Chip transfer method and chip transfer system

Abstract

A chip transfer method includes providing a carrier having a first surface and a second surface opposite to each other. A setting step is executed, a plurality of chips are arranged on the second surface of the carrier at intervals, and an adhesive layer is arranged between the plurality of chips and the second surface of the carrier; a positioning step is executed, and the carrier is moved to the position above the substrate; the substrate is provided with a plurality of solder balls, each chip faces the substrate and is located above the corresponding solder ball, and a gap is formed between each chip and the corresponding solder ball. Executing a removing step, and removing the block corresponding to each chip seat in the carrier and the glue layer, so that each chip is actually contacted with the corresponding tin ball;

Description

Technical Field

[0001] A chip transfer method and system, in particular, relates to a chip transfer method and system using laser etching. Background Art

[0002] In the semiconductor packaging process, chips need to be transferred from a carrier substrate to a target substrate. In existing techniques, the carrier substrate is positioned above the target substrate. Laser heating is used to delaminate the adhesive layer on the carrier substrate, reducing adhesion and allowing the chip to fall onto the target substrate. However, the extent of adhesive delamination affects whether the chip can accurately land on the target substrate. Specifically, existing techniques may cause the chip to "drift" horizontally as it falls onto the target substrate. This reduces chip transfer efficiency and hinders production.

[0003] Therefore, how to improve the chip transfer effect and overcome the above-mentioned defects through structural design improvements has become one of the important issues that this industry wants to solve. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to address the shortcomings of the prior art by providing a chip transfer method, comprising: providing a carrier having a first surface and a second surface opposite to each other; performing a placement step to arrange a plurality of chips on the second surface of the carrier at intervals, with an adhesive layer between the plurality of chips and the second surface of the carrier; performing a positioning step to move the carrier above a substrate having a plurality of solder balls, with each chip facing the substrate and positioned above a corresponding solder ball, with a gap between the chip and the solder ball; and performing a removal step to remove the area of ​​the carrier and the adhesive layer corresponding to the location of each chip, so that the chip is in substantial contact with the corresponding solder ball.

[0005] According to a feasible embodiment, before the removal step, the chip transfer method further includes: performing a core expansion step to extend the carrier and lengthen the intervals between adjacent chips so that the chips are positioned above corresponding solder balls.

[0006] According to a feasible implementation scheme, the removing step uses laser etching technology to remove the carrier and the adhesive layer.

[0007] According to a possible implementation, the removal step is performed using a laser module, which includes a diffractive optical element or a spatial light modulator.

[0008] According to a feasible implementation scheme, the aforementioned gap is 0-50 μm.

[0009] In order to solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide a chip transfer system, which includes: a processing module, a moving module and a laser module. The moving module is electrically connected to the processing module, and the moving module is used to move the carrier, wherein the carrier has a first surface and a second surface relative to each other, and a plurality of chips are adhered to the second surface of the carrier by an adhesive layer, and the plurality of chips are arranged at intervals. The moving module moves the carrier to a substrate, and the substrate has a plurality of solder balls, each chip faces the substrate and is located above the corresponding solder ball, with a gap therebetween. The laser module is electrically connected to the processing module, and the laser module removes the blocks corresponding to the location of each chip in the carrier and the adhesive layer by laser etching, so that the chip actually contacts the corresponding solder ball.

[0010] According to a feasible implementation scheme, the chip transfer system further includes an extension module and an electrical connection processing module. The extension module is used to extend the carrier and lengthen the intervals between adjacent chips so that the chips are positioned above corresponding solder balls.

[0011] According to a possible embodiment, the laser module includes a diffractive optical element or a spatial light modulator.

[0012] One of the beneficial effects of the present invention is that the chip transfer method and chip transfer system provided by the present invention can improve the process efficiency of transferring chips from one target substrate to another target substrate by "moving the carrier to the top of the substrate, the substrate has multiple solder balls, each chip faces the substrate and is located above the corresponding solder ball, and there is a gap between each chip and each solder ball" and "performing a removal step to remove the block corresponding to each chip location in the carrier and the adhesive layer so that the chip actually contacts the corresponding solder ball".

