Laser module

Abstract

The embodiment of the invention discloses a laser module, which is used for improving the laser working efficiency. The embodiment of the invention comprises a printed circuit board and n laser units, wherein n is a positive integer greater than 1; n positive connection pads and m negative connection pads are arranged on the side surface of the printed circuit board, a control chip is mounted on the mounting surface of the printed circuit board, or m positive connection pads and n negative connection pads are arranged on the mounting surface of the printed circuit board, or m positive connection pads and m negative connection pads are arranged on the mounting surface of the printed circuit board. Or the number of the positive connection bonding pads and the number of the negative connection bonding pads are both n, and m is larger than or equal to 1 and smaller than n; the positive ends of the n laser units are electrically connected with the n positive connection bonding pads, and the negative ends of the n laser units are electrically connected with the negative connection bonding pad; the control chip is electrically connected with the positive connection bonding pad and the negative connection bonding pad. The control chip is used for controlling each laser unit in the n laser units through the positive connection bonding pad and the negative connection bonding pad.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of lasers, and in particular to a laser module. Background Art

[0002] With the continuous development of science and technology, lasers have been widely used in various industries. Based on the ability of lasers to weld and heat related objects, people's needs are met. When welding and heating related objects, multiple laser units are involved, and each laser unit emits laser light to heat the related objects.

[0003] However, in existing solutions, multiple laser units are connected to a power supply or control module via cables. Multiple laser units have the same input and output, so it is impossible to control any one of the multiple laser units individually, and only overall control is possible. This results in the inability to make individual adjustments when other conditions arise, resulting in low laser working efficiency. Summary of the Invention

[0004] An embodiment of the present application provides a laser module for improving laser working efficiency.

[0005] A first aspect of an embodiment of the present application provides a laser module, comprising: a printed circuit board and n laser units, where n is a positive integer greater than 1;

[0006] A positive connection pad and a negative connection pad are provided on the side of the printed circuit board, and a control chip is mounted on the mounting surface of the printed circuit board, wherein the number of the positive connection pads is n and the number of the negative connection pads is m, or the number of the positive connection pads is m and the number of the negative connection pads is n, or the number of the positive connection pads and the number of the negative connection pads are both n, wherein m is greater than or equal to 1 and less than n;

[0007] If the number of the positive connection pads is n and the number of the negative connection pads is m, the positive terminals of the n laser units are electrically connected to the n positive connection pads in a one-to-one correspondence, and the negative terminal of any one of the n laser units is electrically connected to any one of the m negative connection pads; the control chip is electrically connected to the n positive connection pads and the m negative connection pads, respectively, and the control chip is used to control each of the n laser units via the n positive connection pads and the m negative connection pads;

[0008] If the number of the positive connection pads is m and the number of the negative connection pads is n, the negative terminals of the n laser units are electrically connected to the n negative connection pads in a one-to-one correspondence, and the positive terminal of any one of the n laser units is electrically connected to any one of the m positive connection pads; the control chip is electrically connected to the m positive connection pads and the n negative connection pads, respectively, and the control chip is used to control each of the n laser units via the m positive connection pads and the n negative connection pads;

[0009] If the number of the positive connecting pads and the negative connecting pads is n, the positive ends of the n laser units are electrically connected to the n positive connecting pads in a one-to-one correspondence, and the negative ends of the n laser units are electrically connected to the n negative connecting pads in a one-to-one correspondence; the control chip is electrically connected to the n positive connecting pads and the n negative connecting pads, respectively, and the control chip is used to control each of the n laser units via the n positive connecting pads and the n negative connecting pads, respectively.

[0010] Optionally, the laser module further comprises: a direct copper plated DPC ceramic substrate;

[0011] The DPC ceramic substrate is provided with 2n through holes penetrating the top surface and the bottom surface of the DPC ceramic substrate, the top surface is provided with n positive contact pads and n negative contact pads, the through holes are filled with conductive material, and the top surface and the bottom surface are both provided with conductive circuits;

