Laser emission module and electronic device

Abstract

The invention relates to the technical field of integrated circuits, in particular to a laser emission module and an electronic device. The laser emission module comprises a substrate; the supporting frame is located on one side of the base plate, and a containing cavity is formed between the supporting frame and the base plate; the laser chip is positioned in the accommodating cavity; the optical sheet is located on the side, away from the substrate, of the supporting frame, and the orthographic projection of the optical sheet on the substrate covers the orthographic projection of the laser chip on the substrate. According to the invention, the laser chip and the optical sheet are integrated on the substrate, so that the laser emission module with a small size can be formed. The laser emission module provided by the invention is compact in size, so that the laser emission module can adapt to the small-size development trend of consumer electronics such as AR / VR and the like or vehicle-mounted applications. Moreover, the laser emission module provided by the invention can be used for integrally packaging products, so that the process production cost is saved, the process links are reduced, and the straight-through yield is improved.

Description

Technical Field

[0001] The present application relates to the field of integrated circuit technology, and in particular to a laser emission module and an electronic device. Background Art

[0002] ToF (Time of Flight) cameras are a type of LiDAR (Light Detection and Ranging) technology. ToF cameras primarily emit light pulses directly toward the object being measured. These light waves are reflected by impenetrable objects. By receiving a single point position and measuring the time interval between the emitted and reflected light, the light's flight time is determined. This allows the distance between the light source and the object to be calculated, creating a point cloud image and ultimately a 3D model of the object being measured. This makes ToF cameras unaffected by ambient lighting conditions, allowing them to operate efficiently even at night or in low light, strong light, rain, snow, or dusty conditions. Consequently, ToF cameras are widely used in mobile phones, vehicles, robots, smart door locks, AR / VR, IoT, and other fields.

[0003] However, in traditional TOF camera manufacturing, the process typically begins with encapsulating a semi-finished TOF bare module (primarily consisting of a substrate, VCSEL, PD, diffuser, etc.), which is then assembled with a receiving IR camera to form a TOF camera module. TOF bare modules are manufactured using techniques such as surface mount technology (SMT), which makes the TOF bare module manufacturing process inefficient. Summary of the Invention

[0004] Based on this, it is necessary to provide a laser emission module and an electronic device to address the problem of low efficiency in the preparation process of TOF bare modules in the prior art.

[0005] In order to achieve the above objectives, a laser emission module is provided, comprising:

[0006] substrate;

[0007] A support frame is located on one side of the substrate, and a receiving cavity is formed between the support frame and the substrate;

[0008] A laser chip is located in the accommodating cavity;

[0009] The optical sheet is located on a side of the support frame away from the substrate, and the orthographic projection of the optical sheet on the substrate covers the orthographic projection of the laser chip on the substrate.

[0010] In one embodiment, the laser emission module includes a plurality of the laser chips and a plurality of the optical sheets, at least two of the optical sheets have different optical functions, and each of the optical sheets is correspondingly arranged to each of the laser chips.

[0011] In one embodiment, the laser emission module further includes:

[0012] The first detection circuit is located on a side of the optical sheet away from the substrate, and is used to detect a working condition of the optical sheet.

[0013] In one embodiment, the first detection circuit includes a detection circuit and conductive glue. The detection circuit is arranged on a side of the optical sheet away from the substrate, and the conductive glue connects two ends of the detection circuit.

[0014] In one embodiment, the optical sheet includes a central area and a peripheral area surrounding the central area, and the detection circuit is disposed in the peripheral area.

[0015] In one embodiment, the optical sheet includes a central area and a peripheral area surrounding the central area, and the detection circuit is at least partially disposed in the central area and at least partially disposed in the peripheral area.

[0016] In one embodiment, at least a portion of the detection circuits located in the central area are in a square wave shape.

[0017] In one embodiment, the laser emission module further includes:

[0018] The second detection circuit is located on one side of the substrate and in the accommodating cavity, and the orthographic projection of the optical sheet on the substrate covers the orthographic projection of the second detection circuit on the substrate. The second detection circuit is used to detect the working condition of the optical sheet.

