Planar three-dimensional structure processing method, storage medium, electronic equipment, device and decorative plate

Abstract

The invention relates to the technical field of plate processing, in particular to a planar three-dimensional structure processing method, a storage medium, electronic equipment, a device and a decorative plate. According to the planar three-dimensional structure processing method, firstly, the forming surface of a base material is coated with a forming material, and a to-be-pressed layer is obtained; embossing the to-be-pressed layer to form a three-dimensional layer; and finally, performing pattern printing on the three-dimensional layer to obtain a pattern layer, and completing the construction of the planar three-dimensional structure. According to the method, the three-dimensional structure is molded at a time in a physical compression molding mode through the embossing technology, then two-dimensional printing of the pattern is conducted on the surface of the three-dimensional structure, the needed three-dimensional structure is obtained, compared with a layered stacking mode, complex data analysis and path planning are not needed in the embossing molding process, and therefore the three-dimensional structure construction efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of plate processing, and in particular to a planar three-dimensional structure processing method, a storage medium, an electronic device, a device and a decorative plate. Background Art

[0002] The surface finishing process for decorative panels has evolved from two-dimensional to three-dimensional. Early techniques commonly used were flat printing or transfer printing, which applied ink to the substrate surface to create a fixed pattern. While these processes could replicate basic textures, their two-dimensional nature made it difficult to simulate the depth and layering of natural materials, and they also failed to meet market demand for customizable textures.

[0003] To overcome the limitations of two-dimensional decoration, the industry has begun exploring technologies for constructing three-dimensional structures. Within this context, 3D printing, with its ability to digitally stack materials, has gradually become a core method for creating highly realistic textures. By precisely controlling the layer-by-layer deposition and instant curing of photosensitive resin, microscopic three-dimensional topological structures such as wood ducts and stone cracks can be recreated on substrate surfaces, achieving a level of texture fidelity unattainable with traditional methods.

[0004] The current mainstream technical route adopts a three-stage process of "digital printing basic texture → stacking / depression printing three-dimensional structure → application of transparent topcoat". Although this solution has made significant progress in texture simulation, it has caused systemic cost problems due to the characteristics of technical implementation: the complexity of the equipment pushes up the initial investment: in order to achieve micron-level precision material stacking, it is necessary to integrate a multi-axis motion control system, a high-resolution nozzle array and a real-time curing device. This multi-system coordination requirement leads to extremely high equipment costs, especially for small and medium-sized manufacturing companies. It forms an unbearable financial barrier; the layered manufacturing mechanism amplifies material loss: the three-dimensional structure needs to undergo repeated stacking-curing cycles before it can be formed. In this process, the resin material that is not fully cured is prone to volatile loss, and the waste rate after the support structure is removed is significant. The significant improvement in production efficiency has resulted in significantly lower raw material utilization than traditional processes. The coupled nature of these processes has limited production efficiency: each printing unit undergoes time-consuming stages of 3D data analysis, nozzle path planning, and layer accuracy calibration. Furthermore, stacking and base pattern printing must be performed in a strictly sequential manner, making parallel processes impossible. This results in low molding efficiency. Furthermore, precision nozzles require frequent production interruptions for maintenance, further compressing effective production capacity. Technology dependency generates ongoing costs: Core components such as piezoelectric nozzles and UV light sources require periodic replacement. Their specialized and high-precision characteristics result in long-term high maintenance costs, resulting in a continuous sunk cost. The precision stacking process's stringent requirements for equipment accuracy, material properties, and process control create a mutually reinforcing cost-increasing cycle.

[0005] Therefore, the low efficiency of constructing planar three-dimensional structures is a technical problem that needs to be urgently solved by those skilled in the art. Summary of the Invention

[0006] The present invention provides a planar three-dimensional structure processing method, a storage medium, an electronic device, a device and a decorative plate. The method is used to solve the technical problem of low construction efficiency of planar three-dimensional structures in the prior art.

[0007] A first aspect of the present invention provides a method for processing a planar three-dimensional structure, comprising:

[0008] S10: coating the molding material on the molding surface of the substrate to obtain a layer to be pressed;

[0009] S11: embossing the layer to be pressed to form a three-dimensional layer;

[0010] S12: Printing a pattern on the three-dimensional layer to obtain a pattern layer.

[0011] In a first possible planar three-dimensional structure processing method of the first aspect, before S10, the method further includes:

[0012] S9: applying paint to the molded surface of the substrate to obtain a primer layer;

[0013] S10 includes: coating a molding material on the primer layer to obtain a layer to be pressed.

[0014] In combination with the first possible planar three-dimensional structure processing method of the first aspect, in the second possible planar three-dimensional structure processing method of the first aspect, after S9 and before S10, the method further includes:

[0015] S90: applying a base color coating on the primer layer to obtain a base color layer;

[0016] S10 includes: coating the molding material on the base color layer to obtain a layer to be pressed.

[0017] In combination with the second possible planar three-dimensional structure processing method of the first aspect, in a third possible planar three-dimensional structure processing method of the first aspect, after S9 and before S90, the method further includes:

[0018] S901: Curing the primer layer;

[0019] S902: Dust removal on the primer layer;

[0020] After S90 and before S10, it also includes:

[0021] S903: Curing the base color layer.

[0022] In a fourth possible planar three-dimensional structure processing method of the first aspect, before S10, the method further includes:

[0023] S8: applying a base color coating on the molded surface of the substrate to obtain a base color layer;

[0024] S10: comprising: coating the molding material on the base color layer to obtain a layer to be pressed.

[0025] In a fifth possible planar three-dimensional structure processing method of the first aspect, after S12, the method further includes:

[0026] S13: applying a transparent topcoat on the pattern layer to obtain a protective layer.

[0027] In a sixth possible planar three-dimensional structure processing method of the first aspect, after S11 and before S12, the method further includes:

[0028] S110: solidifying the three-dimensional layer.

