Metal matrix embedding process, circuit board and embedded metal matrix product
Patent Information
- Application Number
- CN202510828709.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-19
- Publication Date
- 2025-09-19
Smart Images
Figure CN120676540A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of circuit board production, and in particular to a metal-based embedding process, a circuit board and an embedded metal-based product. Background Art
[0002] In the field of wireless communications PCB products, metal-based embedded heat dissipation has achieved mature application and become the mainstream solution in the industry. However, with the continuous development of technology, the requirements for the thermal and electrical conductivity of metal-based materials have increased. For example, customers not only require the metal-based materials to be connected to the inner layers of the PCB, but also demand high current transmission capabilities, which traditional metal-based processes are unable to meet. Currently, the metal-based embedding process primarily involves directly connecting the metal base to the surface conductive layer, then combining it with a buried via structure. The copper inside the buried via connects to the surface conductive layer, thereby achieving conductivity between the metal base and the inner conductive layer. However, this approach has significant limitations when it comes to high-current transmission and cannot meet the performance requirements of each layer for high-current transmission. Summary of the Invention
[0003] Based on this, it is necessary to provide a metal-based embedding process, circuit board and embedded metal-based product to address the above technical problems, so as to achieve large-area electrical connectivity between each conductive layer and the metal base, and meet the needs of each conductive layer to transmit large current through the metal base.
[0004] In the first aspect, a metal-based embedding process is provided, comprising: metallizing the sidewalls of a metal-based groove on a substrate; superimposing a conductive adhesive material between a plurality of metal-based substructures to obtain a metal base superimposed with the conductive adhesive material, and placing the metal base into the metallized metal-based groove to obtain a laminated plate; laminating the laminated plate so that the conductive adhesive material can fill the first gap between the metal base and the metal-based groove during the lamination process to achieve bonding and conduction between the metal base and the metal-based groove.
[0005] In an embodiment of the present application, the conductive adhesive material is superimposed among multiple metal-based substructures to obtain a metal base superimposed with the conductive adhesive material, including: placing the conductive adhesive material in a second gap between different metal-based substructures, and the second gap can be connected to the first gap after the metal base is placed in the metal base groove.
[0006] In an embodiment of the present application, the plurality of metal-based substructures include a boss metal-based substructure and at least one U-shaped metal-based substructure, and the boss metal-based substructure and the U-shaped metal-based substructure are nested with each other.
[0007] In an embodiment of the present application, the number of the U-shaped metal-based substructures is greater than 1, and the U-shaped surface of each of the U-shaped metal-based substructures has the same size.
[0008] In an embodiment of the present application, the plurality of metal-based substructures include multiple layers of metal plates having the same cross-sectional size, and the cross-sectional size is a horizontal cross-sectional size perpendicular to the depth direction of the metal-based groove.
[0009] In an embodiment of the present application, the conductive adhesive material includes conductive glue or conductive paste.
[0010] In an embodiment of the present application, before metallizing the sidewalls of the metal base groove on the substrate, the process further includes: pressing the core board and the prepreg sheet according to the designed structure to form the substrate; and machining a metal base groove on the substrate that passes through the substrate.
[0011] In an embodiment of the present application, after laminating the stacked plates, the process further includes: performing copper electroplating on the surface of the laminated plates to form a new surface copper layer.
[0012] In a second aspect, a circuit board is proposed, wherein the circuit board is manufactured based on the metal-based embedding process described in any embodiment.
[0013] In a third aspect, an embedded metal-based product is proposed, wherein the embedded metal-based product includes the circuit board described in the second aspect.
[0014] In any of the above-mentioned solutions, the sidewalls of the metal base grooves on the substrate for embedding the metal base are metallized so that each conductive layer in the substrate can communicate with the entire side of the metal base through the metallized sidewalls; then, a conductive adhesive material is stacked between the multiple metal base substructures to obtain a metal base stacked with the conductive adhesive material, and then the metal base is placed in the metal base grooves to obtain a laminated plate; and then, the laminated plate is laminated so that the conductive adhesive material can flow and fill the first gap between the metal base and the metal base grooves during the lamination process. The conductive adhesive material has both conductive and adhesive properties. Therefore, the conductive adhesive material filled between the metal base and the metal base groove can not only fix the metal base in the metal base groove, but also achieve electrical connection between the metallized sidewalls of the metal base groove and the metal base. In this way, each conductive layer in the substrate can be connected to the entire metal base. Compared with the prior art in which each inner conductive layer is first connected to the surface conductive layer through the copper holes in the buried vias, and then connected to the metal base through the surface conductive layer, the present application shortens the electrical connection path between each inner conductive layer and the metal base, and is no longer limited by the size of the buried vias. Through the metallized side walls of the metal base grooves and the conductive material fully filled in the first gap, large-area electrical connection between each conductive layer and the metal base is achieved, thereby meeting the performance requirements of each conductive layer for large current transmission. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.