[0019] In one embodiment, the laser emission module further includes:

[0020] A driving chip is located on one side of the substrate and in the accommodating cavity, and the driving chip is used to adjust the laser chip.

[0021] On the other hand, an electronic device is also provided, which includes a camera module and a laser emission module as described in any one of the aforementioned embodiments, and the camera module and the laser emission module are arranged opposite to each other.

[0022] The laser emission module and electronic device of the present application have the following beneficial effects: First, by integrating the laser chip and the optical sheet onto the substrate, the integration level is increased, and a smaller laser emission module can be formed, which helps to reduce parasitic parameters. Furthermore, the laser emission module in the present application can also have better pulse performance. The laser emission module in the present application is compact in size, and can adapt to the development trend of small size for consumer electronics or vehicle-mounted applications such as AR / VR. Moreover, the laser emission module in the present application saves process production costs, reduces process links, and improves direct-through yield by integrating the product into one package. At the same time, in the present application, by setting an integrated integrated laser emission module, it can also facilitate client assembly and simplify the client production process. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 A schematic diagram of the laser emission module provided in the first embodiment;

[0025] Figure 2 A schematic diagram of a laser emission module provided in a second embodiment;

[0026] Figure 3 A schematic diagram of a laser emission module provided in a third embodiment;

[0027] Figure 4 A schematic diagram of a laser emission module provided in a fourth embodiment;

[0028] Figure 5 is a schematic diagram of a substrate provided in one embodiment;

[0029] Figure 6 is a schematic diagram of an optical sheet provided in one embodiment;

[0030] Figure 7 is a schematic diagram of a laser chip provided in one embodiment;

[0031] Figure 8 is a schematic diagram of a first detection circuit provided in one embodiment;

[0032] Figure 9 is a schematic diagram of a first detection circuit provided in another embodiment;

[0033] Figure 10This is a light spot test diagram of a laser emission module provided in one embodiment;

[0034] Figure 11 A viewing angle test chart provided in an embodiment;

[0035] Figure 12 A viewing angle test chart provided in another embodiment;

[0036] Figure 13 A peak optical power test diagram provided in an embodiment;

[0037] Figure 14 This is an optical waveform test diagram provided in an embodiment.

[0038] Explanation of the accompanying drawings: laser emission module-100; substrate-110; support frame-120; laser chip-130; optical sheet-140; driver chip-150; capacitor-160; first detection circuit-170; detection circuit-171; first line segment-1711; second line segment-1712; conductive glue-172; second detection circuit-180.

[0039] In order to better describe and illustrate the embodiments and / or examples of the inventions disclosed herein, reference may be made to one or more of the accompanying drawings. The additional details or examples used to describe the accompanying drawings should not be considered to limit the scope of the disclosed inventions, the presently described embodiments and / or examples, and any of the best modes currently understood for these inventions. DETAILED DESCRIPTION

[0040] To facilitate understanding of the present application, a more comprehensive description of the present application will be provided below with reference to the accompanying drawings. The drawings illustrate preferred embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present disclosure.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0042] In each embodiment, unless otherwise specified or limited, the terms "installed," "connected," "connected," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two elements, or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in each embodiment based on the specific circumstances.

[0043] It should be understood that when an element or layer is referred to as being "on," "adjacent to," or "connected to" another element or layer, it can be directly on, adjacent to, or connected to the other element or layer, or there can be intervening elements or layers. Conversely, when an element is referred to as being "directly on," "directly adjacent to," or "directly connected to" another element or layer, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are merely used to distinguish one element, component, region, layer, or portion from another element, component, region, layer, or portion. Therefore, without departing from the teachings of the present embodiments, the first element, component, region, layer, doping type, or portion discussed below may be represented as a second element, component, region, layer, or portion.

[0044] Spatially relative terms such as "below," "beneath," "beneath," "above," "above," etc., may be used herein to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that in addition to the orientations shown in the figures, spatially relative terms also include different orientations of the device in use and operation. For example, if the device in the drawings is turned over, an element or feature described as "below" or "beneath" or "beneath" the other elements will be oriented "above" the other elements or features. Thus, the exemplary terms "below" and "below" can include both the above and below orientations. In addition, the device can also include alternative orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are to be interpreted accordingly.