[0029] In combination with the possible planar three-dimensional structure processing method provided by the first aspect, the first possible planar three-dimensional structure processing method of the first aspect, the second possible planar three-dimensional structure processing method of the first aspect, the third possible planar three-dimensional structure processing method of the first aspect, the fourth possible planar three-dimensional structure processing method of the first aspect, the fifth possible planar three-dimensional structure processing method of the first aspect, or the sixth possible planar three-dimensional structure processing method of the first aspect, in the seventh possible planar three-dimensional structure processing method of the first aspect, S11 includes:

[0030] S111: attaching a base color to the three-dimensional surface of the laminated film to obtain a base color layer;

[0031] S112: Pressing the pressing film into the layer to be pressed with the three-dimensional surface facing the layer to be pressed until the base color layer and the layer to be pressed are attached to each other and the base color layer is attached to the three-dimensional layer, thereby obtaining a colored three-dimensional layer;

[0032] S12 includes: printing a color matching pattern on the base color layer to obtain a pattern layer, and the pattern layer and the base color layer together constitute a final pattern.

[0033] In combination with the seventh possible planar three-dimensional structure processing method of the first aspect, in the eighth possible planar three-dimensional structure processing method of the first aspect, S111 includes:

[0034] The base color is attached to a part or the entire area of ​​the three-dimensional surface of the laminated film by spraying to obtain a base color layer.

[0035] In combination with a possible planar three-dimensional structure processing method provided by the first aspect, the first possible planar three-dimensional structure processing method of the first aspect, the second possible planar three-dimensional structure processing method of the first aspect, the third possible planar three-dimensional structure processing method of the first aspect, the fourth possible planar three-dimensional structure processing method of the first aspect, the fifth possible planar three-dimensional structure processing method of the first aspect, or the sixth possible planar three-dimensional structure processing method of the first aspect, in the ninth possible planar three-dimensional structure processing method of the first aspect, after S11 and before S12, the following steps are further included:

[0036] S113: performing regional spraying on the three-dimensional layer to obtain a regional color layer;

[0037] S12 includes: printing a pattern on the regional color layer and the three-dimensional layer to obtain a pattern layer, and the pattern layer and the regional color layer together constitute a final pattern.

[0038] In combination with the possible planar three-dimensional structure processing method provided by the first aspect, the first possible planar three-dimensional structure processing method of the first aspect, the second possible planar three-dimensional structure processing method of the first aspect, the third possible planar three-dimensional structure processing method of the first aspect, the fourth possible planar three-dimensional structure processing method of the first aspect, the fifth possible planar three-dimensional structure processing method of the first aspect, or the sixth possible planar three-dimensional structure processing method of the first aspect, in the tenth possible planar three-dimensional structure processing method of the first aspect, S11 includes:

[0039] S114: performing a first embossing process on the layer to be laminated by a first lamination process to obtain a three-dimensional layer prototype;

[0040] S115: performing a second embossing process on the three-dimensional layer prototype through a second lamination to obtain a three-dimensional layer, wherein the height of the three-dimensional protrusions on the first lamination is smaller than the height of the three-dimensional protrusions on the second lamination.

[0041] In combination with the tenth possible planar three-dimensional structure processing method of the first aspect, in the eleventh possible planar three-dimensional structure processing method of the first aspect, the shape of the three-dimensional structure of the first die is the same as the shape of the bottom of the three-dimensional structure at the same position on the second die.

[0042] 14. In conjunction with the eleventh possible planar three-dimensional structure processing method of the first aspect, in the twelfth possible planar three-dimensional structure processing method of the first aspect, after S114 and before S115, the method further includes:

[0043] S116: Preliminary solidification of the three-dimensional layer prototype.

[0044] The second aspect of the present invention provides an electronic device comprising a memory, a processor and a computer program stored in the memory, wherein the processor executes the computer program to implement the steps of any possible planar three-dimensional structure processing method provided in the first aspect.

[0045] A third aspect of the present invention provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of any possible planar three-dimensional structure processing method provided in the first aspect.

[0046] A fourth aspect of the present invention provides a planar three-dimensional structure processing device, which is used to perform any one of the planar three-dimensional structure processing methods provided in the first aspect, comprising:

[0047] A first coating component, used for coating the molding material;

[0048] An embossing component, used for embossing the layer to be pressed;

[0049] A printing component, used for printing patterns on the three-dimensional layer;

[0050] The input end of the embossing component is connected to the output end of the first coating component, and the output end is connected to the input end of the printing component.

[0051] In a first possible implementation of the planar three-dimensional structure processing device of the fourth aspect, the device further includes:

[0052] a second coating assembly for coating the substrate with paint;

[0053] A third coating component is used for base color coating;

[0054] A fourth coating component, for applying a clear topcoat;

[0055] The input end of the third coating component is connected to the output end of the second coating component, and the output end is connected to the input end of the first coating component;

[0056] The input end of the fourth coating component is connected to the output end of the printing component.

[0057] In combination with the planar three-dimensional structure processing device provided in the fourth aspect or the first possible implementation of the planar three-dimensional structure processing device of the fourth aspect, in the second possible implementation of the planar three-dimensional structure processing device of the fourth aspect, the embossing assembly includes an annular pressing film, a driving unit, and a coloring unit;

[0058] The driving part is used to drive the annular pressed film to circulate;

[0059] The coloring part is used to color the three-dimensional surface of the annular pressed film with a base color.

[0060] A fifth aspect of the present invention provides a decorative panel, which is manufactured using any possible planar and three-dimensional structure processing method provided in the first aspect or any possible planar and three-dimensional structure processing device provided in the fourth aspect, comprising:

[0061] Base material, three-dimensional layer and pattern layer;

[0062] The three-dimensional layer is arranged between the molding surface of the substrate and the pattern layer.

[0063] In a first possible implementation of the decorative panel of the fifth aspect, the present invention further includes:

[0064] Primer layer, base color layer and protective layer;

[0065] The primer layer is disposed between the substrate and the base color layer;

[0066] The pattern layer is disposed between the protective layer and the three-dimensional layer;

[0067] The three-dimensional layer is arranged on the base color layer.

[0068] In combination with the decorative board provided in the fifth aspect or the first possible decorative board of the fifth aspect, in the second possible decorative board of the fifth aspect, the substrate is a density board, a glass board or a metal board.

[0069] It can be seen from the above technical solutions that the present invention has the following advantages:

[0070] ① This technical solution first coats the forming surface of the substrate with a molding material to obtain a layer to be laminated; then, the layer to be laminated is embossed to form a three-dimensional layer; finally, a pattern is printed on the three-dimensional layer to obtain a pattern layer, completing the construction of a planar three-dimensional structure. By physically pressing and molding the three-dimensional structure through the embossing process, a three-dimensional structure is created in one go, and then a two-dimensional pattern is printed on the surface of the three-dimensional structure to obtain the desired three-dimensional structure. Compared to the layered stacking method, the embossing process does not require complex data analysis and path planning, thereby improving the efficiency of constructing the three-dimensional structure.