[0013] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and illustration and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 FIG. 4 is a flow chart of a chip transfer method according to an embodiment of the present invention.

[0015] Figures 2 to 6 for Figure 1 Schematic diagram of each step in the embodiment shown.

[0016] Figure 7 FIG. 4 is a flow chart of a chip transfer method according to an embodiment of the present invention.

[0017] Figures 8 to 10 Corresponding to Figure 7 Schematic diagram of the steps in the illustrated embodiment.

[0018] Figure 11 FIG. 1 is a schematic diagram of the architecture of a chip transfer system according to an embodiment of the present invention.

[0019] Figure 12A FIG. 1 is a schematic diagram of the structure of a laser module according to an embodiment of the present invention.

[0020] Figure 12B FIG. 1 is a schematic diagram of the structure of a laser module according to an embodiment of the present invention. DETAILED DESCRIPTION

[0021] The following is an explanation of the implementation of the "chip transfer method and chip transfer system" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

[0022] See also Figures 1 to 6 , Figure 1 FIG. 1 is a flow chart of a chip 13 transfer method 100 according to an embodiment of the present invention. Figures 2 to 6 for Figure 1 Schematic diagram of each step in the embodiment shown. The method of transferring the chip 13 includes: step S1 to step S4.

[0023] Step S1: Provide a carrier 11, such as Figure 2 As shown, the carrier 11 has a first surface 111 and a second surface 112 opposite to each other. The carrier 11 can be, but is not limited to, glass. According to some embodiments, it can also be sapphire. According to some embodiments, the carrier 11 can also be a blue film layer (see below for details). Figure 2 In the illustrated embodiment, the carrier 11 is fixed on a light-transmitting carrier plate 16 .

[0024] Step S2: Perform the arrangement step to arrange the plurality of chips 13 on the second surface 112 of the carrier 11 at intervals, with the adhesive layer 12 between the plurality of chips 13 and the second surface 112 of the carrier 11. In other words, the chips 13 are bonded to the second surface 112 of the carrier 11 via the adhesive layer 12. Figure 3 In some embodiments, a plurality of chips 13 are arranged in a matrix. The chips 13 may be, but are not limited to, light emitting diodes (LEDs).

[0025] Step S3: Perform the positioning step, moving the carrier 11 to the top of the substrate 15, which has a plurality of solder balls 14. Each chip 13 faces the substrate 15 and is located above the corresponding solder ball 14. There is a gap H between the chip 13 and the solder ball 14. Figure 4 The substrate 15 is, for example, a circuit board or a composite ceramic substrate 15, and has a conductive layer or a circuit layer on its surface.

[0026] Step S4: Execute the removal step to remove the area of ​​the carrier 11 and the adhesive layer 12 corresponding to each chip 13, so that each chip 13 is in substantial contact with the corresponding solder ball 14. In other words, through the removal step, the area corresponding to each chip 13 is hollowed out in the carrier 11 and the adhesive layer 12 to form a hole P. In this way, the chip 13 is pulled downward by gravity and is in substantial contact with the solder ball 14, completing the transfer of the chip 13. Figure 5 and Figure 6 As shown. In some embodiments, the aforementioned gap H is 0-50 μm (e.g., any positive integer between 1-50 μm). According to some embodiments, in step S2, after the carrier 11, adhesive layer 12, and chip 13 are positioned with the corresponding solder ball 14, the chip 13 is directly attached to the surface of the solder ball 14 (i.e., the gap H is 0 μm), and then the chip 13 is transferred to step S3. In this embodiment, the removal step uses laser etching technology to remove the carrier 11 and adhesive layer 12 (corresponding to the block where the chip 13 is located) using a laser beam L1.