[0045] As used herein, the singular forms "a," "an," and "the" may also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that when the terms "comprising" and / or "including" are used in this specification, they may specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. At the same time, when used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0046] While embodiments of the present invention are described herein with reference to schematic diagrams that represent idealized embodiments (and intermediate structures) of the present invention, variations from the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are to be expected. Accordingly, embodiments of the present invention should not be limited to the specific shapes of regions illustrated herein but are intended to encompass deviations in shapes due to, for example, manufacturing techniques. The regions shown in the figures are schematic in nature, and their shapes do not represent the actual shapes of regions of a device and do not limit the scope of the embodiments of the present invention.

[0047] In one embodiment, see Figures 1 to 4 This embodiment provides a laser emission module 100 . The laser emission module 100 at least includes a substrate 110 , a support frame 120 , a laser chip 130 , and an optical sheet 140 .

[0048] The material of the substrate 110 may include ceramic materials such as aluminum nitride, aluminum oxide, beryllium oxide, silicon nitride, silicon carbide, etc., or organic materials such as FR4 / PI / BT / ABF. Figure 5 The substrate 110 may be a single-layer structure or a multi-layer structure. As an example, the substrate 110 may include 14 layers of aluminum nitride ceramic plates. This embodiment does not limit the specific composition of the substrate 110. In this embodiment, by routing wires within the substrate 110, not only can the established circuit functions be achieved, but also lower parasitic resistance and parasitic inductance can be achieved, meeting the high-speed performance requirements of the laser emission module 100.

[0049] The material of the support frame 120 (Holder) can include plastics such as LCP, PMMA, PI, PC, and nylon, or other inorganic or organic materials. For example, the support frame 120 can be made of black plastic. Furthermore, metal conductive circuits can be provided inside the support frame 120. The support frame 120 is disposed on one side of the substrate 110. As an example, the support frame 120 can completely cover one side of the substrate 110, or it can cover a portion of the side of the substrate 110.

[0050] A receiving cavity is formed between the support frame 120 and the substrate 110. At this time, the laser chip 130 can be located in the receiving cavity. The laser emitted by the laser chip 130 can pass through the support frame 120 and be emitted to the side of the support frame 120 away from the substrate 110. As an example, the laser chip 130 may include a vertical cavity surface emitting laser (VCSEL) and the like. In addition, the laser chip 130 may also be a gallium arsenide / indium phosphide substrate semiconductor laser surface emitting chip or a related edge emitting chip. This embodiment is not limited to the type of laser chip 130. The wavelength of the laser chip 130 may be a visible light wavelength or an infrared wavelength (for example, the wavelength of the laser chip 130 may be 940 nm).

[0051] The optical sheet 140 (diffuser) is located on the side of the support frame 120 away from the substrate 110. For example, it can include a light homogenizer. For example, the optical sheet 140 can include an optical homogenization element such as a DOE / Metasurface metalens. The optical sheet 140 not only homogenizes the light beam but also creates different spot shapes, thereby making the energy distribution of the light beam more uniform and improving the quality of the light beam.

[0052] Furthermore, the orthographic projection of the optical sheet 140 on the substrate 110 can cover the orthographic projection of the laser chip 130 on the substrate 110 , thereby ensuring that all laser light emitted from the laser chip 130 can be emitted through the optical sheet 140 .

[0053] In addition, the laser emission module 100 may also include other electronic components, such as a driver chip 150 and a capacitor 160. For example, the driver chip 150, capacitor 160, and other electronic components may be located on one side of the substrate 110 and within the housing cavity. For example, the driver chip 150 may be used to adjust the frequency of the laser chip 130. The capacitor 160 may be used to store energy and supply power to the driver chip 150. For example, the laser emission module 100 may include multiple capacitors 160, which may be located on both sides of the driver chip 150. Capacitors 160 may be low-ESL (equivalent series inductance) capacitors or low-ESR (equivalent series resistance) capacitors. In this case, capacitor 160 may be located adjacent to the laser chip 130, with the positive plate of capacitor 160 connected to the positive pin of the laser diode (LD) of the laser emission module 100. This ensures the shortest discharge path from capacitor 160 to the laser chip 130, minimizing rise and fall times.

