Substrate mapping apparatus and method thereof

Abstract

A semiconductor wafer mapping apparatus and method, the apparatus comprising: a frame forming a wafer loading opening in communication with a loading station for a substrate carrier arranged to hold more than one wafer vertically distributed in the substrate carrier for loading through the wafer loading opening; a movable arm movably mounted to the frame so as to move relative to the wafer loading opening, and having at least one end effector movably mounted to the movable arm so as to load the wafer from the substrate carrier through the wafer loading opening; an image acquisition system comprising an array of cameras arranged on a common support, and each camera is fixed relative to the common support, the common support being stationary relative to each camera of the array of cameras, where each respective camera is positioned with a field of view, the field of view is arranged to be viewed through the wafer loading opening with the common support positioned by the movable arm.

Description

[0001] This application is a divisional application of the invention patent application with the application date of June 30, 2021, application number 202180053513.7, and invention name “Substrate mapping device and method thereof”. Technical Field

[0002] The exemplary embodiments relate generally to semiconductor manufacturing equipment, and more particularly to identification of substrates in semiconductor manufacturing equipment. Background Art

[0003] There are various locations where a single substrate or a stack of substrates (such as, for example, wafers, reticles, film frames, trays, etc.) can be held in a semiconductor manufacturing facility. The physical state of the substrate at each of these locations can be one of many states, including but not limited to, absent, present, double slots, intersecting slots, and shifted / tilted. Typically, the physical state of each substrate at a holding location is determined (or mapped) to facilitate substrate handling within the semiconductor manufacturing facility.

[0004] One example of substrate mapping for a single substrate, such as one located on a robotic end effector, includes a vacuum suction technique where a vacuum chuck contacts the backside of the substrate. By opening a valve located on the vacuum line of the end effector, the vacuum pressure level of the chuck determines the substrate state, which in this case is present or absent (the vacuum suction technique does not detect substrate displacement). The vacuum suction technique can result in erroneous readings when the contact between the substrate and the vacuum chuck is not tightly sealed. Additionally, it takes several hundred milliseconds between activating the vacuum valve and establishing a steady-state vacuum pressure level to obtain a determination of whether a substrate is present on the end effector. As can be appreciated, several hundred milliseconds over multiple wafers can have an adverse effect on the substrate throughput through the semiconductor manufacturing equipment.

[0005] Typically, in order to map a stack of substrates (which has a gap separating each of the stacked substrates) held at a loadport in, for example, a substrate cassette or carrier, a beam break technique is employed. Here, a light beam extends from a conveyor to a receiver in a direction parallel to the plane of the substrate. The conveyor and receiver may be referred to as a through-beam sensor. The through-beam sensor moves up or down along one side of the substrate stack so that the light beam engages and is broken by the substrate (a break in the light beam indicates the presence of a substrate). While the beam break technique can detect many of the substrate states mentioned above, the beam break technique is sensitive to the angle of the light beam relative to the substrate plane, such that it is desired that the light beam be precisely aligned with the substrate plane. Here, extending and retracting the through-beam sensor to and from the substrate holding position takes at least several seconds, and the correlation of the beam break and beam restore events for each substrate position typically requires a controlled and slow motion profile for the through-beam sensor, all of which negatively impact substrate throughput.

[0006] Both vacuum pumping and beam-breaking technologies involve mechanical design complexity. For example, vacuum pumping requires a vacuum supply to the substrate handling equipment and involves routing vacuum lines through the substrate transport arm to the end effector. Beam-breaking technology involves moving parts and the extension and retraction of beam sensors. This added complexity increases the cost of manufacturing and servicing semiconductor processing equipment.

[0007] In addition to the above, in advanced semiconductor manufacturing technologies, substrates are provided with varying thicknesses. This varying thickness of substrates presents challenges for beam-breaking technology when determining a map of substrate holding positions. For example, thin substrates may be thick enough not to completely block the beam, resulting in the false identification of a non-existent substrate.

[0008] Imaging systems have also been employed for substrate mapping; however, in conventional imaging systems, such as those that image substrates through a load port opening, the image of substrates toward the top (or bottom) of the substrate stack may be distorted, or some substrates may be obscured from view by substrates located above or below. There may also be issues with light reflecting from the interior of the substrate and / or substrate carrier, which may obscure substrate detection.

[0009] Furthermore, in semiconductor manufacturing facilities, various types of substrates (as described above) are transported by a substrate transporter (e.g., a robot) having an end effector, on which the substrate sits for transport. To transport the substrate, the substrate transporter extends the end effector into a small space below (or from above for some applications) the substrate (e.g., on a substrate seating surface located on a substrate carrier, process module, or other suitable substrate holding location) to pick up the substrate. In the case where the substrate is flat, there is no problem picking up the substrate with the end effector; however, as described above, in advanced semiconductor manufacturing technologies, substrates are provided with varying thicknesses and may not be flat. For example, in advanced packaging, thinned substrates, reconstructed substrates, and fan-out substrates may bend / warp as much as several millimeters. The warping of these substrates may prevent the end effector from extending into the small space below (or above) the substrate to pick up the substrate. Summary of the Invention

[0010] According to one or more aspects of the present disclosure, a semiconductor wafer mapping apparatus includes: a frame forming a wafer loading opening in communication with a loading station for a substrate carrier, the substrate carrier being configured to hold more than one wafer vertically distributed in the substrate carrier for loading through the wafer loading opening; a movable arm movably mounted to the frame for movement relative to the wafer loading opening and having at least one end effector movably mounted to the movable arm for loading a wafer from the substrate carrier through the wafer loading opening; an image acquisition system including a camera array arranged on a common support, with each camera being fixed relative to the common support, the common support being stationary relative to each camera of the camera array, wherein each respective camera is positioned with a field of view configured to observe a different individual portion of the substrate carrier having a wafer slot for holding at least one of the more than one wafers through the wafer loading opening with the common support positioned at a common position by the movable arm. the different individual portions being separate and distinct from portions of the substrate carrier having different wafer slots for holding wafers different from the at least one wafer to be viewed by each of the other cameras when the common support is in the common position, and for imaging each wafer held in the substrate carrier by the camera array when the common support is in the common position; and an illumination source coupled to the common support and configured to illuminate an outer edge of each wafer in the substrate carrier through the wafer loading opening when the common support is in the common position, the edge marking an upper edge boundary and a lower edge boundary of the outer edge of the wafer, the illumination source being positioned relative to each camera so that the outer edge directs reflected edge illumination from the illumination source toward each camera and optically blanking background reflected light viewed by each camera through the wafer loading opening when the common support is in the common position at the upper edge boundary and the lower edge boundary; wherein the outer edge of the wafer is defined in relief by the upper edge boundary and the lower edge boundary, the image contrast being formed by and between the edge reflections registered by each camera and the optically blanked background to perform edge detection for each wafer in the substrate carrier when the common support is in the common position.

[0011] According to one or more aspects of the present disclosure, each different individual portion observed by a corresponding camera of the camera array has a different set of wafer slots corresponding to the individual portion and the corresponding camera, which are vertically distributed at a predetermined reference height observed by the corresponding camera.

[0012] According to one or more aspects of the present disclosure, the semiconductor wafer mapping apparatus further includes a controller communicatively coupled to the movable arm to move the movable arm relative to the frame and position the common support at the common position.

[0013] According to one or more aspects of the present disclosure, the movable arm is an arm of a wafer transport robot having an end effector for loading and unloading wafers into and from a substrate carrier through a wafer loading opening.

[0014] According to one or more aspects of the present disclosure, the illumination sources are positioned relative to the respective cameras such that light reflected from the planar surface of the wafer inserted in the substrate carrier and each other wafer is optically blanked in each image captured by the respective cameras of a different individual portion of the substrate carrier.

[0015] According to one or more aspects of the present invention, a semiconductor wafer mapping apparatus includes: a frame forming a wafer loading opening communicating with a loading station for a substrate carrier, the substrate carrier being configured to hold more than one wafer vertically distributed in the substrate carrier for loading through the wafer loading opening; a movable arm movably mounted to the frame for movement relative to the wafer loading opening and having at least one end effector movably mounted to the movable arm for loading a wafer from the substrate carrier through the wafer loading opening; and an image acquisition system including an array of cameras arranged on a common support, each camera being fixed relative to the common support, the common support being stationary relative to each camera of the camera array, wherein each respective camera A field of view is positioned, the field of view being configured to observe corresponding different individual portions of the substrate carrier through the wafer loading opening when the common support is positioned at a common position by the movable arm, each corresponding different individual portion having at least one corresponding wafer slot that is different from at least one other wafer slot in each other corresponding different individual portion of the substrate carrier, each of the corresponding different individual portions being observed from the common position by each corresponding camera via the wafer loading opening, such that an image captured by each corresponding camera of the corresponding different individual portion excludes each other different individual portion observed by each other corresponding camera, and each wafer in each slot of the substrate carrier being imaged by the camera array when the common support is located at the common position.

[0016] According to one or more aspects of the present disclosure, the semiconductor wafer mapping apparatus further includes an illumination source connected to the common support, the illumination source configured to illuminate an outer edge of each wafer in the substrate carrier through the wafer loading opening when the common support is located at a common position, the outer edge marking an upper edge boundary and a lower edge boundary of the outer edge of the wafer, wherein the illumination source is disposed relative to each respective camera, and the corresponding separate and distinct portions of the image captured by each respective camera are disposed so that the outer edge directs reflected edge illumination from the illumination source toward the respective camera, and optically blanks background reflected light in the separate and distinct portions of the image captured by the respective camera through the wafer loading opening when the common support is located at the common position at the upper and lower edge boundaries.

[0017] According to one or more aspects of the present disclosure, upper and lower edge boundaries are utilized to significantly define the outer edge of the wafer with image contrast formed by and between edge reflections and an optically blanked background registered by each respective camera to perform edge detection for each wafer in a substrate carrier with a common support located at a common position.

[0018] According to one or more aspects of the present disclosure, each of the corresponding different individual portions is imaged by only one respective camera of the array.

[0019] According to one or more aspects of the present disclosure, each of at least one wafer held in a corresponding wafer slot of a corresponding different individual portion is imaged by only one corresponding camera of the camera array.

[0020] According to one or more aspects of the present disclosure, the semiconductor wafer mapping apparatus further includes a controller communicatively coupled to the camera array and programmed with each respective camera calibration, each respective camera calibration having a baseline image for the respective camera that is different from the baseline image of each other respective camera, the baseline image defining predetermined baseline characteristics for each wafer in at least one of the at least one corresponding slots for corresponding separate different portions imaged by the respective camera.

[0021] According to one or more aspects of the present disclosure, a controller is configured to register the calibration of each respective camera, wherein a calibration wafer representing a baseline image of the respective camera is disposed in each slot of the at least one respective slot of the corresponding separately distinct portion and imaged using the respective camera, the respective camera defining the baseline image of the respective camera registered by the controller.