[0012] If the number of the positive connection pads is n and the number of the negative connection pads is m, then the bottom surface is provided with n positive electrode pads and m negative electrode pads, the n positive contact pads are electrically connected to the n positive electrode pads in a one-to-one correspondence via the conductive circuit on the top surface, the conductive material in the n through-holes and the conductive circuit on the bottom surface, the n positive electrode pads are contact-connected to the n positive connection pads in a one-to-one correspondence, the n negative contact pads are electrically connected to any one of the m negative electrode pads via the conductive circuit on the top surface, the conductive material in the n through-holes and the conductive circuit on the bottom surface, and the m negative electrode pads are contact-connected to the m negative connection pads;

[0013] If the number of the positive connection pads is m and the number of the negative connection pads is n, then the bottom surface is provided with m positive electrode pads and n negative electrode pads, the n negative contact pads are electrically connected to the n negative electrode pads in a one-to-one correspondence via the conductive circuit on the top surface, the conductive material in the n through-holes and the conductive circuit on the bottom surface, the n negative electrode pads are contact-connected to the n negative connection pads in a one-to-one correspondence, the n positive contact pads are electrically connected to any one of the m positive electrode pads via the conductive circuit on the top surface, the conductive material in the n through-holes and the conductive circuit on the bottom surface, and the m positive electrode pads are contact-connected to the m positive connection pads;

[0014] If the number of the positive connection pads and the negative connection pads is n, then the bottom surface is provided with n positive electrode pads and n negative electrode pads, the n positive contact pads are electrically connected to the n positive electrode pads in a one-to-one correspondence via the conductive circuit on the top surface, the conductive material in the n through-holes and the conductive circuit on the bottom surface, the n positive electrode pads are contact-connected with the n positive connection pads in a one-to-one correspondence, the n negative contact pads are electrically connected to the n negative electrode pads in a one-to-one correspondence via the conductive circuit on the top surface, the conductive material in the n through-holes and the conductive circuit on the bottom surface, and the n negative electrode pads are contact-connected with the n negative connection pads in a one-to-one correspondence;

[0015] The positive ends of the n laser units are contact-connected with the n positive contact pads in a one-to-one correspondence, and the negative ends of the n laser units are contact-connected with the n negative contact pads in a one-to-one correspondence.

[0016] Optionally, the laser module further includes: a laser heat dissipation module;

[0017] A heat dissipation pad is further provided on the bottom surface of the DPC ceramic substrate. The laser heat dissipation module is closely attached to the heat dissipation pad. The laser heat dissipation module is used to dissipate heat for the n laser units and the DPC ceramic substrate.

[0018] Optionally, the laser module further comprises: a split raised portion;

[0019] If there are multiple positive connection pads, one split protrusion is provided between the adjacent positive connection pads with the shortest distance; if there are multiple negative connection pads, one split protrusion is provided between the adjacent negative connection pads with the shortest distance, and the split protrusion is used to prevent short circuit between the positive connection pads or between the negative connection pads.

[0020] Optionally, if the number of the positive connection pads is n, then the top surface of the top is provided with n positive connection grooves, and each positive connection groove is provided with a positive connection pad at the bottom, and the adjacent positive connection grooves with the shortest distance form a split protrusion; if the number of the negative connection pads is n, then the top surface of the top is provided with n negative connection grooves, and each negative connection groove is provided with a negative connection pad at the bottom, and the adjacent negative connection grooves with the shortest distance form a split protrusion.

[0021] Optionally, if the number of the positive connection pads is n, the n positive connection pads are arranged on the top surface of the top, and one of the split protrusions is provided between the adjacent positive connection pads on the top surface; if the number of the negative connection pads is n, the n negative connection pads are arranged on the top surface of the top, and one of the split protrusions is provided between the adjacent negative connection pads on the top surface.

[0022] Optionally, a polarity protrusion is provided on the side of the printed circuit board between the area where the positive connection pad is located and the area where the negative connection pad is located, and the polarity protrusion is used to insulate the positive connection pad and the negative connection pad.

[0023] Optionally, if the number of the positive connection pads is n, the n positive connection pads are distributed in a line or in an array on the side of the printed circuit board; if the number of the negative connection pads is n, the n negative connection pads are distributed in a line or in an array on the side of the printed circuit board.

[0024] Optionally, the laser module further includes: a circuit board heat dissipation module;

[0025] The circuit board heat dissipation module is provided on the back side of the printed circuit board, and the circuit board heat dissipation module is used to dissipate heat for the control chip.

[0026] Optionally, the printed circuit board has a multi-layer or single-layer structure.