[0071] Embossing is used to create three-dimensional layers. This process requires only conventional embossing equipment, eliminating the need for high-precision printheads, multi-axis motion control, or real-time curing systems. Embossing equipment offers a simple structure, low cost, and easy integration into existing production lines, significantly reducing initial equipment investment. Furthermore, the core components of embossing equipment are highly durable, have a long replacement cycle, and are simple to maintain.

[0072] ③ By applying the molding material directly and then embossing it, a three-dimensional structure is formed in one go, avoiding the multiple stacking and curing cycles required for 3D printing. The embossing process produces no support structure waste, and the material is applied as a single layer (rather than layer by layer), reducing the risk of uncured material volatilization. This significantly improves raw material utilization and reduces overall waste. BRIEF DESCRIPTION OF THE DRAWINGS

[0073] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0074] Figure 1 A schematic flow chart of a method for processing a planar three-dimensional structure provided by an embodiment of the present invention;

[0075] Figure 2 A schematic flow chart of a method for processing a planar three-dimensional structure provided by an embodiment of the present invention;

[0076] Figure 3 A schematic flow chart of a method for processing a planar three-dimensional structure provided by an embodiment of the present invention;

[0077] Figure 4 A schematic structural diagram of a decorative panel provided by an embodiment of the present invention;

[0078] in:

[0079] 1. Base material 2. Primer layer 3. Base color layer

[0080] 4. Three-dimensional layer 5. Pattern layer 6. Protective layer. DETAILED DESCRIPTION

[0081] Embodiments of the present invention provide a planar three-dimensional structure processing method, storage medium, electronic equipment, device and plate, which are used to solve the technical problem that the construction efficiency of the planar three-dimensional structure in the prior art is low.

[0082] In order to make the purposes, features, and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0083] In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, they should not be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance.

[0084] In the description of the embodiments of the present application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, replaceable connections, or integral connections. They can also refer to mechanical connections or electrical connections. They can also refer to direct connections or indirect connections through an intermediate medium. They can also refer to internal connections between two components. For those skilled in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0085] In the existing technology, a three-stage process of "digital printing of basic textures → stacking / depression printing of three-dimensional structures → application of transparent topcoat" is used to construct planar three-dimensional structures. During the process, each printing unit needs to go through time-consuming three-dimensional data analysis, nozzle path planning and layering accuracy calibration stages, and stacking printing and basic texture printing must be carried out strictly sequentially, and process parallelization cannot be achieved, resulting in low molding efficiency. In addition, the precision nozzles need to frequently interrupt production for maintenance, further compressing effective production capacity.

[0086] Example 1

[0087] See also Figures 1 to 3 The method for processing a planar three-dimensional structure provided by an embodiment of the present invention includes:

[0088] S10: coating the molding material on the molding surface of the substrate 1 to obtain a layer to be pressed;

[0089] Specifically, a molding material is coated on the molding surface of the substrate 1 to provide a plastic medium for subsequent embossing. The substrate 1 (such as wood, metal plate) has a high hardness or low texture tolerance, and it is difficult to form a stable three-dimensional structure by direct embossing. The coating molding material can fill the micropores on the surface of the substrate 1 to form a uniform deformable layer. The molding material is applied to the surface of the substrate 1 using a scraper, roller or spraying device. The molding material must meet the following requirements: strong adhesion to the substrate 1 (such as epoxy resin, UV curing acrylate); thermoplasticity or ductility before curing; and controllable thickness to match the height of the three-dimensional structure. During the coating process, the thickness deviation needs to be controlled within 5% to ensure coating uniformity, otherwise it will lead to inconsistent embossing depth. The viscosity of the molding material must also be controlled to an appropriate level to prevent excessive viscosity from causing coating stripes or excessive viscosity from causing sagging. In addition, if a UV curing material is used, only pre-curing is performed to retain plasticity. For example, the substrate 1 is a density board, and the molding material is a polyurethane resin (viscosity 1500cP), which is coated with a precision roller coater at a temperature of 120g / m 2 The coating amount was applied evenly to form a layer to be pressed having a thickness of about 100 μm.

[0090] S11: embossing the layer to be pressed to form a three-dimensional layer 4;

[0091] Specifically, the layer to be pressed is physically pressed by an embossing mold, and a negative structure of the target texture is constructed on the surface of the embossing mold. The negative structure on the embossing mold is aligned and pressed into the layer to be pressed, thereby squeezing out the target texture on the layer to be pressed, realizing a one-time construction of a three-dimensional structure (such as wood grain ducts and stone convexity) to form a three-dimensional layer 4. The embossing mold needs to match the molding material to avoid excessive adhesion. The adhesion can also be further reduced by adding a release agent. The embossing depth needs to be 20%-80% of the thickness of the layer to be pressed to prevent penetration due to being too deep or insufficient three-dimensional sense due to being too shallow. In addition, the sharp corners on the negative structure can be rounded to prevent stress cracking.

[0092] S12: Printing a pattern on the three-dimensional layer 4 to obtain a pattern layer 5.

[0093] Specifically, this step imparts color patterns to the surface of the established three-dimensional structure to achieve precise matching of texture and color. It breaks through the process limitation of traditional processes that must first print a flat pattern and then stack the three-dimensional structure. The color and pattern are constructed on the surface of the three-dimensional structure by digital inkjet printing (such as piezoelectric nozzles, thermal foaming nozzles). The ink can be UV curing ink (suitable for instant curing needs) or water-based pigment ink (an additional drying process is required). During the process, the embossed feature points are identified by a visual sensor to achieve the alignment of the pattern and the three-dimensional structure. In addition, the ink needs to be compatible with the material of the three-dimensional layer 4 to avoid cracking or shrinkage; the distance between the nozzle and the highest point of the three-dimensional layer 4 needs to be constant (such as 0.5-1mm) to prevent scratches. By reversing the process of "physical embossing to construct a three-dimensional base first, and then digitally printing to impart color" (compared to the traditional 3D printing of "first flat printing → then stacking three-dimensional"), the time loss and equipment complexity of layered manufacturing are fundamentally avoided.