[0027] Further, according to some embodiments, the removal step is performed using a laser module (see Figure 11 ) is performed, wherein the laser module includes a diffractive optical element or a spatial light modulator. When the laser module includes a diffractive optical element, the principle of optical diffraction is used to form a pattern of the incident laser light at a specific position, and the pattern corresponds to the position of the carrier 11 and the adhesive layer 12 to be removed. When the laser module includes a spatial light modulator, it can be divided into a liquid crystal spatial light modulator (LCSLM) or a digital light processor (DLP). The former uses a liquid crystal layer as a light modulation material. The liquid crystal layer adopts a hybrid field effect working mode of nematic liquid crystal. Applying different electric fields on the liquid crystal layer can cause changes in the arrangement direction of the liquid crystal molecules, thereby causing changes in its optical properties, thereby achieving control of the light signal, such as the amplitude, polarization state and polarization angle of the light. The latter achieves the purpose of controlling the position of the laser beam projection by controlling the micro-lens matrix on the DMD (Digital Micromirro Device) chip.

[0028] See also Figures 7 to 10 , Figure 7 FIG. 2 is a flow chart of a chip 13 transfer method 200 according to an embodiment of the present invention. Figure 8 and Figure 9 To correspond Figure 7 A schematic diagram of step S21 in the illustrated embodiment. Figure 10 To correspond Figure 7 The schematic diagram of step S4 in the embodiment shown is shown. Figure 7 In the embodiment shown, before performing the removal step S3, the method for transferring the chip 13 further includes a step S21: performing a core expansion step to extend the carrier 11. According to some embodiments, the carrier 11 is ductile, for example, the carrier 11 is a blue film layer. When the chips 13 are placed on the carrier 11, the distance between adjacent chips 13 does not correspond to the solder balls 14. By extending the carrier 11, the distance L between adjacent chips 13 is extended so that each chip 13 is positioned above the corresponding solder ball 14, as shown in FIG. Figure 8 and Figure 9 After the removal step S4, the chip 13 is located on the solder ball 14 and is in substantial contact with the solder ball 14. Figure 10 shown.

[0029] See also Figure 11 , and refer again to Figures 2 to 6 . Figure 11 The schematic diagram of the chip 13 transfer system according to one embodiment of the present invention is shown. The chip 13 transfer system includes a processing module 21, a moving module 22, and a laser module 23. The moving module 22 is electrically connected to the processing module 21 and is used to move the carrier 11 to the substrate 15. The laser module 23 is electrically connected to the processing module 21 and uses laser etching to remove the area corresponding to each chip 13 in the carrier 11 and the adhesive layer 12, so that each chip 13 is in physical contact with the corresponding solder ball 14. Figure 6 shown.

[0030] Please refer again Figure 8 and Figure 9 ,in accordance with Figure 11 In the embodiment shown, the chip 13 transfer system further includes an extension module 24, which is electrically connected to the processing module 21. The extension module 24 can stretch the carrier 11 and the adhesive layer 12 (i.e., perform the aforementioned step S21). By stretching the carrier 11 (and the adhesive layer 12), the distance L between adjacent chips 13 is extended so that each chip 13 is positioned above the corresponding solder ball 14. Figure 8 and Figure 9 shown.

[0031] See also Figure 12A and Figure 12B, respectively, are schematic diagrams of the architecture of a laser module 23A and a laser module 23B according to an embodiment of the present invention. Laser module 23A includes a diffractive optical element 231. Using the principle of optical diffraction, laser module 23A forms a pattern of incident laser light at specific locations. This pattern corresponds to the locations of the carrier 11 and adhesive layer 12 to be removed. Laser module 23B includes a spatial light modulator 232, which can be classified as either a liquid crystal spatial light modulator (LCSLM) or a digital light processor (DLP). LCSLMs use a liquid crystal layer as the light modulation material. The LC layer employs a hybrid field-effect mode of nematic liquid crystals. Applying different electric fields across the LC layer changes the alignment of the LC molecules, thereby altering their optical properties and enabling control of the laser light signal, such as the amplitude, polarization state, and polarization angle. The DLP controls the projection position of the laser beam by controlling the micro-lens matrix on the DMD chip, thereby achieving the desired removal locations of the carrier and adhesive layer.

