Optical module

Abstract

The optical module provided by the invention comprises a circuit board, a bearing part, a light emitting part and a light receiving part. Wherein a notch is formed in the surface of the circuit board, and the bearing piece is embedded in the notch. The light emitting component comprises a laser and an optical multiplexing assembly. The laser and the optical multiplexing assembly are arranged on the surface of the bearing part. The light receiving component comprises a supporting part, a refraction part, a light receiving chip and a light demultiplexing assembly. The supporting part can support the refraction part to a certain height. In the invention, the optical demultiplexing assembly and the optical multiplexing assembly are stacked, and the height of the light inlet of the refraction part and the height of the light outlet of the laser have a difference value, so that a light path between the optical demultiplexing assembly and the refraction part and a light path between the optical multiplexing assembly and the laser are separated by a certain distance in a relative up-and-down position relationship; therefore, interference and crosstalk between the light receiving light path and the light emitting light path are avoided. In addition, the optical demultiplexing assembly and the optical multiplexing assembly are stacked, so that the occupied space of the optical engine is reduced.

Description

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on March 19, 2024, with application number 202410315842.X and invention name “An Optical Module”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present disclosure relates to the field of optical communication technology, and in particular to an optical module. Background Art

[0003] With the development of new services and applications such as cloud computing, mobile internet, and video, advances in optical communication technology are becoming increasingly important. As a key component in optical communication equipment, optical modules enable photoelectric signal conversion. As optical communication technology evolves, the data transmission rate of these modules continues to increase. Summary of the Invention

[0004] The embodiments of the present disclosure provide an optical module, in which light emitting components and light receiving components are rationally arranged through optical path design.

[0005] The optical module provided by the embodiment of the present disclosure includes: a circuit board with a notch formed on the surface; a carrier embedded in the notch; an optical emitting component including a laser and an optical multiplexing component, wherein the laser and the optical multiplexing component are respectively arranged on the surface of the carrier; an optical receiving component including a supporting portion, a refraction portion, an optical receiving chip and an optical demultiplexing component; wherein the refraction portion is arranged on the surface of the supporting portion, and the refraction portion is used to turn the optical signal output by the optical demultiplexing component toward the surface of the optical receiving chip; the optical demultiplexing component and the optical multiplexing component are stacked, and there is a difference between the height of the light inlet of the refraction portion and the height of the light outlet of the laser, so that the optical path between the optical demultiplexing component and the refraction portion and the optical path between the optical multiplexing component and the laser are in relatively upper and lower positions.

[0006] The optical module provided by the present disclosure includes a circuit board, a carrier, a light emitting component and a light receiving component. A notch is formed on the surface of the circuit board, and the carrier is embedded in the notch. The light emitting component includes a laser and an optical multiplexing component. The laser and the optical multiplexing component are both arranged on the surface of the carrier. The optical multiplexing component is located on the light output path of the laser to receive the optical signal emitted by the laser. If the lasers are arranged in an array form, the optical multiplexing component synthesizes the optical signals emitted by each laser into a beam of light. The light receiving component includes a supporting portion, a refractive portion, a light receiving chip and an optical demultiplexing component. The supporting portion is used to support the refractive portion so as to support the refractive portion to a certain height. The refractive portion is used to turn the optical signal output by the optical demultiplexing component toward the surface of the light receiving chip so as to transmit the optical signal to the surface of the light receiving chip. As the transmission rate of optical modules continues to increase, the space reserved for optical engines is smaller. For this reason, in the present disclosure, the optical demultiplexing component and the optical multiplexing component are stacked, and there is a difference between the height of the light inlet of the refraction part and the height of the light outlet of the laser, so as to separate the optical path between the optical demultiplexing component and the refraction part and the optical path between the optical multiplexing component and the laser by a certain distance in terms of the relative upper and lower positions, thereby avoiding interference and crosstalk between the light receiving optical path and the light emitting optical path. In the present disclosure, the space occupied by the optical engine is reduced by stacking the optical demultiplexing component and the optical multiplexing component. The surface of the laser can be flush with the surface of the circuit board, so that the height of the optical path at the end of the light emitting component is lower. The optical path at the end of the light receiving component just needs to have a certain height difference from the surface of the circuit board to make the optical path turn. Therefore, it is feasible to stack the optical demultiplexing component and the optical multiplexing component. Among them, the height difference at the end of the light receiving component can be achieved by supporting the refraction part to a certain height by the support part. By rationally designing the setting height of the optical device, optical path matching is achieved, so that the light receiving optical path and the light emitting optical path are set in a relative upper and lower position relationship, thereby avoiding interference and crosstalk between the light receiving optical path and the light emitting optical path, and realizing a reasonable layout of the light receiving components and the light emitting components. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] To more clearly illustrate the technical solutions of the present disclosure, the following briefly describes the drawings used in some embodiments of the present disclosure. Obviously, the drawings described below are merely illustrations of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0008] Figure 1 A partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0009] Figure 2A partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0010] Figure 3 A structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0011] Figure 4 An exploded view of an optical module provided according to some embodiments of the present disclosure;

[0012] Figure 5 This is a diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure;

[0013] Figure 6 An internal exploded view of an optical module provided according to some embodiments of the present disclosure;

[0014] Figure 7 A schematic diagram of an optical path of an optical module according to some embodiments of the present disclosure Figure 1 ;

[0015] Figure 8 A schematic diagram of an optical path of an optical module according to some embodiments of the present disclosure Figure 2 ;

[0016] Figure 9 A schematic diagram of an optical path of an optical module according to some embodiments of the present disclosure Figure 3 ;

[0017] Figure 10 A schematic diagram of an optical path of an optical module according to some embodiments of the present disclosure Figure 4 ;

[0018] Figure 11 This is a schematic internal cross-sectional view of an optical module provided according to some embodiments of the present disclosure;

[0019] Figure 12 A side view of an optical module according to some embodiments of the present disclosure

[0020] Figure 13 This is an internal top view of an optical module provided according to some embodiments of the present disclosure;

[0021] Figure 14 A schematic diagram of the relative positional relationship between a first fiber collimator and a second fiber collimator of an optical module provided according to some embodiments of the present disclosure;

[0022] Figure 15 A structure of a bearing member provided according to an embodiment of the present disclosure Figure 1 ;

[0023] Figure 16A structure of a carrier provided according to some embodiments of the present disclosure Figure 2 ;

[0024] Figure 17 A structure of a carrier provided according to some embodiments of the present disclosure Figure 3 ;

[0025] Figure 18 A schematic diagram of a connection between a circuit board and a carrier according to some embodiments of the present disclosure Figure 1 ;

[0026] Figure 19 A schematic diagram of a connection between a circuit board and a carrier according to some embodiments of the present disclosure Figure 2 ;

[0027] Figure 20 An assembly diagram of a carrier, a light emitting component, and a light receiving component according to some embodiments of the present disclosure;

[0028] Figure 21 An exploded view of an assembly between a carrier, a light emitting component, and a light receiving component according to some embodiments of the present disclosure;

[0029] Figure 22 A schematic diagram of the internal structure of another optical module provided according to some embodiments of the present disclosure;

[0030] Figure 23 A schematic structural diagram of another circuit board provided according to some embodiments of the present disclosure;

[0031] Figure 24 A schematic structural diagram of another carrier provided according to some embodiments of the present disclosure;

[0032] Figure 25 A schematic structural diagram of a seal provided according to some embodiments of the present disclosure;

[0033] Figure 26 An exploded view of another light emitting component and a light receiving component provided according to some embodiments of the present disclosure;

[0034] Figure 27 A simplified structural diagram of a first mounting portion and a second mounting portion provided according to some embodiments of the present disclosure;

[0035] Figure 28 This is a schematic structural diagram of another load-bearing housing provided according to some embodiments of the present disclosure;

[0036] Figure 29 A rear view of a carrying case provided according to some embodiments of the present disclosure;

[0037] Figure 30 A side view of a load-bearing housing provided according to some embodiments of the present disclosure;

[0038] Figure 31 A schematic structural diagram of a load-bearing cover plate provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0039] Some embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. However, the embodiments described are only some of the embodiments of the present disclosure, not all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided in the present disclosure are within the scope of protection of the present disclosure.

[0040] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as open and inclusive, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the term "suitable for" or "configured to" means open and inclusive language, which does not exclude devices that are suitable for or configured to perform additional tasks or steps; the terms "parallel", "perpendicular", "same", "consistent", "level" and other descriptions are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0041] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby enabling high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0042] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0043] Figure 1 FIG. 1 is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0044] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thereby achieving long-distance, low-power information transmission.

[0045] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0046] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0047] The host computer 100 also includes an external electrical interface that can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is then transmitted to the remote information processing device 1000 via the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0048] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0049] Figure 2 FIG1 is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. Figure 2 As shown, the host computer 100 further includes a PCB 105 disposed within the housing, a cage 106 disposed on the surface of the PCB 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed within the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has protruding structures such as fins to increase the heat dissipation area.

[0050] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200, and the heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects with the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0051] Figure 3 is a structural diagram of an optical module according to some embodiments. Figure 4 FIG. 1 is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, the optical module 200 includes a housing, a circuit board 300 disposed in the housing, a light emitting component 400, and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.

[0052] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square.

[0053] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0054] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0055] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200. Opening 204 is an electrical port, through which the gold finger 301 of circuit board 300 extends and is inserted into the electrical connector of host computer 100; opening 205 is an optical port, configured to receive an external optical fiber 101, thereby connecting optical fiber 101 to the light emitting component 400 and the light receiving component 500 in optical module 200.

[0056] The combined assembly of the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, and the like within the housing. The upper housing 201 and the lower housing 202 provide encapsulation and protection for these components. Furthermore, during assembly of the circuit board 300, the light emitting component 400, and the light receiving component 500, the positioning components, heat dissipation components, and electromagnetic shielding components of these components are easily positioned, facilitating automated production.

[0057] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0058] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0059] For example, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0060] The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers, clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0061] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0062] The circuit board 300 further includes a gold finger 301 formed on the end surface thereof. The gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be provided on only one side of the circuit board 300 (e.g. Figure 4 The upper surface shown in FIG300 may also be provided on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to situations where a large number of pins are required. The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards. At least one of the light emitting component 400 or the light receiving component 500 is located on the side of the circuit board 300 away from the gold finger 301.

[0063] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0064] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0065] As the transmission rate of optical modules becomes higher and higher, the volume requirement for optical modules becomes smaller and smaller, which brings problems such as high-frequency signal transmission performance and optical path crosstalk to the design of optical modules. It has become a major challenge in the industry to arrange more optical components in a smaller optical module housing while taking into account high-frequency signal transmission performance and optical path crosstalk.

[0066] In the present disclosure, the optical demultiplexing component and the optical multiplexing component are stacked to reduce the space occupied by the optical engine.

[0067] To ensure high-frequency signal transmission, the laser surface can be flush with the circuit board surface. In this case, the optical path height at the light-emitting component is relatively low. However, the optical path at the light-receiving component requires a certain height difference from the circuit board surface. The optical path design and requirements for the light-emitting and light-receiving components make it feasible to stack the optical demultiplexer and optical multiplexer components. This height difference at the light-receiving component can be achieved by supporting the refractive element, such as a turning prism, at a certain height.

[0068] By reasonably setting the height of the optical device, optical path matching is achieved, so that the light receiving optical path and the light emitting optical path can be set in a relative upper and lower position relationship, avoiding interference and crosstalk between the light receiving optical path and the light emitting optical path, and realizing a reasonable layout of the light receiving components and the light emitting components.

[0069] In the present disclosure, in order to realize the transmission of multiple optical signals, the optical emitting component 400 can emit multiple optical signals. In some embodiments, when emitting multiple optical signals, they can be emitted separately instead of being combined into a single optical signal for transmission. Exemplarily, multiple optical signals are emitted separately through an optical fiber array, and the laser has a corresponding optical fiber ribbon for transmitting the optical signal. In some embodiments, when emitting multiple optical signals, they can be combined into a single optical signal for transmission. Exemplarily, when combining, combining can be achieved through an optical multiplexing component. Exemplarily, when combining, combining can be achieved through a combination of different filters, and the transmission and reflection characteristics of the filters for specific wavelengths can be utilized to achieve combining by using a combination of multiple filters. Exemplarily, when combining, combining can also be achieved through a combination of different polarization state devices such as polarizers, and the polarization state devices have different transmission characteristics for light with different polarization directions, and the combination of multiple polarizers can be achieved. Exemplarily, when combining, combining can also be achieved through a combination of filters and polarizers.

