Electronic device including liquid coolant conduit having spiral portion

Abstract

The invention discloses an electronic device including a liquid coolant conduit having a spiral portion. An electronic device may include an electronic component, a cooling body in thermal contact with the electronic component, a conduit including a coiled portion coupled to the cooling body to deliver coolant to or from the cooling body, and a coupler coupled to the coiled portion of the conduit, the coupler being removably coupleable to a coolant infrastructure coupler.

Description

Technical Field

[0001] The present invention relates to the field of electronic devices, and more particularly, to liquid-cooled electronic devices. Background Art

[0002] Some electronic devices (e.g., network devices such as network switches in a network system) include heat-generating electronic components that may require cooling. Cooling of heat-generating electronic components of electronic devices can be accomplished using liquid coolants. Cooling heat-generating components using liquid coolants typically requires coupling the electronic devices to cooling infrastructure within a facility (e.g., a data center). Electronic devices typically include conduits through which the liquid coolant circulates and connectors that removably connect the electronic device conduits to connectors of the coolant infrastructure. Due to tolerances between the positions of the connectors in the electronic device and the positions of the coolant infrastructure connectors in the rack, a certain amount of mechanical flexibility may be required to allow the electronic device connectors to properly connect to the coolant infrastructure connectors. However, the conduits of electronic devices are typically formed from rigid materials. To achieve the desired flexibility, flexible hoses are often integrated into the cooling conduit systems of electronic devices. Such flexible hoses are typically connected to the conduits using barbs. However, barbs can increase the likelihood of corrosion and mechanical failure. Additionally, the hydraulic impedance of each electronic device in the rack may need to be adjusted to achieve the desired pressure drop to flow rate ratio. To adjust the hydraulic impedance, orifices and / or heat sinks with relatively small fin pitch are often integrated into the cooling systems of electronic devices. However, this solution can increase the likelihood of corrosion and blockage. Corrosion, mechanical failure, and blockages can impair the proper functioning of the cooling system and the heat-generating components of electronic equipment. Summary of the Invention

[0003] Embodiments of the present invention may provide an electronic device that may include a cooling body in thermal contact with an electronic component, a conduit including a coiled portion coupled to the cooling body to transport a coolant to or from the cooling body, and a coupler coupled to the coiled portion of the conduit, the coupler being detachably coupled to a coolant infrastructure coupler.

[0004] Embodiments of the present invention may provide an electronic device that may include a heat conductor in thermal contact with a heat-generating component, a tube coupled to the heat conductor to transport liquid coolant to or from the heat conductor, the tube including a spiral portion in which the tube is bent into a spiral shape, and a connector connected to the spiral portion of the metal tube, the connector being capable of being detachably connected to a liquid coolant infrastructure coupler.

[0005] 19. The heat dissipation device of claim 18, wherein the heat dissipation device comprises a first tube connected to the heat dissipation device and a second tube connected to the heat dissipation device. The first tube comprises a spiral portion in which the first tube is bent into a spiral shape around a first longitudinal axis; the second tube comprises a spiral portion in which the second tube is bent into a spiral shape around a second longitudinal axis; an inlet connector connected to the spiral portion of the first tube; and an outlet connector connected to the spiral portion of the second tube, wherein the spiral portion of each of the first tube and the second tube is elastically deformed in a direction parallel to the corresponding first longitudinal axis or second longitudinal axis, in a direction perpendicular to the corresponding first longitudinal axis or second longitudinal axis, or in both directions when the corresponding inlet connector or outlet connector is connected to a liquid coolant infrastructure coupler. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] For a better understanding of the embodiments of the present invention and to show how these embodiments may be implemented, reference is made to the accompanying drawings, in which like numerals represent corresponding elements or parts throughout, by way of example only. In the drawings:

[0007] Figure 1 is a perspective view of an electronic device according to some embodiments of the present invention;

[0008] Figure 2 According to some embodiments of the present invention, Figure 1 An enlarged view of an electronic device;

[0009] Figure 3 is a perspective view of a cooling system for an electronic device according to some embodiments of the present invention;

[0010] Figure 4 is a graph showing results of compression and side pull experiments conducted on two example coiled catheter sections having different numbers of coils, according to some embodiments of the present invention; and

[0011] Figure 5 is a graph showing experimental, simulation, analytical, and averaged results of the variation in pressure drop across an example coiled conduit section as a function of flow rate through the coiled conduit section, according to some embodiments of the present invention.