[0022] According to one or more aspects of the present disclosure, a method includes providing a frame forming a wafer loading opening in communication with a loading station for a substrate carrier, the substrate carrier being configured to hold more than one wafer vertically distributed in the substrate carrier for loading through the wafer loading opening; providing a movable arm movably mounted to the frame for movement relative to the wafer loading opening and having at least one end effector, the at least one end effector movably mounted to the movable arm for loading wafers from the substrate carrier through the wafer loading opening; providing an image acquisition system including an array of cameras arranged on a common support, with each camera being fixed relative to the common support, the common support being stationary relative to each camera of the camera array; moving the movable arm so that each respective camera is positioned with a field of view, the field of view being configured to observe different individual portions of the substrate carrier having wafer slots for holding at least one wafer of the more than one wafers through the wafer loading opening when the common support is positioned at a common position by the movable arm, the different individual portions being separate and distinct from portions of the substrate carrier having different wafer slots, the different wafers The circular groove is used to hold a wafer different from the at least one wafer observed by each other camera when the common support is in a common position, and each wafer held in the substrate carrier is imaged by the camera array when the common support is in a common position; and an outer edge of each wafer in the substrate carrier is illuminated by an illumination source connected to the common support through the wafer loading opening when the common support is in a common position, the edge marking the upper edge boundary and the lower edge boundary of the outer edge of the wafer, the illumination source being arranged relative to each camera so that the outer edge directs reflected edge illumination from the illumination source toward each camera and optically blanks background reflected light observed by each camera through the wafer loading opening when the common support is in a common position at the upper edge boundary and the lower edge boundary; wherein the outer edge of the wafer is significantly defined by the upper edge boundary and the lower edge boundary with image contrast, the image contrast being formed by and between the edge reflection and the optically blanked background registered by each camera to perform edge detection on each wafer in the substrate carrier when the common support is in a common position.

[0023] According to one or more aspects of the present disclosure, each different individual portion observed by a corresponding camera of the camera array has a different set of wafer slots corresponding to the individual portion and the corresponding camera, which are vertically distributed at a predetermined reference height observed by the corresponding camera.

[0024] According to one or more aspects of the present disclosure, the method further includes commanding, using a controller communicatively coupled to the movable arm, movement of the movable arm relative to the frame to position the common support at the common location.

[0025] According to one or more aspects of the present disclosure, the movable arm is an arm of a wafer transport robot having an end effector for loading and unloading wafers into and from a substrate carrier through a wafer loading opening.

[0026] According to one or more aspects of the present disclosure, the illumination sources are positioned relative to the respective cameras such that light reflected from the planar surface of the wafer inserted in the substrate carrier and each other wafer is optically blanked in each image captured by the respective cameras of a different individual portion of the substrate carrier. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The foregoing aspects and other features of the disclosed embodiments are explained in the following description taken in conjunction with the accompanying drawings, in which:

[0028] Figure 1A 、 1B and 1C are exemplary substrate processing apparatus incorporating aspects of the present disclosure;

[0029] Figure 2A 、 2B and 2C are according to aspects of the present disclosure Figure 1A 、 1B and an exemplary schematic illustration of a machine vision system and illuminator(s) of a substrate processing apparatus of FIG.

[0030] Figure 3A 、 3B , 3C and 3D are according to aspects of the present disclosure Figure 2A 、 2B and 2C are exemplary schematic illustrations of portions of a machine vision system and illuminator(s);

[0031] Figure 4A According to aspects of the present disclosure Figure 2A 、 2B and a demonstration image of a substrate captured by 2C's machine vision system;

[0032] Figure 4B According to aspects of the present disclosure Figure 4A An exemplary intensity profile of an image of;

[0033] Figure 5 According to aspects of the present disclosure Figure 2A 、 2B and an exemplary comparison of an original profile of an imaged substrate imaged by a machine vision system of 2C and a corresponding true profile of the imaged substrate;

[0034] Figure 6A is an exemplary image of a substrate stack having upper and lower edge boundaries of the substrate and an optically blanked background according to aspects of the present disclosure;

[0035] Figure 6B and 6C is an exemplary image of a substrate in a substrate stack according to aspects of the present disclosure;

[0036] Figure 6D is an example of image optimization showing optimization of an image of a substrate stack to isolate an edge from a background of the image according to aspects of the present disclosure;

[0037] Figure 6E is in the region of interest according to aspects of the present disclosure Figure 6D An example of an isolated edge;

[0038] Figure 6F is an example of image optimization according to aspects of the present disclosure, wherein the carrier in the common substrate holding groove Figure 6D The isolated edge is connected to the boundary of the corresponding substrate holding groove and presents;

[0039] Figure 7A According to aspects of the present disclosure Figure 2A 、 2B and an exemplary illustration of the illuminator(s) of 2C;

[0040] Figure 7B According to aspects of the present disclosure Figure 7A a schematic illustration of exemplary light paths for one or more of the illuminator(s);

[0041] Figure 8A According to aspects of the present disclosure Figure 1A 、 1B and a schematic illustration of an exemplary transport arm of a substrate processing apparatus of FIG.

[0042] Figure 8B According to aspects of the present disclosure Figure 8A a schematic illustration of exemplary light paths for one or more of the illuminator(s) of the transport arm;

[0043] Figure 9A 、 9B , 9C and 9D are exemplary schematic illustrations of the original edge profile and the true profile of a substrate imaged from different angles according to aspects of the present disclosure;

[0044] Figure 10 、 11 , 12 and 13 are exemplary illustrations of the original edge profile and the corrected true profile according to aspects of the present disclosure;

[0045] Figure 14 is an exemplary flow chart of a method according to aspects of the present disclosure;

[0046] Figure 15A 、 15B , 15C and 15D illustrate exemplary baseline images of a substrate carrier according to aspects of the present disclosure; and

[0047] Figure 16A and 16B is a schematic illustration of raw and true profile images of a substrate taken by multiple cameras, each camera capturing an image of a respective different individual area of ​​a substrate carrier, according to aspects of the present disclosure. DETAILED DESCRIPTION

[0048] Figure 1A 、 1B 1C illustrate exemplary substrate processing apparatuses 100, 150, 165 according to aspects of the present disclosure. Although aspects of the present disclosure will be described with reference to the accompanying drawings, it should be understood that aspects of the present disclosure may be embodied in a variety of forms. In addition, any suitable size, shape or type of element or material may be used.

[0049] refer to Figure 1A 、 1B , 1C and 2A, aspects of the present disclosure provide a substrate mapping apparatus 181 (also referred to herein as a semiconductor wafer mapping apparatus) for performing substrate mapping and / or substrate edge profiling, which includes a machine vision system 200 (also referred to herein as an image acquisition system) and at least one illuminator 220 (e.g., a distributed direct or indirect light source, including but not limited to LEDs, fluorescent lamps, floodlights, light arrays, etc., or a combination thereof). According to aspects of the present disclosure, the machine vision system 200 includes at least one camera 210 (or any suitable image acquisition sensor). The at least one illuminator 220 and the at least one camera 210 of the machine vision system 200 are placed at one or more positions to capture images of a substrate stack 270 disposed at any suitable position of the substrate processing apparatus 100, 150, 165. In some aspects, the at least one camera 210 is a camera array 277 (also referred to herein as a camera system or an array of cameras) as described herein. By performing any suitable analysis / processing on the captured images of the substrates S (also referred to herein as wafers) in the substrate stack 270, for example, the true edge profiles 500T (see FIG. Figure 5 ) (or in some aspects, the corrected true edge profile 500TC, such as, for example Figure 10As shown, a substrate map 280 (referred to herein as a map) of a substrate S in a substrate stack 270 is determined. As can be appreciated from the present disclosure, the substrate mapping apparatus 181 disclosed herein overcomes the deficiencies of conventional substrate mappers, such as those mentioned above. The substrate mapping apparatus 181 disclosed herein has essentially no moving parts and can be integrated into any suitable semiconductor manufacturing equipment (also referred to herein as a substrate processing apparatus), such as substrate processing apparatus 100, 150, 165 (or one or more components thereof), while providing the opportunity to enhance substrate mapping through software, essentially without the need for hardware upgrades. As will also be described herein, aspects of the present disclosure provide advanced mapping applications, including but not limited to measuring substrate edge profiles that may not be flat.

[0050] Aspects of the present disclosure also provide for measurement of the edge profile of the substrate S so that the substrate transporter 180 (see Figure 1A ) of the end effector 180E (see also Figure 8A ) of the substrate holding teeth 180ET1, 180ET2 between the distance TD (see Figure 1A ) to pick up warped / bowed substrates. Suitable examples of end effectors with adjustable teeth can be found in U.S. patent application No. 15 / 693,871, entitled “Substrate Handling Apparatus,” filed on September 1, 2017, the disclosure of which is incorporated herein by reference in its entirety. Suitable examples of substrate transporters 180 in which end effectors with adjustable substrate holding teeth 180ET1, 180ET2 can be incorporated are described in U.S. patent application No. 14 / 928,352, entitled “Wafer Aligner,” filed on October 30, 2015, the disclosure of which is incorporated herein by reference in its entirety. As will be described herein, the at least one camera 210 and the at least one illuminator 220 are positioned to capture images of the substrate S or substrate stack 270 across the width of (one or more) substrates S. The edge profile of each substrate S is defined based on processing the captured image. Based on the edge profile of the (one or more) substrates, the available space under each substrate S across its width is determined in any suitable manner. Under the control of any suitable controller, such as the controller 199, the substrate transporter 180 commands adjustment of the distance TD between the substrate holding teeth 180TE1, 180TE2 of the end effector 180E (see FIG. Figure 1A ) so that the teeth extend into the area below the warped / bent substrate S with clearance allowing the end effector 180E to extend below the substrate S.

[0051] In general, as described in more detail herein, aspects of the present disclosure employ the at least one camera 210 to capture an image of the outer edge 233 of the substrate as the substrate is illuminated by the at least one illuminator 220. Here, any suitable controller (e.g., the controller 199) uses any suitable algorithm, such as the algorithm described herein, to define the substrate edge profile from the captured image(s). The number of data points on the outer edge 233 of each substrate imaged by the at least one camera 210 is maximized by employing distributed and diffuse illumination across the substrate width W, wherein multiple exposure techniques are employed for different sections of the substrate width (e.g., adjusting exposure speed, aperture, etc.). The accuracy of the data points on the outer edge 233 of each substrate S is maximized by an algorithm (e.g., programmed into the controller 199) that captures and stores the edge profile of a standard substrate as spatial calibration data 281 (as will be described in more detail herein). During operation of the substrate mapping device 181 for determining the map 280 and / or edge profile, the measured raw substrate profile is compared to the spatial calibration data 281 to determine a corrected true profile 500TC of the substrate S (see Figure 10-13 The original contour is the edge contour of the substrate as seen by the corresponding camera (ie the projection of the three-dimensional substrate edge onto the two-dimensional plane of the camera's field of view - see Figure 5 on the left side of the , and see also Figures 9B-9D ). The true profile 500T and / or the corrected true profile 500TC is what the end effector 180E of the substrate transporter 180 "sees" when picking up the substrate S (i.e., the orthogonal projection of the three-dimensional substrate edge onto the extension / contraction plane of the end effector 180E - see Figure 5 to the right and see also Figure 9A ).

[0052] refer to Figure 1A 、 1B and 1C, aspects of the present disclosure will be described with respect to substrate handling apparatuses 100, 150, 165; however, aspects of the present disclosure are equally applicable to a sorter in which a plurality of carriers 110 are coupled to a transfer chamber 130 and substrates are moved from one carrier 110 to another within the transfer chamber 130 by a substrate transporter 180 (e.g., so as to arrange the substrates in one or more carriers according to a predetermined sequence / order), wherein substrate processes (e.g., processes 140, 160, 170) are not included in the sorter. Figure 1AThe substrate processing apparatus 100 includes a load port 120, a transport chamber 130, and any suitable front-end process 140 (e.g., generally including thin film processes that use vacuum, such as etching, chemical vapor deposition, plasma vapor deposition, implantation, metrology, rapid thermal processing, dry atomic layer deposition, oxidation / diffusion, nitride formation, photolithography, epitaxy, or other thin film processes for fabricating individual semiconductor structures patterned in a semiconductor, up to but not including deposition of metal interconnect layers). The load port 120 is coupled to the transport chamber 130 and is configured to interface any suitable substrate cassette or carrier 110 to the transport chamber 130. The transport chamber 130 is coupled to the front-end process 140 and includes any suitable openings and / or valves through which substrates are transferred between the transport chamber 130 and the front-end process 140.

