Electronic device including antenna

Abstract

The electronic device includes: a housing including a frame having a region configured to function as a slot antenna; and a wireless communication circuit configured to communicate through the area. The frame includes: a conductive portion formed at least partially along a periphery of the frame; a support portion of the frame; and a bridge portion formed between the conductive portion and the support portion, in which the bridge portion includes a first connection portion disposed between the first region of the conductive portion and the support portion. The second connecting part is arranged between the second area of the conductive part and the supporting part. The region includes: a first longitudinal portion between a first connecting portion of the bridge and a second connecting portion of the bridge, having a first longitudinal direction traveling toward an interior of the housing; and a second longitudinal portion between the first region of the conductive portion and the second region of the conductive portion, at least partially having a second longitudinal direction traveling from the front surface to the rear surface of the housing.

Description

Technical Field

[0001] The present disclosure relates to an electronic device including an antenna. Background Art

[0002] An electronic device can transmit or receive signals via an antenna. An electronic device may include multiple antennas to support various frequency bands. For example, a conductive portion of a metal frame of an electronic device may function as a radiator for an antenna that transmits and / or receives signals.

[0003] The above information is presented as background information only to assist with an understanding of the present disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with respect to the present disclosure. Summary of the Invention

[0004] Aspects of the present disclosure are to address at least the above-mentioned problems and / or disadvantages and to provide at least the advantages described below.Accordingly, one aspect of the present disclosure is to provide an electronic device including an antenna.

[0005] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the presented embodiments.

[0006] According to an aspect of the present disclosure, an electronic device is provided. The electronic device includes: a housing, the housing including a frame having an area configured to function as a slot antenna; and a wireless communication circuit configured to perform communication through the area. The frame includes a conductive portion formed at least partially along the periphery of the frame, a support portion of the frame, and a bridge portion formed between the conductive portion and the support portion. The bridge portion includes a first connecting portion arranged between a first area of ​​the conductive portion and the support portion, and includes a second connecting portion arranged between a second area of ​​the conductive portion and the support portion. The area includes a first elongated portion having a first longitudinal direction toward the interior of the housing between the first connecting portion of the bridge portion and the second connecting portion of the bridge portion. The area includes a second elongated portion having a second longitudinal direction at least partially from the rear side to the front side of the housing between the first area of ​​the conductive portion and the second area of ​​the conductive portion.

[0007] According to one aspect of the present disclosure, an electronic device is provided. The electronic device includes a wireless communication circuit, a housing including a metal frame having a gap area, and a display. The metal frame includes a conductive portion formed at an edge of the metal frame, a support member formed within the metal frame, and a bridge portion formed between the conductive portion and the support member. The bridge portion includes a first connecting portion arranged between a first area of ​​the conductive portion and the support member and a second connecting portion arranged between a second area of ​​the conductive portion and the support member. The gap area includes a first gap area and a second gap area. The first gap area is formed to penetrate a surface of the bridge portion in a direction facing the display area of ​​the display between the first connecting portion of the bridge portion and the second connecting portion of the bridge portion. The second gap area is formed to penetrate a surface of the conductive portion in a direction toward one side of the display area between the first area of ​​the conductive portion and the second area of ​​the conductive portion. The wireless communication circuit is configured to perform communication based on the gap area.

[0008] According to aspects of the present disclosure, an electronic device is provided. The electronic device includes a wireless communication circuit, a housing including a metal frame having a gap area, and a display. The metal frame includes a conductive portion formed at an edge of the metal frame, a support member formed within the metal frame, and a bridge portion formed between the conductive portion and the support member. The bridge portion includes a first connecting portion arranged between a first area of ​​the conductive portion and the support member and a second connecting portion arranged between a second area of ​​the conductive portion and the support member. The gap area includes a first gap area and a second gap area. The first gap area is formed on one surface of the bridge portion between the first connecting portion of the bridge portion and the second connecting portion of the bridge portion in a direction facing the display area of ​​the display. The second gap area is formed on one surface of the conductive portion between the first area of ​​the conductive portion and the second area of ​​the conductive portion in a direction toward the side of the display area. The wireless communication circuit is configured to perform communication based on the gap area.

[0009] According to aspects of the present disclosure, an electronic device is provided. The electronic device includes: a housing including a metal frame having a gap area; and a wireless communication circuit configured to perform communication through the gap area. The metal frame includes a conductive portion formed at least partially along the periphery of the metal frame, a supporting portion of the metal frame, and a bridging portion formed between the conductive portion and the supporting portion. The bridging portion includes a first connecting portion arranged between a first area of ​​the conductive portion and the supporting portion, and includes a second connecting portion arranged between a second area of ​​the conductive portion and the supporting portion. The gap area includes a first gap area and a second gap area. The first gap area is formed between the first connecting portion of the bridging portion and the second connecting portion of the bridging portion, extending in a direction from the second gap area toward the interior of the housing. The second gap area is formed between the first area of ​​the conductive portion and the second area of ​​the conductive portion, extending at least partially from the front side to the rear side of the housing.

[0010] Other aspects, advantages, and salient features of the present disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the accompanying drawings, discloses various embodiments of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent through the following description in conjunction with the accompanying drawings, in which:

[0012] Figure 1 is a block diagram of an electronic device in a network environment according to an embodiment of the present disclosure;

[0013] Figure 2a FIG. 1 shows a first slit region of a slit region of an electronic device according to an embodiment of the present disclosure;

[0014] Figure 2b FIG. 2 shows a second slit portion region of a slit region of an electronic device according to an embodiment of the present disclosure;

[0015] Figure 3a shows a metal frame of an electronic device according to an embodiment of the present disclosure;

[0016] Figure 3b An antenna circuit using a metal frame of an electronic device according to an embodiment of the present disclosure is shown;

[0017] Figure 3c An exploded perspective view for describing a connection between a metal frame and a printed circuit board (PCB) of an electronic device according to an embodiment of the present disclosure is shown;

[0018] Figure 4a 、 Figure 4b 、 Figure 4c and Figure 4d shows a state of an electronic device including a movable housing according to various embodiments of the present disclosure;

[0019] Figure 5 An electronic device including a movable housing according to an embodiment of the present disclosure is shown;

[0020] Figure 6 An injection molded product disposed in a gap area of ​​an electronic device according to an embodiment of the present disclosure is shown;

[0021] Figure 7a 、 Figure 7b 、 Figure 7c 、 Figure 7d 、 Figure 7e and Figure 7f A feeding circuit for a gap region of an electronic device according to various embodiments of the present disclosure is shown;

[0022] Figure 8 The antenna performance of the slot antenna according to the feeding method of the embodiment of the present disclosure is shown;

[0023] Figure 9a 、 Figure 9b 、 Figure 9c 、 Figure 9d 、 Figure 9e 、 Figure 9f and Figure 9g shows the shape of the gap area according to various embodiments of the present disclosure;

[0024] Figure 10a and Figure 10b shows antenna performance of a slot antenna according to the shape of a slot area according to various embodiments of the present disclosure;

[0025] Figure 11a and Figure 11b shows antenna performance of electronic devices according to various embodiments of the present disclosure; and

[0026] Figure 12a 、 Figure 12b 、 Figure 12c and Figure 12d The antenna performance of the slot antenna according to various embodiments of the present disclosure is shown.

[0027] The same reference numerals are used throughout the drawings to denote the same elements. DETAILED DESCRIPTION

[0028] The following description, with reference to the accompanying drawings, is provided to facilitate a fuller understanding of the various embodiments of the present disclosure as defined by the claims and their equivalents. It includes various specific details to aid understanding, but these details are to be considered merely as exemplary. Therefore, those skilled in the art will recognize that various changes and modifications may be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure. Furthermore, descriptions of well-known functions and structures may be omitted for clarity and conciseness.

[0029] The terms and words used in the following description and claims are not limited to the bibliographical meanings, but are merely used by the inventor to enable a clear and consistent understanding of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of the present disclosure is provided for illustration purposes only and not for the purpose of limiting the present disclosure as defined by the appended claims and their equivalents.

[0030] It should be understood that the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a component surface" includes reference to one or more of such surfaces.

[0031] The terms used herein (including technical or scientific terms) may have the same meaning as that generally understood by persons with ordinary knowledge in the art described in this disclosure. Among the terms used in this disclosure, terms defined in general dictionaries may be interpreted as having the same or similar meaning as terms in the context of the relevant technology, and unless explicitly defined in this disclosure, shall not be interpreted in an ideal or overly formal sense. In some cases, even terms defined in this disclosure shall not be interpreted as excluding embodiments of the present disclosure.

[0032] In the various embodiments of the present disclosure described below, a hardware access method will be described as an example. However, since the various embodiments of the present disclosure include technologies using both hardware and software, the various embodiments of the present disclosure do not exclude software-based access methods.

[0033] For ease of description, the following description includes terms referring to parts of electronic devices (e.g., substrate, printed circuit board (PCB), flexible PCB (FPCB), module, antenna, antenna element, circuit, processor, chip, component, device, support member, support portion, conductive portion); terms referring to the shape of a component (e.g., structure, support portion, contact portion, protrusion, opening, gap area); terms referring to connections between structures (e.g., connection portion, contact portion, feed portion, support portion, contact structure, conductive member, assembly); and terms referring to circuits (e.g., PCB, FPCB, signal line, feed line, data line, radio frequency (RF) signal line, antenna line, RF module, RF circuit, splitter, distributor, coupler, combiner). Therefore, the present disclosure is not limited to the terms described below, and other terms with equivalent technical meanings may be used. Furthermore, terms such as "…portion," "…body," "…material," and "…body" used below may refer to at least one shape or structure, or may represent a unit of processing functionality.

[0034] In addition, in the present disclosure, expressions greater than or less than may be used to determine whether a specific condition is met or achieved, but this is merely a description for expressing an example and does not exclude descriptions of greater than or equal to or less than or equal to. A condition described as "greater than or equal to" may be replaced with "greater than," a condition described as "less than or equal to" may be replaced with "less than," and a condition described as "greater than or equal to and less than" may be replaced with "greater than and less than or equal to." In addition, hereinafter, 'A' to 'B' represent at least one of the elements from A (including A) to B (including B). hereinafter, 'C' and / or 'D' refers to at least one of 'C' or 'D', i.e., {'C', 'D', 'C', and 'D'}.

[0035] Figure 1is a block diagram illustrating electronic devices in a network environment according to an embodiment of the present disclosure.

[0036] Reference Figure 1 , the electronic device 101 in the network environment 100 can communicate with the external electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or can communicate with at least one of the external electronic device 104 or the server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment of the present disclosure, the electronic device 101 can communicate with the external electronic device 104 via the server 108. According to an embodiment of the present disclosure, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) 196, or an antenna module 197. In some embodiments of the present disclosure, at least one of the above-described components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the above-described components (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (e.g., display module 160).

[0037] The processor 120 may execute, for example, software (e.g., program 140) to control at least one other component of the electronic device 101 connected to the processor 120 (e.g., a hardware component or a software component), and may perform various data processing or calculations. According to one embodiment of the present disclosure, as at least part of the data processing or calculation, the processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the commands or data stored in the volatile memory 132, and store the resulting data in the non-volatile memory 134. According to an embodiment of the present disclosure, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 121 in operation. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121 or be adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121.

[0038] When the main processor 121 is inactive (e.g., in a sleep state), the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states associated with at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190). Alternatively, when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 may work with the main processor 121 to control at least some of the functions or states associated with at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190). According to embodiments of the present disclosure, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component functionally related to the auxiliary processor 123 (e.g., the camera module 180 or the communication module 190). Depending on the embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware structures dedicated to artificial intelligence model processing. The artificial intelligence model may be generated through machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network, or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0039] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134.

[0040] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0041] The input module 150 may receive commands or data from outside the electronic device 101 (e.g., a user) to be used by other components of the electronic device 101 (e.g., the processor 120). The input module 150 may include, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus).

[0042] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or records. The receiver can be used to receive incoming calls. Depending on the embodiment of the present disclosure, the receiver can be implemented separately from the speaker or as part of the speaker.

[0043] The display module 160 can visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment of the present disclosure, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of the force caused by the touch.

[0044] The audio module 170 can convert sound into an electrical signal, and vice versa. According to an embodiment of the present disclosure, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., external electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0045] The sensor module 176 can detect the operating state of the electronic device 101 (e.g., power or temperature) or the environmental state outside the electronic device 101 (e.g., the state of the user), and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment of the present disclosure, the sensor module 176 may include, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0046] The interface 177 may support one or more specific protocols for connecting the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the external electronic device 102). According to an embodiment of the present disclosure, the interface 177 may include, for example, a High-Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, or an audio interface.