[0012] It should be understood that for simplicity and clarity of illustration, the elements shown in the figures are not necessarily drawn to scale. For example, the dimensions of some elements may be exaggerated relative to other elements for clarity. Furthermore, where deemed appropriate, reference numerals may be repeated in the figures to indicate corresponding or similar elements. DETAILED DESCRIPTION

[0013] In the following description, various aspects of the present invention are described. For the purpose of explanation, specific configurations and details are set forth in order to provide a thorough understanding of the present invention. However, it will also be understood by those skilled in the art that the present invention may be implemented without the specific details provided herein. In addition, well-known features have been omitted or simplified so as not to obscure the present invention. With specific reference to the accompanying drawings, it should be emphasized that the details shown are merely examples and are used only for illustrative purposes to discuss the present invention and are intended to provide a description of the principles and concepts of the present invention that is considered to be the most useful and easiest to understand. In this regard, unless necessary for a basic understanding of the present invention, no attempt is made to show the structural details of the present invention in more detail, and the description in conjunction with the accompanying drawings will enable those skilled in the art to clearly understand how several forms of the present invention are embodied in practice.

[0014] Before explaining at least one embodiment of the present invention in detail, it should be understood that the invention is not limited in its application to the details of construction and the arrangement of components set forth in the following description or illustrated in the accompanying drawings. The invention is applicable to other embodiments and combinations of the disclosed embodiments that can be practiced or implemented in various ways. Furthermore, it should be understood that the phraseology and terminology used herein are for descriptive purposes only and should not be construed as limiting.

[0015] Embodiments of the present invention can improve cooling systems for electronic devices. The electronic device may include electronic components (e.g., heat-generating components). During operation, the electronic components may generate heat. The electronic device may include a cooling body (e.g., a heat conductor). The cooling body may be coupled to the electronic components. The cooling body may be in thermal contact with the electronic components. The electronic device may include a conduit (e.g., a tube). The conduit may be coupled to the cooling body to transport a coolant (e.g., a liquid coolant) to or from the cooling body. The conduit may be formed from a rigid (e.g., non-flexible) material. The conduit may include a coiled portion (e.g., a helical portion). The coiled portion of the conduit may be arranged along a central axis (e.g., a longitudinal axis). The coiled portion of the conduit may include a plurality of turns (e.g., a winding). Each two adjacent turns of the coiled portion of the conduit may be spaced apart from each other. The conduit, or at least the coiled portion of the conduit, may be formed from an elastic material, such as metal (e.g., copper, stainless steel, or any other suitable metallic material). The coiled portion of the conduit may be elastically deformable under an applied force. For example, a plurality of distanced turns formed of an elastic material can cause the coiled portion of the catheter to elastically deform under an applied force, e.g., in a spring-like manner. The electronic device can include a coupler (e.g., a blind-mate connector or any other suitable connector). The coupler can be coupled to the coiled portion of the catheter. For example, the coupler can be coupled directly to the coiled portion of the catheter or via a rigid (e.g., non-flexible) portion of the catheter (e.g., without a flexible hose and / or barbs disposed between the coupler and the coiled portion of the catheter).

[0016] A facility (e.g., a data center) may include racks that can house (e.g., removably house) electronic equipment. The racks may include coolant infrastructure couplers that can couple the electronic equipment to the coolant infrastructure to circulate coolant through the cooling system of the electronic equipment. When the electronic equipment is inserted into the rack, the coupler of the electronic equipment can be coupled (e.g., removably coupled) to the coolant infrastructure coupler. When the coupler is coupled to the coolant infrastructure coupler, the coiled portion of the conduit can deform. For example, the coiled portion of the conduit can deform (e.g., elastically) in a direction parallel to a central axis of the coiled portion, in a direction perpendicular to the central axis of the coiled portion, or in both directions. The deformation may be at least partially due to a tolerance between the position of the coupler in the electronic equipment and the position of the coolant conduit coupler in the rack. The number of turns of the coiled portion, the distance between adjacent turns of the coiled portion, the diameter of the coiled portion, and the diameter of the conduit can be selected (e.g., predetermined) based on a desired stiffness of the coiled portion (e.g., the desired degree to which the coiled portion of the conduit resists or allows deformation in response to an applied force). The number of turns of the coiled portion, the distance between adjacent turns of the coiled portion, the diameter of the coiled portion, and the diameter of the conduit can be selected (e.g., predetermined) based on the desired hydraulic impedance of the cooling conduit system for the electronic device (e.g., the desired pressure drop to flow rate ratio of the electronic device).