[0070] In the present disclosure, in order to realize the reception of multiple optical signals, the optical receiving component 500 may include multiple photodetectors to receive the multiple optical signals. In some embodiments, the multiple optical signals can be received by an optical fiber array, and then the optical path is turned by an optical path turning device, so that the multiple optical signals are transmitted to multiple photodetectors respectively. When turning the optical path, the optical fiber end face can also be formed into a reflective surface by grinding, so as to achieve the change of the optical path. For example, when the optical fiber end face is formed into a reflective surface by grinding, the optical fiber can be clamped up and down because the optical fiber is soft. At this time, the optical fiber may be extended or not extended. If the optical fiber is extended, the optical fiber end face can be polished separately. If the optical fiber is not extended, it can be polished together with the upper and lower clamping structures. In some embodiments, a received optical signal can be decomposed into multiple optical signals by an optical demultiplexing component, and then the optical path is turned by an optical path turning device, so that the multiple optical signals are transmitted to multiple photodetectors respectively. In some embodiments, an arrayed waveguide grating (AWG) may be used to decompose a received optical signal into multiple optical signals, and then the optical paths are turned so that the multiple optical signals are transmitted to the photodetector respectively.

[0071] Figure 5 This is a diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure; Figure 6 This is an internal exploded view of an optical module provided according to some embodiments of the present disclosure. Figure 5 and Figure 6 As shown, the optical module may include a carrier 900 . A surface of the carrier 900 is used to carry the light emitting component 400 and the light receiving component 500 .

[0072] A notch 302 may be formed on the surface of the circuit board 300 . The carrier 900 is embedded in the notch 302 , thereby fixing the carrier 900 on the circuit board 300 .

[0073] In some embodiments, the light emitting component 400 may include a laser 401. The laser 401 may convert a received electrical signal into an optical signal.

[0074] The light emitting component 400 may include a TEC 402. The laser 401 is disposed on the surface of the TEC 402. The TEC 402 is used to adjust the operating temperature of the laser 401 so that the operating temperature is stable within a certain range.

[0075] The optical emitting component 400 may include an optical multiplexing assembly 403. The optical multiplexing assembly 403 may be disposed on a surface of the carrier 900. The optical multiplexing assembly 403 is disposed on the optical path of the laser 401. The optical multiplexing assembly 403 may combine the laser signals emitted by the various lasers 401 into a single optical signal.

[0076] The light emitting component 400 may include a first collimating lens 404. The first collimating lens 404 is disposed between the laser 401 and the optical multiplexing component 403.

[0077] The light emitting component 400 may include a first converging lens 405 . The first converging lens 405 is disposed on the light outgoing path of the optical multiplexing component 403 .

[0078] The light emitting component 400 may include a first fiber collimator 406 .

[0079] In the present disclosure, lasers 401 and a first collimating lens 404 are disposed on the surface of a TEC 402. Lasers 401 are arranged in an array. A predetermined number of lasers 401 can be positioned on the surface of a TEC 402. The optical signals emitted by each laser 401 are collimated by the first collimating lens 404 and then enter the optical multiplexing assembly 403 as parallel light. The optical multiplexing assembly 403 combines the optical signals emitted by each laser 401 into a single optical signal. The combined optical signal is then transmitted to the exterior of the optical module via a first converging lens 405 and a first fiber collimator 406.

[0080] In order to improve the high-frequency signal transmission performance, the surface of the laser 401 can be flush with the surface of the circuit board 300 to ensure that the bonding wire is short, thereby improving the high-frequency signal transmission performance.

[0081] In the present disclosure, when the surface of the laser 401 is flush with the surface of the circuit board 300, the height of the pigtail connected to the first fiber collimator 406 is aligned with the height of the circuit board 300. To prevent the pigtail connected to the first fiber collimator 406 from interfering with the surface of the circuit board 300 and being broken, a recessed portion 303 is formed on the surface of the circuit board 300 to allow the pigtail connected to the first fiber collimator 406 to pass through and avoid interference with the circuit board 300 and being broken.

[0082] In some embodiments, the light receiving component 500 may include a second fiber collimator 501 .

[0083] The light receiving part 500 may include a second collimating lens 502 .

[0084] The optical receiving component 500 may include an optical demultiplexing assembly 503. The external optical signal is transmitted to the optical demultiplexing assembly 503 via the second optical fiber collimator 501 and the second collimating lens 502. The optical demultiplexing assembly 503 decomposes the external optical signal into multiple optical signals.

[0085] The optical receiving component 500 may include a second converging lens 504. The second converging lens 504 is arranged in an array to receive the multiple optical signals output by the optical demultiplexing component 503. The light inlet of the second converging lens 504 faces the optical demultiplexing component 503.

[0086] The light receiving component 500 may include a deflecting portion 505. The light receiving direction of the light receiving chip is perpendicular to the surface of the circuit board 300, while the light transmission direction of the second fiber collimator 501 is parallel to the circuit board 300. To this end, the deflecting portion 505 is provided in the transmission optical path between the second fiber collimator 501 and the light receiving chip. The deflecting portion 505 functions as a light path deflection, deflecting the external optical signal transmitted by the second fiber collimator 501 downward, that is, deflecting the external optical signal toward the light receiving chip, thereby transmitting the external optical signal into the light receiving chip.

[0087] The light incident surface of the refracting portion 505 faces the optical demultiplexing component 503 , and the light emitting surface faces the light receiving chip.

[0088] Exemplarily, the refraction portion 505 has a reflective surface.

[0089] Exemplarily, the refractive portion 505 may be a turning prism.

[0090] The light receiving component 500 may include a light receiving chip 506. The light receiving chip 506 may convert a received optical signal into an electrical signal. The light receiving chips 506 may be arranged in an array.

[0091] The optical receiving component 500 may include a transimpedance amplifier 507. The transimpedance amplifier 507 may be electrically connected to the optical receiving chip 506. The transimpedance amplifier 507 is configured to amplify the electrical signal converted and generated by the optical receiving chip 506.

[0092] The light receiving component 500 may include a support portion 508. The support portion 508 is used to support the refracting portion 505. Because the light path of the light receiving component needs to be turned, a certain height difference is required in the light path of the light receiving component. The support portion 508 supports the refracting portion to a certain height, thereby generating a certain height difference in the light path and achieving the turning of the light path.

[0093] Exemplarily, the support portion 508 supports the deflecting portion upward to a certain height from the surface of the circuit board 300 .

[0094] The second converging lens 504 and the refraction portion 505 are disposed on the surface of the support portion 508 so that the optical paths of the second converging lens 504 and the refraction portion 505 are coaxial with the optical path of the optical demultiplexing assembly 503 .

[0095] In some embodiments, the optical receiving chip 506 and the transimpedance amplifier 507 may be connected by wire bonding to achieve electrical connection between the two.

[0096] Exemplarily, the surface of the light receiving chip 506 has a first connection pad and a photosensitive surface. Usually, the first connection pad and the photosensitive surface of the light receiving chip 506 are located on the same surface.

[0097] A second connection pad is provided on the surface of the transimpedance amplifier 507. A wire bond is formed between the first and second connection pads to electrically connect the optical receiver chip 506 to the transimpedance amplifier 507. At this point, the photosensitive surface of the optical receiver chip 506 and the first connection pad are both facing upward, with the photosensitive surface exposed to the air. To reduce light signal reflection into the air and allow more light signal to be absorbed into the photosensitive surface, the photosensitive surface is coated with an anti-reflection film. The refractive index of the anti-reflection film is greater than that of air, allowing more light signal to be transmitted into the photosensitive surface, thereby ensuring the received light power.

[0098] In some embodiments, the transimpedance amplifier 507 is disposed on the surface of the circuit board 300, and the first connection pad on the surface of the light receiving chip 506 is soldered to the second connection pad on the surface of the transimpedance amplifier 507, thereby electrically connecting the light receiving chip 506 and the transimpedance amplifier 507. That is, the light receiving chip 506 is attached upside down to the surface of the transimpedance amplifier 507, with the photosensitive surface of the light receiving chip 506 facing downward. To allow the light signal to be transmitted to the photosensitive surface, a lens is provided on the surface of the light receiving chip 506 exposed to air. An optical through hole can be formed between the lens and the photosensitive surface, through which the light signal is transmitted to the photosensitive surface, thereby achieving reception of the light signal.

[0099] By flip-chip bonding the optical receiver chip 506 to the transimpedance amplifier 507, parasitic effects caused by wire bonding can be avoided, improving signal transmission performance. Furthermore, since the photosensitive surface of the optical receiver chip 506 is not exposed to air, the optical signal is less likely to be reflected into the air, ensuring the received optical power.

[0100] As the transmission rate of optical modules continues to increase, the space reserved for optical engines becomes smaller. Therefore, in the present disclosure, the optical demultiplexing component 503 and the optical multiplexing component 403 can be stacked together to reduce the space occupied by the optical engine.

[0101] In some embodiments, since the space between the upper shell 201 and the circuit board 300 is larger than the space between the lower shell 202 and the circuit board 300, and the upper shell 201 of the optical module can form a heat dissipation duct with the cage 106 of the host computer 100, the upper shell 201 has a better heat dissipation effect than the lower shell 202. Since the heat generated by the light emitting component is relatively large, the heat generated by it needs to be conducted away to ensure the normal operation of the light emitting component. In view of this, the carrier 900 can be set in the space between the upper shell 201 and the circuit board 300. Figure 6The position relationship of the carrier 900 is shown to be reversed by 180 degrees. In this case, the heat generated by the laser 401 is sequentially transferred to the outside through the TEC 402 and the upper housing 201, and the heat dissipation path is better, thereby achieving better heat dissipation.

[0102] The surface of the circuit board 300 that is opposite to the upper housing 201 is referred to as the top surface of the circuit board 300. The surface of the carrier 900 used to support the light emitting component 400 and the light receiving component 500 is referred to as the top surface of the carrier 900. For better heat dissipation, the bottom surface of the carrier 900 can be arranged toward the upper housing 201, that is, the bottom surface of the carrier 900 and the top surface of the circuit board 300 can both be arranged toward the upper housing 201 to provide a better heat dissipation path. Since the DSP 304 also generates a large amount of heat, the DSP 304 can be arranged on the top surface of the circuit board 300 so that the heat generated by the DSP 304 can be dissipated to the outside of the optical module through the upper housing 201.

[0103] Figure 7 A schematic diagram of an optical path of an optical module according to some embodiments of the present disclosure Figure 1 .like Figure 7 As shown, the optical demultiplexing assembly 503 is stacked with the optical multiplexing assembly 403. The surface of the laser 401 is flush with the surface of the circuit board 300, so the light path of the laser 401 is close to the surface of the circuit board 300 and the light path of the laser 401 is lower.

[0104] Since the optical path of the optical receiving component needs to be turned, the optical receiving chip 506 is arranged on the surface of the circuit board 300 or on the surface of the transimpedance amplifier 507. Therefore, the optical path at the end of the optical receiving component needs to have a certain height difference from the surface of the circuit board in order to turn the optical path and turn the optical signal to the surface of the optical receiving chip 506.

[0105] The optical path design requirements of the optical transmitter and receiver provide feasibility for stacking the optical demultiplexer assembly 503 and the optical multiplexer assembly 403. The height difference of the optical receiver end can be achieved by supporting the deflecting portion 505 to a certain height from the surface of the circuit board 300 by the support portion 508.

[0106] In the present disclosure, the optical demultiplexing component 503 and the optical multiplexing component 403 are stacked to set the optical path of the light emitting end and the optical path of the light receiving end on the same surface of the circuit board 300 .

[0107] The surface of the circuit board 300 along which the light output path of the laser 401 is located and the surface of the circuit board 300 at which the refractive portion 505 is supported to a certain height by the support portion 508 can be the same surface of the circuit board 300 .

[0108] The light path of the laser 401 is close to the surface of the circuit board 300 , and the light path between the optical demultiplexing component 503 and the refracting portion 505 is at a preset distance from the surface of the circuit board 300 .

[0109] Illustratively, the optical path formed between the second optical fiber collimator 501, the second collimating lens 502, the optical demultiplexing assembly 503, the second converging lens 504, and the refractive portion 505 is at a certain distance from the surface of the circuit board 300, so that the light output path of the laser 401 and the optical path formed between the second optical fiber collimator 501, the second collimating lens 502, the optical demultiplexing assembly 503, the second converging lens 504, and the refractive portion 505 are in a relative upper and lower position relationship, and the optical paths present a certain height difference in the relative upper and lower positions, thereby avoiding optical path interference and crosstalk between the optical transmitting end and the optical receiving end.

[0110] Figure 8 A schematic diagram of an optical path of an optical module according to some embodiments of the present disclosure Figure 2 .like Figure 8 As shown, the optical demultiplexing component 503 and the optical multiplexing component 403 are stacked.

[0111] The optical multiplexing assembly 403 is disposed on a surface of the carrier 900 , and the optical demultiplexing assembly 503 is disposed on a surface of the optical multiplexing assembly 403 .

[0112] The light inlet of the optical demultiplexing assembly 503 and the light outlet of the optical multiplexing assembly 403 may be located on two sides of the same end of the carrier 900 to avoid optical path interference.

[0113] The light emitting surface of the optical demultiplexing component 503 faces the light incident surface of the refraction portion 505 , and the light incident surface of the optical multiplexing component 403 faces the light emitting surface of the laser 401 .

