Conductive column connecting structure for chip stacking

Abstract

The invention relates to the technical field of semiconductors, in particular to a conductive column connecting structure for chip stacking, and aims to solve the problem that a top chip is inconvenient to limit, the conductive column connecting structure comprises a substrate, two groups of connecting holes are formed in the upper surface of the substrate, a first chip assembly is arranged above the substrate, and a second chip assembly is arranged above the first chip assembly. A second chip assembly is arranged above the first chip assembly, and a limiting assembly is arranged above the substrate. Through arrangement of the first connecting columns and the connecting holes, the two first connecting chips can be connected with the substrate, through cooperation of the supporting rods, the second connecting columns and the through grooves, the second connecting chips can be connected with the first connecting chips, and the second connecting chips can be limited through the limiting plates, the limiting rods and the limiting holes; the second connection chip is prevented from inclining, the stability of the first conductive column and the second conductive column after connection is ensured, inclination and deviation during welding are avoided, and therefore the stability of a circuit after welding is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a conductive column connection structure for chip stacking. Background Art

[0002] Semiconductors are a type of material between conductors and insulators. Their electrical conductivity can be adjusted by factors such as doping, temperature, or electric field. Common semiconductor materials include silicon (Si) and germanium (Ge). An important characteristic of semiconductors is that their conductivity is not fixed, but can change according to external conditions. This makes semiconductors widely used in electronic devices such as transistors, diodes, integrated circuits, etc. Conductive pillars are needed to connect the chips when stacking them.

[0003] Although the current chip conductive pillars can connect the chips when in use, there are still some shortcomings in actual use. For example, in actual use, it is not convenient to limit the top chip. Once the top chip is misaligned during welding, the conductive pillar will be tilted, resulting in unstable connection at the welding point and the risk of short circuit.

[0004] Based on this, the present invention designs a conductive column connection structure for chip stacking to solve the problem. Summary of the Invention

[0005] An object of the present invention is to provide a conductive pillar connection structure for chip stacking, so as to solve the problem in the above-mentioned background technology that it is inconvenient to limit the top chip.

[0006] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a conductive column connection structure for chip stacking, comprising a substrate, wherein two groups of connection holes are provided on the upper surface of the substrate, a first chip assembly is provided above the substrate, a second chip assembly is provided above the first chip assembly, and a limiting assembly is provided above the substrate.

[0007] Preferably, the first chip assembly includes two first connecting chips arranged above the substrate, and a group of first conductive columns are fixedly installed on the side of the two first connecting chips away from each other, and the bottom ends of the two groups of first conductive columns extend to the interior of the two groups of connecting holes respectively, and a group of second conductive columns are fixedly installed on the side of the two first connecting chips away from each other.

[0008] Preferably, the second chip assembly includes a second connecting chip arranged above the substrate, and two groups of support rods are fixedly installed on the bottom surface of the second connecting chip, and connecting blocks are fixedly installed on the side surfaces of the two groups of support rods away from each other, and a slot adapted for the second conductive column is provided on the upper surface of each of the connecting blocks, and the top ends of the two groups of second conductive columns respectively pass through the two groups of slots and extend above the two groups of slots.

[0009] Preferably, the limiting assembly includes a column installed on the upper surface of the base plate, a limiting plate is fixedly installed on the upper surface of the column, a group of limiting holes are opened on the upper surface of the limiting plate, and a limiting rod is slidably installed on the inner wall of each limiting hole, and the top end of each limiting rod is fixedly installed on the bottom surface of the second connecting chip.

[0010] Preferably, a retaining ring is fixedly mounted on the outer surface of the column, and the bottom end of each of the limiting rods is in contact with the upper surface of the retaining ring.

[0011] Preferably, a positioning ring is fixedly mounted on the outer surface of each first conductive pillar and the outer surface of each second conductive pillar, and the sides of the two groups of positioning rings close to each other are fixedly mounted on the sides of the two first connection chips away from each other.

[0012] Preferably, two cross support plates are fixedly mounted on the upper surface of the substrate, and the left and right side surfaces of the two cross support plates are respectively in contact with the side surfaces of the two first connection chips that are close to each other.