[0016] Figure 1 A flow chart of a metal-based embedding process according to an exemplary embodiment of the present application is shown; Figure 2 A cross-sectional view of a substrate with a metal base placed thereon is shown as another exemplary embodiment of the present application; Figure 3 A cross-sectional view of a substrate with a metal base placed thereon is shown as another exemplary embodiment of the present application; Figure 4 It is a top view of the nested U-shaped metal substructure and the boss metal substructure; Figure 5 A cross-sectional view of a substrate with a metal base placed thereon is shown as another exemplary embodiment of the present application; Figure 6 A flow chart of a metal-based embedding process according to an exemplary embodiment of the present application is shown; Figure 7 Schematic diagram of stacking a core board and a prepreg shown in one embodiment of the present application; Figure 8 For Figure 7 A cross-sectional view of a substrate obtained by laminating a core board and a prepreg; Figure 9 For Figure 8 A cross-sectional view of the substrate after the substrate is milled; Figure 10 For Figure 9 A cross-sectional view of the substrate after metallization of the metal base groove sidewalls; Figure 11 For Figure 10 A cross-sectional view of the substrate after the metal base is placed in the metal base groove; Figure 12 For Figure 11 A cross-sectional view of the substrate after lamination; Figure 13 For Figure 12 The substrate is a cross-sectional view of the substrate after surface copper electroplating.
[0017] The reference numerals in the specification are as follows: 1. Metal substrate; 2. Conductive adhesive material; 3. U-shaped metal base structure; 4. Boss metal base structure; 5. Core board; 51. Surface copper layer of core board; 6. Prepreg; 7. Metal base groove; 71. Metallized side wall of metal base groove; 8. Surface copper layer. DETAILED DESCRIPTION
[0018] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments.
[0019] It should be understood that the embodiments set forth below represent the necessary information to enable those skilled in the art to implement the embodiments and to illustrate the best mode of implementing the embodiments. After reading the following description in light of the accompanying drawings, those skilled in the art will understand the concepts of the present disclosure and will recognize applications of these concepts not specifically mentioned herein. It should be understood that these concepts and applications fall within the scope of the present disclosure and the appended claims.
[0020] It should also be understood that the terms "upper", "lower", "left", "right", "front", "back", "bottom", "middle", "top", etc. may be used in this document to describe various elements, and the indicated orientation or position relationship is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, so these elements should not be restricted by these terms.
[0021] It is further understood that the terms “comprises” and “includes” when used herein specify the presence of stated features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.
[0022] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that the terms used herein should be interpreted as having a meaning consistent with their meaning in the context of this specification and the relevant art, and will not be interpreted in an idealized or overly formal sense unless expressly defined as such herein.
[0023] The metal base embedding process proposed in the embodiment of the present application can be used to make circuit boards for embedded metal base products. In order to meet the user's high requirements for the heat dissipation performance of the circuit board, in the current circuit board manufacturing process, a metal base is usually embedded in the substrate of the circuit board to dissipate heat. The current embedding process only embeds the metal base in the metal base groove and makes a conductive layer on the surface of the plate in which the metal base is embedded, so as to achieve conduction between the metal base and the surface conductive layer. If the metal base and the internal conductive layer need to be connected, a blind hole is processed in the plate by buried holes, and then the inner conductive layer and the surface conductive layer are connected through the copper holes, so that the surface conductive layer and the metal base can be connected. The circuit board made by this metal base embedding method is not convenient for transmitting large currents due to the size of the copper pillars in the buried holes. On the other hand, it is not convenient for transmitting large currents due to the electrical connection path from each inner conductive layer to the metal base. In addition, the manufacturing process is complicated and it is even more difficult to operate on a highly integrated circuit board with limited material space. To solve the above problems, the embodiment of the present application provides a metal base embedding process to ensure that the metal base embedded in the plate can be connected to each conductive layer over a large area to achieve large current transmission, and the operation process is simple and easier to implement.
[0024] Figure 1 This is a flow chart showing a metal-based embedding process according to an exemplary embodiment of the present application.
