accumulation of thermal stress on the workpiece under long-term high-temperature exposure, thereby reducing the risk of deformation or damage to the workpiece. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In the attached figure:

[0017] Figure 1 This is a schematic diagram of the overall structure of a semiconductor surface pretreatment device for integrated circuit manufacturing proposed by the present invention;

[0018] Figure 2 This is a front view schematic diagram of a semiconductor surface pretreatment device for integrated circuit manufacturing proposed by the present invention;

[0019] Figure 3 This is a schematic top view of the structure of a semiconductor surface pretreatment device for integrated circuit manufacturing proposed by the present invention;

[0020] Figure 4 This is a schematic diagram of a partial cross-sectional three-dimensional structure of a shower head in a semiconductor surface pretreatment device for integrated circuit manufacturing proposed by the present invention;

[0021] Figure 5 The present invention proposes Figure 4 Schematic diagram of the enlarged structure of area A in the middle;

[0022] Figure 6 This is a schematic diagram of the side cross-sectional structure of a shower head in a semiconductor surface pretreatment device for integrated circuit manufacturing proposed by the present invention;

[0023] Figure 7 The present invention proposes Figure 6 Schematic diagram of the enlarged structure of the middle B area;

[0024] Figure 8 This is a schematic diagram of the overall perspective structure of the square block of the present invention.

[0025] In the figure: 1. workbench; 11. driving mechanism; 2. mounting seat; 3. nozzle; 301. impeller; 302. connecting shaft; 303. eccentric wheel; 304. extrusion plate; 305. slide bar; 306. limit block; 307. return spring; 31. plasma generator; 32. gas injection port; 4. square block; 41. first channel; 42. second channel; 43. gas guide port; 44. rotating shaft; 45. rotating block; 46. extrusion spring; 47. fixed block; 51. movable plate; 52. fixed plate; 53. through hole; 54. air bleed pipe; 55. air bleed hood; 56. telescopic spring; 57. fixing ring; 58. slide cylinder; 61. tension spring; 62. mounting block. DETAILED DESCRIPTION

[0026] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments so that those skilled in the art can implement the invention with reference to the description.

[0027] It should be understood that terms such as “having”, “including” and “comprising” used herein do not preclude the existence or addition of one or more other elements or combinations thereof.

[0028] In the description of the present invention, the terms "horizontal", "longitudinal", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like to indicate orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the present invention.

[0029] Example 1: Reference Figures 1-8 A semiconductor surface pretreatment device for integrated circuit manufacturing includes a workbench 1, a mounting base 2 is provided on the workbench 1, a driving mechanism 11 for driving the mounting base 2 to move is provided on the workbench 1, a nozzle 3 is installed on the mounting base 2, a plasma generator 31 is installed on the nozzle head 3, and a gas injection port 32 is connected to the top of the nozzle head 3. It also includes: a swingable square block 4, which is arranged inside the nozzle head 3; a guide unit for uniformly conveying the passing plasma airflow is provided on the square block 4; a liftable movable plate 51, which is arranged in the nozzle head 3, and an air bleed hood 55 is provided below the movable plate 51; when the square block 4 swings, it is used to intermittently change the intensity of the conveying airflow. When the airflow passes through, it can blow the movable plate 51 up and down, thereby driving the air bleed hood 55 to extend, thereby increasing the blowing range of the airflow on the surface of the semiconductor material.

[0030] Among them, the workbench 1 is installed in the pretreatment box, and the treatment box is equipped with an exhaust fan and an air purifier for discharging the plasma gas after acting on the semiconductor material out of the box for filtration and purification. When in use, the semiconductor material to be processed is placed on the workbench 1, and the driving mechanism 11 includes two groups of moving parts, which are composed of a driving motor, a screw rod, a slider, a limit rod, etc. When in use, it can drive the mounting seat 2 to move left and right and up and down, thereby driving the nozzle head 3 to move synchronously to perform pretreatment operations on the surface of the semiconductor material placed on the workbench 1. This is the existing technology and will not be repeated here. During the pretreatment process, the high-pressure airflow delivery pipe is connected through the gas injection port 32. When the airflow at the gas injection port 32 is delivered to the nozzle head 3, the plasma generator 31 is started to generate a plasma gas mass by the passing airflow, and the output plasma airflow is used to act on the surface of the semiconductor material to change the chemical and physical properties of the material surface, which has a good cleaning effect and is convenient for subsequent assembly and use. In this solution, when the formed plasma airflow blows toward the square block 4, the structural design on the square block 4 can effectively spray out the plasma airflow evenly when it passes through the smaller nozzle position of the nozzle head 3, thereby improving the uniformity of the airflow spraying, so that the semiconductor material has a better effect during the pretreatment process. When the formed plasma airflow blows toward the square block 4, the square block 4 can be made to swing, so that the airflow after passing through the square block 4 is sprayed out in an intermittent strong and weak manner. After the airflow passes through the square block 4, it blows the movable plate 51, causing the movable plate 51 to rise and fall and reciprocate, so that the air hood 55 is intermittently extended. In this way, on the one hand, the plasma airflow can increase the gas spraying range when it is sprayed, thereby improving the working efficiency of the device for jet pretreatment of the semiconductor material surface. At the same time, the intermittent spraying method reduces the accumulation of thermal stress on the surface of the semiconductor material during the pretreatment process, improves the processing quality of the material, and reduces the risk of deformation or damage of the workpiece.

