Double-dispensing mechanism of semiconductor packaging all-in-one machine

Abstract

The invention discloses a double-dispensing mechanism of a semiconductor packaging all-in-one machine, and relates to the technical field of semiconductor packaging, the double-dispensing mechanism comprises a platform and a material conveying table, the platform is provided with a first three-axis guide rail and a second three-axis guide rail which are arranged in parallel, a first glue head is arranged on a Z-axis guide rail of the first three-axis guide rail, and a second glue head is arranged on a Z-axis guide rail of the second three-axis guide rail; the first glue head and the second glue head are oppositely arranged, the conveying table conveys materials in the Y-axis direction of the first three-axis guide rail and the Y-axis direction of the second three-axis guide rail, a template clamping head is arranged at the glue dispensing position of the second glue head and used for carrying a dam body, the dam body is used for storing glue liquid discharged by the second glue head in a surrounding mode, and the first glue head is used for dotting a single-layer glue ring matched with the dam body in size on the outer side of a chip. And the chip set moves in the directions of the first rubber head and the second rubber head through the material conveying table, and the first rubber head conducts rubber ring dotting. According to the method, the box dam can be prefabricated, so that the uniformity of the box dam is guaranteed, step-by-step machining is achieved, synchronous working can be achieved, and the working efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a double-dispensing mechanism of a semiconductor packaging all-in-one machine. Background Art

[0002] In the semiconductor packaging process, dam dispensing technology is widely used in packaging scenarios such as chip bottom filling, cavity sealing, and preventing glue overflow. This technology requires the precise coating of high-viscosity glue on the periphery of the chip or substrate to form a closed dam structure to ensure that the subsequent filling glue is evenly distributed and avoid overflow. Traditional single dispensing systems face significant challenges in dam dispensing. On the one hand, it is difficult for a single nozzle to complete multilateral dams simultaneously, and segmented dispensing is prone to uneven glue line interfaces due to start-stop delays, affecting sealing. On the other hand, the formation of high-aspect ratio glue lines requires the nozzle to maintain constant pressure when dispensing glue at high speed. However, the existing system often has glue stacking or glue breakage defects due to pressure fluctuations. It is urgent to develop a working method with dual dispensing heads working together and combining prefabricated dams with dotting paths. Through the spatial staggered layout and synchronous control of the dual dispensing heads, the dam can be quickly placed, while improving dispensing efficiency and process consistency to meet the stringent requirements of high-precision semiconductor packaging.

[0003] The patent with announcement number CN201820416306.9 discloses a dual dispensing mechanism of a semiconductor packaging all-in-one machine, including a first dispensing mechanism, the first dispensing mechanism including a first dispensing head, a first X-axis linear guide pair, a first Y-axis linear guide pair arranged perpendicular to the first X-axis linear guide pair, and a loading platform, the first dispensing head is movably connected to the slider of the first Y-axis linear guide pair through a first connecting member; it also includes a second dispensing mechanism and a controller, the second dispensing mechanism including a second dispensing head, a second Y-axis linear guide pair arranged perpendicular to the first X-axis linear guide pair, the second dispensing head is movably connected to the slider of the second Y-axis linear guide pair through a second connecting member; the controller controls the first dispensing mechanism and the second dispensing mechanism to perform dispensing according to a predetermined mode. This patent has the advantages of simple structure, low cost and few failure points, but there is still a problem that the stacking of colloids in the dam dispensing process is time-consuming and defects are prone to cause circuit board contamination. Summary of the Invention

[0004] In response to the shortcomings of the existing technology, the present invention provides a dual dispensing mechanism for a semiconductor packaging all-in-one machine, which can achieve the uniformity of the dam through prefabricated dams, and at the same time perform step-by-step processing and work synchronously, thereby improving work efficiency.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: a dual-dispensing mechanism for a semiconductor packaging integrated machine, comprising a platform and a feeding platform, wherein a three-axis guide rail 1 and a three-axis guide rail 2 are arranged in parallel on the platform, a glue head 1 is arranged on the Z-axis guide rail of the three-axis guide rail 1, and a glue head 2 is arranged on the Z-axis guide rail of the three-axis guide rail 2, wherein the glue head 1 and the glue head 2 are arranged opposite to each other, and the feeding platform feeds materials along the Y-axis of the three-axis guide rail 1 and the three-axis guide rail 2;

[0006] The glue dispensing position of the second glue head is provided with a template clamping head, the template clamping head is used to carry the dam body, and the dam body is used to surround and store the glue discharged by the second glue head;

[0007] The first rubber head is used to draw a single layer of rubber ring on the outside of the chip that matches the size of the dam;

[0008] The chip set is moved along the direction of rubber head one and rubber head two through the feeding platform, and rubber head one is used to dot the rubber ring, while rubber head two places the prefabricated dam body corresponding to the rubber ring and fills it with glue. The processes are synchronized to improve work efficiency.