[0114] The light emitting surface of the optical demultiplexing component 503 may be oriented in the same direction as the light incident surface of the optical multiplexing component 403 . For example, both face the laser 401 .

[0115] In the present disclosure, the light input port of optical multiplexing assembly 403 faces the light output port of laser 401. The light output port of optical demultiplexing assembly 503 faces the light input port of refraction unit 505. The light input surface of optical multiplexing assembly 403 and the light output surface of optical demultiplexing assembly 503 are oriented in the same direction, both toward laser 401. In other words, laser 401 and refraction unit 505 are located on the same side of optical multiplexing assembly 403 or optical demultiplexing assembly 503.

[0116] In the present disclosure, in order to avoid optical path crosstalk between the optical receiving end and the optical transmitting end, a difference is set between the height of the light inlet of the refractive portion 505 and the height of the light outlet of the laser 401, so that the optical path between the optical demultiplexing component 503 and the refractive portion 505 and the optical path between the optical multiplexing component 403 and the laser 401 are separated by a certain distance in terms of relative vertical position relationship, so that the optical path of the optical transmitting end and the optical path of the optical receiving end present a certain height difference in terms of relative vertical position relationship, thereby avoiding interference and crosstalk between the optical receiving optical path and the optical transmitting optical path.

[0117] By aligning the surface of the laser 401 with the surface of the circuit board 300, the optical path of the light emitting end is close to the surface of the circuit board 300. The support portion 508 supports the refracting portion 505 at a certain distance from the circuit board 300, providing a height difference for the optical path to turn, so that the optical path of the light receiving end is at a certain distance from the surface of the circuit board 300. This ensures that the optical paths of the light emitting end and the light receiving end are in a relative vertical positional relationship. By adjusting the height of the light inlet of the refracting portion 505 and the height of the light outlet of the laser 401, the optical paths of the light emitting end and the light receiving end do not interfere with each other in their relative vertical positional relationship.

[0118] by Figure 8 In terms of the positional relationship shown in FIG, the optical demultiplexing assembly 503 is positioned above the optical multiplexing assembly 403. The optical path formed by the second fiber collimator 501, the second collimating lens 502, the optical demultiplexing assembly 503, the second converging lens 504, and the refraction unit 505 is located above the optical path formed between the laser 401 and the optical multiplexing assembly 403.

[0119] The optical paths of the light emitting end and the light receiving end are in a relative upper and lower position relationship: the light output path of the laser 401 is relatively closer to the surface of the circuit board 300; the refraction portion 505 is at a certain distance from the surface of the circuit board 300 to facilitate the turning of the optical path. At this time, the refraction portion 505 is above the surface of the circuit board 300.

[0120] The support portion 508 can support the refracting portion 505 to a certain height to bend the optical path of the optical signal. For example, the optical path of the optical signal is turned downward.

[0121] by Figure 8 As for the positional relationship shown in FIG, if the position of the optical multiplexing component 403 is above the position of the optical demultiplexing component 503, then if the optical path height of the optical receiving end is guaranteed to remain unchanged, the position of the laser 401 is passively raised. At this time, the surface of the laser 401 is not flush with the surface of the circuit board 300, resulting in a longer wire length between the laser 401 and the circuit board 300, which reduces the high-frequency signal transmission performance. Figure 8As for the positional relationship shown in FIG, if the optical multiplexing component 403 is positioned above the optical demultiplexing component 503, and if the optical path height of the optical transmitting end is guaranteed to remain unchanged, the optical demultiplexing component 503 is positioned lower. At this time, since the TEC 402 has a certain thickness, the TEC 402 is bound to block the optical path of the optical receiving end, which is not conducive to the transmission of the signal at the optical receiving end.

[0122] In the present disclosure, the transimpedance amplifier 507 is electrically connected to the DSP 304 through metal vias to transmit the electrical signal amplified by the transimpedance amplifier 507 to the DSP 304. Wire bonding is performed between the surface of the laser 401 and the surface of the circuit board 300, and then an electrical connection is achieved with the DSP 304 through metal vias on the surface of the circuit board 300 to transmit the electrical signal to the laser 401.

[0123] In the present disclosure, the optical demultiplexing assembly 503 is stacked with the optical multiplexing assembly 403. The light outlet of the optical demultiplexing assembly 503 faces the deflecting portion 505, and the light inlet of the optical multiplexing assembly 403 faces the laser 401. By adjusting the height difference between the light inlet of the deflecting portion 505 and the light outlet of the laser 401 to a predetermined value, the optical path between the optical demultiplexing assembly 503 and the deflecting portion 505 and the optical path between the optical multiplexing assembly 403 and the laser 401 are separated by a certain distance in terms of relative vertical position, thereby preventing interference and crosstalk between the light receiving path and the light transmitting path.

[0124] For example, the light inlet height of the refracting portion 505 can be adjusted by adjusting the thickness of the supporting portion 508 , thereby adjusting the light inlet height of the refracting portion 505 and the light outlet height of the laser 401 to a preset difference.

[0125] Figure 9 A schematic diagram of an optical path of an optical module according to some embodiments of the present disclosure Figure 3 .like Figure 9 As shown, the optical demultiplexing assembly 503 is stacked with the optical multiplexing assembly 403. The optical multiplexing assembly 403 is disposed on the surface of the carrier 900, and the optical demultiplexing assembly 503 is disposed on the surface of the optical multiplexing assembly 403.

[0126] The external optical signal is transmitted sequentially along the second optical fiber collimator 501, the second collimating lens 502, the optical demultiplexing assembly 503, the second converging lens 504, and the refracting portion 505. The external optical signal is split into multiple optical beams by the optical demultiplexing assembly 503. The refracting portion 505 redirects each optical beam to the surface of the optical receiving chip 506.

[0127] The support portion 508 supports the refracting portion 505 to a certain height to facilitate the turning of the optical signal path. When the support portion 508 supports the refracting portion 505 to a certain height, the optical path of the light receiving end is also supported to a certain height to avoid crosstalk and interference with the optical path of the light transmitting end.

[0128] Exemplarily, the second fiber collimator 501 and the second collimating lens 502 are disposed on the surface of the carrier 900. The surface height of the carrier 900 ensures that the optical path heights of the second fiber collimator 501 and the second collimating lens 502 are coaxial with the optical path heights of the optical demultiplexing assembly 503, thereby achieving optical path matching. The optical demultiplexing assembly 503 is disposed on the surface of the optical multiplexing assembly 403. One surface of the support portion 508 is connected to the circuit board 300, and the other surface is connected to the refractive portion 505.

[0129] Figure 10 A schematic diagram of an optical path of an optical module according to some embodiments of the present disclosure Figure 4 .like Figure 10 As shown, the optical signal emitted by the laser 401 is collimated into parallel light by the first collimating lens 404, and enters the optical multiplexing component 403 in the form of parallel light. The optical multiplexing component 403 combines the optical signals into a beam of light. The synthesized optical signal is transmitted to the outside of the optical module in turn through the first converging lens 405 and the first optical fiber collimator 406. Among them, the optical multiplexing component 403 is arranged on the surface of the carrier 900, and the surface of the laser 401 is flush with the surface of the circuit board 300, so that the optical path between the laser 401 and the optical multiplexing component 403 is close to the surface of the circuit board 300. The optical path between the laser 401 and the optical multiplexing component 403 is lower than the optical path between the second optical fiber collimator 501, the second collimating lens 502, the optical demultiplexing component 503, the second converging lens 504, and the refractive part 505. The "sinking" is based on Figure 10 In terms of the positional relationship presented.

[0130] In the present disclosure, the light input port of the optical demultiplexing assembly 503 and the light output port of the optical multiplexing assembly 403 are located on opposite sides of the same end of the carrier 900. The first fiber collimator 406 and the second fiber collimator 501 are then located on opposite sides of the same end of the carrier 900, thereby further preventing optical crosstalk between the light emitting end and the light receiving end.

[0131] Exemplarily, the transmission path of the external optical signal along the second optical fiber collimator 501 and the second collimating lens 502 and the transmission path of the synthesized optical emission signal along the first converging lens 405 and the first optical fiber collimator 406 are located on different sides of the same surface, thereby avoiding interference or crosstalk between the optical paths.

[0132] The lens disposed between the second fiber collimator 501 and the optical demultiplexing assembly 503 is a second collimating lens 502. Therefore, each optical signal beam outputted by the optical demultiplexing assembly 503 is collimated light. Each optical signal beam outputted by the optical demultiplexing assembly 503 is transmitted as parallel light to the deflecting portion 505. In this case, the divergence angle is small, making it less likely for the optical signal to crosstalk with the optical transmitter, thus preventing optical signal crosstalk.

[0133] The lens positioned between laser 401 and optical multiplexing assembly 403 is a first collimating lens 404. Therefore, each optical signal entering optical multiplexing assembly 403 is collimated light. The optical signal output from laser 401 is transmitted to optical multiplexing assembly 403 as parallel light. This reduces the divergence angle, making it less likely that the optical signal will crosstalk with the optical receiving end, thus preventing optical signal crosstalk.

[0134] Figure 11 This is a schematic internal cross-sectional view of an optical module provided according to some embodiments of the present disclosure; Figure 12 Schematic side view of an optical module according to some embodiments of the present disclosure. Figure 11 and Figure 12 As shown, the optical demultiplexing assembly 503 and the optical multiplexing assembly 403 are stacked on top of each other, and the optical path is adjusted to avoid optical signal crosstalk, thereby achieving a compact arrangement of optical components and reducing the space occupied by the optical engine.

[0135] In this disclosure, Figure 12 As for the upper and lower positional relationship shown, the light path of the laser 401 is sunken and the light path of the light receiving end is relatively arranged upward, thereby avoiding optical path crosstalk.

[0136] If the surface of laser 401 is flush with the surface of circuit board 300, the optical path of laser 401 is close to the surface of circuit board 300, and the optical path of laser 401 is relatively low. However, since the optical path of the optical receiving component needs to be turned, and the optical receiving chip 506 is located on the surface of circuit board 300 or on the surface of transimpedance amplifier 507, the optical path at the optical receiving component end needs to have a certain height difference from the circuit board surface to turn the optical path and redirect the optical signal to the surface of optical receiving chip 506. This provides feasibility for stacking optical demultiplexing assembly 503 and optical multiplexing assembly 403.

[0137] In the present disclosure, the optical demultiplexing component 503 and the optical multiplexing component 403 are stacked up and down, and the optical paths of the optical transmitting end and the optical receiving end can be adjusted by adjusting the thickness of the optical demultiplexing component 503 and the optical multiplexing component 403 to achieve the purpose of non-interference of the optical paths.

[0138] Figure 13 FIG. 1 is an internal top view of an optical module provided according to some embodiments of the present disclosure. Figure 13As shown, in order to avoid optical path crosstalk and optical device interference, the light outlet of the optical multiplexing component 403 and the light inlet of the optical demultiplexing component 503 are located on both sides of the carrier 900 in the width direction.

[0139] Based on the principle of optical paths, the optical output port of optical multiplexing assembly 403 outputs a beam of optical signals, and the optical input port of optical demultiplexing assembly 503 inputs a beam of optical signals. When the optical output port of optical multiplexing assembly 403 and the optical input port of optical demultiplexing assembly 503 are located on opposite sides of the carrier 900 in the width direction, crosstalk between the optical signals output by the optical output port of optical multiplexing assembly 403 and the optical signals input by the optical input port of optical demultiplexing assembly 503 can be avoided.

[0140] The first optical fiber collimator 406 and the first converging lens 405 face the light outlet of the optical multiplexing component 403 .

[0141] The second fiber collimator 501 and the second collimating lens 502 face the light entrance of the optical demultiplexing component 503 .

[0142] The light output port of the optical multiplexing assembly 403 and the light input port of the optical demultiplexing assembly 503 are located on opposite sides of the carrier 900 in the width direction. Therefore, the first fiber collimator 406 and the second fiber collimator 501 are located on opposite sides of the same end of the carrier 900 in the width direction to prevent interference between the first fiber collimator 406 and the second fiber collimator 501. For example, the first fiber collimator 406 and the second fiber collimator 501 are located on the same side of the optical multiplexing assembly 403 or the optical demultiplexing assembly 503.

[0143] Accordingly, the first converging lens 405 and the second collimating lens 502 are located on opposite sides of the same end of the carrier 900 in the width direction, thereby preventing interference between the first converging lens 405 and the second collimating lens 502. For example, the first converging lens 405 and the second collimating lens 502 are located on the same side of the optical multiplexing assembly 403 or the optical demultiplexing assembly 503.

[0144] The transmission path of the external optical signal along the second optical fiber collimator 501 and the second collimating lens 502 and the transmission path of the synthesized optical transmit signal along the first converging lens 405 and the first optical fiber collimator 406 are located on different sides, thereby avoiding optical path crosstalk.