[0031] It should be noted that this solution is mainly aimed at improving the general air cavity structure of most air shower heads 3 in the prior art, which is thick at the top and thin at the bottom, and is applied to smaller semiconductor material preprocessing operations.

[0032] Example 2: Reference Figure 5 、 Figure 6 and Figure 8, which is basically the same as Example 1, and further, the guide unit includes a first channel 41 symmetrically opened on the surface of the square block 4, a second channel 42 is opened on the square block 4 between the two first channels 41, and an air guide port 43 is provided at the air inlet end at the top of the second channel 42. The second channel 42 is S-shaped, and the two ends of the square block 4 are fixedly connected with a rotating shaft 44, one end of which is rotatably connected to the inner wall of the nozzle head 3 through a bearing, and one end of the other rotating shaft 44 passes through the nozzle head 3 and extends to the outside and is fixedly connected to a rotating block 45, one side of the rotating block 45 is connected to an extrusion spring 46, and one end of the extrusion spring 46 is installed with a fixed block 47 fixedly connected to the outer wall of the nozzle head 3, the inner wall of the nozzle head 3 is rotatably connected to a guide plate through a pin shaft, and one end of the guide plate is in contact with the top surface of the square block 4.

[0033] The above scheme is adopted, in which a symmetrical first channel 41 is set on the square block 4, and is set at an inclined angle, which can guide the passing plasma airflow. The airflow in the middle part enters through the air guide port 43, and then is ejected through the second channel 42. Since the second channel 42 is S-shaped, the strong airflow in the middle part can be reversed, and finally ejected synchronously with the airflow at the first channel 41, so that the airflow is more uniform after being ejected. At the same time, when the plasma airflow about to enter the square block 4 is sprayed toward the top of the square block 4, the airflow can be accurately blown to the first channel 41 and the air guide port 43 through the setting of the guide plate. The airflow that has not entered can be blocked and guided backflow by the guide plate, thereby improving the effect of plasma airflow generation. Through this structural design, the effect of turbulence is reduced.

[0034] On the other hand, as the square block 4 swings left and right, the plasma airflow passing through the square block 4 is ejected in an intermittent manner, so that the force exerted by the airflow when blowing towards the movable plate 51 is different, causing the movable plate 51 to move back and forth.

[0035] It should be understood that one end of the guide plate contacts the top surface of the square block 4 , and the end in contact with the square block 4 remains in contact with the square block 4 during the swinging process of the square block 4 , and will not affect the swinging of the square block 4 .

[0036] Example 3: Reference Figure 5 、 Figure 6 and Figure 8, which is basically the same as Example 2, and further: a return spring 307 is attached to the other side of the rotating block 45, and the top of the return spring 307 is fixedly connected to the slide rod 305, which slides through the limit block 306, and one end of the limit block 306 is fixedly connected to the outer wall of the nozzle head 3, and one end of the slide rod 305 is fixedly connected to the extrusion plate 304, and a return spring 307 is fixedly connected between the extrusion plate 304 and the limit block 306, and the return spring 307 is sleeved on the surface of the slide rod 305, and the surface of the extrusion plate 304 is attached to the eccentric wheel 303, and one side of the eccentric wheel 303 is fixedly connected to the connecting shaft 302, and one end of the connecting shaft 302 passes through the nozzle head 3 and extends to the inside, and the surface of the connecting shaft 302 is mounted with an impeller 301.