[0009] According to the above technical solution, the template clamping head includes a connecting frame, a through hole is opened in the middle of the connecting frame, the glue outlet of the glue head 2 is connected to the glue delivery nozzle, and the glue delivery nozzle is inserted through the connecting frame;

[0010] The bottom of the connecting frame is fixedly connected to a clamping plate, the inner dimensions of the clamping plate are adapted to the outer wall dimensions of the dam body, the top of the clamping plate is provided with an air chamber, a suction hole is opened on the clamping plate, the suction hole is connected to the air chamber, the bottom side of the suction hole is in contact with the top of the dam body, and a sealing gasket is provided at the contact portion;

[0011] A sealing plate is provided on the outside of the gas bin, and the sealing plate is used to seal the gas bin;

[0012] The air bin is connected to the master control cylinder, and the air pressure in the air bin is controlled by the master control cylinder.

[0013] According to the above technical solution, a circular ring protrudes from the top of the connecting frame, and a positioning ring groove is opened on the outside of the circular ring. A plurality of magnet columns are fixedly connected to the top of the connecting frame, and the magnet columns have magnetism.

[0014] According to the above technical solution, the second rubber head is connected to the template clamping head through a quick-connect device, and the quick-connect device includes a connecting plate, which is fixedly connected to the bottom of the second rubber head. A circular hole is opened at the bottom of the connecting plate, and the circular hole is adapted to the circular ring at the top of the connecting frame.

[0015] The bottom side of the connecting plate is rotatably connected with a fiber shaft, the fiber shaft corresponds to the positioning ring groove, and a quick slot is opened on the fiber shaft, and the quick slot corresponds to the positioning ring groove.

[0016] According to the above technical solution, an inclined surface is provided on the inner side of the dam body, and the width of the dam body decreases linearly from the side close to the chip to the side away from the chip.

[0017] According to the above technical solution, the template clamping head is provided with a positioning control device, the positioning control device includes a limit device and an overflow detection device, the overflow detection device includes a guide rod 2, an electrical connection port, and a capacitor plate. The guide rod 2 passes through the clamping plate on the template clamping head, and the end of the guide rod 2 close to the dam body is coupled with a capacitor plate. The guide rods 2 are grouped in pairs, and at least three groups of guide rods 2 are provided on each side of the clamping plate. The spacing between the guide rods 2 in the same group is between one and four millimeters.

[0018] An electrical connection port is provided on the top of the clamping plate. An electrical connector is provided on the electrical connection port. The electrical connection port is connected to an external circuit to enable the capacitor plate on the second guide rod of the same group to work and generate a stable capacitance value.

[0019] According to the above technical solution, the limiting device supports a gasket, an annular frustum, a spring, and an air inlet. A support gasket is provided on one side of the capacitor plate, and the support gasket is adapted to the inclined slope on the dam body. A circular frustum is fixedly connected to the guide rod 2 located near the corner of the clamping plate, and a spring is sleeved on the guide rod 2. The spring applies a force to the circular frustum close to the dam body. An air inlet is provided on the clamping plate, and the guide rod 2 is inserted into the air inlet. Under normal circumstances, the circular frustum blocks the top of the air inlet under the action of the spring, and the inner diameter of the air inlet is larger than the outer diameter of the guide rod 2.

[0020] According to the above technical solution, an airflow assisting device is provided in the clamping plate, and the airflow assisting device includes an air guide pipe and a guide rod. The air guide pipe is slidably connected in the suction hole, and the guide rod is fixedly connected in the air bin. An air outlet is provided on the side of the air guide pipe close to the dam body. The middle part of the guide spiral groove is rotatably connected to a rotating frame, and the top of the rotating frame is fixedly connected to a transmission shaft sleeve.

[0021] A guide spiral groove is provided on the outer side of the guide rod 1, and the guide spiral groove is in transmission connection with the transmission sleeve;

[0022] A windshield is fixedly connected to one side of the rotating frame, and the arc radius of the windshield is smaller than the arc radius of the inner wall of the air guide duct;

[0023] A windshield gasket is fixedly attached to the inner wall of the air duct, and the arc radius of the windshield gasket and the windshield plate are the same. When the air duct is completely located in the suction hole, the windshield plate and the windshield gasket partially overlap.

[0024] According to the above technical solution, a fast solenoid valve is provided on the three-axis guide rail 2, and the fast solenoid valve is connected to the air tank.

[0025] According to the above technical solution, a transmission sleeve is provided at the bottom of the air guide pipe, the transmission sleeve contacts the top of the dam body, a gasket is provided at the bottom of the transmission sleeve, and a stepped limit platform is provided at the bottom of the air guide pipe.