[0027] It can be seen from the above technical solutions that the embodiments of the present application have the following advantages:

[0028] The laser module of this embodiment is provided with a printed circuit board and n laser units. The number of at least one of the positive connection pads or the negative connection pads is n. These n pads are then individually connected to the n laser units. Either the positive terminals of all laser units are disconnected, or the negative terminals of all laser units are disconnected, or both the positive and negative terminals are disconnected. This allows for individual control of each laser unit, adapting to various situations and significantly improving laser operating efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0030] Figure 1 This is a schematic diagram of an embodiment of a laser module disclosed in this application;

[0031] Figure 2 This is a schematic diagram of a laser module DPC ceramic substrate and laser unit disclosed in this application;

[0032] Figure 3 This is a schematic diagram of another embodiment of a laser structure disclosed in this application;

[0033] Figure 4 A schematic diagram of the connection pads of the printed circuit board disclosed in this application;

[0034] Figure 5 This is a schematic diagram of the bottom surface of the DPC ceramic substrate disclosed in this application.

[0035] Wherein, the accompanying drawings are marked as follows:

[0036] 1. DPC ceramic substrate; 2. Printed circuit board; 3. Laser heat dissipation module; 4. Circuit board heat dissipation module; 5. Negative connection pad; 6. Positive connection pad; 7. Polarity protrusion; 8. Negative electrode pad; 9. Positive electrode pad; 10. Heat dissipation pad; 11. Laser unit. DETAILED DESCRIPTION

[0037] The present application is further described in detail below with reference to the accompanying drawings.

[0038] An embodiment of the present application provides a laser module for improving laser working efficiency.

[0039] Lasers have been widely used in heating and welding related objects. Multiple laser units are connected to a power supply or control module through cables. However, in existing solutions, the distance between multiple laser units is small, the cables are dense, and the cables have weak current resistance, resulting in a smaller current flowing through the laser unit. In addition, multiple laser units have the same input and the same output, so it is impossible to control any one of the multiple laser units individually, and only overall control is possible. This results in the inability to adjust individually when other conditions occur, and the laser working efficiency is low. In order to solve the above problems, the present application provides a laser module that allows a larger current to flow through a perforated and metal-filled DPC ceramic substrate, combined with a pad, which greatly improves the laser working efficiency. In addition, based on multiple pads, each laser unit can be individually controlled, which can adapt to various different situations and greatly improve the laser working efficiency.

[0040] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0041] The terms "first," "second," "third," "fourth," and so forth, in the description and claims of the present invention and in the accompanying drawings are used to distinguish similar items and are not necessarily used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, such that the embodiments described herein can be practiced in an order other than that illustrated or described herein. Furthermore, the terms "including," "comprising," and "having," and any variations thereof, are intended to cover non-exclusive inclusions.

[0042] The following describes a laser module of the present application. Figure 1 , an embodiment of a laser module of the present application includes: a printed circuit board and n laser units, wherein n is a positive integer greater than 1;

[0043] A positive connection pad and a negative connection pad are provided on the side of the printed circuit board, and a control chip is mounted on the mounting surface of the printed circuit board, wherein the number of the positive connection pads is n and the number of the negative connection pads is m, or the number of the positive connection pads is m and the number of the negative connection pads is n, or the number of the positive connection pads and the number of the negative connection pads are both n, wherein m is greater than or equal to 1 and less than n;

[0044] If the number of positive connection pads is n and the number of negative connection pads is m, then the positive terminals of the n laser units are electrically connected to the n positive connection pads in a one-to-one correspondence, and the negative terminal of any of the n laser units is electrically connected to any of the m negative connection pads; the control chip is electrically connected to the n positive connection pads and the m negative connection pads, respectively, and the control chip is used to control each of the n laser units via the n positive connection pads and the m negative connection pads. In this case, one positive connection pad is connected to the positive terminal of a single laser unit, and one negative connection pad can be connected to the negative terminal of one or more laser units.

[0045] If the number of positive connection pads is m and the number of negative connection pads is n, then the negative terminals of the n laser units are electrically connected to the n negative connection pads in a one-to-one correspondence, and the positive terminal of any of the n laser units is electrically connected to any of the m positive connection pads; the control chip is electrically connected to the m positive connection pads and the n negative connection pads, respectively, and is used to control each of the n laser units via the m positive connection pads and the n negative connection pads. In this case, one negative connection pad is connected to the negative terminal of a single laser unit, and one positive connection pad can be connected to the negative terminal of one or more laser units.