[0032] [Beneficial Effects of Embodiments]

[0033] One of the beneficial effects of the present invention is that the chip transfer method and chip transfer system provided by the present invention can improve the process efficiency of transferring chips from one target substrate to another target substrate by "moving the carrier to the top of the substrate, the substrate has multiple solder balls, each chip faces the substrate and is located above the corresponding solder ball, and there is a gap between each chip and each solder ball" and "performing a removal step to remove the block corresponding to each chip location in the carrier and the adhesive layer so that the chip actually contacts the corresponding solder ball".

[0034] Furthermore, according to some embodiments, the removal step uses laser etching technology to directly remove the carrier and the adhesive layer, so that the chip is smoothly (dropped or directly) placed on the solder balls, thereby improving the efficiency of chip transfer.

[0035] According to some embodiments, the gap between the chip and the solder ball is 0-50 μm. This gap can reduce the risk of the chip deviating from the solder ball when dropped. In other words, when the chip and the solder ball are in contact, the horizontal offset between the chip and the solder ball can be controlled within 1 μm.

[0036] In some embodiments, the laser module uses diffraction to create a specific pattern that corresponds to the area where the carrier and adhesive layer need to be removed. Alternatively, a spatial light modulator (SLM) can be included to control the amplitude, polarization state, and polarization angle of the laser beam to achieve precise positioning of the laser beam, removing the desired area of ​​the carrier and adhesive layer, and ensuring precise contact between the chip and the solder ball (either by dropping the chip into contact with the solder ball or by direct contact with the solder ball).

[0037] The contents disclosed above are only preferred feasible embodiments of the present invention and do not limit the scope of protection of the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the description and drawings of the present invention are included in the scope of protection of the claims of the present invention.

Claims

1. A chip transfer method, characterized in that: The chip transfer method includes: Providing a carrier having a first surface and a second surface opposite to each other; performing a placement step to arrange a plurality of chips on the second surface of the carrier at intervals, with an adhesive layer between the plurality of chips and the second surface of the carrier; Performing a positioning step to move the carrier to above a substrate having a plurality of solder balls thereon, with each chip facing the substrate and positioned above at least one corresponding solder ball, with a gap between each chip and each solder ball; and A removal step is performed to remove the area of ​​the carrier and the adhesive layer corresponding to the location of each chip, so that each chip is in substantial contact with the corresponding at least one solder ball.

2. The chip transfer method according to claim 1, wherein: Before the removing step, the chip transfer method further includes: performing a core expansion step to extend the carrier and lengthen the interval between adjacent chips so that each chip is positioned above the corresponding at least one solder ball.

3. The chip transfer method according to claim 1, wherein: The removing step adopts laser etching technology to remove the carrier and the adhesive layer.

4. The chip transfer method according to claim 3, wherein: The removing step is performed by using a laser module, and the laser module includes a diffractive optical element or a spatial light modulator.

5. The chip transfer method according to claim 1, wherein: The gap is 0-50 μm.

6. A chip transfer system, characterized in that: The chip transfer system includes: a processing module; a moving module electrically connected to the processing module, the moving module being configured to move a carrier, wherein the carrier has a first surface and a second surface opposite to each other, a plurality of chips being adhered to the second surface of the carrier via an adhesive layer, and the plurality of chips being arranged in intervals; the moving module moves the carrier above a substrate having a plurality of solder balls thereon, with each chip facing the substrate and positioned above at least one corresponding solder ball with a gap therebetween; and A laser module is electrically connected to the processing module. The laser module removes the area corresponding to each chip seat in the carrier and the adhesive layer by laser etching, so that each chip is in substantial contact with the corresponding at least one solder ball.

7. The chip transfer system according to claim 6, wherein: The chip transfer system further includes an extension module electrically connected to the processing module. The extension module is used to extend the carrier and lengthen the interval between adjacent chips so that each chip is positioned above the corresponding at least one solder ball.

8. The chip transfer system according to claim 6, wherein: The laser module includes a diffractive optical element or a spatial light modulator.

9. The chip transfer system according to claim 6, wherein: The gap is 0-50 μm.

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