[0026] The present invention provides a dual dispensing mechanism for a semiconductor packaging machine. It has the following beneficial effects:

[0027] The present invention drives the glue head 1 to dot the rubber ring on the outside of the chip through the three-axis guide rail 1, and then transports the chip with the dotted rubber ring to the working area of ​​the glue head 2 on the feeding platform. At this time, the glue head 2, under the operation of the three-axis guide rail 2, first takes the prefabricated dam body through the template clamping head, and aligns the dam body with the dotted rubber ring so that the dam body is attached to the rubber ring. At the same time, the glue head 2 works to fill the dam body with glue liquid. Compared with the traditional dam body stacking and curing layer by layer, this mechanism can save the time of dam body stacking. At the same time, the rubber ring dotting of the glue head 1 and the glue filling of the glue head 2 can work step by step and synchronously. Compared with the traditional method of surrounding the dam and then dotting and filling with glue, the work efficiency is improved and the types and strength of the dam body are expanded.

[0028] In the present invention, when the glue discharged from the second glue head contacts the capacitor plates along the guide of the dam body, the glue will fill the space between the capacitor plates. At this time, the medium between the capacitor plates changes from air to a mixed state of air and glue, and then to a state of only glue. At this time, the gradual change of the medium causes the dielectric constant to change, and causes the size of the capacitance to change. When the capacitance detected by the external circuit reaches a certain threshold, the second glue head is controlled to stop, so as to avoid glue overflow, causing serious problems such as short circuit and circuit board contamination.

[0029] In the present invention, when the dam body is separated from the clamping plate by the push of the spring, the air pressure in the air chamber is increased so that the air guide pipe moves downward under the push of the gas, and the transmission shaft sleeve protrudes from the bottom side of the clamping plate. At the same time, when the air guide pipe moves downward, the transmission shaft sleeve drives the wind shield plate to rotate under the limit of the guide spiral groove. Since the downward movement of the top of the dam body is small at this time, the downward movement of the air guide pipe is also small. At this time, the wind shield plate is not separated from the surface of the wind shield gasket. At this time, the transmission shaft sleeve is blocked by the dam body. The air guide pipe has only one air outlet. When the fast solenoid valve is working, the air guide pipe can blow an impact airflow to the middle part of the dam body through the air outlet, thereby destroying the glue tension on the chip surface and allowing the glue to circulate normally. At the same time, the impact airflow can also increase the flow effect of the glue and reduce the occurrence of air bubbles and hollowing problems.

[0030] When the dam body is pasted and glued, the second glue head moves to pick up the next dam body. By increasing the air pressure in the air chamber, the air guide pipe is completely protruded from the suction hole. At this time, the transmission shaft sleeve drives the windshield to rotate under the limit of the guide spiral groove and disengages from the windshield gasket. At this time, the gas in the air chamber can blow and clean the outer surface of the capacitor plate from two directions, thereby avoiding the adhesion of glue on the capacitor plate, and then affecting the overflow detection of glue after multiple operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic structural diagram of the present invention as a whole;

[0032] Figure 2 This is a schematic structural diagram of the second rubber head and adjacent components of the present invention;

[0033] Figure 3 This is a schematic structural diagram of the second rubber head of the present invention;

[0034] Figure 4 For the present invention Figure 3 Schematic diagram of the structure of area A;

[0035] Figure 5 This is a schematic structural diagram of the template clamping head of the present invention when it is unfolded;

[0036] Figure 6 This is a schematic diagram of the structure of a half-section of the template clamping head of the present invention;

[0037] Figure 7 It is a schematic cross-sectional structural diagram of the template clamping head of the present invention;

[0038] Figure 8 For the present invention Figure 5 Schematic diagram of the structure of area B;

[0039] Figure 9 For the present invention Figure 7 Schematic diagram of the D zone structure;

[0040] Figure 10 For the present invention Figure 6 Schematic diagram of the structure of region C;

[0041] Figure 11 This is a schematic diagram of the overall structure of the air guide duct of the present invention;

[0042] Figure 12 This is a schematic diagram of the overall structure of the air guide duct of the present invention.