[0094] The beneficial effects of this embodiment include:

[0095] ① The three-dimensional structure is formed in one go through physical pressing by embossing technology, and then the pattern is printed in two dimensions on the surface of the three-dimensional structure to obtain the required three-dimensional structure. Compared with the layered stacking method, the embossing process does not require complex data analysis and path planning, thereby improving the efficiency of three-dimensional structure construction.

[0096] Second, embossing is used to create the three-dimensional layer 4. This process requires only conventional embossing equipment, eliminating the need for high-precision printheads, multi-axis motion control, or real-time curing systems. Embossing equipment offers a simple structure, low cost, and easy integration into existing production lines, significantly reducing initial equipment investment. Furthermore, the core components of the embossing equipment are highly durable, have a long replacement cycle, and are simple to maintain.

[0097] ③ By applying the molding material directly and then embossing it, a three-dimensional structure is formed in one go, avoiding the multiple stacking and curing cycles required for 3D printing. The embossing process produces no support structure waste, and the material is applied as a single layer (rather than layer by layer), reducing the risk of uncured material volatilization. This significantly improves raw material utilization and reduces overall waste.

[0098] ④The embossing mold can be replaced to achieve small batch multi-texture production.

[0099] Optimized, in order to improve the interfacial bonding strength between the substrate 1 and the molding material and avoid interlayer peeling during the embossing process, a primer coating process is added before step S10:

[0100] S9: applying paint to the molded surface of the substrate 1 to obtain a primer layer 2;

[0101] Specifically, paint is applied to the molded surface of substrate 1 using a roller coater or sprayer to seal gaps in substrate 1 and prevent subsequent molding material from penetrating into substrate 1 and causing waste. This also forms a chemically bonded transition layer between substrate 1 and the molding material, enhancing adhesion. The surface tension of primer layer 2 must be between that of substrate 1 and the molding material. The type of paint should be selected based on the characteristics of substrate 1: For porous substrates 1 (wood, gypsum board), a penetrating epoxy primer (solids content ≥ 40%) should be used; for non-porous substrates 1 (metal, PVC), a modified polyurethane primer (containing an adhesion promoter) should be used. Furthermore, prior to paint application, substrate 1 must be pretreated, such as degreasing metal substrates and sanding wood.

[0102] Accordingly, S10 is optimized as follows: coating the molding material on the primer layer 2 to obtain a layer to be pressed.

[0103] It should be noted that the molding material must contain functional groups that can react with the primer (such as hydroxyl, carboxyl); it should be applied when the primer layer 2 is not fully cured (curing degree 50%-70%) to promote interfacial interpenetration; the thickness of the molding material layer should be ≥ 3 times the thickness of the primer layer 2 to avoid the embossing stress from being transferred to the primer. For example, on the epoxy primer layer 2 that is not fully cured, a polyurethane molding material (viscosity 1800 cP) is applied with a coating amount of 150 g / m 2 , forming a layer to be pressed with a thickness of about 120μm. An amino-isocyanate cross-linking reaction occurs at the interface between the primer and the molding material.

[0104] Optimized: To improve color consistency, reduce ink usage for pattern printing and increase printing speed, a base color coating process is added between steps S9 and S10:

[0105] S90: applying a base color coating on the primer layer 2 to obtain a base color layer 3;

[0106] Specifically, a color coater is applied to the primer layer 2 using a precision roller coater or curtain coater. This provides a base color tone for the three-dimensional structure (e.g., beige for wood grain or off-white for stone), eliminating the need for full-coverage spraying during pattern printing. This also masks color variations in the substrate 1, uniforming base color fluctuations across batches. Furthermore, the light-colored base layer 3 enhances the brightness of the subsequent printed pattern, achieving an optically enhanced effect. The color coat can be either a solvent-based or UV-curable base coat. It is important to ensure that the base layer 3 completely covers the primer layer 2.

[0107] Accordingly, S10 is optimized as follows: coating the molding material on the base layer 3 to obtain the layer to be pressed. Due to the presence of the base layer 3, even when the embossing depth is reduced, the same three-dimensional effect can still be achieved with the base layer. For example, after embossing, the raised parts of the wood grain are transparent, while the recessed parts show the base color. At the same time, the base layer 3 assumes the basic color tone. S12 printing only requires local color correction (such as wood grain ducts and stone texture points), reducing the amount of high-cost digital ink and simplifying the printing process. For example, only dark textures need to be printed on the raised parts, while the base color is retained in the recessed parts, reducing the amount of ink used, thereby increasing the printing speed. It is important to note that the light transmittance of the molding material must be ≥85% (380-780nm wavelength) to avoid covering the base color; the refractive index difference between the molding material and the base layer 3 must be ≤0.05 (for example, if the acrylic base layer 3 has n=1.49, the molding material should be a polyurethane with n=1.45-1.53). More preferably, the molding material contains carboxyl groups to form hydrogen bonds with the hydroxyl groups of the base layer 3.

[0108] Optimized, in order to solve the embossing cracking problem caused by poor interlayer bonding, add the following steps after S9 and before S90:

[0109] S901: Curing the primer layer 2;

[0110] Specifically, primer layer 2 is cured using a UV-LED curing machine (wavelength 365-405nm) or a hot air drying tunnel, bringing it to a semi-cured state. This provides sufficient mechanical strength to support subsequent steps while retaining active groups for chemical bonding to base layer 3. During this process, the epoxy group conversion rate is monitored using FTIR (Fourier Transform Infrared Spectroscopy) to monitor the degree of cure.

[0111] S902: removing dust from the primer layer 2;

[0112] Specifically, in this step, static electricity is first eliminated by an ion air knife, then non-contact vacuum cleaning is used, and finally residual particles are removed by a sticky roller, thereby removing the particles adsorbed on the surface of the semi-cured primer layer 2 to prevent the particles from being pressed into the coating to form pits during embossing.

[0113] Accordingly, the following steps are added after S90 and before S10:

[0114] S903: Curing the base color layer 3.