[0046] If the number of the positive connection pads and the negative connection pads are both n, then the positive terminals of the n laser units are electrically connected to the n positive connection pads in a one-to-one correspondence, and the negative terminals of the n laser units are electrically connected to the n negative connection pads in a one-to-one correspondence; the control chip is electrically connected to the n positive connection pads and the n negative connection pads, respectively, and the control chip is used to control each of the n laser units via the n positive connection pads and the n negative connection pads. In this case, one positive connection pad is connected to the positive terminal of one laser unit, and one negative connection pad is connected to the negative terminal of one laser unit.

[0047] In this embodiment, the laser module includes a printed circuit board and n laser units. The number of at least one of the positive connection pads or the negative connection pads is n. These n pads are then individually connected to the n laser units. Either the positive terminals of all laser units are disconnected, or the negative terminals of all laser units are disconnected, or both the positive and negative terminals are disconnected. This allows for individual control of each laser unit, adapting to various situations and significantly improving laser operating efficiency.

[0048] The laser module of this application is described in detail below. Figures 2 to 5, another embodiment of a laser module of the present application includes: a printed circuit board 2 and n laser units 11, wherein n is a positive integer greater than 1;

[0049] The side of the printed circuit board 2 is provided with a positive connection pad 6 and a negative connection pad 5. The mounting surface of the printed circuit board 2 is mounted with a control chip. The number of the positive connection pads 6 is n, and the number of the negative connection pads 5 is m, or the number of the positive connection pads 6 is m, and the number of the negative connection pads 5 is n, or the number of the positive connection pads 6 and the number of the negative connection pads 5 are both n, where m is greater than or equal to 1 and less than n. The printed circuit board 2 has a multi-layer or single-layer structure.

[0050] If the number of positive connection pads 6 is n and the number of negative connection pads 5 is m, then the positive terminals of the n laser units 11 are electrically connected to the n positive connection pads 6 in a one-to-one correspondence, and the negative terminal of any one of the n laser units 11 is electrically connected to any one of the m negative connection pads 5. The control chip is electrically connected to the n positive connection pads 6 and the m negative connection pads 5, respectively, and is used to control each of the n laser units 11 via the n positive connection pads 6 and the m negative connection pads 5. In this case, one positive connection pad 6 is connected to the positive terminal of a single laser unit 11, and one negative connection pad 5 can be connected to the negative terminal of one or more laser units 11.

[0051] If the number of positive connection pads 6 is m and the number of negative connection pads 5 is n, then the negative terminals of the n laser units 11 are electrically connected to the n negative connection pads 5 in a one-to-one correspondence, and the positive terminal of any one of the n laser units 11 is electrically connected to any one of the m positive connection pads 6. The control chip is electrically connected to the m positive connection pads 6 and the n negative connection pads 5, respectively, and is used to control each of the n laser units 11 via the m positive connection pads 6 and the n negative connection pads 5. In this case, one negative connection pad 5 is connected to the negative terminal of a single laser unit 11, and one positive connection pad 6 can be connected to the negative terminal of one or more laser units 11.

[0052] If the number of both the positive connection pads 6 and the negative connection pads 5 is n, then the positive terminals of the n laser units 11 are electrically connected to the n positive connection pads 6 in a one-to-one correspondence, and the negative terminals of the n laser units 11 are electrically connected to the n negative connection pads 5 in a one-to-one correspondence; the control chip is electrically connected to the n positive connection pads 6 and the n negative connection pads 5, respectively, and is used to control each of the n laser units 11 via the n positive connection pads 6 and the n negative connection pads 5. In this case, one negative connection pad 5 is connected to the negative terminal of a single laser unit 11, and one positive connection pad 6 can be connected to the negative terminals of one or more laser units 11.

[0053] Furthermore, in order to solve the problem in existing solutions that the distance between multiple laser units 11 is small, the wiring is dense, and the wiring has weak current resistance, resulting in a small current flowing through the laser unit 11 and low efficiency, a DPC ceramic substrate 1 can also be provided. Specifically, the laser module also includes: a directly copper-plated DPC ceramic substrate 1;

[0054] The DPC ceramic substrate 1 is provided with 2n through-holes penetrating the top and bottom surfaces of the DPC ceramic substrate 1. The top surface is provided with n positive contact pads and n negative contact pads. The through-holes are filled with a conductive material, and both the top and bottom surfaces are provided with conductive traces. The conductive material can be copper, silver, or the like, and the specific material is not limited here.