[0043] In the figure: 1. Rubber head 1; 2. Rubber head 2; 3. Three-axis guide rail 1; 4. Three-axis guide rail 2; 5. Dam body; 6. Quick-connect device; 601. Connecting plate; 602. Fiber shaft; 603. Quick slot; 7. Template clamping head; 701. Connecting frame; 702. Positioning ring groove; 703. Magnet column; 704. Sealing plate; 705. Clamping plate; 706. Air chamber; 707. Suction hole; 8. Airflow auxiliary device; 801. Air guide duct; 802. Guide rod 1; 803. Rotating frame; 804. Guide spiral groove; 805. Windshield gasket; 806. Windshield; 807. Air outlet; 808. Drive shaft sleeve; 9. Positioning control device; 911. Guide rod 2; 912. Electrical connection port; 913. Capacitor plate; 921. Support gasket; 922. Circular frustum; 923. Spring; 924. Air inlet; 10. Glue delivery nozzle; 11. Inclined surface; 12. Fast solenoid valve. DETAILED DESCRIPTION

[0044] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0045] See also Figure 1-12 A dual-dispensing glue mechanism for a semiconductor packaging all-in-one machine includes a platform and a feeding platform. The platform is provided with a three-axis guide rail 1 3 and a three-axis guide rail 2 4 arranged in parallel. A glue head 1 is provided on the Z-axis guide rail of the three-axis guide rail 1 3, and a glue head 2 is provided on the Z-axis guide rail of the three-axis guide rail 2 4. The glue heads 1 and 2 are arranged facing each other. The feeding platform feeds materials along the Y-axis of the three-axis guide rail 1 3 and the three-axis guide rail 2 4.

[0046] The glue dispensing part of the glue head 2 is provided with a template clamping head 7, which is used to carry the dam body 5, and the dam body 5 is used to enclose and store the glue discharged by the glue head 2;

[0047] The rubber head 1 is used to draw a single layer of rubber ring on the outside of the chip that matches the size of the dam body 5;

[0048] The chip set is moved along the direction of rubber head 1 and rubber head 2 through the feeding platform, and rubber head 1 is used to dot the rubber ring, and rubber head 2 is used to place the prefabricated dam body 5 corresponding to the rubber ring and fill it with glue. The processes are synchronized to improve work efficiency.

[0049] Furthermore, the dispensing mechanism is used to fill the dam of batches of single-size chips.

[0050] Furthermore, the position of the chip is acquired through graphics, and the inclined surface 11 is controlled to draw a rubber ring on the outside of the chip.

[0051] During use, the three-axis guide rail 13 drives the glue head 1 to draw the rubber ring on the outside of the chip, and then the chip with the rubber ring is transported to the working area of ​​the glue head 2 2 on the feeding platform. At this time, the glue head 2 2 first takes the prefabricated dam body 5 through the template clamping head 7 under the operation of the three-axis guide rail 2 4, and aligns the dam body 5 with the drawn rubber ring, so that the dam body 5 is attached to the rubber ring. At the same time, the glue head 2 2 works to fill the glue inside the dam body 5. Compared with the traditional dam body 5 stacked and solidified layer by layer, this mechanism can save the time of stacking the dam body 5. At the same time, the rubber ring dotting of the glue head 1 and the glue filling of the glue head 2 2 can work step by step and synchronously. Compared with the traditional dam encirclement and then glue filling, the work efficiency is improved and the types and strength of the dam body 5 are expanded.

[0052] The template clamping head 7 includes a connecting frame 701. A through hole is provided in the middle of the connecting frame 701. The glue outlet of the glue head 2 is connected to the glue delivery nozzle 10. The glue delivery nozzle 10 passes through the connecting frame 701.

[0053] A clamping plate 705 is fixedly connected to the bottom of the connecting frame 701. The internal dimensions of the clamping plate 705 are adapted to the outer wall dimensions of the dam body 5. An air chamber 706 is provided on the top of the clamping plate 705. A suction hole 707 is provided on the clamping plate 705. The suction hole 707 is connected to the air chamber 706. The bottom side of the suction hole 707 contacts the top of the dam body 5, and a sealing gasket is provided at the contact portion.

[0054] A sealing plate 704 is provided on the outside of the gas chamber 706, and the sealing plate 704 is used to seal the gas chamber 706;

[0055] The air bin 706 is connected to the master control cylinder, and the air pressure in the air bin 706 is controlled by the master control cylinder.

[0056] During use, the gas in the gas tank 706 is extracted through the main control cylinder, so that the air pressure in the gas tank 706 is reduced. When the rubber head 2 controls the clamping plate 705 to correspond to the dam body 5, the dam body 5 is adsorbed in the air inlet of the suction hole 707 under the adsorption of negative pressure. When the clamping plate 705 moves to the predetermined position, the air pressure in the gas tank 706 is changed through the main control cylinder, so as to facilitate the dam body 5 to be pasted on the rubber ring of the rubber head 1 electronic drawing.

[0057] A circular ring protrudes from the top of the connecting frame 701 , and a positioning ring groove 702 is provided on the outside of the circular ring. A plurality of magnet columns 703 are fixedly connected to the top of the connecting frame 701 , and the magnet columns 703 are magnetic.