[0025] like Figure 1 As shown, the metal-based embedding process may include the following steps: S101, performing sidewall metallization on the metal base groove on the substrate.
[0026] For example, the grooved substrate is subjected to processing steps such as drill desmearing, copper deposition, and electroplating to metallize the sidewalls of the metal base groove 7. This allows electrical connection between the side copper of the inner conductive layer of the substrate and the sidewall copper layer of the metal base groove 7. The large conductive area of the sidewall copper layer ensures large-area electrical connection between the inner conductive layer and the metal base, thereby ensuring that the large current transmitted on the inner conductive layer can be transferred to the metal base.
[0027] S102, stacking a conductive adhesive material between multiple metal base substructures to obtain a metal base stacked with the conductive adhesive material, and placing the metal base into a metallized metal base groove to obtain a laminated plate.
[0028] In one example, the conductive adhesive material 2 can be stacked between two adjacent metal-based substructures in an alternating stacking sequence. For example, along the placement direction of the metal base within the metal-based groove 7, i.e., the depth direction of the metal-based groove 7, the metal-based substructure, the conductive adhesive material 2, the metal-based substructure, and so on, can be stacked alternately.
[0029] The conductive adhesive material 2 may be understood as a material having both conductive and adhesive properties. In one embodiment, the conductive adhesive material 2 may include but is not limited to conductive glue or conductive paste.
[0030] For example, conductive adhesive: usually composed of a resin matrix (such as epoxy resin, acrylic resin, etc.) and conductive fillers (such as silver powder, copper powder, carbon nanotubes, etc.).
[0031] Conductive paste: It is generally composed of conductive powder (such as metal powders such as silver, gold, copper, aluminum, or carbon powders such as carbon black and graphite), organic carriers (such as terpineol, ethyl cellulose, etc.) and additives (such as dispersants, binders, etc.).
[0032] It should be noted that the specific "stacking" process in this step will vary depending on the form of the conductive adhesive material 2 used. For example, if the conductive adhesive is semi-solid, then when stacking the conductive adhesive between two adjacent metal substructures, one metal substructure can be placed first, then the semi-solid conductive adhesive can be placed on the upper surface of the metal substructure, and then the other metal substructure can be placed. If the conductive adhesive is in a paste form, then when stacking the conductive adhesive between two adjacent metal substructures, one metal substructure can be placed first, then the conductive adhesive can be applied to the upper surface of the metal substructure, and then the other metal substructure can be placed.
[0033] The multiple metal-based substructures are obtained by segmenting the metal base and can be assembled to be completely embedded within the metal base groove 7. The volume of the metal base can be adjusted based on the desired thermal and electrical conductivity. For example, a single metal base can be pre-determined to match the spatial volume of the metal base groove 7. This metal base can then be segmented to obtain multiple metal-based substructures. During the metal-based embedding process, a conductive adhesive material 2 is superimposed between these metal-based substructures. The metal base with the superimposed conductive adhesive material 2 is then placed within the metal base groove 7 to completely embed the entire metal base within the metal base groove 7.
[0034] S103, laminating the stacked plates so that the conductive adhesive material can fill the first gap between the metal base and the metal base groove during the lamination process, so as to achieve bonding and conduction between the metal base and the metal base groove.
[0035] The stacked panels are laminated, specifically the metal base substructure and the conductive adhesive material 2 stacked within the metal base groove 7. During the lamination process, the conductive adhesive material 2 exhibits fluidity and gradually flows into the gap between the metal base and the metal base groove 7. For ease of description, this gap is referred to as the first gap.
[0036] For example, during the lamination process, as the temperature gradually increases and pressure is applied, the mobility of the resin molecules of the conductive adhesive gradually increases, the interaction between the resin and the metal particles will also change, and the conductive adhesive will gradually soften and show a certain fluidity, and can be filled into the first gap under the action of pressure. For example, for epoxy resin-based conductive adhesive, when the temperature rises to about 60-80°C and a pressure of 0.1-0.3MPa is applied at the same time, the conductive adhesive will begin to show obvious fluidity. It should be noted that this is only an exemplary description of the temperature and pressure values implemented in the lamination process, and it is not intended to limit it. In practice, the material composition of the conductive adhesive is different, and the temperature and pressure values and reaction time required to show fluidity and the curing reaction will also be different. The various parameters of the lamination process can be set as needed, and this application does not impose any restrictions.
[0037] After the conductive adhesive has been subjected to a period of heating and pressure, the resin will undergo a curing reaction, causing the viscosity of the conductive adhesive to increase rapidly and gradually lose fluidity. The metal particles are fixed in the resin structure, forming a stable conductive path.