[0054] It is understood that the arrangement of the electronic components on the substrate 110 is not limited to the arrangement shown in the drawings, and the specific number, model and layout of the individual electronic components are determined according to specific functional requirements.

[0055] In this embodiment, by integrating the laser chip 130 and the optical sheet 140 onto the substrate 110, the integration level is increased, and a smaller laser emission module 100 can be formed, which helps to reduce parasitic parameters. Furthermore, the laser emission module 100 in the present application can also have better pulse performance (for example, the rise time and fall time (Rise / Fall Time) in the iTOF (Indirect TOF) solution can be achieved at the 0.5ns level). The laser emission module 100 in the present application is compact in size (for example, the length and width can be achieved at the 5mm*3mm level), which can adapt to the development trend of small size for consumer electronics or automotive applications such as AR / VR. Moreover, the laser emission module 100 in the present application saves process production costs, reduces process links, and improves direct-through yield by integrating the product into one package. At the same time, in the present application, by setting up an integrated laser emission module 100, it can also facilitate client assembly and simplify the client production process.

[0056] In one embodiment, see Figure 6 and Figure 7 The laser emission module 100 includes a plurality of laser chips 130 and a plurality of optical sheets 140 . At least two optical sheets 140 have different optical functions. Each optical sheet 140 is correspondingly arranged to each laser chip 130 .

[0057] As an example, the laser emission module 100 may include two laser chips 130 and two optical sheets 140. Specifically, the two optical sheets 140 may have different optical specifications, or the two optical sheets 140 may have different light uniformity effects. In this case, each optical sheet 140 is configured to correspond to each laser chip 130, so that the optical sheet 140 can be controlled to accurately disperse the laser light emitted by the corresponding laser chip 130.

[0058] In addition, this embodiment does not limit the specific number of laser chips 130 and optical sheets 140. For example, the laser emission module 100 may also include five or ten laser chips 130 and corresponding optical sheets 140.

[0059] In this embodiment, by setting multiple optical sheets 140 in the laser emission module 100, not only can the laser be homogenized multiple times to convert the laser beam into a light spot with more uniform energy distribution, but also customized homogenization processing can be performed for laser beams of different modes to adapt to different application requirements.

[0060] In one embodiment, the laser emission module 100 may further include a first detection circuit 170 .

[0061] The first detection circuit 170 can be located on the side of the optical sheet 140 away from the substrate 110. The first detection circuit 170 can be used to detect the operating condition of the optical sheet 140. For example, the first detection circuit 170 can include a detection circuit 171 and conductive adhesive 172. The detection circuit 171 can be located on the side of the optical sheet 140 away from the substrate 110. For example, the material of the detection circuit 171 can include a conductive material such as indium tin oxide (ITO). The conductive adhesive 172 can connect the two ends of the detection circuit 171, forming two electrodes for the detection circuit 171.

[0062] For a possible example, see Figure 8 , the optical sheet 140 includes a central area and an edge area surrounding the central area. In this case, the detection circuit 171 is set in the edge area. For example, the detection circuit 171 can extend along the edge area. This makes the preparation process of the detection circuit 171 simpler. In another possible example, please refer to Figure 9 , the detection circuit 171 is at least partially located in the central area and at least partially located in the edge area. In this case, at least the portion of the detection circuit 171 located in the central area can have a square wave shape. Specifically, the detection circuit 171 can include at least a plurality of first line segments 1711 and second line segments 1712 spaced apart from each other, wherein the first line segments 1711 extend along a first direction (X direction) and are arranged along the first direction, and the second line segments 1712 extend along a second direction (Y direction) and are arranged along the first direction. The second line segments 1712 can be at least partially located in the central area (i.e., the second line segments 1712 can extend from the edge area through the central area, or the second line segments 1712 can be located in the central area). The first line segment 1711 can be located in either the central area or the edge area. The first line segment 1711 connects two adjacent second line segments 1712 in the second direction, and the two ends of the first line segment 1711 are respectively connected to two adjacent second line segments 1712. The first direction and the second direction can be perpendicular. Furthermore, the detection circuit 171 in the central region may have a sinusoidal shape, etc. This embodiment does not limit the specific form of the detection circuit 171 (for example, the pattern of the detection circuit 171 may include straight lines, curves, patterns, etc.). This allows the detection circuit 171 to detect the operating conditions of the central region of the optical sheet 140.