[0058] Furthermore, the template clamping head 7 is a replaceable component. When processing chips of different types, the template clamping head 7 of the same size can be replaced to facilitate subsequent processing.

[0059] Furthermore, the magnet column 703 protrudes from the surface of the connecting frame 701 to facilitate positioning.

[0060] During use, the provided magnet column 703 can be adsorbed on the surface of the quick-connect device 6 on the rubber head 2. At the same time, under the limitation of the magnet column 703, the entire template clamping head 7 is pre-installed, which is convenient for subsequent reinforcement.

[0061] The second rubber head 2 is connected to the template clamping head 7 through a quick-connect device 6. The quick-connect device 6 includes a connecting plate 601, which is fixedly connected to the bottom of the second rubber head 2. A circular hole is opened at the bottom of the connecting plate 601, and the circular hole is adapted to the circular ring at the top of the connecting frame 701.

[0062] The bottom side of the connecting plate 601 is rotatably connected to a fiber shaft 602 , which corresponds to the positioning ring groove 702 . A quick slot 603 is provided on the fiber shaft 602 , which corresponds to the positioning ring groove 702 .

[0063] Furthermore, an indicator arrow is provided on the outside of the connecting plate 601 to facilitate the operator to confirm the position of the quick slot 603 on the fiber shaft 602 by observing from the outside;

[0064] Furthermore, in a normal state, the notch of the quick slot 603 on the fiber shaft 602 faces the circular hole on the connecting plate 601 .

[0065] When in use, the template clamping head 7 is quickly fixed by aligning the circular ring on the connecting frame 701 with the bottom of the connecting plate 601, aligning the magnet column 703 with the bottom of the connecting plate 601, and then rotating the fiber shaft 602 so that the arc surface of the fiber shaft 602 is clamped in the notch position of the positioning ring groove 702.

[0066] An inclined surface 11 is formed on the inner side of the dam 5 , and the width of the dam 5 decreases linearly from the side close to the chip to the side away from the chip.

[0067] Furthermore, the bottom of the dam body 5 is roughened to facilitate adhesion.

[0068] When in use, the inclined slope formed by the dam body 5 expands the space in the narrow area, facilitates the circulation of liquid, facilitates the discharge of air, and reduces the probability of the occurrence of air bubbles and hollowing problems;

[0069] At the same time, the glue accumulated on the inclined surface 11 will also exert a certain downward pressure on the dam body 5, thereby improving the stability of the adhesion between the dam body 5 and the rubber head and the rubber ring.

[0070] The template clamping head 7 is provided with a positioning control device 9, which includes a limit device and an overflow detection device. The overflow detection device includes a second guide rod 911, an electrical connection port 912, and a capacitor plate 913. The second guide rod 911 passes through the clamping plate 705 on the template clamping head 7. The capacitor plate 913 is coupled to the end of the second guide rod 911 close to the dam body 5. The second guide rods 911 are arranged in groups of two. At least three groups of second guide rods 911 are provided on each side of the clamping plate 705. The spacing between the second guide rods 911 in the same group is between one and four millimeters.

[0071] An electrical connection port 912 is provided on the top of the clamping plate 705 , and an electrical connector is provided on the electrical connection port 912 . The electrical connection port 912 is connected to an external circuit to enable the capacitor plate 913 on the second guide rod 911 of the same group to work and generate a stable capacitance value.

[0072] Furthermore, the outer side of the capacitor plate 913 is provided with a permanent anti-stick coating;

[0073] Furthermore, since the template clamping head 7 blocks the dam body 5 and the chip, the image acquisition device cannot confirm whether the colloid has overflowed. Therefore, the injection amount of the glue can be confirmed by measuring the capacitance change between the capacitor plates 913, and the stopping of the glue head 2 can be controlled accordingly.

[0074] During use, when the glue discharged from the glue head 2 contacts the capacitor plates 913 along the guidance of the dam body 5, the glue will fill the space between the capacitor plates 913. At this time, the medium between the capacitor plates 913 changes from air to a mixed state of air and glue, and then to a state of only glue. At this time, the gradual change of the medium causes the dielectric constant to change, and causes the size of the capacitance to change. When the capacitance detected by the external circuit reaches a certain threshold, the glue head 2 is controlled to stop, so as to avoid glue overflow, causing serious problems such as short circuit and contamination of the circuit board.

[0075] The limiting device includes a support gasket 921, an annular cone 922, a spring 923, and an air inlet 924. A support gasket 921 is provided on one side of the capacitor plate 913. The support gasket 921 is adapted to the inclined slope 11 on the dam body 5. The annular cone 922 is fixedly connected to the guide rod 2 911 located near the corner of the clamping plate 705, and a spring 923 is sleeved on the guide rod 2 911. The spring 923 applies a force to the annular cone 922 close to the dam body 5. An air inlet 924 is provided on the clamping plate 705, and the guide rod 2 911 is inserted into the air inlet 924. Under normal circumstances, the annular cone 922 blocks the top of the air inlet 924 under the action of the spring 923, and the inner diameter of the air inlet 924 is larger than the outer diameter of the guide rod 2 911.