[0055] If the number of the positive connecting pads 6 is n and the number of the negative connecting pads 5 is m, then the bottom surface is provided with n positive electrode pads 9 and m negative electrode pads 8, the n positive contact pads are electrically connected to the n positive electrode pads 9 one-to-one through the conductive circuit of the top surface, the conductive material in the n through holes and the conductive circuit of the bottom surface, the n positive electrode pads 9 are contact-connected to the n positive connecting pads 6 one-to-one, the n negative contact pads are electrically connected to any one of the m negative electrode pads 8 through the conductive circuit of the top surface, the conductive material in the n through holes and the conductive circuit of the bottom surface, and the m negative electrode pads 8 are contact-connected to the m negative connecting pads 5.

[0056] If the number of the positive connection pads 6 is m and the number of the negative connection pads 5 is n, then the bottom surface is provided with m positive electrode pads 9 and n negative electrode pads 8, the n negative contact pads are electrically connected to the n negative electrode pads 8 in a one-to-one correspondence via the conductive circuit on the top surface, the conductive material in the n through-holes and the conductive circuit on the bottom surface, the n negative electrode pads 8 are contact-connected with the n negative connection pads 5 in a one-to-one correspondence, the n positive contact pads are electrically connected to any one of the m positive electrode pads 9 via the conductive circuit on the top surface, the conductive material in the n through-holes and the conductive circuit on the bottom surface, and the m positive electrode pads 9 are contact-connected with the m positive connection pads 6;

[0057] If the number of the positive connection pads 6 and the negative connection pads 5 are both n, then the bottom surface is provided with n positive electrode pads 9 and n negative electrode pads 8, the n positive contact pads are electrically connected to the n positive electrode pads 9 one-to-one via the conductive circuit on the top surface, the conductive materials in the n through holes and the conductive circuit on the bottom surface, the n positive electrode pads 9 are contact-connected to the n positive connection pads 6 one-to-one, the n negative contact pads are electrically connected to the n negative electrode pads 8 one-to-one via the conductive circuit on the top surface, the conductive materials in the n through holes and the conductive circuit on the bottom surface, and the n negative electrode pads 8 are contact-connected to the n negative connection pads 5 one-to-one.

[0058] The principles behind the three aforementioned scenarios are now explained. The top laser units 11, contact pads, top conductive traces, conductive material in the through-holes, bottom conductive traces, and bottom electrode pads form a circuit loop, enabling electrical signals from the bottom surface to be transmitted to the top laser units 1111. When an electrical signal is input to the electrode pads, the multiple laser units 11 operate and emit laser light. When no electrical signal is input to the electrode pads, the multiple laser units 11 cease operation.

[0059] The positive ends of the n laser units 11 are contact-connected with the n positive contact pads in a one-to-one correspondence, and the negative ends of the n laser units 11 are contact-connected with the n negative contact pads in a one-to-one correspondence.

[0060] The perforated DPC ceramic substrate 1, with its conductive traces and metal material within the through-holes, enables electrical connection between multiple laser units 11 connected to the connection pads and the electrode pads on the bottom surface. When current flows through the electrode pads, current also flows through the laser units 11, causing them to operate. This embodiment eliminates the need for wiring. The perforated and metal-filled DPC ceramic substrate 1, combined with the pads, allows for a high current flow, significantly improving laser efficiency.

[0061] Furthermore, dedicated heat sinks can be provided to dissipate heat from the DPC ceramic substrate 1 and laser units 11. Specifically, the laser module also includes a laser heat sink module 3. A heat sink pad 10 is provided on the bottom surface of the DPC ceramic substrate 1. The laser heat sink module 3 is in close contact with this heat sink pad 10 and is used to dissipate heat from the n laser units 11 and the DPC ceramic substrate 1. The heat sink pad 10 transfers heat from the laser units 11 and DPC ceramic substrate 1 to the laser heat sink module 3, cooling the laser units 11 and other components, ensuring structural reliability.