[0017] Advantageously, the coiled portion in the cooling conduit system of an electronic device can provide a desired flexibility of the cooling conduit system (e.g., to compensate for tolerances as described above) while eliminating the need for flexible hoses and barbs in the cooling conduit system. A cooling conduit system without flexible hoses and barbs can reduce the likelihood of corrosion and mechanical failure compared to prior art systems. The parameters of the coiled portion can be predetermined to provide a desired hydraulic impedance for the cooling conduit system of the electronic device while eliminating the need for a heat sink with orifices and / or relatively small fin pitch in the cooling system. A cooling system without orifices and / or a heat sink with relatively small fin pitch can reduce the likelihood of corrosion and blockage in the cooling system compared to prior art systems. The reduced likelihood of corrosion, mechanical failure, and blockage can improve the operation of the cooling system and the electronic components of the electronic device.

[0018] refer to Figure 1 , Figure 1 is a perspective view of an electronic device 100 according to some embodiments of the present invention.

[0019] Also refer to Figure 2 , Figure 2 According to some embodiments of the present invention Figure 1 An enlarged view of the electronic device 100 is shown.

[0020] Also refer to Figure 3, Figure 3 is a perspective view of a cooling system 139 of an electronic device 100 according to some embodiments of the present invention.

[0021] The electronic device 100, for example Figures 1 to 3 The network switch device shown in FIG. 1 may include a frame (e.g., housing) 110. The frame 110 may include an interior 112. The interior 112 of the frame 110 may house components of the electronic device 100. The electronic device 100 may include a printed circuit board (PCB) 114. The PCB 114 may be disposed in the interior 112 of the frame 110. Although Figures 1 to 3 A network switch device is shown as an example of the electronic device 100 , but the electronic device 100 may be any other suitable electronic device (eg, a computing machine or a server) that may require liquid cooling.

[0022] The electronic device 100 may include an electronic component (e.g., a heat-generating component) 120. The electronic component 120 may be placed on the PCB 114. During operation, the electronic component 120 may generate heat. For example, the electronic component 120 may be a central processing unit (CPU), a graphics processing unit (GPU), a networking application-specific integrated circuit (ASIC), or any other heat-generating electronic component.

[0023] The electronic device 100 may include a cooling body (e.g., a heat conductor) 130. The cooling body 130 may be coupled to the electronic component 120. The cooling body 130 may be in thermal contact with the electronic component 120. The cooling body 130 may be made of, or may include, a material such as copper, aluminum, or stainless steel. For example, the cooling body 130 may directly or indirectly contact the electronic component 120 so that heat is dissipated from the electronic component 120 to the cooling body 130. The electronic device 100 may include a subframe 131 to couple the cooling body 130 to the frame 110 and / or the PCB 114 to fix the position of the cooling body 130 relative to the electronic component 120. The subframe 131 may be coupled to the frame 110 and / or the PCB 114 using fasteners (e.g., bolts).

[0024] exist Figures 1 to 3 In the example of FIG, the electronic device 100 includes a first conduit 132 and a second conduit 134. Each of the first conduit 132 and the second conduit 134 can be a pipe or a tube. Each of the first conduit 132 and the second conduit 134 can be formed by interconnected sections or parts (e.g., Figures 1 to 3As shown). Each of the first conduit 132 and the second conduit 134 may contain a coolant, such as a liquid coolant. The coolant may be or include, for example, water (e.g., pure water) or an aqueous solution (e.g., glycol water). Each of the first conduit 132 and the second conduit 134 may be coupled to the cooling body 130 or in contact with the cooling body 130. Figures 1 to 3 In the example of FIG, the first conduit 132 transports the coolant to the cooling body 130, and the second conduit 134 transports the coolant from the cooling body 130. Each of the first conduit 132 and the second conduit 134 can be formed of a rigid (eg, non-flexible) material.