[0047] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the external electronic device 102) via the connector. According to an embodiment of the present disclosure, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0048] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment of the present disclosure, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0049] The camera module 180 may capture still images or moving images. According to an embodiment of the present disclosure, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

[0050] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment of the present disclosure, the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.

[0051] The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment of the present disclosure, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0052] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., external electronic device 102, external electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment of the present disclosure, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth™, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a fifth-generation (5G) network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components (e.g., multiple chips) separated from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0053] The wireless communication module 192 can support 5G networks, which are the next generation after the fourth generation (4G) networks, as well as next-generation communication technologies (e.g., New Radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave (mmWave) bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance in high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., external electronic device 104), or a network system (e.g., second network 199). According to an embodiment of the present disclosure, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 gigabits per second (Gbps) or greater), loss coverage for implementing mMTC (e.g., 164 decibels (dB) or less), or U-plane latency for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 millisecond (ms) or less round trip).

[0054] Antenna module 197 can transmit or receive signals or power to or from an external device (e.g., an external electronic device) outside electronic device 101. According to an embodiment of the present disclosure, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment of the present disclosure, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for the communication scheme used in a communication network (e.g., first network 198 or second network 199) may be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment of the present disclosure, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may also be formed as part of antenna module 197.

[0055] According to various embodiments of the present disclosure, antenna module 197 may form a millimeter wave antenna module. According to embodiments of the present disclosure, a millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., array antennas). The RFIC is disposed on or adjacent to a first surface (e.g., the bottom surface) of the printed circuit board and is capable of supporting a designated high-frequency band (e.g., the millimeter wave band). The multiple antennas are disposed on or adjacent to a second surface (e.g., the top surface or a side surface) of the printed circuit board and are capable of transmitting or receiving signals in the designated high-frequency band.

[0056] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, general purpose input output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and communicatively transfer signals (e.g., commands or data) therebetween.

[0057] According to an embodiment of the present disclosure, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type than the electronic device 101. According to an embodiment of the present disclosure, all or some operations to be executed on the electronic device 101 may be executed on one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or execute another function or service related to the request, and transmit the results of the execution to the electronic device 101. The electronic device 101 may provide the results as at least a partial response to the request, either with or without further processing. To this end, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technologies may be used, for example. The electronic device 101 may use distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment of the present disclosure, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server that utilizes machine learning and / or neural networks. According to an embodiment of the present disclosure, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be used for intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0058] The electronic device 101 can be equipped with various antennas to support various services. For example, with the introduction of ultra-wideband (UWB) technology or satellite communication technology for broadband, it is necessary to include additional antennas in the electronic device 101. UWB ranging is a technology that measures distance using signals in the UWB frequency band. When the antenna used for UWB ranging is set at the rear of the electronic device 101, the radiation pattern is concentrated toward the rear direction, and therefore, the radiation performance may deviate depending on the direction of the electronic device 101. In order to increase the directivity toward the upper direction of the electronic device 101, an additional radiator can be set in an area facing the upper direction of the electronic device 101. However, due to antenna design constraints, the additional radiator may be difficult to implement within a limited space. Due to the installation space of electronic components (such as cameras, communication modules, motors, or speakers) within the electronic device 101, the freedom of antenna design may be reduced.

[0059] To solve the above problems, embodiments of the present disclosure propose a slot antenna technology for radiating signals through an opening formed on a metal bridge of a metal frame of an electronic device. Of course, the embodiments of the present disclosure can solve not only the above problems but also other problems.

[0060] Figure 2a A first slit portion area of ​​a slit area of ​​an electronic device according to an embodiment of the present disclosure is shown. The same figure marks may be cited for the same description between the drawings. The slit area may include a space corresponding to a slit formed within the electronic device. A portion within the slit may be referred to as a first slit portion area. In terms of the portion having a length in a specific direction, the portion may be referred to as a first elongated portion. Another portion within the slit may be referred to as a second slit portion area. In terms of the other portion having a length in a specific direction, the other portion may be referred to as a second elongated portion. In the present disclosure, the term "slit area" refers to a gap between metal parts, and is not used to limit the embodiments and examples of the electronic device to electronic devices having holes.

[0061] refer to Figure 2aThe electronic device 101 may include a display 210 and a metal frame 220. Referring to a portion 222a of the metal frame 220, the metal frame 220 may include a conductive portion 230, a support portion 240, and a bridge portion 277. In an embodiment of the present disclosure, the conductive portion 230 may be disposed along at least a portion of the edge of the metal frame 220. For example, the conductive portion 230 may include a side member forming the exterior of the metal frame 220. In this disclosure, the conductive portion 230 is referred to as a conductive portion because it is disposed between the non-conductive portions of the housing as part of the metal frame. However, the terms "outer portion," "exterior portion," "edge portion," "side portion," and / or equivalent technical or structural terms may be used in place of the conductive portion. The support portion 240 may be disposed within the metal frame 220. The support portion 240 may be configured to support components of the electronic device 101 (e.g., the display 210). For example, the support portion 240 may include a bracket. The conductive portion 230 and the support portion 240 may be physically connected via the bridge portion 277.

[0062] The bridge portion 277 of the metal frame 220 may include a metal bridge for physically connecting the exterior (e.g., the conductive portion 230) and interior (e.g., the support portion 240) of the metal frame 220. The bridge portion 277 may include a first connecting portion 251 and a second connecting portion 252. The bridge portion 277 may include a first slit region 261 formed between the first connecting portion 251 and the second connecting portion 252. The first slit region 261 may include an opening formed on one surface of the bridge portion 277. According to an embodiment of the present disclosure, the metal frame 220 may include a slit region 260 in which a hole is formed in a three-dimensional space rather than a two-dimensional space. For example, the slit region 260 may be formed within the metal frame 220 for mechanical stability. The metal frame 220 includes at least one metal side that forms a three-dimensional slit in the metal frame 220. The at least one metal side may be formed on the bridge portion 277 and the conductive portion 230. The slit region 260 may include a first slit portion region 261 corresponding to an opening formed in one plane and a second slit portion region 262 corresponding to an opening formed in another plane (eg, a slit portion region described later). Figure 2bThe second slit portion area 262). Depending on the embodiment, a non-conductive material (e.g., an injection molded material) may be provided in the opening of the first slit portion area 261. Depending on the embodiment, a non-conductive material (e.g., an injection molded material) may be provided in the opening of the second slit portion area 262. According to an embodiment of the present disclosure, the space corresponding to the slit region 260 may be filled with a non-conductive dielectric. For example, a non-conductive material, such as a side segment portion (e.g., a non-conductive portion 371 and a non-conductive portion 372 described later) may be provided in the space corresponding to the slit region 260. When observed in the direction of observing the display 210 of the electronic device 101 (e.g., the (+) z-axis direction), the first slit portion area 261 may be formed on one plane (e.g., the xy plane). For example, the first slit portion area 261 may be formed to penetrate one surface of the bridging portion 277 in the direction in which the display area of ​​the display 210 faces. In other words, the first slit region 261 may be formed in a direction from the top side of the electronic device 101 toward the inside of the housing (or from the second slit region 262 toward the inside of the housing).

[0063] Figure 2b The second slit region of the slit region of the electronic device according to an embodiment of the present disclosure is shown. For the same description between the drawings, the same reference numerals may be cited. The slit region 260 means a space corresponding to the slit formed in the electronic device, and a portion of the slit may be referred to as the first slit region. Figure 2b In, when Figure 2a , when the electronic device 101 is viewed from above (eg, when viewed in the (−)y-axis direction), a second slit region formed on one surface of the electronic device 101 is shown.

[0064] Reference Figure 2bOne surface 270 of the conductive portion 230 of the metal frame 220 may include a second slit region 262. For example, one surface 270 of the conductive portion 230 may correspond to one side of the display area of ​​the display 210 (e.g., the xz plane). The second slit region 262 may include an opening formed on one surface 270 of the conductive portion 230. Depending on the embodiment, a non-conductive material (e.g., injection-molded material) may be disposed in the opening. According to an embodiment of the present disclosure, the metal frame 220 may include a slit region 260 in which a hole is formed in a three-dimensional space. The slit region 260 may include a first slit region 261 corresponding to the opening formed in one plane and a second slit region 262 corresponding to the opening formed in another plane. For example, the second slit region 262 may be formed to penetrate the one surface 270 of the conductive portion 230 in a direction toward the side of the display area of ​​the display 210. In other words, the second slit region 262 may be formed in a direction from the rear side toward the front side of the housing.

[0065] Referring to portion 222 b of conductive portion 230 , a second slit region 262 may be formed on one surface 270 of conductive portion 230 . Second slit region 262 may include an opening formed from an edge of one surface 270 of conductive portion 230 . Depending on the embodiment, a non-conductive material (e.g., injection-molded material) may be disposed in the opening (slit region 260 ). Second slit region 262 may extend from an end of first slit region 261 . For example, second slit region 262 may be formed continuously from first slit region 261 , which is formed to extend to the edge of one surface 270 of conductive portion 230 on the xy plane. As an example, when the effective gap length of the gap region 260 is L (for example, L is about 12 millimeters (mm)) and the length of the first gap portion region 261 is M (for example, M is about 5 mm), the second gap portion region 262 can have a shape extending from the end of the first gap portion region 261 by a length N (=LM) (for example, N is about 7 mm).

[0066] include Figure 2a The first gap region 261 and Figure 2bThe slot region 260 of the second slot region 262 can operate as a radiator of a slot antenna. A slot antenna is an antenna that utilizes the following principle: based on a signal fed to one side of a slot of a substrate formed of a metal material, electromagnetic waves are radiated by current distributed around the slot. For example, in order to function as a slot antenna, at least one metal side forms the slot region 260. The slot may have a width and a length. In the case of realizing the slot within a single plane, it may be difficult to ensure space according to the required width and the required length within the single plane. According to an embodiment of the present disclosure, the slot region 260 may have a slot region (e.g., a first slot region 261) formed in a direction corresponding to the width of the electronic device 101 (e.g., a direction within the xy plane), and a slot region (e.g., a second slot region 262) formed to have a specific height in a direction corresponding to the thickness of the electronic device 101 (e.g., the z-axis direction). Because a 3D-shaped gap is formed in the bridge portion 277 between the conductive portion 230 and the metal frame 220, and the bridge portion 277 connects the conductive portion 230 and the support portion 240, antenna integration can be enhanced. For example, the 3D-shaped gap may include gap regions with multiple penetration directions relative to the metal frame 220. The electronic device 101 can radiate signals in a designated frequency band (e.g., the frequency band of UWB channel 5 and the frequency band of UWB channel 9) via the wireless communication circuit based on the gap region 260.

[0067] According to an embodiment of the present disclosure, a structure including a 3D-shaped gap can be applied to the electronic device 101 regardless of the form factor of the electronic device 101, such as a strip type, a foldable type, or a rollable type. This structure can be applied if the electronic device 101 has a certain amount or more thickness in a specific direction (e.g., the z-axis). The electronic device 101 having the above-mentioned structure may include a non-conductive portion, which includes a surface arranged on two different planes (e.g., an xy plane and an xz plane). For example, the electronic device 101 includes a first non-conductive portion (e.g., a portion of an injection molded product arranged in the second gap portion area 262) exposed through one side (e.g., the top surface) of the electronic device 101, and may include a second non-conductive portion (e.g., another portion of the injection molded product arranged in the first gap portion area 261) extending from the first non-conductive portion toward the inside.

[0068] Figure 3a 1 shows a metal frame of an electronic device according to an embodiment of the present disclosure. For the same description between the drawings, the same reference numerals may be used. The electronic device 101 can transmit a signal by using a slot antenna that uses a slot area as a radiator, such as Figure 2a and Figure 2bIn addition to the slot antenna through the metal frame 220 , the electronic device 101 may also use various types of antennas (eg, an inverted-F antenna (IFA) type antenna).

[0069] Reference Figure 3a , the electronic device 101 may include a metal frame 220. Referring to portion 312 of the metal frame 220, the electronic device 101 may include multiple conductive parts. For example, the electronic device 101 may include a conductive part 230 and / or a conductive part 235. The electronic device 101 may include multiple non-conductive parts. For example, the electronic device 101 may include a non-conductive part 371 and / or a non-conductive part 372. The non-conductive part 371 and / or the non-conductive part 372 may be referred to as a segment part. In addition, the electronic device 101 may include a non-conductive part in the gap area 260, which will be described later. The electronic device 101 may include a bridging portion 277. The bridging portion 277 may include a first connecting portion 251 and a second connecting portion 252. The first gap portion area 261 may be formed between the first connecting portion 251 and the second connecting portion 252. The first connecting portion 251 may be coupled to the first area 231 of the conductive portion 230 and the support portion 240. The second connection portion 252 may be coupled to the second region 232 of the conductive portion 230 and the support portion 240 .