[0145] In some embodiments, the first fiber collimator 406 and the second fiber collimator 501 can also be located on different sides of the optical multiplexing assembly 403 or the optical demultiplexing assembly 503. For example, if the position of the light emitting component remains unchanged and the first fiber collimator 406 is moved to the other side of the optical multiplexing assembly 403 or the optical demultiplexing assembly 503, the position of the laser 401 should also be changed accordingly. When an external fiber ribbon is positioned on one side of the second fiber collimator 501, an optical connection can be achieved between the first fiber collimator 406 and the external fiber ribbon through fiber winding.

[0146] In the present disclosure, the light output port of the optical multiplexing assembly 403 is positioned near the first converging lens 405, and the light output end face of the optical multiplexing assembly 403 is tilted toward the first converging lens 405. The light input port of the optical demultiplexing assembly 503 is positioned toward the second collimating lens 502, and the light input end face of the optical demultiplexing assembly 503 is tilted toward the second collimating lens 502. Because the first converging lens 405 and the second collimating lens 502 are located on different sides of the carrier 900 in the width direction, there is a certain misalignment between the tilt direction of the light output end face of the optical multiplexing assembly 403 and the tilt direction of the light input end face of the optical demultiplexing assembly 503.

[0147] In the present disclosure, since the optical demultiplexing component 503 needs to be disposed on the surface of the optical multiplexing component 403 , the size of the optical multiplexing component 403 may be larger than that of the optical demultiplexing component 503 to better fix the optical demultiplexing component 503 .

[0148] Figure 14 Schematic diagram of the relative position relationship between the first fiber collimator and the second fiber collimator of an optical module provided according to some embodiments of the present disclosure. Figure 14 As shown, Figure 14 As for the positional relationship presented in FIG, the optical axis of the second fiber collimator 501 is higher than the optical axis of the first fiber collimator 406, so that the optical path of the light receiving end is higher than the optical path of the light emitting end to avoid mutual interference.

[0149] The heights of the optical axes of the second fiber collimator 501 and the first fiber collimator 406 can be adjusted by adjusting the surface height of the supporting component 900 .

[0150] In some embodiments, to prevent the optical transmission signal from returning to the laser 401 along its original path, an isolator is integrated into the first fiber collimator 406. The isolator prevents the optical transmission signal from returning to the laser 401 along its original path, thereby ensuring the quality of the optical signal emitted by the laser 401. Because the first fiber collimator 406 is integrated with the isolator, its size is larger than that of the second fiber collimator 501.

[0151] Figure 15A structure of a bearing member provided according to an embodiment of the present disclosure Figure 1 .like Figure 15 As shown, the surface of the carrier 900 is formed with supporting areas with different surface heights to accommodate various optical devices. The surface heights of the supporting areas are different to achieve optical path matching.

[0152] A first carrying area 902 may be formed on a surface of the carrying member 900 .

[0153] The first carrying area 902 is used to carry the second optical fiber collimator 501 and the second collimating lens 502 respectively.

[0154] The surface of the first supporting area 902 is relatively high to ensure that the second fiber collimator 501 and second collimating lens 502 disposed thereon are at a relatively high height. For example, the first supporting area 902 may be in the form of a boss. To avoid interference with the optical path of the light transmitting end, the second fiber collimator 501 and second collimating lens 502 are disposed at a relatively high height. This also provides a height difference in the optical path of the light receiving end, facilitating optical path deflection during optical signal transmission.

[0155] A first stopper 903 is formed on one side of the first supporting area 902 to limit and secure the second fiber collimator 501. The first stopper 903 can be in the form of a barrier. The top surface of the first stopper 903 is higher than the top surface of the first supporting area 902. For example, the sidewalls of the second fiber collimator 501 rest against the sidewalls of the first stopper 903 to limit and secure the second fiber collimator 501.

[0156] The length of the first stopper 903 does not extend toward the second collimating lens 502. In other words, a notch 904 is formed on one side of the first stopper 903. Since the coupling of the second collimating lens 502 is active, such as by an active coupling device sucking the second collimating lens 502 for coupling, the notch 904 provides space for active coupling and facilitates observation of the coupling status of the second collimating lens 502.

[0157] The surface of the carrier 900 may form a second carrier area 905 .

[0158] The second supporting area 905 is used to support the TEC 402, the laser 401, and the first collimating lens 404. The laser 401 and the first collimating lens 404 are respectively provided on the surface of the TEC 402. The assembly consisting of the TEC 402, the laser 401, and the first collimating lens 404 is referred to as the light-emitting assembly. The second supporting area 905 is used to support the light-emitting assembly.

[0159] To improve high-frequency signal transmission performance, the surface of the laser 401 can be flush with the surface of the circuit board 300 to ensure shorter bonding wires, thereby improving high-frequency signal transmission performance. Because the TEC 402 has a certain height, the second supporting area 905 can be designed as a recessed area to ensure that the surface of the laser 401 is flush with the surface of the circuit board 300. The surface of the second supporting area 905 is relatively recessed.

[0160] A third carrying area 906 may be formed on the surface of the carrier 900 .

[0161] The third carrying area 906 is provided between the first carrying area 902 and the second carrying area 905 and is used to carry the optical multiplexing component 403 .

[0162] To secure the optical multiplexing assembly 403 to the surface of the third supporting area 906, the surface of the third supporting area 906 is formed with a first section 9061, a second section 9062, and a third section 9063. The first section 9061 is the glue dispensing area for securing the optical multiplexing assembly 403. The second section 9062 is a glue overflow groove to collect overflowing glue. The surface of the third section 9063 is used to support the optical multiplexing assembly 403.

[0163] Since the optical path height at the optical emission end is relatively low, the surface height of the third supporting area 906 is lower than the surface height of the first supporting area 902. The height difference between the third supporting area 906 and the first supporting area 902 forms a step, so that the optical multiplexing assembly 403 rests on the wall surface of the third supporting area 906.

[0164] A fourth carrying area 907 may be formed on the surface of the carrying member 900 .

[0165] The fourth carrying area 907 is used to carry the first converging lens 405. The fourth carrying area 907 is disposed on one side of the first carrying area 902 so that the first converging lens 405 and the second collimating lens 502 are located on both sides.

[0166] A fifth carrying area 908 may be formed on the surface of the carrier 900 .

[0167] The fifth carrying area 908 is used to carry the first optical fiber collimator 406. The fifth carrying area 908 is disposed on one side of the first carrying area 902 so that the first optical fiber collimator 406 and the second optical fiber collimator 501 are located on both sides.

[0168] The height of the first carrying area 902 is higher than that of the fourth carrying area 907 and the fifth carrying area 908 to avoid interference between the optical path of the light receiving end and the optical path of the light emitting end.

[0169] In the present disclosure, in order to coordinate the light receiving optical path and the light emitting optical path, in the carrier 900, the height of the third carrier area 906 and the thickness of the supporting part are such that there is a preset difference between the height of the light inlet of the refractive part 505 and the height of the light outlet of the laser 401, so that the optical path between the optical demultiplexing component 503 and the refractive part 505 and the optical path between the optical multiplexing component 403 and the laser 401 are in relative upper and lower positions.

[0170] The height of the first carrying area 902 enables the optical path of the second optical fiber collimator 501 to match that of the refraction portion 505 .

[0171] The height of the second carrying area 905 enables the optical paths of the optical multiplexing component 403 and the laser 401 to match, and enables the optical demultiplexing component on the surface of the optical multiplexing component 403 to match the optical path of the refraction portion 505 to match.

[0172] The height of the fourth carrying area 907 enables the optical paths of the first converging lens 405 and the optical multiplexing component 403 to match each other.

[0173] The height of the fifth carrying area 908 enables the optical path of the first optical fiber collimator 406 to match that of the optical multiplexing component 403 .

[0174] In the present disclosure, the optical path design is achieved by rationally designing the structure of the carrier 900 .

[0175] Figure 16 A structure of a carrier provided according to some embodiments of the present disclosure Figure 2 .like Figure 16 As shown, the surface height of the fourth carrying area 907 is higher than the surface height of the fifth carrying area 908 to match the optical path heights of the first converging lens 405 and the first optical fiber collimator 406 .

[0176] A second stopper 909 is formed on one side of the third support area 906 to securely position the optical multiplexing assembly 403. The second stopper 909 can be in the form of a barrier. The top surface of the second stopper 909 is higher than the top surface of the third support area 906. For example, the optical multiplexing assembly 403 rests on the sidewall of the second stopper 909 to securely position the optical multiplexing assembly 403.

[0177] Likewise, the second limiting portion 909 does not extend toward the fourth supporting area 907 , so as to provide a coupling space for the active coupling of the first converging lens 405 and facilitate observation of the coupling state of the first converging lens 405 .

[0178] Figure 17 A structure of a carrier provided according to some embodiments of the present disclosure Figure 3 .like Figure 17As shown, an escape portion 910 is formed between the second carrying area 905 and the second limiting portion 909 .

[0179] The surface of the second supporting area 905 is provided with a TEC 402. The avoidance portion 910 is provided to avoid the positive and negative bonding wires of the TEC 402.

[0180] Figure 18 A schematic diagram of a connection between a circuit board and a carrier according to some embodiments of the present disclosure Figure 1 ; Figure 19 A schematic diagram of a connection between a circuit board and a carrier according to some embodiments of the present disclosure Figure 2 .like Figure 18-19 As shown, the edge of the carrier 900 supports the circuit board 300 , thereby achieving a fixed connection between the carrier 900 and the circuit board 300 .

[0181] Edge portions 901 are formed on four edges of the carrier 900 . The edge portions 901 are used to support the circuit board 300 .

[0182] In the width direction of the carrier 900 , there is still a certain space between the second carrying area 905 and the outermost edge of the carrier 900 to form an edge portion 901 to support the circuit board 300 .

[0183] In the width direction of the carrier 900 , there is still a certain space between the first supporting area 902 and the other outermost edge of the carrier 900 to form an edge portion 901 on the other side to support the circuit board 300 .

[0184] The carrier 900 also has a certain amount of blank space in the length direction to form edge portions 901 on both sides to support the circuit board 300 .

[0185] Figure 20 An assembly diagram of a carrier, a light emitting component, and a light receiving component according to some embodiments of the present disclosure; Figure 21 This is an exploded view of the assembly between a carrier, a light emitting component, and a light receiving component according to some embodiments of the present disclosure. Figure 20 and Figure 21 As shown, the carrier 900 is used to carry the light emitting component 400 and the light receiving component 500 .

[0186] The surface of the carrier 900 is formed with supporting areas with different surface heights to accommodate various optical devices. The surface heights of the supporting areas are different to achieve optical path matching between the various optical devices.

[0187] In the light emitting component 400, the light emitting components are disposed on the surface of the carrier 900. For example, the light emitting components are disposed on the surface of the second carrier area 905. The light emitting components include a TEC 402, a laser 401, and a first collimating lens 404.

[0188] The optical multiplexing component 403 is disposed on the surface of the third supporting area 906 .

[0189] The first converging lens 405 is disposed on the surface of the fourth supporting area 907 .

[0190] The first optical fiber collimator 406 is disposed on the surface of the fifth supporting area 908 .

[0191] In the optical receiving component 500 , the second optical fiber collimator 501 and the second collimating lens 502 are both disposed on the surface of the first carrying area 902 . The optical demultiplexing assembly 503 is disposed on the surface of the optical multiplexing assembly 403 .

[0192] The support portion 508 is disposed on the surface of the circuit board 300 . The second converging lens 504 and the refractive portion 505 are disposed on the surface of the support portion 508 .

[0193] In the present disclosure, the optical demultiplexing component and the optical multiplexing component are stacked, and there is a difference between the height of the light inlet of the refractive part and the height of the light outlet of the laser, so as to separate the optical path between the optical demultiplexing component and the refractive part and the optical path between the optical multiplexing component and the laser by a certain distance in terms of the relative upper and lower positions, thereby avoiding interference and crosstalk between the light receiving optical path and the light emitting optical path. In the present disclosure, the space occupied by the light engine is reduced by stacking the optical demultiplexing component and the optical multiplexing component. The surface of the laser can be flush with the surface of the circuit board, and the height of the optical path at the end of the light emitting component is lower. The optical path at the end of the light receiving component just needs to have a certain height difference from the surface of the circuit board to turn the optical path. Therefore, it is feasible to stack the optical demultiplexing component and the optical multiplexing component. Among them, the height difference at the end of the light receiving component can be achieved by supporting the refractive part to a certain height by the support part. By rationally designing the setting height of the optical device, optical path matching is achieved, so that the light receiving optical path and the light emitting optical path are set in a relative upper and lower position relationship, thereby avoiding interference and crosstalk between the light receiving optical path and the light emitting optical path, and realizing a reasonable layout of the light receiving components and the light emitting components.

[0194] Different from the above embodiment, the present disclosure also provides another optical module.