[0053] The transport chamber 130 includes a substrate transporter 180 configured to transfer a substrate S between the substrate carrier 110 and the front-end process 140. Here, the substrate transporter 180 includes a transport arm 180TA having an end effector 180E for loading and unloading the substrate S into and from the substrate carrier 110 through the opening 888 of the load port 120. As described above, a suitable example of the substrate transporter 180 can be found in U.S. patent application Ser. No. 14 / 928,352, filed on Oct. 30, 2015, entitled “Wafer Aligner,” the disclosure of which is incorporated herein by reference in its entirety. For example, reference can also be made to Figure 8A and 8B , aspects of the disclosed embodiments will be described with respect to an atmospheric transport robot 180, but it should be understood that aspects of the disclosed embodiments are equally applicable to vacuum transport robots, such as those found in front-end-of-line processing 140, back-end-of-line processing 160, and back-end-of-line processing 170. As can be appreciated, the substrate transporter 180 is mounted to a linear slide 850 or boom arm BA (e.g., as described in U.S. patent application Ser. No. 14 / 377,987, filed Aug. 11, 2014, entitled "Substrate Processing Apparatus," the disclosure of which is incorporated herein by reference in its entirety) so as to be movable in at least the X and / or Y directions, and in other aspects so as to be fixed from movement in the X and / or Y directions. The configuration shown is representative for illustrative purposes only, and the arrangement, shape, and placement of the components shown may be varied as desired without departing from the scope of the present invention.

[0054] As in Figures 1A-1C8A , in one aspect, the substrate transporter 180 is movably mounted to the frame 800 of the transport chamber 130, or in other aspects, to the frame of any suitable module of the substrate processing apparatus 100, 150, or 165. As can be appreciated, the frame 800 includes one or more openings 888 (also referred to herein as wafer loading openings) that communicate with the load ports 120 (also referred to herein as loading stations) of the substrate carriers 110. The substrate carriers 110 are positioned on the load ports 120 to hold one or more substrates S in a vertically distributed arrangement (as described herein) for loading into the substrate processing apparatus 100 (and similarly, into the substrate processing apparatus 150, 165 described herein) through the openings 888. The substrate transporter 180 includes a transport arm 180TA (also referred to herein as a movable arm), which, in one aspect, is mounted to the carriage 863 such that the transport arm 180TA is movably mounted to the frame 800. In one aspect, the carriage 863 is mounted to the linear slide 850 so as to be movable in the X direction, while in other aspects, the carriage 863 is mounted to the frame 800 so as to be fixed in the X (and / or Y direction). In one aspect, any suitable drive 867 is mounted to the frame 800 and drivingly connected to the carriage 863 via any suitable transmission to move the transport arm 180TA in the X direction. In this aspect, the transmission is a belt and pulley transmission and the drive is a rotary drive, but in other aspects, the drive 867 is a linear actuator drivingly connected to the carriage 863 using any suitable transmission or without a transmission (e.g., such as where the carriage includes a transmission portion of the linear actuator). Here, the transport arm 180TA includes a rotary drive 862, a Z-drive column 830, a slider body 820, and one or more end effectors 180E. The rotary driver 862 is any suitable rotary driver mounted to the carriage 863, and the Z drive column 830 is mounted to the output end of the rotary driver 862 so as to rotate about the θ axis (e.g., the θ direction) in the direction of arrow T. The slider body 820 is movably mounted to the Z drive column 830, wherein the Z drive column 830 includes any suitable drive motor and / or transmission for moving the slider body 820 in the Z direction.

[0055] The one or more (e.g., at least one) end effectors 180E are movably mounted to the slider body 820 in any suitable manner so as to extend and retract in the R direction (note that the R direction is rotational about axis θ, such that the extension of the end effector(s) 180E can be aligned with the X-axis or the Y-axis, or at any suitable rotational angle in the XY plane). Although only two end effectors 180E are shown for exemplary purposes, it should be understood that any suitable number of end effectors may be mounted to the slider body 820. As can be appreciated, the one or more end effectors 180E, together with the transport arm 180TA, move back and forth as a unit in a first direction (e.g., one or more of the X, Y, and Z directions) relative to the frame 800, and move linearly back and forth in a second direction (e.g., the R direction) different from the first direction relative to the transport arm 180TA. The slider body 820 includes one or more linear actuators 825 configured to independently move each end effector 180E in the R direction. The one or more linear actuators 825 are any suitable actuator(s) having any suitable transmission, and in one aspect, the actuators are substantially similar to those described in, for example, U.S. Provisional Patent Application No. 61 / 917,056, filed December 17, 2013, entitled "Substrate Transport Apparatus," the disclosure of which is incorporated herein by reference in its entirety. The end effectors 180E are arranged on the slider body 820 such that they are stacked one above the other so as to have a common telescoping axis R. The end effectors may also include a mechanism for adjusting the distance TD between the end effector teeth 180ET1, 180ET2 (see FIG. Figure 1A ) as described in U.S. patent application Ser. No. 15 / 693,871, filed on Sep. 1, 2017, and entitled “Substrate Processing Apparatus,” the disclosure of which is incorporated herein by reference in its entirety.

[0056] The carrier 110 may be any suitable carrier 110, such as a front opening carrier (in Figure 1A and 1BThe carrier 110 may be a carrier 110, such as that shown in FIG. 1 , a suitable example of which is a front-opening unified pod (FOUP) or a bottom-opening carrier (a suitable example of which is a standard mechanical interface (SMIF) pod). In one aspect, the carrier 110 may be substantially similar to the carrier described in U.S. Patent No. 9,105,673, issued on August 11, 2015, entitled “Side-Opening Unified Pod,” the disclosure of which is incorporated herein by reference in its entirety. In one aspect, the transport chamber 130 has the same atmosphere as the atmosphere of the front-end process 140 (e.g., a vacuum atmosphere); while in other aspects, the transport chamber has an atmospheric environment, and the front-end process 140 includes any suitable load lock for transferring the substrate S between the front-end process 140 and the transport chamber 130 without degrading the processing atmosphere of the front-end process 140.

[0057] refer to Figure 1B , the substrate handling apparatus 150 includes a load port 120 (similar to the load ports described herein), a transport chamber 130 (similar to the transport chamber described herein), and any suitable back-end-of-line process 160 (e.g., generally associated with the fabrication of metal interconnect layers of the semiconductor structure formed by the front-end-of-line process 140, and including any suitable processing steps subsequent to the front-end-of-line process up to and including fabrication of a final passivation layer). The load port 120 is coupled to the transport chamber 130 and is configured to interface any suitable substrate carrier 110 to the transport chamber 130. The transport chamber 130 is coupled to the back-end-of-line process 160 and includes any suitable openings and / or valves through which substrates are transferred between the transport chamber 130 and the back-end-of-line process 160. The transport chamber 130 includes a substrate transporter 180 (such as the substrate transporters described above) configured to transfer substrates between the carrier 110 and the back-end-of-line process 160. The carrier 110 can be any suitable carrier 110, such as a front-opening carrier (in Figure 1A and 1B , a suitable example of which is a front-opening unified pod (FOUP) or a bottom-opening carrier (a suitable example of which is a standard mechanical interface (SMIF) pod). In one aspect, the carrier 110 can be substantially similar to the carrier described in U.S. Patent No. 9,105,673, issued on August 11, 2015, entitled "Side-Opening Unified Pod," the disclosure of which is incorporated herein by reference in its entirety. In one aspect, the transport chamber 130 has the same atmosphere as the atmosphere of the back-end-of-line process 160 (e.g., a vacuum atmosphere); however, in other aspects, the transport chamber has an atmospheric environment, and the back-end-of-line process 160 includes any suitable load lock for transferring the substrate S between the back-end-of-line process 160 and the transport chamber 130 without degrading the processing atmosphere of the back-end-of-line process 160.

[0058] refer to Figure 1C, the substrate handling apparatus 165 includes a loading port 120 (similar to the loading port described herein), a transport chamber 130 (similar to the transport chamber described herein), and any suitable back-end process 170 (e.g., generally including substrate testing, substrate grinding, chip separation, chip testing, IC (integrated circuit) packaging, and final testing). The loading port 120 is coupled to the transport chamber 130 and is configured to interface any suitable substrate carrier 110 to the transport chamber 130. The transport chamber 130 is coupled to the back-end process 170 and includes any suitable openings and / or valves through which substrates S are transferred between the transport chamber 130 and the back-end process 170. The transport chamber 130 includes a substrate transporter 180 (such as the substrate transporter described above) that is configured to transfer substrates between the carrier 110 and the back-end process 170. The carrier 110 can be any suitable carrier 110, such as the front opening carrier described above (in Figure 1A and Figure 1B , a suitable example of which is a front-opening unified pod (FOUP) or a bottom-opening carrier (a suitable example of which is a standard mechanical interface (SMIF) pod). In one aspect, the carrier 110 can be substantially similar to the carrier described in U.S. Patent No. 9,105,673, issued on August 11, 2015, entitled "Side-Opening Unified Pod," the disclosure of which is incorporated herein by reference in its entirety.

[0059] refer to Figure 2A 、 2B2C, the substrate mapping apparatus 181 will be described with respect to one substrate S or substrate stack 270 held in a substrate carrier 110, wherein the substrate carrier 110 is seated on and engaged with the load port 120; however, in other aspects, the one substrate S or substrate stack 270 may be disposed in any suitable location in the substrate processing apparatus 100, 150, 165, including but not limited to any suitable substrate buffer, substrate aligner, load lock, and any other location in which one or more substrates S are held. As described above, the substrate mapping apparatus 181 includes at least one camera 210 and at least one illuminator 220 coupled to any suitable controller (e.g., the controller 199) and the substrate processing apparatus 100, 150, 165. As will be described herein, the substrate S or substrate stack 270 is illuminated by the at least one illuminator 220, such that the at least one camera captures at least one image of the edge(s) of the substrate illuminated by the at least one illuminator 220. A signal representing an image is transmitted from the at least one camera 210 to the controller 199 for processing the image using any suitable image processing algorithm and extracting (or otherwise determining) a map 280 from the image. The map 280 is stored in any suitable memory 199M of the controller 199 or is accessible by the controller 199 so that the controller 199 can command movement of the substrate transport device based on the state of the substrate S or each substrate in the substrate stack 270 as determined by the map 280. As will be described herein, in one or more aspects, a single camera and illuminator pair is employed to image (one or more) substrates S and determine the map, while in other aspects, more than one camera and / or more than one illuminator are used. In some aspects, more than one image of the substrate S or substrate stack 270 is captured and analyzed as described herein to determine the map 280, such as depending on the substrate type (e.g., thickness, shape, material, etc.) and the environment surrounding the substrate (e.g., within the carrier 110, within an unenclosed rack, etc.). For exemplary purposes only, the description provided herein assumes that only a single image is being analyzed; however, as described above, more than one image can be compared, overlaid, etc., and analyzed in a manner similar to that described herein without departing from aspects of the present disclosure. Furthermore, for ease of explanation, the present disclosure is described with respect to the analysis of a substrate stack 270; however, the analysis of a single substrate S is substantially similar to the analysis described herein.