[0038] In summary, the lamination process allows the conductive adhesive material 2 to fully fill the first gap between the metal base and the metal base groove 7, as well as any gaps between the metal base substructures. The cured conductive adhesive material 2 secures the multiple metal base substructures together and secures the multiple metal base substructures within the metal base groove 7. The conductivity of the conductive adhesive material 2 allows the sidewalls of the metal base groove 7 to communicate with any metal base substructure.
[0039] In the embodiment of the present application, the conductive adhesive material 2 is superimposed between two adjacent metal-based substructures and placed in the metal-based groove 7, and then the conductive adhesive material 2 is made to flow to the first gap by lamination. Compared with the method of inserting the conductive adhesive material 2 into the gap by plugging the hole after embedding the metal base, the embodiment of the present application is simple to operate and easier to implement. Moreover, due to the limitation of the fluidity of the conductive adhesive material, the method of inserting the conductive adhesive material into the gap after embedding the metal base will make it difficult to fully fill the first gap when the first gap depth is too long, so this method is difficult to apply on a multilayer board. However, the present application can adapt to the depth of the multilayer board by increasing the number of metal-based substructures, so that the conductive adhesive material can be placed at different depths of the metal-based groove, so that after lamination, the first gap can be filled with the conductive adhesive material. Therefore, the present application can be better applied on a multilayer board.
[0040] In summary, the embodiment of the present application provides a metal base embedding process, which first metallizes the sidewalls of the metal base groove on the substrate for embedding the metal base, so that each conductive layer in the substrate can be connected to the entire metal base side through the metallized sidewall; then, a conductive adhesive material is stacked between multiple metal base substructures to obtain a metal base stacked with a conductive adhesive material, and the metal base is placed in the metallized metal base groove to obtain a stacked plate; then, the stacked plate is laminated so that the conductive adhesive material can flow and fill the first gap between the metal base and the metal base groove during the lamination process. The conductive adhesive material has conductive and adhesive properties. Therefore, the conductive adhesive material filled between the metal base and the metal base groove can not only fix the metal base in the metal base groove, but also achieve conduction between the metallized sidewalls of the metal base groove and the metal base. In this way, each conductive layer in the substrate can be connected to the entire metal base. Compared with the prior art in which each inner conductive layer is first connected to the surface conductive layer through the copper holes in the buried vias, and then connected to the metal base through the surface conductive layer, the present application shortens the electrical connection path between each inner conductive layer and the metal base, and is no longer limited by the size of the buried vias. Through the metallized side walls of the metal base grooves and the conductive material fully filled in the first gap, large-area electrical connection between each conductive layer and the metal base is achieved, thereby meeting the performance requirements of each layer for large current transmission.
[0041] In one embodiment, the step S102 of "superimposing a conductive adhesive material between the plurality of metal-based substructures to obtain a metal-based groove superimposed with the conductive adhesive material" may be implemented by the following process: The conductive adhesive material 2 is placed in the second gap between different metal base substructures. The second gap can be connected to the first gap after the metal base is placed in the metal base groove 7.
[0042] When multiple metal-based substructures are stacked along the depth direction of the metal base groove 7, a second gap that can be connected to the first gap will exist between the two adjacent metal-based substructures in the depth direction of the metal base groove 7. It is only necessary to place the conductive adhesive material 2 in the second gap. During the lamination process, the conductive adhesive material 2 in the second gap will flow to the first gap and the gap between the adjacent metal-based substructures that is connected to the second gap.
[0043] In this way, the placement operation of the conductive adhesive material 2 can be simplified. After placing a metal base, the conductive adhesive material 2 can be stacked on the upper surface of the metal base (ie, the surface facing the opening direction of the metal base groove 7).
[0044] Furthermore, the plurality of metal-based substructures may include a plurality of metal substrates 1 having the same cross-sectional size, where the cross-sectional size is a horizontal cross-sectional area perpendicular to the depth direction of the metal-based groove 7 .
[0045] For example, Figure 2As shown, metal substrate 1 - conductive adhesive material 2 - metal substrate 1 - conductive adhesive material 2 - metal substrate 1 are placed alternately in the metal base groove.
[0046] The thermal conductivity of the conductive adhesive material 2 is lower than that of the metal-based material. For example, the thermal conductivity of silver paste, a conductive paste composed of copper (or silver) particles and an organic solvent, is typically 30-40 W / (m·K), while the thermal conductivity of the metal-based material is typically 300-400 W / (m·K).