[0013] Compared with the prior art, the beneficial effects of the present invention are: by providing a first connecting column and a connecting hole, the two first connecting chips can be connected to the substrate, and by utilizing the cooperation of the support rod, the second connecting column and the through groove, the second connecting chip can be connected to the first connecting chip, and the second connecting chip can be limited by the limiting plate, the limiting rod and the limiting hole to prevent the second connecting chip from tilting, ensuring the stability of the first conductive column and the second conductive column after connection, avoiding tilting and deviation during welding, thereby improving the stability of the circuit after welding. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0015] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0016] Figure 2 It is a schematic diagram of the three-dimensional structure of the side view of the present invention;

[0017] Figure 3 This is a schematic diagram of the split structure of the present invention;

[0018] Figure 4 It is a schematic diagram of the three-dimensional structure of the limiting component of the present invention.

[0019] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0020] 1. Substrate; 101. Connecting hole; 2. First chip assembly; 201. First connecting chip; 202. First conductive column; 203. Second conductive column; 204. Positioning ring; 3. Limiting assembly; 301. Column; 302. Limiting plate; 303. Limiting hole; 304. Limiting rod; 305. Retaining ring; 4. Second chip assembly; 401. Second connecting chip; 402. Support rod; 403. Connecting block; 404. Slot; 5. Cross support plate. DETAILED DESCRIPTION

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0022] See also Figures 1 to 4 The present invention provides a technical solution: a conductive column connection structure for chip stacking, comprising a substrate 1, two groups of connection holes 101 are opened on the upper surface of the substrate 1, a first chip component 2 is provided above the substrate 1, a second chip component 4 is provided above the first chip component 2, and a limit component 3 is provided above the substrate 1.

[0023] See also Figure 2 The first chip assembly 2 includes two first connecting chips 201 arranged above the substrate 1. A group of first conductive pillars 202 are fixedly installed on the side of the two first connecting chips 201 away from each other. The bottom ends of the two groups of first conductive pillars 202 extend into the inside of the two groups of connecting holes 101 respectively. A group of second conductive pillars 203 are fixedly installed on the side of the two first connecting chips 201 away from each other. Through the cooperation of the first conductive pillars 202 and the connecting holes 101, the two first connecting chips 201 can be connected to the substrate 1.

[0024] See also Figure 3The second chip assembly 4 includes a second connecting chip 401 arranged above the substrate 1. Two groups of support rods 402 are fixedly installed on the bottom surface of the second connecting chip 401. A connecting block 403 is fixedly installed on the side of the two groups of support rods 402 away from each other. The upper surface of each connecting block 403 is provided with a slot 404 adapted to the second conductive column 203. The top ends of the two groups of second conductive columns 203 respectively pass through the two groups of slots 404 and extend above the two groups of slots 404. Through the cooperation of the slots 404, the connecting block 403 and the support rods 402, the second conductive column 203 can be connected to the second connecting chip 401, so that the staff can connect the second connecting chip 401 to the first connecting chip 201.

[0025] See also Figure 4 The limiting component 3 includes a column 301 installed on the upper surface of the substrate 1, and a limiting plate 302 is fixedly installed on the upper surface of the column 301. A group of limiting holes 303 are opened on the upper surface of the limiting plate 302. The inner wall of each limiting hole 303 is slidably installed with a limiting rod 304, and the top of each limiting rod 304 is fixedly installed with the bottom surface of the second connecting chip 401. By inserting the limiting rod 304 into the limiting hole 303, the limiting rod 304 can cooperate with the limiting hole 303 and the limiting plate 302 to limit the second connecting chip 401 to prevent the second connecting chip 401 from sliding.

[0026] See also Figure 4 A retaining ring 305 is fixedly installed on the outer surface of the column 301, and the bottom end of each limiting rod 304 contacts the upper surface of the retaining ring 305, and the limiting rod 304 can be limited by the retaining ring 305.

[0027] See also Figure 2 A positioning ring 204 is fixedly installed on the outer surface of each first conductive pillar 202 and the outer surface of each second conductive pillar 203. The sides of the two sets of positioning rings 204 that are close to each other are fixedly installed on the sides of the two first connection chips 201 that are away from each other. The positioning rings 204 can reinforce the first conductive pillars 202 and the second conductive pillars 203 to prevent them from loosening.