[0060] As will be described herein, a map 280 is determined or otherwise generated to determine the state of each substrate S in each holding slot of the substrate stack 270. An image of the substrate stack 270 is captured using the at least one camera 210 and the at least one illuminator 220 at any suitable position(s) relative to the substrate stack 270 such that the outer edges 233 of the substrates S in the substrate stack 270 are captured in the image (e.g., see image 400 in FIG. 4 ). The image is processed by the controller 199 in any suitable manner, such as the manner described herein, to identify the outer edges 233 of the substrates S, wherein the controller 199 performs at least a partial definition of the outer edges 233 based on the image.

[0061] As briefly mentioned above, and also see Figure 5 , for each holding slot of substrate stack 270 (note, (one or more) holding slots (n, n+1, n+2, ...; each holding slot has a predetermined height relative to the load port reference position, as in The substrates S are defined by a substrate carrier 110 or other substrate support and are arranged to support respective substrates S in a substrate stack 270 with a predetermined distance or pitch between the substrates S), edge data of each substrate S (e.g., see Figure 5 ) Determine the state of the substrate S in the holding tank based on the following exemplary substrate mapping rules:

[0062] In the event that no substrate edge 500 is detected in the image (the substrate edge 500 in the image is the outer edge 233 of the substrate S in the substrate stack 270 ), the status of the substrate S of any given holding slot is absent (i.e., no substrate is present);

[0063] In the event that a single substrate edge 500 is detected in the image or a shape line (indicative of the substrate edge 500) is detected in the image that overlaps with the holding slot base line 510, the status of the substrate S in any given holding slot is present (i.e., a single substrate is present in the holding slot);

[0064] In the event that two substrate edges 500 are detected in the image or the thickness of the substrate S detected in the image is, for example, twice the expected substrate thickness (or any suitable multiple), the status of the substrate S in any given holding slot is duplex (i.e., two substrates S are disposed one above the other in the same holding slot);

[0065] In the event that the shape line (indicative of the substrate edge 500) is not parallel to the base line 510 of the holding slot, the state of the substrate S in any given holding slot is an intersection (i.e., an intersecting slot where one substrate spans two slots (e.g., Figure 5 slots n+2 and n+3);

[0066] In the event that the shape line (indicative of the substrate edge 500) is parallel to the slot base line 510 but is vertically displaced (such parallelism can be detected when the at least one camera 210 observes the substrate S from a certain angle (i.e., from above or below the substrate S)), the state of the substrate S in any given holding slot is displaced or tilted (i.e., the substrate has slipped out of its nominal position within the holding slot).

[0067] Note that the state of each substrate S in each holding slot collectively forms the map 280 .

[0068] refer to Figure 2A 、 2B , 2C and 3A, according to aspects of the present disclosure, the at least one camera 210 is mounted in one or more of a near plane 300 and a far plane 301. The near plane 300 is adjacent to the substrate carrier 110 (e.g., located on the load port 120), while the far plane 301 is further away from the substrate carrier 110. The near plane 300 is any suitable distance Y1 closest to the opening 399 of the substrate carrier 110, where all substrates S stacked in the substrate carrier 110 are captured in the camera 210 equipped with a wide angle lens, and these substrates S substantially fill the field of view FOVW of the camera 210 (see Figure 3C The far plane 301 is any suitable distance Y2 from the opening 399 of the substrate carrier 110 at which all substrates S stacked within the substrate carrier 110 are captured in the camera 210 equipped with a telephoto lens and substantially fill the field of view FOVT of the camera 210 (see FIG. Figure 3D As can be appreciated, the distances Y1 and Y2 can be determined based on the height of the substrate stack 270 and the focal lengths of the wide-angle lens and the telephoto lens, respectively. According to the present disclosure, the mounting position of the at least one camera 210 in the X direction is substantially along the vertical (Z-axis) centerline 371 of the substrate stack 270 (not shown for clarity). Figure 3A 371, but substantially coincident with the vertical centerline of the substrate carrier 110; however, in other aspects, the at least one camera 210 can be mounted on one or more sides (e.g., to the left or right) of the vertical centerline 371. The at least one camera 210 can be mounted substantially flush with the horizontal center plane 370 (XY plane) of the substrate carrier 110 in the Z direction; however, in other aspects, the at least one camera 210 can be mounted above or below the center plane 370. Figure 2B A single camera 210 is shown mounted flush with the horizontal center plane 370, while Figure 2C 370, camera 210B is shown mounted on the horizontal center plane 370, camera 210A is mounted above the horizontal center plane 370, and camera 210C is mounted below the horizontal center plane 370 (note that Figure 2B and 2C 300 and far plane 301 are common. In other aspects, more or fewer cameras may be used. The one or more cameras described herein are generally referred to as at least one camera 210 (including a single camera or a system / array of cameras 210A, 210B, 210C, etc.).

[0069] In one or more aspects, at least one of the at least one camera 210 is mounted at a lower center position LC to image the substrate stack 270 in an angled upward direction. In the lower center position LC, the resulting image is substantially free of background noise due to, for example, ambient reflections (such as reflections from the interior of the carrier 110) and / or the top surface of the substrate (which may include a die grip pattern). Here, the substrate is illuminated from one or more of these positions (e.g., upper left UL, upper center UC, upper right UR, middle left ML, middle center MC, middle right MR, lower left LL, lower center LC, and lower right LR). In one or more aspects, at least one of the at least one camera 210 is mounted at an upper center position UC, wherein the substrate stack is illuminated from one or more of the lower positions LL, LC, LR and the intermediate positions ML, MC, MR so as to suppress background noise or imaging from at least the top surface of the substrate (e.g., by casting the top surface of the substrate in a shadow in a manner similar to that described in U.S. Patent Application No. 16 / 570,453, filed on September 13, 2019, entitled “Methods and Apparatus for Substrate Alignment,” the disclosure of which is incorporated herein by reference in its entirety). In one or more aspects, at least one of the at least one camera 210 is mounted at a middle center position MC, wherein the substrate stack 270 is illuminated from one or more of the lower positions LL, LC, LR so as to suppress background noise or imaging from at least the top surface of the substrate S. In still other aspects, the at least one camera 210 can be located at any number and combination of the mounting positions UL, UC, UR, ML, MC, MR, LL, LC, and LR on the near plane 300 and / or the far plane 301 (e.g., where the at least one camera 210 comprises more than one camera); however, where the at least one camera 210 is mounted at a middle center position MC on the near plane 300, the at least one camera 210 is mounted to a loadport door 120D of a loadport such that the at least one camera moves with the loadport door along a substrate transfer path to and from the substrate cassette 110. Here, the at least one camera 210 images (with one or more images) the substrate stack 270 as the loadport door 120D moves to open and close the loadport / substrate carrier.

[0070] refer to Figures 1A-1C and 2C, the at least one camera 210 is mounted to a fixed position within the interior of the substrate processing apparatus 100, 150, 165 (so as to be fixed relative to the substrate stack 270) (see Figures 1A-1C The at least one camera 210 may also be mounted to a movable component of the substrate processing apparatus 100, 150, 165 (eg, the load port door 120D and / or the substrate transporter 180) (see Figures 1A-1C Here, the movable assembly positions the at least one camera 210 in a desired position UL, US, UR, ML, MC, MR, LL, LC, LR on the near plane 300 and / or the far plane 301 in order to image the substrate stack 270 . Figure 2C An example is shown in which a camera array 277 comprising more than one camera 210A, 210B, 210C is located on the substrate transporter 180. Here, the camera array 277 is located on a common support 244 (in this case, the Z-drive column 830) of the substrate transporter 180 (where "common support" refers to a single support to which each camera in the camera array 277 is mounted, such that the cameras share the single support); however, in other aspects, the camera array 277 may be mounted to any common support of the substrate processing apparatus 100, 150, 165 if fixedly mounted in the transfer chamber 130, and may be mounted to any movable structure of the substrate processing apparatus 100, 150, 165 if movably mounted. Each camera 210A, 210B, 210C is fixed to (or fixed relative to) the common support 244. The common support 244 is stationary relative to each camera 210A, 210B, 210C of the camera array 277 (ie, there is no relative motion between the cameras 210A, 210B, 210C and the common support).

[0071] In one aspect, any suitable camera controller 278 is located on the substrate transporter 180 and coordinated by any suitable controller, such as the controller 199, while in other aspects, the camera controller 278 is incorporated into the controller 199. In one or more aspects, the at least one illuminator 220 is mounted to the substrate transporter 180 or in a fixed location within the substrate processing apparatus 100, 150, 165.

[0072] With the at least one camera 210 and, in some aspects, the at least one illuminator 220 mounted to the substrate transporter 180, the substrate transporter 180 transports at least a portion of the machine vision system 200 to any desired location within the substrate processing apparatus 100, 150, 165 to hold the substrate stack 270. Mounting the at least one camera 210 and, in some aspects, the at least one illuminator 220 to the substrate transporter 180 can reduce the number of cameras and illuminators (e.g., where the substrate processing apparatus 100, 150, 165 has multiple loadports for holding substrate carriers 110 and mapping the substrate stack 270) and can provide optimal positioning of the at least one camera 210 and the at least one illuminator 220 (e.g., an unobstructed field of view in any one or more of the positions UL, US, UR, ML, MC, MR, LL, LC, LR on the near plane 300 and / or the far plane 301) regardless of the configuration of the robotic environment (i.e., the interior of the substrate processing apparatus 100, 150, 165).

[0073] In such Figure 2C In the example shown (see also Figure 8A and 8B ), each respective camera 210A, 210B, 210C is disposed on the Z-drive column 830 of the substrate transporter 180 such that the fields of view FOVA, FOVB, FOVC extend in a direction parallel to or along the center plane 370 of the substrate carrier 110 (e.g., perpendicular to the axis of extension of the end effector of the substrate transporter). Here, the fields of view FOVA, FOVB, FOVC are located on the Z-drive column 830 (i.e., the common support 244) so ​​as to be visible to the viewer when the transfer arm 180TA ( Figure 8A ) Position the Z-drive column 830 relative to the opening 888 at a common position CP (see Figure 8B wherein "common position" refers to a single position of the substrate transporter such that the cameras 210A, 210B, 210C mounted to the common support 244 are dependent upon that single position of the common support 244 to observe different individual portions of the substrate carrier 110 through the opening 888 (e.g., see Figure 2C The regions RA, RB, RC and Figure 6E830 is located at a common position CP. Each of the different individual regions RA, RB, and RC has a substrate slot for holding at least one or more substrates S, and these regions are separate and distinct from portions of the substrate carrier 110 having different substrate holding slots, the different substrate holding slots of these portions being used to hold substrates S different from the at least one or more substrates S in the region / portion observed by each of the other cameras 210A, 210B, and 210C when the Z-axis drive 830 is located at a common position CP. Each substrate S held in the substrate carrier 110 is imaged by the camera array 277 when the Z-axis drive 830 is located at the common position CP. In some aspects, each corresponding distinct individual portion is imaged by only one respective camera 210A, 210B, 210C of the camera array 277 (note also that although the fields of view may overlap, the images may be cropped such that each corresponding distinct individual portion is imaged by only one respective camera 210A, 210B, 210C; whereas in other aspects, the fields of view do not overlap). In some aspects, at least one substrate S held in a corresponding wafer slot of a corresponding distinct individual portion is imaged by only one of the respective cameras 210A, 210B, 210C of the camera array 277 (note also that although the fields of view may overlap, the images may be cropped such that each corresponding distinct individual portion is imaged by only one respective camera 210A, 210B, 210C; whereas in other aspects, the fields of view do not overlap). Here, the controller 199 may be communicatively coupled to the transport arm 180TA to move the transport arm 180TA relative to the frame 800 (see FIG. 8 ) and position the common support 244 at the common position CP.