[0037] When the plasma airflow generated in the nozzle head 3 blows toward the square block 4, an impeller 301 is provided between the square block 4 and the plasma generator 31, so that the airflow passing through can blow the impeller 301 to rotate, and the connecting shaft 302 is driven to rotate through the impeller 301, thereby causing the eccentric wheel 303 to reciprocate and squeeze the squeezing plate 304, and the squeezing plate 304 moves back and forth and down to drive the fixed block 47 to squeeze the rotating block 45, and cooperates with the elastic elastic rebound reset of the squeezing spring 46 to make the square block 4 swing left and right inside the nozzle head 3. The square block 4 in the swinging state is restricted by the structure, and the incoming air intake is partially blocked to achieve adjustment. Since the square block 4 swings left and right, the airflow after passing through the square block 4 is ejected in an intermittent and strong manner, thereby causing the movable plate 51 to move up and down, thereby making the square block 4 can evenly transport the output plasma airflow while also changing the intensity of the airflow.

[0038] Example 4: Reference Figure 4 、 Figure 6 and Figure 7 , which is basically the same as Example 3, and furthermore, a fixed plate 52 is fixedly connected to the inner wall of the nozzle head 3 below the movable plate 51, and a through hole 53 is opened on the surface of the movable plate 51 and the fixed plate 52. An air bleed pipe 54 is provided at the bottom of the movable plate 51 at the through hole 53, and a slide cylinder 58 is fixedly connected to the outer wall of one end of the air bleed pipe 54. The slide cylinder 58 slides through the fixed plate 52, and an air bleed cover 55 is fixedly installed on the bottom surface of the fixed plate 52. A telescopic spring 56 is provided on the inner wall of the air bleed cover 55, and a fixing ring 57 is fixedly connected to the bottom of the air bleed cover 55. The top surface of the fixing ring 57 fits with the slide cylinder 58. A tension spring 61 is fixedly connected to the surrounding surfaces of the top of the through hole 53. The end of the tension spring 61 is fixedly connected to the mounting block 62, and the mounting block 62 is fixedly connected to the inner wall of the nozzle head 3. The through holes 53 opened on the surfaces of the movable plate 51 and the fixed plate 52 are evenly spaced.

[0039] The above scheme is adopted, and compared with the previous embodiment, a step further is that when the plasma airflow after passing through the square block 4 is blown to the movable plate 51, part of the airflow is ejected through the multiple through holes 53 on the movable plate 51, and then passes through the air duct 54 and the slide 58 and then ejected through the through holes 53 on the fixed plate 52, and finally ejected from the air hood 55 to act on the surface of the semiconductor material. The airflow that has not passed through the through holes 53 opened on the movable plate 51 causes the movable plate 51 to move up and down due to the blowing force of the airflow, and then causes the slide 58 to move synchronously, squeezing the fixed ring 57 fixed on the air hood 55, causing the air hood 55 to reciprocate and expand. In this way, the range of the airflow ejected from the air hood 55 is increased. A certain distance is set between the two adjacent air hoods 55, and there is no contact or interference during the extension and contraction process. Through this structural design, the nozzle head 3 can effectively improve the working efficiency when ejecting plasma airflow to treat the surface of the semiconductor material, and increase the range of the device's surface treatment work on the semiconductor material.

[0040] At the same time, the square block 4 changes the strength of the airflow. The airflow ejected from the bleed hood 55 acts on the surface of the semiconductor material in an intermittent manner. When the ejection range is small, it can finely treat a specific small area. When the ejection range is large, it can cover a wider area. This flexibility helps to meet different processing needs. Intermittent ejection can reduce the accumulation of thermal stress on the workpiece due to long-term exposure to relatively high temperatures, thereby reducing the risk of deformation or damage to the workpiece. Intermittent ejection may be more efficient than continuous ejection because it can reduce unnecessary energy consumption and processing time while maintaining processing quality. Intermittent ejection helps to avoid local overheating or insufficient processing. By alternating the ejection range, the processing energy can be more evenly distributed, thereby improving processing uniformity.

[0041] It should be understood that the arrangement of the telescopic spring 56 facilitates the elastic reset of the air bleed hood 55, but the elasticity of the telescopic spring 56 is less than the force applied to the fixed ring 57 at the slide 58, and the elasticity of the tension spring 61 is less than the blowing force of the air flow ejected after passing through the square block 4. The four side surfaces of the movable plate 51 are slidably connected to the inner wall of the nozzle 3, which plays a role in limiting the movement of the movable plate 51 in the moving state, thereby improving the stability of the structure. The air bleed hood 55 is made of corrugated rubber telescopic material.

[0042] The above embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patented invention. It should be noted that those skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention. These variations and improvements are equivalent modifications and improvements to the above embodiments based on the essential technology of the present invention and fall within the scope of protection of the present invention.