[0063] In this embodiment, by disposing a first detection circuit 170 on a side of the optical sheet 140 away from the substrate 110, it is possible to detect in real time whether the optical sheet 140 has fallen off, thereby improving the operating stability of the laser emission module 100. Furthermore, the detection circuit 171 in this embodiment can have different forms to meet different detection requirements.

[0064] In one embodiment, the laser emission module 100 further includes a second detection circuit 180 .

[0065] See also Figure 1 and Figure 2 The second detection circuit 180 can be located on one side of the substrate 110 and in the accommodating cavity, and the orthographic projection of the optical sheet 140 on the substrate 110 covers the orthographic projection of the second detection circuit 180 on the substrate 110. The second detection circuit 180 is also used to detect the working condition of the optical sheet 140.

[0066] As an example, the second detection circuit 180 may include a photodiode (PD), etc. For example, the second detection circuit 180 may include semiconductor materials such as silicon / germanium / indium telluride / indium gallium arsenide phosphide (InGaAs) / gallium arsenide (GaAs). Specifically, at this time, the second detection circuit 180 can receive light reflected by the optical sheet 140. If the optical sheet 140 is in poor working condition (for example, the optical sheet 140 is damaged or detached), the light received by the second detection circuit 180 will change. Furthermore, the photocurrent and operating temperature of the photodiode can be monitored by the driver chip 150, thereby automatically adjusting the optical power of the laser chip 130 to form a fully functional adaptive laser emission module.

[0067] In this embodiment, the second detection circuit 180 is provided in the accommodating cavity to further detect the working condition of the optical sheet 140 , thereby improving the working stability of the laser emission module 100 .

[0068] Based on the same inventive concept, the present application provides an electronic device. The electronic device includes a camera module and a laser emission module 100 provided in any of the aforementioned embodiments. The camera module and the laser emission module 100 can be arranged opposite each other. As an example, the laser emission module 100 can be arranged on one side of the camera module. The camera module can include a receiving-end IR camera, etc.

[0069] In this embodiment, the laser emitting module 100 is first formed and then disposed on one side of the camera module, thereby improving the manufacturing efficiency of the electronic device.

[0070] After testing the multiple laser emission modules 100 provided in this application, the following can be obtained: Figures 10 to 14 The results are shown in . Figure 10 After measuring the light spot shown (the field of view (FOV) is 89°*73°), we can get Figure 11 and Figure 12 The peak test graph (Full Width at Half Maximum, FWHM) shown in the figure. Figure 11 For Figure 10 Peak test chart measured in the X direction, Figure 12 For Figure 10 Peak value test chart for measurement in the Y direction. Figure 13 After testing the photoelectric performance of multiple laser emission modules 100 provided in this application, the photoelectric conversion efficiency (PCE) can be greater than 50% under the conditions of temperature of 60°C, pulse width of 100μs, and period of 2.5mS. Figure 13 When the current is 1.6A, the optical power output of the device is 2.5W; when the current is 2.7A, the optical power output of the device is 4.5W. Figure 14 After performing optical waveform testing on multiple laser emission modules 100 provided in this application, the rise time (Rise Time) and fall time (Fall Time) of the waveform can reach 500ps.