[0074] Each different individual portion of the substrate carrier 110 and the substrate stack 270 therein viewed by a corresponding camera 210A, 210B, 210C of the camera array 277 has a different set of wafer slots corresponding to the individual portion and the corresponding camera 210A, 210B, 210C, which are vertically distributed at a predetermined reference height viewed by the corresponding camera 210A, 210B, 210C. The predetermined reference height is determined by, for example, the reference position of the load port 120 where the substrate carrier 110 is located. The standard establishes heights for the substrate carrier corresponding to different holding slot numbers (in this example, for a 25-slot substrate carrier). For example, each field of view FOVA, FOVB, FOVC of the respective cameras 210A, 210B, 210C captures a respective region of interest RA, RB, RC of the interior 222 of the substrate carrier 110 (and the substrate stack 270 therein). In one or more aspects, the image of the corresponding distinct individual portion captured by each respective camera 210A, 210B, 210C excludes each other distinct individual portion viewed by each other respective camera 210A, 210B, 210C, and images each substrate in each slot of the substrate carrier 110 by the camera array 277 with the common support 244 in a common position CP. In this example, the substrate carrier 110 is a 25-substrate carrier, and the region of interest RC corresponds to holding slots 1-8, the region of interest RB corresponds to holding slots 9-17, and the region of interest RA corresponds to holding slots 18-25. The fields of view FOVA, FOVB, FOVC may overlap by any desired amount to provide substantially complete coverage of the interior 222 (in some aspects, this can increase the amount of image information and increase the resolution of the resulting map 280); while in other aspects, as described herein, the fields of view may not overlap or be cropped for image processing. In this regard, as described herein, image processing is performed on each image captured by the respective camera 210A, 210B, 210C, wherein the controller 199 combines the respective processed images to generate a map 280 of the substrate stack 270 within the substrate carrier 110.

[0075] Although Figure 2C 888, the cameras 210A, 210B, 210C are shown one above the other (e.g., in positions UC, MC, LC), but in other aspects (which also apply to fixedly mounted cameras), they can be mounted in any number of positions UL, US, UR, ML, MC, MR, LL, LC, LR to form a one-dimensional vertical camera array (in the Z direction), a one-dimensional horizontal camera array (e.g., in the X direction), or a two-dimensional camera array (e.g., in the XZ plane). As can be appreciated, in general, for a circular substrate, as the substrate outer edge 233 curves away from the at least one camera 210, the leftmost FL and rightmost FR of the substrate (see FIG. 888) are curved away from the at least one camera 210. Figure 2A) may be darker. In the event that the edge signal obtained by the at least one camera 210 drops below any suitable predetermined threshold, additional images of the substrate may be captured using a longer exposure time and / or a larger camera aperture. As will be appreciated, a longer exposure time and / or a larger aperture may result in overexposure of a central region WC of the substrate in the image, wherein the plurality of images (low-exposure and high-exposure images) or different vertical segments of different images may be combined using any suitable image processing algorithm, including but not limited to a high dynamic range (HDR) algorithm, to produce a resulting image with uniform exposure that highlights the substrate edge 233. Thus, the cameras in different positions UL, US, UR, ML, MC, MR, LL, LC, LR may be programmed with different aperture sizes and / or exposure speeds optimized for different regions of the substrate stack / substrate carrier. For example, a camera closer to the at least one illuminator 220 may have a slower exposure speed and / or a smaller aperture than a camera further away from the at least one illuminator 220 to substantially prevent overexposure of the image, thereby preventing substrate edge detection. As can be appreciated, the exposure speed and / or aperture size of the cameras in the different positions can be determined so that the resulting combined image has consistent exposure and contrast for features of the image substantially throughout the entire image (see Figure 4A ).

[0076] refer to Figure 2A 、 3B and 7, illuminating the substrate S via at least one illuminator 220 (also referred to herein as an illumination source), and capturing images via the at least one camera 210 in a manner that maximizes the signal in images corresponding to the substrate edge 500 and minimizes the signal in images corresponding to the background (including the environment surrounding the substrate S, the top / bottom of the substrate S, any chip grid pattern on the substrate S, etc.) to, for example, produce a high contrast image emphasizing the edge 500. An example of high contrast imaging is described in U.S. patent application Ser. No. 16 / 570,453, previously incorporated herein by reference. As will also be described herein, the at least one illuminator is configured to provide diffuse illumination across the width W of each substrate S (when viewed from the smaller side of the substrate—e.g., see Figure 4A , where width W is the visible width of the substrate(s) S held in the substrate holding position). As can be appreciated, the at least one illuminator 220 can be positioned within the substrate processing apparatus 100, 150, 165 in a manner generally similar to that described herein with respect to the cameras 210, 210A, 210B, 210C.

[0077] As an example, refer to Figure 2A 、 2B, 2C, 3B and 8A, the at least one illuminator 220 is connected to the common support 244 and is configured to illuminate the outer edge 233 of each substrate S in the substrate carrier 110 through the opening 888 when the common support 244 is in the common position CP (see Figures 2A-2C ) (The term "outer" is relative to the substrate carrier 110 and refers to the edge portion of the substrate visible through the opening 888). The outer edge 233 indicates the upper and lower edge boundaries 233U, 233L of the outer edge 233 of the corresponding substrate S (see FIG. Figure 2A ). The at least one illuminator 220 is positioned relative to each camera 210, 210A, 210B, 210C so that the outer edge 233 directs reflected edge illumination from the at least one illuminator 220 toward the camera 210, 210A, 210B, 210C and optically blanks background reflected light viewed through the opening 888 by each camera 210, 210A, 210B, 210C when the common support 244 is in the common position CP at the upper edge boundary 233U and the lower edge boundary 233L. The at least one illuminator 220 is positioned relative to the respective camera 210A, 210B, 210C so that each image captured by the respective camera 210A, 210B, 210C of a different individual portion of the substrate carrier 110 (e.g., see FIG. 2 ). Figure 4A and 6B -6E) optically blanks light reflected from the planar surfaces SP1, SP2 (e.g., top and bottom major planar surfaces) of the substrate S inserted in (or otherwise held in) the substrate carrier 110 and each other substrate S. For example, Figure 6E The region of interest in Figure 2C Any one or more of the regions RA, RB, RC (see also Figure 16A and 16B ), wherein the image from each camera 210A, 210B, 210C images a portion of the respective field of view FOVA, FOVB, FOVC (although the field of view may be larger than the captured image), wherein light reflected from the planar surfaces SP1, SP2 of the substrate S in the substrate carrier 110 (and any background of the carrier) and each other substrate S is optically suppressed. Here, the outer edge 233 of the substrate S is prominently defined in image contrast or otherwise marked with upper and lower edge boundaries 233U, 233L (see, for example, Figures 6A-6C ), image contrast is formed by and between edge reflections and optically blanked backgrounds registered by each camera 210, 210A, 210B, 210C to perform edge detection on each substrate S in the substrate carrier 110 with the common support 244 at a common position CP.

[0078] like Figure 2A and 3B As shown, in one aspect, the at least one illumination source 220 is at least one shaped illumination line 369. In the example shown, the shaped illumination line 369 is disposed in one or more of an upper position and a lower position in the near plane 300; however, in other aspects, the shaped illumination line 369 can be disposed in one or more of an upper position and a lower position in the far plane 301, or in a position intermediate one or more of the near plane 300 and the far plane 301. The shaped illumination line 369 is shaped to conform to the outer edge 233 of the substrate S held within the substrate carrier 110; however, in other aspects, the shaped illumination line 369 can have any suitable shape for illuminating the substrate S in the manner described herein.

[0079] refer to Figure 8A and 8B , the at least one illuminator 220 includes at least one vertical (Z-axis) oriented illuminator 220V1, 220V2 and at least one horizontal (in the XY plane) oriented illuminator 220H. Here, cameras 210A, 210B, 210C (although three are shown, there may be two or more cameras for imaging two or more different individual carrier areas) are arranged in an upper center position UC, a middle center position MC and a lower center position LC (see Figure 3A and 3B ) and is spanned by two illuminators 220V1 and 220V2, which extend from the upper right position UR to the lower right position LR and from the upper left position UL to the lower left position LL, respectively, so as to form two straight lines of illumination. The illuminator 220H is located above the cameras 210A, 210B, and 210C so as to illuminate the camera 210A, 210B, and 210C from any suitable angle β (e.g., Figure 8B In the example shown, the angle β is relative to the XY plane, but in other aspects, the angle may be relative to the Z axis) to illuminate the outer edge 233 of each substrate S. Here, the illuminator 220H is arranged to illuminate the substrate S so that the cameras 210A, 210B, 210C detect the substrate S1 sliding out of the carrier 110, while the illuminators 220V1, 220V2 illuminate the outer edge 233 in a manner such that background reflections (e.g., from the interior of the carrier, the top of the substrate, or the bottom of the substrate) are substantially prevented or otherwise eliminated.

[0080] In one aspect, reference may also be made to Figure 7A and 7B The illuminators 220V1, 220V2 are arranged to direct diffuse light in any suitable direction (ie, at any suitable angle) in the XY plane so as to illuminate the edge 233 of the substrate S through the opening 888 (see FIG. Figure 7A). For exemplary purposes, Figure 7B As shown, the illuminators 220V1, 220V2 are arranged to emit diffuse light in one or more directions that are tilted relative to the plane 888P of the opening 888. In the example shown, the illuminators emit light in any suitable direction outward at an angle α relative to the centerline 110C of the substrate carrier 110. In the example shown, the angle α is the same for both illuminators 220V1, 220V2; however, in other aspects, the angle α for illuminator 220V1 may be different from the angle α for illuminator 220V2. Here, the light from the illuminators 220V1, 220V2 is arranged vertically so that the light reaches the substrates S in all substrate holding slots of the substrate carrier 110 and is not blocked by vertically adjacent substrates. In this aspect, light from the illuminators 220V1, 220V2 is directed toward the reflective surfaces 750, 751 within the transfer chamber 130 such that the light is reflected by the reflective surfaces 750, 751 toward the edge 233 of the substrate S (now indirect light), thereby substantially eliminating reflections from the interior of the substrate carrier 110 as seen by the cameras 210A, 210B, 210C. In other aspects, the illuminators 220V1, 220V2 are equipped with diffusers or other light scattering devices that provide indirect or diffuse light to the substrate edge 233 in a manner that substantially eliminates reflections from the interior of the substrate carrier 110 as seen by the cameras 210A, 210B, 210C. The resulting effect of imaging by each camera 210A, 210B, 210C in the corresponding different individual areas / portions RA, RB, RC is that the substrate edge reflections optically blank out the background, thereby significantly defining the boundaries of each substrate edge with image contrast.