[0025] The first conduit 132 may include a coiled portion (e.g., a spiral portion) 132a. The coiled portion 132a may include a plurality of turns (windings) 132ab. The coiled portion 132a (e.g., turns 132ab of the coiled portion 132a) may be arranged along a first central axis (e.g., a first longitudinal axis 132aa). Every two adjacent turns 132ab of the plurality of turns of the coiled portion 132a may be spaced apart from each other. For example, every two adjacent turns 132ab of the plurality of turns of the coiled portion 132a may be spaced apart from each other (e.g., as shown in FIG. 1 ). Figure 3 (as shown). The first conduit 132, or at least the coiled portion 132a, can be formed from a resilient material, such as metal (e.g., copper or stainless steel) or plastic (e.g., polyethylene terephthalate (PET) or fluorinated ethylene propylene (FEP)). The coiled portion 132a of the first conduit 132 can elastically deform under an applied force. For example, a plurality of spaced-apart turns formed of a resilient material can allow the coiled portion 132a of the first conduit 132 to elastically deform under an applied force, such as in a spring-like manner.

[0026] The second conduit 134 may include a coiled portion (e.g., a spiral portion) 134a. The coiled portion 134a may include a plurality of turns (e.g., windings) 134ab. The coiled portion 134a (e.g., the turns 134ab of the coiled portion 132a) may be arranged along a second central axis (e.g., a first longitudinal axis 134aa). Every two adjacent turns 134ab of the plurality of turns of the coiled portion 134a may be spaced apart from each other. For example, every two adjacent turns 134ab of the plurality of turns of the coiled portion 134a may be spaced apart from each other (e.g., as shown in FIG. 1 ). Figure 3(as shown). The second conduit 134, or at least the coiled portion 134a, can be formed from a resilient material, such as metal (e.g., copper or stainless steel) or plastic (e.g., polyethylene terephthalate (PET) or fluorinated ethylene propylene (FEP)). The coiled portion 134a of the second conduit 134 can elastically deform under an applied force. For example, a plurality of spaced-apart turns formed of a resilient material can allow the coiled portion 134a of the second conduit 134 to elastically deform under an applied force, such as in a spring-like manner.

[0027] Although two conduits 132, 134 are shown, electronic device 100 may include any other suitable number of conduits to transport coolant to or from cooling body 130. For example, one conduit formed from multiple interconnected segments and including coiled portions 132a, 134a may be used.

[0028] exist Figures 1 to 3 In the example of , the electronic device 100 includes a first coupler (e.g., a first or inlet connector) 136 and a second coupler (e.g., a second or outlet connector) 138. Each of the first coupler 136 and the second coupler 138 can be a blind-mate connector or any other suitable connector (e.g., a hot-swap connector or a quick-disconnect connector). The first coupler 136 can be coupled to the coiled portion 132a of the first conduit 132. For example, the first coupler 136 can be directly coupled to the coiled portion 132a of the first conduit 132, or coupled via a rigid (e.g., non-flexible) portion of the first conduit 132 (e.g., such that no flexible hose and / or barb is disposed between the first coupler 136 and the coiled portion 132a of the first conduit 132). The second coupler 138 can be coupled to the coiled portion 134a of the second conduit 134. For example, the second coupler 138 can be coupled directly to the coiled portion 134a of the second conduit 134, or can be coupled via a rigid (e.g., non-flexible) portion of the second conduit 134 (e.g., such that no flexible hose and / or barb is disposed between the second coupler 138 and the coiled portion 134a of the second conduit 134). Each of the first connector 136 and the second coupler 138 can extend at least partially externally to the interior 112 of the frame 110 (e.g., as shown in FIG. Figures 1 to 2 shown).

[0029] The cooling body 130, the subframe 131, the conduits 132, 134 and the couplers 136, 138 may be part of a cooling system 139 of the electronic device 100 (e.g., as Figure 3 shown).

[0030] The electronic device 100 can be removably inserted into a rack 70 in a facility (e.g., a data center). The rack 70 can include a first coolant infrastructure coupler 82 and a second coolant infrastructure coupler 84. The rack 70 and the coolant infrastructure couplers 82, 84 are connected to each other. Figures 1 to 2 Schematically indicated by arrows in FIG. When the electronic device 100 is inserted into the rack 70, the first coupler 136 of the electronic device 100 can be coupled (e.g., detachably coupled) to the first coolant infrastructure coupler 82 to supply coolant from the cooling infrastructure to the first conduit 132 via the first coupler 136. The second coupler 138 of the electronic device 100 can be coupled (e.g., detachably coupled) to the second coolant infrastructure coupler 84 to move coolant from the second conduit 134 back to the cooling infrastructure via the second coupler 138. When the first coupler 136 is coupled to the first coolant conduit coupler 82, the coiled portion 132a of the first conduit 132 can be deformed. For example, the coiled portion 132a of the first conduit 132 may be deformable (e.g., elastically deformable) in a direction 132ae parallel to the central axis 132aa of the coiled portion 132a, in a direction 132ag perpendicular to the central axis 132aa of the coiled portion 132a, or in some combination of these directions.