[0195] Figure 22 The figure is a schematic diagram of the internal structure of another optical module provided according to an embodiment of the present disclosure. Figure 23 FIG. 1 is a schematic diagram of the structure of another circuit board provided according to some embodiments of the present disclosure. Figure 3 、 Figure 22 and Figure 23As shown, the optical module 200 includes a circuit board 300, a carrier 900, a light emitting component 400 and a light receiving component 500. The circuit board 300, the carrier 900, the light emitting component 400 and the light receiving component 500 are arranged in an installation space enclosed by the upper housing 201 and the lower housing 202.

[0196] In some examples, a notch 302 is formed on the surface of the circuit board 300, and the notch 302 can be formed in the middle region of the circuit board 300. The carrier 900 can be connected to the circuit board 300 by being embedded in the notch 302, and connected to the middle region of the circuit board 300, thereby ensuring the stability of the connection between the carrier 900 and the circuit board 300 and ensuring that the light emitting component 400 and the light receiving component 500 in the sealed cavity 911 can operate normally and stably.

[0197] Connecting the carrier 900 and the circuit board 300 by embedding them can simplify the connection relationship and eliminate the need for additional connecting components. It is worth noting that the circuit board 300 is generally an elongated structure. Therefore, when setting the embedding direction of the carrier 900 and the circuit board 300, the carrier 900 can be controlled to be embedded in the circuit board 300 along the length of the circuit board 300, thereby ensuring its embedding stability with the circuit board 300 and facilitating the rational layout of the installation space for the circuit board 300.

[0198] In some examples, after the carrier 900 is embedded in the circuit board 300, a portion of the carrier 900 is located above the circuit board 300, while another portion of the carrier 900 is located below the circuit board 300. In other words, the embedded portion of the carrier 900 and the circuit board 300 is the middle region of the carrier 900, which helps to further ensure the embedding stability of the carrier 900 and the circuit board 300.

[0199] Figure 24 FIG. 1 is a schematic structural diagram of another carrier provided according to an embodiment of the present disclosure. Figure 24 As shown, the carrier 900 includes a carrier shell 912 and a carrier cover 913. The carrier shell 912 is embedded in the notch 302, and the carrier cover 913 is covered on the carrier shell 912. Specifically, the carrier shell 912 includes an insertion port a5, and the carrier 900 is embedded in the notch 302 through the insertion port a5.

[0200] Figure 25 Schematic diagram of the structure of a seal provided according to some embodiments of the present disclosure. Figure 25As shown, the optical module also includes a sealing member 914, which is provided between the plug-in interface a5 and the circuit board 300 and is used to seal the gap between the plug-in interface a5 and the circuit board 300, so that after the carrier 900 is installed on the circuit board 300, a sealed cavity 911 can be formed in the carrier 900 through the sealing member 915, and the sealed cavity 911 can provide a sealed installation environment for the light emitting component 400 and the light receiving component 500. By configuring the carrier 900 to be in the form of a carrier shell 912 and a carrier cover 913, when installing the carrier 900, the carrier shell 912 can be first inserted on the circuit board 300, and then the light emitting component 400 and the light receiving component 500 can be installed, and finally the carrier cover 913 can be covered on the carrier shell 912, thereby sealing the carrier shell 912 to form a sealed cavity 911. In this way, the sealing of the carrier 900 can be guaranteed, and it is also beneficial to the installation and replacement of the light emitting component 400 and the light receiving component 500. Among them, Figure 24 The carrier 900 shown in FIG is in a sealed state, and a sealed cavity 911 is formed inside the carrier 900. The sealed cavity 911 is in a sealed state. Figure 22 The sealing member 914 may include a first sealing member 9141 and a second sealing member 9142. The first sealing member 9141 is used to seal the upper surface of the circuit board 300 corresponding to the embedded position of the plug-in interface a5, and the second sealing member 9142 is used to seal the lower surface of the circuit board 300 corresponding to the embedded position of the plug-in interface a5. It should be emphasized that in order to better demonstrate the installation status of the light emitting component 400 and the light receiving component 500 in the sealed cavity 911, Figure 22 The sealed cavity 911 is shown in the open state.

[0201] In some embodiments, both the light emitting component 400 and the light receiving component 500 are disposed within a sealed cavity 911. The light emitting component 400 is used to generate and transmit optical signals, and transmit the optical signals to the external environment for signal interaction. Placing the light emitting component 400 within the sealed cavity 911 not only dissipates heat, but also utilizes the sealed cavity 911 within it to provide an installation environment for the light emitting component 400, ensuring sealing. The light receiving component 500 is used to receive and converge external optical signals. The external optical signals may be generated by returning optical signals after being transmitted to the external environment, and carry information about the external environment.

[0202] In some examples, because the sealed cavity 911 is sealed, the light emitting component 400 and the light receiving component 500 installed therein are also sealed and isolated from the external environment. As a result, when the optical module 200 adopts a liquid cooling method and the optical module 200 is placed entirely in the coolant, the light emitting component 400 and the light receiving component 500 can be isolated from the coolant by the carrier 900, thereby preventing the coolant from entering the carrier 900 and contacting the light emitting component 400 and the light receiving component 500, effectively ensuring the service life of the light emitting component 400 and the light receiving component 500. At the same time, because the optical module 200 has a structure with a carrier 900, when the optical module 200 adopts a heat pipe cooling method, the heat pipe can be laid on the surface of the carrier 900, thereby transferring heat to the housing of the optical module 200 through the heat pipe, and then conducting the heat to the external environment through the housing of the optical module 200. In other words, the carrier 900 can simultaneously meet the liquid cooling and heat pipe cooling requirements of the optical module 200, and has strong adaptability. When switching between different cooling modes, there is no need to change its own structure, thereby improving the adaptability of the optical module 200.

[0203] Figure 26 FIG1 is an exploded view of another light emitting component and light receiving component provided according to an embodiment of the present disclosure. Figure 26 As shown, the optical transmitting component 400 includes a laser 401, an optical multiplexing assembly 403, and a transmitting adapter 701. The laser 401 and the optical multiplexing assembly 403 are located on the bottom surface of the carrying housing 912. The transmitting adapter 701 is embedded in the side of the carrying housing 712. The optical receiving component 500 includes an optical receiving chip 506, an optical demultiplexing assembly 503, and a receiving adapter 702. The optical receiving chip 506 is located on the circuit board 300. The optical demultiplexing assembly 503 is stacked with the optical multiplexing assembly 403. The receiving adapter 702 is embedded in the side of the carrying housing 912. There is a preset difference between the height of the light outlet of the transmitting adapter 701 and the height of the light inlet of the receiving adapter 702, so that the optical path between the receiving adapter 702, the optical demultiplexing assembly 503, and the optical receiving chip 506 is arranged vertically relative to the optical path between the laser 401, the optical multiplexing assembly 403, and the transmitting adapter 701.

[0204] Thus, the laser 401 of the optical emitting component 400 and the optical receiving chip 506 of the optical receiving component 500 are disposed on the carrier 900 and the circuit board 300, respectively. The optical path of the optical signal and the optical path of the external optical signal are spaced apart along a first direction, which is the thickness direction of the circuit board 300. In other words, the optical paths of the optical signal and the external optical signal do not propagate on the same horizontal plane, forming a top-to-bottom stacked optical path. For example, the optical signal can be below the external optical signal. In this example, the optical module 200 can transmit the optical signal from below and receive the external optical signal from above. By setting up an optical transmission design that is stacked up and down, on the one hand, the installation space of the optical emitting component 400 and the optical receiving component 500 along the width direction of the circuit board 300 can be reduced. On the other hand, the number of lasers 401 in the optical emitting component 400 can be increased accordingly, thereby increasing the use capacity of the optical module 200 by utilizing the superimposed optical path. For example, 8 single-wave electro-absorption modulated lasers 401 (electro-absorption modulated laser, EML) are set up, each channel is 200Gbps, that is, 100GBd PAM4 format, and COC (Chip on Carrier) packaging technology is used to achieve a 1.6T OSFP 2×FR4 packaging structure design. As the number of lasers 401 increases, a larger capacity can be achieved. Figure 22 In the figure, a rectangular coordinate system is established with the circuit board 300 as a reference, wherein the x-axis is the thickness direction (first direction) of the circuit board 300, the y-axis is the width direction (second direction) of the circuit board 300, and the z-axis is the length direction (third direction) of the circuit board 300.

[0205] Thus, the optical module 200 provided by the present disclosure, by providing the carrier 900, can not only simultaneously meet the multiple heat dissipation requirements of liquid cooling and heat pipes, but also, based on the superimposed optical path form, utilize the installation space in the thickness direction of the circuit board 300, without occupying the installation space in the width direction of the circuit board 300. It can also meet the large capacity requirements of the optical module 200 by increasing the number of lasers 401 in the light emitting component 400. At the same time, it is conducive to the rational utilization of the circuit board 300, reducing the volume of the circuit board 300 while ensuring the performance of the circuit board 300, and meeting the miniaturization requirements of the optical module 200.

[0206] In some embodiments, see Figure 22As shown, the carrying housing 912 is provided with a first mounting portion 9121, and the transmitting adapter 701 is disposed on the first mounting portion 9121. For example, the first mounting portion 9121 can be disposed on the carrying housing 912 in an open-hole structure. In other words, the transmitting adapter 701 can be mounted on the carrying housing 912 through the open-hole structure. The optical module 200 also includes a receiving adapter 702. The carrying housing 912 is further provided with a second mounting portion 9122, and the receiving adapter 702 is disposed on the second mounting portion 9122. For example, the second mounting portion 9122 can also be disposed on the carrying housing 912 in an open-hole structure. In other words, the receiving adapter 702 can be mounted on the carrying housing 912 through the open-hole structure.

[0207] It is worth noting that the first mounting portion 9121 and the second mounting portion 9122 can be identical or different. If the first mounting portion 9121 and the second mounting portion 9122 are identical, they can both have an open hole structure. In this way, using the same process to form the first mounting portion 9121 and the second mounting portion 9122 in the carrier housing 912 can help save production time for the optical module 200, improve production efficiency, and thus reduce production costs.

[0208] In some embodiments, there are two transmitter adapters 701 and two receiver adapters 702. Along a first direction, the two transmitter adapters 701 are located below the two receiver adapters 702. The first direction corresponds to the thickness of the circuit board 300. Along a second direction, the two transmitter adapters 701 are located between the two receiver adapters 702. The second direction corresponds to the width of the circuit board 300. In other words, the transmitter adapters 701 and the receiver adapters 702 are staggered in both the first and second directions. The two transmitter adapters 701 can be understood as being located slightly below and in the middle of the two receiver adapters 702.

[0209] Figure 27 A schematic diagram of the structure of a first mounting portion and a second mounting portion provided according to an embodiment of the present disclosure. Figure 27 As shown, the first mounting portion 9121 and the second mounting portion 9122 are staggered along the first direction. The first mounting portion 9121 and the second mounting portion 9122 are also staggered along the second direction. In the first direction, the two first mounting portions 9121 are positioned below the two second mounting portions 9122. In the second direction, the two first mounting portions 9121 are positioned between the two second mounting portions 9122. In this embodiment, a stacked optical path design is employed, with bottom-layer transmission and top-layer reception.

[0210] It is worth noting that Figure 27The illustrated number of first mounting portions 9121 and second mounting portions 9122 is two, respectively, for exemplary purposes only. In other embodiments, the number of first mounting portions 9121 and second mounting portions 9122 may also be four, eight, or other numbers. When adjusting the number of first mounting portions 9121 and second mounting portions 9122, the number of transmitting adapters 701 and receiving adapters 702, as well as the number of optical components within the sealed cavity 911, is adjusted accordingly.

[0211] In some embodiments, during the installation of the carrier housing 912, the carrier housing 912 needs to be aligned with the notch 302, moved into the notch 302, and inserted into the notch 302 along the length of the circuit board 300. After the carrier housing 912 is installed, the carrier housing 912 is located within a portion of the notch 302, while the remaining portion of the notch 302 provides clearance for the transmitter adapter 701 and the receiver adapter 702. This rationalizes the positional relationship between the carrier housing 912, the circuit board 300, and the transmitter adapter 701 and the receiver adapter 702, facilitating a miniaturized design for the optical module 200. In these embodiments, the transmitter adapter 701 can be located within the notch 302, and the receiver adapter 702 can be located above the notch 302.

[0212] Figure 28 Schematic diagram of a structure of a carrying shell provided according to the present disclosure. Figure 28 As shown, the bottom of the carrying housing 912 is provided with a mounting groove 9123, and the light emitting component 400 and a portion of the light receiving component 500 are disposed within the mounting groove 9123. The mounting groove 9123 provides a mounting base for the light emitting component 400 and a portion of the light receiving component 500, respectively, thereby ensuring the optical path spacing between the optical signal and the external optical signal. The mounting groove 9123 can be formed by cutting a groove in the bottom of the carrying housing 912. To ensure the overall strength of the carrying housing 912, the bottom thickness of the carrying housing 912 can be set slightly greater than the thickness of the side walls, thereby protecting the installation stability of the light emitting component 400 and the light receiving component 500.