[0070] According to an embodiment of the present disclosure, the electronic device 101 may include a plurality of feeding sections. For example, the electronic device 101 may include a first feeding section 321, a second feeding section 322, a third feeding section 323, and / or a fourth feeding section 324. The electronic device 101 may include a plurality of grounding sections. For example, the electronic device 101 may include a first critical contact point (CCP) 351, a second CCP 352, a third CCP 353, and / or a fourth CCP 354. In the first CCP 351, the second CCP 352, the third CCP 353, and / or the fourth CCP 354, a PCB (e.g., a PCB to be described later) may be connected to the ground. Figure 3c The PCB 344) and the bracket of the support portion 240 may be electrically connected via a C-clip.

[0071] According to an embodiment of the present disclosure, the electronic device 101 can transmit a first signal in a first frequency band through the first antenna 301. The electronic device 101 can use the metal portion from one end of the conductive portion 230 to the first region 231 as a radiator of the first antenna 301. One end of the conductive portion 230 can be a portion adjacent to the non-conductive portion 371. The first feed portion 321 can be located between one end of the conductive portion 230 and the first region 231. When the first signal in the first frequency band is provided to the first feed portion 321, the first signal can be radiated. The ground of the PCB 344 can be electrically connected to the ground of the support portion 240 through the first CCP 351, the second CCP 352, the third CCP 353, and / or the fourth CCP 354. For example, the ground for the first antenna 301 can be used as a ground by connecting to the first CCP 351, the second CCP 352, and / or the third CCP 353 adjacent to the first feed portion 321 and the radiator (e.g., the metal portion extending from one end of the conductive portion 230 to the first region 231). For example, the first frequency band may include a frequency band approximately equal to or greater than 1 gigahertz (GHz). For example, the first frequency band may include the Global Positioning System (GPS) L1 band (e.g., a center frequency of approximately 1575.42 megahertz (MHz)). For example, the first frequency band may include a mid-band (MB) band (e.g., approximately equal to or greater than 1 GHz and less than 2.3 GHz) and / or a high-band (HB) band (e.g., approximately equal to or greater than 2.3 GHz). For example, the first frequency band may include the n77 band (e.g., greater than or equal to 3300 MHz and less than 4200 MHz).

[0072] According to an embodiment of the present disclosure, the electronic device 101 can transmit a second signal in a second frequency band via the second antenna 302. The electronic device 101 can use the metal portion extending from one end of the conductive portion 230 to the second region 232 as a radiator for the second antenna 302. The one end of the conductive portion 230 can be adjacent to the non-conductive portion 372. The second feeder 322 can be located between the one end of the conductive portion 230 and the second region 232. When the second signal in the second frequency band is supplied to the second feeder 322, the second signal can be radiated. For example, the second frequency band can include the n79 band (e.g., greater than or equal to 4400 MHz and less than 5000 MHz).

[0073] According to an embodiment of the present disclosure, the electronic device 101 can transmit a third signal in a third frequency band via the third antenna 303. The electronic device 101 can use the slot region 260, which includes the first slot region 261 and the second slot region 262 of the conductive portion 230, as a radiator for the third antenna 303. For example, because the third antenna 303 utilizes the slot region 260 of the bridge portion 277, the third antenna 303 can be referred to as a three-dimensional slot antenna. The third feeder 323 can be located on one side of the slot region 260 (e.g., one surface of the second connection portion 252). When the third signal in the third frequency band is supplied to the third feeder 323, a potential difference may occur around the slot region 260. The third signal can be radiated based on the resonance formed in the slot region 260. For example, the third frequency band may include channel 5 of the UWB band (e.g., with a center frequency of approximately 6489.6 MHz and a bandwidth of approximately 499.2 MHz). Furthermore, for example, the third frequency band may include channel 9 of the UWB band (eg, a center frequency of approximately 7987.2 MHz and a bandwidth of approximately 499.2 MHz).

[0074] According to an embodiment of the present disclosure, the electronic device 101 can transmit a fourth signal in a fourth frequency band via the fourth antenna 304. The electronic device 101 can use the metal portion of the conductive portion 235 as a radiator for the fourth antenna 304. One end of the conductive portion 235 can be adjacent to the non-conductive portion 372. The non-conductive portion 372 can be formed between the conductive portion 230 and the conductive portion 235. The fourth feeder 324 can be located in a region of the conductive portion 235. When the fourth signal in the fourth frequency band is supplied to the fourth feeder 324, the fourth signal can be radiated. For example, the fourth frequency band can include wireless local area network (WLAN) frequency bands (e.g., 2.4 GHz band, 5 GHz band, and 6 GHz band).

[0075] According to an embodiment of the present disclosure, in order to transmit a third signal on a third frequency band, a slot region 260 may be formed in the bridge portion. Since the slot region 260 is formed in the bridge portion 277, the isolation between the first antenna 301 and the second antenna 302 can be improved. The first signal can be transmitted from the first feed portion 321 to the first connection portion 251. The second signal can be transmitted from the second feed portion 322 to the second connection portion 252. The slot region 260 provided between the first connection portion 251 and the second connection portion 252 can improve the isolation performance for the first signal and the second signal. For example, due to the first slot region 261 of the slot region 260, the bridge portion 277 is physically divided into the first connection portion 251 and the second connection portion 252, respectively. Therefore, the radiation current for the first antenna 301 and the radiation current for the second antenna 302 can each flow along independent paths. As a result, the isolation between the first antenna 301 and the second antenna 302 can be improved. Through the first slot region 261, the slot region 260 can function as a radiator for the third antenna 303 via a feeder (e.g., the third feeder 323) and improve isolation. Instead of using an additional structure (e.g., stainless steel (SUS) and a laser direct structuring (LDS) pattern) as a radiator, the use of the slot region 260 as a bridge can increase spatial integration within the electronic device 101.

[0076] Figure 3b FIG1 shows an antenna circuit using a metal frame of an electronic device according to an embodiment of the present disclosure. For the same description between the drawings, the same reference numerals may be used. Figure 3b In the description, the Figure 3a Antenna circuit of the antenna described in.

[0077] refer to Figure 3b , the electronic device 101 may include four antennas in a portion (eg, portion 312). For example, the four antennas may include Figure 3aThe first antenna 301, second antenna 302, third antenna 303, and fourth antenna 304 are provided. For example, the electronic device 101 can transmit a first signal in a first frequency band via the first antenna 301. The first antenna 301 may include an inverted-F antenna (IFA) formed by a region 391 of the conductive portion 230 adjacent to the first non-conductive portion 371, a first feeder 321, and a second CCP 352. Because the first feeder 321 is disposed between one end of the conductive portion 230 adjacent to the first non-conductive portion 371 and the grounded second CCP 352, the region 391 of the conductive portion 230 can function as a radiator of the IFA. For example, the electronic device 101 can transmit a second signal in a second frequency band via the second antenna 302. The second antenna 302 may include an IFA formed by a region 392 of the conductive portion 230 adjacent to the second non-conductive portion 372, the second feeder 322, and the third CCP 353. Because the second feed portion 322 is disposed between one end of the conductive portion 230 adjacent to the second non-conductive portion 372 and the grounded third CCP 353, a region 392 of the conductive portion 230 can operate as a radiator of an IFA-type antenna. For example, the electronic device 101 can transmit a third signal in a third frequency band via the third antenna 303. The third antenna 303 may include a slot antenna having a slot structure. The slot structure may include a first connecting portion 251, a second connecting portion 252, and a slot region 260. The slot region 260 can operate as a radiator of the slot antenna. For example, the electronic device 101 can transmit a fourth signal in a fourth frequency band via the fourth antenna 304. The fourth antenna 304 may include an IFA-type antenna formed by the conductive portion 235 formed adjacent to the second non-conductive portion 372, a fourth feed portion 324, and a fourth CCP 354. Since the fourth feeding portion 324 is disposed between one end of the conductive portion 235 adjacent to the second non-conductive portion 372 and the grounded fourth CCP 354 , one region 394 of the conductive portion 235 may operate as a radiator of the IFA type antenna.

[0078] According to an embodiment of the present disclosure, the display (e.g., display 210) included in the display module 160 may be flexible. For example, the display 210 may include a display area exposed outside the housing of the electronic device 101, which provides at least a portion of the outer surface of the electronic device 101. For example, since the display 210 is flexible, at least a portion of the display 210 may be rollable into the housing or slidable into the housing. For example, the size of the display area may be changed according to the size of at least a portion of the display 210 that is rolled into the housing or slid into the housing. For example, the electronic device 101 including the display 210 may be in a plurality of states, including a first state in which a display area having a first size is provided and a second state in which a display area having a second size different from the first size is provided. For example, the electronic device 101 may be in a plurality of states ... Figure 4a and Figure 4b The first state is described below.

[0079] Figure 3c An exploded perspective view for describing the connection between a metal frame and a printed circuit board (PCB) of an electronic device according to an embodiment of the present disclosure is shown. For the same description between the drawings, the same reference numerals may be used. Figure 3c In the description Figure 3a and 3b The connection relationship between the feeding portion and the grounding portion of the metal frame 220 and the PCB is described in detail.

[0080] refer to Figure 3c , the electronic device 101 may include a PCB 344. For example, the PCB 344 may include a substrate on which a communication module (e.g., the communication module 190) is disposed. According to an embodiment of the present disclosure, the PCB 344 may include a first wireless communication circuit for the first antenna 301. The first wireless communication circuit may provide a signal to the first antenna 301 via the first feeder 321. The PCB 344 may be electrically connected to the first feeder 321. For example, the PCB 344 and the first feeder 321 may be electrically connected by bringing a portion of the PCB 344 into contact with the first feeder 321. For another example, the PCB 344 may be electrically connected to the first feeder 321 via a structure (e.g., a C-clip).

[0081] According to an embodiment of the present disclosure, the PCB 344 may include a second wireless communication circuit for the second antenna 302. The second wireless communication circuit may provide signals to the second antenna 302 via the second feeder 322. The PCB 344 may be electrically connected to the second feeder 322. For example, the PCB 344 and the second feeder 322 may be electrically connected by bringing a portion of the PCB 344 into contact with the second feeder 322. For another example, the PCB 344 may be electrically connected to the second feeder 322 via a structure (e.g., a C-clip).

[0082] According to an embodiment of the present disclosure, the PCB 344 may include a third wireless communication circuit for the third antenna 303. The third wireless communication circuit may provide signals to the third antenna 303 via the third feeder 323. The PCB 344 may be electrically connected to the third feeder 323. For example, the PCB 344 may be electrically connected to the third feeder 323 via a structure (e.g., a C-clip 383). In another example, the PCB 344 and the third feeder 323 may be electrically connected by bringing a portion of the PCB 344 into contact with the third feeder 323.

[0083] According to an embodiment of the present disclosure, the PCB 344 may include a fourth wireless communication circuit for the fourth antenna 304. The fourth wireless communication circuit may provide signals to the fourth antenna 304 via the fourth feeder 324. The PCB 344 may be electrically connected to the fourth feeder 324. For example, the PCB 344 and the fourth feeder 324 may be electrically connected by bringing a portion of the PCB 344 into contact with the fourth feeder 324. For another example, the PCB 344 may be electrically connected to the fourth feeder 324 via a structure (e.g., a C-clip).

[0084] According to an embodiment of the present disclosure, the PCB 344 can provide grounding. Similar to the aforementioned feeders (e.g., the first feeder 321, the second feeder 322, the third feeder 323, and / or the fourth feeder 324), grounding portions (e.g., the first CCP 351, the second CCP 352, the third CCP 353, and / or the fourth CCP 354) can also be electrically connected to the PCB 344 to provide grounding. For example, the support portion 240 and the PCB 344 can be in contact in at least one of the first CCP 351, the second CCP 352, the third CCP 353, and the fourth CCP 354. Furthermore, for example, the support portion 240 and the PCB 344 can be electrically connected in at least one of the first CCP 351, the second CCP 352, the third CCP 353, and the fourth CCP 354 via a structure (e.g., a C-clip). When a partial area of ​​the PCB 344 in at least one CCP is electrically connected to the support portion 240 , grounding for the antenna including the metal frame 220 or the first slot portion region 261 of the slot region 260 may be provided.

[0085] Figure 4a 、 Figure 4b 、 Figure 4c and Figure 4d 101 and 102 illustrate states of an electronic device including a movable housing according to various embodiments of the present disclosure. The same reference numerals may be used for the same descriptions between the figures. The state of the electronic device 101 may include a first state. The electronic device may include a second state. The state of the electronic device 101 may include a state different from the first state and the second state.