[0115] Specifically, long-wave UV (395nm) or far-infrared heating is used to allow the energy gradient to penetrate the base color layer 3; step curing of the base color layer 3 is achieved: pre-curing hardens the surface + main curing makes the overall curing degree reach 75%-80%, so that the base color layer 3 reaches the state of "surface dry and hard, bottom layer semi-active": the surface is completely hardened (anti-stick roller), and the bottom layer retains unreacted groups for the molding material to penetrate. In addition, it can be cured in a nitrogen atmosphere (oxygen content ≤ 200ppm) to prevent surface oxygen inhibition. By precisely controlling the process window of "semi-curing-dust removal-step curing", the interface failure problem of the multi-layer coating system during the embossing process is solved, which is particularly suitable for high-precision three-dimensional texture manufacturing.

[0116] Optimized, in order to improve wear resistance, the following steps are added after S12:

[0117] S13: applying a transparent topcoat on the pattern layer 5 to obtain a protective layer 6.

[0118] Specifically, a layer of transparent topcoat is applied to the pattern layer 5 via high-precision roller coating or electrostatic spraying to prevent abrasion of the raised portions of the three-dimensional layer 4 during transportation and installation. This prevents UV rays and moisture from eroding the ink in the pattern layer 5, improving chemical stability. Refractive index matching can also be used to enhance the visual depth of the three-dimensional texture, achieving optical optimization. The transparent topcoat can be a UV-curable topcoat for high wear resistance, or a water-based polyurethane for applications with high environmental requirements. It is important to note that the surface tension of the topcoat must be lower than that of the pattern layer 5. A wetting agent can also be added to the topcoat to control the wettability of the interface. When rolling, the rubber roller hardness should be controlled to avoid collapsing the micro-protrusions. When spraying, the atomization pressure should be controlled to an appropriate level to ensure even coverage of the recessed areas. The topcoat fills the recessed areas of the three-dimensional texture, but does not need to be completely leveled to preserve the tactile texture. By adding a layer of transparent topcoat, the durability of the product is significantly improved while maintaining the tactile feel of the three-dimensional texture, making it particularly suitable for high-contact applications such as flooring and furniture.

[0119] Optimized, in order to avoid printing distortion caused by deformation of the embossed structure, the following three-dimensional layer 4 curing process is added between S11 and S12.

[0120] S110: solidifying the three-dimensional layer 4.

[0121] Specifically, after the three-dimensional layer 4 is obtained by embossing, the three-dimensional layer 4 is cured by UV curing or thermal curing to fix the embossed structure, prevent the three-dimensional layer 4 from being deformed due to printing pressure, and at the same time increase the surface tension of the three-dimensional layer 4 to ensure accurate wetting of the ink and avoid capillary diffusion. It can also release the plastic deformation stress generated by the embossing process and reduce the risk of warping in the later stage. It should be noted that during thermal curing, an infrared thermal imager is used for real-time monitoring to control the surface temperature difference of the substrate 1 to ≤±3°C to avoid local shrinkage; UV curing requires nitrogen protection to prevent the surface from becoming sticky. By adding the "precision curing after embossing" step, the problem of physical stability of the three-dimensional structure during the printing process is systematically solved, which is particularly suitable for the manufacture of three-dimensional textures with micron-level precision. Those skilled in the art can choose UV or thermal curing mode according to the characteristics of the molding material.

[0122] To further improve processing efficiency and solve the problem of ink being difficult to fill in the grooves, S11 is optimized into the following steps:

[0123] S111: attaching a base color to the three-dimensional surface of the laminated film to obtain a base color layer;

[0124] Specifically, electrostatic spraying or dipping is used to attach the base color to the three-dimensional surface of the laminate to achieve preset base color, provide a uniform base color for the concave area of ​​the three-dimensional structure, and avoid white defects caused by the inability of ink to penetrate into the micron-level grooves during printing. Optimally, a centrifugal stripping process can be added after electrostatic spraying or dipping. The base color material can be a quick-drying alkyd resin paint. It should be noted that the thickness of the base color layer in the groove needs to be 2-3 times that of the flat area to compensate for the printing loss; the base color layer sequence is controlled to be dry and non-sticky (solvent volatility ≥ 90%) to avoid adhesion during transfer.

[0125] Further optimization, in order to accurately control the spraying area and thickness distribution, and solve the problems of base color waste and non-target area pollution caused by traditional dipping, S111 is optimized as follows: the base color is attached to the local or entire area of ​​the three-dimensional surface of the laminated film by spraying to obtain a base color layer.

[0126] Specifically, a 3D scan is performed on the pressed three-dimensional surface to identify the spraying target area (such as identifying a groove area with a depth ≥ 50μm as the spraying target area), and then a regional spraying path is generated according to the target area. The robot arm is then equipped with a piezoelectric micro-point nozzle to spray along the spraying path, and a quick-drying paint is used as the base color material. In addition, the paint film can be made surface dry by infrared flash drying to prevent sagging before embossing. The functional zoning coloring of the three-dimensional structure is achieved through the combination of "robotic precision spraying + embossing transfer". Those skilled in the art can program the spraying path according to the texture characteristics. In addition, it can be expanded to multi-color base color spraying, such as spraying dark brown first and then light yellow to simulate the difference between the heartwood and sapwood of wood.

[0127] S112: Pressing the pressing film into the layer to be pressed with the three-dimensional surface facing the layer to be pressed until the base color layer and the layer to be pressed are attached to each other and the base color layer is attached to the three-dimensional layer 4, thereby obtaining a colored three-dimensional layer 4;

[0128] Specifically, the laminating film is pressed into the layer to be pressed to achieve the three-dimensional structure, while the base color layer is transferred to the surface of the three-dimensional structure to achieve the coloring of the three-dimensional structure. It is important to note that after the laminating film is pressed into place, the pressure and temperature must be maintained to drive the base color layer to peel off from the laminating film. At the same time, the deformation resistance of the layer to be pressed is reduced to ensure that the base color layer is fully transferred.

[0129] S12 includes: printing a color matching pattern on the base color layer to obtain a pattern layer 5, and the pattern layer 5 and the base color layer together constitute a final pattern.

[0130] Specifically, the base color layer has covered the three-dimensional structure, especially forming sufficient coverage of the recessed area. In this step, emphasis is placed on color matching printing, and only a thin layer of printing is required on the raised part to avoid excessive accumulation of ink. At the same time, the base color layer can provide a visual alignment reference to avoid multiple printing positioning deviations.