[0213] In one embodiment, Figure 22 、 Figure 26 and Figure 27 As shown, the light emitting component 400 further includes a semiconductor refrigeration plate (Thermo Electric Cooler, TEC402), a first collimating lens 404 and a first converging lens 405.

[0214] The mounting groove 9123 includes a first mounting groove 9123 a , a second mounting groove 9123 b and a third mounting groove 9123 c arranged in sequence along a third direction; the third direction is the length direction of the circuit board 300 .

[0215] Laser 401 and first collimating lens 404 are mounted on TEC 402 via first ceramic spacer 407. TEC 402 is mounted in first mounting groove 9123a. Specifically, TEC 402 can be mounted in first mounting groove 9123a using adhesive. Laser 401 and first collimating lens 404 can be sequentially attached to TEC 402 along the optical path of the optical signal. The placement of first ceramic spacer 407 ensures the optical path height of the optical signal and also ensures the mounting stability of laser 401.

[0216] Specifically, the laser 401 and the first collimating lens 404 can be installed on the cooling surface of the TEC 402, and the heating surface of the TEC 402 is in contact with the wall of the first installation groove 9123a.

[0217] like Figure 26 As shown, each laser 401 is used to generate one optical signal, and eight lasers 401 are used to generate eight optical signals. A first collimating lens 404 is disposed in the optical path of the laser 401. The laser 401 generates heat during use, and the heat generated by the laser 401 is transferred to the bottom of the carrier housing 912 through the TEC 402.

[0218] Optical multiplexing assembly 403 can be installed in second mounting groove 9123b by gluing, and optical multiplexing assembly 403 is arranged in the optical path of the optical signal. Optical multiplexing assembly 403 is used to combine 8 optical signals into 2 optical signals. The number of optical multiplexing assemblies 403 is 2, and each optical multiplexing assembly 403 can combine 4 optical signals into 1 optical signal.

[0219] First converging lens 405 is disposed in third mounting slot 9123c and is positioned in the optical path of the optical signal, on the side of optical multiplexing assembly 403 facing away from laser 401. The position of first converging lens 405 corresponds to that of transmitting adapter 701, and first converging lens 405 is used to transmit the two optical signals to transmitting adapter 701. Transmitting adapter 701 is used to transmit the two optical signals to the external environment.

[0220] Specifically, the depths of the first mounting groove 9123a, the second mounting groove 9123b, and the third mounting groove 9123c decrease in sequence. Since the TEC 402 is provided to conduct heat from the laser 401, the first mounting groove 9123a, the second mounting groove 9123b, and the third mounting groove 9123c are provided with different depths to meet the optical path height of the optical signal.

[0221] It should be emphasized that the specific sizes of the first mounting groove 9123 a , the second mounting groove 9123 b and the third mounting groove 9123 c can be adjusted according to the specific size of the light emitting component 400 .

[0222] In the above embodiment, the number of lasers 401 and first collimating lenses 404 is eight, and the number of optical multiplexing components 403 and first converging lenses 405 is two. Lasers 401 can be self-made single-wavelength 200G EML lasers 401, with a traditional 8-channel design with a pitch of 1.1mm. This enables the optical module 200 to meet the capacity requirements of 1.6T computing data processing services.

[0223] Of course, in other embodiments, the number of lasers 401 and first collimating lenses 404 can also be other numbers, such as 16. Correspondingly, the number of optical multiplexing components 403 and first converging lenses 405 can remain unchanged or be 4. When the number of optical multiplexing components 403 and first converging lenses 405 remains unchanged, the optical path channels of the optical multiplexing component 403 can be changed to 8 channels. In this way, each optical multiplexing component 403 can transmit 8-channel optical signals and converge the 8-channel optical signals to one first collimating lens 404.

[0224] In these embodiments, the 8 optical signals of the laser 401 can meet the requirements of large-capacity use, and by setting three installation grooves of different depths, the light emitting component 400 can be reasonably set in the sealed cavity 911. The layout is rationalized while meeting the optical path requirements, which is conducive to reducing the size of the sealed cavity 911. While ensuring the sealing and installation space, the size of the carrier shell 912 is reduced, which is conducive to realizing the miniaturization design of the optical module 200.

[0225] In some embodiments, the optical receiving component also includes a supporting portion 508 and a refractive portion 505. The supporting portion 508 is arranged on the circuit board 300, and the refractive portion 505 is arranged on the surface of the supporting portion 508. The refractive portion 505 is used to turn the optical signal output by the optical demultiplexing component 503 toward the surface of the optical receiving chip 506.

[0226] In some embodiments, the refracting portion 505 is disposed on the circuit board 300 via the support portion 508, and the refracting portion 505 is located on a side of the laser 401 that is away from the first collimating lens 404. Along a first direction, the refracting portion 505 is disposed above the laser 401. The refracting portion 505 is configured to refract and converge the eight external optical signals onto the optical receiving chip 506.

[0227] In some embodiments, the support portion 508 includes a support base 5081 and a support cover 5082. The support base 5081 is disposed on the circuit board 300, and the optical receiving chip 506 is located on the side of the support base 5081 facing away from the laser 401. The optical receiving chip 506 is disposed on the circuit board 300 via a transimpedance amplifier 507. The support cover 5082 is disposed on the support base 5081, and the refracting portion 505 is disposed obliquely on the support cover 5082. The refracting portion 505 is used to change the optical path direction of the external optical signal transmitted by the optical demultiplexing assembly 503, thereby converging the external optical signal to the optical receiving chip 506.

[0228] Among them, the center of the receiving adapter 702 and the center of the optical demultiplexing component 503 are in the same plane, and the plane is the plane where the optical path of the external optical signal is located. This plane intersects with the refractive portion 505. After the optical path of the external optical signal is incident on the refractive portion 505, the original transmission optical path is changed and converged to the photosensitive surface of the optical receiving chip 506 for photoelectric conversion to achieve signal transmission. In order to facilitate the installation of the inclined refractive portion 505, the shape of the support cover 5082 can be a special shape or a regular shape with an installation bevel. The specific shape and size of the support seat 5081 and the support cover 5082 can be adaptively adjusted according to the parameters and position of the optical receiving chip 506, so that the installation height of the optical receiving chip 506 can be reduced, which is conducive to reducing the size of the supporting shell 912. Specifically, the refractive portion 505 can be a prism with refraction and convergence functions.

[0229] In some embodiments, continuing as Figure 22 、 Figure 26 and Figure 28 The optical receiving component 500 further includes a second collimating lens 502 , and the second collimating lens 502 , the optical demultiplexing component 503 , the refraction portion 505 and the optical receiving chip 506 are sequentially arranged along the third direction.

[0230] In some embodiments, the carrying housing 912 further includes two mounting platforms 9124, which are arranged on both sides of the third mounting groove 9123c along the second direction. The mounting platforms 9124 are used to mount the second collimating lens 502. In this embodiment, in order to save the mounting space of the carrying housing 912 in the width direction of the circuit board 300, the mounting space in the thickness direction of the circuit board 300 is used to mount the second collimating lens 502, and the dimension of the third mounting groove 9123c in the width direction of the circuit board 300 is set to be smaller than the dimension of the first mounting groove 9123a in the width direction of the circuit board 300. Figure 28As shown, the mounting platform 9124 not only provides a mounting base for the second collimating lens 502 but also satisfies the optical path height requirements of the external optical signal based on its own height. The height of the mounting platform 9124 is less than the height of the supporting housing 912. The specific height of the mounting platform 9124 can be adaptively adjusted based on the actual height of the second collimating lens 502 and the optical path height of the external optical signal.

[0231] In some embodiments, a second collimating lens 502 is provided corresponding to a receiving adapter 702. The second collimating lens 502 is used to collimate the two external optical signals transmitted by the receiving adapter 702. The number of second collimating lenses 502 is the same as the number of receiving adapters 702, and each receiving adapter 702 is provided with a corresponding second collimating lens 502.

[0232] In some embodiments, the optical demultiplexer assembly 503 is disposed on the optical multiplexing assembly 403 via a second ceramic spacer 509. The optical demultiplexer assembly 503 is disposed in the optical path of the external optical signal and is located on the side of the second collimating lens 502 facing away from the receiving adapter 702. The optical demultiplexer assembly 503 is configured to convert the two external optical signals collimated by the second collimating lens 502 into eight external optical signals. The number of optical demultiplexers 503 can be the same as the number of second collimating lenses 502, both being two, and each optical demultiplexer assembly 503 has four optical path channels. It is worth noting that the optical multiplexing component 403 is arranged in the second installation groove 9123b, and the two opposite sides of the two optical multiplexing components 403 are stuck on the groove wall of the second installation groove 9123b. When the optical demultiplexing component 503 is installed, the optical demultiplexing component 503 covers the optical multiplexing component 403 and the second installation groove 9123b, and the two opposite sides of the two optical demultiplexing components 503 are stuck on the inner wall surface of the carrying shell 912 to ensure the installation stability of the optical demultiplexing component 503.

[0233] In some embodiments, the dimensions of the first mounting groove 9123a, the second mounting groove 9123b, and the third mounting groove 9123c along the second direction continuously decrease. The dimension of the first mounting groove 9123a along the second direction can be adjusted according to the actual number of lasers 401. The dimension of the first mounting groove 9123a along the second direction can be the same as or smaller than the dimension of the carrying housing 912 along the second direction. For example, if the number of lasers 401 is large, the dimension of the first mounting groove 9123a along the second direction can be set to be relatively large. If the number of lasers 401 is small, the dimension of the first mounting groove 9123a along the second direction can be set to be relatively small. The second mounting groove 9123b can have a smaller dimension along the second direction than the first mounting groove 9123a. The second mounting groove 9123b is primarily used to mount the optical multiplexing assembly 403. Therefore, the dimension of the second mounting groove 9123b along the second direction can be the same as the overall dimension of the optical multiplexing assembly 403 along the second direction. This allows the side edges of the optical multiplexing assembly 403 to abut against the wall of the second mounting groove 9123b, thereby ensuring the stable installation of the optical multiplexing assembly 403. The third mounting groove 9123c can have a smaller dimension along the second direction than the second mounting groove 9123b. The third mounting groove 9123c is used to mount the first converging lens 405. The third mounting groove 9123c only needs to meet the overall dimensions of the first converging lens 405 and the receiving adapter 702. The areas on both sides of the third mounting groove 9123c are used to accommodate mounting platforms 9124. The top surface of the mounting platforms 9124 is higher than the bottom of the third mounting groove 9123c, ensuring that the optical path of the external optical signal is higher than the optical path of the received optical signal.

[0234] In some embodiments, both first and second ceramic gaskets 407 and 509 are made of ceramic. They have different sizes, and their thickness can be adjusted based on the required optical path height. The first and second ceramic gaskets 407 and 509 primarily meet the required optical path height and prevent the mounting of the optical device from being unstable due to excessively thick adhesive. Furthermore, ceramic materials are less prone to heat generation, facilitating heat dissipation within the sealed cavity 911.

[0235] The material of the support portion 508 can be the same as that of the first ceramic spacer 407 and the second ceramic spacer 509 .

[0236] In these embodiments, the optical receiving chip 506 and the transimpedance amplifier 507 can be set on the circuit board 300 based on flip-chip technology, the voltage is provided through the DC line, and the chip capacitor is located between the DC line and the ground to eliminate noise from the power supply. At the same time, this design can shorten the distance between the driver and the chip, and control the peak value in the RF design, thereby reducing losses and increasing bandwidth.

[0237] In some embodiments, the tilt angle of the refraction portion 505 ranges from 40° to 45°.

[0238] In a specific embodiment, the inclination angle of the refraction portion 505 may be 42°.

[0239] To facilitate understanding of the optical emitting component 400 and the optical receiving component 500 of the optical module 200 of the present disclosure, the transmission process of the optical signal and the external optical signal is briefly introduced below.

[0240] The eight optical signals generated by eight lasers 401 are collimated by eight first collimating lenses 404 and then incident on two optical multiplexing assemblies 403. Each optical multiplexing assembly 403 is configured to receive four optical signals. Each optical multiplexing assembly 403 converts the four optical signals into one optical signal and transmits it to two first converging lenses 405. The two first converging lenses 405 transmit the optical signals to two transmitting adapters 701 and then to the external environment. The two receiving adapters 702 transmit the received external optical signals to two second collimating lenses 502 for collimation. The two second collimating lenses 502 then send the two external optical signals to two optical demultiplexing assemblies 503. Each optical demultiplexing assembly 503 converts one detection optical signal into four external optical signals, which are then transmitted to a deflecting portion 505 located on a support portion 508. The deflecting portion 505 changes the optical path of the external optical signals and converges them onto an optical receiving chip 506, which then detects the information carried in the external optical signals.