[0086] Figure 4a is a top plan view of an electronic device in a first state according to an embodiment of the present disclosure.

[0087] refer to Figure 4a The electronic device 101 may include a first shell 410, a second shell 420 and a display 430 (for example, the display 210), wherein the second shell 420 is movable relative to the first shell 410 in a first direction 461 parallel to the y-axis or in a second direction 462 parallel to the y-axis and opposite to the first direction 461.

[0088] For example, the electronic device 101 may be in a first state. For example, in the first state, the second housing 420 may be movable relative to the first housing 410 in a first direction 461 of a first direction 461 and a second direction 462. For example, in the first state, the movement of the second housing 420 relative to the first housing 410 in the second direction 462 may be restricted. As an example, the second housing 420 may have difficulty moving further relative to the first housing 410 in the second direction 462. As another example, the second housing 420 may be difficult to move due to being stuck relative to the first housing 410 in the second direction 462.

[0089] For example, in the first state, the display 430 may provide a display area having a minimum size. For example, in the first state, the display area may correspond to the area 430a. For example, although Figure 4a , but in the first state, a region of the display 430 different from the region 430a serving as the display area (eg, Figure 4c Region 430b) may be included within first housing 410. For example, in the first state, this region may be covered by first housing 410. For example, in the first state, this region may be rolled into first housing 410. For example, in the first state, region 430a may include a flat portion, unlike the region including a curved portion. However, this is not limiting. For example, in the first state, region 430a may include a curved portion extending from the flat portion and located within the edge portion.

[0090] For example, in terms of at least a portion of the second housing 420 being located within the first housing 410, the first state may be referred to as a slid-in state or a closed state. For example, in terms of providing a display area with a minimum size, the first state may be referred to as a zoomed-out state. However, the present invention is not limited thereto.

[0091] For example, the first housing 410 may include a first image sensor 450-1 within the camera module 180, the first image sensor 450-1 being visually exposed through a portion of the region 430a and facing a third direction 463 parallel to the z-axis. For example, the camera module 180 may be arranged to perform its function without being visually exposed through a portion of the region 430a in the interior space of the electronic device. For example, although Figure 4a 1 , but the second housing 420 may include one or more second image sensors within the camera module 180, which are exposed through a portion of the second housing 420 and face a fourth direction 464 that is parallel to the z-axis and opposite to the third direction 463. Figure 4b One or more second image sensors are shown in the description.

[0092] Figure 4bis a rear view of the electronic device in a first state according to an embodiment of the present disclosure.

[0093] refer to Figure 4b In the first state, one or more second image sensors 450-2 disposed within the second housing 420 may be located within a structure for the one or more second image sensors 450-2 disposed within the first housing 410. For example, in the first state, light from outside the electronic device 101 may be received by the one or more second image sensors 450-2 through the structure. For example, because the one or more second image sensors 450-2 are located within the structure in the first state, the one or more second image sensors 450-2 may be exposed through the structure in the first state. For example, the structure may be implemented in various ways. For example, the structure may be an opening or a recess. For example, the structure may be an opening 412a within the plate 412 of the first housing 410 that surrounds at least a portion of the second housing 420. However, this is not limited to this. For example, in the first state, the one or more second image sensors 450-2 included in the second housing 420 may be covered by the plate 412 of the first housing 410.

[0094] Reference again Figure 4a , the first state can be changed to the second state.

[0095] For example, the first state (or the second state) may be changed to the second state (or the first state) through one or more intermediate states between the first state and the second state.

[0096] For example, the first state (or second state) can be changed to the second state (or first state) based on user input. For example, the first state (or second state) can be changed to the second state (or first state) in response to user input to a physical button exposed through a portion of the first housing 410 or a portion of the second housing 420. For example, the first state (or second state) can be changed to the second state (or first state) in response to touch input on an executable object displayed within the display area. For example, the first state (or second state) can be changed to the second state (or first state) in response to touch input having a contact point on the display area and a pressing intensity greater than or equal to a reference intensity. For example, the first state (or second state) can be changed to the second state (or first state) in response to voice input received through a microphone of the electronic device 101. For example, the first state (or second state) can be changed to the second state (or first state) in response to a force applied to the first housing 410 and / or the second housing 420 to move the second housing 420 relative to the first housing 410. For example, the first state (or second state) may be changed to the second state (or first state) in response to user input recognized by an external electronic device (eg, earbuds or a smartwatch) connected to the electronic device 101. However, this is not limiting.

[0097] The second state can be Figure 4c and 4d is shown in the description.

[0098] Figure 4c is a top plan view of an electronic device in a second state according to an embodiment of the present disclosure.

[0099] refer to Figure 4c , the electronic device 101 may be in the second state. For example, in the second state, the second housing 420 may move relative to the first housing 410 in the second direction 462 of the first direction 461 and the second direction 462. For example, in the second state, the second housing 420 may not move relative to the first housing 410 in the first direction 461.

[0100] For example, in the second state, the display 430 may provide a display area having a maximum size. For example, in the second state, the display area may correspond to an area 430c including the area 430a and the area 430b. For example, the area 430b included in the first housing 410 in the first state may be exposed in the second state. For example, in the second state, the area 430a may include a planar portion. However, this is not limited to this. For example, the area 430a may include a curved portion extending from the planar portion and located within the edge portion. For example, unlike the area 430a in the first state, in the second state, the area 430b may include a planar portion of the planar portion and the curved portion. However, this is not limited to this. For example, the area 430b may include a curved portion extending from the planar portion of the area 430b and located within the edge portion.

[0101] For example, in terms of at least a portion of the second housing 420 being located outside the first housing 410, the second state may be referred to as a slid-out state or an open state. For example, in terms of providing a display area having a maximum size, the second state may be referred to as an extended state. However, the present invention is not limited thereto.

[0102] For example, when the state of the electronic device 101 changes from the first state to the second state, the first image sensor 450-1 facing the third direction 463 may move together with the region 430a according to the movement of the second housing 420 toward the first direction 461. Figure 4c , when the state of the electronic device 101 changes from the first state to the second state, the one or more second image sensors 450-2 facing the fourth direction 464 may move according to the movement of the second housing 420 toward the first direction 461. For example, the relative positional relationship between the one or more second image sensors 450-2 and the structure may be changed according to the movement of the one or more second image sensors 450-2. For example, Figure 4d The change of the relative position relationship is shown in FIG.

[0103] Figure 4d is a rear view of the electronic device in a second state according to an embodiment of the present disclosure.

[0104] refer to Figure 4dIn the second state, one or more second image sensors 450-2 may be located outside the structure. For example, in the second state, one or more second image sensors 450-2 may be located outside the opening 412a in the plate 412. For example, because one or more second image sensors 450-2 are located outside the opening 412a in the second state, one or more second image sensors 450-2 may be exposed in the second state. For example, because one or more second image sensors 450-2 are located outside the structure in the second state, the relative positional relationship in the second state may be different from the relative positional relationship in the first state.

[0105] For example, in a case where the electronic device 101 does not include a structure such as the opening 412 a , the one or more second image sensors 450 - 2 in the second state may be exposed, unlike the one or more second image sensors 450 - 2 in the first state.

[0106] Although not in Figure 4a 、 Figure 4b 、 Figure 4c and Figure 4d , electronic device 101 may be in an intermediate state between the first state and the second state. For example, the size of the display area in the intermediate state may be larger than the size of the display area in the first state and smaller than the size of the display area in the second state. For example, the display area in the intermediate state may correspond to an area including area 430a and a portion of area 430b. For example, in the intermediate state, a portion of area 430b may be exposed, while another portion (or the remaining portion) of area 430b may be covered by or rolled into the first housing 410. However, this is not limiting.

[0107] Figure 5 An electronic device including a movable housing according to an embodiment of the present disclosure is shown. For the same description between the drawings, the same reference numerals may be cited. Figure 5 In the description, Figures 4a to 4d An example of moving in directions (eg, (+)x axis, (-)x axis) different from the moving direction (eg, (+)y axis, (-)y axis) of the second housing 420 .

[0108] refer to Figure 5 The electronic device 101 may include a first shell 510, a second shell 520 and a display 530 (for example, the display 210), and the second shell 520 can move relative to the first shell 510 in a first direction 561 parallel to the x-axis or a second direction 562 parallel to the x-axis and opposite to the first direction 561.

[0109] The electronic device 101 may be in a first state. For example, in the first state, the second shell 520 may move relative to the first shell 510 in the second direction 562 of the first direction 561 and the second direction 562. For example, within the first state, the second shell 520 may not move relative to the first shell 510 in the first direction 561. For example, within the first state, the display 530 may provide a display area with a minimum size. For example, in terms of at least a portion of the second shell 520 being located within the first shell 510, the first state may be referred to as a slid-in state or a closed state. For example, in terms of providing a display area with a minimum size, the first state may be referred to as a zoomed-out state. However, this is not limited to this. For example, although not in Figure 5 Although not shown in the figure, the first housing 510 may include an image sensor (not shown). For example, the second housing 520 may be exposed through a portion of the second housing 520 and may include one or more image sensors 550 within the camera module 180.

[0110] The second housing 520 can be pulled out from the first housing 510. Upon pulling out the second housing 520 from the first housing 510, the state of the electronic device 101 can be changed from the first state to the second state. In addition, the second housing 520 can be inserted into the first housing 510. Upon inserting the second housing 520 from the first housing 510, the state of the electronic device 101 can be changed from the second state to the first state.

[0111] The electronic device 101 can be in a second state. For example, in the second state, the second housing 520 can move relative to the first housing 510 in a first direction 561 of a first direction 561 and a second direction 562. For example, in the second state, the second housing 520 may not move relative to the first housing 510 in the second direction 562. For example, in the second state, the display 530 can provide a display area with a maximum size. For example, in terms of at least a portion of the second housing 520 being located outside the first housing 510, the second state can be referred to as a slid-out state or an open state. For example, in terms of providing a display area with a maximum size, the second state can be referred to as an extended state. However, this is not limiting.

[0112] Hereinafter, the electronic device 101 including the second housing 420 will be described. Figures 4a to 4d The embodiment of the present disclosure may also be applied to an operation including Figure 5The electronic device 101 of the second housing 520 is movable in a direction (e.g., (+) x-axis, (-) x-axis) in the first region 477 or the second region 488 of the electronic device 101. According to embodiments described later, the conductive portion and the non-conductive portion of the metal frame of the electronic device 101 may be disposed in the first region 477 or the second region 488 of the electronic device 101. Furthermore, according to embodiments described later, the supporting portion, the bridging portion, and the gap region formed across the bridging portion and the conductive portion of the electronic device 101 may be disposed in the first region 477 of the electronic device 101.

[0113] In addition, for the embodiments of the present disclosure, there is no limitation on structural changes due to expansion or reduction in the horizontal or vertical directions, and the radiator structure including the bridging portion and the gap area according to the embodiments described later can also be applied to bar-type or foldable electronic devices.

[0114] According to embodiments of the present disclosure, a slot antenna can be formed based on the bridge portion 277 of the metal frame 220. Due to the bridge portion 277, the slot antenna can ensure isolation from adjacent antennas (e.g., the first antenna 301 and the second antenna 302). Furthermore, antennas designed for transmitting signals in the UWB band (e.g., channel 5 or channel 9) may require a slot length of approximately 10 mm or longer. Due to the mounting of electronic components (e.g., a camera, speaker, motor, USB, communication module, or chip-on-plastic (COP)) within the second housing 420, the electronic device 101 having the aforementioned rollable form factor may not have sufficient space to form a slot along the metal frame 220. Embodiments of the present disclosure may include a slot region (e.g., slot region 260) having a three-dimensional shape. The slot region 260 may include a slot region (e.g., first slot region 261) that penetrates one surface and a slot region (e.g., second slot region 262) that penetrates another surface. For example, depending on the frequency band, a slot region having a width of approximately 1 mm or greater and a length of approximately 12 mm may be required. The slot region may include a first slot region 261 and a second slot region 262. For example, a first slot region 261 having a width of approximately 1 mm and a length of approximately 5 mm may be formed on one surface (e.g., the xy plane). For example, a second slot region 262 having a width of approximately 1.5 mm and a length of approximately 7 mm may be formed in one direction (e.g., the z-axis). The one surface and the other surface may not be parallel to each other. For example, the one surface and the other surface may be substantially perpendicular. For example, one surface may include a surface of the bridge portion as a surface perpendicular to the direction toward the display 210. For example, the other surface may include a surface 270 of the conductive portion 230 as a side surface of the display 210. To ensure the overall antenna efficiency of the slot antenna, the physical length of the slot must be sufficient. Therefore, the region configured to function as a slot antenna includes a first elongated portion (e.g., first slot region 261) extending in a first longitudinal direction toward the interior of the housing between first connection portion 251 of the bridge portion and second connection portion 252 of the bridge portion 277, and a second elongated portion (e.g., second slot region 262) extending in a second longitudinal direction at least partially from the rear side to the front side of the housing between first region 231 of the conductive portion 230 and second region 232 of the conductive portion 230. The electronic device 101 can communicate across a frequency band depending on the slot length. For example, the slot length can be determined as the sum of the length of the first elongated portion in the first direction and the length of the second elongated portion in the second direction.