[0131] By pre-attaching a base color layer to the three-dimensional surface of the laminate, structural pressing and base color transfer are achieved simultaneously, realizing the process innovation of "laminated pre-coloring - embossing simultaneous transfer", breaking through the technical bottleneck of coloring deep grooves in three-dimensional structures. The base color layer is forcibly filled into micro-grooves with a depth-to-width ratio greater than 5:1 through physical embossing, solving the problem of microscopic coloring. At the same time, ink usage is reduced, reducing printing complexity and improving printing efficiency. The base color layer forms a gradient thickness within the grooves (thick at the bottom → thin at the mouth), simulating the color absorption characteristics of natural materials and enhancing texture fidelity. Combined with the base color scheme, it achieves three-layer coloring, increasing the sense of color layering. In addition, the transition between the grooves and the surface is natural, adding to the tactile authenticity.

[0132] Optimized, in order to solve the problem of material tearing caused by one-time pressing of deep three-dimensional structures, S11 is optimized into the following steps:

[0133] S114: performing a first embossing process on the layer to be laminated by a first lamination process to obtain a prototype of a three-dimensional layer 4;

[0134] Specifically, the raised height H1 of the first lamination is 30%-60% of the final height of the three-dimensional structure. This first lamination provides a preliminary shallow texture pattern for the layer to be embossed, providing a guide structure for the secondary embossing. Simultaneously, it pre-compresses the molding material, eliminating air bubbles within the layer to be embossed, thereby improving density uniformity. Alternatively, the raised height H1 of the first lamination can be the height of all three-dimensional structures whose raised heights are less than a certain threshold, meaning that shallow, wider depressions are compressed first.

[0135] S115: performing a second embossing process on the prototype of the three-dimensional layer 4 through a second lamination to obtain a three-dimensional layer 4, wherein the height of the three-dimensional protrusions on the first lamination is smaller than the height of the three-dimensional protrusions on the second lamination.

[0136] Specifically, the height H2 of the three-dimensional protrusions of the second die is 100% of the final height. This second die is then used to emboss the prototype of the three-dimensional layer 4 a second time, deepening the texture to the target size based on the prototype, achieving depth extension, while also sharpening the edges, enhancing texture clarity, and achieving detailed characterization. It should be noted that the dwell time of the first embossing is shorter than that of the second embossing. The embossing temperature control requires a gradient, with the first embossing temperature being relatively low to prevent sagging and the second embossing temperature being relatively high to promote flow. The shape of the three-dimensional structure of the first die is identical to the bottom shape of the three-dimensional structure at the same location on the second die. That is, the outer contour of the protrusions of the first die is equal to the outer contour of the bottom of the protrusions at the same location on the second die. This ensures that the contour of the prototype formed by the rough embossing precisely matches the base structure of the fine embossing die, avoiding material wrinkles caused by misalignment during the step-by-step embossing. Through "die geometry inheritance design," seamless integration of the step-by-step embossing is achieved, making it particularly suitable for producing three-dimensional textures with micron-level precision. Those skilled in the art can generate the die segment by segment based on the 3D model data of the target texture.

[0137] Through a step-by-step pressing strategy of "rough embossing with short projections → fine embossing with high projections," the first embossing eliminates 40%-60% of internal stress, allowing the secondary embossing to safely apply higher pressure and achieve a step-by-step stress release. Simultaneously, the prototype structure guides the material's directional flow during the secondary embossing, preventing lateral accumulation and optimizing the fluidity of the molded material. By performing two embossing operations with increasing heights, not only does this avoid the material tearing associated with a single press, it also breaks through the physical limitations of single-stage molding for deep, three-dimensional structures. Those skilled in the art can adjust the parameters of the two-stage embossing according to the target texture depth.

[0138] Optimized, in order to prevent the rough pressing structure from collapsing and deforming during the fine pressing process, the following steps are added after S114 and before S115:

[0139] S116: Preliminary solidification of the three-dimensional layer 4 prototype.

[0140] Specifically, the surface of the prototype three-dimensional layer 4 is cured through UV localized curing or thermal gradient curing, while maintaining the thermoplastic interior. The surface is cured to a rigid state, forming a "rigid shell" that resists the lateral force of the second pressing press, preventing impact displacement. The uncured core maintains an appropriate crosslink density, ensuring plastic flow of the molding material during the second embossing, allowing for directional flow to fill the mold's sharp corners. This "rough pressing → selective surface curing → fine pressing" process overcomes the challenge of multi-step molding of high-aspect-ratio three-dimensional structures. Those skilled in the art can adjust the curing depth based on the material's rheological properties.

[0141] Example 2

[0142] An embodiment of the present invention provides a planar three-dimensional structure processing device, which processes a planar three-dimensional structure according to the planar three-dimensional structure processing method provided in the first embodiment, including:

[0143] The first coating component is used to coat the molding material; the embossing component is used to emboss the layer to be laminated; the printing component is used to print patterns on the three-dimensional layer 4; the input end of the embossing component is connected to the output end of the first coating component, and the output end is connected to the input end of the printing component.

[0144] Specifically, the first coating assembly includes a constant temperature feeding system, a precision anilox roller, and an anti-static rod. The constant temperature feeding system is used to maintain the viscosity of the molding material. The jacket water temperature is adjusted (±0.5°C) using a PID algorithm to ensure coating leveling. The precision anilox roller is used to quantitatively transfer the molding material. The gap between the roller and the rubber back pressure roller is controlled to achieve closed-loop control of film thickness (feedback from a β-ray thickness gauge). The anti-static rod is used to eliminate static electricity on the surface of substrate 1. It is located in the pre-coating station to prevent the material from absorbing dust. The processing flow of the first coating assembly is: substrate 1 → anti-static rod → preheating → gap coating → online thickness measurement → automatic scraper compensation. The embossing assembly includes an embossing die, an infrared temperature measurement array, and a nano-release coating. The embossing die can be a laser-engraved embossing roller or a film, with a negative texture engraved on its surface. It is linked to a hydraulic system to automatically increase pressure in deep-textured areas. The infrared temperature measurement array monitors the surface temperature of the substrate 1 in real time and feeds the monitored temperature back to the thermal oil temperature control system (±1°C) to ensure optimal material flow. The nano-release coating is applied to the embossing die and automatically reapplied every 100 impressions to prevent material adhesion. The processing flow of the embossing assembly is as follows: coating the substrate 1 → embossing die preheating zone → main pressing zone → pressure holding and shaping → automatic peeling. The printing component includes an adaptive print head, a UV-hot air composite curing unit and a machine vision positioning unit. The piezoelectric nozzle of the adaptive print head floats on the Z axis, the laser rangefinder obtains the height of the three-dimensional layer 4 in real time, and the nozzle spacing is pneumatically adjusted (to prevent scratches); the energy density of the UV-hot air composite curing unit is adjustable, and the mode can be switched according to the ink type: hot air is used for dye ink, and UV curing is used for pigment ink; machine vision positioning is used to identify the characteristic points of the three-dimensional layer 4, and share coordinate data with the embossing component to achieve precise pattern-texture alignment. The processing flow of the printing component is: three-dimensional layer 4 enters → laser scanning height → machine vision positioning → inkjet printing → graded curing (pre-curing + main curing).