[0081] In one or more aspects, the illuminators 220, 220V1, 220V2, 220H, 369 are coupled to the controller 199 for dynamic control (e.g., turning on and off) and / or adjustment (e.g., intensity adjustment). The controller 199 is configured to cycle one or more of the illuminators 220, 220V1, 220V2, 220H, 369, or portion(s) thereof, to illuminate different portions of the substrate stack 270 being imaged, either individually or in combination (e.g., individually illuminating a top segment, a bottom segment, a middle segment, or any combination thereof, such as illuminating the top and middle segments, the top and bottom segments substantially simultaneously, or illuminating one or more of these different segments in any suitable sequence, wherein these segments are illuminated, either individually or in combination). The controller 199 is configured to maintain the intensity of illumination from one or more of the illuminators 220, 220V1, 220V2, 220H, 369 static (e.g., substantially constant intensity) or dynamically change its intensity. In the case of dynamically changing the intensity of one or more of the illuminators 220, 220V1, 220V2, 220H, 369, the intensity can vary along the X, Y, and / or Z directions of the illuminators 220, 220V1, 220V2, 220H, 369, including different illumination intensities on different sides of the box 110. In one or more aspects, the dynamic variation in intensity can be regular (e.g., in a regular sequence such as high-low, where, for each slot of the box 110, the illumination at a reference line (e.g., a baseline) is high and, for each reference line, decreases (e.g., low) as it moves away from the slot reference line). In other aspects, the illumination can be dynamically varied irregularly, such as high-high-high-low, at corresponding slot reference lines in a series of slot reference lines. In addition, different illuminators 220, 220V1, 220V2, 220H, 369 can use different types of light spectra (e.g., infrared light, visible white light, visible colored light, etc.) to enhance image contrast. Each illuminator 220, 220V1, 220V2, 220H, 369 can be independently controlled by the controller 199 for one or more of intensity and light spectrum.

[0082] Now refer to Figure 5 、 4A , 4B and 6A, the images (e.g., the final image, the original image, or the recombined image) are processed by the controller 199 to define the edge outline of the outer edge 233. As can be appreciated, any suitable image processing can be applied to these images to enhance the contrast of the outer edge 233 of the substrate S relative to the background. Examples of image processing that can be applied to the images to enhance contrast include, but are not limited to, grayscale filters, contrast stretching, and intensity transition edge filters. Figure 6AAn example application of an intensity transition edge filter is provided in , where each outer edge 233 is identified using two intensity transitions (eg, representing the upper and lower edge boundaries 233U, 233L of each substrate). Figure 6A As can be seen in FIG, two substrates arranged one on top of the other (ie, in a “double” state) are located in the substrate holding slots 13 of the substrate carrier 110 .

[0083] A substrate edge profile is generated in the raw view / profile (via any suitable edge construction / image processing algorithm(s)). A spatial correction algorithm is applied to the raw profile using the spatial calibration data to generate a true substrate edge profile that is independent of the position of the at least one camera 210 (for use by the controller when commanding the positioning of the end effector 180E to pick up the substrate S). Here, a multiple camera optical recognition system (such as the system described herein) generates substantially the same true profile 500T from different raw profiles in images captured by different cameras.

[0084] The edge definition algorithm programmed into the controller 199 is the same for both substrate mapping and edge contour definition. In one or more aspects, vertical image slices 410-416 of the image are analyzed to detect outer edges 233. One or more of the vertical slices 410-416 may be used to perform substrate mapping, wherein more than one of the vertical slices 410-416 may be used to perform edge contour definition. Note that for exemplary purposes only, Figure 4A 499 . In one embodiment, seven vertical slices are shown, while in other aspects more or less than seven slices (or two or three slices) may be used. To define the edge 233 of the substrate S for mapping and edge profiling, the image 499 is sliced ​​into vertical slices 410-416, which are narrow vertical strips of the image 499 taken at predetermined positions relative to the width 499W of the image 499. For each slice 410-416, the controller 199 averages the intensities of the image pixels along the horizontal direction 495 (the terms horizontal and vertical are used for reference only and for ease of explanation) to generate an intensity profile 480 as a function of vertical position within the slice 410-416. Figure 4B In FIG. 4 , an intensity profile 480 of, for example, slice 410 is shown for a portion of a substrate stack, wherein the intensity profile 480 is represented by a peak 489 (removed for clarity in FIG. 4 ) compared to a background level 488. Figure 4B Each substrate edge 433 (corresponding to outer edge 233) is identified by measuring the width of the corresponding peak base, as shown in FIG. Figure 4BAs can be seen in FIG. 1 , the peak substrate width of the peak corresponding to slot 13 in substrate stack 270 is approximately twice the expected thickness of substrate S (wherein the pixel size of the image can be converted to inches or millimeters by controller 199 in any suitable manner, such as by image recognition of substrate cassette features of known size), indicating that there are two substrates S in the same slot, one on top of the other (e.g., in FIG. 1 ). Figure 5 The "double" state shown in ). Figure 4B It can also be seen in FIG. 4 that the peak 489 corresponding to the groove 13 comprises a "double peak," which also indicates that there are two substrates S in the same groove, one on top of the other.

[0085] After the intensity profile 480 is established and the peaks 489 are determined, for each substrate slot, the controller 199 searches / determines which peak vertical positions are closest to the predetermined baseline height of the corresponding substrate holding slot (the predetermined vertical position within the box that will hold the substrate, i.e., the slot height). Here, the peaks are correlated with the substrate slot heights to determine whether a substrate is held in the corresponding substrate holding slot. In the event that a peak is found and correlated with the substrate holding height, the original edge profile of the substrate in the corresponding substrate holding slot is formed along the position of the peak in the intensity profile 480. For example, in Figure 4B The height of the trough 18 is identified in FIG4 , wherein the peak 489A is substantially centered relative to the height of the trough 18, causing the controller 199 to correlate the peak 489A with the trough 18 to indicate the presence of a substrate in the trough 18. The controller 199 determines the true edge profile 500T ( ) for any given substrate S by subtracting, for each data point (of the raw profile) in the intensity profile 480, the vertical position of the calibrated baseline (at the same horizontal position of the image slice) from the vertical position of the raw profile (at the same horizontal position of the image slice for the given substrate S). Figure 5 ). The controller 199 determines the thickness of a given substrate S as the average of the thicknesses measured from all data points on the corresponding original profile.

[0086] In one or more aspects, reference Figure 6B 、 6C6D, the edge definition algorithm includes (e.g., using the controller 199) dividing the raw image from the at least one camera 210 into a center region 600M, a left region 600L, and a right region 600R. The left region 600L is substantially illuminated by the illuminator 220V2, the right region 600R is substantially illuminated by the illuminator 220V1, and the center region 600M is substantially illuminated by the illuminator 220H; however, in other aspects, the regions 600M, 600L, 600R can be illuminated by any one or more of the illuminators described herein in any suitable manner. Here, for each of the center region 600M, the left region 600L, and the right region 600R, the above-mentioned state is determined (e.g., in a manner similar to that described above with respect to the image intensity profile). Substrates disposed below (or above, depending on the camera and / or lighting angle) a substrate slid out of the substrate carrier 110 may be hidden from view by the slid-out substrate and may not be detected in the middle region 600M, but those hidden substrates may be detected in the left region 600L and the right region 600R (see FIG. Figure 6B ).like Figure 6B As shown, the fourth substrate (or wafer) at the top of the image (identified as "wafer detected (slid out)") has slid out of the substrate carrier 110 and is blocking light from shining on the substrate below the slid out substrate in the middle region 600M; however, the substrate below the slid out substrate is visible in the left region 600L and the right region 600R. Here, as shown in FIG. Figure 6B As shown, when a substrate is detected in both the left region 600L and the right region 600R for any given slot, the substrate for that given slot is detected (i.e., identified as present). For any given slot, reflections detected in the middle region 600M but not in the left region 600L and the right region 600R are mapped as not present (e.g., empty slot) (see FIG. Figure 6C ). As in Figure 6C As can be seen in FIG. 6 , the areas of the image corresponding to the substrate holding slots where there are reflections in the middle region 600M but no corresponding reflections in either the left region 600L or the right region 600R are mapped as empty slots (ie, substrate not present).

[0087] Figure 6D301, which has been optimized by the controller 199 (using any suitable image processing, such as that described herein), and which shows substrate edges detected in the middle region 600M, the left region 600L, and the right region 600M. The controller 199 is configured to detect (by any suitable image processing, such as that described herein) the edges of the substrate in any suitable region of interest within the captured image (including each of the middle region 600M, the left region 600L, and the right region 600M). Figure 6E As shown. Figure 6F As can be seen, the controller 199 is configured to connect edges detected in each of the middle region 600M, the left region 600L, and the right region 600M (corresponding to substrate holding slots of the substrate carrier 110 having slot boundaries known to the controller) to determine that a substrate is present.

[0088] use Figure 6B and 6C One or more of the middle region 600M, the left region 600L, and the right region 600R in the substrate may be used to detect substrate warpage / bending as described herein.

[0089] At this point, in the edge definition algorithm, sufficient data is obtained to perform substrate mapping of the status of the substrate S in the substrate cassette 110 by employing the exemplary substrate mapping rules described above.

[0090] Note that for edge profiling of the substrate, further data is needed (in addition to the data obtained for mapping) to determine any bending / warping of the substrate that may hinder substrate pickup. As mentioned above, the original profile of the substrate may depend on the position of the at least one camera 210 that images the substrate. The controller 199 is configured to obtain the original profile (see Figure 5 ) applies spatial correction to transform the original profile into a camera-independent corrected true profile 500TC (see Figure 10-13 ). Figures 9A-9C An example of comparison of the original (edge) contour with the true (edge) contour is provided in . Figure 9A The true edge profile 500T of each substrate S in the substrate stack 270 is shown. The true edge profile 500T is substantially equivalent to the edge profile of the substrate S positioned at the far plane 301 ( Figure 3A and 3B) and located at a middle center position MC. For exemplary purposes only, a telephoto lens is a lens having a focal length of approximately 100 mm or greater and that of a full-frame camera (i.e., a camera with an image sensor format the same size as a 35mm film format); however, in other aspects, the telephoto lens focal length can be greater or less than approximately 100 mm. Here, the curved shape of the substrate edge is not apparent because the direction of the 3D to 2D projection is generally parallel to the substrate plane. Figure 9B A raw image of camera 210 (equipped with a wide-angle lens) is shown at a middle center position MC of near plane 300. For exemplary purposes only, a wide-angle lens is a lens having a focal length of approximately 28 mm or less and used with a full-frame camera; however, in other aspects, the focal length of the wide-angle lens can be greater or less than approximately 28 mm. Figure 9C is an illustration of a raw image of a camera 210 (equipped with a wide angle lens) located at a lower center position LC on the near plane 300 , with its field of view pointing upward (at an angle) toward a substrate S in the substrate stack 270 . Figure 9D is an illustration of the raw image of the camera 210 (equipped with a wide angle lens) located at the upper center position LC on the near plane 300, with its field of view directed downward (at a certain angle) toward the substrate S in the substrate stack 270. Here, the raw view of the wide angle lens (from the near plane 300) illustrates the effect of a three-dimensional object being projected into the two-dimensional image plane of the camera's field of view. Figures 9B-9D As is apparent in FIG, the shape of the substrate becomes visible when the 3D to 2D projection lines are no longer parallel, for example due to proximity to camera 210. The further the substrate is from the camera position, the more pronounced the 3D shape of the substrate becomes. As the substrate is positioned further away from the camera (e.g., at Figures 9B-9D ), the perspective also changes, wherein substrates that are further away appear smaller than substrates that are closer relative to the camera 210. Figures 9B-9D The background in the original image may also be distorted (e.g., barrel distortion) due to the characteristics of the wide-angle lens.