[0076] Furthermore, when the dam body 5 contacts the bottom of the clamping plate 705, the second guide rod 911 and the annular frustum 922 move upward under the support of the capacitor plate 913, and the squeezing spring 923 is further compressed;

[0077] Furthermore, the bottom of the annular frustum 922 is adapted to the inner wall of the air inlet 924, and the annular frustum 922 is slidably connected to the air inlet 924;

[0078] Furthermore, since the top of the dam body 5 is thinner, when the overall thickness is small, the dam body 5 may be deformed under compression, making it difficult to pick up and place. Therefore, a support gasket 921 is used to support one side of the dam body 5, and the dam body 5 is made to fit the inner wall of the clamping plate 705, which facilitates the clamping plate 705 to pick up and place the dam body 5.

[0079] When in use, after the template clamping head 7 corresponds to the placed dam body 5, the template clamping head 7 is moved downward to clamp the dam body 5 along the inner sleeve of the clamping plate 705 at the bottom of the clamping plate 705, and the air pressure of the air chamber 706 is reduced so that the dam body 5 is adsorbed on the bottom side of the suction hole 707. At this time, the suction hole 707 is blocked, and the low air pressure in the air chamber 706 will push the guide rod 2 911 to move upward until the annular cone 922 is separated from the air inlet hole 924. When the dam body 5 After moving to the position corresponding to the dotted rubber ring, by increasing the air pressure in the air chamber 706, the annular cone 922 will push the guide rod 2 911 downward under the action of the spring 923, and support the side wall of the dam body 5, so that the dam body 5 can overcome the friction and separate from the inner wall of the clamping plate 705, and squeeze the dam body 5 to contact the dotted rubber ring, so that the dam body 5 and the dotted rubber ring fit more closely, avoiding the glue leakage from the bottom of the dam body 5 and contaminating the circuit board when the glue head 2 is injecting glue.

[0080] An airflow assist device 8 is provided in the clamping plate 705. The airflow assist device 8 includes an air guide duct 801 and a guide rod 802. The air guide duct 801 is slidably connected to the suction hole 707. The guide rod 802 is fixedly connected to the air chamber 706. An air outlet 807 is provided on the side of the air guide duct 801 close to the dam body 5. A rotating frame 803 is rotatably connected to the middle of the guide spiral groove 804. A transmission shaft sleeve 808 is fixedly connected to the top of the rotating frame 803.

[0081] A guide spiral groove 804 is formed on the outer side of the guide rod 802, and the guide spiral groove 804 is in transmission connection with the transmission sleeve 808;

[0082] A windshield 806 is fixedly connected to one side of the rotating frame 803. The arc radius of the windshield 806 is smaller than the arc radius of the inner wall of the air guide duct 801.

[0083] A windshield gasket 805 is fixedly attached to the inner wall of the air duct 801. The windshield gasket 805 and the windshield plate 806 have the same arc radius. When the air duct 801 is completely located in the suction hole 707, the windshield plate 806 and the windshield gasket 805 partially overlap.

[0084] A fast solenoid valve 12 is provided on the three-axis guide rail 2 4 , and the fast solenoid valve 12 is connected to the air storage 706 .

[0085] Furthermore, the master control cylinder is connected to the gas tank 706 through the fast solenoid valve 12.

[0086] Furthermore, the width of the air outlet 807 is greater than the thickness of the capacitor plate 913 .

[0087] When the dam body 5 is disengaged from the clamping plate 705 by the push of the spring 923, the air pressure in the air chamber 706 is increased, so that the air guide pipe 801 moves downward under the push of the gas, and the transmission shaft sleeve 808 protrudes from the bottom side of the clamping plate 705. At the same time, when the air guide pipe 801 moves downward, the transmission shaft sleeve 808 drives the wind shield plate 806 to rotate under the limit of the guide spiral groove 804. Since the downward movement of the top of the dam body 5 is small at this time, the downward movement of the air guide pipe 801 is small, and the wind shield plate 806 is not disengaged from the surface of the wind shield gasket 805. At this time, the transmission shaft sleeve 808 is blocked by the dam body 5, and the air guide pipe 801 has an air outlet. When the fast solenoid valve 12 is working, the air guide pipe 801 can blow an impact airflow to the middle part of the dam body 5 through the air outlet, thereby destroying the glue tension on the chip surface, allowing the glue to circulate normally. At the same time, the impact airflow can also increase the glue flow effect and reduce the problem of air bubbles and hollowing.