[0115] According to an embodiment of the present disclosure, since the antenna for the UWB band is provided at the upper end of the metal frame 220 (eg, at Figure 2aThe area in the (+) y-axis direction) can improve the radiation performance of UWB ranging. For example, antennas such as LB (e.g., less than approximately 1 GHz), MB, and / or HB antennas, as well as a GPS antenna (where upper hemisphere isotropic sensitivity (UHIS) is important) are primarily disposed at the upper end of metal frame 220. Since the slot antenna is implemented as a UWB antenna on bridge portion 277 in electronic device 101 in addition to the aforementioned antennas, the antenna integration level of electronic device 101 can be increased.

[0116] Figure 6 1 shows an injection molded product provided in a gap region of an electronic device according to an embodiment of the present disclosure. For the same description between the drawings, the same reference numerals may be cited. The electronic device 101 may include Figure 2a 、 Figure 2b 、 Figure 3a and Figure 3b The gap region 260 described in .

[0117] refer to Figure 6 , perspective view 601 indicates electronic device 101. Electronic device 101 may include a first cover structure 620 and / or a second cover structure 630, wherein the first cover structure 620 and / or the second cover structure 630 include a display 210, a board 610, and a metal frame 220. Board 610 may be coupled to one surface of first cover structure 620 (e.g., one surface 270 of conductive portion 230) for assembling and protecting display 210. According to an embodiment of the present disclosure, electronic device 101 may include an injection molded product 660 for occupying the space of gap region 260. Injection molded product 660 may be provided on one surface of board 610.

[0118] Perspective view 603 shows an injection molded product 660 of electronic device 101. Injection molded product 660 may include a first injection molded portion 661 and / or a second injection molded portion 662. First injection molded portion 661 may occupy the space of first slit region 261. Second injection molded portion 662 may occupy the space of second slit region 262. First injection molded portion 661 may be disposed within a space formed through bridge portion 277. Second injection molded portion 662 may be disposed on one surface (e.g., one surface 270) of conductive portion 230. As an example, referring to portion 622, second injection molded portion 662 may include a first region 662a formed along a first direction and a second region 662b formed in a direction different from the first direction (e.g., in an opposite direction), based on the region coupled to first injection molded portion 661.

[0119] Figure 7a 、 Figure 7b 、 Figure 7c 、 Figure 7d、 Figure 7e and Figure 7f FIG. 7 shows a feeding circuit 701 for a gap region of an electronic device according to various embodiments of the present disclosure. For the same description between the drawings, the same reference numerals may be used. Figures 7a to 7f , an example of arrangement of a feeding structure and a grounding structure is described for an antenna using the slot region 260.

[0120] Reference Figure 7a , the electronic device 101 may include a feeding structure 766 and a grounding structure 777. For example, the feeding structure 766 may be arranged to contact a substrate including a wireless communication circuit. For example, the feeding structure 766 may include a C-clip for rear contact. According to an embodiment of the present disclosure, the feeding structure 766 may be arranged on one side of the gap area 260, and the grounding structure 777 may be arranged on an area of ​​the support portion 240. For example, the feeding structure 766 may be arranged on a surface of the second connecting portion 252 (for example, a surface facing the (+) z-axis). For example, since the electronic device 101 has a structure for feeding power from the rear direction, the feeding from the feeding structure 766 may be referred to as rear feeding. The grounding structure 777 may be arranged on a surface of the support portion 240 (for example, a surface facing the (+) z-axis). The grounding structure 777 may include a CCP.

[0121] Reference Figure 7b The electronic device 101 may include a feed structure 766 and a ground structure 777. For example, the feed structure 766 may be arranged to contact the substrate including the wireless communication circuitry. For example, the feed structure 766 may include a C-clip for rear contact. According to an embodiment of the present disclosure, the feed structure 766 may be provided on one side of the slot region 260, and the ground structure 777 may be provided on a side different from the slot region 260. For example, the feed structure 766 may be provided on one side, based on the longitudinal direction of the slot region 260, and the ground structure 777 may be provided on the other side. For example, the feed structure 766 may be provided on one surface of the second connection portion 252 (e.g., the surface facing the (+) z-axis). Feeding by the feed structure 766 may be referred to as rear feeding. The ground structure 777 may be provided on one surface of the first connection portion 251 (e.g., the surface facing the (+) z-axis). The ground structure 777 may include a CCP. The contact between the ground structure 777 and one surface of the first connection portion 251 may be referred to as rear contact.

[0122] refer to Figure 7c , showing the section along the A-A' direction Figure 7b1 is a cross-sectional view of the structure of the gap region 260 of the electronic device 101. The support portion 240 may be disposed on the display 210. The PCB 344 may be disposed on the support portion 240. To electrically connect to the PCB 344, the second connection portion 252 connected to the bridge portion 277 of the support portion 240 may contact the feeding structure 766 (e.g., a C-clip).

[0123] refer to Figure 7d , showing the section along the BB' direction Figure 7b A cross-sectional view of the structure of the slot region 260 of the electronic device 101 is shown. For example, the display 210 and the support portion 240 may be physically coupled via an adhesive layer. The second connection portion 252 and the first connection portion 251 connected to the support portion 240 may be located between the display 210 and the PCB 344. For example, a grounding structure 777 (e.g., a C-clip) may be provided between the first connection portion 251 and the PCB 344. As an example, the grounding structure 777 may be electrically connected to the PCB 344 via an interposer 774. The PCB 344 and the first connection portion 251 may be electrically connected via the grounding structure 777. For example, a feed structure 766 (e.g., a C-clip) may be provided between the second connection portion 252 and the PCB 344. The PCB 344 and the second connection portion 252 may be electrically connected via the feed structure 766. According to an embodiment of the present disclosure, the first slot region 261 of the slot region 260 may be formed between the first connection portion 251 and the second connection portion 252. For example, a certain gap is formed between the first slot region 261 and the display 210 so that the first slot region 261 can function as a radiator of the slot antenna. For example, a non-conductive material may be provided in the first slot region 261 of the slot region 260.

[0124] Despite Figure 7d An interposer 774 is shown in FIG. 3 , but according to another embodiment of the present disclosure, the interposer 774 may be omitted. An electrical connection between the PCB 344 and the first connection portion 251 may be formed by directly contacting the PCB 344 and the ground structure 777 .

[0125] Reference Figure 7eThe electronic device 101 may include a feed structure 766 and a ground structure 788. For example, the feed structure 766 may be configured to contact a substrate including wireless communication circuitry. For example, the feed structure 766 may include a C-clip for rear contact. According to an embodiment of the present disclosure, the feed structure 766 may be provided on one side of the slot region 260, and the ground structure 788 may be provided on a side different from the slot region 260. For example, the feed structure 766 may be provided on one side, based on the longitudinal direction of the slot region 260, and the ground structure 788 may be provided on the other side. For example, the feed structure 766 may be provided on one surface of the second connecting portion 252 (e.g., the surface facing the (+) z-axis). Feeding by the feed structure 766 may be referred to as rear feeding. The conductive portion 230 may include a protrusion 791 facing in one direction (e.g., the (-) y-axis direction). The ground structure 788 may be provided on one surface of the protrusion 791 of the conductive portion 230 (e.g., the surface facing the (-) y-axis direction). The contact method between the ground structure 788 and the protrusion 791 may be referred to as side contact.

[0126] Reference Figure 7f The electronic device 101 may include a feed structure 799 and a ground structure 788. For example, the feed structure 799 may be arranged to contact the substrate including the wireless communication circuitry. For example, the feed structure 799 may include a C-clip for side contact. According to an embodiment of the present disclosure, the feed structure 799 may be arranged on one side of the slot region 260, and the ground structure 788 may be arranged on a side different from the slot region 260. For example, the feed structure 799 may be arranged on one side based on the longitudinal direction of the slot region 260, and the ground structure 788 may be arranged on the other side. For example, the conductive portion 230 may include a protrusion 791 and a protrusion 792 facing in one direction (e.g., the (-)y-axis direction). The feed structure 799 may be arranged on one surface of the protrusion 792 of the conductive portion 230 (e.g., the surface facing the (-)y-axis direction). The feeding method of the feed structure 799 and the protrusion 792 may be referred to as side feeding. The ground structure 788 may be provided on one surface (eg, a surface facing the (−)y-axis direction) of the protrusion 791 of the conductive portion 230 .

[0127] Figure 8 The antenna performance of the slot antenna according to the feeding method of the embodiment of the present disclosure is shown. Figure 8 In the description Figure 7a 、 Figure 7b and Figure 7e The antenna performance of each of the feeding circuit methods described in Figure 7a The arrangement of the feeding circuit can be called the first method. Figure 7bThe arrangement of the feeding circuit can be called the second method. Figure 7e The arrangement of the feeding circuit can be called the third method.

[0128] refer to Figure 8 Graph 800 indicates the total antenna efficiency at each frequency. The horizontal axis of graph 800 indicates frequency (unit: GHz), and the vertical axis of graph 800 indicates the total antenna efficiency (unit: decibel (dB)). A first line 811 indicates the total antenna efficiency in a feeding circuit according to the first method. A second line 812 indicates the total antenna efficiency in a feeding circuit according to the second method. A third line 813 indicates the total antenna efficiency in a feeding circuit according to the third method.

[0129] Referring to graph 800, the radiation efficiency of a slot antenna using the slot region 260 is shown using the rear feed method. Furthermore, the slot antenna using the slot region 260 can provide improved radiation efficiency because the degree of symmetry with respect to the feed and ground positions is increased around the slot region 260. For example, referring to channel 5 of the UWB band (e.g., with a center frequency of 6489.6 MHz), it can be seen that the radiation efficiency is highest in the order of the third method, the second method, and the first method. Furthermore, referring to channel 9 of the UWB band (e.g., with a center frequency of 7987.2 MHz), it can be seen that the radiation efficiency is highest in the order of the third method, the second method, and the first method. Because the feed and ground are symmetrically arranged around the slot region 260, a large potential difference can be formed on the open surface within the slot region 260. This large potential difference can cause current to concentrate in a specific direction, providing high gain in radiated electromagnetic waves.

[0130] Figure 9a 、 9b 9c, 9d, 9e, 9f, and 9g illustrate the shapes of the slit regions according to various embodiments of the present disclosure. Identical reference numerals may be used for the same descriptions between the figures. In the present disclosure, the slit region 260 may include a region that penetrates on one surface (e.g., first slit region 261) and a region that penetrates on the other side (e.g., second slit region 262). In the case where each of two different surfaces has a penetrating region and the penetrating regions form a slit, the shape of the slit region 260 may vary.

[0131] Reference Figure 9aIn example 901, the shape of slit region 260 may include a curved straight line. The shape of second slit region 262 may include a straight line. As a decorative plate (e.g., plate 610) on the top surface, plate 610 may overlap the top surface of metal frame 220 (e.g., one surface 270 of conductive portion 230). Since other electrical objects are not placed on the top surface, second slit region 262 can have a relatively high degree of freedom. Therefore, second slit region 262 can have various shapes, as well as a straight line.

[0132] Reference Figure 9b In example 903, the shape of the slit region 260 may include a curved 'ㄱ' shape. For example, the shape of the second slit region 262 may include a 'ㄱ' shape.

[0133] Reference Figure 9c In example 905, the shape of the slit region 260 may include a curved 'ㄴ' shape. For example, the shape of the second slit region 262 may include a 'ㄴ' shape.

[0134] Reference Figure 9d In example 907, the shape of the slit region 260 may include a curved 'T' shape. For example, the shape of the second slit region 262 may include a 'T' shape.