[0047] In one embodiment, to ensure the thermal conductivity of the circuit board, the multiple metal-based substructures used in the above step S101 may include a boss metal-based substructure 4 and at least one U-shaped metal-based substructure 3, wherein the boss metal-based substructure 4 and the U-shaped metal-based substructure 3 are nested with each other.
[0048] For example, Figure 3 and 4 As shown, the U-shaped metal substructure 3 and the boss metal substructure 4 are nested together, and a conductive adhesive material 2 is placed in the second gap between the boss metal substructure 4 and the U-shaped metal substructure 3. In this way, the thermal conductivity of the metal base can be improved by not inserting the conductive adhesive material 2 into the middle of the boss metal substructure 4.
[0049] Furthermore, when there are multiple U-shaped metal-based substructures 3 , the U-shaped surface of each U-shaped metal-based substructure 3 has the same size.
[0050] For example, Figure 5 As shown, Figure 3 The illustrated U-shaped metal-based substructure 3 is divided into two, so that a layer of conductive adhesive material 2 can be stacked between the two U-shaped metal-based substructures 3 .
[0051] In multilayer boards, the depth of the metal base groove 7 is often large. In order to ensure that the first gap between the metal base groove 7 and the metal base can be fully filled with the conductive adhesive material 2, the embodiment of the present application divides the U-shaped metal base substructure 3 into multiple parts. In this way, conductive adhesive material 2 can be placed at different depths of the metal base groove 7. After pressing, conductive adhesive materials 2 of different heights can fully fill the first gap near the height, thereby ensuring the conductivity of the first gap, so that each inner conductive layer can be fully conductive with the metal base.
[0052] In one embodiment, if Figure 6 As shown, before the step S101 of "metallizing the sidewalls of the metal-based grooves on the substrate", the metal-based embedding process provided in the embodiment of the present application may further include the following steps: S601, pressing the core board and the prepreg together according to the designed structure to form a substrate.
[0053] According to the design structure of the substrate to be processed, multiple core boards 5 and prepregs 6 are pressed together. After pressing together, the surface copper layer 51 of the core board serves as the conductive layer of the substrate.
[0054] S602, a metal base groove penetrating the substrate is processed on the substrate.
[0055] Grooving is performed on the substrate to form a metal base groove 7 that penetrates the substrate. The metal base groove 7 is used to embed the metal base.
[0056] In this embodiment, the multi-layer core board 5 is pressed and grooved before being embedded in the metal base, and then the metal base is embedded in the groove. Compared with the traditional metal base embedding process, in which grooves are first made on each layer of the core board, and then each layer of the core board and the metal base are stacked and pressed together, the embodiment of the present application presses the multi-layer core board 5 before embedding the metal base. In this way, when the metal base and the conductive adhesive material 2 are laminated, the semi-cured sheet material stacked between the multi-layer core boards 5 is prevented from flowing into the metal base groove 7, thereby preventing it from affecting the conduction between the metal base and the conductive layer. In this way, the conductivity between each conductive layer and the metal base can be guaranteed.
[0057] In one embodiment, after the step S103 of "laminating the stacked plates", the metal-based embedding process provided in the embodiment of the present application may further include the following steps: Copper electroplating is performed on the surface of the laminated board to form a new surface copper layer.
[0058] For example, after desmearing, copper deposition and electroplating, a new surface copper layer 8 is formed on the surface of the board, thereby connecting the inner conductive layer and the surface copper layer of the substrate to the metal base.
[0059] In order to facilitate the understanding of the metal-based embedding process provided in the embodiment of the present application, Figure 7-13 Provide an example.
[0060] First, if Figure 7 As shown, the multi-layer core board 5 and the multi-layer prepreg 6 are alternately stacked according to the designed structure, and the core board includes a surface conductive layer 51.
[0061] Then, the stacked core board 5 and prepreg 6 are pressed together to obtain a substrate. Figure 8 is a cross-sectional view of the substrate.
[0062] Then, the metal base groove is milled on the substrate to prepare for subsequent metallization. Figure 9 This is a cross-sectional view of the substrate after milling.
[0063] Then, the substrate after the groove is milled undergoes processes such as drill desmearing, copper deposition, and electroplating to metallize the groove sidewalls to obtain metallized sidewalls 71. Figure 10 This is a cross-sectional view of the substrate after sidewall metallization.