[0031] The number of turns 132ab of the coiled portion 132a of the first conduit 132, the distance 132ac between adjacent turns 132ab of the coiled portion 132a, the diameter 132ai of the coiled portion 132a, the diameter 132c of the first conduit 132 and / or the wall thickness of the first conduit 132 are used to provide the desired stiffness of the coiled portion 132a (e.g., the desired degree to which the coiled portion of the conduit resists or allows deformation in response to an applied force). The number of turns 132ab of the coiled portion 132a of the first conduit 132, the distance 132ac between adjacent turns 132ab of the coiled portion 132a, the diameter 132ai of the coiled portion 132a, and / or the diameter (e.g., inner diameter) of the first conduit 132 can be selected (e.g., predetermined) to provide a desired hydraulic impedance of the coiled portion 132a (e.g., a desired pressure drop to flow rate ratio of the coiled portion 132a) and / or a desired hydraulic impedance of the cooling system 139 of the electronic device 100 (e.g., a desired pressure drop to flow rate ratio of the cooling system 139).

[0032] The coiled portion 134a of the second conduit 134 can deform when the second coupler 138 is coupled to the second coolant conduit coupler 84. For example, the coiled portion 134a of the second conduit 134 can deform (e.g., elastically) in a direction 134ae parallel to a central axis 134aa of the coiled portion 134a, in a direction 134ag perpendicular to the central axis 134aa of the coiled portion 134a, or in both directions. The deformation may be due, at least in part, to a tolerance between the positions of the couplers 136, 138 in the electronic device 100 and the positions of the coolant infrastructure couplers 82, 84 in the rack 70. The number of turns 134ab of the coiled portion 134a of the second conduit 134, the distance 134ac between adjacent turns 134ab of the coiled portion 134a, the diameter 134ai of the coiled portion 134a, the diameter 134c of the second conduit 134 and / or the wall thickness of the second conduit 134 can be selected (e.g., predetermined) to provide a desired stiffness of the coiled portion 134a (e.g., a desired degree to which the coiled portion of the conduit resists or allows deformation in response to an applied force). The number of turns 134ab of the coiled portion 134a of the second conduit 134, the distance 134ac between adjacent turns 134ab of the coiled portion 134a, the diameter 134ai of the coiled portion 134a and / or the diameter (e.g., inner diameter) of the second conduit 134 can be selected (e.g., predetermined) to provide a desired hydraulic impedance of the coiled portion 134a (e.g., a desired pressure drop to flow rate ratio of the coiled portion 134a) and / or a desired hydraulic impedance of the cooling system 139 of the electronic device 100 (e.g., a desired pressure drop to flow rate ratio of the cooling system 139).

[0033] refer to Figure 4 , Figure 4 is a graph showing results of compression and side pull experiments conducted on two example coiled catheter sections having different numbers of coils, according to some embodiments of the present invention.

[0034] In the experiment, a first coiled conduit section having 9 turns (e.g., coiled section 132a as described above) and a second coiled conduit section having 19 turns (e.g., coiled section 134a) were tested. Other parameters of the first and second coiled conduit sections (e.g., material, diameter of the coiled section, diameter of the conduit, and distance between adjacent turns) were identical. Figure 4 As shown in the graph, the second coiled conduit section with fewer turns has greater stiffness against compression and lateral tension than the first coiled conduit section with more turns.

[0035] The desired stiffness of a coiled conduit portion (e.g., coiled portions 132a, 134a) can be achieved by predetermining (e.g., selecting) parameters of the coiled conduit portion (e.g., material, diameter of the coiled portion, diameter of the conduit, wall thickness of the conduit, and / or distance between adjacent turns of the coiled portion). For example, the greater the number of turns of the coiled conduit portion (e.g., turns 132ab, 134ab), the less stiff the coiled portion is against compression and / or lateral pull. In another example, the greater the distance between adjacent turns of the coiled conduit portion (e.g., distance 132ac, 134ac), the more stiff the coiled portion is against compression and / or lateral pull. In another example, the greater the diameter of the coiled conduit portion (e.g., diameters 132ai, 134ai), the less stiff the coiled portion is against compression and / or lateral pull. In another example, the greater the wall thickness of the conduit, the more stiff the coiled portion is against compression and / or lateral pull.