[0028] See also Figure 1 Two cross support plates 5 are fixedly installed on the upper surface of the substrate 1. The left and right side surfaces of the two cross support plates 5 are respectively in contact with the side surfaces of the two first connection chips 201 that are close to each other. The cross support plates 5 can limit the two first connection chips 201 to prevent the two first connection chips 201 from approaching each other.

[0029] The implementation principle of the conductive column connection structure of a chip stack in the embodiment of the present application is: when in use, first move the two first connecting chips 201 to the top of the substrate 1, then push the first connecting chip 201 to insert the first conductive column 202 into the inside of the connecting hole 101, and then start moving the second connecting chip 401 to the top of the substrate 1, and then align the limiting rod 304 with the limiting hole 303 so that the limiting rod 304 can be inserted into the inside of the limiting hole 303, and as the second connecting chip 401 moves downward, the second connecting chip 401 can push the support rod 402 to move downward, so that the slot 404 is sleeved on the outside of the second conductive column 203, and the limiting rod 304 and the limiting hole 303 can limit the second connecting chip 401, effectively preventing the second connecting chip 401 from sliding, and ensuring that the first conductive column 202 and the second conductive column 203 can remain stable during welding.

[0030] The drawings in this application are for illustrative purposes only. The sizes and shapes of the components shown are not intended to be limiting, but are merely for illustrative purposes. In actual implementation, the components may be appropriately configured and adjusted based on specific needs and actual conditions.

[0031] Throughout this specification, references to terms such as "one embodiment," "example," or "specific example" indicate that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0032] The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the present invention to the specific embodiments described. Obviously, many modifications and variations are possible based on the content of this specification. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A conductive pillar connection structure for chip stacking, comprising a substrate (1), characterized in that: Two groups of connection holes (101) are provided on the upper surface of the substrate (1); a first chip assembly (2) is provided above the substrate (1); a second chip assembly (4) is provided above the first chip assembly (2); and a limit assembly (3) is provided above the substrate (1).

2. The conductive pillar connection structure for chip stacking according to claim 1, wherein: The first chip assembly (2) comprises two first connection chips (201) arranged above the substrate (1); a group of first conductive pillars (202) are fixedly mounted on the side of the two first connection chips (201) away from each other; the bottom ends of the two groups of first conductive pillars (202) extend into the interiors of the two groups of connection holes (101), respectively; and a group of second conductive pillars (203) are fixedly mounted on the side of the two first connection chips (201) away from each other.

3. The conductive pillar connection structure for chip stacking according to claim 2, wherein: The second chip assembly (4) comprises a second connecting chip (401) arranged above the substrate (1); two groups of support rods (402) are fixedly mounted on the bottom surface of the second connecting chip (401); connecting blocks (403) are fixedly mounted on the side surfaces of the two groups of support rods (402) that are away from each other; a slot (404) adapted to the second conductive column (203) is provided on the upper surface of each connecting block (403); and the top ends of the two groups of second conductive columns (203) respectively penetrate the two groups of slots (404) and extend above the two groups of slots (404).

4. The conductive pillar connection structure for chip stacking according to claim 3, wherein: The limiting assembly (3) comprises a column (301) mounted on the upper surface of the base plate (1); a limiting plate (302) is fixedly mounted on the upper surface of the column (301); a group of limiting holes (303) are opened on the upper surface of the limiting plate (302); a limiting rod (304) is slidably mounted on the inner wall of each limiting hole (303); and the top end of each limiting rod (304) is fixedly mounted on the bottom surface of the second connecting chip (401).

5. The conductive pillar connection structure for chip stacking according to claim 4, wherein: A retaining ring (305) is fixedly mounted on the outer surface of the column (301), and the bottom end of each of the limiting rods (304) is in contact with the upper surface of the retaining ring (305).

6. The conductive pillar connection structure for chip stacking according to claim 1, wherein: A positioning ring (204) is fixedly mounted on the outer surface of each first conductive column (202) and the outer surface of each second conductive column (203), and the sides of the two sets of positioning rings (204) that are close to each other are fixedly mounted on the sides of the two first connection chips (201) that are away from each other.

7. The conductive pillar connection structure for chip stacking according to claim 1, wherein: Two cross support plates (5) are fixedly mounted on the upper surface of the base plate (1), and the left and right side surfaces of the two cross support plates (5) are respectively in contact with the side surfaces of the two first connection chips (201) that are close to each other.

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