[0241] Figure 29 A rear view of a carrying case provided according to an embodiment of the present disclosure; Figure 30 This is a side view of a carrying shell provided according to an embodiment of the present disclosure. Figures 27 to 30As shown, the carrying housing 912 includes a connected frame structure 9125 and a bottom structure 9126. Along a first direction, the bottom structure 9126 is connected to the bottom of the frame structure 9125, and the carrying cover 913 is disposed on a side of the frame structure 9125 facing away from the bottom structure 9126. Specifically, mounting slots 9123 are disposed on the bottom structure 9126. After the carrying housing 912 is inserted into the circuit board 300, along the first direction, the frame structure 9125 is located above the circuit board 300, and the bottom structure 9126 is located below the circuit board 300. Furthermore, the first mounting slot 9123a, the second mounting slot 9123b, and the third mounting slot 9123c are all located below the circuit board 300, thereby meeting the optical path requirements for optical signals and external optical signals. At the same time, the bottom structure 9126 board does not completely cover the bottom of the frame structure 9125. The bottom structure 9126 and the frame structure 9125 form an insertion interface a5, and the insertion interface a5 is used to avoid the circuit board 300. After the carrying shell 912 is inserted into the circuit board 300, the circuit board 300 is filled in the insertion interface a5, and the position of the circuit board 300 corresponding to the insertion interface a5 is used to install the refractive part 505 and the light receiving chip 506.

[0242] In the second direction, the first mounting groove 9123a, the second mounting groove 9123b, the third mounting groove 9123c, and the plug interface a5 are arranged in sequence. In other words, under the premise that the bottom structure 9126 can accommodate the light emitting component 400 and part of the light receiving component 500, the size of the bottom structure 9126 can be shortened accordingly, which helps save production costs.

[0243] In some embodiments, the height of the frame structure 9125 can be the same as the height of the bottom structure 9126, or the height of the bottom structure 9126 can be slightly smaller than the height of the frame structure 9125, so that the supporting shell 912 is inserted after the circuit board 300, and along the first direction, the circuit board 300 can be located at the center of the supporting shell 912 to ensure installation stability.

[0244] In some embodiments, the frame structure 9125 includes a first subframe 9125a, a second subframe 9125b, and a contraction portion 9125c. One end of the contraction portion 9125c is connected to the first subframe 9125a, and the other end contracts inward along the central axis of the load-bearing housing 912 and connects to the second subframe 9125b. The first subframe 9125a and the second subframe 9125b can be understood as two U-shaped subframe structures, with the openings of the two U-shaped subframe structures facing each other and connected by two contractions 9125c. The bottom of the second subframe 9125b is connected to the bottom structure 9126. The bottom of the first subframe 9125a is the plug interface a5.

[0245] In some embodiments, the first sub-frame 9125a structure includes a first side a1 and a second side a2, the first side a1 extends along the second direction, the second side a2 extends along the third direction, the number of first sides a1 is one, the number of second sides a2 is two, and a second side a2 is connected to each of the opposite sides of the first side a1.

[0246] The second subframe 9125b includes a third side a3 and a fourth side a4. A contracting portion 9125c is connected between the second side a2 and the third side a3. One end of the contracting portion 9125c contracts inwardly along the second side a2 toward the central axis of the support housing 912, and the other end is connected to the third side a3. The third side a3 extends along the second direction, with one end connected to the contracting portion 9125c and the other end connected to the fourth side a4. The fourth side a4 extends along the third direction, opposite the first side a1, and is shorter than the first side a1 along the second direction.

[0247] In this way, the frame structure 9125 is set along the third direction to a structure with one end larger than the other end, such as larger at the top and smaller at the bottom. In this way, on the one hand, the volume of the carrying shell 912 itself can be saved, and the production cost of the carrier 900 can be reduced. On the other hand, the two opposite third sides a3 of the frame structure 9125 can form a gripping portion to facilitate installation and disassembly operations. Correspondingly, the shape of the notch 302 on the circuit board 300 corresponds to the shape of the frame structure 9125. Along the third direction, the notch 302 can be a structure with a larger top and a smaller bottom, so as to facilitate the insertion of the carrying shell 912. Among them, the size of the notch 302 can be the same as the size of the carrying shell 912, or slightly smaller than the size of the carrying shell 912, thereby realizing an interference fit between the carrying shell 912 and the circuit board 300, ensuring the installation stability of the carrying shell 912, and then ensuring the stability of the optical path.

[0248] In these embodiments, the bottom structure 9126 may comprise a bottom plate and side plates, specifically including a first side plate 9126a, a second side plate 9126b, a third side plate 9126c, and a bottom plate 9126d. The first side plate 9126a and the second side plate 9126b are opposed to each other and are both connected to a side of the third side a3 that is close to the central axis of the carrying housing 912. The third side plate 9126c is connected to the fourth side a4. The second side plate 9126b and the fourth side a4 are used to define the first mounting portion 9121 and the second mounting portion 9122. It is worth noting that the carrying housing 912 may be an integrally formed structure, which facilitates ensuring the sealing of the sealed cavity 911.

[0249] Specifically, along the first direction, the projections of the first side panel 9126a and the second side panel 9126b from the carrier cover 913 toward the circuit board 300 are within the enclosed area of ​​the third side a3 and the fourth side a4. That is, the first side panel 9126a and the second side panel 9126b can be understood as structures in which the two opposing third sides a3 are contracted toward the central axis of the carrier housing 912. The first side panel 9126a and the second side panel 9126b can be configured as straight side panels, or the first side panel 9126a and the second side panel 9126b can be configured to have the same shape as the first side a1, the contracted portion 9125c, and the third side a3. For example, the first side panel 9126a can be a side panel with a contracted structure in the middle to adapt to the shape of the frame structure 9125. Of course, in other embodiments, the bottom structure 9126 can also be configured as other structures.

[0250] In some embodiments, the carrying shell 912 may further include an abutment portion 9129, wherein the two abutment portions 9129 are respectively arranged on the side walls opposite to the two third sides a3, for stably installing the optical demultiplexing assembly 503. When installing the optical demultiplexing assembly 503, the two opposite side edges of the optical demultiplexing assembly 503 can abut against the abutment portion 9129, thereby ensuring the installation stability of the optical demultiplexing assembly 503. The abutment portion 9129 can be arranged in a form that protrudes from the inner wall of the third side a3, and the specific protruding distance can be adaptively adjusted according to the size of the optical demultiplexing assembly 503. For example, when the size of the optical demultiplexing assembly 503 is large, an abutment portion 9129 with a relatively small protruding distance can be set, and when the size of the optical demultiplexing assembly 503 is small, an abutment portion 9129 with a relatively large protruding distance can be set.

[0251] In some embodiments, the bottom plate 9126d includes a plug-in portion d1, which is disposed at the plug-in interface a5 and located on the side facing away from the third side plate 9126c. The plug-in portion d1 and the second mounting slot 9123b are located on either side of the first mounting slot 9123a. After the carrier housing 912 is plugged into the circuit board 300, the plug-in portion d1 is aligned with the circuit board 300, and the first mounting slot 9123a is positioned adjacent to the circuit board 300. The provision of the plug-in portion d1 ensures the stability of the plug-in connection between the carrier housing 912 and the circuit board 300, preventing relative displacement of the carrier housing 912 relative to the circuit board 300 and thereby ensuring the stability of the optical path. The plug-in portion d1 can be understood as extending from the bottom plate 9126d toward the plug-in interface a5 after the three mounting slots are formed. Projected along the first direction from the carrier cover 913 toward the circuit board 300, the plug-in portion d1 is within the area enclosed by the two second sides a2.

[0252] In some embodiments, the sealed cavity 911 may include a first sub-sealed cavity 9111 and a second sub-sealed cavity 9112 that are connected. The first sub-sealed cavity 9111 is formed by the first side a1, the two second sides a2, and the circuit board 300. The refractive portion 505, the light receiving chip 506, and the transimpedance amplifier 507 are located within the first sub-sealed cavity 9111. The contraction portion 9125c, the third side a3, and the fourth side a4 are enclosed to form the second sub-sealed cavity 9112. The light emitting component 400, the second collimating lens 502, and the optical demultiplexing assembly 503 are located within the second sub-sealed cavity 9112. Specifically, due to the provision of the contraction portion 9125c, the end of the second sub-sealed cavity 9112 that is connected to the first sub-sealed cavity 9111 can be understood as being contracted inward.

[0253] In some embodiments, as Figure 25 and Figure 28 As shown, the carrier housing 912 further includes a sealing groove 9127, which is disposed around the top of the carrier housing 912 and is recessed a predetermined distance from the top of the carrier housing 912 toward the bottom of the carrier housing 912. The optical module 200 further includes a third sealing member 915, which is disposed within the sealing groove 9127. The carrier cover 913 is disposed over the third sealing member 915, thereby sealing the sealed cavity 911. The third sealing member 915 can be in the form of a sealing adhesive, which is applied to the sealing groove 9127 to seal the light emitting component 400 and the light receiving component 500 within the carrier 900, thereby supporting the sealing requirements for liquid cooling. When installing the carrier 900, the carrier housing 912 can be first inserted into the circuit board 300, and then the light emitting component 400 and the light receiving component 500 can be installed on the carrier 900 and the circuit board 300. Finally, a layer of third sealing member 915 is applied to the sealing groove 9127, and the carrier cover 913 is placed on the third sealing member 915. It is worth noting that the depth of the sealing groove 9127 can be greater than or equal to the thickness of the third sealing member 915 and the overall thickness of the carrier cover 913. In this way, after the carrier cover 913 is placed on the carrier housing 912, the carrier cover 913 does not protrude from the top of the carrier housing 912, that is, it does not occupy the installation space in the second direction, and the aesthetics of the carrier 900 are guaranteed.

[0254] In these embodiments, the carrying cover 913 is arranged behind the carrying shell 912, and a preset distance is set between the surface of the carrying cover 913 located in the sealed cavity 911 and the light emitting component 400 and the light receiving component 500, so as to avoid interference with the light path caused by contact between the carrying cover 913 and the light emitting component 400 and the light receiving component 500.

[0255] Figure 31 Schematic diagram of a structure of a load-bearing cover plate provided according to an embodiment of the present disclosure. Figure 28 and Figure 31 As shown, the carrying housing 912 also includes a first limiting member 9128, and the carrying cover 913 is provided with a second limiting member 9131. The first limiting member 9128 and the second limiting member 9131 are positioned relative to each other, and through the cooperation of the first limiting member 9128 and the second limiting member 9131, the carrying cover 913 is prevented from moving relative to the carrying housing 912 after being covered on the carrying housing 912, thereby effectively ensuring the installation stability of the carrying member 900 and further ensuring the stability of its internal optical path. Exemplarily, the first limiting member 9128 can be a limiting groove, and the second limiting member 9131 can be a limiting protrusion. The shapes of the limiting groove and the limiting protrusion are adapted. The number of limiting grooves can be two, and they are relatively arranged on two opposite sides of the carrying housing 912 along the second direction, such as on the third side a3 or the contraction portion 9125c. During the installation of the bearing cover 913, the positions of the limiting protrusion and the limiting groove are aligned, and the bearing cover 913 is moved toward the bearing shell 912 to reduce the distance between the limiting protrusion and the limiting groove until the limiting protrusion is completely located in the limiting groove, so that the bearing cover 913 is sealed on the bearing shell 912, and a sealing cavity 911 is formed inside the bearing component 900.

[0256] In a specific embodiment, the first stopper 9128 of the carrying housing 912 can be disposed on the sealing groove 9127, thereby further ensuring the sealing of the carrying member 900. In this embodiment, the sealing groove 9127 can be recessed along the top of the carrying housing 912 toward the bottom of the carrying housing 912 by a first preset distance. When the first stopper 9128 is a stopper groove, the stopper groove can be recessed along the bottom of the sealing groove 9127 toward the bottom of the carrying housing 912 by a second preset distance. The first preset distance can be smaller than the second preset distance, thereby ensuring the sealing of the carrying member 900 while ensuring the stable installation of the heat dissipation carrying cover plate 913.

[0257] In some embodiments, the first sealing member 9141 is disposed in the first sub-sealed cavity 9111 and is attached to the bottom of the side wall of the second side a2 where it contacts the circuit board 300. Figure 25 The second sealing member 9142 is provided at a position corresponding to the first sealing member 9141 and is located outside the first sub-sealed cavity 9111, affixed to the position where the bottom of the side wall of the second side a2 contacts the circuit board 300, as shown in FIG. Figure 25The Q2 position shown here seals the lower surface of the circuit board 300 where it mates with the plug interface a5. The first sealant 9141 cooperates with the first sealant to seal the sealed cavity 911, preventing leakage when the optical module 200 utilizes liquid cooling. The first sealant 9141, the second sealant 9142, and the third sealant 915 can be made of the same material, which simplifies the installation process.