[0135] refer to Figure 9e In example 909, at least a portion of the gap region 260 may include at least a portion of a speaker hole. The electronic device 101 may include a plurality of speaker holes 931a, 931b, 931c, and 931d for a speaker (e.g., the sound output module 155). For example, the plurality of speaker holes may include a first speaker hole 931a, a second speaker hole 931b, a third speaker hole 931c, and / or a fourth speaker hole 931d. The first speaker hole 931a, the second speaker hole 931b, the third speaker hole 931c, and / or the fourth speaker hole 931d may be formed on one surface 270 of the conductive portion 230 of the metal frame 220. The opening of the first speaker hole 931a may be coupled to at least a portion of the opening of the second gap region 262 of the gap region 260. For example, the first speaker hole 931a may be at least a portion of the second gap region 262.

[0136] Reference Figure 9fIn example 911, at least a portion of the slot region 260 may include at least a portion of an aperture for a communication module (e.g., antenna module 197). For example, the communication module may include a mmWave module. To facilitate radiation from the communication module, the electronic device 101 may include radiation apertures 961a, 961b, 961c, 961d, 971a, 971b, 971c, 971d, and 971e on one surface 270 of the conductive portion 230. For example, the plurality of radiation apertures may include a first radiation aperture 961a, a second radiation aperture 961b, a third radiation aperture 961c, and / or a fourth radiation aperture 961d. The first radiation aperture 961a, the second radiation aperture 961b, the third radiation aperture 961c, and / or the fourth radiation aperture 961d may be provided on one surface 270 of the conductive portion 230 of the metal frame 220. The opening of the first radiation aperture 961a may be coupled to at least a portion of the opening of the second slot region 262 of the slot region 260. For example, the first radiation hole 961 a may be at least a portion of the second slit region 262 .

[0137] Reference Figure 9g In Example 913, the shape of the slit region 260 may include a curved straight line shape. For example, the shape of the second slit region 262 may include a straight line shape. Unlike Example 901, the second slit region 262 in Example 913 may include a straight line shape that extends from one edge of the conductive portion 230 to the other edge to have an open shape.

[0138] Figure 10a and Figure 10b The antenna performance of the slot antenna according to the shape of the slot area according to various embodiments of the present disclosure is shown. For the same description between the drawings, the same reference numerals may be cited. Figure 10a The shape of the gap region 260 will be shown Figure 6 The injection molded product 660 described in FIG. The gap region 260 may include a second gap region 262 on one surface 270 of the conductive portion 230 .

[0139] Reference Figure 10aThe first shape 1001 of the slit region 260 may have a length in one direction (e.g., the (+)z-axis direction) on one surface 270 of the conductive portion 230. The third shape 1005 of the slit region 260 may include an 'l' shape. The second slit region 262 may include a first length 1001a and a second length 1001b. The first length 1001a represents the distance from one end of the second slit region 262 to the first slit region 261. For example, the first length 1001a may correspond to the length of the second region 662b of the second injection portion 662 of the injection molded product 660. The second length 1001b represents the length from one end of the second slit region 262 formed on one surface 270 of the conductive portion 230 to one edge of the conductive portion 230. For example, the first length 1001a may be approximately 6.2 mm, and the second length 1001b may be approximately 8.0 mm.

[0140] According to an embodiment of the present disclosure, the second shape 1003 of the slit region 260 may have a length in one direction (e.g., the (+)z-axis direction) on one surface 270 of the conductive portion 230. The second shape 1003 of the slit region 260 may include an 'l' shape. The second slit region 262 may include a first length 1003a and a second length 1003b. The first length 1003a represents the distance from one end of the second slit region 262 to the first slit region 261. For example, the first length 1003a may correspond to the length of the second region 662b of the second injection portion 662 of the injection molded product 660. The second length 1003b represents the length from one end of the second slit region 262 formed on one surface 270 of the conductive portion 230 to one edge of the conductive portion 230. For example, the first length 1003a may be approximately 6.2 mm, and the second length 1003b may be approximately 6.7 mm. The length of the second length 1003 b of the second shape 1003 may be shorter than the length of the second length 1001 b of the first shape 1001 .

[0141] According to an embodiment of the present disclosure, the third shape 1005 of the slit region 260 may have a length in one direction (e.g., the (+) z-axis direction) and a length in another direction (e.g., the (-) x-axis direction) on one surface 270 of the conductive portion 230. The third shape 1005 of the slit region 260 may include a "Γ" shape. The second slit region 262 may include a first length 1005a and a second length 1005b. The first length 1005a represents the distance from one end of the second slit region 262 to the first slit region 261. The second length 1005b represents the length extending from the one surface 270 of the conductive portion 230 in the other direction (e.g., the (-) x-axis direction). For example, the first length 1005a may be approximately 2.7 mm, and the second length 1005b may be approximately 3.5 mm.

[0142] According to an embodiment of the present disclosure, the fourth shape 1007 of the slit region 260 may have a length in one direction (e.g., the (+) z-axis direction) and a length in another direction (e.g., the (-) x-axis direction) on one surface 270 of the conductive portion 230. The third shape 1007 of the second slit region 262 may include a "Γ" shape. The second slit region 262 may include a first length 1007a and a second length 1007b. The first length 1007a represents the distance from one end of the second slit region 262 to the first slit region 261. The second length 1007b represents the length extending from the one surface 270 of the conductive portion 230 in the other direction (e.g., the (-) x-axis direction). For example, the first length 1007a may be approximately 2.7 mm, and the second length 1007b may be approximately 5.5 mm.

[0143] refer to Figure 10b , graph 1050 indicates the total antenna efficiency at each frequency. Figure 10b In the following, we will describe Figure 7e The antenna performance for each shape of the slot region 260 (e.g., rear feed of the feed structure 766 and side contact of the ground structure 788) according to the third method is shown. A first line 1061 represents the total antenna efficiency for the first shape 1001 of the slot region 260. A second line 1063 represents the total antenna efficiency for the second shape 1003 of the slot region 260. A third line 1065 represents the total antenna efficiency for the third shape 1005 of the slot region 260. A fourth line 1067 represents the total antenna efficiency for the fourth shape 1007 of the slot region 260.

[0144] Referring to graph 1050, it can be seen that first line 1061 and second line 1063 provide a higher overall antenna efficiency than third line 1065 and fourth line 1067. The performance of a slot antenna can be related to the dimensions of the slot (e.g., the slot length and the slot width). Here, the slot length refers to the length in one direction that allows current to flow. To ensure the overall antenna efficiency of a slot antenna, the physical length of the slot must be sufficient. The second slot section 262 can extend from the first slot section 261. The length of the second slot section 262 can extend in various directions from the first slot section 261. For example, the length of the second slot section 262 can extend in a first direction (e.g., the (+) z-axis direction). The length of the second slot section 262 can also extend in a second direction (e.g., the (-) x-axis direction). In this case, the overall antenna efficiency of the slot antenna can be determined based on the length from the first slot section 261 to the direction of extension (e.g., the first direction or the second direction). Referring to the second line 1063 and the third line 1065, it can be seen that, even at the same length (e.g., 6.2 mm), the 'L' shape provides higher radiation efficiency than the 'Γ' shape. Furthermore, it can be seen that the influence of the opening area in directions other than the width and length of the slot region 260 is relatively low compared to the influence of the shape. For example, the length in the (-) z-axis direction has little effect on the radiation performance of a slot antenna using the slot region 260. This is because the opening surface formed by a portion of the second slot region 262 extending in the (+) z-axis direction and the first slot region 261 acts as a single slot, operating as the radiator of the slot antenna.

[0145] Figure 11a and Figure 11b 1 shows the antenna performance of the electronic device according to various embodiments of the present disclosure. For the same description between the figures, the same reference numerals may be cited. The electronic device 101 may include four antennas in a portion (eg, portion 312). The four antennas may include Figure 3a and Figure 3b The first antenna 301, the second antenna 302, the third antenna 303, and the fourth antenna 304 are shown. For example, the first antenna 301 may include an IFA-type antenna, in which a region 391 of the conductive portion 230 operates as a radiator. For example, the second antenna 302 may include an IFA-type antenna, in which a region 392 of the conductive portion 230 operates as a radiator. For example, the third antenna 303 may include a slot antenna, in which the slot structure of the conductive portion 230 operates as a radiator. For example, the fourth antenna 304 may include an IFA-type antenna, in which the conductive portion 235 operates as a radiator.

[0146] refer to Figure 11aGraph 1100 shows the total antenna efficiency at each frequency. A first line 1111 represents the total antenna efficiency of first antenna 301. A second line 1112 represents the total antenna efficiency of second antenna 302. A third line 1113 represents the total antenna efficiency of third antenna 303. A fourth line 1114 represents the total antenna efficiency of fourth antenna 304.

[0147] The first antenna 301 can transmit a first signal in a first frequency band (e.g., the GPS L1 band). For example, since the efficiency of the first line 1111 is highest in the range of approximately 1.5 GHz to 1.6 GHz, it can be seen that the first antenna 301 has guaranteed isolation performance relative to other antennas. Furthermore, the second antenna 302 can transmit a second signal in a second frequency band (e.g., the n79 band). For example, since the efficiency of the second line 1112 is highest in the range of approximately 4.4 GHz to 5.0 GHz, it can be seen that the second antenna 302 has guaranteed isolation performance relative to other antennas. Furthermore, the fourth antenna 304 can transmit a fourth signal in a fourth frequency band (e.g., the 2.4 GHz band for WLAN). For example, since the efficiency of the fourth line 1114 is highest in the range of approximately 2.4 GHz to 2.5 GHz, it can be seen that the fourth antenna 304 has guaranteed isolation performance relative to other antennas.

[0148] According to an embodiment of the present disclosure, third antenna 303 can transmit a third signal in a third frequency band (e.g., UWB channel 5 and UWB channel 9). For example, assuming UWB channel 5, since the efficiency of third line 1113 is highest in the range of approximately 6.25 GHz to 6.75 GHz, it can be seen that third antenna 303 has guaranteed isolation performance relative to other antennas. Furthermore, for example, assuming UWB channel 9, since the efficiency of third line 1113 is highest in the range of approximately 7.75 GHz to 8.25 GHz, it can be seen that third antenna 303 has guaranteed isolation performance relative to other antennas.

[0149] refer to Figure 11b Graph 1150 shows S parameters for each frequency. A first line 1161 indicates the pass coefficient (e.g., transmission coefficient) from the third antenna 303 to the first antenna 301. A second line 1162 indicates the pass coefficient from the third antenna 303 to the second antenna 302. A third line 1163 indicates the pass coefficient from the third antenna 303 to the third antenna 303. A fourth line 1164 indicates the pass coefficient from the third antenna 303 to the fourth antenna 304.

[0150] Since the third line 1163 is a pass coefficient with respect to the same antenna, it can be substantially close to 0 dB. Referring to the first line 1161, the second line 1162, and the fourth line 1164, since a pass coefficient less than or equal to a specific reference value (e.g., -15 dB) is provided, the graph 1150 can indicate that the signal component of the third antenna 303 cannot flow well into the other antenna. In other words, the graph 1150 can indicate that the signal component of the third antenna 303 cannot flow well into the other antenna. Figure 3a and Figure 3b The isolation performance between antennas is guaranteed to be at a certain level or higher.

[0151] Figure 12a 、 Figure 12b 、 Figure 12c and Figure 12d The antenna performance of the slot antenna according to various embodiments of the present disclosure is shown. For the same description between the figures, the same reference numerals may be cited. The electronic device 101 may include Figure 3a and Figure 3b The first antenna 301, second antenna 302, third antenna 303, and / or fourth antenna 304 are shown. The third antenna 303 may be a slot antenna, and the first antenna 301, second antenna 302, and / or fourth antenna 304 may be an IFA antenna. In the slot structure of the third antenna 303, when the first connecting portion 251 or the second connecting portion 252 is absent, the third antenna 303 may operate as an IFA antenna. However, when the third antenna 303 is implemented as an IFA antenna, isolation performance relative to other antennas (e.g., the first antenna 301 or the second antenna 302) may be reduced.

[0152] Figure 12a Shown Figure 3a The first connection portion 251 of the bridge portion 277 is opened in the antenna structure. The bridge portion 277 may include the first connection portion 1251 instead of the first connection portion 251. According to an embodiment of the present disclosure, a segment portion 1298 may be formed in the first connection portion 1251.

[0153] Figure 12b Shown Figure 3a The second connection portion 252 of the bridge portion 277 is opened to form an antenna structure. The bridge portion 277 may include the second connection portion 1252 instead of the second connection portion 252. The segment portion 1299 may be formed in the second connection portion 1252.

[0154] refer to Figure 12c , graph 1200 shows the total antenna efficiency of the first antenna 301 at each frequency.

[0155] A first line 1210 indicates the total antenna efficiency of the first antenna 301 when the third antenna 303 is implemented as a slot antenna including a slot structure.