[0091] The above can be corrected by applying spatial calibration data 281 to the original image with the help of controller 199. Figures 9B-9D . The controller 199 is configured to utilize an empirical method to transform the original profile into a corrected true profile 500TC, wherein the corrected true profile 500TC provides substrate warpage / bow determination and end effector adjustment to pick up and place the warped / bowed substrate S. The empirical method includes initial spatial calibration and spatial correction at runtime when measuring the substrate profile.

[0092] The controller 199 may be communicatively coupled to the camera array 277 and programmed with each respective camera calibration (also referred to herein as spatial calibration data 281) having a baseline image for a respective camera 210A, 210B, 210C (see FIG. Figure 5 and Figure 10 , wherein each baseline 510 of a corresponding substrate carrier 110 slot together forms a baseline image). Figure 15A 、 15B , 15C and 15D provide examples of baseline images (note that these baseline images correspond to Figure 9A 、 9B , 9C and 9D). The baseline image of each corresponding camera 210A, 210B, 210C ( Figures 15A-15D The baseline image of four cameras, one camera located at the far plane 301 center middle CM, and three cameras located at the near plane center middle CM, upper center US and lower center LC) is different from the baseline image of each other corresponding camera 210A, 210B, 210C (as shown in Figures 15A-15D ), and are correspondingly separate distinct portions of the substrate carrier 110 imaged by the respective cameras 210A, 210B, 210C (see Figure 2C The regions RA, RB, RC and Figure 6E 10C). Each of the at least one substrate S in each of at least one corresponding slot of at least one corresponding slot (a region of interest in a ...

[0093] Also refer to Figure 10-13 An initial spatial calibration is obtained by capturing the original profile of a flat substrate (e.g., calibration wafer 1500, which is known to be flat and without bow / warp) whose true profile 500T and position within substrate stack 270 are known. The original baseline or calibration image serves as the spatial calibration data 281 for each respective camera 210A, 210B, 210C (see Figure 2A ) is stored in the controller 199 (or the memory 199M accessible to the controller 199). The edge profile of the calibration wafer 1500 corresponding to each substrate holding groove is formed as in, for example Figure 5 and Figure 10-13 , and a baseline image 510 position of each substrate shown in the image (i.e., the expected position of the corresponding substrate in the substrate carrier obtained from the baseline image). Generally, spatial calibration is performed after the camera is installed, and if the camera position or angle changes after the initial installation, the spatial calibration is rerun. In one or more aspects, the calibration wafer 1500 is integrally formed with or otherwise secured to a calibration box (substantially similar to box 110, but with the calibration wafer secured in a predetermined position therein). Here, the calibration wafer 1500 can be a partial wafer coupled to a carrier so as to form a leading edge of a wafer that is scanned / detected in the calibration image in the manner described herein. Here, the calibration box, together with the integral calibration wafer, forms a calibration wafer rack that sits on a load port as a unit. In other aspects, the calibration wafer 1500 can be integrally formed as a stack of wafers that are inserted into the box as rack units, with predetermined spacing and vertical alignment between the integrally formed calibration wafers in the integral wafer stack. Here, the integrally formed wafer stack may be placed on and / or removed from the slot of the cassette 110 as a rack unit.

[0094] In operation, when measuring a substrate edge profile (e.g., for mapping and / or edge profiling), the controller 199 performs a spatial correction on the raw image / profile, wherein the controller 199 applies the spatial calibration data 281 to correct the raw profile of the substrate and obtains a corrected true profile 500TC by subtracting the raw profile of the substrate in a given slot from the baseline 510 of the given slot (e.g., wherein any deviation of the measured raw profile 500 from the baseline 510 is indicative of bow / warp of the substrate as represented in the corrected true profile 500TC (see, e.g., FIG. 2 ). Figure 10 on the right side)).

[0095] The spatial correction described herein provides at least an equivalent transformation from a wide angle lens projected at close range (e.g., at the near plane 300) to a telephoto lens projected at far range (e.g., at the far plane 301), correction for perspective effects corresponding to the angle of the camera and the distance relative to the substrate being imaged, correction for barrel distortion introduced by the wide angle lens, and correction for mechanical variations in position and orientation in the camera mount. Figure 11-13 Experimental data obtained by employing spatial correction in edge profiling are shown in , which illustrate the effectiveness of the spatial correction described in this paper. Figure 11 An original outline 500 of three substrates spanning the width of the substrate cassette 110 is shown. Figure 12 Shown Figure 11 an intermediate substrate (e.g., a trench 13 substrate). Figure 13The corrected true profile 500TC of the trench 13 substrate is shown, exhibiting warping / bending.Also, note that spatial correction can be applied before or after processing the image by cutting the image into vertical image slices 410-416.

[0096] As described above, the controller 199 uses the substrate profile when commanding the substrate transporter 180 to pick up the substrate. Here, the controller 199 can be configured to use the substrate profile by placing the teeth 180TE1, 180TE2 as shown in FIG. Figure 13 (e.g., where there is enough space to insert teeth under the substrate) to command the end effector 180E of the substrate transporter to widen / increase the tines 180TE1, 180TE2 based on the corrected true profile 510TC of the substrate (see Figure 1A ) between the distance TD (see Figure 1A ) to accommodate any warping / bending in the substrate (e.g., Figure 13 groove 13 in the substrate).

[0097] refer to Figures 1A-1C , 2A-2C, 8A, 8B and 14, an exemplary substrate mapping / edge profiling operation will be described. A frame 800 is provided to form an opening 888 (eg, a wafer loading opening) that communicates with the load port 120 ( Figure 14 , block 1400). As described herein, the load port 120 is configured to hold a substrate carrier 110, wherein the substrate carrier 110 holds more than one substrate S vertically distributed within the substrate carrier 110 for loading into the substrate processing apparatus 100, 150, 165 through the opening 888. A transport arm 180TA (e.g., a movable arm) is provided and mounted to the frame 800 ( Figure 14 , block 1405) for movement relative to the opening 888. As depicted, the transport arm 180TA includes an end effector 180E movably mounted to the transport arm 180TA for loading a substrate from the substrate carrier 110 into the substrate processing apparatus 100, 150, 165 (or vice versa) through the opening 888.

[0098] Provide a machine vision system 200 (eg, an image acquisition system) ( Figure 14, block 1410), the machine vision system 200 includes at least one camera 210. For exemplary purposes, the method is described with respect to the camera array 277, but it should be understood that the method is equally applicable to images captured by a single camera. As described above, each respective camera 210A, 210B, 210C is positioned with a field of view FOVA, FOVB, FOVC configured to observe, through the opening 888, a different, separate portion of the substrate carrier 110 having a wafer slot for holding at least one of the more than one substrates S when the common support 244 is positioned in the common position CP by the transport arm 180TA, the different, separate portion being distinct from a portion of the substrate carrier 110 having a different wafer slot for holding a substrate S different from the at least one substrate S as observed by each of the other cameras 210A, 210B, 210C when the common support 244 is in the common position CP, and each substrate S held in the substrate carrier 110 is imaged by the camera array 277 when the common support 244 is in the common position CP.

[0099] Providing the at least one illuminator 220 ( Figure 14 , block 1415), the at least one illuminator 220 is connected to the common support 244. As described above, the at least one illuminator is configured to illuminate the outer edge 233 of each substrate S in the substrate carrier 110 through the opening 888 when the common support 244 is in the common position CP, the edge indicating the upper and lower edge boundaries 233U, 233L of the outer edge 233 of the substrate S. The at least one illuminator 220 is disposed relative to each respective camera 210A, 210B, 210C and is illuminated by a corresponding separate distinct portion of each respective camera 210A, 210B, 210C (e.g., see FIG. 2 ). Figure 2C The regions RA, RB, RC and Figure 6E The images of the region of interest in the substrate carrier 110 (the region of interest in the substrate carrier 110) are arranged such that the outer edge 233 directs reflected edge illumination from the at least one illuminator 220 toward the respective camera 210A, 210B, 210C and optically cancels background reflected light at the upper edge boundary 233U and the lower edge boundary 233L in images of separate distinct portions of the substrate carrier 110 captured by the respective camera 210A, 210B, 210C through the opening 888 when the common support 244 is in the common position CP. As described herein, the upper and lower edge boundaries 233U, 233L are utilized to significantly define the outer edge 233 of the substrate S with image contrast formed between and by the edge reflections and the optically canceled background registered by each camera 210A, 210B, 210C to perform edge detection for each substrate S in the substrate carrier 110 when the common support 244 is in the common position CP.

[0100] When the substrate carrier 110 is seated on the load port 120, the controller 199 commands the transport arm 180TA to be moved so that the transport arm 180TA is positioned relative to the opening 888 ( Figure 14 , block 1420) to image the substrate S within the carrier 110 through the opening 888. The substrate S is illuminated by the at least one illuminator 220 and different individual areas are captured by the camera array 277 via the opening 888 (e.g., see Figure 2C The image of the substrate S in the regions RA, RB, RC) ( Figure 14 , block 1425). After capturing raw images of the substrate in each of the different individual regions, the controller 199 is configured to perform one or more of determining a substrate map and determining substrate warpage / bow. As described herein, substrate mapping and warpage / bow determination may be determined in any suitable order relative to one another, such as where both are desired.

[0101] With respect to substrate mapping, the controller 199 determines an intensity profile 480 for each of the different individual regions (eg, regions RA, RB, RC) in the manner described herein (see Figure 4A and 4B )( Figure 14 , block 1430). From the intensity profile 480, the controller 199 determines the true edge profile 500T ( Figure 14 , block 1440), thereby determining a substrate map 280 for each different individual region and the entire substrate carrier 110 ( Figure 14 , block 1442). The controller 199 determines the substrate state (e.g., absent, present, double, intersecting, shifted) from the substrate map 280 by applying substrate mapping rules to the true edge contour 480 using any suitable image processing algorithm, as described herein ( Figure 14 , Block 1445). Brief Reference Figure 16B , the controller 199 is configured to compare adjacent substrate holding positions of adjacent different individual regions to determine, for example, an intersecting slot substrate that spans between adjacent different individual regions. Figure 16BAs can be seen in the figure, grooves 8 and grooves 9 of different individual regions RC and RB, respectively, are adjacent to each other, and in some aspects, there may be a substrate with an intersecting groove between grooves 8 and grooves 9. The controller 199 is configured to employ the wafer mapping rules described herein in determining the substrate map 280 and state of the substrate S in the substrate carrier 110, such as when multiple cameras 210A, 210B, 210C are employed to capture images in the different individual regions RA, RB, RC, in which the grooves forming boundaries between adjacent different individual regions (in this example, the different individual regions RC and RB, with the boundary grooves being grooves 8 and grooves 9).

[0102] Note that when imaging the substrate S, capturing images in different individual areas (e.g., multiple images from different cameras covering corresponding different individual areas in different individual areas and combined to form a substrate map) provides less distortion of the substrate S than imaging the entire substrate carrier 110 in a single image. For example, Figure 16A shows the raw contour images of the substrate S captured from the cameras 210A, 210B, 210C for each respective different individual region RA, RB, RC, while Figure 16B The true contour image of the substrate S captured from the cameras 210A, 210B, 210C for each respective different individual region RA, RB, RC is shown. Figures 9B-9C When compared to the original profile, it can be seen that there is less substrate deformation (i.e., between the original profile and the true profile) when multiple cameras 210A, 210B, 210C are used to image the corresponding different individual areas RA, RB, RC compared to when a single camera is used to image all substrates S in the substrate carrier 110 at once.