[0062] Furthermore, in order to prevent short circuits between the positive connection pads 6 or between the negative connection pads 5, a protrusion can be provided for isolation. Specifically, the laser module further includes: a split protrusion. If there are multiple positive connection pads 6, one split protrusion is provided between the adjacent positive connection pads 6 with the shortest distance; if there are multiple negative connection pads 5, one split protrusion is provided between the adjacent negative connection pads 5 with the shortest distance. The split protrusion is used to prevent short circuits between the positive connection pads 6 or between the negative connection pads 5. At the same time, it also plays a role in fixing the DPC ceramic substrate 1 that is in contact with the printed circuit board 2.

[0063] There are two implementations of the split raised portion. In the first implementation, if the number of the positive connection pads 6 is n, then the top surface of the top portion is provided with n positive connection grooves, each of which is provided with a positive connection pad 6 at the bottom, and the adjacent positive connection grooves with the shortest distance therebetween constitute a split raised portion. If the number of the negative connection pads 5 is n, then the top surface of the top portion is provided with n negative connection grooves, each of which is provided with a negative connection pad 5 at the bottom, and the adjacent negative connection grooves with the shortest distance therebetween constitute a split raised portion.

[0064] In the second embodiment, if the number of the positive connection pads 6 is n, the n positive connection pads 6 are arranged on the top surface of the top, and one of the split protrusions is provided between the adjacent positive connection pads 6 on the top surface; if the number of the negative connection pads 5 is n, the n negative connection pads 5 are arranged on the top surface of the top, and one of the split protrusions is provided between the adjacent negative connection pads 5 on the top surface.

[0065] This embodiment is described with reference to the first implementation method.

[0066] Furthermore, a protrusion may be provided to prevent a short circuit between the positive connection pad 6 and the negative connection pad 5. Specifically, a polarity protrusion 7 is provided on the side of the printed circuit board 2 between the area where the positive connection pad 6 is located and the area where the negative connection pad 5 is located. The polarity protrusion 7 is used to insulate the positive connection pad 6 from the negative connection pad 5.

[0067] The arrangement of the positive connection pads 6 and the negative connection pads 5 can be further limited. Specifically, if the number of the positive connection pads 6 is n, the n positive connection pads 6 are distributed in a straight line or in an array on the side of the printed circuit board 2; if the number of the negative connection pads 5 is n, the n negative connection pads 5 are distributed in a straight line or in an array on the side of the printed circuit board 2. This embodiment is described using a straight line arrangement.

[0068] Furthermore, heat can be dissipated from the printed circuit board 2 to keep the control chip on the printed circuit board 2 within a normal temperature range. Specifically, the laser module also includes a circuit board heat dissipation module 4. This module is located on the back of the printed circuit board and is used to dissipate heat from the control chip. This prevents significant temperature rise in the control chip and ensures structural reliability.

[0069] Furthermore, existing packaging solutions utilize gold wire bonding, which is costly. To reduce costs, this embodiment utilizes screen printing for packaging. To further ensure the current handling capability of the DPC ceramic substrate 11, the copper layer of the DPC ceramic substrate 11 can be greater than or equal to 35 microns, and the wiring width can be greater than or equal to 2 mm.

[0070] The operating principle of this embodiment will now be described. For example, in one embodiment, n is 16 and m is 1, meaning there is one positive connection pad 6 (integrated structure) and 16 negative connection pads 5 (split structure). Similarly, the negative terminals of each laser unit 11 are independent of each other and are each indirectly connected to a negative connection pad 5, while the positive terminals of all laser units 11 are indirectly connected to the positive connection pad 6. The laser units 11, contact pads, conductive traces, conductive material in the through-holes, conductive traces, and electrode pads form a circuit loop, enabling electrical signals from the bottom surface of the DPC ceramic substrate 1 to be transmitted to the laser units 11 on the top surface of the DPC ceramic substrate 1. Specifically, the negative connection pads 5 corresponding to the 16 laser units 11 are different. Vertically from the top surface, the DPC ceramic substrate 1 contacts and connects to the printed circuit board and laser heat sink module 3 below. The printed circuit board also has a circuit board heat sink module 4 for heat dissipation. When it is necessary to separately control the power of different laser units 11 to emit corresponding lasers, the power of each laser unit 11 is controlled based on each independent circuit loop (i.e., the laser unit 11, the contact pad corresponding to the laser unit 11, the conductive circuit on the top surface of the laser unit 11, the corresponding conductive material, the conductive circuit on the bottom surface of the laser unit 11, the negative electrode pad 8 corresponding to the laser unit 11, the negative connection pad 5 corresponding to the laser unit 11, the positive connection pad 6, and the positive contact pad corresponding to the laser unit 11), thereby controlling the corresponding laser. When the laser units 11 are no longer needed, they are controlled to shut down and stop working based on their independent circuit loops.