[0258] In some embodiments, see Figure 22 As shown, the optical module 200 also includes a digital signal processor (DSP 304). The DSP 304 is disposed on the circuit board 300 and outside the sealed cavity 911. The DSP 304 is disposed on the side of the carrier 900 facing away from the transmitter adapter 701 and the receiver adapter 702, thereby effectively utilizing the installation space of the circuit board 300. During operation of the optical module 200, the operating heat generated by the DSP 304 is relatively large, followed by the laser 401. However, the heat generated by the laser 401 is much less than that generated by the DSP 304.

[0259] To facilitate understanding of the working principle of the carrier 900 in the present disclosure, the heat dissipation paths of the DSP 304 and the laser 401 are briefly introduced below.

[0260] During liquid cooling, the optical module 200 is placed in a coolant. The coolant enters the optical module 200 through the gap between the upper housing 201 and the lower housing 202. The coolant DSP 304 comes into contact with the coolant, dissipating the heat directly through the coolant. Heat generated by the laser 401 within the sealed cavity 911 is dissipated by the TEC 402 located below it. Furthermore, the heat is conducted by the TEC 402 to the bottom of the housing 912, where it is carried away by the coolant.

[0261] When using a heat pipe for heat dissipation, the heat pipe can be set on the carrier cover 913, and the length of the heat pipe along the third direction is greater than the length of the carrier cover 913. The side of the heat pipe close to the DSP 304 extends out of the carrier cover 913, and the heat generated by the DSP 304 will be conducted to the entire heat pipe through the end of the heat pipe. At the same time, the carrier cover 913 corresponds to the upper housing 201 of the optical module 200, and the bottom of the carrier housing 912 corresponds to the lower housing 202 of the optical module 200. In this way, the heat of the DSP 304 can be transferred to the upper housing 201 through the heat pipe, and then transferred to the external environment through the upper housing 201. The heat generated by the laser 401 can be dissipated and conducted through the TEC 402, thereby achieving heat conduction between the DSP 304 and the laser 401, improving the heat dissipation effect.

[0262] It should be emphasized that the optical module 200 can also be provided with a thermally conductive gasket (not shown in the figure), which is arranged between the bottom of the carrying shell 912 and the lower shell 202 of the optical module 200 opposite to it. In this way, when heat is transferred, the heat of the laser 401 can be transferred to the bottom of the carrying shell 912 through the TEC402, and then transferred to the lower shell 202 of the optical module 200 through the thermally conductive gasket. Therefore, when a heat pipe heat dissipation method is adopted, the heat of the laser 401 can also be better transferred to the lower shell 202 of the optical module 200, and then transferred to the external environment.

[0263] In some embodiments, a space is reserved between the bottom of the carrier housing 912 and the lower housing 202 of the optical module 200 for installing a thermal pad. The distance between the two is set to 2.55 mm, and the thickness of the thermal pad can be 0.35 mm. The distance between the carrier cover 913 and the upper housing of the optical module 200 is set to 2.5 mm.

[0264] The optical module 200 provided by the present disclosure, by providing a carrier 900, not only satisfies the multiple heat dissipation requirements of liquid cooling and heat pipes simultaneously, but also utilizes the installation space in the thickness direction of the circuit board 300 based on the superimposed optical path form, without occupying the installation space in the width direction of the circuit board 300. This allows for a larger capacity of the optical module 200 by increasing the number of lasers 401 in the light emitting component 400. Furthermore, this facilitates the rational utilization of the circuit board 300, reducing the size of the circuit board 300 while ensuring its performance, thereby meeting the miniaturization requirements of the optical module 200.

[0265] The above are only specific embodiments of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in this disclosure should be included in the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. An optical module, characterized in that: include: A circuit board having a notch formed on its surface; A bearing member is embedded in the notch; The light emitting component includes a laser and an optical multiplexing component, wherein the laser and the optical multiplexing component are respectively arranged on the surface of the carrier; The optical receiving component includes a supporting portion, a refraction portion, an optical receiving chip and an optical demultiplexing assembly; wherein the refraction portion is provided on the surface of the supporting portion, and is used to turn the optical signal output by the optical demultiplexing assembly toward the surface of the optical receiving chip; the optical demultiplexing assembly and the optical multiplexing assembly are stacked, and there is a preset difference between the height of the light inlet of the refraction portion and the height of the light outlet of the laser, so that the optical path between the optical demultiplexing assembly and the refraction portion and the optical path between the optical multiplexing assembly and the laser are in relative upper and lower positions.

2. The optical module according to claim 1, wherein The surface of the laser is flush with the surface of the circuit board; There is a preset distance between the optical path between the optical demultiplexing component and the refraction portion and the surface of the circuit board.

3. The optical module according to claim 1, wherein: The light inlet of the optical demultiplexing component and the light outlet of the optical multiplexing component are located on both sides of the same end of the carrier; The light emitting surface of the optical demultiplexing component faces the light incident surface of the refraction portion, and the light incident surface of the optical multiplexing component faces the light emitting surface of the laser; The light emitting surface of the optical demultiplexing component is oriented in the same direction as the light incident surface of the optical multiplexing component.

4. The optical module according to claim 1, wherein: The light emitting components respectively include the laser, the first collimating lens, the optical multiplexing component, the first converging lens and the first optical fiber collimator; The light receiving components respectively include a second optical fiber collimator, a second collimating lens, the optical demultiplexing component, a second converging lens, the refraction part and the light receiving chip; The surfaces of the carriers are respectively formed with: A first carrying area, used for carrying the second optical fiber collimator and the second collimating lens respectively; a second carrying area, for carrying the laser and the first collimating lens respectively; the second carrying area is set as a recessed area so that the surface of the laser is flush with the surface of the circuit board; a third bearing area, provided between the first bearing area and the second bearing area, for bearing the optical multiplexing component; a fourth carrying area, for carrying the first converging lens; the fourth carrying area is provided on one side of the first carrying area, so that the first converging lens and the second collimating lens are located on both sides; a fifth carrying area, for carrying the first optical fiber collimator, wherein the fifth carrying area is provided on one side of the first carrying area so that the first optical fiber collimator and the second optical fiber collimator are located on both sides; The height of the first bearing area is higher than that of the third bearing area, the fourth bearing area, and the fifth bearing area.

5. An optical module, characterized in that: include: A circuit board having a notch formed on its surface; A bearing member is embedded in the notch; An optical emitting component, comprising a laser, an optical multiplexing assembly, a first converging lens, and a first optical fiber collimator; the optical multiplexing assembly is disposed on a surface of a carrier and located on an outgoing optical path of the laser to receive the optical signals emitted by the laser; the optical multiplexing assembly is configured to combine the optical signals into a beam of light, and the combined beam of light is transmitted along the first converging lens and the first optical fiber collimator, respectively; The optical receiving component includes a second optical fiber collimator, a second collimating lens, an optical demultiplexing assembly, a refracting portion, and an optical receiving chip; an external optical signal is transmitted along the second optical fiber collimator and the second collimating lens to the optical demultiplexing assembly, the optical demultiplexing assembly is used to decompose the external optical signal into individual optical beams, and the decomposed optical beams are respectively transmitted to the refracting portion; the refracting portion is used to bend the transmission direction of each optical beam toward the optical receiving chip; The optical demultiplexing assembly and the optical multiplexing assembly are stacked, and there is a difference between the height of the light inlet of the refraction portion and the height of the light outlet of the laser, so that the optical path between the optical demultiplexing assembly and the refraction portion and the optical path between the optical multiplexing assembly and the laser are in relatively upper and lower positions; and the light inlet of the optical demultiplexing assembly and the light outlet of the optical multiplexing assembly are located on both sides.

6. The optical module according to claim 5, characterized in that The surfaces of the carriers are respectively formed with: A first carrying area, used for carrying the second optical fiber collimator and the second collimating lens respectively; A second bearing area is used to respectively bear the lasers; the second bearing area is set as a recessed area so that the surface of the laser is flush with the surface of the circuit board; a third bearing area, provided between the first bearing area and the second bearing area, for bearing the optical multiplexing component; a fourth carrying area, for carrying the first converging lens; the fourth carrying area is provided on one side of the first carrying area, so that the first converging lens and the second collimating lens are located on both sides; a fifth carrying area, for carrying the first optical fiber collimator, wherein the fifth carrying area is provided on one side of the first carrying area so that the first optical fiber collimator and the second optical fiber collimator are located on both sides; The height of the first bearing area is higher than that of the third bearing area, the fourth bearing area, and the fifth bearing area.

7. The optical module according to claim 5, wherein: A second converging lens and the refractive portion are respectively provided on the light output path of the optical demultiplexing component, and a light inlet of the second converging lens faces the optical demultiplexing component; The second converging lens and the refraction portion are arranged on the surface of the support portion, so that the optical paths of the second converging lens and the refraction portion and the optical path of the optical demultiplexing component are on the same axis.

8. The optical module according to claim 5, wherein: The surface of the laser is flush with the surface of the circuit board; There is a preset distance between the optical path between the optical demultiplexing component and the refraction portion and the surface of the circuit board.

9. An optical module, characterized in that: include: A circuit board having a notch formed on its surface; A carrier is embedded in the notch; wherein the carrier includes a carrier shell and a carrier cover, the carrier cover is covered on the carrier shell; the carrier shell includes an insertion port, and the carrier is embedded in the notch through the insertion port; a sealing member disposed between the plug-in interface and the circuit board to seal a gap between the plug-in interface and the circuit board, so as to form a sealed cavity inside the carrier; The optical emitting component includes a laser, an optical multiplexing assembly and an emission adapter, wherein the laser and the optical multiplexing assembly are arranged on the bottom surface of the carrying shell; the emission adapter is embedded in the side surface of the carrying shell; The optical receiving component includes an optical receiving chip, an optical demultiplexing assembly and a receiving adapter. The optical receiving chip is arranged on the circuit board, the optical demultiplexing assembly and the optical multiplexing assembly are stacked, and the receiving adapter is embedded in the side of the carrying shell; there is a preset difference between the height of the light outlet of the transmitting adapter and the height of the light inlet of the receiving adapter, so that the optical path between the receiving adapter, the optical demultiplexing assembly and the optical receiving chip is arranged relative to the optical path between the laser, the optical multiplexing assembly and the transmitting adapter.

10. The optical module according to claim 9, wherein: The number of the transmitting adapter and the number of the receiving adapter are both two; Along a first direction, the two transmitting adapters are located below the two receiving adapters, and the first direction is a thickness direction of the circuit board; Along a second direction, the two transmitting adapters are located between the two receiving adapters, and the second direction is a width direction of the circuit board.

11. The optical module according to claim 9, wherein: The light emitting component further includes a TEC, a first collimating lens and a first converging lens; Along the third direction, the bottom of the carrying housing includes a first mounting groove, a second mounting groove and a third mounting groove arranged in sequence; the third direction is the length direction of the circuit board; The laser and the first collimating lens are arranged on the TEC via a first ceramic gasket, and the TEC is arranged in the first mounting groove; the first collimating lens is arranged in the optical path of the laser; wherein the laser is used to generate 8 optical signals; The TEC is used to transfer the heat of the laser to the bottom of the carrier; The optical multiplexing assembly is arranged in the second mounting slot; the optical multiplexing assembly is used to combine the 8 optical signals into 2 optical signals; The first converging lens is disposed in the third mounting slot, and the first converging lens is used to transmit the two optical signals to the transmitting adapter; Wherein, the groove depths of the first installation groove, the second installation groove and the third installation groove decrease in sequence.

12. The optical module according to claim 11, wherein: The optical receiving component further includes a supporting portion and a refracting portion. The supporting portion is provided on the circuit board. The refracting portion is provided on the surface of the supporting portion. The refracting portion is used to turn the external optical signal output by the optical demultiplexing component toward the surface of the optical receiving chip.

13. The optical module according to claim 12, wherein: The light receiving component further includes a second collimating lens; The bearing housing further includes two mounting platforms; the two mounting platforms are arranged on opposite sides of the third mounting slot along the second direction; The second collimating lens is arranged on the mounting platform, and the second collimating lens is arranged corresponding to the receiving adapter; the second collimating lens is used to collimate the two external optical signals transmitted by the receiving adapter; The optical demultiplexing component is arranged on the optical multiplexing component through a second ceramic gasket; the optical demultiplexing component is used to convert the two external optical signals into eight external optical signals; The refracting portion is used to redirect the eight external optical signals to the optical receiving chip.

14. The optical module according to claim 11, wherein: The bearing housing includes a frame structure and a bottom structure, the bottom structure is provided with the first mounting slot, the second mounting slot, and the third mounting slot, and the frame structure and the bottom structure form the plug interface, and along the second direction, the first mounting slot, the second mounting slot, the third mounting slot, and the plug interface are arranged in sequence; The carrying shell is installed behind the circuit board. Along the first direction, the frame structure is located on the circuit board, and the bottom structure is located under the circuit board.

15. The optical module according to claim 14, wherein: The frame structure includes a first sub-frame, a second sub-frame and a contraction portion, one end of the contraction portion is connected to the first sub-frame, and the other end contracts inward toward the central axis of the load-bearing shell and connects to the second sub-frame; the bottom structure is connected to the second sub-frame.

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