[0156] The second line 1211 indicates the total antenna efficiency of the first antenna 301 when the third antenna 303 is implemented as an IFA type antenna (eg, an antenna having a first connection portion 1251 and a segment portion 1298), wherein the segment portion is formed in the first connection portion 251. For the IFA type antenna, reference may be made to Figure 12a antenna structure.

[0157] The third line 1212 indicates the total antenna efficiency of the first antenna 301 when the third antenna 303 is implemented as an IFA type antenna (eg, an antenna having a second connection portion 1252 and a segment portion 1299), wherein the segment portion is formed in the second connection portion 252. For the IFA type antenna, reference may be made to Figure 12b Referring to the graph 1200 , it can be seen that when the first connection portion 251 , which is a ground path of the first antenna 301 , is opened, the radiation performance of the second line 1211 deteriorates.

[0158] refer to Figure 12d , a graph 1250 shows the total antenna efficiency of the second antenna 302 at each frequency. A first line 1260 represents the total antenna efficiency of the second antenna 302 when the third antenna 303 is implemented as a slot antenna having a slot structure. A second line 1261 represents the total antenna efficiency of the second antenna 302 when the third antenna 303 is implemented as an IFA type antenna (e.g., having a first connection portion 1251 and a segment portion 1298). Figure 12a The total antenna efficiency of the second antenna 302 when the third antenna 303 is implemented as an IFA type antenna (e.g., an antenna having the second connection 1252 and the segment portion 1299) is shown in FIG. Figure 12b 1250 , it can be seen that the radiation performance of the third line 1262 deteriorates as the second connection portion 252, which is the ground path of the second antenna 302, is opened.

[0159] Referring to graphs 1200 and 1250, a bridging portion (e.g., bridging portion 277) and a slot region (e.g., slot region 260) formed within the conductive portion can be used to implement an antenna radiation structure that ensures isolation performance and overcomes structural constraints, while maintaining the same level of radiation efficiency for first antenna 301 and second antenna 302. For example, by placing the slot antenna on the top surface of electronic device 101, electronic device 101 can provide a radiation pattern suitable for UWB ranging without a separate metal structure (e.g., LDS and / or SU).

[0160] Embodiments of the present disclosure propose a technology for utilizing an additional antenna without expanding the antenna design space within the limited space of the electronic device 101. A slot antenna for improving the radiation pattern can be provided by forming a slot in a bridging portion between a conductive portion (e.g., conductive portion 230) and a support member (e.g., support portion 240) of a metal frame (e.g., metal frame 220). The slot area of ​​the slot antenna may include an opening formed on one surface of the bridging portion to ensure the slot length and an opening formed on one surface of the conductive portion. The slot area formed in the bridging portion can not only increase the space efficiency of the electronic device 101, but also provide high isolation performance of adjacent antennas relative to the slot antenna. Therefore, the antenna radiation efficiency of the antenna of the electronic device 101 can be increased.

[0161] Effects obtainable in the present disclosure are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood from the following description by a person having ordinary knowledge in the art to which the present disclosure pertains.

[0162] An electronic device 101 according to an embodiment is provided. The electronic device 101 may include a wireless communication circuit, a housing 420 including a metal frame 220 having a slit region 260, and a display 210. The metal frame 220 may include a conductive portion 230 formed at an edge of the metal frame 220, a support portion 240 formed within the metal frame 220, and a bridge portion formed between the conductive portion 230 and the support portion 240. The bridge portion may include a first connection portion 251 disposed between a first region 231 of the conductive portion 230 and the support portion 240, and a second connection portion 252 disposed between a second region 232 of the conductive portion 230 and the support portion 240. The slit region 260 may include a first slit region 261 and a second slit region 262. The first slit region 261 may be formed to penetrate one surface of the bridge portion between the first connection portion 251 and the second connection portion 252 of the bridge portion in a direction facing the display area of ​​the display. The second slit region 262 may be formed to penetrate one surface 270 of the conductive portion 230 in a direction toward the display area between the first region 231 and the second region 232 of the conductive portion 230. The wireless communication circuit may be configured to perform communication based on the slit region 260.

[0163] For example, the electronic device 101 may further include a support housing 410. The housing 420 may be coupled to the support housing 410 so as to be movable in a first direction pulled out from the support housing 410 or in a second direction opposite to the first direction. One surface 270 of the conductive portion 230 may be disposed to face the second direction.

[0164] For example, the electronic device 101 may include a board including a first surface facing a first direction and a second surface facing a second direction. The electronic device 101 may include an injection molded product for occupying a space corresponding to the gap area 260. The injection molded product may be disposed on the first surface of the board.

[0165] For example, the second slit portion region 262 may be formed to extend from the first slit portion region 261 .

[0166] For example, the conductive portion 230 may be disposed between the first non-conductive portion 371 of the housing 420 and the second non-conductive portion 372 of the housing 420. The conductive portion 230 may include a first end adjacent to the first non-conductive portion 371 and a second end adjacent to the second non-conductive portion 372. A first signal in a first frequency band may be provided from the first feed portion 321 between the first end and the first region 231. A second signal in a second frequency band may be provided from the second feed portion 322 between the second end and the second region 232.

[0167] For example, the first connection portion 251 may be used as a ground for a first signal, and the second connection portion 252 may be used as a ground for a second signal.

[0168] For example, the communication may include transmitting the third signal on an ultra-wideband (UWB) frequency band, which may include a channel 5 frequency band having a center frequency of approximately 6489.6 megahertz (MHz) or a channel 9 frequency band having a center frequency of approximately 7987.2 MHz.

[0169] For example, the electronic device 101 may include an additional conductive portion 235 disposed adjacent to the second non-conductive portion 372. The additional conductive portion 235 may function as a radiator for a fourth signal on a fourth frequency band. The fourth frequency band may include a frequency band for a wireless local area network (WLAN).

[0170] For example, the sideward direction may include a direction toward the top of the electronic device 101. The first non-conductive portion 371 may be provided on one surface facing the top of the electronic device 101. The second non-conductive portion 372 may be provided on one surface facing the left or right side of the electronic device 101.

[0171] For example, the first slit region 261 may include an opening formed on one surface of the bridge portion. The second slit region 262 may include an opening formed on one surface 270 of the conductive portion 230. One surface of the bridge portion may not be parallel to one surface 270 of the conductive portion 230.

[0172] For example, the electronic device 101 may include a communication module including multiple antenna elements. One surface 270 of the conductive portion 230 may include multiple radiation holes 961 for the communication module. At least one of the radiation holes 961 may be at least a portion of the second slot region 262.

[0173] For example, the electronic device 101 may further include a speaker. One surface 270 of the metal frame 220 may include a plurality of speaker holes 931 for the speaker. At least one of the plurality of speaker holes 931 may be at least a portion of the second slit area 262.

[0174] For example, the second slit portion region 262 may have a straight line shape, an 'L' shape, or a 'T' shape on one surface 270 of the conductive portion 230 .

[0175] For example, the electronic device 101 may include a ground structure 777 disposed on one surface of the first connection portion 251. The electronic device 101 may include a feed structure 766 disposed on one surface of the second connection portion 252. The wireless communication circuit may be configured to provide a signal through the feed structure 766.

[0176] For example, the conductive portion 230 may include a protrusion 791 that protrudes in a direction toward the support portion 240. The ground structure 788 may be provided on one surface of the protrusion. The feed structure 766 may be provided on one surface of the second connection portion 252. The wireless communication circuit may be configured to provide a signal through the feed structure 766.

[0177] For example, the conductive portion 230 may include a first end and a second end formed along an edge. The conductive portion 230 may include a first protrusion 791 and a second protrusion 792 that protrude toward the support portion 240. The first protrusion 791 may be formed between the first end and the first region 231. The second protrusion 792 may be formed between the second end and the second region 232. The ground structure 788 may be provided on one surface of the first protrusion 791. The feed structure 799 may be provided on one surface of the second protrusion 792. The wireless communication circuit may be configured to provide a signal through the feed structure 799.

[0178] For example, the ground structure 788 may be provided on one surface of the first protrusion 791 in a direction toward the side of the display area. The feeding structure 799 may be provided on one surface of the second protrusion 792 in a direction toward the side of the display area.

[0179] For example, the electronic device 101 may include a ground structure 777 disposed on one surface of the support portion 240. The electronic device 101 may include a feeding structure 766 disposed on one surface of the second connection portion 252. The wireless communication circuit may be configured to provide a signal through the feeding structure 766.

[0180] For example, the electronic device 101 may further include an injection molded product 660 for occupying the gap area 260. The injection molded product may include a first injection portion 661 for the first gap area 261 and a second injection portion 662 for the second gap area 262. Based on the area where the first injection portion 661 and the second injection portion 662 are connected, the second injection portion 662 may include a first portion 662a formed in one direction toward the display 210 and a second portion 662b formed in a direction opposite to the one direction.

[0181] For example, based on one direction, the length of the second portion 662b may be longer than the length of the first portion 662a.

[0182] An electronic device 101 according to an embodiment of the present disclosure is provided. The electronic device 101 may include a wireless communication circuit, a housing 420 including a metal frame 220 having a slit region 260, and a display 210. The metal frame 220 may include a conductive portion 230 formed at an edge of the metal frame 220, a support portion 240 formed within the metal frame 220, and a bridge portion formed between the conductive portion 230 and the support portion 240. The bridge portion may include a first connection portion 251 disposed between a first region 231 of the conductive portion 230 and the support portion 240, and a second connection portion 252 disposed between a second region 232 of the conductive portion 230 and the support portion 240. The slit region 260 may include a first slit region 261 and a second slit region 262. The first slit region 261 may be formed on one surface of the bridge portion between the first connection portion 251 and the second connection portion 252 of the bridge portion in a direction facing the display area of ​​the display 210. The second slit region 262 may be formed on one surface 270 of the conductive portion 230 in a direction toward the side of the display area, between the first region 231 and the second region 232 of the conductive portion 230. The wireless communication circuit may be configured to perform communication based on the slit region 260.

[0183] According to an embodiment, an electronic device is provided. The electronic device includes: a housing including a metal frame having a gap area; and a wireless communication circuit configured to perform communication through the gap area. The metal frame includes a conductive portion formed at least partially along the periphery of the metal frame, a supporting portion of the metal frame, and a bridging portion formed between the conductive portion and the supporting portion. The bridging portion includes a first connecting portion arranged between a first area of ​​the conductive portion and the supporting portion, and includes a second connecting portion arranged between a second area of ​​the conductive portion and the supporting portion. The gap area includes a first gap area and a second gap area. The first gap area is formed between the first connecting portion of the bridging portion and the second connecting portion of the bridging portion, extending in a direction from the second gap area toward the inside of the housing. The second gap area is formed between the first area of ​​the conductive portion and the second area of ​​the conductive portion, extending at least partially from the front side to the rear side of the housing.

[0184] For example, the housing includes a first housing component and a second housing component movably engaged with the first housing component.The first housing component includes a metal frame.

[0185] For example, an electronic device includes a board including a first surface facing a first direction toward the interior of a housing and a second surface facing a second direction. The electronic device includes a non-conductive component for occupying a space corresponding to a gap region. At least a portion of the non-conductive component is disposed on the first surface of the board.

[0186] For example, the electronic device includes a feeding structure provided on one surface of the first connection portion or the second connection portion, the feeding structure being electrically connected to the slot region, and the wireless communication circuit being configured to provide a signal to the feeding structure so as to radiate the signal through the slot region.

[0187] For example, the conductive portion is disposed between a first non-conductive portion of the housing and a second non-conductive portion of the housing. The conductive portion includes a first end adjacent to the first non-conductive portion and a second end adjacent to the second non-conductive portion. The wireless communication circuit is configured to transmit or receive a first signal in a first frequency band via a first power feeder between the first end and the first region. The wireless communication circuit is configured to transmit or receive a second signal in a second frequency band via a second power feeder between the second end and the second region.

[0188] For example, the first connection portion serves as a ground for the first signal, and the second connection portion serves as a ground for the second signal.

[0189] For example, the communicating includes transmitting the third signal on a frequency band of ultra-wideband (UWB).

[0190] For example, the electronic device includes an additional conductive portion disposed adjacent to the second non-conductive portion. The wireless communication circuit is configured to transmit or receive a fourth signal in a fourth frequency band via the additional conductive portion. The fourth frequency band includes a frequency band for a wireless local area network (WLAN).

[0191] For example, the electronic device includes a first non-conductive portion provided on one surface facing the top side of the housing, and a second non-conductive portion provided on one surface facing the left side or the right side of the housing.

[0192] For example, the electronic device includes a non-conductive component, at least a portion of the non-conductive component is disposed in a first space of a first slit region, and at least another portion of the non-conductive component is disposed in a second space of a second slit region.