[0071] In this embodiment, the laser module is provided with a printed circuit board 2 and n laser units 11. Among them, the number of at least one of the positive connection pads 6 or the negative connection pads 5 is n, and then according to the corresponding n pads, they are individually connected to the n laser units 11. Either the positive ends of all laser units 11 are not connected to each other, or the negative ends of all laser units 11 are not connected to each other, or the positive and negative ends are not connected to each other, so that each laser unit 11 can be individually controlled separately, which can adapt to various different situations and greatly improve the laser working efficiency. This embodiment does not require wiring. With the perforated and metal-filled DPC ceramic substrate 1, it can allow a larger current to flow through in conjunction with the pads, greatly improving the laser working efficiency. Based on screen printing, costs can be reduced, and the configuration of the laser heat dissipation module 3 and the circuit board heat dissipation module 4 can cool the structure and ensure the reliability of the structure. In addition, a raised portion is provided to prevent circuit short circuits, further ensuring the reliability of the structure.

[0072] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned embodiments and will not be repeated here.

[0073] In the several embodiments provided in this application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are merely schematic. For example, the division of the units is merely a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0074] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0075] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0076] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A laser module, characterized in that: include: A printed circuit board and n laser units, wherein n is a positive integer greater than 1; A positive connection pad and a negative connection pad are provided on the side of the printed circuit board, and a control chip is mounted on the mounting surface of the printed circuit board, wherein the number of the positive connection pads is n and the number of the negative connection pads is m, or the number of the positive connection pads is m and the number of the negative connection pads is n, or the number of the positive connection pads and the number of the negative connection pads are both n, wherein m is greater than or equal to 1 and less than n; If the number of the positive connection pads is n and the number of the negative connection pads is m, the positive terminals of the n laser units are electrically connected to the n positive connection pads in a one-to-one correspondence, and the negative terminal of any one of the n laser units is electrically connected to any one of the m negative connection pads; the control chip is electrically connected to the n positive connection pads and the m negative connection pads, respectively, and the control chip is used to control each of the n laser units via the n positive connection pads and the m negative connection pads; If the number of the positive connection pads is m and the number of the negative connection pads is n, the negative terminals of the n laser units are electrically connected to the n negative connection pads in a one-to-one correspondence, and the positive terminal of any one of the n laser units is electrically connected to any one of the m positive connection pads; the control chip is electrically connected to the m positive connection pads and the n negative connection pads, respectively, and the control chip is used to control each of the n laser units via the m positive connection pads and the n negative connection pads; If the number of the positive connecting pads and the negative connecting pads is n, the positive ends of the n laser units are electrically connected to the n positive connecting pads in a one-to-one correspondence, and the negative ends of the n laser units are electrically connected to the n negative connecting pads in a one-to-one correspondence; the control chip is electrically connected to the n positive connecting pads and the n negative connecting pads, respectively, and the control chip is used to control each of the n laser units via the n positive connecting pads and the n negative connecting pads, respectively.