[0064] Then, the metal base covered with the conductive adhesive material 2 is placed into the metal base groove. Figure 11 This is a cross-sectional view of the substrate after placing the metal base.
[0065] Then, the stacked plates are laminated so that the conductive adhesive material fills the first gap between the metal base groove sidewall and the metal base, and the second gap between the metal base substructures, thereby completing the embedding of the metal base. Figure 12 It is a cross-sectional view of the substrate after lamination.
[0066] Then, after the metal base is embedded in the substrate, the upper and lower surfaces of the substrate are subjected to processes such as desmearing, copper deposition, and electroplating to form new surface copper layers 8 on the upper and lower surfaces. Figure 13 This is a cross-sectional view of the substrate after surface copper electroplating.
[0067] The present invention first presses the core boards 5 of each layer together to obtain a substrate, then mills grooves on the substrate to obtain a metal base groove 7, and then metalizes the sidewalls of the metal base groove 7. When embedding the metal base, the entire metal base is first split into multiple pieces, and conductive glue or silver paste is placed between two adjacent metal base substructures. The entire piece is then placed in the groove and pressed together. The conductive glue / silver paste in the middle of the metal base substructure fills the surrounding gaps, achieving adhesion between the metal base and the sidewalls of the metal base groove. The present invention allows the metal base to be conductively connected to the metalized metal base sidewalls, thereby connecting each conductive layer that is conductively connected to the metal base sidewalls to the metal base.
[0068] The present application also proposes a circuit board, which is manufactured based on the metal-based embedding process described in any of the above embodiments.
[0069] It can be understood that based on the corresponding beneficial effects of the above embodiments, the circuit board of this embodiment is manufactured based on the metal-based embedding process described in any of the above embodiments, and should also have corresponding technical effects. In order to avoid repetition, it will not be repeated here.
[0070] The present application also proposes an embedded metal-based product, which includes the circuit board described in the above embodiment.
[0071] It can be understood that based on the corresponding beneficial effects of the above embodiments, the embedded metal-based product of this embodiment includes the circuit board based on the above embodiments, which should also have corresponding technical effects. In order to avoid repetition, it will not be repeated here.
[0072] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention, and should all be included in the scope of protection of the present invention.
Claims
1. A metal-based embedding process, characterized in that: include: Performing sidewall metallization on the metal base groove on the substrate; Superimposing a conductive adhesive material between a plurality of metal base substructures to obtain a metal base superimposed with the conductive adhesive material, and placing the metal base into the metallized metal base groove to obtain a laminated plate; The stacked plates are laminated so that the conductive adhesive material can fill the first gap between the metal base and the metal base groove during the lamination process to achieve bonding and conduction between the metal base and the metal base groove.
2. The metal-based embedding process according to claim 1, characterized in that: The method of stacking a conductive adhesive material among a plurality of metal-based substructures to obtain a metal base stacked with the conductive adhesive material comprises: The conductive adhesive material is placed in a second gap between different metal-based substructures, and the second gap can be connected to the first gap after the metal base is placed in the metal-based groove.
3. The metal-based embedding process according to claim 2, characterized in that: The plurality of metal-based substructures include a boss metal-based substructure and at least one U-shaped metal-based substructure, and the boss metal-based substructure and the U-shaped metal-based substructure are nested with each other.
4. The metal-based embedding process according to claim 3, characterized in that: The number of the U-shaped metal-based substructures is greater than 1, and the U-shaped surfaces of each of the U-shaped metal-based substructures have the same size.
5. The metal-based embedding process according to claim 2, characterized in that: The plurality of metal-based substructures include multiple layers of metal plates with the same cross-section size, and the cross-section is a horizontal cross-section perpendicular to the depth direction of the metal-based groove.
6. The metal-based embedding process according to any one of claims 1 to 5, characterized in that: The conductive adhesive material includes conductive glue or conductive paste.
7. The metal-based embedding process according to claim 1, characterized in that: Before metallizing the sidewalls of the metal base grooves on the substrate, the method further comprises: Pressing the core board and the prepreg together according to the designed structure to form the substrate; A metal base groove penetrating the substrate is processed on the substrate.
8. The metal-based embedding process according to claim 1, characterized in that: After laminating the stacked panels, the method further comprises: Copper electroplating is performed on the surface of the laminated board to form a new surface copper layer.
9. A circuit board, characterized in that: The circuit board is manufactured based on the metal-based embedding process described in any one of claims 1-8.
10. An embedded metal-based product, characterized in that: The embedded metal-based product includes the circuit board according to claim 9.