[0145] The optimized, planar three-dimensional structure processing device is also provided with a second coating component for coating the substrate 1 with paint, which includes a precision roller coating unit and a UV curing module, wherein the precision roller coating unit is provided with a rubber-coated steel rod and a ceramic anilox roller, and the UV curing module is provided with multiple groups of LED-UV lamps. After dust removal, the substrate 1 enters the roller coating unit for primer coating to obtain a primer layer 2 with uniform thickness, and then the primer layer 2 is instantly cured by multiple groups of LED-UV lamps; the third coating component is used for base color coating, which includes a high-precision curtain coating machine equipped with a constant pressure feeding system, an online colorimeter and an infrared drying unit. The substrate 1 is dried from the first coating unit to the second coating unit. After flowing out of the second coating component, it flows into the third coating component, and is coated with a base color by a curtain coater to form a base color layer 3 on the primer layer 2. The base color layer 3 is then cured by infrared pre-curing and UV main curing, and real-time color detection is performed by an online colorimeter, and the curtain coater is controlled to perform color correction based on the detection results; the fourth coating component is used for transparent topcoat coating, and precision roller coating or electrostatic spraying can be selected according to the complexity of the texture; the input end of the third coating component is connected to the output end of the second coating component, and the output end is connected to the input end of the first coating component; the input end of the fourth coating component is connected to the output end of the printing component.

[0146] Preferably, the embossing assembly includes an annular pressing film, a driving part and a coloring part; the driving part is used to drive the annular pressing film to circulate and realize precise tension control of the annular pressing film; the coloring part is used to color the three-dimensional surface of the annular pressing film with a base color, and a robotic spraying station can be used. Specifically, the texture groove is scanned by laser, and then the micro-dot nozzle is driven by a six-axis robotic arm to spray. Further optimized, the annular pressing film flows counterclockwise, and the flow path is an upward triangle, the bottom surface of which is used to emboss the layer to be pressed, and the left side or / and right side corresponds to the coloring part for base color attachment. When the left side corresponds to the coloring part, a cleaning part corresponding to the right side can be added to clean the annular pressing film after embossing to remove the base color remaining thereon and prepare for the next base color attachment; when the right side corresponds to the coloring part, a drying part corresponding to the left side can be added to dry the annular pressing film after coloring to form a paint film on the base color layer to prevent sagging before printing; when the left side and the right side are both provided with a corresponding coloring part, the coloring efficiency can be improved, and the annular pressing film can also be colored in batches to achieve separate attachment of different colors.

[0147] Example 3

[0148] See also Figure 4 The embodiment of the present invention provides a decorative board, which is manufactured by the planar three-dimensional structure processing method provided in the first embodiment or the planar three-dimensional structure processing device provided in the second embodiment, comprising:

[0149] Substrate 1, three-dimensional layer 4, and pattern layer 5; three-dimensional layer 4 is disposed between the molding surface of substrate 1 and pattern layer 5. Three-dimensional layer 4 is obtained by embossing a pre-pressed layer composed of molding material. Optimally, the decorative panel also includes a primer layer 2, a base color layer 3, and a protective layer 6. Primer layer 2 enhances the adhesion and overall strength of substrate 1, and an appropriate coating amount can be selected based on the type of substrate 1. Base color layer 3 serves as the foundation for subsequent coloring, and can be applied based on the desired pattern, texture, and color. Protective layer 6 protects the pattern and enhances surface properties. Primer layer 2 is disposed between the molding surface and base color layer 3; three-dimensional layer 4 is disposed between a transparent base layer and pattern layer 5; the transparent base layer is disposed on base color layer 3; and protective layer 6 is disposed on pattern layer 5. Optionally, substrate 1 can be a density board, a glass plate, or a metal plate.

[0150] Example 4

[0151] An embodiment of the present invention further provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the planar three-dimensional structure processing method of embodiment one is implemented. The computer-readable storage medium can be any available medium that can be stored by a computing device or a data storage device such as a data center containing one or more available media. The available medium can be a magnetic medium (for example, a floppy disk, a hard disk, a magnetic tape), an optical medium (for example, a high-density digital video disc (DVD)), or a semiconductor medium (for example, a solid-state hard disk), etc. The computer-readable storage medium includes instructions that instruct the computing device to execute any one of the planar three-dimensional structure processing methods provided in embodiment one.

[0152] Example 5

[0153] An embodiment of the present invention further provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory;

[0154] The processor executes the computer program to implement the planar three-dimensional structure processing method in the first embodiment.

[0155] Those skilled in the art can clearly understand that for the convenience and brevity of description, other working processes of the method described above can refer to the corresponding processes in the aforementioned embodiments and will not be repeated here.

[0156] Through the description of the above embodiments, those skilled in the art can clearly understand that the present application can be implemented by means of software plus necessary general hardware, and of course can also be implemented by special hardware including application-specific integrated circuits, special CPUs, special memories, special components, etc. In general, all functions performed by computer programs can be easily implemented with corresponding hardware, and the specific hardware structures used to implement the same function can also be various, such as analog circuits, digital circuits or special circuits, etc. However, for the present application, software program implementation is a better implementation method in most cases. Based on such an understanding, the technical solution of the present application is essentially or the part that contributes to the prior art can be embodied in the form of a software product, which is stored in a readable storage medium, such as a computer's floppy disk, USB flash drive, mobile hard disk, ROM, RAM, magnetic disk or optical disk, etc., and includes a number of instructions to enable a computer device (which can be a personal computer, training equipment, or network equipment, etc.) to execute the methods of each embodiment of the present application.