2. The laser module according to claim 1, wherein: The laser module further comprises: a direct copper plated DPC ceramic substrate; The DPC ceramic substrate is provided with 2n through holes penetrating the top surface and the bottom surface of the DPC ceramic substrate, the top surface is provided with n positive contact pads and n negative contact pads, the through holes are filled with conductive material, and the top surface and the bottom surface are both provided with conductive circuits; If the number of the positive connection pads is n and the number of the negative connection pads is m, then the bottom surface is provided with n positive electrode pads and m negative electrode pads, the n positive contact pads are electrically connected to the n positive electrode pads in a one-to-one correspondence via the conductive circuit on the top surface, the conductive material in the n through-holes and the conductive circuit on the bottom surface, the n positive electrode pads are contact-connected to the n positive connection pads in a one-to-one correspondence, the n negative contact pads are electrically connected to any one of the m negative electrode pads via the conductive circuit on the top surface, the conductive material in the n through-holes and the conductive circuit on the bottom surface, and the m negative electrode pads are contact-connected to the m negative connection pads; If the number of the positive connection pads is m and the number of the negative connection pads is n, then the bottom surface is provided with m positive electrode pads and n negative electrode pads, the n negative contact pads are electrically connected to the n negative electrode pads in a one-to-one correspondence via the conductive circuit on the top surface, the conductive material in the n through-holes and the conductive circuit on the bottom surface, the n negative electrode pads are contact-connected to the n negative connection pads in a one-to-one correspondence, the n positive contact pads are electrically connected to any one of the m positive electrode pads via the conductive circuit on the top surface, the conductive material in the n through-holes and the conductive circuit on the bottom surface, and the m positive electrode pads are contact-connected to the m positive connection pads; If the number of the positive connection pads and the negative connection pads is n, then the bottom surface is provided with n positive electrode pads and n negative electrode pads, the n positive contact pads are electrically connected to the n positive electrode pads in a one-to-one correspondence via the conductive circuit on the top surface, the conductive material in the n through-holes and the conductive circuit on the bottom surface, the n positive electrode pads are contact-connected with the n positive connection pads in a one-to-one correspondence, the n negative contact pads are electrically connected to the n negative electrode pads in a one-to-one correspondence via the conductive circuit on the top surface, the conductive material in the n through-holes and the conductive circuit on the bottom surface, and the n negative electrode pads are contact-connected with the n negative connection pads in a one-to-one correspondence; The positive ends of the n laser units are contact-connected with the n positive contact pads in a one-to-one correspondence, and the negative ends of the n laser units are contact-connected with the n negative contact pads in a one-to-one correspondence.

3. The laser module according to claim 2, characterized in that: The laser module further includes: a laser heat dissipation module; A heat dissipation pad is further provided on the bottom surface of the DPC ceramic substrate. The laser heat dissipation module is closely attached to the heat dissipation pad. The laser heat dissipation module is used to dissipate heat for the n laser units and the DPC ceramic substrate.

4. The laser module according to claim 1, wherein: The laser module further comprises: a split raised portion; If there are multiple positive connection pads, one split protrusion is provided between the adjacent positive connection pads with the shortest distance; if there are multiple negative connection pads, one split protrusion is provided between the adjacent negative connection pads with the shortest distance, and the split protrusion is used to prevent short circuit between the positive connection pads or between the negative connection pads.

5. The laser module according to claim 4, characterized in that: If the number of the positive connection pads is n, then the top surface of the top is provided with n positive connection grooves, and each positive connection groove is provided with a positive connection pad at the bottom, and the adjacent positive connection grooves with the shortest distance form a split protrusion; if the number of the negative connection pads is n, then the top surface of the top is provided with n negative connection grooves, and each negative connection groove is provided with a negative connection pad at the bottom, and the adjacent negative connection grooves with the shortest distance form a split protrusion.

6. The laser module according to claim 4, characterized in that: If the number of the positive connection pads is n, the n positive connection pads are arranged on the top surface of the top, and one of the split protrusions is provided between the adjacent positive connection pads on the top surface; if the number of the negative connection pads is n, the n negative connection pads are arranged on the top surface of the top, and one of the split protrusions is provided between the adjacent negative connection pads on the top surface.

7. The laser module according to claim 1, wherein: On the side surface of the printed circuit board, a polarity protrusion is provided between the area where the positive connection pad is located and the area where the negative connection pad is located. The polarity protrusion is used to insulate the positive connection pad from the negative connection pad.

8. The laser module according to claim 1, wherein: If the number of the positive connection pads is n, the n positive connection pads are distributed in a straight line or in an array on the side of the printed circuit board; if the number of the negative connection pads is n, the n negative connection pads are distributed in a straight line or in an array on the side of the printed circuit board.

9. The laser module according to claim 1, wherein: The laser module further includes: a circuit board heat dissipation module; The circuit board heat dissipation module is provided on the back side of the printed circuit board, and the circuit board heat dissipation module is used to dissipate heat for the control chip.

10. The laser module according to claim 1, wherein: The printed circuit board is a multi-layer or single-layer structure.

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