[0071] Based on this, the laser emission module 100 provided in one or more embodiments of this application integrates a driver chip 150 and a photodiode to precisely calibrate the optical output power, achieve automatic power control, and detect laser safety issues (e.g., lens drop, skin contact, etc.). Furthermore, in this application, a detection circuit 171 (ITO thin film) is etched on the surface of the optical sheet 140 to implement on / off monitoring. Photodiode current monitoring and detection circuit 171 protection are used to achieve dual eye protection. Furthermore, in this application, the optical sheet 140 can be designed with a dual-zone or multi-zone microlens array structure based on actual needs. Using the driver chip 150 and host computer integrated software, two or more zones of the field of view angle spot can be independently controlled. Furthermore, the laser emission module 100 in this application also provides automatic power control (APC) to ensure laser safety. It can also integrate a temperature sensor to automatically adjust the current or shut down when safety issues or high temperature risks are encountered, preventing device damage and human injury. The laser emission module 100 in this application has good pulse performance. By embedding the driver chip 150 in the accommodating cavity and designing a low-inductance packaging structure in the same package, it helps to reduce the module parasitic effects and heat loss, and achieve ps-level modulated pulse width response. In addition, the overall size of the laser emission module 100 in this application is greatly reduced compared to conventional solutions. The length and width dimensions can be achieved at the level of 5mm*3mm (for example, 3.6mm*5.46mm), and the thickness can be adjusted according to needs. In addition, the laser emission module 100 in this application can also have a serial peripheral interface (SPI) interface, which is suitable for photography, AR games, object scanning applications and other occasions.

[0072] In the description of this application, the reference terms "some embodiments", "other embodiments", "ideal embodiments", etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this application, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that "this embodiment" or "one embodiment" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment.

[0073] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features of the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of the present application.

[0074] The embodiments described above only express several implementation methods of the present application, and their descriptions are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that for ordinary technicians in this field, without departing from the concept of the present application, several variations and improvements can be made, which all fall within the scope of protection of the present application. Therefore, the scope of protection of the patent in this application shall be based on the attached claims. The above description is only the preferred implementation method of the present application, and does not limit the scope of the patent in this application. All equivalent structural transformations made by using the contents of the description and drawings of this application under the inventive concept of this application, or direct / indirect application in other related technical fields are included in the scope of protection of the patent in this application.

Claims

1. A laser emission module, characterized in that: include: substrate; A support frame is located on one side of the substrate, and a receiving cavity is formed between the support frame and the substrate; A laser chip is located in the accommodating cavity; The optical sheet is located on a side of the support frame away from the substrate, and the orthographic projection of the optical sheet on the substrate covers the orthographic projection of the laser chip on the substrate.

2. The laser emission module according to claim 1, characterized in that: The laser emission module includes a plurality of the laser chips and a plurality of the optical sheets, at least two of the optical sheets have different optical functions, and the optical sheets are arranged in a one-to-one correspondence with the laser chips.

3. The laser emission module according to claim 1, characterized in that: The laser emission module also includes: The first detection circuit is located on a side of the optical sheet away from the substrate, and is used to detect a working condition of the optical sheet.

4. The laser emission module according to claim 3, characterized in that: The first detection circuit includes a detection circuit and conductive glue. The detection circuit is arranged on a side of the optical sheet away from the substrate, and the conductive glue connects two ends of the detection circuit.

5. The laser emission module according to claim 4, characterized in that: The optical sheet includes a central area and a peripheral area surrounding the central area, and the detection circuit is arranged in the peripheral area.

6. The laser emission module according to claim 4, characterized in that: The optical sheet includes a central area and a peripheral area surrounding the central area. The detection circuit is at least partially disposed in the central area and at least partially disposed in the peripheral area.

7. The laser emission module according to claim 6, characterized in that: At least a portion of the detection circuit located in the central area is in a square wave shape.

8. The laser emission module according to claim 1, characterized in that: The laser emission module also includes: The second detection circuit is located on one side of the substrate and in the accommodating cavity, and the orthographic projection of the optical sheet on the substrate covers the orthographic projection of the second detection circuit on the substrate. The second detection circuit is used to detect the working condition of the optical sheet.

9. The laser emission module according to claim 1, characterized in that: The laser emission module also includes: A driving chip is located on one side of the substrate and in the accommodating cavity, and the driving chip is used to adjust the laser chip.

10. An electronic device, characterized in that: The electronic device includes a camera module and a laser emission module as described in any one of claims 1 to 9, and the camera module and the laser emission module are arranged opposite to each other.

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