[0103] With respect to determination of substrate warpage / bow, in the event that spatial calibration data 281 does not exist for each camera 210A, 210B, 210C for the load port 120 where the substrate cassette 110 is located, the controller 199 obtains / determines spatial calibration data 281 for each camera 210A, 210B, 210C in the manner described herein. Figure 14 , block 1455). The controller 199 determines the intensity profile 480 (see FIG. 48) of the substrate S held in the substrate carrier 210 (in each of the different individual zones) seated on the load port 210 in the manner described herein. Figure 4A and 4B )( Figure 14 , block 1430). The spatial calibration data 281 is applied to the captured image (at least the substrate imaged as identified by the intensity distribution 480) ( Figure 14, block 1460) such that a corrected true edge profile 500TC is determined for the imaged substrate S. For example, camera 210A corresponds to a different individual area RA, camera 210B corresponds to a different individual area RB, and camera 210C corresponds to a different individual area RC. The spatial correction data 281 of camera 210A is applied to the different individual areas RA, the spatial correction data 281 of camera 210B is applied to the different individual areas RB, and the spatial correction data 281 of camera 210C is applied to the different individual areas RC. Any substrate warpage / bend of the substrate in the different individual areas RA, RB, RC is determined by the controller 199 in any suitable manner (such as using image processing as described herein) from the corrected true edge profile 500TC of the substrate S. Figure 14 , block 1467). The controller 199 uses the warp / bend determination to adjust the distance TD (or spacing) between the end effector tines 180ET1, 180ET2 (see Figure 1A ) to pick up the warped / bent substrate S ( Figure 14 , box 1470).

[0104] It should be understood that the above description only illustrates aspects of the present disclosure. Various alternatives and modifications may be envisioned by those skilled in the art without departing from aspects of the present disclosure. Therefore, aspects of the present disclosure are intended to include all such alternatives, modifications, and variations that fall within the scope of any appended claims. Furthermore, the mere fact that different features are recited in mutually different dependent or independent claims does not indicate that a combination of these features cannot be used to advantage, and such combinations remain within the scope of aspects of the present disclosure.

Claims

1. A semiconductor substrate transport device, comprising: a frame forming a substrate loading opening in communication with a loading station for a substrate carrier configured to hold more than one substrate stacked in the substrate carrier for loading through the substrate loading opening; a movable door movably connected to the frame to open and close the substrate loading opening; a movable arm movably mounted to the frame for movement relative to the substrate loading opening and having at least one end effector movably mounted to the movable arm for loading a substrate from the substrate carrier through the substrate loading opening; an image acquisition system including at least one camera having a field of view configured to view a substrate slot for holding at least one of the more than one substrates in a substrate carrier through a substrate loading opening with the at least one camera positioned by the movable door, and each substrate held in the substrate carrier being imaged by the at least one camera positioned by the movable door; as well as an illumination source connected to and positioned by the movable door, in common with at least one camera, to illuminate an outer edge of each substrate in the substrate carrier through the substrate loading opening, the outer edge marking upper and lower edge boundaries of the outer edge of the substrate, the illumination source being positioned relative to the at least one camera such that the outer edge directs reflected edge illumination from the illumination source toward the at least one camera and optically blanks background reflected light observed by the at least one camera through the substrate loading opening at the upper and lower edge boundaries; The upper edge boundary and the lower edge boundary are used in the image to significantly define the outer edge of the substrate with image contrast, and the image contrast is formed by and between the edge reflection and the optically blanked background aligned by at least one camera, so as to determine one or more of the warping amount and the bending amount of a corresponding selected one of the stacked substrates from the image of the outer edge. 2 . The semiconductor substrate transporting apparatus according to claim 1 , wherein the end effector has movable teeth that are adjusted to change a distance between teeth to pick up a substrate that is one or more of a warped substrate and a curved substrate.

3. The semiconductor substrate transport apparatus of claim 1 , wherein the end effector has teeth that move relative to each other to pick up a substrate based on determination of one or more of an amount of warpage and an amount of bending of a corresponding selected one of the stacked substrates.

4. The semiconductor substrate transport apparatus of claim 1 , wherein the illumination source is positioned relative to the respective cameras such that light reflected from the planar surface of the substrate inserted in the substrate carrier and each other substrate is optically blanked in each image captured by the respective cameras.

5. The semiconductor substrate transport apparatus of claim 1 , further comprising a controller communicatively coupled to the movable door and the at least one camera, the controller configured to move the movable door to open and close the substrate loading opening, and to image the more than one substrate in the substrate carrier using one or more images as the movable door moves to open and close the substrate loading opening.

6. The semiconductor substrate transport apparatus of claim 5 , wherein the controller is configured to position the movable door at predetermined positions relative to the substrate carrier, thereby enabling imaging of separate and distinct portions of the substrate carrier using at least one camera located at each respective predetermined position.

7. The semiconductor substrate transport apparatus of claim 6, wherein each separate and distinct portion of the substrate carrier imaged by the at least one camera has a different set of substrate slots corresponding to the separate and distinct portion of the substrate carrier.

8. The semiconductor substrate transport device according to claim 1, wherein based on the determination of one or more of the warping amount and the bending amount of the corresponding selected one of the stacked substrates, the end effector is moved and adjusted relative to the substrate loading opening to achieve the picking up of the corresponding selected one of the stacked substrates.

9. A semiconductor substrate transport device comprising: a frame forming a substrate loading opening in communication with a loading station for a substrate carrier configured to hold more than one substrate stacked therein for loading through the substrate loading opening; a movable door movably connected to the frame to open and close the substrate loading opening; a movable arm movably mounted to the frame for movement relative to the substrate loading opening and having at least one end effector movably mounted to the movable arm for loading a substrate from the substrate carrier through the substrate loading opening; an image acquisition system including at least one camera having a field of view configured to view a substrate slot for holding at least one of the more than one substrates in a substrate carrier through a substrate loading opening with the at least one camera positioned by the movable door, and each substrate held in the substrate carrier being imaged by the at least one camera positioned by the movable door; as well as an illumination source coupled to and positioned by the movable door to illuminate an edge profile of each substrate in the substrate carrier through the substrate loading opening, the edge profile identifying upper and lower edge boundaries of the edge profile of the substrate, the illumination source being positioned relative to at least one camera positioned by the movable door such that outer edges of the substrates direct reflected edge illumination from the illumination source toward the at least one camera and optically blanking background reflected light observed by the at least one camera through the substrate loading opening at the upper and lower edge boundaries; The upper edge boundary and the lower edge boundary are used in the image to significantly define the edge profile of the substrate with image contrast, and the image contrast is formed by and between the edge reflection and the optically blanked background aligned by at least one camera, so as to determine one or more of the warping amount and the bending amount of a corresponding selected one of the stacked substrates from the image of the edge profile. 10 . The semiconductor substrate transporting apparatus according to claim 9 , wherein the end effector has movable teeth that are adjusted to change a distance between teeth to pick up a substrate that is one or more of a warped substrate and a curved substrate.

11. The semiconductor substrate transporting apparatus of claim 9, wherein the end effector has teeth that move relative to each other to pick up a substrate based on determination of one or more of an amount of warpage and an amount of bending of a corresponding selected one of the stacked substrates.

12. The semiconductor substrate transport apparatus of claim 9, wherein the illumination sources are positioned relative to the respective cameras such that light reflected from the planar surfaces of the substrate inserted in the substrate carrier and each other substrate is optically blanked in each image captured by the respective cameras.

13. The semiconductor substrate transporting device according to claim 9, further comprising: a controller communicatively coupled to the movable door and the at least one camera, the controller configured to: moving the movable door to open and close the substrate loading opening, and enabling imaging of the more than one substrate in the substrate carrier using one or more images as the movable door moves to open and close the substrate loading opening; as well as The controller is configured to position the movable door at predetermined positions relative to the substrate carrier to enable imaging of separate and distinct portions of the substrate carrier using at least one camera at each respective predetermined position.

14. The semiconductor substrate transport apparatus of claim 13, wherein each separate and distinct portion of the substrate carrier imaged by the at least one camera has a different set of substrate slots corresponding to the separate and distinct portion of the substrate carrier.

15. The semiconductor substrate transport device according to claim 9, wherein based on the determination of one or more of the warping amount and the bending amount of the corresponding selected one of the stacked substrates, the end effector is moved and adjusted relative to the substrate loading opening to achieve the picking up of the corresponding selected one of the stacked substrates.

16. A method comprising: A semiconductor substrate transport device is provided having the following components: a frame forming a substrate loading opening communicating with a loading station for a substrate carrier, the substrate carrier being arranged to hold more than one substrate stacked therein for loading through the substrate loading opening, a movable door movably connected to the frame to open and close the substrate loading opening, a movable arm movably mounted to the frame for movement relative to the substrate loading opening and having at least one end effector movably mounted to the movable arm for loading a substrate from the substrate carrier through the substrate loading opening, an image acquisition system comprising at least one camera, and a lighting source connected to the movable door; positioning at least one camera with the movable door such that a field of view of the at least one camera is arranged to view a substrate slot for holding at least one of the more than one substrates in a substrate carrier through the substrate loading opening, and each substrate held in the substrate carrier is imaged by the at least one camera positioned by the movable door; illuminating an outer edge of each substrate in the substrate carrier through the substrate loading opening with an illumination source common to at least one camera and connected to and positioned by the movable door, the outer edge marking upper and lower edge boundaries of the outer edge of the substrate, the illumination source being positioned relative to the at least one camera such that the outer edge directs reflected edge illumination from the illumination source toward the at least one camera and optically blanking background reflected light observed by the at least one camera through the substrate loading opening at the upper and lower edge boundaries; and Based on the image of the outer edge, one or more of the warping and bending amounts of a corresponding selected one of the stacked substrates are determined, wherein the outer edge of the substrate is significantly defined in the image by the upper edge boundary and the lower edge boundary with image contrast, and the image contrast is formed by and between the edge reflection and the optically blanked background aligned by at least one camera. 17 . The method of claim 16 , further comprising adjusting movable teeth of the end effector to change a distance between the teeth to pick up a substrate that is one or more of a warped substrate and a curved substrate.

18. The method of claim 16, further comprising moving the teeth of the end effector relative to each other to pick up a substrate based on the determination of one or more of an amount of warpage and an amount of bowing of a corresponding selected one of the stacked substrates.

19. The method of claim 16, wherein the illumination sources are positioned relative to the respective cameras such that light reflected from the planar surfaces of the substrate and each other substrate inserted in the substrate carrier is optically blanked in each image captured by the respective cameras.

20. The method of claim 16, further comprising, utilizing a controller communicatively coupled to the movable door and at least one camera, enabling movement of the movable door to open and close the substrate loading opening, and imaging the more than one substrate in the substrate carrier with one or more images using the at least one camera as the movable door moves to open and close the substrate loading opening.

21. The method of claim 20, further comprising enabling, with the controller, positioning the movable door at predetermined positions relative to the substrate carrier, and imaging separate and distinct portions of the substrate carrier with at least one camera located at each respective predetermined position.

22. The method of claim 21, wherein each separate and distinct portion of the substrate carrier imaged by the at least one camera has a different set of substrate slots corresponding to the separate and distinct portion of the substrate carrier.

23. The method according to claim 16 further includes moving and adjusting the end effector relative to the substrate loading opening based on determining one or more of the warping amount and the bending amount of the corresponding selected one of the stacked substrates to achieve picking up the corresponding one of the stacked substrates.

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