[0036] refer to Figure 5 , Figure 5 is a graph showing experimental, simulation, analytical, and averaged results of the variation in pressure drop across an example coiled conduit section as a function of flow rate through the coiled conduit section, according to some embodiments of the present invention.

[0037] Figure 5 The graphs show experimental, simulation, and analytical results, as well as their averages, of the variation in pressure drop across a coiled conduit section (e.g., coiled sections 132a, 134a as described above) as a function of flow rate through the coiled conduit section. A coiled conduit section having 19 turns and a liquid at 45 degrees Celsius was used in the experiments and considered in the simulation and analytical models.

[0038] The number of turns of the coiled portions 132a, 134a of the first and second conduits 132, 134, respectively, the distance between adjacent turns of the coiled portions 132a, 134a, the diameter of the coiled portions 132a, 134a, the diameter of the first and second conduits 132, 134, and / or the diameter (e.g., inner diameter) of the first and second conduits 132, 134, respectively, can be selected (e.g., predetermined) to provide a desired hydraulic impedance of the coiled portions 132a, 134a and / or a desired hydraulic impedance of the cooling system 139 of the electronic device 100. For example, the greater the number of turns (e.g., turns 132ab, 134ab) of the coiled portion of the conduit, the greater the hydraulic impedance of the coiled portion. In another example, the greater the diameter (e.g., diameter 132ai, 134ai) of the coiled portion of the conduit, the greater the hydraulic impedance of the coiled portion. In another example, the greater the diameter (e.g., inner diameter) of the conduit, the lower the hydraulic impedance of the coiled portion.

[0039] As described above, the use of one or more coiled sections (e.g., coiled sections 132a, 134a) in the cooling conduit system of the electronic device 100 can provide the desired mechanical flexibility of the cooling conduit system of the electronic device 100 (e.g., to compensate for tolerances as described above) and the desired hydraulic impedance of the cooling conduit system of the electronic device 100 while eliminating the need for flexible hoses, barbs, orifices, and / or heat sinks with relatively small fin pitches, thereby reducing the likelihood of corrosion, mechanical failure, and / or blockage in the cooling system of the electronic device 100 as compared to prior art systems.

[0040] In the above description, an embodiment is an example or implementation of the present invention. The various appearances of "one embodiment," "an embodiment," "certain embodiments," or "some embodiments" do not necessarily all refer to the same embodiment. Although various features of the present invention may be described in the context of a single embodiment, these features may also be provided individually or in any suitable combination. Conversely, although the present invention may be described herein in the context of separate embodiments for clarity, the present invention may also be implemented in a single embodiment. Certain embodiments of the present invention may include features from different embodiments disclosed above, and certain embodiments may combine elements from other embodiments disclosed above. Disclosure of elements of the present invention in the context of specific embodiments should not be construed as limiting their use to only those specific embodiments. Furthermore, it should be understood that the present invention may be implemented or practiced in various ways, and that the present invention may be implemented in certain embodiments other than the embodiments outlined in the description above.

[0041] Although embodiments of the present invention are not limited in this respect, the terms "plurality" and "a plurality" as used herein may include, for example, "multiple" or "two or more." The terms "plurality" or "a plurality" may be used throughout the specification to describe two or more components, devices, elements, units, parameters, etc. As used herein, a term "set" may include one or more items.

[0042] The present invention is not limited to these diagrams or corresponding descriptions. For example, the flow need not pass through each illustrated box or state, nor need it move in exactly the same order as illustrated and described. Unless otherwise defined, the meaning of the technical and scientific terms used herein will be generally understood by those of ordinary skill in the art to which the invention belongs. Although the present invention has been described with respect to a limited number of embodiments, these should not be construed as limiting the scope of the invention, but rather as examples of some preferred embodiments. Other possible variations, modifications, and applications are also within the scope of the present invention. Therefore, the scope of the present invention should not be limited by what has been described, but should be limited by the appended claims and their legal equivalents.