[0157] In the above embodiments, all or part of the embodiments may be implemented by software, hardware, firmware, or any combination thereof. When implemented by software, all or part of the embodiments may be implemented in the form of a computer program product.

[0158] The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the process or function according to the embodiment of the present application is generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions can be transmitted from a website, computer, training equipment or data center to another website, computer, training equipment or data center via a wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) method. The computer-readable storage medium can be any available medium that a computer can store or a data storage device such as a training equipment, data center, etc. that includes one or more available media integrations. Available media can be magnetic media, (e.g., floppy disk, hard disk, tape), optical media (e.g., DVD), or semiconductor media (e.g., solid-state drive (SSD)), etc.

[0159] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A method for processing a planar three-dimensional structure, characterized in that: include: S10: coating the molding material on the molding surface of the substrate to obtain a layer to be pressed; S11: embossing the layer to be pressed to form a three-dimensional layer; S12: Printing a pattern on the three-dimensional layer to obtain a pattern layer.

2. A method for processing a planar three-dimensional structure according to claim 1, characterized in that: Before S10, it also included: S9: applying paint to the molded surface of the substrate to obtain a primer layer; S10 includes: coating a molding material on the primer layer to obtain a layer to be pressed.

3. A method for processing a planar three-dimensional structure according to claim 2, characterized in that: After S9 and before S10, it also includes: S90: applying a base color coating on the primer layer to obtain a base color layer; S10 includes: coating the molding material on the base color layer to obtain a layer to be pressed.

4. A method for processing a planar three-dimensional structure according to claim 3, characterized in that: After S9 and before S90, it also includes: S901: Curing the primer layer; S902: Dust removal on the primer layer; After S90 and before S10, it also includes: S903: Curing the base color layer.

5. A method for processing a planar three-dimensional structure according to claim 1, characterized in that: Before S10, it also included: S8: applying a base color coating on the molded surface of the substrate to obtain a base color layer; S10: comprising: coating the molding material on the base color layer to obtain a layer to be pressed.

6. A method for processing a planar three-dimensional structure according to claim 1, characterized in that: S12 and later also include: S13: applying a transparent topcoat on the pattern layer to obtain a protective layer.

7. A method for processing a planar three-dimensional structure according to claim 1, characterized in that: After S11 and before S12, it also includes: S110: solidifying the three-dimensional layer.

8. A method for processing a planar three-dimensional structure according to any one of claims 1 to 7, characterized in that: The S11 includes: S111: attaching a base color to the three-dimensional surface of the laminated film to obtain a base color layer; S112: Pressing the pressing film into the layer to be pressed with the three-dimensional surface facing the layer to be pressed until the base color layer and the layer to be pressed are attached to each other and the base color layer is attached to the three-dimensional layer, thereby obtaining a colored three-dimensional layer; S12 includes: printing a color matching pattern on the base color layer to obtain a pattern layer, and the pattern layer and the base color layer together constitute a final pattern.

9. A method for processing a planar three-dimensional structure according to claim 8, characterized in that: S111 includes: The base color is attached to a part or the entire area of ​​the three-dimensional surface of the laminated film by spraying to obtain a base color layer.

10. A method for processing a planar three-dimensional structure according to any one of claims 1 to 7, characterized in that: After S11 and before S12, it also includes: S113: performing regional spraying on the three-dimensional layer to obtain a regional color layer; S12 includes: printing a pattern on the regional color layer and the three-dimensional layer to obtain a pattern layer, and the pattern layer and the regional color layer together constitute a final pattern.

11. A method for processing a planar three-dimensional structure according to any one of claims 1 to 7, characterized in that: The S11 includes: S114: performing a first embossing process on the layer to be laminated by a first lamination process to obtain a three-dimensional layer prototype; S115: performing a second embossing process on the three-dimensional layer prototype through a second lamination to obtain a three-dimensional layer, wherein the height of the three-dimensional protrusions on the first lamination is smaller than the height of the three-dimensional protrusions on the second lamination.

12. A method for processing a planar three-dimensional structure according to claim 11, characterized in that: The shape of the three-dimensional structure of the first laminate is the same as the shape of the bottom of the three-dimensional structure at the same position on the second laminate.

13. A method for processing a planar three-dimensional structure according to claim 12, characterized in that: After S114 and before S115, it also includes: S116: Preliminary solidification of the three-dimensional layer prototype.

14. An electronic device comprising a memory, a processor, and a computer program stored in the memory, wherein: The processor executes the computer program to implement the steps of the planar three-dimensional structure processing method according to any one of claims 1 to 13.

15. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the planar three-dimensional structure processing method according to any one of claims 1 to 13 are implemented.

16. A planar three-dimensional structure processing device, used to execute the planar three-dimensional structure processing method according to any one of claims 1 to 13, characterized in that: include: A first coating component, used for coating the molding material; An embossing component, used for embossing the layer to be pressed; A printing component, used for printing patterns on the three-dimensional layer; The input end of the embossing component is connected to the output end of the first coating component, and the output end is connected to the input end of the printing component.

17. A planar three-dimensional structure processing device according to claim 16, characterized in that: Also includes: a second coating assembly for coating the substrate with paint; A third coating component is used for base color coating; A fourth coating component, for applying a clear topcoat; The input end of the third coating component is connected to the output end of the second coating component, and the output end is connected to the input end of the first coating component; The input end of the fourth coating component is connected to the output end of the printing component.

18. A planar three-dimensional structure processing device according to claim 16 or 17, characterized in that: The embossing assembly includes an annular pressing film, a driving part and a coloring part; The driving part is used to drive the annular pressing film to circulate; The coloring portion is used to color the three-dimensional surface of the annular pressed film with a base color.

19. A decorative board, produced by the planar and three-dimensional structure processing method according to any one of claims 1 to 13 or the planar and three-dimensional structure processing device according to any one of claims 16 to 18, characterized in that: include: Base material, three-dimensional layer and pattern layer; The three-dimensional layer is arranged between the molding surface of the substrate and the pattern layer.

20. A decorative panel according to claim 19, characterized in that: Also includes: Primer layer, base color layer and protective layer; The primer layer is provided between the substrate and the base color layer; The pattern layer is provided between the protective layer and the three-dimensional layer; The three-dimensional layer is arranged on the base color layer.

21. A decorative panel according to claim 19 or 20, characterized in that: The substrate is a density board, a glass board or a metal board.

Images