Claims

1. A semiconductor surface pretreatment device for integrated circuit manufacturing, comprising a workbench (1), a mounting seat (2) provided on the workbench (1), a driving mechanism (11) for driving the mounting seat (2) to move provided on the workbench (1), a nozzle (3) installed on the mounting seat (2), a plasma generator (31) installed on the nozzle head (3), and a gas injection port (32) connected to the top of the nozzle head (3), characterized in that: Also includes: A swingable square block (4) is arranged inside the jet head (3); The square block (4) is provided with a flow guide unit for uniformly conveying the passing plasma airflow; A movable plate (51) capable of being raised and lowered is arranged in the nozzle head (3), and an air bleed cover (55) is arranged below the movable plate (51); When the square block (4) swings, the intensity of the conveying airflow is intermittently changed. When the airflow passes through, the movable plate (51) is blown up and down, thereby driving the air bleed cover (55) to extend, thereby increasing the blowing range of the airflow on the surface of the semiconductor material.

2. The semiconductor surface pretreatment device for integrated circuit manufacturing according to claim 1, characterized in that: The air guide unit comprises first channels (41) symmetrically opened on the surface of a square block (4); a second channel (42) is opened on the square block (4) between the two first channels (41); an air guide port (43) is provided at the air inlet end at the top of the second channel (42); and the second channel (42) is S-shaped.

3. The semiconductor surface pretreatment device for integrated circuit manufacturing according to claim 2, characterized in that: The two ends of the square block (4) are fixedly connected to a rotating shaft (44), one end of the rotating shaft (44) is rotatably connected to the inner wall of the nozzle head (3) through a bearing, and one end of the other rotating shaft (44) passes through the nozzle head (3) and extends to the outside to be fixedly connected to a rotating block (45), one side of the rotating block (45) is connected to an extrusion spring (46), and one end of the extrusion spring (46) is installed with a fixed block (47) fixedly connected to the outer wall of the nozzle head (3).

4. The semiconductor surface pretreatment device for integrated circuit manufacturing according to claim 3, characterized in that: A return spring (307) is attached to the other side of the rotating block (45), and a sliding rod (305) is fixedly connected to the top of the return spring (307). The sliding rod (305) slides through the limiting block (306), and one end of the limiting block (306) is fixedly connected to the outer wall of the nozzle head (3). One end of the sliding rod (305) is fixedly connected to the extrusion plate (304).

5. The semiconductor surface pretreatment device for integrated circuit manufacturing according to claim 4, characterized in that: A return spring (307) is fixedly connected between the extrusion plate (304) and the limit block (306), and the return spring (307) is sleeved on the surface of the slide rod (305). An eccentric wheel (303) is attached to the surface of the extrusion plate (304), and a connecting shaft (302) is fixedly connected to one side of the eccentric wheel (303). One end of the connecting shaft (302) passes through the jet head (3) and extends to the inside. An impeller (301) is installed on the surface of the connecting shaft (302).

6. The semiconductor surface pretreatment device for integrated circuit manufacturing according to claim 1, characterized in that: A fixed plate (52) is fixedly connected to the inner wall of the nozzle head (3) below the movable plate (51), and a through hole (53) is provided on the surface of the movable plate (51) and the fixed plate (52). An air bleed pipe (54) is provided at the bottom of the movable plate (51) at the through hole (53), and a slide cylinder (58) is fixedly connected to the outer wall of one end of the air bleed pipe (54), and the slide cylinder (58) slides through the fixed plate (52).

7. The semiconductor surface pretreatment device for integrated circuit manufacturing according to claim 6, characterized in that: The air bleed hood (55) is fixedly mounted on the bottom surface of the fixed plate (52), a telescopic spring (56) is provided on the inner wall of the air bleed hood (55), a fixing ring (57) is fixedly connected to the bottom of the air bleed hood (55), and the top surface of the fixing ring (57) is in contact with the slide cylinder (58).

8. The semiconductor surface pretreatment device for integrated circuit manufacturing according to claim 7, characterized in that: Tension springs (61) are fixedly connected to the four sides of the top of the through hole (53), and the ends of the tension springs (61) are fixedly connected to the mounting blocks (62), and the mounting blocks (62) are fixedly connected to the inner wall of the nozzle head (3).

9. The semiconductor surface pretreatment device for integrated circuit manufacturing according to claim 8, characterized in that: The through holes (53) provided on the surfaces of the movable plate (51) and the fixed plate (52) are distributed at equal intervals.

10. The semiconductor surface pretreatment device for integrated circuit manufacturing according to claim 2, characterized in that: The inner wall of the jet head (3) is rotatably connected to a guide plate via a pin shaft, and one end of the guide plate contacts the top surface of the square block (4).

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