Claims

1. An electronic device comprising: a cooling body in thermal contact with the electronic component; a conduit coupled to the cooling body to transport coolant to or from the cooling body, the conduit comprising a coiled portion; as well as A coupler is coupled to the coiled portion of the conduit, the coupler being removably coupleable to a coolant infrastructure coupler. 2 . The electronic device of claim 1 , wherein the coiled portion comprises a plurality of turns, wherein every two adjacent turns of the plurality of turns are spaced apart from each other. 3 . The electronic device according to claim 1 , wherein the coiled portion of the conduit is formed of an elastic material such that the coiled portion elastically deforms under an applied force. 4 . The electronic device of claim 3 , wherein the coiled portion of the conduit deforms when the coupler is coupled to the coolant infrastructure coupler. 5 . The electronic device according to claim 1 , wherein the coiled portion is arranged along a central axis, and wherein the coiled portion is elastically deformed in a direction parallel to the central axis under an applied force. 6 . The electronic device according to claim 1 , wherein the coiled portion is arranged along a central axis, and wherein the coiled portion is elastically deformed in a direction perpendicular to the central axis under an applied force.

7. The electronic device of claim 1 , wherein the number of turns, the distance between adjacent turns, the diameter of the coiled portion, the diameter of the conduit, and the wall thickness of the conduit are predetermined based on a desired stiffness of the coiled portion of the conduit.

8. The electronic device of claim 1, wherein the number of turns, the distance between adjacent turns, the diameter of the coiled portion of the conduit, and the diameter of the conduit are predetermined based on a desired fluid impedance of the electronic device.

9. The electronic device of claim 1 comprising a frame having an interior, wherein at least a portion of the coupler extends from an exterior to the interior of the frame.

10. An electronic device comprising: a heat conductor in thermal contact with the heat generating component; a tube coupled to the heat conductor to transport liquid coolant to or from the heat conductor, the tube including a spiral portion in which the tube is bent into a spiral shape; as well as A connector is connected to the spiral portion of the tube, the connector being removably connectable to a liquid coolant infrastructure coupler. 11 . The electronic device according to claim 10 , wherein every two adjacent windings of the spiral portion of the tube are spaced apart from each other.

12. The electronic device of claim 10 , wherein the spiral portion is arranged about a longitudinal axis, and wherein when the connector is connected to the liquid coolant infrastructure coupler, the spiral portion of the tube elastically deforms in a direction parallel to the longitudinal axis, a direction perpendicular to the longitudinal axis, or both directions.

13. The electronic device of claim 10, wherein the number of windings, the distance between adjacent windings, the diameter of the spiral portion of the tube, the diameter of the tube, and the wall thickness of the tube are predetermined based on a desired stiffness of the spiral portion of the tube.

14. The electronic device of claim 10, wherein the number of windings, the distance between adjacent windings, the diameter of the spiral portion of the tube, and the diameter of the tube are predetermined based on a desired fluid impedance of the electronic device. 15 . The electronic device of claim 10 , comprising a housing including an interior accommodating the heat-generating component, the heat conductor, and the tube, wherein at least a portion of the connector extends from the exterior to the interior of the housing.

16. An electronic device comprising: a heat conductor in thermal contact with the heat generating component; a first tube coupled to the heat conductor to deliver liquid coolant to the heat conductor, the first tube including a helical portion wherein the first tube is bent into a helical shape about a first longitudinal axis; a second tube coupled to the heat conductive body to remove the liquid coolant from the heat conductive body, the second tube including a helical portion wherein the second tube is bent into a helical shape about a second longitudinal axis; an inlet connector connected to the spiral portion of the first tube; an outlet connector connected to the spiral portion of the second tube; wherein, upon connecting the corresponding inlet connector or the outlet connector to the liquid coolant infrastructure coupler, the spiral portion of each of the first tube and the second tube is elastically deformed in a direction parallel to the corresponding first longitudinal axis or second longitudinal axis, in a direction perpendicular to the corresponding first longitudinal axis or second longitudinal axis, or in both directions.

17. The electronic device of claim 16 , wherein the number of windings, the distance between adjacent windings, the diameter of the spiral portion of each of the first tube and the second tube, the diameter of each of the first tube and the second tube, and the wall thickness of each of the first tube and the second tube are predetermined based on a desired stiffness of the corresponding tube.

18. The electronic device of claim 16, wherein the number of windings, the distance between adjacent windings, the diameter of the spiral portion of each of the first tube and the second tube, and the diameter of each of the first tube and the second tube are predetermined based on a desired fluid impedance of the electronic device.

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