[0088] When the dam body 5 is pasted and glued, the glue head 2 moves to pick up the next dam body 5. By increasing the air pressure in the air chamber 706, the air guide pipe 801 is completely protruded from the suction hole 707. At this time, the transmission sleeve 808 drives the windshield 806 to rotate under the limitation of the guide spiral groove 804 and disengages from the windshield gasket 805. At this time, the gas in the air chamber 706 can blow and clean the outer surface of the capacitor plate 913 from two directions, thereby preventing the glue from adhering to the capacitor plate 913, and then affecting the overflow detection of the glue after multiple operations.

[0089] A transmission sleeve 808 is provided at the bottom of the air guide pipe 801 . The transmission sleeve 808 contacts the top of the dam body 5 . A gasket is provided at the bottom of the transmission sleeve 808 . A stepped limit platform is provided at the bottom of the air guide pipe 801 .

[0090] Working principle: The three-axis guide rail 1 drives the rubber head 1 to draw rubber rings on the outside of the chip. Then, the chip with rubber rings is transported to the working area of ​​the rubber head 2 on the feeding platform. At this time, the rubber head 2, under the operation of the three-axis guide rail 2, extracts the gas from the air chamber 706 through the master control cylinder, so that the air pressure in the air chamber 706 is reduced. When the rubber head 2 controls the clamping plate 705 to correspond with the dam body 5, the negative pressure makes the dam body 5 adsorbed in the air inlet of the suction hole 707. When the clamping plate 705 moves to the predetermined position, the master control cylinder changes the air chamber 706. 06, so as to facilitate the dam body 5 to be pasted on the rubber ring of the rubber head 1, and at the same time, the rubber head 2 works to fill the glue inside the dam body 5. Compared with the traditional dam body 5 stacked and solidified layer by layer, this mechanism can save the time of stacking the dam body 5. At the same time, the rubber ring dotting of the rubber head 1 and the glue filling of the rubber head 2 can work step by step and synchronously. Compared with the traditional method of surrounding the dam and then dotting and filling with glue, the work efficiency is improved and the types and strength of the dam body 5 are expanded.

[0091] The above are only preferred specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with this technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solutions and inventive concepts of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A dual dispensing mechanism for a semiconductor packaging machine, comprising a platform and a feeding platform, characterized in that: The platform is provided with a three-axis guide rail 1 (3) and a three-axis guide rail 2 (4) arranged in parallel, a glue head 1 (1) is provided on the Z-axis guide rail of the three-axis guide rail 1 (3), and a glue head 2 (2) is provided on the Z-axis guide rail of the three-axis guide rail 2 (4), the glue head 1 (1) and the glue head 2 (2) are arranged facing each other, and the feeding platform feeds materials along the Y-axis of the three-axis guide rail 1 (3) and the three-axis guide rail 2 (4); A template clamping head (7) is provided at the glue dispensing position of the second glue head (2), and the template clamping head (7) is used to carry the dam body (5), and the dam body (5) is used to enclose and store the glue liquid discharged by the second glue head (2); The first rubber head (1) is used to draw a single-layer rubber ring on the outer side of the chip that matches the size of the dam body (5); The chip set is moved along the direction of the first glue head (1) and the second glue head (2) by the feeding platform, and the first glue head (1) is used to dot the glue ring, and the second glue head (2) is used to place the prefabricated dam body (5) corresponding to the glue ring and fill the glue liquid. The process is synchronized, thereby improving work efficiency.

2. The double dispensing mechanism of a semiconductor packaging integrated machine according to claim 1, characterized in that: The template clamping head (7) includes a connecting frame (701), a through hole is opened in the middle of the connecting frame (701), the glue outlet of the glue head (2) is connected to a glue delivery nozzle (10), and the glue delivery nozzle (10) is inserted through the connecting frame (701); The bottom of the connecting frame (701) is fixedly connected to a clamping plate (705), the inner dimensions of the clamping plate (705) are adapted to the outer wall dimensions of the dam body (5), the top of the clamping plate (705) is provided with an air chamber (706), the clamping plate (705) is provided with a suction hole (707), the suction hole (707) is communicated with the air chamber (706), the bottom side of the suction hole (707) is in contact with the top of the dam body (5), and a sealing gasket is provided at the contact portion; A sealing plate (704) is provided on the outside of the gas chamber (706), and the sealing plate (704) is used to seal the gas chamber (706); The air bin (706) is connected to a master control cylinder, and the master control cylinder controls the air pressure in the air bin (706).

3. The double dispensing mechanism of a semiconductor packaging integrated machine according to claim 2, characterized in that: A circular ring protrudes from the top of the connecting frame (701), and a positioning ring groove (702) is provided on the outside of the circular ring. A plurality of magnet columns (703) are fixedly connected to the top of the connecting frame (701), and the magnet columns (703) are magnetic.