[0193] For example, the electronic device includes a communication module including a plurality of antenna elements. One surface of the conductive portion includes a plurality of radiating holes for the communication module. At least a portion of the second slot region is formed on at least one of the plurality of radiating holes.

[0194] For example, the electronic device includes a speaker, one surface of the conductive portion includes a plurality of speaker holes for the speaker, and at least a portion of the second slit region is formed on at least one speaker hole among the plurality of speaker holes.

[0195] For example, the second slit portion region has a straight line shape, an 'L' shape, or a 'T' shape on one surface of the conductive portion.

[0196] For example, the electronic device includes a ground structure for the slot region and a feeding structure for the slot region. The wireless communication circuit is configured to feed a signal to the feeding structure to radiate the signal through the slot region.

[0197] For example, the conductive portion includes a protrusion protruding in a direction toward the support portion, the grounding structure is provided on one surface of the protrusion, and the feeding structure is provided on one surface of the second connecting portion.

[0198] For example, the conductive portion includes a first end and a second end formed along an edge. The conductive portion includes a first protrusion and a second protrusion that protrude toward the support portion. The first protrusion is formed between the first end and the first region. The second protrusion is formed between the second end and the second region. The grounding structure is disposed on one surface of the first protrusion. The feed structure is disposed on one surface of the second protrusion.

[0199] For example, the one surface of the first protrusion faces a direction from the rear side toward the front side of the housing. The one surface of the second protrusion faces a direction from the rear side toward the front side of the housing.

[0200] For example, the grounding structure is provided on one surface of the supporting portion, and the feeding structure is provided on one surface of the second connecting portion.

[0201] For example, the electronic device includes a non-conductive component for occupying a space corresponding to a slot region. The non-conductive component includes a first non-conductive portion for the first slot region and a second non-conductive portion for the second slot region. The second non-conductive portion includes a first portion extending from the region where the first and second non-conductive portions are coupled and formed in a direction toward the front of the housing. The second non-conductive portion includes a second portion extending from the region where the first and second non-conductive portions are coupled and formed in a direction opposite to the first direction.

[0202] For example, the length of the second portion is longer than the length of the first portion.

[0203] According to an embodiment, an electronic device is provided. The electronic device includes: a housing, the housing including a frame having an area configured to function as a slot antenna; and a wireless communication circuit configured to perform communication through the area. The frame includes a conductive portion formed at least partially along the periphery of the frame, a support portion of the frame, and a bridge portion formed between the conductive portion and the support portion. The bridge portion includes a first connecting portion arranged between a first area of ​​the conductive portion and the support portion, and includes a second connecting portion arranged between a second area of ​​the conductive portion and the support portion. The area includes a first elongated portion having a first longitudinal direction toward the interior of the housing, between the first connecting portion of the bridge portion and the second connecting portion of the bridge portion. The area includes a second elongated portion having a second longitudinal direction at least partially from the rear side to the front side of the housing, between the first area of ​​the conductive portion and the second area of ​​the conductive portion.

[0204] For example, the wireless communication circuit is configured to transmit or receive signals on a frequency band according to the length of the first elongated portion in the first longitudinal direction and the length of the second elongated portion in the second longitudinal direction.

[0205] For example, the housing includes a first housing component and a second housing component movably engaged with the first housing component.The first housing component includes a frame.

[0206] For example, an electronic device includes a board including a first surface facing a first direction toward the interior of a housing and a second surface facing a second direction opposite the first direction. The electronic device includes a non-conductive component for occupying a space corresponding to the area. At least a portion of the non-conductive component is disposed on the first surface of the board.

[0207] For example, the conductive portion is disposed between a first non-conductive portion of the housing and a second non-conductive portion of the housing. The conductive portion includes a first end adjacent to the first non-conductive portion and a second end adjacent to the second non-conductive portion. The wireless communication circuit is configured to transmit or receive a first signal in a first frequency band via a first power feeder between the first end of the conductive portion and the first region, and to transmit or receive a second signal in a second frequency band via a second power feeder between the second end of the conductive portion and the second region.

[0208] For example, the first connection portion serves as a ground for the first signal, and the second connection portion serves as a ground for the second signal.

[0209] For example, the communicating includes transmitting the third signal on a frequency band of ultra-wideband (UWB).

[0210] For example, the electronic device further includes an additional conductive portion disposed adjacent to the second non-conductive portion. The wireless communication circuit is configured to transmit or receive a fourth signal in a fourth frequency band via the additional conductive portion. The fourth frequency band includes a frequency band for a wireless local area network (WLAN).

[0211] For example, the electronic device includes a feed structure disposed on a surface of the first connection portion of the bridge portion or the second connection portion of the bridge portion. The frame corresponds to a metal frame. The wireless communication circuit is configured to provide a signal to the first connection portion or the second connection portion via the feed structure.

[0212] For example, the electronic device includes a non-conductive component, at least a portion of the non-conductive component is disposed in a first space of the first elongated portion, and at least another portion of the non-conductive component is disposed in a second space of the second elongated portion.

[0213] For example, the electronic device includes a communication module including a plurality of antenna elements. One surface of the conductive portion includes a plurality of radiating holes for the communication module. At least a portion of the second elongated portion is formed on at least one of the plurality of radiating holes.

[0214] For example, the electronic device includes a speaker, one surface of the conductive portion includes a plurality of speaker holes for the speaker, and at least a portion of the second elongated portion is formed on at least one speaker hole among the plurality of speaker holes.

[0215] For example, the second elongated portion has a straight line shape, an 'L' shape, or a 'T' shape on the one surface of the conductive portion.

[0216] For example, the electronic device includes a ground structure for the region and a feeding structure for the region, and the wireless communication circuit is configured to feed a signal to the feeding structure to radiate the signal through the region.

[0217] For example, the conductive portion includes a protrusion protruding in a direction toward the support portion, the grounding structure is provided on one surface of the protrusion, and the feeding structure is provided on one surface of the second connecting portion.

[0218] For example, the conductive portion includes a first end and a second end formed along an edge. The conductive portion includes a first protrusion and a second protrusion that protrude toward the support portion. The first protrusion is formed between the first end and a first region of the conductive portion. The second protrusion is formed between the second end and a second region of the conductive portion. A grounding structure is provided on one surface of the first protrusion. A feed structure is provided on one surface of the second protrusion.

[0219] For example, the one surface of the first protrusion faces a direction from the rear side toward the front side of the housing. The one surface of the second protrusion faces a direction from the rear side toward the front side of the housing.

[0220] For example, the grounding structure is provided on one surface of the supporting portion, and the feeding structure is provided on one surface of the second connecting portion.

[0221] For example, the electronic device includes a non-conductive component for occupying a space corresponding to the area. The non-conductive component includes a first non-conductive portion for the first elongated portion and a second non-conductive portion for the second elongated portion. The second elongated portion includes a first portion extending from the area where the first non-conductive portion and the second non-conductive portion are connected and formed in a direction toward the front of the housing. The second elongated portion includes a second portion extending from the area where the first non-conductive portion and the second non-conductive portion are connected and formed in a direction opposite to the one direction.

[0222] For example, the length of the second portion is longer than the length of the first portion.

[0223] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to embodiments of the present disclosure, the electronic device is not limited to those described above.

[0224] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but rather include various changes, equivalents or alternative forms for the corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "first" and "second" or "first" and "second" may be used to simply distinguish a corresponding component from another component and do not limit the components in other respects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “coupled with another element (e.g., a second element)”, “coupled to another element (e.g., a second element)”, “connected with another element (e.g., a second element)”, or “connected to another element (e.g., a second element)”, with or without the terms “operably” or “communicatively” being used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0225] As used in connection with various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or portion of such a single integrated component. For example, according to an embodiment of the present disclosure, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0226] The various embodiments described herein can be implemented as software (e.g., program 140) comprising one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that is readable by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function in accordance with the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. The term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0227] According to embodiments of the present disclosure, the methods according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disc read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., the Play Store). TM ) The computer program product may be published online (e.g., downloaded or uploaded) or distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smartphones). If published online, at least part of the computer program product may be temporarily generated or at least temporarily stored in a machine-readable storage medium (e.g., a memory of a manufacturer's server, an application store's server, or a forwarding server).

[0228] According to various embodiments of the present disclosure, each of the above-mentioned components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately provided in different components. According to various embodiments of the present disclosure, one or more of the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments of the present disclosure, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding one of the multiple components performed the one or more functions before integration. According to various embodiments of the present disclosure, the operations performed by a module, program, or another component may be performed sequentially, in parallel, repeatedly, or in a heuristic manner, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

Claims

1. An electronic device comprising: a housing including a frame having a region configured to function as a slot antenna; and wireless communication circuitry configured to perform communication via the region, wherein the frame includes a conductive portion formed at least partially along a periphery of the frame, a support portion of the frame, and a bridge portion formed between the conductive portion and the support portion, wherein the bridging portion includes a first connecting portion provided between a first region of the conductive portion and the supporting portion, and includes a second connecting portion provided between a second region of the conductive portion and the supporting portion, The areas mentioned include: a first elongated portion, between the first connection portion of the bridge portion and the second connection portion of the bridge portion, having a first longitudinal direction toward the interior of the housing, and The second elongated portion has a second longitudinal direction at least partially from the rear side to the front side of the housing between the first region of the conductive portion and the second region of the conductive portion.

2. The electronic device according to claim 1, in, The wireless communication circuit is configured to transmit or receive signals on a frequency band according to a length of the first elongated portion in the first longitudinal direction and a length of the second elongated portion in the second longitudinal direction.

3. The electronic device according to claim 1, in, The housing includes a first housing component and a second housing component movably engaged with the first housing component, and Wherein, the first shell component includes the frame.

4. The electronic device according to claim 3, further comprising: a plate including a first surface facing a first direction toward the interior of the housing and a second surface facing a second direction opposite to the first direction; and a non-conductive member for occupying a space corresponding to the area, At least a portion of the non-conductive component is disposed on the first surface of the plate.

5. The electronic device according to claim 1, wherein the conductive portion is disposed between the first non-conductive portion of the housing and the second non-conductive portion of the housing, wherein the conductive portion comprises a first end adjacent to the first non-conductive portion and a second end adjacent to the second non-conductive portion, The wireless communication circuit is configured as follows: transmitting or receiving a first signal in a first frequency band through a first feeding portion between the first end of the conductive portion and the first region, and A second signal in a second frequency band is transmitted or received through a second feeding portion between the second end of the conductive portion and the second region.

6. The electronic device according to claim 5, wherein the first connection portion is used as a ground for the first signal, and The second connection portion is used as a ground for the second signal.

7. The electronic device according to claim 5, wherein: The communication includes transmission of a third signal on an ultra-wideband (UWB) frequency band.

8. The electronic device according to claim 7, further comprising: an additional conductive portion, disposed adjacent to the second non-conductive portion, wherein the wireless communication circuit is configured to transmit or receive a fourth signal on a fourth frequency band through the additional conductive portion, and The fourth frequency band includes a frequency band used for a wireless local area network (WLAN).

9. The electronic device according to claim 1, further comprising: a feeding structure, provided on one surface of the first connecting portion of the bridge portion or the second connecting portion of the bridge portion, wherein the frame corresponds to a metal frame, and The wireless communication circuit is configured to provide a signal to the first connection portion or the second connection portion through the feeding structure.

10. The electronic device according to claim 1, further comprising: non-conductive parts, wherein at least a portion of the non-conductive component is disposed within the first space of the first elongated portion, and At least another portion of the non-conductive component is disposed in the second space of the second elongated portion.

11. The electronic device according to claim 1 , further comprising: Communication module including multiple antenna elements wherein one surface of the conductive portion includes a plurality of radiation holes for the communication module, and At least a portion of the second elongated portion is formed on at least one radiation hole among the plurality of radiation holes.

12. The electronic device according to claim 1, further comprising: speaker, wherein one surface of the conductive portion includes a plurality of speaker holes for the speaker, and At least a portion of the second elongated portion is formed on at least one speaker hole among the plurality of speaker holes.

13. The electronic device according to claim 1, wherein The second elongated portion has a straight line shape, an “L” shape, or a “T” shape on one surface of the conductive portion.

14. The electronic device according to claim 1, further comprising: a grounding structure for said area; and The feeding structure for the region, The wireless communication circuit is configured to feed a signal to the feeding structure to radiate the signal through the area.

15. The electronic device according to claim 14, wherein the conductive portion includes a protrusion protruding in a direction toward the support portion, wherein the grounding structure is provided on one surface of the protrusion, The feeding structure is provided on a surface of the second connecting portion.

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