4. The double dispensing mechanism of a semiconductor packaging integrated machine according to claim 3, characterized in that: The second glue head (2) is connected to the template clamping head (7) through a quick-connect device (6), and the quick-connect device (6) includes a connecting plate (601), and the connecting plate (601) is fixedly connected to the bottom of the second glue head (2), and a circular hole is opened at the bottom of the connecting plate (601), and the circular hole is adapted to the circular ring at the top of the connecting frame (701); The bottom side of the connecting plate (601) is rotatably connected to a fiber shaft (602), the fiber shaft (602) corresponds to the positioning ring groove (702), and a quick slot (603) is provided on the fiber shaft (602), and the quick slot (603) corresponds to the positioning ring groove (702).

5. The double dispensing mechanism of a semiconductor packaging integrated machine according to claim 1, characterized in that: An inclined surface (11) is provided on the inner side of the dam body (5), and the width of the dam body (5) decreases linearly from the side close to the chip to the side away from the chip.

6. The double dispensing mechanism of a semiconductor packaging integrated machine according to claim 1, characterized in that: The template clamping head (7) is provided with a positioning control device (9), the positioning control device (9) includes a limit device and an overflow detection device, the overflow detection device includes a second guide rod (911), an electrical connection port (912), and a capacitor plate (913), the second guide rod (911) is inserted through the clamping plate (705) on the template clamping head (7), and the capacitor plate (913) is coupled to one end of the second guide rod (911) close to the dam body (5), the second guide rods (911) are arranged in pairs, and at least three groups of second guide rods (911) are provided on each side of the clamping plate (705), and the spacing between the second guide rods (911) in the same group is between one and four millimeters; The top of the clamping plate (705) is provided with an electrical connection port (912), and an electrical connector is provided on the electrical connection port (912). The electrical connection port (912) is connected to an external circuit to enable the capacitor plate (913) on the second guide rod (911) of the same group to work and generate a stable capacitance value.

7. The double dispensing mechanism of a semiconductor packaging integrated machine according to claim 6, characterized in that: The limiting device includes a support gasket (921), a circular frustum (922), a spring (923), and an air inlet (924). A support gasket (921) is provided on one side of the capacitor plate (913). The support gasket (921) and the inclined surface (11) on the dam body (5) are adapted to each other. A circular frustum (922) is fixedly connected to the guide rod 2 (911) located near the corner of the clamping plate (705), and the guide rod 2 (911) is sleeved. A spring (923) is provided, and the spring (923) applies a force to the annular frustum (922) to move it closer to the dam body (5). An air inlet hole (924) is provided on the clamping plate (705), and the second guide rod (911) is inserted into the air inlet hole (924). Under normal conditions, the annular frustum (922) blocks the top of the air inlet hole (924) under the action of the spring (923), and the inner diameter of the air inlet hole (924) is greater than the outer diameter of the second guide rod (911).

8. The double dispensing mechanism of a semiconductor packaging integrated machine according to claim 1, characterized in that: An airflow assisting device (8) is provided in the clamping plate (705), and the airflow assisting device (8) includes an air guide pipe (801) and a guide rod (802). The air guide pipe (801) is slidably connected in the suction hole (707), and the guide rod (802) is fixedly connected in the air bin (706). An air outlet (807) is provided on a side of the air guide pipe (801) close to the dam body (5). The middle part of the guide spiral groove (804) is rotatably connected to a rotating frame (803), and the top of the rotating frame (803) is fixedly connected to a transmission shaft sleeve (808); A guide spiral groove (804) is provided on the outer side of the guide rod (802), and the guide spiral groove (804) is in transmission connection with the transmission shaft sleeve (808); A windshield (806) is fixedly connected to one side of the rotating frame (803), and the arc radius of the windshield (806) is smaller than the arc radius of the inner wall of the air guide duct (801); A windshield gasket (805) is fixedly attached to the inner wall of the air guide duct (801), and the arc radius of the windshield gasket (805) and the windshield plate (806) are the same. When the air guide duct (801) is completely located in the suction hole (707), the windshield plate (806) and the windshield gasket (805) partially overlap. A fast electromagnetic valve (12) is provided on the three-axis guide rail 2 (4), and the fast electromagnetic valve (12) is connected to the air chamber (706).

9. The double dispensing mechanism of a semiconductor packaging integrated machine according to claim 8, characterized in that: A transmission sleeve (808) is provided at the bottom of the air guide pipe (801), the transmission sleeve (808) contacts the top of the dam body (5), a gasket is provided at the bottom of the transmission sleeve (808), and a stepped limit platform is provided at the bottom of the air guide pipe (801).

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